Power device module, power supply module, electric drive system and vehicle

Abstract

A power device module includes a heat dissipation member and a power circuit board assembly. The heat dissipation component comprises a main body, wherein the main body comprises a top surface (120) and at least one side wall extending in the extending direction transverse to the top surface (120); and a cooling circuit (140) for circulating a cooling medium, the cooling circuit being disposed in the body adjacent to the top surface and the side wall. The power circuit board assembly comprises a power circuit board and a first heating element (200) arranged on the power circuit board, and the power circuit board comprises a first face and a second face which are opposite to each other. The first face of the power circuit board is provided with the first heating element and the second face is arranged adjacent to the top face of the main body so as to transfer heat between the first heating element and the cooling medium in the cooling loop through the top face. The power supply module comprises the power device module. The electric driving system comprises the power supply module. A vehicle comprises the power supply module or the electric driving system.

Description

Technical Field

[0001] The present disclosure relates to an electric drive system for a vehicle, in particular an electric vehicle or a hybrid vehicle. The present disclosure particularly relates to a power device module, a power supply module including the power device module, an electric drive system including the power supply module, and a related vehicle. Background Art

[0002] With the development of electric vehicles and hybrid vehicles, higher requirements are put forward for the heat dissipation of power devices in in-vehicle power supply modules and electric drive systems. Currently, power devices in in-vehicle power supply modules and electric drive systems, such as MOSFETs, IGBTs, etc., are usually arranged on the peripheral side walls of heat dissipation devices. Fixing the power devices to the peripheral side walls of the heat dissipation devices usually also requires elastic clamping clips made of, for example, metal and plastic brackets for ensuring electrical insulation between the elastic clamping clips and the heat dissipation devices and maintaining the elastic clamping clips. At the same time, a heat dissipation substrate, such as a ceramic sheet or a thermal conductive gasket, etc., is usually also provided between the power device and the peripheral side wall of the heat dissipation device. The heat dissipation substrate realizes heat conduction on the one hand and needs to ensure electrical insulation between the power device and the heat dissipation device on the other hand. In addition, the circuit board is usually installed above the heat dissipation device, and each power device and other possible magnetic components are connected to the circuit board by wave soldering.

[0003] It is not difficult to understand that the existing solutions require heat conductive materials such as ceramic sheets and thermal grease, and may also require plastic brackets for positioning power devices and elastic clamping clips, resulting in a large number of parts, high material costs, high defect rates, low production efficiency, and high production costs. In addition, fixing devices such as elastic clamping clips may have fatigue problems due to frequent extrusion. More specifically, during vehicle driving, the power devices may be continuously subjected to external vibrations, and fixing devices such as elastic clamping clips are prone to losing elasticity or even failing under varying loads. This can lead to poor heat dissipation due to the inability to press the power devices against the heat dissipation device, resulting in reduced power consumption or failures. Moreover, the design pressure of the elastic clamping clip is determined by the design compression amount, the thickness of the device on the heat dissipation substrate, and the arrangement position. The specifications of different devices are often inconsistent, which will cause the corresponding elastic clamping clip to require re-design, simulation, and measurement. These factors that cannot be precisely controlled will cause a large deviation in the pressure of the elastic clamping clip.

[0004] Therefore, there is still a need for a new solution to at least partially overcome the above problems existing in the prior art. Summary of the Invention

[0005] To this end, a first aspect of the present disclosure proposes a power device module. According to one embodiment, the power device module includes a heat dissipation member and a power circuit board assembly, wherein:

[0006] The heat dissipation member includes: a main body including a top surface and at least one side wall extending in a direction transverse to the extension direction of the top surface; and a cooling circuit for allowing a cooling medium to flow therethrough, the cooling circuit being disposed in the main body and adjacent to the top surface and the side wall.

[0007] The power circuit board assembly includes a power circuit board and a first heating element disposed on the power circuit board. The power circuit board includes a first surface and a second surface opposite to each other.

[0008] Wherein, the first surface of the power circuit board is provided with the first heating element and the second surface is adjacent to the top surface of the main body of the heat dissipation member, so as to transfer heat between the first heating element and the cooling medium in the cooling circuit through the top surface.

[0009] That is, in the power device module proposed in the present disclosure, the first heating element of the power circuit board assembly is disposed on the first surface of the power circuit board of the power circuit board assembly. At the same time, the second surface of the power circuit board is adjacent to the top surface of the main body of the heat dissipation member, so as to transfer heat between the first heating element and the cooling medium in the cooling circuit of the heat dissipation member through the top surface. Thus, in the power device module proposed in the present disclosure, the first heating element, which is a power device to be cooled, does not need to be disposed on the peripheral side wall of the heat dissipation member as in the prior art, and thus does not need to use an elastic clip and a corresponding plastic bracket to fix the first heating element relative to the heat dissipation member. On the one hand, this reduces the number of components, simplifies the assembly, saves materials, and improves the cost effectiveness. On the other hand, it also improves the stable installation of the first heating element in place, that is, it is not easily affected by external vibrations. More specifically, this allows the first heating element and the power circuit board to be pre-assembled into an integral sub-assembly, for example, by soldering, more specifically by reflow soldering, which further facilitates the stable holding and precise positioning of the first heating element and allows further simplification of the assembly.

[0010] At the same time, since the first heating element is not installed on the peripheral side wall of the heat dissipation member, the floor area of the entire power device module is reduced, and thus a smaller power circuit board can be used, which is beneficial to a more compact power device module. This is beneficial to its integration in a limited space and is also beneficial to arranging power devices more densely, thereby improving the power of the entire power device module. In addition, this also allows the cooling circuit of the heat dissipation member to be widened, thereby increasing the surface area of the top surface of the cooling circuit for heat transfer, which promotes the heat transfer from the first heating element to the cooling circuit through the top surface.

[0011] According to various embodiments, the power device module proposed in the present disclosure may further include one or more of the following further developments.

[0012] In some embodiments, the power circuit board includes a metal substrate circuit board, which includes a circuit layer, an insulating layer, and a metal bottom plate, and the first heating element is disposed on the metal substrate circuit board. That is, the circuit layer of the metal substrate circuit board ensures its basic function as a circuit board; the insulating layer ensures insulation between the circuit layer and the metal bottom plate, and the thickness of the insulating layer is, for example, in the range of 0.15 mm to 0.3 mm, and its thermal resistance is very low; the metal bottom plate can ensure efficient heat transfer from the first heating element to the heat dissipation member due to its very high thermal conductivity, more specifically higher than that of the ceramic sheet. It is easy to understand that high heat dissipation performance can be achieved without increasing the size of the power circuit board at all.

[0013] In some embodiments, the power device module further includes a main circuit board, and the power circuit board is located between the main circuit board and the top surface of the main body of the heat dissipation member. This further facilitates the realization of a compact overall structure, and at the same time, as described above, allows the first heating element and the power circuit board to be pre-assembled into an integral sub-assembly, and then this integral sub-assembly is installed on the heat dissipation member, and then the main circuit board is assembled with this integral sub-assembly, which simplifies the assembly while ensuring the stable holding and precise positioning of this integral sub-assembly, and improves cost-effectiveness.

[0014] In some embodiments, current conducting posts are provided between the power circuit board and the main circuit board.

[0015] In some embodiments, the current conducting posts are welded to the power circuit board and include threaded connection portions configured to be connected to the main circuit board. This allows the circuit conduction and mechanical connection between the power circuit board and the main circuit board to be realized with a simple structure, and allows the disassembly between the two to be achieved in a convenient manner.

[0016] In some embodiments, a board-to-board connector is provided between the power circuit board and the main circuit board. The board-to-board connector, for example, realizes signal transmission between the power circuit board and the main circuit board.

[0017] In some embodiments, the main body is further provided with a recess, the recess is provided between two opposite side walls of the main body and has an opening at the top surface, and a second heating element is further provided on the power circuit board, and the second heating element is disposed in the recess. Thus, the second heating element can be accommodated in a compact structure and effective heat dissipation of the second heating element can be ensured.

[0018] In some embodiments, a third heating element is further provided on the side of the main circuit board facing the power circuit board, and the third heating element is positioned to surround at least part of the periphery of the heat dissipation member. This allows the realization of a compact structure while also allowing effective heat dissipation of the third heating element.

[0019] In some embodiments, the first heating element is a surface-mounted IGBT power transistor and / or MOSFET. The surface-mounted power device allows for a more convenient and stable installation onto the power circuit board while improving the heat dissipation efficiency.

[0020] In some embodiments, the cooling circuit is a U-shaped circuit provided along the side wall. This further facilitates the formation of a structurally compact power device module and allows for an increased setting density of the power devices without affecting their heat dissipation.

[0021] In some embodiments, the top wall defining the cooling circuit is provided with heat dissipation fins protruding relative to the top wall. The heat dissipation fins allow for a reduction in the pressure drop of the cooling medium in the cooling circuit while increasing the contact area with the cooling medium, thereby improving the heat transfer efficiency.

[0022] A second aspect of the present disclosure provides a power supply module, which includes a housing and a power device module according to any one of the above embodiments.

[0023] In one variant, the heat dissipation member of the power device module is integrally provided with the housing; in another variant, the heat dissipation member of the power device module is separately provided from the housing.

[0024] A third aspect of the present disclosure provides an electric drive system, which includes a power supply module according to any one of the above embodiments.

[0025] A fourth aspect of the present disclosure provides a vehicle, which includes a power supply module according to any one of the above embodiments, or includes an electric drive system as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0028] Figure 1 is a three-dimensional schematic diagram of a power device module according to an exemplary embodiment;

[0029] Figure 2 is Figure 1 an exploded three-dimensional view of the shown power device module;

[0030] Figure 3is a perspective view of a power device module according to an exemplary embodiment, with the main circuit board removed;

[0031] Figure 4 is a perspective view of the power circuit board of the power device module with the first heating element and the second heating element disposed together;

[0032] Figure 5 is Figure 1 a sectional perspective view of the power device module shown;

[0033] Figure 6 is Figure 3 a sectional perspective view of the power device module shown.

[0034] List of Reference Numerals

[0035] 10 Power device module

[0036] 100 Heat dissipation member

[0037] 110 Body

[0038] 120 Top surface

[0039] 130a, 130b, 130c Side walls

[0040] 140 Cooling circuit

[0041] 141 Top wall

[0042] 142 Heat dissipation fins

[0043] 150 Recess

[0044] 200 First heating element

[0045] 300 Second heating element

[0046] 400 Power circuit board

[0047] 410 First side

[0048] 420 Second side

[0049] 430 Metal substrate circuit board

[0050] 450 Current conducting post

[0051] 500 Main circuit board

[0052] 600 Board-to-board connector

[0053] 700 Third heating element Detailed Description

[0054] Next, a power device module and a power supply module according to embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. To make the objectives, technical solutions, and advantages of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments.

[0055] Therefore, the following detailed description of the embodiments of the present disclosure provided in conjunction with the accompanying drawings is not intended to limit the scope of the claimed present disclosure, but merely represents selected embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present disclosure without creative efforts fall within the scope of protection of the present disclosure.

[0056] Unless otherwise defined in the context, the singular forms include the plural forms. Throughout the specification, terms such as "including", "having", etc. are used herein to specify the presence of the described features, numbers, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof.

[0057] In addition, even though ordinal terms such as "first", "second", etc. may be used to describe various components, these components are not limited by these terms, and these terms are only used to distinguish one element from other elements. For example, without departing from the scope of the present disclosure, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

[0058] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship when the disclosed product is normally placed, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present disclosure.

[0059] A first aspect of the present disclosure proposes a power device module 10. As Figures 1-6 shown, according to one embodiment, the power device module 10 includes a heat dissipation member 100 and a power circuit board assembly. The power circuit board assembly includes heat-generating elements, and the heat dissipation member 100 is configured to dissipate the heat of these heat-generating elements. In an exemplary application environment, the power device module 10 is part of a power supply module or an electric drive system, such as part of an on-vehicle power supply module or an electric drive system of an electric vehicle or a hybrid vehicle.

[0060] As Figure 2 and 5 shown, the heat dissipation member 100 may include a main body 110 and a cooling circuit 140 disposed in the main body 110. The main body 110 is configured to include a top surface 120 and at least one side wall 130a, 130b, 130c extending in a direction transverse to the extension direction of the top surface 120, and the side walls 130a, 130b, 130c more specifically extend vertically downward from the top surface 120. The cooling circuit 140 is configured to allow a cooling medium to flow, and the cooling medium is water in a specific embodiment, but it is not limited to water. The cooling circuit 140 is disposed adjacent to the top surface 120 and the side walls 130a, 130b, 130c in the main body 110 of the heat dissipation member 100, for example, so that heat exchange can occur between the cooling medium in the cooling circuit 140 and the component to be cooled via the top surface 120 and the side walls 130a, 130b, 130c.

[0061] As Figures 1-6 shown, the power circuit board assembly may include a power circuit board 400 and a first heating element 200 disposed on the power circuit board 400. The first heating element 200 is connected to the power circuit board 400, for example, via soldering, such as via reflow soldering. In a specific embodiment, the first heating element 200 may include an IGBT power transistor and / or a MOSFET. The power circuit board 400 includes a first surface 410 and a second surface 420 opposite to each other, and the first surface 410 and the second surface 420 here are the main extension planes of the power circuit board 400, that is, the extension planes with the largest surface area.

[0062] In this embodiment, as Figures 2-4 and 6 shown, the first surface 410 of the power circuit board 400 is provided with the first heating element 200 and the second surface 420 is disposed adjacent to the top surface 120 of the main body 110 of the heat dissipation member 100 to transfer heat between the first heating element 200 and the cooling medium in the cooling circuit 140 through the top surface 120. More specifically, the first heating element 200 disposed on the first surface 410 of the power circuit board 400 may be configured to correspond to, for example, be aligned with, the top surface 120 of the main body 110 of the heat dissipation member 100 to facilitate heat transfer via the top surface 120. In a specific embodiment, as shown in the figure, the heat dissipation member 100 may be disposed facing the second surface 420 of the power circuit board 400, thereby further improving the heat transfer effect.

[0063] Thus, in the power device module 10 proposed in the present disclosure, the first heating element 200 of the power circuit board assembly is disposed on the first surface 410 of the power circuit board 400 of the power circuit board assembly. At the same time, the second surface 420 of the power circuit board 400 is disposed adjacent to the top surface 120 of the main body 110 of the heat dissipation member 100, and more specifically faces the top surface 120, so as to transfer heat between the first heating element 200 and the cooling medium in the cooling circuit 140 of the heat dissipation member 100 through the top surface 120. In this way, in the power device module 10 proposed in the present disclosure, the first heating element 200, which is a power device to be cooled, does not need to be disposed on the peripheral side wall of the heat dissipation member as in the prior art, and thus does not need to use elastic clamping clips and corresponding plastic brackets to fix the first heating element relative to the heat dissipation member. On the one hand, this reduces the number of components, simplifies the assembly, saves materials, and improves the cost-effectiveness. On the other hand, it also improves the stable installation of the first heating element 200 in place, that is, it is not easily affected by external vibrations. More specifically, this allows the first heating element 200 and the power circuit board 400 to be pre-assembled into an integral sub-assembly, for example, by soldering, and more specifically by reflow soldering, which further facilitates the stable holding and precise positioning of the first heating element 200 and allows further simplification of the assembly.

[0064] At the same time, since the first heating element 200 does not need to be installed on the peripheral side wall of the heat dissipation member 100, the floor area of the entire power device module 10 is reduced, and thus a smaller power circuit board 400 can be used, which is beneficial to a more compact power device module 10. This is beneficial to its integration in a limited space and is also beneficial to arranging power devices more densely, thereby increasing the power of the entire power device module 10. In addition, this also allows the cooling circuit 140 of the heat dissipation member 100 to be widened, thereby increasing the surface area of the top surface for heat transfer in the cooling circuit 140, which promotes the heat transfer from the first heating element 200 to the cooling circuit 140 through the top surface 120.

[0065] In some embodiments, as Figure 6 shown, the top wall 141 that participates in defining the cooling circuit 140 is provided with heat dissipation fins 142 that protrude relative to the top wall 141. The heat dissipation fins 142 may be in the form of a protruding plate extending downward from the top wall 141. The heat dissipation fins 142 allow reducing the pressure drop of the cooling medium in the cooling circuit 140 while increasing the contact area with the cooling medium, thereby improving the heat transfer efficiency.

[0066] In an embodiment (not shown), the cross-section of the cooling circuit 140 of the heat dissipation member 100 near the top surface 120 is widened relative to the cross-section of the remaining part, so that the cross-section of the cooling circuit 140 forms an inverted L shape, wherein heat transfer between the first heating element 200 via the top surface 120 and the cooling medium in the cooling circuit 140 is promoted.

[0067] In some embodiments, as Figure 3 , 4 and shown in FIG. 6, the power circuit board 400 may include a metal substrate circuit board 430, which includes a circuit layer, an insulating layer, and a metal bottom plate sequentially arranged from the first surface 410 to the second surface 420. The first heating element 200 may be disposed on the metal substrate circuit board 430. More specifically, the circuit layer of the metal substrate circuit board 430 ensures its basic functions as a circuit board, including electrical connection and signal connection; the insulating layer ensures insulation between the circuit layer and the metal bottom plate, and the thickness of the insulating layer is, for example, in the range of 0.15 mm to 0.3 mm, and its thermal resistance is very low; the metal bottom plate is made of, for example, aluminum or copper, and it can ensure efficient heat transfer from the first heating element 200 to the heat dissipation member 100 because of its very high thermal conductivity, more specifically higher than that of the ceramic sheet. It is easy to understand that high heat dissipation performance can be achieved without increasing the size of the power circuit board 400 at all. In a more specific embodiment, only the part of the power circuit board 400 for disposing the first heating element 200 includes the metal substrate circuit board 430, and the other parts are the same as the design of the conventional circuit board. Thus, without affecting heat dissipation, conduction, and signal transmission, the cost of the power circuit board 400 can be saved.

[0068] In some embodiments, as Figures 1-2 and shown in FIG. 5, the power device module 10 may further include a main circuit board 500, which is mainly used for electrical and signal connection with external components, for example. In such an embodiment, the power circuit board 400 may be disposed between the main circuit board 500 and the top surface 120 of the main body 110 of the heat dissipation member 100. This further facilitates the realization of a compact overall structure, and at the same time, as described above, allows the first heating element 200 and the power circuit board 400 to be pre-assembled into an integral sub-assembly, and then this integral sub-assembly is installed on the heat dissipation member 100, more specifically, installed facing the top surface 120 of the main body 110 of the heat dissipation member 100, and then the main circuit board 500 is assembled with this integral sub-assembly, which simplifies the assembly while ensuring the stable holding and precise positioning of this integral sub-assembly, and improves cost-effectiveness. More specifically, the main circuit board 500 may also be fixed to the heat dissipation member 100 via fasteners, such as screws, which also allows the power circuit board 400 to be pressed against the top surface 120 of the main body 110 of the heat dissipation member 100.

[0069] In some embodiments, such as Figure 2 , 4 and as shown in 6, a current conducting post 450 may also be provided between the power circuit board 400 and the main circuit board 500. The current conducting post 450 is, for example, a copper post. In a more specific embodiment, the current conducting post 450 is welded to the power circuit board 400 and includes a threaded connection portion configured to be connected to the main circuit board 500. This allows for circuit conduction and mechanical connection between the power circuit board 400 and the main circuit board 500 to be achieved with a simple structure, and allows for the disassembly between the two to be achieved in a convenient manner.

[0070] In some embodiments, such as Figure 4 and 6 shown, a board-to-board connector 600 is provided between the power circuit board 400 and the main circuit board 500. The board-to-board connector 600, for example, realizes signal transmission between the power circuit board 400 and the main circuit board 500. The board-to-board connector 600 of the power circuit board 400 and the board-to-board connector of the main circuit board 500 may be connected to each other, for example, via soldering, and more specifically via wave soldering.

[0071] In some embodiments, such as Figures 5-6 adaptively shown, the main body 110 of the heat dissipation member 100 is further provided with a recess 150. The recess 150 is more specifically provided between two opposite side walls 130a, 130c of the main body 110 and has an opening at the top surface 120. A second heating element 300 is further provided on the power circuit board 400, and the second heating element 300 can be received in the recess 150 via the opening. This allows the second heating element 300 to be accommodated in a compact structure and ensures effective heat dissipation of the second heating element 300. In a specific embodiment, the second heating element may be a magnetic component.

[0072] In some embodiments, such as Figures 2-4 and as shown in 6, the first heating element 200 may be a surface-mounted IGBT power transistor and / or MOSFET. The surface-mounted power device allows for more convenient and stable installation onto the power circuit board 400, while improving the heat dissipation efficiency. More specifically, the surface-mounted IGBT power transistor and / or MOSFET itself is provided with a heat dissipation surface, and its heat dissipation surface abuts against the first surface 410 of the power circuit board 400, thereby enhancing the heat dissipation efficiency.

[0073] In some embodiments, the cooling circuit 140 may be a U-shaped circuit disposed along the sidewalls 130a, 130b, 130c of the main body 110 of the heat dissipation member 100. This further facilitates the formation of a structurally compact power device module 10 and allows an increase in the setting density of power devices. For example, a first heating element 200 can be provided corresponding to the entire top surface of the U-shaped circuit, without affecting its heat dissipation. More specifically, the U-shaped circuit also allows for more effective heat dissipation of the second heat dissipation element 300. More specifically, as Figures 2-3 shown in FIGS. 5-6, the heat dissipation member 100 includes opposite first sidewalls 130a and second sidewalls 130c and a third sidewall 130b connecting the first sidewall 130a and the second sidewall 130c. The U-shaped circuit is disposed in the first sidewall 130a, the second sidewall 130c, and the third sidewall 130b.

[0074] In some embodiments, as Figure 1 and 5 shown, a third heating element 700 may be provided on the main circuit board 500. More specifically, the third heating element 700 is provided on the side of the main circuit board 500 facing the power circuit board 400. In this case, in the assembled state of the power device module 10, the third heating element 700 may be disposed around at least a part of the periphery of the heat dissipation member 100. More specifically, the third heating element 700 is positioned outside one or more of the sidewalls 130a, 130b, 130c of the heat dissipation member 100 where the cooling circuit 140 is provided, because now the first heating element 200 does not need to be provided on the outside of the sidewalls 130a, 130b, 130c. Therefore, this allows for the achievement of a very compact structure on the one hand and the effective cooling of the third heating element 700 by being adjacent to the sidewalls 130a, 130b, 130c of the heat dissipation member on the other hand.

[0075] In some embodiments, the heat dissipation member 100 may further include a cover disposed on the top of the cooling circuit 140 and fixed, for example, welded to the main body 110 of the heat dissipation member 100, where the top surface 120 is the top surface of the cover. More specifically, the cover may be configured to have a very low thermal resistance to facilitate heat transfer efficiency.

[0076] A second aspect of the present disclosure provides a power supply module, which includes a housing and the power device module 10 according to any one of the above embodiments.

[0077] In one variant, the heat dissipation member 100 of the power device module 10 is integrally provided with the housing; in another variant, the heat dissipation member 100 of the power device module 10 is separately provided from the housing. More specifically, the housing may be provided with a cooling medium inlet and a cooling medium outlet communicating with the cooling circuit.

[0078] A third aspect of the present disclosure provides an electric drive system, which includes a power module according to any one of the above embodiments.

[0079] A fourth aspect of the present disclosure provides a vehicle, which includes a power module according to any one of the above embodiments, or includes the electric drive system as described above. The vehicle may be an electrified vehicle, such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), a range extended electric vehicle, or a fuel cell electric vehicle (FCEV). The vehicle may also be a hydrogen energy vehicle.

[0080] The exemplary embodiments of the power device module and the power module proposed by the present invention have been described in detail above with reference to the preferred embodiments. However, those skilled in the art can understand that, without departing from the concept of the present invention, various modifications and variations can be made to the above specific embodiments, and various combinations of the technical features and structures proposed by the present invention can be made without exceeding the protection scope of the present invention.

[0081] The scope of the present disclosure is not limited by the embodiments described above, but is defined by the appended claims and their equivalent scope.

Claims

1. A power device module (10) includes a heat dissipation member (100) and a power circuit board assembly, wherein: The heat dissipation member (100) includes: A main body (110), the main body (110) includes a top surface (120) and at least one side wall (130a, 130b, 130c) extending in a direction transverse to the extension direction of the top surface (120), and A cooling circuit (140) for circulating a cooling medium, the cooling circuit (140) is disposed in the main body (110) and is disposed adjacent to the top surface (120) and the side walls (130a, 130b, 130c); The power circuit board assembly includes a power circuit board (400) and a first heating element (200) disposed on the power circuit board (400), the power circuit board (400) includes a first surface (410) and a second surface (420) opposite to each other, Wherein, the first surface (410) of the power circuit board (400) is provided with the first heating element (200) and the second surface (420) is disposed adjacent to the top surface (120) of the main body (110), so as to transfer heat between the first heating element (200) and the cooling medium in the cooling circuit (140) through the top surface (120).

2. The power device module (10) according to claim 1, wherein, The power circuit board (400) includes a metal substrate circuit board (430), the metal substrate circuit board (430) includes a circuit layer, an insulating layer and a metal bottom plate, and the first heating element (200) is disposed on the metal substrate circuit board (430).

3. The power device module (10) according to claim 2 further includes a main circuit board (500), and the power circuit board (400) is located between the main circuit board (500) and the top surface (120) of the main body (110) of the heat dissipation member (100).

4. The power device module (10) according to claim 3, wherein, A current conducting post (450) is disposed between the power circuit board (400) and the main circuit board (500).

5. The power device module (10) according to claim 4, wherein, The current conducting post (450) is welded to the power circuit board (400) and includes a threaded connection portion configured to be connected to the main circuit board (500).

6. The power device module (10) according to any one of claims 3 to 5, wherein, A board-to-board connector (600) is disposed between the power circuit board (400) and the main circuit board (500).

7. The power device module (10) according to any one of claims 1 to 5, wherein, The main body (110) is further provided with a recess (150), the recess (150) is disposed between two opposite side walls (130a, 130c) of the main body (110) and has an opening at the top surface (120), and a second heating element (300) is further disposed on the power circuit board (400), and the second heating element (300) is disposed in the recess (150).

8. The power device module (10) according to any one of claims 3 to 5, wherein, The main circuit board (500) is further provided with a third heating element (700) on the side facing the power circuit board (400), and the third heating element (700) is positioned to surround at least part of the periphery of the heat dissipation member (100).

9. The power device module (10) according to any one of claims 1 to 5, wherein, The first heating element (200) is a surface-mounted IGBT power transistor and / or MOSFET.

10. The power device module (10) according to any one of claims 1 to 5, wherein, The cooling circuit (140) is a U-shaped circuit arranged along the side walls (130a, 130b, 130c).

11. The power device module (10) according to any one of claims 1 to 5, wherein, The top wall participating in defining the cooling circuit (140) is provided with heat dissipation fins (142) protruding relative to the top wall (141).

12. A power module, comprising a housing and the power device module (10) according to any one of claims 1 to 11.

13. The power module according to claim 12, wherein the heat dissipation member (100) of the power device module (10) is integrally provided or separately provided with the housing.

14. An electric drive system, comprising the power module according to claim 12 or 13.

15. A vehicle, comprising the power module according to claim 12 or 13, or comprising the electric drive system according to claim 14.

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