Encapsulated Circuit Board, Electronic Device, Design Method and Computer Readable Storage Medium

Abstract

The present invention discloses a packaged circuit board, electronic device, design method, and computer-readable storage medium, which are applied to the field of electronic device heat dissipation technology. The packaged circuit board includes: a first circuit board, one side of which is paved with a metal heat-conducting layer; a plurality of first heat-conducting holes provided on the first circuit board, the first heat-conducting holes filled with a first heat-conducting material, the first heat-conducting material being in contact with and connected to the metal heat-conducting layer; a plurality of second heat-conducting holes provided on the first circuit board, the second heat-conducting holes filled with a second heat-conducting material; a heating element provided on the first circuit board, the second heat-conducting material being in contact with and connected to the heating element; a liquid-cooled heat dissipation conduit, the insulating protective layer being provided with a hollow area, the hollow area coinciding with the orthographic projection of the liquid-cooled heat dissipation conduit on the first circuit board, the liquid-cooled heat dissipation conduit being connected to the metal heat-conducting layer through the hollow area; and a liquid-cooled heat dissipation conduit provided on at least one side of the heating element. The packaged circuit board provided by the present invention can significantly reduce the volume of the packaged circuit board and increase its scope of application.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and in particular to a packaged circuit board, electronic equipment, a design method and a computer-readable storage medium. Background Art

[0002] As the power consumption of high-power electronic devices continues to rise, electronic devices such as CPUs (Central Processing Units) or GPUs (Graphics Processing Units) generally use liquid cooling technology to quickly absorb the heat generated inside high-power electronic devices and transfer it to external cooling equipment.

[0003] In the related art, a cold plate is generally installed on the upper surface of a high-power electronic device. Coolant flows in the cold plate and absorbs the heat of the high-power electronic device, and then the device is cooled by an external heat dissipation device. However, the cold plate cooling method in the related art is only suitable for high-power and large-scale electronic devices. The cold plate has a large area and can cover the larger electronic devices as a whole. However, it is difficult to cover high-power and smaller electronic devices in other areas of the PCB board, such as power supply devices. In addition, the cold plate cooling method is difficult to design. Covering the top of the electronic device increases the overall height of the assembled PCB (Printed Circuit Board), thereby increasing the assembly volume of the entire machine, which is not conducive to the miniaturization design of the product.

[0004] Therefore, how to achieve miniaturization of the board design while meeting the heat dissipation requirements of electronic devices is a technical problem that those skilled in the art currently need to solve. Summary of the Invention

[0005] The purpose of the present invention is to provide a packaged circuit board, electronic equipment, design method and computer-readable storage medium, which can reduce the height, facilitate miniaturization design and have good heat dissipation effect.

[0006] To achieve the above objectives, the present invention provides the following technical solutions.

[0007] A packaged circuit board, comprising:

[0008] a first circuit board, wherein a metal heat-conducting layer is provided on one side of the first circuit board, an insulating protective layer is provided on a side of the metal heat-conducting layer away from the first circuit board, a plurality of first heat-conducting holes are provided on the first circuit board, the first heat-conducting holes are filled with a first heat-conducting material, and the first heat-conducting material is in contact with and connected to the metal heat-conducting layer;

[0009] a heating element, located on a side of the insulating protective layer away from the metal heat-conducting layer, and disposed on the first circuit board; the first circuit board is provided with a plurality of second heat-conducting holes, the second heat-conducting holes being filled with a second heat-conducting material, and the second heat-conducting material being in contact with and connected to the heating element;

[0010] A liquid-cooling heat dissipation conduit is located on a side of the insulating protective layer facing away from the metal heat-conducting layer, the insulating protective layer is provided with a hollow area, the hollow area coincides with the orthographic projection of the liquid-cooling heat dissipation conduit on the first circuit board, and the liquid-cooling heat dissipation conduit is connected to the metal heat-conducting layer through the hollow area; and the liquid-cooling heat dissipation conduit is provided on at least one side of the heating element.

[0011] An electronic device comprises the above-mentioned packaged circuit board.

[0012] A method for designing a packaged circuit board comprises the following steps:

[0013] Determining a preset area for laying a metal heat-conducting layer on the first circuit board according to the wiring position of the heating element;

[0014] Determining the locations of a plurality of first thermal conductive holes in the overlapping area of the metal thermal conductive layer and the first circuit board, and determining the locations of a plurality of second thermal conductive holes at positions on the first circuit board corresponding to the heating elements;

[0015] The laying position and width of the liquid cooling heat dissipation pipe are determined according to the heat dissipation requirements of the heating element, and the opening position of the hollow area is determined in the area where the insulating protective layer and the liquid cooling heat dissipation pipe overlap.

[0016] A computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the above-mentioned packaged circuit board design method when executed by a processor.

[0017] The packaged circuit board provided by the present invention has the following beneficial effects: a metal heat-conducting layer is provided on the first circuit board, and then the metal heat-conducting layer is covered with an insulating protective layer to achieve an insulating effect, while restricting the metal heat-conducting layer to ensure that the metal heat-conducting layer can be firmly attached to the surface of the first circuit board; a plurality of first heat-conducting holes are provided at positions corresponding to the metal heat-conducting layer on the first circuit board, that is, the first heat-conducting holes penetrate the first circuit board and the metal heat-conducting layer at the same time, the first heat-conducting holes are filled with a first heat-conducting material, and the first heat-conducting material is in contact with and connected to the metal heat-conducting layer for transferring heat from the first circuit board to the metal heat-conducting layer; positions corresponding to the heating elements on the first circuit board are provided with a plurality of first heat-conducting holes. A plurality of second heat-conducting holes are provided, and the second heat-conducting holes can also be separately provided as needed, or the holes of the first circuit board itself can be used for heat conduction. The second heat-conducting holes are filled with a second heat-conducting material, and the second heat-conducting material is in contact with and connected to the heating element to transfer the heat of the heating element to the first circuit board; the first circuit board has multiple layers, and a plurality of layers of metal plates are provided inside the first circuit board to play a role of conductivity or heat conduction. The heat generated by the heating element when in use is transferred to the metal plate inside the first circuit board through the second heat-conducting holes, and then the heat of the metal plate inside the first circuit board is dissipated along its own extension direction to the position of the first heat-conducting hole, and then the heat is dissipated through the first heat-conducting hole. The heat holes are dissipated to the metal heat-conducting layer, so that the heat of the heating element is transferred to the metal heat-conducting layer with the help of the first circuit board; further, by providing a hollow area on the insulating protective layer, the hollow area coincides with the positive projection of the liquid-cooling heat dissipation pipe on the first circuit board, so that the metal heat-conducting layer located in the hollow area is exposed, thereby facilitating the connection with the liquid-cooling heat dissipation pipe. The metal heat-conducting layer transfers its own heat to the liquid-cooling heat dissipation pipe, so that the heating element transfers heat to the liquid-cooling heat dissipation pipe with the help of the first circuit board and the metal heat-conducting layer, and then with the help of the external cooling medium circulation system, the cooling medium is introduced into the liquid-cooling heat dissipation pipe to achieve heat dissipation of the metal heat-conducting layer, and then achieve heat dissipation of the first circuit board. Heat dissipation, ultimately achieving heat dissipation of the heating element; at the same time, the liquid-cooled heat dissipation conduit and the heating element are laid flat on the same side of the first circuit board, and at least one side of the heating element is provided with a liquid-cooled heat dissipation conduit, avoiding the solution in the related art of placing the liquid-cooled heat dissipation conduit on the side of the heating element away from the circuit board. Instead, the liquid-cooled heat dissipation conduit is placed on at least one side of the heating element. Such an arrangement can not only effectively dissipate the heat of the heating element, improve the heat dissipation effect, and ensure the stable operation of the high-power heating element, but also effectively reduce the overall assembly height of the packaged circuit board and reduce the volume of the packaged circuit board, thereby facilitating the development of electronic equipment towards high density and miniaturization.

[0018] In one embodiment, a heat-conducting component is further included, which is arranged in the assembly gap and is in contact with and connected to both the heating element and the liquid-cooled heat dissipation pipe. The above arrangement, on the one hand, can realize that the heat of the heating element is transferred to the metal heat-conducting layer through the second heat-conducting hole, the first heat-conducting hole and the first circuit board through the arrangement of the metal heat-conducting layer, the first heat-conducting hole and the second heat-conducting hole; on the other hand, by arranging the liquid-cooled heat dissipation pipe on at least one side of the heating element and utilizing the arrangement of the heat-conducting component, the heat of the heating element is transferred to the liquid-cooled heat dissipation pipe through the heat-conducting component; that is, the heat of the heating element is conducted to the liquid-cooled heat dissipation pipe in a direction perpendicular to the surface of the first circuit board and in a direction parallel to the surface of the first circuit board, respectively, and then dissipated by the cooling medium in the liquid-cooled heat dissipation pipe, thereby significantly improving the heat dissipation efficiency.

[0019] In one embodiment, the liquid-cooled heat dissipation pipe is welded and fixed to the metal heat-conducting layer; by welding the liquid-cooled heat dissipation pipe to the metal heat-conducting layer, on the one hand, the solder can ensure good contact between the liquid-cooled heat dissipation pipe and the metal heat-conducting layer, thereby improving the assembly stability and firmness of the liquid-cooled heat dissipation pipe, and the welding method does not require the opening of a mounting hole in the first circuit board, which is conducive to reducing the size of the first circuit board, reducing the manufacturing cost of the first circuit board, and improving the competitive advantage of the product. On the other hand, the welding method can also increase the metal connection area between the metal heat-conducting layer and the liquid-cooled heat dissipation pipe, thereby further improving the heat dissipation efficiency; of course, the liquid-cooled heat dissipation pipe and the metal heat-conducting layer can also be connected and heat-conducted by thermal conductive glue, and the thermal conductive glue covers the hollow area. The thermal conductive glue not only has an insulating effect, but also can ensure the heat conduction efficiency between the liquid-cooled heat dissipation pipe and the metal heat-conducting layer. The connection method using thermal conductive glue is more convenient and can significantly improve the assembly efficiency of the liquid-cooled heat dissipation pipe.

[0020] The electronic device provided by the present invention is provided with the above-mentioned packaged circuit board. Since the packaged circuit board has the above-mentioned technical effects, the electronic device provided with the packaged circuit board should also have corresponding technical effects.

[0021] The packaged circuit board design method provided by the present invention has the following beneficial effects: first, a preset area is determined according to the wiring position in the heating element, and the preset area is used to lay the metal heat-conducting layer to prevent the metal heat-conducting layer from affecting the wiring position in the heating element; then, the opening positions of a plurality of first heat-conducting holes are determined in the overlapping area of the metal heat-conducting layer and the first circuit board, and the opening positions of a plurality of second heat-conducting holes are determined at positions corresponding to the heating element on the first circuit board, the first heat-conducting holes are used to realize heat transfer from the first circuit board to the metal heat-conducting layer, and the second heat-conducting holes are used to realize heat transfer from the heating element to the first circuit board; then, the laying position and width of the liquid-cooling heat dissipation pipe are determined according to the heat dissipation requirements of the heating element. For heating elements with higher power, the laying length and width of the liquid-cooling heat dissipation pipe at the corresponding position can be appropriately increased, and for heating elements with lower power, the laying length and width of the liquid-cooling heat dissipation pipe at the corresponding position can be appropriately increased. The laying length and width of the liquid-cooling heat dissipation pipe at the corresponding position can be reduced. At the same time, in order to ensure the firmness of the liquid-cooling heat dissipation pipe and the transfer of heat from the metal heat-conducting layer to the liquid-cooling heat dissipation pipe, the opening position of the hollow area can be determined in the area where the insulating protective layer and the liquid-cooling heat dissipation pipe overlap. During actual processing, the insulating protective layer can be set on the entire metal heat-conducting layer and the surface of the first circuit board, and then the insulating protective layer in the hollow area can be removed. The liquid-cooling heat dissipation pipe can be fixed on the metal heat-conducting layer through the hollow area, and heat can also be transferred through the hollow area. After the liquid-cooling heat dissipation pipe is assembled, the heating element is installed, and the first circuit board, the heating element and the liquid-cooling heat dissipation pipe are packaged to obtain a complete packaged circuit board. No secondary assembly is required, which can simplify the assembly process of the packaged circuit board and solve the technical problem of high integration, high power consumption and high heat dissipation efficiency being difficult to design in a compatible manner.

[0022] The computer-readable storage medium provided by the present invention stores a computer program. When the computer program is executed by a processor, the steps of the above-mentioned packaged circuit board design method are implemented. Since the above-mentioned packaged circuit board design method has the above-mentioned technical effects, the computer-readable storage medium should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a cross-sectional view of a specific embodiment of the packaged circuit board provided by the present invention.

[0025] Figure 2This is a cross-sectional view of another specific embodiment of the packaged circuit board provided by the present invention.

[0026] Figure 3 This is a schematic diagram of the positions of the metal heat-conducting layer and the hollow area in the packaged circuit board provided by the present invention.

[0027] Figure 4 This is another structural schematic diagram of the hollow area in the packaged circuit board provided by the present invention.

[0028] Figure 5 This is a schematic diagram of the positions of the metal heat-conducting layer and the wiring area in the packaged circuit board provided by the present invention.

[0029] Figure 6 The figure is a schematic layout diagram of a specific embodiment of the liquid-cooling heat dissipation conduit in the packaged circuit board provided by the present invention.

[0030] Figure 7 This is a schematic layout diagram of another specific embodiment of the liquid-cooling heat dissipation pipe in the packaged circuit board provided by the present invention.

[0031] Figure 8 for Figure 6 Schematic diagram of the positions of the water inlet and outlet of the liquid cooling heat dissipation pipe in the packaged circuit board shown.

[0032] Figure 9 for Figure 7 Schematic diagram of the positions of the water inlet and outlet of the liquid cooling heat dissipation pipe in the packaged circuit board shown.

[0033] Figure 10 This is a cross-sectional schematic diagram of the liquid-cooling heat dissipation conduit and heat-conducting components in the packaged circuit board provided by the present invention.

[0034] Figure numerals: first circuit board 1; metal heat-conducting layer 11; insulating protective layer 12; hollow area 121; first heat-conducting hole 13; second heat-conducting hole 14; heating element 2; wiring area 21; liquid-cooling heat dissipation pipe 3; water inlet 31; water outlet 32; heat-conducting component 4; metal cover 5; packaging component 6. DETAILED DESCRIPTION

[0035] The core of the present invention is to provide a packaged circuit board, electronic equipment, design method and computer-readable storage medium, which can reduce the volume of the first circuit board, reduce production costs and improve heat dissipation effect.

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation, and are therefore not to be construed as limiting the present invention. The terms "mounted," "connected," and "connected" should be understood broadly, and may refer to, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the conditions described and conditions similar to the conditions described, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0038] In order to enable those skilled in the art to better understand the solutions of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0039] Please refer to Figures 1 to 5 In this embodiment, the packaged circuit board includes:

[0040] A first circuit board 1 is provided with a metal heat-conducting layer 11 on one side of the first circuit board 1. The metal heat-conducting layer 11 is provided with an insulating protective layer 12 on a side away from the first circuit board 1. The first circuit board 1 is provided with a plurality of first heat-conducting holes 13, and the first heat-conducting holes 13 correspond to the positions of the metal heat-conducting layer 11. The first heat-conducting holes 13 are filled with a first heat-conducting material, and the first heat-conducting material is in contact with and connected to the metal heat-conducting layer 11. The first heat-conducting holes 13 can penetrate the metal heat-conducting layer 11 and partially extend into the interior of the first circuit board 1. The first heat-conducting holes 13 are used to transfer heat from the first circuit board 1 to the metal heat-conducting layer 11.

[0041] The heating element 2 is disposed on the first circuit board 1. The first circuit board 1 is provided with a plurality of second thermal conductive holes 14. The second thermal conductive holes 14 correspond to the positions of the heating elements 2. The second thermal conductive holes 14 are filled with a second thermal conductive material. The second thermal conductive material is in contact with the heating element 2. The second thermal conductive holes 14 are used to transfer heat from the heating element 2 to the first circuit board 1.

[0042] The liquid-cooling heat dissipation conduit 3 is arranged flatly on the same side of the first circuit board 1 as the heating element 2. The insulating protective layer 12 is provided with a hollow area 121. The hollow area 121 coincides with the orthographic projection of the liquid-cooling heat dissipation conduit 3 on the first circuit board 1. The liquid-cooling heat dissipation conduit 3 is connected to the metal thermal conductive layer 11 through the hollow area 121. The liquid-cooling heat dissipation conduit 3 is provided on at least one side of the heating element 2, that is, the liquid-cooling heat dissipation conduit 3 is arranged in a position adjacent to at least one side of the heating element 2.

[0043] Specifically, the liquid-cooled heat dissipation pipe 3 is connected to the metal heat-conducting layer 11 through the hollow area 121 to facilitate heat transfer between the liquid-cooled heat dissipation pipe 3 and the metal heat-conducting layer 11 through the hollow area 121; the insulating protective layer 12 can not only play an insulating effect, but also fix the metal heat-conducting layer 11 to prevent the metal heat-conducting layer 11 from detaching from the first circuit board 1; the insulating protective layer 12 can be a coating glue, which is a liquid or semi-fluid glue. Its main function is to protect the first circuit board 1 from environmental influences such as moisture, dust, and corrosion. It can be quickly solidified by spraying, brushing or soaking; the metal heat-conducting layer 11 can be a network copper foil. The grid copper foil is a special copper cladding method in the design of printed circuit boards. A grid structure is formed by regularly arranged copper wires. Compared with solid copper cladding, the network copper foil reduces the area of the continuous copper layer through the copper wires arranged at intervals. The resistance is higher than solid copper, but it can reduce the eddy current effect in high-frequency circuits and improve the electromagnetic shielding at specific frequencies. shielding performance; further, the first thermal conductive via 13 and the second thermal conductive via 14 can be set separately, and metal, such as copper, can be set on the inner wall to play a good thermal conductive role; the first thermal conductive via 13 and the second thermal conductive via 14 can also be GND through-holes, that is, grounding through-holes, which connect the metal surfaces of different layers of the first circuit board 1 through dense GND through-holes, providing the shortest return path for high-frequency signals and noise currents, reducing impedance and reducing electromagnetic radiation, while playing a heat dissipation effect; the first thermal conductive via 13 and the second thermal conductive via 14 can be set separately, that is, avoiding the GND through-hole originally designed on the first circuit board 1, and the first thermal conductive via 13 and the second thermal conductive via 14 only play a heat conductive role. When so set, the diameter of the first thermal conductive via 13 and the second thermal conductive via 14 can be larger than the size of the GND through-hole to improve the thermal conductive effect; of course, for the second thermal conductive via 14 on the first circuit board 1, the GND through-hole of the first circuit board 1 itself can also be used without being set separately, saving production costs.

[0044] Furthermore, the liquid cooling heat dissipation conduit 3 can be made of a metal tube, such as a copper tube, a stainless steel tube or an aluminum alloy tube. The metal tube has high strength, good corrosion resistance, and is easy to weld and fix on the metal heat conductive layer 11. Of course, the liquid cooling heat dissipation conduit 3 can also be made of a non-metallic tube, such as a plastic tube, and then connected and fixed to the metal heat conductive layer 11 through thermal conductive glue.

[0045] The packaged circuit board is provided with a metal heat-conducting layer 11 on the first circuit board 1, and then the metal heat-conducting layer 11 is covered with an insulating protective layer 12 to achieve an insulating effect. At the same time, the metal heat-conducting layer 11 is restricted to ensure that the metal heat-conducting layer 11 can be firmly attached to the surface of the first circuit board 1; a plurality of first heat-conducting holes 13 are provided at positions corresponding to the metal heat-conducting layer 11 on the first circuit board 1, that is, the first heat-conducting holes 13 penetrate the first circuit board 1 and the metal heat-conducting layer 11 at the same time, and a plurality of second heat-conducting holes 14 are provided at positions corresponding to the heating elements 2 on the first circuit board 1. The second heat-conducting holes 14 can also be provided separately as needed, or the holes of the first circuit board 1 itself can be used for heat conduction. The first circuit board 1 has multiple layers, and a plurality of layers of metal plates are provided inside the first circuit board 1. The plane where the metal plates are located is parallel to the surface of the first circuit board. The metal plates play a role of conductivity or heat conduction. The heat generated by the heating element 2 during use is transferred to the metal inside the first circuit board 1 through the second heat-conducting holes 14. The heat of the metal plate inside the first circuit board 1 is dissipated along its own extension direction to the position of the first heat-conducting hole 13, and then the heat is dissipated to the metal heat-conducting layer 11 through the first heat-conducting hole 13, so that the heat of the heating element 2 is transferred to the metal heat-conducting layer 11 with the help of the first circuit board 1; further, by providing a hollow area 121 on the insulating protective layer 12, the hollow area 121 coincides with the orthographic projection of the liquid-cooling heat dissipation pipe 3 on the first circuit board 1, so that the metal heat-conducting layer 11 at the position of the hollow area 121 is exposed, thereby facilitating connection with the liquid-cooling heat dissipation pipe 3, and the metal heat-conducting layer 11 transfers its own heat to the liquid-cooling heat dissipation pipe 3, so that the heating element 2 transfers heat to the liquid-cooling heat dissipation pipe 3 with the help of the first circuit board 1 and the metal heat-conducting layer 11, and then with the help of the external cooling medium circulation system, the cooling medium is introduced into the liquid-cooling heat dissipation pipe 3 to achieve heat dissipation of the metal heat-conducting layer 11, thereby achieving heat dissipation of the first circuit board 1, and finally achieving heat dissipation of the heating element 2.

[0046] Furthermore, the liquid-cooling heat dissipation conduit 3 and the heating element 2 are arranged on the same surface of the first circuit board 1, and the liquid-cooling heat dissipation conduit 3 is located on at least one side of the heating element 2. The liquid-cooling heat dissipation conduit 3 and the heating element 2 are both arranged on the same surface of the first circuit board 1, avoiding the solution of placing the liquid-cooling heat dissipation conduit 3 on the surface of the heating element 2 in the related art. Instead, the liquid-cooling heat dissipation conduit 3 is placed on at least one side of the heating element 2. Such a setting can not only effectively dissipate heat for the heating element 2, improve the heat dissipation effect, and ensure the stable operation of the high-power heating element 2, but also effectively reduce the overall assembly height of the packaged circuit board and reduce the volume of the packaged circuit board, thereby facilitating the development of electronic equipment towards high density and miniaturization.

[0047] In some embodiments, the liquid-cooling heat dissipation conduit 3 and the heating element 2 are spaced apart so that an assembly gap can be formed between the liquid-cooling heat dissipation conduit 3 and the heating element 2; specifically, the liquid-cooling heat dissipation conduit 3 and the heating element 2 are arranged on the same surface of the first circuit board 1. By spacing the liquid-cooling heat dissipation conduit 3 and the heating element 2 apart, the disassembly and assembly of the heating element 2 can be facilitated, and maintenance is facilitated.

[0048] In some embodiments, a heat conducting component 4 is further included, which is arranged between the liquid-cooling heat dissipation pipe 3 and the heating element 2, and the heat conducting component 4 is in contact with the heating element 2 and the liquid-cooling heat dissipation pipe 3 respectively, that is, both sides of the heat conducting component 4 are in contact with the heating element 2 and the liquid-cooling heat dissipation pipe 3 respectively; the above arrangement, on the one hand, can realize that the heat of the heating element 2 is transferred to the metal heat conducting layer 11 through the second heat conducting holes 14, the first heat conducting holes 13 and the first circuit board 1 through the arrangement of the metal heat conducting layer 11, the first heat conducting holes 13, and the second heat conducting holes 14; on the other hand, by arranging the liquid-cooling heat dissipation pipe 3 on at least one side of the heating element 2 and utilizing the arrangement of the heat conducting component 4, the heat of the heating element 2 is transferred to the liquid-cooling heat dissipation pipe 3 through the heat conducting component 4; that is, the heat of the heating element 2 is conducted to the liquid-cooling heat dissipation pipe 3 in a direction perpendicular to the surface of the first circuit board 1 and in a direction parallel to the surface of the first circuit board 1, and then dissipated by the cooling medium in the liquid-cooling heat dissipation pipe 3, thereby significantly improving the heat dissipation efficiency.

[0049] In some embodiments, the wall thickness of the liquid-cooling heat dissipation pipe 3 is 0.5-0.8 mm, which is not only conducive to heat dissipation, but also can ensure the strength of the liquid-cooling heat dissipation pipe 3 and improve stability and reliability; if the wall thickness of the liquid-cooling heat dissipation pipe 3 is too thick, it will occupy the area of the first circuit board 1, resulting in an increase in the area of the first circuit board 1, and at the same time it is not conducive to the layout of the wiring area 21 around the heating element 2. If the wall thickness of the liquid-cooling heat dissipation pipe 3 is too thin, it will cause the liquid-cooling heat dissipation pipe 3 to be difficult to process and manufacture, and at the same time, it has low pressure resistance and is easy to break or crack.

[0050] In some embodiments, the width of the hollow area 121 is 1-3 mm. The hollow area 121 serves to connect the liquid-cooling heat dissipation conduit 3 and the metal heat-conducting layer 11. Therefore, it should not be too small, resulting in a loose connection, nor too large, as this would prevent the metal heat-conducting layer 11 from being covered by the liquid-cooling heat dissipation conduit 3 and thus affect the insulation protection of the insulating protective layer 12. Specifically, the width of the hollow area 121 refers to the width perpendicular to the extension direction of the liquid-cooling heat dissipation conduit 3 at the corresponding position; the size of the hollow area 121 can be adjusted appropriately based on the width of the liquid-cooling conduit.

[0051] In some embodiments, the first thermal conductive via 13 and the second thermal conductive via 14 are both connected to the metal layers in the first circuit board 1; and the extension directions of the first thermal conductive via 13 and the second thermal conductive via 14 are both perpendicular to the surface of the first circuit board 1; specifically, the first thermal conductive via 13 and the second thermal conductive via 14 extend perpendicular to the surface of the first circuit board 1, which can avoid interference with other GND holes, shorten the heat conduction path, and maximize the heat conduction efficiency; further, the second thermal conductive via 14 is located close to the center of the heating element 2. Since the center of the heating element 2 generates the most heat, the second thermal conductive via 14 is located close to the center of the heating element 2 to ensure that heat is conducted to the inside of the first circuit board 1 as quickly as possible; further, the first thermal conductive via 13 can also be located close to the liquid cooling heat dissipation conduit 3 so that heat is conducted to the liquid cooling heat dissipation conduit 3 as quickly as possible; of course, the position of the first thermal conductive via 13 can also be set as needed.

[0052] In some embodiments, the diameter of the first thermal conductive hole 13 and / or the second thermal conductive hole 14 is 0.3-0.4 mm; in the related art, the diameter of the GND hole on the first circuit board 1 is generally 0.25 mm. The present application improves the heat transfer efficiency by increasing the diameter of the first thermal conductive hole 13 and / or the second thermal conductive hole 14. Of course, the first thermal conductive hole 13 and / or the second thermal conductive hole 14 can also directly utilize the GND hole on the first circuit board 1, that is, the originally designed GND hole on the first circuit board 1, as the first thermal conductive hole 13 or the second thermal conductive hole 14, without the need for additional processing of the first thermal conductive hole 13 and the second thermal conductive hole 14, thereby simplifying the operation process; it should be noted that the GND hole is opened after the first circuit board 1 and the metal thermal conductive layer 11 are assembled.

[0053] In some embodiments, the spacing between the metal thermal conductive layer 11 and the wiring area 21 of the heating element 2 is ≥0.1 mm, that is, the metal thermal conductive layer 11 can be arranged in the area with a distance of more than 0.1 mm from the wiring area 21 of the heating element 2. In order to improve the heat dissipation efficiency, the larger the laying area of the metal thermal conductive layer 11, the better.

[0054] In some embodiments, the hollow area 121 is strip-shaped and / or circular, and the area of the hollow area 121 is smaller than the area of the metal heat-conducting layer 11; the hollow area 121 is set to be strip-shaped, and the hollow area 121 is opened at all positions on the insulating protective layer 12 that overlap with the liquid-cooling heat dissipation pipe 3, which can improve the thermal conductivity between the liquid-cooling heat dissipation pipe 3 and the metal heat-conducting layer 11, and can improve the connection strength and stability between the liquid-cooling heat dissipation pipe 3 and the metal heat-conducting layer 11; setting the hollow area 121 to be circular can facilitate processing and welding fixation.

[0055] In some embodiments, hollow areas 121 are distributed around the heating element 2, and the hollow areas 121 located around the heating element 2 have the same size. For example, the hollow areas 121 in the long direction have the same length and width, and the number of hollow areas 121 located around the heating element 2 also has the same effect. Furthermore, the hollow areas 121 located around the heating element 2 can also be located at the same position as the corresponding side walls. This arrangement is to ensure uniform force between the metal heat-conducting layer 11 of the liquid-cooling heat dissipation pipe 3 and reduce the risk of deformation of the liquid-cooling heat dissipation pipe 3.

[0056] In some embodiments, the cross-section of the liquid-cooling heat dissipation conduit 3 is triangular or rectangular, and the side of the liquid-cooling heat dissipation conduit 3 connected to the metal heat-conducting layer 11 is flat; specifically, the flat structure is more convenient for connection and fixation with the metal heat-conducting layer 11, and has a large heat-conducting area, which is conducive to improving heat dissipation efficiency; in order to facilitate processing and improve stability, the cross-section of the liquid-cooling heat dissipation conduit 3 is preferably rectangular.

[0057] In some embodiments, as Figure 10 As shown, the cross-section of the liquid-cooling heat dissipation pipe 3 is trapezoidal, and the bottom surface of the liquid-cooling heat dissipation pipe 3 with a larger width is connected to the metal heat-conducting layer 11; the bottom surface of the liquid-cooling heat dissipation pipe 3 has a large area, which can improve the stability and firmness of the connection with the metal heat-conducting layer 11. At the same time, through the arrangement of the trapezoidal structure, the contact area between the side surface of the liquid-cooling heat dissipation pipe 3 and the heat-conducting component 4 can also be increased, thereby improving the heat conduction efficiency of the heat-conducting component 4 to the liquid-cooling heat dissipation pipe 3; at the same time, it can also facilitate the arrangement of the heat-conducting component 4. When the heat-conducting component 4 is thermally conductive silicone, since the bottom of the assembly gap is narrower and the top is wider, it is more convenient to fill the thermally conductive silicone.

[0058] In some embodiments, the first thermal conductive material and / or the second thermal conductive material is a metal tube, that is, a metal tube is provided in the first thermal conductive hole and / or the second thermal conductive hole. The metal tube can be embedded in the thermal conductive hole. The metal tube can be a copper tube with high thermal conductivity efficiency.

[0059] In some embodiments, the spacing width between the liquid-cooling heat dissipation pipe 3 and the heating element 2 is 1.5-3 mm; by setting the spacing width between the liquid-cooling heat dissipation pipe 3 and the heating element 2 to not less than 1.5 mm, the requirements for disassembly and assembly of the heating element 2 on the first circuit board 1 are met; of course, the spacing width between the liquid-cooling heat dissipation pipe 3 and the heating element 2 should not be too large, resulting in low heat transfer efficiency between the liquid-cooling heat dissipation pipe 3 and the heating element 2, affecting heat dissipation, and it is appropriate to select a spacing width of 1.5-3 mm.

[0060] In some embodiments, the liquid cooling heat dissipation pipe 3 surrounds the periphery of at least one heating element 2; Figure 6 and Figure 7As shown, for the heating elements 2 with higher power, a liquid-cooling heat dissipation pipe 3 is set around the entire periphery of a single heating element 2. If the size of the heating element 2 is small and the heat dissipation power is not high, liquid-cooling heat dissipation pipes 3 can be set around the periphery of at least two heating elements 2 to improve the scope of application while meeting the heat dissipation requirements.

[0061] In some embodiments, as Figure 7 As shown, the liquid cooling heat dissipation pipe 3 extends in an S-shape between two adjacent heating elements and surrounds the two adjacent heating elements in reverse. That is, after the liquid cooling heat dissipation pipe 3 passes between the two adjacent heating elements, it extends and bends in different directions. Specifically, for multiple high-power heating elements 2 installed at a close distance, an S-shaped structure can be used to surround them. Of course, the extension direction of the liquid cooling heat dissipation pipe 3 can also be freely combined according to the heat dissipation requirements of the heating elements 2. For example, after the liquid cooling heat dissipation pipe 3 extends in an S-shaped structure, it can continue to surround one or more heating elements 2, such as Figure 7 The two arrangements of the liquid-cooling heat dissipation pipes 3 shown in the figure can be connected; only one liquid-cooling heat dissipation pipe 3 can be set on the same packaged circuit board, and this liquid-cooling heat dissipation pipe 3 extends to the periphery of each heating element 2; of course, multiple liquid-cooling heat dissipation pipes 3 can also be set, and the cooling medium can be transported to different liquid-cooling heat dissipation pipes 3 through a water distributor.

[0062] In some embodiments, as Figure 8 and Figure 9 As shown, the liquid-cooling heat dissipation pipe 3 is provided with a water inlet 31 and a water outlet 32, and the extension directions of the water inlet 31 and the water outlet 32 are both parallel to the surface of the first circuit board 1; specifically, the liquid-cooling heat dissipation pipe 3 is provided with a water inlet 31 and a water outlet 32, which are respectively connected to the external cooling medium circulation system, and the extension directions of the water inlet 31 and the water outlet 32 are both parallel to the surface of the first circuit board 1, that is, the water inlet and water outlet of the liquid-cooling heat dissipation pipe 3 are also carried out in contact with the surface of the first circuit board 1, without occupying the overall height of the packaged circuit board. Furthermore, the water inlet 31 and the water outlet 32 of the liquid-cooling heat dissipation pipe 3 are arranged adjacent to each other; specifically, by arranging the water inlet 31 and the water outlet 32 adjacent to each other, the connection of the external cooling medium circulation system can be facilitated, the assembly efficiency can be improved, and the setting of the pipeline can be reduced; specifically, in addition to the liquid-cooling heat dissipation pipe 3 surrounding the periphery of the heating element 2, other spaces on the first circuit board 1 avoiding the wiring area 21 can also be utilized to extend the liquid-cooling heat dissipation pipe 3 until the liquid-cooling heat dissipation pipe 3 extends from the side edge of the first circuit board 1 to facilitate connection with the external cooling medium circulation system. Such an arrangement can further reduce the height of the entire packaged circuit board to meet the requirements of miniaturization design.

[0063] In some embodiments, the liquid cooling heat dissipation pipe 3 is fixed to the metal heat conductive layer 11 by welding through the hollow area 121 ; alternatively, thermal conductive adhesive is filled between the liquid cooling heat dissipation pipe 3 and the metal heat conductive layer 11 , and the thermal conductive adhesive covers the hollow area 121 . The liquid-cooling heat dissipation pipe 3 is welded and fixed to the metal heat-conducting layer 11 through the hollow area 121; by welding the liquid-cooling heat dissipation pipe 3 to the metal heat-conducting layer 11, on the one hand, the solder can ensure good contact between the liquid-cooling heat dissipation pipe 3 and the metal heat-conducting layer 11, thereby improving the assembly stability and firmness of the liquid-cooling heat dissipation pipe 3, and the use of welding does not require opening a mounting hole in the first circuit board 1, thereby helping to reduce the size of the first circuit board 1, reducing the manufacturing cost of the first circuit board 1, and improving the product's competitive advantage. On the other hand, the welding connection can also increase the metal connection area between the metal heat-conducting layer 11 and the liquid-cooling heat dissipation pipe 3, thereby further improving the heat dissipation efficiency; of course, the liquid-cooling heat dissipation pipe 3 and the metal heat-conducting layer 11 can also be connected and heat-conducted by thermal conductive glue. The thermal conductive glue covers the hollow area 121. The thermal conductive glue not only has an insulating effect, but also can ensure the heat conduction efficiency between the liquid-cooling heat dissipation pipe 3 and the metal heat-conducting layer 11. The connection method using thermal conductive glue is more convenient and can significantly improve the assembly efficiency of the liquid-cooling heat dissipation pipe 3.

[0064] In some embodiments, the height of the liquid-cooling heat dissipation conduit 3 along the first direction is less than or equal to the height of the heating element 2 along the first direction, and the first direction is perpendicular to the surface of the first circuit board 1. Specifically, the height of the heat-conducting component 4 along the first direction should also be less than or equal to the height of the heating element 2 along the first direction. An optimal configuration is to have the liquid-cooling heat dissipation conduit 3, the heat-conducting component 4, and the heating element 2 have the same height along the first direction. This configuration, by limiting the height of the heating element 2 along the first direction, avoids an increase in the height of the packaged circuit board due to an excessive height of the liquid-cooling heat dissipation conduit 3. When the power of the heating element 2 is high and the heat dissipation requirements are difficult to meet, this can be achieved by adjusting the location of the liquid-cooling heat dissipation conduit 3 or the width of the liquid-cooling heat dissipation conduit 3, without affecting the overall height of the packaged circuit board, thus facilitating a miniaturized design of the packaged circuit board.

[0065] In some embodiments, the heating element 2 includes a first electrical component and a second electrical component, the height of the first electrical component along the first direction is greater than the height of the second electrical component along the first direction; a first liquid-cooling heat dissipation pipe is provided on at least one side of the first electrical component, and a second liquid-cooling heat dissipation pipe is provided on at least one side of the second electrical component, the height of the first liquid-cooling heat dissipation pipe along the first direction is equal to the height of the first electrical component along the first direction, and the height of the second liquid-cooling heat dissipation pipe along the first direction is equal to the height of the first liquid-cooling heat dissipation pipe along the first direction;

[0066] In addition, it also includes a metal cover plate 5, which is laid on the second electrical component and is in contact with the side wall of the second liquid-cooled heat dissipation pipe, and the sum of the heights of the metal cover plate 5 and the second electrical component along the first direction is equal to the height of the first electrical component along the first direction.

[0067] The above arrangement, through the arrangement of the metal cover plate 5, facilitates the uniform height of the heating elements 2 in the entire packaged circuit board. When the heights of the heating elements 2 are different, the height of all the surrounding liquid-cooling heat dissipation pipes 3 is determined by the heating element 2 with the highest height. According to the height difference, the surrounding liquid-cooling heat dissipation pipes 3 used by the heating elements 2 with lower heights are connected to the liquid-cooling heat dissipation around the heating elements 2 by adding a metal cover plate 5 above the heating elements 2. The metal cover plate 5 is in contact with the liquid-cooling heat dissipation around the heating elements 2, thereby conducting the heat of the heating elements 2 to the heat dissipation pipes, thereby improving the heat dissipation efficiency without increasing the height of the packaged circuit board.

[0068] Embodiment 1: The packaged circuit board includes a first circuit board 1, a heating element 2 and a liquid-cooling heat dissipation pipe 3. A metal heat-conducting layer 11 is laid on the first circuit board 1, and an insulating protective layer 12 is provided on the surface of the metal heat-conducting layer 11. A plurality of first heat-conducting holes 13 are provided at positions corresponding to the metal heat-conducting layer 11 on the first circuit board 1; the heating element 2 is arranged on the first circuit board 1, and a plurality of second heat-conducting holes 14 are provided at positions corresponding to the heating element 2 on the first circuit board 1; the liquid-cooling heat dissipation pipe 3 and the heating element 2 are arranged on the same surface of the first circuit board 1, the insulating protective layer 12 is provided with a hollow area 121, and the hollow area 121 coincides with the projection of the liquid-cooling heat dissipation pipe 3 in the first direction, and the liquid-cooling heat dissipation pipe 3 is connected to the metal heat-conducting layer 11 through the hollow area 121; an assembly gap is provided between the liquid-cooling heat dissipation pipe 3 and the heating element 2, and further includes a heat-conducting component 4, which is arranged in the assembly gap, and the two sides of the heat-conducting component 4 are respectively in contact with the heating element 2 and the liquid-cooling heat dissipation pipe 3.

[0069] With the above arrangement, the heat of the heating element 2 is conducted to the liquid-cooled heat dissipation pipe 3 along the first direction and the second direction respectively, wherein the second direction is parallel to the surface of the first circuit board 1, and then the heat is dissipated by the cooling medium in the liquid-cooled heat dissipation pipe 3, thereby significantly improving the heat dissipation efficiency.

[0070] Embodiment 2: The packaged circuit board includes a first circuit board 1, a heating element 2 and a liquid cooling heat dissipation pipe 3. The difference from embodiment 1 is that the height of the liquid cooling heat dissipation pipe 3 along the first direction is limited to be less than or equal to the height of the heating element 2 along the first direction.

[0071] The above arrangement can avoid the increase in the height of the packaged circuit board due to the excessive height of the liquid-cooling heat dissipation pipe 3, will not affect the overall height of the packaged circuit board, and is conducive to the miniaturization design of the packaged circuit board.

[0072] Example 3: The packaged circuit board includes a first circuit board 1, a heating element 2 and a liquid-cooled heat dissipation pipe 3; the difference from Example 2 is that the heating element 2 includes a first electrical component and a second electrical component, and the height of the first electrical component along the first direction is greater than the height of the second electrical component along the first direction; and it also includes a metal cover plate 5, the metal cover plate 5 is laid on the second electrical component, and the sum of the height of the metal cover plate 5 and the second electrical component along the first direction is equal to the height of the first electrical component along the first direction.

[0073] The above arrangement facilitates the unification of the heights of the heating elements 2 in the entire packaged circuit board. By adding a metal cover plate 5 above the heating element 2, the metal cover plate 5 is in contact with the liquid cooling heat dissipation around the heating element 2, thereby conducting the heat of the heating element 2 to the heat dissipation duct, thereby improving the heat dissipation efficiency without increasing the height of the packaged circuit board.

[0074] In addition to the above-mentioned packaged circuit board, the present invention also provides an electronic device including the above-mentioned packaged circuit board. For the structures of other parts of the electronic device, please refer to the relevant technology and will not be described in detail herein.

[0075] In addition to the above-mentioned packaged circuit board, the present invention also provides a packaged circuit board design method that can be used to design the above-mentioned packaged circuit board; the packaged circuit board design method includes the following steps:

[0076] Step S1: determining a preset area for laying a metal heat-conducting layer 11 on the first circuit board 1 according to the wiring position of the heating element 2;

[0077] Step S2: determining the locations of a plurality of first thermal conductive vias 13 in the overlapping area between the metal thermal conductive layer 11 and the first circuit board 1 , and determining the locations of a plurality of second thermal conductive vias 14 at positions on the first circuit board 1 corresponding to the heating elements 2 ;

[0078] Step S3: Determine the laying position and width of the liquid cooling heat dissipation pipe 3 according to the heat dissipation requirements of the heating element 2, and determine the opening position of the hollow area 121 in the area where the insulating protective layer 12 and the liquid cooling heat dissipation pipe 3 overlap.

[0079] Specifically, by fixing the liquid-cooling heat dissipation pipe 3 and the metal heat-conducting layer 11 at the position of the hollow area 121, welding can be used for fixing. By welding, there is no need to increase the mounting holes of the liquid-cooling heat dissipation pipe 3, thereby increasing the wiring area 21 of the high-power consumption heating element 2 on the first circuit board 1, which is conducive to the miniaturization design of the packaged circuit board and reduces the manufacturing cost of the packaged circuit board; of course, thermal conductive glue can also be provided for fixing; after the first circuit board 1, the metal heat-conducting layer 11 and the insulating protective layer 12 are set, the heating element 2 is installed, and the first circuit board 1, the heating element 2 and the liquid-cooling heat dissipation pipe 3 are packaged, and the packaged circuit board is formed into a complete whole through the packaging component 6; the first thermal conductive hole 13 and the second thermal conductive hole 14 are connected to the flat copper foil of the inner layer of the first circuit board 1, thereby increasing the metal copper connection area and conductivity.

[0080] The packaged circuit board design method first determines a preset area based on the wiring position in the heating element 2. The preset area is used to lay the metal heat-conducting layer 11 to prevent the metal heat-conducting layer 11 from affecting the wiring position in the heating element 2. Then, the opening positions of a plurality of first heat-conducting holes 13 are determined in the overlapping area of the metal heat-conducting layer 11 and the first circuit board 1, and the opening positions of a plurality of second heat-conducting holes 14 are determined at positions on the first circuit board 1 corresponding to the heating element 2. The first heat-conducting holes 13 are used to transfer heat from the first circuit board 1 to the metal heat-conducting layer 11, and the second heat-conducting holes 14 are used to transfer heat from the heating element 2 to the first circuit board 1. Then, the laying position and width of the liquid-cooling heat dissipation conduit 3 are determined based on the heat dissipation requirements of the heating element 2. For a heating element 2 with higher power, the laying length and width of the liquid-cooling heat dissipation conduit 3 at the corresponding position can be appropriately increased. For a heating element 2 with lower power, the laying length and width of the liquid-cooling heat dissipation conduit 3 at the corresponding position can be reduced.

[0081] Furthermore, in order to ensure the firmness of the liquid-cooling heat dissipation pipe 3 and the transfer of heat from the metal heat-conducting layer 11 to the liquid-cooling heat dissipation pipe 3, the position of the hollow area 121 can be determined in the area where the insulating protective layer 12 overlaps with the liquid-cooling heat dissipation pipe 3. During actual processing, the insulating protective layer 12 can be provided on the entire surface of the metal heat-conducting layer 11 and the first circuit board 1, and then the insulating protective layer 12 located in the hollow area 121 can be removed. The liquid-cooling heat dissipation pipe 3 can be fixed on the metal heat-conducting layer 11 through the hollow area 121, and heat can also be transferred through the hollow area 121. After the liquid-cooling heat dissipation pipe 3 is assembled, the heating element 2 is installed, and the first circuit board 1, the heating element 2 and the liquid-cooling heat dissipation pipe 3 are packaged to obtain a complete packaged circuit board. No secondary assembly is required, which can simplify the assembly process of the packaged circuit board and solve the technical problem of high integration, high power consumption and high heat dissipation efficiency being difficult to design in a compatible manner.

[0082] In some embodiments, determining the laying position and width of the liquid cooling heat dissipation pipe 3 according to the heat dissipation requirement of the heating element 2 includes:

[0083] The width of the liquid cooling heat dissipation pipe 3 is determined according to the power of the heating element 2;

[0084] Moreover, when the power of the heating element 2 is ≥1000W, the width of the liquid-cooling heat dissipation conduit 3 is determined to be 4.5-5.5mm; when the power of the heating element 2 is ≤1000W, the width of the liquid-cooling heat dissipation conduit 3 is determined to be 0.8-1.2mm; the width of the liquid-cooling heat dissipation conduit 3 is adjusted according to the power size of the heating element 2 to meet the heat dissipation requirements of different heating elements 2.

[0085] Specifically, according to the heat dissipation requirements of the high-power heating element 2, the width of the liquid-cooling heat dissipation pipe 3 is expanded outward, thereby determining the outer dimensions of the liquid-cooling heat dissipation pipe 3 and its layout area; for example, the length, width and height dimensions of the conventional heating element 2 are: 60mm×80mm×3mm, and the length, width and height dimensions of the overall inner circle of the surround-type liquid-cooling heat dissipation pipe 3 are 63mm×83mm×3mm. Since the power of the heating element 2 can reach 1000~1200W, in order to improve the heat dissipation efficiency, according to the heat dissipation requirements of the heating element 2 and heat dissipation analysis, it is necessary to If the liquid-cooling heat dissipation pipe 3 is to be expanded outward on one side by 5mm, the length, width and height dimensions of the overall outer circle of the surround-type liquid-cooling heat dissipation pipe 3 are: 73mm×93mm×3mm; the length, width and height dimensions of the conventional heating element 2 are: 10mm×12mm×1mm; then the overall inner circle dimensions of the surround-type liquid-cooling heat dissipation pipe 3 are 13mm×15mm×1mm. According to the heat dissipation requirements and heat dissipation analysis of the heating element 2, it is necessary to expand outward on one side by 1mm, so the overall outer circle dimensions of the surround-type heat dissipation pipe are: 15mm×17mm×1mm.

[0086] This packaged circuit board and its design method are mainly based on the design perspective of the liquid cooling system and its corresponding packaged circuit board. The thermal conductive liquid channel surrounds the circumference of the high-power heating element 2, which is applicable to all high-power heating elements 2, thereby quickly taking away heat and improving the operating stability of the high-power heating element 2; at the same time, the overall assembly height of the packaged circuit board is reduced, which is conducive to the high integration and miniaturization development of the entire electronic device system, and solves the technical problem of the compatibility of heat dissipation and miniaturization of future high-power electronic products.

[0087] In addition to the above-mentioned packaged circuit board design method, the present invention also provides a computer-readable storage medium, which stores a computer program, wherein when the computer program is executed by a processor, the steps of the above-mentioned packaged circuit board design method are implemented.

[0088] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0089] The above is a detailed introduction to the packaged circuit board provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only intended to help understand the method and core concept of the present invention. It should be noted that for those skilled in the art, without departing from the principles of the present invention, various improvements and modifications can be made to the present invention, and such improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A packaged circuit board, characterized in that: include: A first circuit board (1), wherein a metal heat-conducting layer (11) is provided on one side of the first circuit board (1), an insulating protective layer (12) is provided on the side of the metal heat-conducting layer (11) away from the first circuit board (1), a plurality of first heat-conducting holes (13) are provided on the first circuit board (1), the first heat-conducting holes (13) are filled with a first heat-conducting material, and the first heat-conducting material is in contact with and connected to the metal heat-conducting layer (11); A heating element (2) is arranged on the first circuit board (1), the first circuit board (1) is provided with a plurality of second heat-conducting holes (14), the second heat-conducting holes (14) are filled with a second heat-conducting material, and the second heat-conducting material is in contact with and connected to the heating element (2); The liquid-cooling heat dissipation pipe (3) is arranged flatly on the same side of the first circuit board (1) as the heating element (2); the insulating protective layer (12) is provided with a hollow area (121); the hollow area (121) coincides with the orthographic projection of the liquid-cooling heat dissipation pipe (3) on the first circuit board (1); the liquid-cooling heat dissipation pipe (3) is connected to the metal heat-conducting layer (11) through the hollow area (121); the area of the hollow area (121) is smaller than the area of the metal heat-conducting layer (11); and the liquid-cooling heat dissipation pipe (3) is provided on at least one side of the heating element (2).

2. The packaged circuit board according to claim 1, wherein: The liquid cooling heat dissipation conduit (3) and the heating element (2) are spaced apart.

3. The packaged circuit board according to claim 2, wherein: It also includes a heat-conducting component (4), which is arranged between the liquid-cooling heat dissipation pipe (3) and the heating element (2), and the heat-conducting component (4) is in contact with the heating element (2) and the liquid-cooling heat dissipation pipe (3) respectively.

4. The packaged circuit board according to claim 1, wherein: The first heat-conducting hole (13) and the second heat-conducting hole (14) are both connected to the heat-conducting metal layer in the first circuit board (1); and the extension directions of the first heat-conducting hole (13) and the second heat-conducting hole (14) are both perpendicular to the surface of the first circuit board (1).

5. The packaged circuit board according to claim 1, wherein: The diameter of the first heat-conducting hole (13) and / or the second heat-conducting hole (14) is 0.3-0.4 mm.

6. The packaged circuit board according to claim 1, wherein: The spacing between the metal heat-conducting layer (11) and the wiring area (21) of the heating element (2) is ≥0.1 mm.

7. The packaged circuit board according to claim 1, wherein: The hollow area (121) is strip-shaped and / or circular; and / or the heating element (2) is provided with hollow areas (121) on all four sides, and the hollow areas (121) located on the four sides of the heating element (2) have the same size.

8. The packaged circuit board according to claim 1, wherein: The cross section of the liquid cooling heat dissipation pipe (3) is triangular or rectangular, and the surface of the liquid cooling heat dissipation pipe (3) connected to the metal heat conducting layer (11) is a plane; Alternatively, the cross section of the liquid-cooling heat dissipation pipe (3) is trapezoidal, and the bottom surface with a larger width in the liquid-cooling heat dissipation pipe (3) is connected to the metal heat-conducting layer (11).

9. The packaged circuit board according to claim 1, wherein: The first heat-conducting material and / or the second heat-conducting material is a metal tube.

10. The packaged circuit board according to claim 1, wherein: The width of the interval between the liquid-cooling heat dissipation pipe (3) and the heating element (2) is 1.5-3 mm; the wall thickness of the liquid-cooling heat dissipation pipe (3) is 0.5-0.8 mm; and the width of the hollow area (121) is 1-3 mm.

11. The packaged circuit board according to any one of claims 1 to 10, wherein: The liquid-cooling heat dissipation conduit (3) surrounds the periphery of at least one of the heating elements (2); or, the liquid-cooling heat dissipation conduit (3) extends in an S-shape and surrounds two adjacent heating elements in reverse.

12. The packaged circuit board according to claim 11, wherein: The liquid cooling heat dissipation pipe (3) is provided with a water inlet (31) and a water outlet (32), and the extension directions of the water inlet (31) and the water outlet (32) are both parallel to the surface of the first circuit board (1).

13. The packaged circuit board according to claim 12, wherein: The water inlet (31) and the water outlet (32) of the liquid cooling heat dissipation pipe (3) are arranged adjacent to each other.

14. The packaged circuit board according to any one of claims 1 to 10, characterized in that: The liquid-cooling heat dissipation pipe (3) is welded and fixed on the metal heat-conducting layer (11); or, the liquid-cooling heat dissipation pipe (3) and the metal heat-conducting layer (11) are connected via a heat-conducting adhesive, and the heat-conducting adhesive covers the hollow area (121).

15. The packaged circuit board according to any one of claims 1 to 10, characterized in that: The height of the liquid-cooling heat dissipation pipe (3) along the first direction is less than or equal to the height of the heating element (2) along the first direction, and the first direction is perpendicular to the surface of the first circuit board (1).

16. The packaged circuit board according to claim 15, wherein: The heating element (2) comprises a first electrical element and a second electrical element, wherein the height of the first electrical element along the first direction is greater than the height of the second electrical element along the first direction; a first liquid-cooling heat dissipation conduit is provided on at least one side of the first electrical element, and a second liquid-cooling heat dissipation conduit is provided on at least one side of the second electrical element; Furthermore, it also includes a metal cover plate (5), which is laid on the second electrical component and is in contact with the side wall of the second liquid-cooled heat dissipation pipe, and the sum of the heights of the metal cover plate (5) and the second electrical component along the first direction is equal to the height of the first electrical component along the first direction.

17. An electronic device comprising a packaged circuit board, characterized in that: The packaged circuit board is the packaged circuit board according to any one of claims 1 to 16.

18. A packaging circuit board design method, characterized in that: The following steps are involved: Determining a preset area for laying a metal heat-conducting layer (11) on the first circuit board (1) according to a wiring position in the heating element (2); Determining the opening positions of a plurality of first heat-conducting holes (13) in the overlapping area of the metal heat-conducting layer (11) and the first circuit board (1), and determining the opening positions of a plurality of second heat-conducting holes (14) at positions on the first circuit board (1) corresponding to the heating element (2); The laying position of the liquid cooling heat dissipation pipe (3) and the width of the liquid cooling heat dissipation pipe (3) are determined according to the heat dissipation requirements of the heating element (2), and the opening position of the hollow area (121) is determined in the area where the insulating protective layer (12) and the liquid cooling heat dissipation pipe (3) overlap.

19. The packaging circuit board design method according to claim 18, wherein: Determining the laying position of the liquid cooling heat dissipation pipe (3) and the width of the liquid cooling heat dissipation pipe (3) according to the heat dissipation requirements of the heating element (2) includes: Determining the width of the liquid cooling heat dissipation conduit (3) according to the power of the heating element (2); Furthermore, when the power of the heating element (2) is ≥1000W, the width of the liquid-cooling heat dissipation conduit (3) is determined to be 4.5-5.5mm; when the power of the heating element (2) is ≤1000W, the width of the liquid-cooling heat dissipation conduit (3) is determined to be 0.8-1.2mm.

20. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the packaged circuit board design method according to claim 18 or 19.

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