Manufacturing method for blind hole of packaging substrate

Abstract

The invention relates to the technical field of packaging substrate processing, and discloses a manufacturing method of a packaging substrate blind hole, which specifically comprises the following steps: providing a packaging substrate, and forming a resin material layer on the packaging substrate; providing a needle mold substrate, and forming a plurality of needle molds on the needle mold substrate; pressing the plurality of needle dies and the surface of the resin material layer so as to form a plurality of blind holes; and cleaning the blind holes in the resin material layer. According to the manufacturing method of the blind hole of the packaging substrate, the pin die matched with the blind hole in the packaging substrate is independently designed, and the pin die and the resin material layer are laminated to form the blind hole, so that the production efficiency can be effectively improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging substrate processing, and particularly to a method for manufacturing blind vias of a packaging substrate. Background Art

[0002] During the manufacturing process of a packaging substrate, it is necessary to perform blind via processing on the surface of a metal layer by attaching an organic resin material, so as to achieve communication between upper and lower metal layers. Blind via processing is a highly precise and time-sensitive manufacturing process. The diameter of the blind vias is in the micron range, and the number of blind vias is usually more than one million. Currently, laser drilling is used for blind via processing of packaging substrates. Since laser drilling is a single-hole process, when the number of blind vias to be processed reaches more than one million, the overall processing time usually takes more than half an hour, resulting in an increase in the overall manufacturing cost. If multiple laser processing devices are added to balance production capacity, it will also cause high upfront capital investment and have the problem of inconvenient maintenance.

[0003] Therefore, how to improve the processing efficiency of blind vias of packaging substrates and reduce production costs has become a key research topic in the industry. Summary of the Invention

[0004] The present invention aims to solve at least one problem in the background art. For this purpose, the present invention provides a method for manufacturing blind vias of a packaging substrate, which has high manufacturing efficiency and thus reduces the overall production cost.

[0005] A method for manufacturing blind vias of a packaging substrate according to an embodiment of the present invention specifically includes the steps of:

[0006] Provide a packaging substrate and form a resin material layer on the packaging substrate;

[0007] Provide a needle mold substrate and form a plurality of needle molds on the needle mold substrate;

[0008] Press a plurality of the needle molds against the surface of the resin material layer to form a plurality of blind vias;

[0009] Clean the blind vias on the resin material layer.

[0010] It can be seen that the present application can effectively improve production efficiency and reduce production costs by separately designing a needle mold matching the blind vias on the packaging substrate and forming blind vias by pressing the needle mold against the resin material layer.

[0011] According to another embodiment of the present invention, forming a plurality of needle molds on the needle mold substrate specifically includes:

[0012] Based on the required number and size of the blind vias, form a plurality of needle molds on the needle mold substrate by means of fine hole electrical discharge or chemical etching.

[0013] According to another embodiment of the present invention, the number of the needle dies is greater than or equal to 10,000.

[0014] According to another embodiment of the present invention, the total number of the needle dies is greater than or equal to the total number of the required blind holes, and the size of a single needle die is less than or equal to the size of the required blind hole.

[0015] According to another embodiment of the present invention, the resin material layer of the encapsulation substrate is divided into a plurality of sub-regions, and the number of the needle dies is greater than or equal to the number of the blind holes in a single sub-region.

[0016] According to another embodiment of the present invention, in a single sub-region, the number of the blind holes is greater than or equal to 10,000.

[0017] According to another embodiment of the present invention, wherein, pressing a plurality of the needle dies against the surface of the resin material layer to form a plurality of blind holes specifically includes:

[0018] Obtaining the thickness of the resin material layer, and setting the pressing force and pressing time of the needle die;

[0019] Based on the set pressing force and pressing time, pressing on the surface of the resin material layer to form a plurality of blind holes.

[0020] According to another embodiment of the present invention, when pressing on the surface of the resin material layer, the relative parallelism of the two planes of the surface of the encapsulation substrate and the bottom surface of the needle die needs to be controlled within 3 μm.

[0021] According to another embodiment of the present invention, wherein, cleaning the blind holes on the resin material layer specifically includes:

[0022] Based on the number and size of the blind holes formed on the resin material layer, setting the cleaning time;

[0023] Based on the set cleaning time, performing plasma cleaning on the blind holes on the surface of the resin material layer.

[0024] According to another embodiment of the present invention, the bottom material of the needle die is metal.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The present invention discloses a manufacturing method for blind vias of a packaging substrate, specifically including the steps of: providing a packaging substrate and forming a resin material layer on the packaging substrate; providing a needle mold substrate and forming a plurality of needle molds on the needle mold substrate; pressing the plurality of needle molds against the surface of the resin material layer to form a plurality of blind vias; and cleaning the blind vias on the resin material layer. The manufacturing method for blind vias of the packaging substrate in this application can effectively improve production efficiency and reduce production costs by separately designing needle molds that match the blind vias on the packaging substrate and forming blind vias through pressing the needle molds against the resin material layer.

[0027] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings are only used to illustrate the embodiments and are not considered as limitations to the present invention. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0029] Figure 1 is a schematic flowchart of an embodiment of the manufacturing method for blind vias of the packaging substrate provided in this application;

[0030] Figure 2 is a schematic flowchart of another embodiment of the manufacturing method for blind vias of the packaging substrate provided in this application;

[0031] Figure 3 is a schematic flowchart of yet another embodiment of the manufacturing method for blind vias of the packaging substrate provided in this application;

[0032] Figure 4 is a schematic flowchart of still another embodiment of the manufacturing method for blind vias of the packaging substrate provided in this application;

[0033] Figure 5 is a schematic diagram of the manufacturing process of an embodiment of the manufacturing method for blind vias of the packaging substrate provided in this application;

[0034] Figure 6 is another schematic diagram of the manufacturing process of an embodiment of the manufacturing method for blind vias of the packaging substrate provided in this application;

[0035] Figure 7 is yet another schematic diagram of the manufacturing process of an embodiment of the manufacturing method for blind vias of the packaging substrate provided in this application;

[0036] The meanings of the marks in the figures are as follows:

[0037] 100, packaging substrate; 110, resin material layer; 120, blind via;

[0038] 200, needle mold substrate; 210, needle mold. Detailed implementation manners

[0039] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0040] In the description of the present invention, it should be understood that the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly defined and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0042] To illustrate the manufacturing method of the blind vias of the package substrate provided by the present application, the following will be elaborated in detail in conjunction with the description of the accompanying drawings of the specification and the embodiments.

[0043] The following refers to Figures 1-7 Describe a manufacturing method of blind vias of a package substrate according to an embodiment of the present invention, as Figure 1 shown, which specifically includes the steps:

[0044] Step S100: Provide a package substrate 100, and form a resin material layer 110 on the package substrate 100;

[0045] Specifically, the package substrate 100 may include a metal layer, and a resin material layer 110 is attached to the surface of the metal layer, so as to fabricate blind vias 120 on the resin material layer 110. Specifically, the resin material layer 110 may be a BT resin, that is, a thermosetting resin. It can be understood that the resin material layer 110 may also be other resin materials that meet the requirements.

[0046] Step S200: Provide a needle die substrate 200, and form a plurality of needle dies 210 on the needle die substrate 200;

[0047] Specifically, multiple needle dies 210 are produced on the needle die substrate 200. Specifically, the multiple needle dies 210 can have the same size and dimensions, and at the same time, there is the same distance between the multiple needle dies 210, so that there is an effect of uniform distribution between the multiple needle dies 210, to meet the same size and shape of the multiple blind holes 120 formed subsequently, and the multiple blind holes 120 are evenly arranged.

[0048] Step S300: Press the multiple needle dies 210 against the surface of the resin material layer 110 to form multiple blind holes 120;

[0049] Specifically, according to the requirements of the desired blind holes 120 and the thickness of the resin material layer 110, corresponding pressing conditions such as pressure and time are selected.

[0050] Step S400: Clean the blind holes 120 on the resin material layer 110.

[0051] Specifically, by cleaning the inside of the blind holes 120 that have been formed on the resin material layer 110, the excess material remaining inside the blind holes 120 is cleaned up.

[0052] According to an embodiment of the present invention, as Figure 2 shown, wherein, in step S200: forming multiple needle dies 210 on the needle die substrate 200, specifically includes:

[0053] Step S210: Based on the required number and size of the blind holes 120, multiple needle dies 210 are formed on the needle die substrate 200 by means of micro-hole electrical discharge or chemical etching.

[0054] Specifically, due to different usage scenarios, the number and shape of the blind holes 120 required to be formed on the packaging substrate 100 are different. Therefore, it is necessary to design the number and size of the needle dies 210 according to specific requirements, and at the same time, generate the needle dies 210 by means of micro-hole electrical discharge or chemical etching.

[0055] According to an embodiment of the present invention, as Figures 5-7 shown, the number of the needle dies 210 is greater than or equal to 10,000. It can be understood that controlling the number of the needle dies 210 at the ten-thousand level can realize the generation of multiple blind holes 120 in one hole-forming, thereby improving the overall production efficiency. At the same time, since it is avoided that the number of the needle dies 210 is too large, resulting in too large overall dimensions of the needle die substrate 200 and the needle dies 210, the number of the needle dies 210 should preferably be 10,000 to 1,000,000.

[0056] According to an embodiment of the present invention, as Figures 5-7As shown, the total number of the needle dies 210 is greater than or equal to the total number of the required blind holes 120, and the size of a single needle die 210 is less than or equal to the size of the required blind hole 120. It can be understood that when the resin material layer 110 is an integral layer, the total number of the needle dies 210 being greater than or equal to the total number of the required blind holes 120 can enable all the blind holes 120 to be formed in one pressing, thereby improving the overall production efficiency.

[0057] According to an embodiment of the present invention, the resin material layer 110 of the encapsulation substrate 100 is divided into multiple sub-regions, and the number of the needle dies 210 is greater than or equal to the number of the blind holes 120 in a single sub-region. It can be understood that in order to avoid poor formation of some of the blind holes 120 when the blind holes 120 are formed at one time, the resin material layer 110 can be divided into multiple sub-regions. Specifically, the multiple sub-regions can have the same area size, so that the same processing method can be adopted for the multiple regions. Preferably, each sub-region is a square, and the side length of the square is 100 mm. It can be understood that setting each sub-region as a regular square can make the processing more convenient and the distribution on the entire surface of the encapsulation substrate 100 more uniform.

[0058] According to an embodiment of the present invention, in a single sub-region, the number of the blind holes 120 is greater than or equal to 10,000. It can be understood that the area and shape of a single sub-region can be set as a square region of 100 mm×100 mm. At this time, the number of the blind holes 120 in a single sub-region can be set between 10,000 and 1,000,000, so as to take into account the overall number of the blind holes 120 and the distance between the blind holes 120, and avoid the distance between the blind holes 120 being too small due to too many blind holes 120.

[0059] According to an embodiment of the present invention, as Figure 3 shown, wherein, step S300: pressing a plurality of needle dies 210 against the surface of the resin material layer 110 to form a plurality of blind holes 120, specifically including:

[0060] Step S310: obtaining the thickness of the resin material layer 110, and setting the pressing force and pressing time of the needle die 210;

[0061] Specifically, according to the different thicknesses of the resin material layer 110, the corresponding pressing force and pressing time need to be set, so as to avoid the resin material layer 110 being penetrated by the needle die 210 due to too large a pressing force or too long a pressing time, thereby piercing the metal layer of the encapsulation substrate 100.

[0062] Step S320: based on the set pressing force and pressing time, perform pressing on the surface of the resin material layer 110 to form a plurality of blind holes 120.

[0063] According to an embodiment of the present invention, as Figures 5-7 shown, when laminating on the surface of the resin material layer 110, the relative parallelism of the two planes of the surface of the encapsulation substrate 100 and the surface of the needle die substrate 200 needs to be controlled within 3 μm. It can be understood that limiting the relative parallelism of the two planes within 3 μm makes the depths of the generated multiple blind holes 120 as consistent as possible.

[0064] According to an embodiment of the present invention, as Figure 4 shown, wherein, step S400: cleaning the blind holes 120 on the resin material layer 110, specifically including:

[0065] Step S410: setting the cleaning time based on the number and size of the blind holes 120 formed on the resin material layer 110;

[0066] Step S420: performing plasma cleaning on the blind holes 120 on the surface of the resin material layer 110 based on the set cleaning time.

[0067] Specifically, plasma cleaning is to ionize CF4, N2, Ar, O2 or other gases to form an electric spark jet on the surface of the resin material layer 110 to remove the powder inside the blind holes 120 pierced by the needle die 210. Specifically, the specific composition of the gas, equipment power, temperature, time and other parameters can be adjusted according to the number and size of the blind holes 120.

[0068] According to an embodiment of the present invention, as Figures 5-7 shown, the needle die substrate 200 is a metal. Specifically, the needle die substrate 200 can be a steel material with relatively high hardness, so that the needle die 210 still has corresponding strength after working multiple times, increasing the overall service life.

[0069] The above manufacturing method of the blind holes of the encapsulation substrate provided by this application is a preferred embodiment, and it should not be construed as a limitation on the scope of the rights protected by this application. Those skilled in the art should know that without departing from the concept of this application, various improvements or replacements can be made, and all improvements or replacements should be within the scope of the rights protected by this application, that is, the scope of the rights protected by this application should be subject to the claims.

[0070] Without conflict, the above embodiments and the features in the embodiments in this article can be combined with each other.

Claims

1. A manufacturing method for blind vias of a packaging substrate, characterized in that, Comprising: Providing a packaging substrate and forming a resin material layer on the packaging substrate; Providing a needle die substrate and forming a plurality of needle dies on the needle die substrate; Pressing a plurality of the needle dies against the surface of the resin material layer to form a plurality of blind holes; Cleaning the blind holes on the resin material layer.

2. The manufacturing method of blind vias of the encapsulated substrate according to claim 1, wherein, Wherein, Forming a plurality of needle dies on the needle die substrate specifically includes: Based on the required number and size of the blind holes, forming a plurality of needle dies on the needle die substrate by means of fine hole discharge or chemical etching.

3. The manufacturing method of the blind via of the packaging substrate according to claim 2, wherein The number of the needle dies is greater than or equal to 10,000.

4. The manufacturing method of blind vias of a packaging substrate according to claim 3, wherein The total number of the needle dies is greater than or equal to the total number of the required blind holes, and the size of a single needle die is less than or equal to the size of the required blind hole.

5. The manufacturing method of the blind hole of the encapsulation substrate according to claim 3, wherein The resin material layer of the packaging substrate is divided into a plurality of sub-regions, and the number of the needle dies is greater than or equal to the number of the blind holes in a single sub-region.

6. The manufacturing method of blind vias of the encapsulation substrate according to claim 5, wherein, In a single sub-region, the number of the blind holes is greater than or equal to 10,000.

7. The manufacturing method of blind vias of a packaging substrate as described in claim 1, wherein Wherein, Pressing a plurality of the needle dies against the surface of the resin material layer to form a plurality of blind holes specifically includes: Obtaining the thickness of the resin material layer and setting the pressing force and pressing time of the needle dies; Based on the set pressing force and pressing time, pressing on the surface of the resin material layer to form a plurality of blind holes.

8. The manufacturing method of the blind hole of the encapsulated substrate according to claim 7, characterized in that, When pressing on the surface of the resin material layer, the relative parallelism of the two planes of the surface of the packaging substrate and the surface of the needle die substrate needs to be controlled within 3 μm.

9. The manufacturing method of the blind hole of the encapsulation substrate according to claim 1, wherein, Wherein, Cleaning the blind holes on the resin material layer specifically includes: Based on the number and size of the blind holes formed on the resin material layer, setting the cleaning time; Based on the set cleaning time, performing plasma cleaning on the blind holes on the surface of the resin material layer.

10. The manufacturing method of the blind hole of the encapsulation substrate according to claim 1, characterized in that, The needle die substrate is metal.

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