Method and device for determining heat dissipation parameters of equipment

Abstract

The invention discloses a method and a device for determining heat dissipation parameters of equipment. The method comprises the following steps: acquiring multi-dimensional classification types corresponding to a plurality of parts included in a target chassis; sub-temperature margin values corresponding to the multiple multi-dimensional classification types are determined according to margin temperature determination modes corresponding to the multiple multi-dimensional classification types and margin temperature values corresponding to components included in the multiple multi-dimensional classification types; determining a target temperature margin value according to the plurality of sub-temperature margin values; and according to the target temperature allowance value, a heat dissipation parameter corresponding to target equipment is determined, and the target equipment is used for dissipating heat of the target machine disc. According to the method and the device, the technical problem that the heat dissipation parameters cannot be conveniently and quickly determined to control the target equipment to effectively dissipate heat due to the complexity of differentiated heat dissipation requirements of a plurality of parts in a machine plate in the related technology is solved.

Description

Technical Field

[0001] The present invention relates to the field of data processing, and in particular to a method and device for determining heat dissipation parameters of a device. Background Art

[0002] In the related technology, most devices use active cooling with fans. However, due to the different disk models in some devices, the disk combination is complex, and different disks are equipped with a large number of different components. Due to the differences in the heat dissipation requirements of multiple components in the disk, it is necessary to formulate multiple heat dissipation methods in a targeted manner, but it is difficult to formulate effective heat dissipation strategies for the corresponding heat dissipation methods. There is a technical problem that the heat dissipation parameters cannot be determined conveniently and quickly to control the effective heat dissipation of the device.

[0003] To address the above-mentioned problems, no effective solution has been proposed yet. Summary of the invention

[0004] An embodiment of the present invention provides a method and apparatus for determining the heat dissipation parameters of a device, so as to at least solve the technical problem in the related art that, due to the complexity of the differentiated heat dissipation requirements of multiple components in a computer disk, it is impossible to conveniently and quickly determine the heat dissipation parameters to control the target device for effective heat dissipation.

[0005] According to one aspect of an embodiment of the present invention, a method for determining heat dissipation parameters of a device is provided, comprising: obtaining multi-dimensional classification types corresponding to a plurality of components included in a target disk, wherein the corresponding multi-dimensional classification types are obtained according to the types to which the corresponding components belong under a plurality of classification items; determining sub-temperature margin values ​​corresponding to the plurality of multi-dimensional classification types according to margin temperature determination methods corresponding to the plurality of multi-dimensional classification types, and margin temperature values ​​corresponding to the components included under the plurality of multi-dimensional classification types; determining a target temperature margin value according to the plurality of sub-temperature margin values; and determining a heat dissipation parameter corresponding to a target device according to the target temperature margin value, wherein the target device is used to dissipate heat for the target disk.

[0006] Optionally, before obtaining the multi-dimensional classification types respectively corresponding to the multiple components included in the target disk, it also includes: determining the multiple classification items, wherein the multiple classification items at least include: temperature tolerance classification items, sensitivity classification items, and the sensitivity classification items are represented as classification items classified based on the sensitivity to heat dissipation parameters; determining the multiple types respectively corresponding to the multiple classification items; combining the multiple types respectively corresponding to the multiple classification items to obtain a plurality of predetermined classification types, wherein the plurality of predetermined classification types include the plurality of multi-dimensional classification types.

[0007] Optionally, determining the heat dissipation parameters corresponding to the target device according to the target temperature margin value includes: determining a parameter adjustment strategy line corresponding to the target device and a disk operating condition line corresponding to the target disk; determining the heat dissipation parameters corresponding to the target device according to the target temperature margin value, the parameter adjustment strategy line, and the disk operating condition line.

[0008] Optionally, determining the parameter adjustment strategy line corresponding to the target device includes: obtaining the ambient temperature fluctuation range and the temperature rise fluctuation range corresponding to the target disk; determining the target device type of the target disk according to the ambient temperature fluctuation range and the temperature rise fluctuation range; and determining the parameter adjustment strategy line corresponding to the target device according to the target device type.

[0009] Optionally, determining the parameter adjustment strategy line corresponding to the target device according to the target device type includes: when the target device type is an environment-sensitive device, determining that the parameter adjustment strategy line corresponding to the target device is an inverse proportional curve; and / or when the target device type is a power consumption-sensitive device, determining that the parameter adjustment strategy line corresponding to the target device is a straight line with a negative slope.

[0010] Optionally, determining multiple heat dissipation parameters for step-by-step adjustment corresponding to the target disk according to the target temperature margin value, the parameter adjustment strategy line, and the disk operating condition line includes: when the heat dissipation parameter includes a heat dissipation balance point, determining the heat dissipation balance point according to the parameter adjustment strategy line and the disk operating condition line, so that the target device reaches the rotation speed corresponding to the heat dissipation balance point, and controlling the margin value corresponding to the target disk to be at the margin temperature value corresponding to the heat dissipation balance point.

[0011] Optionally, obtaining the multi-dimensional classification types corresponding to multiple components included in the target disk includes: obtaining the component parameters corresponding to multiple components included in the target disk; and determining the multi-dimensional classification types corresponding to the multiple components according to the component parameters corresponding to the multiple components.

[0012] According to another aspect of the present invention, there is provided a device heat dissipation parameter determination device, including: an acquisition module, configured to acquire multi-dimensional classification types respectively corresponding to a plurality of components included in a target disk, wherein the corresponding multi-dimensional classification types are obtained based on the respective types to which the corresponding components belong under a plurality of classification items; a first determination module, configured to determine sub-temperature margin values respectively corresponding to the plurality of multi-dimensional classification types according to the margin temperature determination methods respectively corresponding to the plurality of multi-dimensional classification types and the margin temperature values of the components included under the plurality of multi-dimensional classification types; a second determination module, configured to determine a target temperature margin value according to the plurality of sub-temperature margin values; a third determination module, configured to determine a heat dissipation parameter corresponding to a target device according to the target temperature margin value, wherein the target device is used to dissipate heat for the target disk.

[0013] According to another aspect of the present invention, there is provided a computer-readable storage medium, the computer-readable storage medium including a stored executable program, wherein when the executable program runs, it controls the device where the computer-readable storage medium is located to execute the device heat dissipation parameter determination method described in any one of the above.

[0014] According to another aspect of the present invention, there is provided an electronic device, including: a memory storing an executable program; a processor configured to run the program, wherein when the program runs, it executes the device heat dissipation parameter determination method described in any one of the above.

[0015] According to another aspect of the present invention, there is provided a computer program product, including a computer program, and when the computer program is executed by a processor, it implements the steps of the method described in any one of the above.

[0016] In an embodiment of the present invention, through the above steps, multi-dimensional classification types corresponding to multiple components included in a target disk are obtained, where the corresponding multi-dimensional classification types are obtained based on the types to which the corresponding components belong respectively under multiple classification items; according to the remaining temperature determination methods corresponding to the multiple multi-dimensional classification types and the remaining temperature values corresponding to the components included under the multiple multi-dimensional classification types, sub-remaining temperature values corresponding to the multiple multi-dimensional classification types are determined; according to the multiple sub-remaining temperature values, a target remaining temperature value is determined; according to the target remaining temperature value, heat dissipation parameters corresponding to a target device are determined, where the target device is used to dissipate heat from the target disk. By obtaining the multi-dimensional classification types corresponding to multiple components included in the target disk, the process of determining the heat dissipation parameters is simplified. That is, in this way, the models and specifications of the disk and components are not restricted. The multiple components are classified according to multiple classification items to determine the multi-dimensional classification types corresponding to the multiple components respectively, and then according to the remaining temperature determination methods corresponding to the multiple multi-dimensional classification types, the sub-remaining temperature values corresponding to the multiple multi-dimensional classification types are determined. It not only improves the compatibility with various disk and chip combinations, but also does not need to determine the temperature and heat resistance of different components. Only by classifying and dividing to determine the corresponding multi-dimensional classification types can the corresponding remaining temperature determination methods be adaptively selected to determine the sub-remaining temperature values corresponding to the classification types, so as to conveniently and quickly determine multiple sub-remaining temperature values. Moreover, through this method, the heat dissipation characteristics of the components under each classification can be fully considered, which not only simplifies the process of determining the remaining temperature values, but also ensures the accuracy of determining the remaining temperature values, and then conveniently and quickly determines the heat dissipation parameters corresponding to the target device, and uses the heat dissipation parameters to control the target device to dissipate heat from the target disk, ensuring that the target disk can maintain within the optimal working temperature range under various working conditions, and thus solving the technical problem in the related art that due to the complexity of the different heat dissipation requirements of multiple components in the disk, it is impossible to conveniently and quickly determine the heat dissipation parameters to control the target device for effective heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0018] Figure 1 is a flowchart of a method for determining heat dissipation parameters of a device according to an embodiment of the present invention;

[0019] Figure 2 is a schematic diagram of a speed regulation strategy line in an alternative embodiment of the present invention;

[0020] Figure 3 is a schematic diagram of a board card working condition line in an alternative embodiment of the present invention;

[0021] Figure 4 It is a schematic diagram for confirming the heat dissipation balance point in an alternative embodiment of the present invention;

[0022] Figure 5 It is a schematic diagram for confirming the heat dissipation balance point based on the ambient temperature in an alternative embodiment of the present invention;

[0023] Figure 6 It is a relationship diagram between the target device type and the temperature margin in an alternative embodiment of the present invention;

[0024] Figure 7 It is a schematic diagram of multi-dimensional classification types in an alternative embodiment of the present invention;

[0025] Figure 8 It is a structural block diagram of a device for determining heat dissipation parameters of the device according to an embodiment of the present invention. Specific embodiments

[0026] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0028] First, some nouns or terms that appear in the process of describing the embodiments of the present application are applicable to the following explanations:

[0029] Black box model: The black box model is a model that regards the system as a closed and opaque box, only focusing on the input and output, and not caring about the internal structure and working principle of the system.

[0030] White-box model: The white-box model treats the system as a transparent box, emphasizing an in-depth understanding of the internal structure and working principle of the system.

[0031] Embodiment 1

[0032] According to an embodiment of the present invention, an embodiment of a method for determining heat dissipation parameters of a device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than here.

[0033] Figure 1 is a flowchart of the method for determining heat dissipation parameters of the device according to an embodiment of the present invention. As Figure 1 shown, the method includes the following steps:

[0034] S102, obtaining multi-dimensional classification types respectively corresponding to multiple components included in the target chassis, where the corresponding multi-dimensional classification types are obtained based on the respective types to which the corresponding components belong under multiple classification items;

[0035] In step S102 provided in the present application, the multi-dimensional classification types respectively corresponding to multiple components included in the target chassis are obtained.

[0036] Among them, the target chassis is involved. The target chassis is a specific chassis that needs to be temperature-controlled in the chassis device. For example, in an optical network device, the target chassis can be a circuit board card including active optical components (such as lasers), processing chips, and storage components. The target chassis can be of multiple types, such as service board cards, cross-connection board cards, power supply board cards, etc.

[0037] Among them, components are involved. The components are each constituent unit on the target chassis, and can be chips, modules, connectors, heat sinks, or any other hardware unit that helps to implement the functions of the chassis. For example, the components can include a processor (CPU), a network switching chip (SWITCH), a dynamic random access memory (DDR), a flash memory (Flash), a complex programmable logic device (CPLD), a microcontroller (MCU), and an optical module, etc.

[0038] Among them, the multi-dimensional classification types are involved. The multi-dimensional classification types are types used to classify multiple components included in the target chassis respectively, and the multi-dimensional classification types are not simply based on a single standard, but are based on multiple different classification attributes. For example, the components can be classified according to multiple dimensions such as their heat resistance, temperature sensitivity, heat generation, whether they include heat sinks, and whether they are externally inserted devices.

[0039] Among them, a classification item is involved. This classification item is determined according to the specific temperature-related attributes of multiple components included in the target chassis and is used for classification. For example, temperature sensitivity can be a classification item, where components are marked as "highly sensitive" or "lowly sensitive"; heat generation can also be another classification item, and components are classified as "high power consumption" or "low power consumption".

[0040] In addition, this classification item can also be determined by a predetermined classification threshold. The classification threshold can be one or multiple. When there are multiple predetermined classification thresholds, the corresponding classification item can be divided into multiple categories.

[0041] In this step, multi-dimensional classification types corresponding to multiple components included in the target chassis are obtained, where the corresponding multi-dimensional classification types are obtained based on the respective types to which the corresponding components belong under multiple classification items.

[0042] By obtaining the multi-dimensional classification types corresponding to multiple components included in the target chassis, it helps to more comprehensively understand the characteristics of the components, thereby helping to more comprehensively evaluate the heat dissipation requirements, and identifying which components are the key to heat dissipation control, and further helping to solve the problem in the related technology that effective heat dissipation control cannot be carried out for the complex components in the chassis.

[0043] In addition, the classification type of the component can be dynamically adjusted according to dynamic conditions such as the real-time power consumption, workload, and environmental humidity of the chassis, so that the heat dissipation strategy can better adapt to the current working environment and operating state. By introducing machine learning algorithms to learn the temperature behavior of components under different working conditions, the multi-dimensional classification and heat dissipation strategy can be further optimized to achieve automatic and adaptive heat dissipation control.

[0044] S104. Determine the sub-temperature margin values corresponding to multiple multi-dimensional classification types according to the margin temperature determination methods corresponding to multiple multi-dimensional classification types and the margin temperature values of the components included under multiple multi-dimensional classification types;

[0045] In step S104 provided in this application, the sub-temperature margin values corresponding to multiple multi-dimensional classification types are determined.

[0046] Among them, a method for determining the margin temperature is involved. This method for determining the margin temperature is a method for determining the difference between the upper limit value of the temperature that a component can withstand and the current temperature value of the component. This method for determining the margin temperature can be a method for determining the margin temperature value by obtaining the internal temperature value of the component and then subtracting the upper limit value of the internal temperature of the component, or a method for determining the margin temperature value by measuring the external temperature value of the component and then subtracting the upper limit value of the external temperature of the component. When the method for determining the margin temperature by measuring the external temperature value of the component and then subtracting the upper limit value of the external temperature of the component is adopted, the target disk can be regarded as being black-boxed at this time. Only by obtaining the corresponding external temperature value can the corresponding margin temperature value be determined, without the need to deeply understand the internal structure and heat conduction path of the component. Even when the component is updated or the configuration changes, the margin temperature value can be determined based on the external temperature measurement, thus simplifying the process of determining the margin temperature value and reducing the complexity of data processing.

[0047] Among them, a margin temperature value is involved. This margin temperature value is the difference between the current temperature value of the component and the upper limit value of the component temperature. For example, if the upper limit value of the external temperature of a CPU is 110°C and the current external temperature value of the CPU is 90°C, then the margin temperature value of the CPU is 20°C.

[0048] Among them, a sub-temperature margin value is involved. This sub-temperature margin value is determined based on the methods for determining the margin temperature corresponding to multiple multi-dimensional classification types and the margin temperature values of the corresponding components, and is the temperature margin value corresponding to each multi-dimensional classification type. This sub-temperature margin value can reflect the safe temperature margin of the corresponding component under the corresponding multi-dimensional classification type.

[0049] By determining the sub-temperature margin values corresponding to multiple multi-dimensional classification types respectively based on the methods for determining the margin temperature corresponding to multiple multi-dimensional classification types and the margin temperature values of the components included under multiple multi-dimensional classification types, it is ensured that each part of the disk operates within a safe temperature range, thereby realizing the heat dissipation control of different components in the disk, ensuring that each component can operate stably within a safe temperature range, and further helping to solve the problem in the related technology that effective heat dissipation control cannot be carried out for the complex components in the disk.

[0050] In addition to the temperature margin value, other factors can be further considered, such as the power consumption change of the component, the operating mode, the ambient temperature fluctuation, and the aging degree of the component, to comprehensively evaluate the heat dissipation requirements of each component. For example, the real-time power consumption of the component can be monitored. For a component in a high-power state, even if its current sub-temperature margin value is relatively high, its possible future heat demand can be predicted, and the parameters of the target device can be increased in advance to cope with the potential overheating risk.

[0051] S106. Determine a target temperature margin value based on multiple sub-temperature margin values;

[0052] In step S106 provided in this application, the target temperature margin value is determined.

[0053] Among them, the target temperature margin value is involved. The target temperature margin value is the sub-temperature margin value corresponding to the component that needs heat dissipation treatment.

[0054] By determining the target temperature margin value, the components with overheating risk in the target chassis can be accurately identified, so as to ensure that the heat dissipation requirements of this component can be preferentially addressed during subsequent heat dissipation treatment, which helps to effectively solve the problem in the related technology that it is impossible to effectively control the heat dissipation of complex components in the chassis.

[0055] S108. Determine the heat dissipation parameters corresponding to the target device based on the target temperature margin value, where the target device is used to dissipate heat from the target chassis.

[0056] In step S108 provided in this application, the heat dissipation parameters corresponding to the target device are determined.

[0057] Among them, the target device is involved. The target device is a device that can reduce the temperature of the components corresponding to the target chassis. For example, fans, heat sinks, heat pipes, water cooling systems, etc. Among them, by installing a fan inside the frame device, the heat generated by the components can be taken away by increasing the air flow rate, so as to achieve the purpose of heat dissipation.

[0058] Among them, the heat dissipation parameters are involved. The heat dissipation parameters are the parameters corresponding to the target device and used to control the operating state of the target device. For example, when the target device is a fan, the heat dissipation parameter can be the fan speed. By adjusting the fan speed, the heat dissipation degree of the fan can be controlled.

[0059] In addition, when the target device is a fan, the heat dissipation parameter can include the rotation speed percentage of the fan (such as 50%, 80%, 100%), the pulse width modulation (PWM) control signal of the fan, and the operating mode of the fan (such as automatic, silent, full speed), etc. Among multiple fans, the heat dissipation parameter can also include the coordinated control parameters of different fans or fan groups.

[0060] By determining the heat dissipation parameters corresponding to the target device according to the target temperature margin value, and controlling the target device to dissipate heat from the target disk according to the heat dissipation parameters, it effectively avoids the problem that the target device cannot respond to temperature changes in real time, which may lead to insufficient heat dissipation or overcooling. At the same time, through the target temperature margin value, the heat dissipation requirements of the target disk can be understood, and while comprehensively considering the heat dissipation characteristics of multiple components, the corresponding heat dissipation parameters can be quickly and accurately determined, and then the target device can be controlled to dissipate heat effectively.

[0061] In addition, the function of predicting the temperature change trend can be added by monitoring the operating state of the disk and the external environmental conditions, so that the heat dissipation parameters can be adjusted in advance according to the prediction results, and thus the preventive management of the disk heat dissipation can be effectively realized.

[0062] As an optional embodiment, the execution subject of the method in this embodiment can be a terminal or a server for determining the heat dissipation parameters of the device. For example, when applied to a terminal used to determine the heat dissipation parameters of the device, when applied to the terminal, it can be a device with independent computing and control capabilities, such as a dedicated heat dissipation management terminal, an embedded control unit or a hardware module. Another example is that when applied to a server, the rich computing resources of the server can be called, or a relatively larger and more accurate heat dissipation parameter determination model of the device can be used, and then the heat dissipation parameters of the target device can be determined more accurately. The execution subject is responsible for collecting, analyzing and processing the temperature information of the target disk, determining the sub-temperature margin value based on the multi-dimensional classification type, comprehensively calculating the target temperature margin value, and dynamically adjusting the heat dissipation parameters of the target device (such as the fan system) based on this value to achieve accurate control of the heat dissipation of the target device.

[0063] It should be noted that the types of the above terminals can be various. For example, it can be a mobile terminal with certain computing capabilities, or a fixed computer device with recognition capabilities, etc. The types of the above servers can also be various. For example, it can be a local server or a virtual cloud server. The server can be a single computer device according to its computing power, or a computer cluster integrated by multiple computer devices.

[0064] Through the above steps, multi-dimensional classification types corresponding to multiple components included in the target disk are obtained, where the corresponding multi-dimensional classification types are obtained based on the types to which the corresponding components respectively belong under multiple classification items; based on the remaining temperature determination methods respectively corresponding to the multiple multi-dimensional classification types, and the remaining temperature values corresponding to the components included under the multiple multi-dimensional classification types, sub-temperature remaining values respectively corresponding to the multiple multi-dimensional classification types are determined; based on the multiple sub-temperature remaining values, a target temperature remaining value is determined; based on the target temperature remaining value, heat dissipation parameters corresponding to the target device are determined, where the target device is used to dissipate heat from the target disk. By obtaining the multi-dimensional classification types corresponding to multiple components included in the target disk, the process of determining the heat dissipation parameters is simplified. That is, in this way, the models and specifications of the disk and components are not restricted. The multiple components are classified according to multiple classification items to determine the multi-dimensional classification types respectively corresponding to the multiple components, and then based on the remaining temperature determination methods respectively corresponding to the multiple multi-dimensional classification types, the sub-temperature remaining values respectively corresponding to the multiple multi-dimensional classification types can be determined. It not only improves the compatibility with various disk and chip combinations, but also does not need to determine the temperature and heat resistance of different components. Only by classifying and dividing to determine the corresponding multi-dimensional classification types can the corresponding remaining temperature determination method be adaptively selected to determine the sub-temperature remaining value corresponding to this classification type, thereby conveniently and quickly determining multiple sub-temperature remaining values. Moreover, through this method, the heat dissipation characteristics of the components under each classification can be fully considered, which not only simplifies the process of determining the remaining temperature value, but also ensures the accuracy of determining the remaining temperature value, and then conveniently and quickly determines the heat dissipation parameters corresponding to the target device, and uses the heat dissipation parameters to control the target device to dissipate heat from the target disk, ensuring that the target disk can maintain within the optimal working temperature range under various working conditions, and thus solving the technical problem in the related art that due to the complexity of the different heat dissipation requirements of multiple components in the disk, it is impossible to conveniently and quickly determine the heat dissipation parameters to control the target device for effective heat dissipation.

[0065] As an optional embodiment, before obtaining the multi-dimensional classification types corresponding to multiple components included in the target disk, it further includes: determining multiple classification items, where the multiple classification items at least include: a temperature tolerance classification item, a sensitivity classification item, and the sensitivity classification item is a classification item classified based on the sensitivity to the heat dissipation parameters; determining multiple types respectively corresponding to the multiple classification items; combining the multiple types respectively corresponding to the multiple classification items to obtain multiple predetermined classification types, where the multiple predetermined classification types include multiple multi-dimensional classification types.

[0066] In this embodiment, the specific steps before obtaining the multi-dimensional classification types corresponding to multiple components included in the target disk are described.

[0067] Among them, a temperature tolerance classification item is involved. This temperature tolerance classification item is a classification based on the upper working temperature limit or heat resistance that each of the multiple components included in the target circuit board can withstand respectively. Each component has its specific temperature upper limit, which should not be exceeded under normal working conditions to avoid performance degradation or damage. For example, the components can be classified into three categories: "high heat resistance", "medium heat resistance", and "low heat resistance". Among them, optical modules can be classified into the "low heat resistance" category because they are sensitive to temperature, while microcontroller (MCU) chips can be classified into the "high heat resistance" category because they have a higher temperature upper limit and relatively lower requirements for wind speed and heat dissipation.

[0068] Among them, a sensitivity classification item is involved. This sensitivity classification item is a classification based on the sensitivity of each of the multiple components included in the target circuit board to heat dissipation parameters (such as fan speed). For example, the components can be classified into two categories: "high sensitivity" and "low sensitivity". In the case where the target device is a fan, the corresponding heat dissipation parameter can be the fan speed. Accordingly, for the main chip CPU and switch chip, their temperatures are greatly affected by the wind speed, so they have a high sensitivity to heat dissipation parameters; while some components far from the heat source or with low heat dissipation requirements, such as complex programmable (CPLD) logic devices and MCU chips, have a small response to wind speed changes and belong to the "low sensitivity" category.

[0069] Among them, a predetermined classification type is involved. This predetermined classification type is pre-determined based on multiple classification items (such as the temperature tolerance classification item and the sensitivity classification item) and is used to classify and combine the multiple components included in the target circuit board. The predetermined classification type divides them into different groups by comprehensively considering various characteristics of different components, and each group has its specific heat dissipation requirements and control strategies. For example, according to the temperature tolerance and heat dissipation sensitivity of each of the multiple components included in the target circuit board, four predetermined classification types, namely "high heat resistance / high sensitivity", "high heat resistance / low sensitivity", "low heat resistance / high sensitivity", and "low heat resistance / low sensitivity", can be defined and represented by a four-quadrant coordinate system. Among them, "high heat resistance / high sensitivity", "high heat resistance / low sensitivity", "low heat resistance / low sensitivity", and "low heat resistance / high sensitivity" correspond to the first, second, third, and fourth quadrants respectively.

[0070] In the steps involved in this embodiment, before obtaining the multi-dimensional classification types corresponding to each of the multiple components included in the target circuit board, multiple classification items are first determined, such as the temperature tolerance classification item and the sensitivity classification item. The sensitivity classification item is a classification item classified based on the sensitivity to heat dissipation parameters, and corresponding multiple types are determined for each classification item. Then, by combining different types of these classification items, predetermined classification types are obtained, among which the multiple predetermined classification types include multiple multi-dimensional classification types.

[0071] By determining multiple classification items, where the multiple classification items at least include: a temperature tolerance classification item and a sensitivity classification item, the thermal characteristics of different components in the target chassis can be accurately determined. And by determining multiple types corresponding to the multiple classification items respectively and combining the multiple types corresponding to the multiple classification items respectively, multiple predetermined classification types including multiple multi-dimensional classification types are obtained, which helps to more comprehensively understand the heat dissipation requirements of each component, thereby helping to solve the technical problem that due to the different heat dissipation requirements of components, the target device cannot be accurately controlled for effective heat dissipation.

[0072] In addition, in addition to the above-mentioned temperature tolerance classification item and sensitivity classification item, other classification items can also be introduced, such as the physical location of the component (close to or far from the heat source), the heat conduction efficiency (such as whether it has a heat sink), the power consumption level of the component (high, medium, low power consumption), etc. By increasing the classification dimensions, the heat dissipation requirements of each component can be more comprehensively evaluated, and a more refined and intelligent heat dissipation control strategy can be formulated.

[0073] As an alternative embodiment, according to the target temperature margin value, the heat dissipation parameters corresponding to the target device are determined, including: determining the parameter adjustment strategy line corresponding to the target device and the chassis operating condition line corresponding to the target chassis; according to the target temperature margin value, the parameter adjustment strategy line and the chassis operating condition line, the heat dissipation parameters corresponding to the target device are determined.

[0074] In this embodiment, the specific steps of determining the heat dissipation parameters corresponding to the target device according to the target temperature margin value are described.

[0075] Among them, the parameter adjustment strategy line is involved. The parameter adjustment strategy line is a relationship line used to reflect the corresponding relationship between the temperature margin value and the corresponding heat dissipation parameters. The parameter adjustment strategy line reflects the heat dissipation parameter values to which the target device should be adjusted under different temperature margins to achieve the best heat dissipation effect. For example, the temperature margin value corresponding to the parameter adjustment strategy line is represented on the horizontal axis, and the heat dissipation parameters of the target device are represented on the vertical axis.

[0076] Among them, the chassis operating condition line is involved. The chassis operating condition line is a relationship line between the temperature margin value of the current chassis and the corresponding heat dissipation parameters under specific operating conditions of the chassis. The chassis operating condition line reflects the actual heat dissipation effect of the chassis under different heat dissipation parameter settings, that is, how the parameter changes of the target device affect the temperature margin of the chassis components under given environmental temperature, workload and other conditions.

[0077] In the steps involved in this embodiment, in the process of determining the heat dissipation parameters of the target device based on the target temperature margin value, first, the parameter adjustment strategy line corresponding to the target device and the disk operating condition line corresponding to the target disk are determined; then, according to the target temperature margin value, the parameter adjustment strategy line, and the disk operating condition line, the heat dissipation parameters corresponding to the target device are determined.

[0078] By determining the parameter adjustment strategy line, it is ensured that when the temperature margin value is large, the target device operates at lower heat dissipation parameters (such as low fan speed), and when the temperature margin value decreases, the target device will automatically adjust to higher heat dissipation parameters (such as high fan speed) to cope with the pressure of rising temperature, thus effectively controlling the temperature of the disk and avoiding overheating or insufficient cooling. At the same time, by determining the disk operating condition line, it helps to timely understand the actual feedback of the disk heat dissipation situation. By comprehensively considering the target temperature margin value, the parameter adjustment strategy line, and the disk operating condition line, the heat dissipation parameters corresponding to the target device are determined, effectively avoiding the problem of mismatch between the heat dissipation parameters and the actual heat dissipation requirements, which helps to realize the dynamic adjustment of the heat dissipation parameters, ensure the optimization of the heat dissipation effect, and at the same time reduce the unnecessary energy consumption of the target device.

[0079] In addition, the establishment and use of the parameter adjustment strategy line and the disk operating condition line can further combine machine learning and big data analysis technologies. According to historical operation data and environmental change trends, the models of these two lines are continuously optimized to adapt to wider and more complex working scenarios. And in the case where there are multiple independent target devices in the disk, the parameter adjustment strategy line can be extended to a group of strategy lines for different target devices, and each strategy line is individually adjusted according to the position, type of the device, and the specific operating conditions of the disk to achieve all-round and multi-level control of the internal temperature of the disk.

[0080] As an optional embodiment, determining the parameter adjustment strategy line corresponding to the target device includes: obtaining the environmental temperature fluctuation range and temperature rise fluctuation range corresponding to the target disk; determining the target device type of the target disk according to the environmental temperature fluctuation range and temperature rise fluctuation range; and determining the parameter adjustment strategy line corresponding to the target device according to the target device type.

[0081] In this embodiment, the specific steps of determining the parameter adjustment strategy line corresponding to the target device are described.

[0082] Among them, the environmental temperature fluctuation range is involved. This environmental temperature fluctuation range is the difference between the highest value and the lowest value of the environmental temperature at which the target disk is located during operation. This environmental temperature fluctuation range reflects the external temperature conditions of the disk. The fluctuation of the environmental temperature directly affects the heat dissipation requirements of the components inside the disk, especially in some devices with strict temperature control requirements.

[0083] Among them, the temperature rise fluctuation range is involved. The temperature rise fluctuation range is the difference between the highest value and the lowest value of the temperature difference between each component inside the chassis and its ambient temperature under different working conditions. This temperature rise fluctuation range reflects the temperature change situation of the components due to power consumption changes during operation. For example, if the temperature rise of a component is 5°C under low load and 20°C under high load, then the temperature rise fluctuation range is 15°C.

[0084] Among them, the target device type is involved. The target device type is the device type corresponding to the target chassis determined according to the ambient temperature fluctuation range and the temperature rise fluctuation range. This device type is divided according to the relative magnitudes of the ambient temperature fluctuation range and the temperature rise fluctuation range, and can be used to determine whether the target chassis is more inclined to be "environment-sensitive" or "power consumption-sensitive".

[0085] In the steps involved in this embodiment, before determining the tuning strategy line corresponding to the target device, the ambient temperature fluctuation range and the temperature rise fluctuation range corresponding to the target chassis are first obtained, then the target device type of the target chassis is determined according to the ambient temperature fluctuation range and the temperature rise fluctuation range, and finally, according to the target device type, the tuning strategy line corresponding to the target device is determined.

[0086] By the above steps, determining the target device type of the target chassis according to the ambient temperature fluctuation range and the temperature rise fluctuation range helps to accurately analyze whether the target chassis is environment-sensitive or power consumption-sensitive, so as to determine the tuning strategy line applicable to the target chassis, which helps to more comprehensively understand the heat dissipation requirements of the target chassis, and further helps to more accurately guide the target device to achieve the best balance between the heat dissipation effect and energy consumption of the target chassis.

[0087] As an optional embodiment, determining the tuning strategy line corresponding to the target device according to the target device type includes: when the target device type is an environment-sensitive device, determining the tuning strategy line corresponding to the target device as an inverse proportional curve; and / or, when the target device type is a power consumption-sensitive device, determining the tuning strategy line corresponding to the target device as a straight line with a negative slope.

[0088] In this embodiment, the specific steps of determining the tuning strategy line corresponding to the target device according to the target device type are described.

[0089] Among them, environmentally sensitive devices are involved. Such environmentally sensitive devices are those whose device temperature is greatly affected by the ambient temperature. For such environmentally sensitive devices, a slight change in the external temperature may cause a significant change in the device temperature, thereby affecting the performance and stability of the device. For example, some low-power devices without built-in active cooling mechanisms, such as small routers and switches, their temperatures largely depend on the temperature conditions of the surrounding environment. For environmentally sensitive devices, the cooling strategy needs to pay more attention to the fluctuations in the ambient temperature to ensure that the device can work stably under various environmental conditions.

[0090] Among them, an inverse proportional curve is involved. Such an inverse proportional curve is a relationship where the product of two variables is a constant. In cooling control, the inverse proportional curve is used to describe the relationship between the target device parameters (such as fan speed) and the temperature margin value in environmentally sensitive devices. When the temperature margin is small (i.e., the device is close to the overheating state), the target device needs to operate at a higher parameter value (such as a high-speed fan) to enhance cooling; while when the temperature margin value is large, the target device can operate at a lower parameter value (such as a low-speed fan) to reduce unnecessary energy consumption.

[0091] Among them, power consumption sensitive devices are involved. Such power consumption sensitive devices are those whose device temperature is affected by the device power consumption, and fluctuations in the power consumption will directly cause changes in the device temperature. For example, devices such as high-performance servers and large switches generate a large amount of heat when processing a large amount of data or running at high loads. For power consumption sensitive devices, the cooling strategy needs to adjust the parameters of the target device according to the actual power consumption of the device to ensure that the device can dissipate heat in a timely manner during high-load operation and save energy during low-load operation.

[0092] Among them, a negatively sloped straight line is involved. Such a negatively sloped straight line is a straight line with a negative slope, indicating that one variable decreases as another variable increases. In cooling control, the negatively sloped straight line is used to describe the relationship between the target device parameters and the temperature margin in power consumption sensitive devices. As the temperature margin increases, the parameters of the target device gradually decrease.

[0093] In the steps involved in this embodiment, when determining the parameter adjustment strategy line corresponding to the target device, a differential strategy based on the target device type (i.e., the sensitivity of the device to the ambient temperature or internal power consumption) is adopted. For environmentally sensitive devices, the parameter adjustment strategy line for cooling control is designed as an inverse proportional curve, while for power consumption sensitive devices, a negatively sloped straight line is used as the parameter adjustment strategy line.

[0094] By adopting a differentiated strategy based on the target device type (i.e., the sensitivity of the device to environmental temperature or internal power consumption), the tuning strategy line corresponding to the target device is determined, ensuring the accurate quantification of the heat dissipation requirements under different device types. As a result, the target device can be adjusted specifically according to the actual needs of the device, effectively avoiding the situation that traditional heat dissipation control strategies often adopt a single parameter adjustment model and cannot effectively respond to the differences in heat dissipation requirements among different device types. Furthermore, it helps to ensure the stable operation of different types of devices under various working conditions.

[0095] In addition, the determination of the tuning strategy line can also be dynamically optimized based on the real-time state and historical operation data of the device through machine learning algorithms. For example, the operation data of the device under different environmental temperatures and load conditions can be collected to learn and predict the relationship between the temperature margin and the target device parameters, and continuously adjust the model parameters of the tuning strategy line to adapt to the long-term operation and aging characteristics of the device, ensuring the long-term effectiveness and stability of the heat dissipation control strategy.

[0096] As an alternative embodiment, based on the target temperature margin value, the tuning strategy line, and the disk condition line, multiple heat dissipation parameters for step-by-step adjustment corresponding to the target disk are determined, including: when the heat dissipation parameter includes the heat dissipation balance point, the heat dissipation balance point is determined according to the tuning strategy line and the disk condition line, so that the target device reaches the rotation speed corresponding to the heat dissipation balance point, and the margin value corresponding to the target disk is controlled to be at the margin temperature value corresponding to the heat dissipation balance point.

[0097] In this embodiment, the specific steps for determining multiple heat dissipation parameters for step-by-step adjustment corresponding to the target disk based on the target temperature margin value, the tuning strategy line, and the disk condition line are described.

[0098] Among them, the heat dissipation balance point is involved. The heat dissipation balance point is the point at which the heat dissipation capacity of the target device reaches equilibrium with the heat generation of the disk under specific operating conditions. At this heat dissipation balance point, the target device can effectively remove the heat generated by the disk, keeping the temperature of the disk stable at a safe and appropriate level. The heat dissipation balance point can reflect the most suitable heat dissipation parameters (such as fan rotation speed) of the target device under the current environmental temperature and internal temperature rise conditions. For example, assuming that under the condition that the environmental temperature is 30°C and the internal temperature rise fluctuation of the disk is 10°C, the heat dissipation balance point is determined through the intersection of the tuning strategy line and the disk condition line, and the rotation speed of the target device (such as a fan) is 50%. This means that under the current environment and working conditions, if the fan operates at a rotation speed of 50%, the temperature of the disk can be effectively controlled to keep it within the safe working range.

[0099] Among them, the rotational speed is involved, and this rotational speed is the operating speed of the target device. For example, when the target device is a fan device, the rotational speed represents the rotational speed of the fan, which can be expressed in revolutions per minute (RPM) or as a percentage. The level of the rotational speed directly affects the heat dissipation efficiency of the target device. The higher the rotational speed, the stronger the heat dissipation ability, but at the same time, more noise and energy consumption may be generated. Determining the corresponding rotational speed is to minimize unnecessary energy consumption and noise while meeting the heat dissipation requirements.

[0100] In the steps involved in this embodiment, when the heat dissipation parameters include the heat dissipation balance point, the heat dissipation balance point can be determined according to the parameter adjustment strategy line and the disk condition line. After determining the heat dissipation balance point, the rotational speed corresponding to the heat dissipation balance point is determined. Thus, according to this rotational speed, the margin value corresponding to the target disk can be controlled to be at the margin temperature value corresponding to the heat dissipation balance point.

[0101] The determination of the heat dissipation balance point ensures that the target device operates at the most suitable rotational speed. By adjusting the rotational speed of the target device to the value corresponding to the balance point according to the heat dissipation balance point, it is ensured that the device can obtain the best heat dissipation effect under various operating conditions, while avoiding unnecessary energy consumption and reducing the operating cost.

[0102] In addition, the determination of the heat dissipation balance point and the step-by-step adjustment strategy of the heat dissipation parameters can also be combined with the usage mode of the device, historical operation data, and prediction algorithms for dynamic optimization. For example, in a scenario where the ambient temperature fluctuates greatly, the heat dissipation balance point can be dynamically adjusted by real-time monitoring of the ambient temperature change to ensure that the target device can quickly adapt to the environmental change and maintain the disk temperature within a safe range. At the same time, by collecting and analyzing the long-term operation data of the device, the thermal characteristics of the disk under different operating conditions can be learned, the possible future temperature trends can be predicted, and the heat dissipation parameters can be adjusted in advance to achieve a more proactive thermal management and further improve the thermal stability and operation efficiency of the device.

[0103] Moreover, the determination and adjustment strategy of the heat dissipation balance point can also be applied to scenarios with multiple devices and multiple chassis. By coordinating the heat dissipation parameters between different chassis through a central control system, it is ensured that the entire system not only meets the heat dissipation requirements but also achieves the global optimization of energy utilization. For example, in a data center environment, the central control system can dynamically adjust the parameters of the target device based on the real-time temperature and load information of each chassis to realize the intelligent scheduling of heat dissipation resources and improve the overall energy utilization efficiency and thermal management ability of the data center.

[0104] As an alternative embodiment, obtaining the multi-dimensional classification types corresponding to multiple components included in the target disk includes: obtaining the component parameters corresponding to multiple components included in the target disk; and determining the multi-dimensional classification types corresponding to multiple components based on the component parameters corresponding to multiple components.

[0105] In this embodiment, specific steps of obtaining multi-dimensional classification types corresponding to a plurality of components included in a target disk are described.

[0106] Among them, component parameters are involved, which are parameters used to reflect the temperature characteristics of each component in the target disk. The component parameters can be used to determine the temperature tolerance, heat dissipation requirements, and sensitivity to changes in heat dissipation parameters of the component. The component parameters may include the upper temperature limit, heat generation power, heat dissipation sensitivity, etc.

[0107] In the steps involved in this embodiment, first, component parameters that can reflect corresponding temperature characteristics corresponding to multiple components included in the target disk are obtained, and then, based on the component parameters corresponding to each component, the multi-dimensional classification type corresponding to each component is determined.

[0108] By obtaining the component parameters corresponding to the multiple components included in the target disk, the temperature tolerance, heat dissipation requirements and sensitivity to changes in heat dissipation parameters of the components can be accurately determined, effectively realizing accurate analysis of the temperature sensitivity and heat dissipation requirements of different types of components. By determining the multi-dimensional classification types corresponding to the multiple components according to the component parameters corresponding to the multiple components, not only the temperature characteristics of each component are taken into account, but also the multi-dimensional classification types that match the components can be accurately determined, which helps to accurately identify these differential heat dissipation requirements and accurately control the target device for effective heat dissipation.

[0109] In addition, it is also possible to consider incorporating factors such as component health, service life, and workload into component parameters to build a more comprehensive component classification system to achieve more intelligent and refined thermal management control. For example, for components with a long service life, even if their nominal temperature tolerance is high, their actual thermal stability may decrease due to aging, so their temperature tolerance classification level can be appropriately lowered during classification to ensure that these components receive more accurate heat dissipation treatment.

[0110] Based on the above embodiments and optional embodiments, an optional implementation is provided, which is described in detail below.

[0111] In the related technology, most devices use active cooling with fans. However, due to the different disk models in some devices, the disk combination is complex, and different disks are equipped with a large number of different components. Due to the differences in the heat dissipation requirements of multiple components in the disk, it is necessary to formulate multiple heat dissipation methods in a targeted manner, but it is difficult to formulate effective heat dissipation strategies for the corresponding heat dissipation methods. There is a technical problem that the heat dissipation parameters cannot be determined conveniently and quickly to control the effective heat dissipation of the device.

[0112] For the above problems, no effective solutions have been proposed yet.

[0113] In view of this, an embodiment of the present invention provides a method for determining heat dissipation parameters of a device, which can also be referred to as a method for controlling fans of a chassis device, and can solve the technical problem in the related art that due to the complexity of the different heat dissipation requirements of components in a chassis, it is impossible to accurately control a target device for effective heat dissipation.

[0114] Figure 2 It is a schematic diagram of a speed regulation strategy line in an embodiment of the present invention. Figure 3 It is a schematic diagram of a board card operating condition line in an embodiment of the present invention. Figure 4 It is a schematic diagram for confirming a heat dissipation balance point in an embodiment of the present invention. Figure 5 It is a schematic diagram for confirming a heat dissipation balance point based on ambient temperature in an embodiment of the present invention. Figure 6 It is a relationship diagram between a target device type and a temperature margin in an embodiment of the present invention, and Figure 7 It is a schematic diagram of multi-dimensional classification types in an embodiment of the present invention, such as Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , and Figure 7 as shown, and the following is a detailed description.

[0115] S1. Determine multiple classification items, where the multiple classification items at least include: a temperature tolerance classification item, a sensitivity classification item, and the sensitivity classification item is a classification item classified based on the sensitivity to heat dissipation parameters.

[0116] S2. Determine multiple types corresponding to the multiple classification items respectively.

[0117] S3. Combine the multiple types corresponding to the multiple classification items respectively to obtain multiple predetermined classification types, where the multiple predetermined classification types include multiple multi-dimensional classification types.

[0118] For example, a black-box model is used instead of a white-box model. Specifically, each circuit board is regarded as a single black-box model (i.e., Venus black-boxing), and the unique temperature margin information of each circuit board is obtained. After being acquired and compared by the main control circuit board, the rotation speed is adjusted according to its own type. In computer science, engineering design, and system analysis, black-boxing refers to the process of treating a system, component, or device as opaque and understanding and operating it only through its inputs and outputs, without the need to know its internal structure or working principle. Black-boxing means regarding the circuit board (i.e., the board) as an independent unit with a complex internal structure. The system determines the rotation speed of the fan only through the measurable temperature margin on its surface, without the need to know the specific working state of various chips on the circuit board or the internal heat distribution. By regarding the circuit board as a black box, the control strategy can focus only on the key inputs (i.e., temperature margin) and outputs (i.e., fan rotation speed).

[0119] First, the target chips / modules (same as the above components) on the board (same as the above target circuit board) are divided into four quadrants (same as the above multi-dimensional classification type) according to the upper limit temperature (same as the above temperature tolerance classification item) given in the specification and the sensitivity to wind speed (same as the above sensitivity classification item).

[0120] First quadrant: Sensitive to wind speed (same as the above sensitivity classification item) / Large chip threshold (same as the above temperature tolerance classification item). This quadrant mainly consists of main chips (CPU / SWITCH, etc.), characterized by high thermal power, large heat generation, and having a heat sink;

[0121] Second quadrant: Sensitive to wind speed / Small chip threshold. This quadrant mainly consists of peripheral devices of the main chip, such as DDR, Flash, etc. Although they do not have a heat sink, they are sensitive to wind speed because they are gathered around the main chip and follow the heat dissipation trend of the main chip;

[0122] Third quadrant: Insensitive to wind speed / Small chip threshold. This quadrant is for optical modules, characterized by large heat generation, high concentration, and poor heat dissipation;

[0123] Fourth quadrant: Insensitive to wind speed / Large chip threshold. This quadrant mainly consists of CPLD logic devices / MCU chips, etc., characterized by being far from the main chip and generating little heat by themselves. Because the temperature rise is very low, they are also insensitive to wind speed;

[0124] For the first quadrant, the actual junction temperature of each target chip is obtained, and at the same time, the subtraction is made with the upper limit junction temperature of the target chip, which is defined as the temperature margin value of the target chip;

[0125] For the second quadrant, the case temperature of each target chip is obtained, and at the same time, the subtraction is made with the upper limit ambient temperature of the target chip, which is defined as the temperature margin value of the target chip;

[0126] For the third quadrant, since the optical module is an external device, there are often problems with mismatched models and untrustworthy obtained temperatures. Therefore, the equivalent margin values corresponding to the inserted quantity are adopted (for example, defining the upper limit of the optical module as 40°C and subtracting 2°C for each inserted optical module to obtain the equivalent temperature margin value), which are used to participate in speed regulation.

[0127] For the fourth quadrant, under normal circumstances, overheating will not occur, and it generally does not participate in the speed regulation strategy.

[0128] S4. Obtain the multi-dimensional classification types respectively corresponding to multiple components included in the target chassis, where the corresponding multi-dimensional classification types are obtained based on the respective types to which the corresponding components belong under multiple classification items.

[0129] Specifically, S4 includes:

[0130] S41. Obtain the component parameters respectively corresponding to multiple components included in the target chassis;

[0131] S42. Determine the multi-dimensional classification types respectively corresponding to multiple components based on the component parameters respectively corresponding to multiple components.

[0132] S5. Determine the sub-temperature margin values respectively corresponding to multiple multi-dimensional classification types based on the margin temperature determination methods respectively corresponding to multiple multi-dimensional classification types and the margin temperature values of the components included under multiple multi-dimensional classification types;

[0133] S6. Determine the target temperature margin value based on multiple sub-temperature margin values;

[0134] For example, collect the magnitudes of the temperature margin values (the same as the above-mentioned margin temperature values) in four quadrants, and compare to obtain the minimum value of the temperature margin values of all targets on this chassis (the same as the above-mentioned sub-temperature margin values). Divide the air duct into several control areas, and give the minimum value of the chassis temperature margin included in the control area to the main control chassis. The main control chassis then automatically compares to obtain the minimum value of several chassis (the same as the above-mentioned target temperature margin value). The main control chassis adjusts the fan speed of the corresponding control area according to the minimum value of the compared temperature margin, which can be obtained by looking up the temperature margin and speed table (i.e., the strategy line);

[0135] S7. Determine the heat dissipation parameters corresponding to the target device based on the target temperature margin value, where the target device is used to dissipate heat from the target chassis.

[0136] Specifically, S7 includes:

[0137] S71. Determine the parameter adjustment strategy line corresponding to the target device and the chassis working condition line corresponding to the target chassis;

[0138] Specifically, S71 includes:

[0139] S711. Obtain the environmental temperature fluctuation range and temperature rise fluctuation range corresponding to the target disk; determine the target device type of the target disk according to the environmental temperature fluctuation range and temperature rise fluctuation range.

[0140] S712. When the target device type is an environment-sensitive device, determine that the tuning strategy line corresponding to the target device is an inverse proportional curve; and / or when the target device type is a power consumption-sensitive device, determine that the tuning strategy line corresponding to the target device is a straight line with a negative slope.

[0141] For example, the strategy on the main control side is determined by the overall machine judgment. According to the environmental temperature fluctuation range and temperature rise fluctuation range, it is divided into environment-sensitive and power consumption-sensitive devices. According to the ratio, the a and b coefficients of the strategy line (the same as the above tuning strategy line) can be calculated. The basic equivalent formula for the environment-sensitive type (the same as the above environment-sensitive device) is: Y = c / X + d, and the basic equivalent formula for the power consumption-sensitive type (the same as the above power consumption-sensitive device) is: Y = -aX + b. If the difference in the environmental temperature fluctuation range is 50°C and the difference in the temperature rise fluctuation range is 10°C, it is an environment-sensitive type, and the strategy line is biased towards a curve. If the difference in the environmental temperature fluctuation range (the same as the above environmental temperature fluctuation range) is 20°C and the difference in the temperature rise fluctuation range (the same as the above temperature rise fluctuation range) is 40°C, it is a temperature rise-sensitive type, and the strategy line is biased towards a straight line.

[0142] Among them, Y represents the rotational speed, X represents the temperature margin value, c represents a constant, d represents the intercept of the tuning strategy line, a represents the slope, and b represents the intercept of the disk operating condition line.

[0143] It can be seen from Figure 2 that the control strategy establishes a corresponding relationship between the temperature margin and the rotational speed, and overall shows a trend that the smaller the temperature margin, the larger the rotational speed. This is because when the chip is closer to the upper limit temperature, a larger rotational speed is required for heat dissipation. It should be noted that when at the maximum rotational speed, there must still be a temperature margin for the disk chip, otherwise this strategy is not applicable.

[0144] It can be seen from Figure 3 that the disk operating condition line (the same as the above disk operating condition line) is obtained through testing. When the disk is in a scenario with a certain environmental temperature and a certain heat dissipation power consumption, adjusting the rotational speed, the temperature margin also changes accordingly, and overall shows a trend that the higher the rotational speed, the larger the temperature margin. Even if the environmental temperature changes, the operating condition line will only shift, and the overall trend will not change.

[0145] S72. When the heat dissipation parameter includes the heat dissipation balance point, determine the heat dissipation balance point according to the tuning strategy line and the disk operating condition line, so that the target device reaches the rotational speed corresponding to the heat dissipation balance point, and control the margin value corresponding to the target disk to be at the margin temperature value corresponding to the heat dissipation balance point.

[0146] For example, it can be seen fromFigure 4 It can be seen that when the chassis is in any scenario and the speed regulation strategy is enabled, the temperature margin of the chassis will change according to T1→T2→T3…→T n while the rotational speed will change accordingly as S1→S2→S3→S4…→S n until the equilibrium intersection point (T n , S n ) is reached (the same as the above heat dissipation equilibrium point). At the same time, when formulating the strategy, stepless rotational speed is used to correspond to different temperature margin values. When the rotational speed scale is small enough, a unique corresponding relationship for the equilibrium point can be ensured. (Even if there is no corresponding relationship for this equilibrium point, the fan rotational speed will oscillate between the gears closest to S n (such as S n and S (n-1) ), and the change in rotational speed is very small, almost without wind power).

[0147] Among them, stepless speed regulation refers to the ability to continuously and smoothly adjust the rotational speed of equipment (such as motors, fans), as opposed to stepped speed regulation. In stepped speed regulation, the rotational speed of the equipment can only be switched between several preset fixed gears, while stepless speed regulation allows the rotational speed of the equipment to continuously vary within a certain range, enabling more precise control. In fan control, stepless speed regulation means that the fan can continuously change its rotational speed according to actual needs, and there can be countless possible rotational speed values between the lowest and highest rotational speeds, not just limited to several preset gears.

[0148] It can be seen from Figure 5 that when the speed regulation strategy takes effect, if the ambient temperature and heat dissipation power change, the equilibrium intersection point (T n , S n ) will also move accordingly. If the ambient temperature / heat dissipation power increases, T n moves in the direction of T (n+1) ; if the ambient temperature / heat dissipation power decreases, T n moves in the direction of T (n-1) . When the ambient temperature / heat dissipation power remains unchanged, the temperature margin and rotational speed remain stable.

[0149] It can be seen from Figure 6 that if the change in ambient temperature dominates, the strategy is approximately a curve, because when the margin is smaller, the rotational speed base is larger, and more rotational speed needs to be increased to achieve the same cooling effect. If the change in temperature rise dominates, the strategy is approximately a straight line. Generally, such equipment needs to avoid as much as possible the sudden change in rotational speed caused by the violent fluctuation of temperature rise.

[0150] Through the above optional implementation manners, at least the following beneficial effects can be achieved:

[0151] (1) Compared with the related art, the present invention simplifies the process of determining the heat dissipation parameters by obtaining the multi-dimensional classification types respectively corresponding to multiple components included in the target disk. That is, in this way, without restricting the models and specifications of the disk and components, the multiple components are classified according to multiple classification items to determine the multi-dimensional classification types respectively corresponding to the multiple components, and then according to the remaining temperature determination methods respectively corresponding to the multiple multi-dimensional classification types, the sub-temperature remaining values respectively corresponding to the multiple multi-dimensional classification types can be determined. It not only improves the compatibility with various disk and chip combinations, but also does not need to determine the temperature and heat resistance of different components. Only by classifying and dividing to determine the corresponding multi-dimensional classification type can the corresponding temperature remaining determination method be adaptively selected to determine the sub-temperature remaining value corresponding to this classification type, so as to conveniently and quickly determine multiple sub-temperature remaining values. Moreover, through this method, the heat dissipation characteristics of the components under each classification can be fully considered, which not only simplifies the process of determining the temperature remaining value, but also ensures the accuracy of the determination of the temperature remaining value, and then conveniently and quickly determines the heat dissipation parameters corresponding to the target device, and controls the target device to dissipate heat from the target disk with the heat dissipation parameters, ensuring that the target disk can maintain within the optimal working temperature range under various working conditions, and thus solving the technical problem in the related art that due to the complexity of the different heat dissipation requirements of the components in the disk, it is impossible to conveniently and quickly determine the heat dissipation parameters to control the target device for effective heat dissipation.

[0152] (2) Compared with the related art, the present invention ensures that when the temperature remaining value is large, the target device operates at a lower heat dissipation parameter (such as low fan speed), and when the temperature remaining value decreases, the target device will automatically adjust to a higher heat dissipation parameter (such as high fan speed) to cope with the pressure of rising temperature by determining the parameter adjustment strategy line, thereby realizing the effective control of the disk temperature and avoiding overheating or insufficient cooling. At the same time, by determining the disk working condition line, it helps to timely understand the actual feedback of the heat dissipation situation of the disk. By comprehensively considering the target temperature remaining value, the parameter adjustment strategy line, and the disk working condition line, the heat dissipation parameters corresponding to the target device are determined, effectively avoiding the problem of mismatch between the heat dissipation parameters and the actual heat dissipation requirements, which helps to realize the dynamic adjustment of the heat dissipation parameters, ensures the optimization of the heat dissipation effect, and at the same time reduces the unnecessary energy consumption of the target device.

[0153] (3) Compared with the related art, the present invention adopts a differentiated strategy based on the target device type (i.e., the sensitivity of the device to ambient temperature or internal power consumption) to determine the parameter adjustment strategy line corresponding to the target device, thereby ensuring accurate quantification of the heat dissipation requirements under different device types, so that the target device can be adjusted in a targeted manner according to the actual needs of the device, thereby effectively avoiding the traditional heat dissipation control strategy that often adopts a single parameter adjustment model and cannot effectively address the differences in heat dissipation requirements of different device types, thereby helping to ensure the stable operation of different types of devices under various working conditions.

[0154] (4) Compared with the related art, the present invention adopts a method for determining the residual temperature by measuring the shell temperature value of a component and then subtracting the upper limit value of the shell temperature of the component to determine the residual temperature value. The target disk can be regarded as being black-boxed. The corresponding residual temperature value can be determined only by obtaining the corresponding shell temperature value without in-depth understanding of the internal structure of the component and the heat conduction path. Even when the component is updated or the configuration changes, the residual temperature value can be determined based on the shell temperature measurement, thereby simplifying the process of determining the residual temperature value and reducing the complexity of data processing.

[0155] (5) Compared with the related art, the present invention uses a black box model instead of a white box model to output a unique temperature margin, effectively solving the pain points of a large number of disk types and chips; using a temperature equivalent margin solves the instability of external devices; and using stepless speed regulation ensures that the final strategy can be stabilized at a constant speed, without causing drastic speed fluctuations to cause trouble to maintenance personnel. Proportional calculation is used to make the speed regulation strategy more suitable for various machine frame application scenarios.

[0156] Example 2

[0157] According to another aspect of the present invention, there is also provided a device for determining heat dissipation parameters of a device, for implementing the method for determining heat dissipation parameters of the device described above. Figure 8 is a structural block diagram of a device for determining heat dissipation parameters of a device according to an embodiment of the present invention. Figure 8 The device includes: an acquisition module 802, a first determination module 804, a second determination module 806 and a third determination module 808. The device is described in detail below.

[0158] An acquisition module 802, configured to acquire multi-dimensional classification types respectively corresponding to multiple components included in a target disk, where the corresponding multi-dimensional classification types are obtained according to the types to which the corresponding components belong respectively under multiple classification items; a first determination module 804, connected to the above acquisition module 802, configured to determine sub-temperature margin values respectively corresponding to multiple multi-dimensional classification types according to the margin temperature determination methods respectively corresponding to the multiple multi-dimensional classification types and the margin temperature values of the components included under the multiple multi-dimensional classification types; a second determination module 806, connected to the above first determination module 804, configured to determine a target temperature margin value according to the multiple sub-temperature margin values; a third determination module 808, connected to the above second determination module 806, configured to determine a heat dissipation parameter corresponding to a target device according to the target temperature margin value, where the target device is used to dissipate heat from the target disk.

[0159] The above acquisition module 802, first determination module 804, second determination module 806, and third determination module 808 correspond one by one to steps S101 to S108. The instances and application scenarios implemented by the multiple modules and the corresponding steps are the same, but are not limited to the content disclosed in the above embodiments.

[0160] Embodiment 3

[0161] An embodiment of the present invention further provides a computer-readable storage medium. Optionally, in this embodiment, the above computer-readable storage medium may be used to store the program code executed by the method for determining the heat dissipation parameter of the device provided in the above embodiment.

[0162] Embodiment 4

[0163] An embodiment of the present invention may provide an electronic device, and this computer device includes a memory and a processor. The processor may call the information and application programs stored in the memory through a transmission device to execute the following steps:

[0164] Acquire multi-dimensional classification types respectively corresponding to multiple components included in a target disk, where the corresponding multi-dimensional classification types are obtained according to the types to which the corresponding components belong respectively under multiple classification items; determine sub-temperature margin values respectively corresponding to multiple multi-dimensional classification types according to the margin temperature determination methods respectively corresponding to the multiple multi-dimensional classification types and the margin temperature values of the components included under the multiple multi-dimensional classification types; determine a target temperature margin value according to the multiple sub-temperature margin values; determine a heat dissipation parameter corresponding to a target device according to the target temperature margin value, where the target device is used to dissipate heat from the target disk.

[0165] Embodiment 5

[0166] An embodiment of the invention also provides a computer program product, including a computer program which, when executed by a processor, implements the steps of the method for determining the heat dissipation parameters of the device in each embodiment of the present application.

[0167] Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing the relevant hardware of the terminal device through a program, and this program can be stored in a non-volatile storage medium. The storage medium can include: a flash drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disc, etc.

[0168] The serial numbers of the above embodiments of the present invention are only for description and do not represent the superiority or inferiority of the embodiments.

[0169] In the above embodiments of the present invention, the descriptions of each embodiment have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0170] In several embodiments provided by the present application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only illustrative. For example, the division of the units can be a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces. The indirect coupling or communication connection of units or modules can be in an electrical or other form.

[0171] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place, or they can be distributed to multiple units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0172] In addition, the functional units in each embodiment of the present invention can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above integrated units can be implemented in the form of hardware or in the form of software functional units.

[0173] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present invention, in essence, or the part that contributes to the related technology, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The foregoing storage medium includes: various media that can store program codes, such as USB flash drives, read-only memories (ROMs), random access memories (RAMs), mobile hard disks, magnetic disks, or optical discs.

[0174] The foregoing are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for determining heat dissipation parameters of a device, characterized in that: include: Acquire multi-dimensional classification types corresponding to a plurality of components included in the target disk, wherein the corresponding multi-dimensional classification types are obtained according to the types corresponding to the corresponding components under a plurality of classification items; Determine the sub-temperature margin values ​​corresponding to the multiple multi-dimensional classification types respectively according to the margin temperature determination methods corresponding to the multiple multi-dimensional classification types respectively and the margin temperature values ​​corresponding to the components included in the multiple multi-dimensional classification types; Determining a target temperature margin value according to the plurality of sub-temperature margin values; A heat dissipation parameter corresponding to a target device is determined according to the target temperature margin value, wherein the target device is used to dissipate heat for the target disk.

2. The method according to claim 1, characterized in that Before obtaining the multi-dimensional classification types corresponding to the multiple components included in the target disk, the method further includes: Determine the multiple classification items, wherein the multiple classification items at least include: a temperature tolerance classification item, a sensitivity classification item, and the sensitivity classification item is represented as a classification item classified based on the sensitivity to the heat dissipation parameter; Determine a plurality of types corresponding to the plurality of classification items respectively; The multiple types corresponding to the multiple classification items are combined to obtain multiple predetermined classification types, wherein the multiple predetermined classification types include the multiple multi-dimensional classification types.

3. The method according to claim 1, characterized in that The step of determining the heat dissipation parameter corresponding to the target device according to the target temperature margin value includes: Determine a parameter adjustment strategy line corresponding to the target device and a disk operating condition line corresponding to the target disk; According to the target temperature margin value, the parameter adjustment strategy line and the disk operating condition line, a heat dissipation parameter corresponding to the target device is determined.

4. The method according to claim 3, characterized in that The determining a parameter adjustment strategy line corresponding to the target device includes: Acquire the ambient temperature fluctuation range and temperature rise fluctuation range corresponding to the target disk; Determining a target device type of the target disk according to the ambient temperature fluctuation range and the temperature rise fluctuation range; Based on the target device type, determine the parameter adjustment strategy line corresponding to the target device.

5. The method according to claim 4, characterized in that Determining, according to the target device type, a parameter adjustment strategy line corresponding to the target device, including: In the case where the target device type is an environment-sensitive device, determining that the parameter adjustment strategy line corresponding to the target device is an inverse proportional curve; and / or, When the target device type is a power consumption sensitive device, the parameter adjustment strategy line corresponding to the target device is determined to be a negative slope straight line.

6. The method according to claim 3, characterized in that According to the target temperature margin value, the parameter adjustment strategy line and the disk operating condition line, a plurality of heat dissipation parameters corresponding to the target disk are determined to be adjusted step by step, including: When the heat dissipation parameters include a heat dissipation balance point, the heat dissipation balance point is determined based on the parameter adjustment strategy line and the disk operating condition line so that the target device reaches a rotation speed corresponding to the heat dissipation balance point, and the margin value corresponding to the target disk is controlled to be at a margin temperature value corresponding to the heat dissipation balance point.

7. The method according to any one of claims 1 to 6, characterized in that: Get the multi-dimensional classification types corresponding to the multiple components included in the target disk, including: Obtain component parameters corresponding to multiple components included in the target disk; The multi-dimensional classification types respectively corresponding to the multiple components are determined according to the component parameters respectively corresponding to the multiple components.

8. A device for determining heat dissipation parameters of a device, characterized in that: include: An acquisition module, used to acquire multi-dimensional classification types corresponding to a plurality of components included in the target disk, wherein the corresponding multi-dimensional classification types are obtained according to the types corresponding to the corresponding components under a plurality of classification items; A first determination module is used to determine the sub-temperature margin values ​​corresponding to the multiple multi-dimensional classification types respectively according to the margin temperature determination methods corresponding to the multiple multi-dimensional classification types respectively and the margin temperature values ​​corresponding to the components included in the multiple multi-dimensional classification types; A second determination module, configured to determine a target temperature margin value according to a plurality of sub-temperature margin values; The third determination module is used to determine a heat dissipation parameter corresponding to a target device according to the target temperature margin value, wherein the target device is used to dissipate heat for the target disk.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored executable program, wherein when the executable program is running, the device where the computer-readable storage medium is located is controlled to execute the method for determining the heat dissipation parameters of the device according to any one of claims 1 to 7.

10. An electronic device, characterized in that: include: A memory storing an executable program; A processor is used to run the program, wherein the program, when running, executes the method for determining the heat dissipation parameters of the device according to any one of claims 1 to 7.

11. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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