Split type medical device and preparation method of electronic component of split type medical device

Abstract

The invention relates to a split type medical device and a preparation method of an electronic component thereof, and the split type medical device comprises a first housing, an electronic module and a separator which are arranged on the first housing, a second housing which is detachably assembled with the first housing, and a sensor which is arranged on the second housing. The second shell comprises a sensor mounting seat which can be arranged under the skin; the isolation piece is provided with a groove-shaped part matched with the mounting seat and a functional surface deviating from the electronic module, a bulge surrounding the groove-shaped part is arranged on the functional surface, the electronic module comprises a connecting area used for being electrically connected with the sensor, and the isolation piece is attached to the first shell and covers the electronic module in a manner that the connecting area is exposed at the groove-shaped part; when the first shell is assembled on the second shell, the isolation piece is located between the second shell and the first shell, and the protrusion deforms in the direction, facing the first shell, of the second shell. According to the split type medical device and the manufacturing method of the electronic assembly of the split type medical device, the sealing effect can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of biomedical engineering industry, and particularly relates to a split-type medical device and a preparation method for its electronic components. Background Art

[0002] Diabetes has currently become one of the major diseases affecting the physical health of the public. For diabetic patients, real-time monitoring of their blood glucose changes helps to control the development of diabetes and treat diabetes. Currently, a Continuous Glucose Monitoring (CGM) device is usually used to continuously monitor the blood glucose concentration of the human body. In order to reuse the electronic module of the continuous glucose monitor, the existing continuous glucose monitors usually adopt a split-type assembly method.

[0003] Generally speaking, in order to keep the continuous glucose monitor in normal working performance, the electronic module needs to be sealed. In the prior art, a split-type assembled continuous glucose monitor usually includes an upper housing, a lower housing, and an electronic module disposed between the upper housing and the lower housing. And usually, a sealing ring is arranged at the junction of the upper housing and the lower housing to seal the electronic module.

[0004] However, during the use of the above-mentioned prior art continuous glucose monitor, the sealing ring may have the risk of loosening, which may lead to poor sealing effect on the electronic module, thereby affecting the working performance of the continuous glucose detector. Summary of the Invention

[0005] The present disclosure is proposed in view of the above situation, and its purpose is to provide a split-type medical device capable of improving the sealing effect and a preparation method for its electronic components.

[0006] To this end, a first aspect of the present disclosure provides a split-type medical device. The split-type medical device includes a first housing, an electronic module and a spacer disposed in the first housing, a second housing detachably assembled with the first housing, and a sensor disposed in the second housing. The second housing includes a mounting seat for disposing a sensor that can be placed subcutaneously; the spacer has a groove-shaped portion matching the mounting seat and a functional surface facing away from the electronic module, and a protrusion surrounding the groove-shaped portion is disposed on the functional surface; the electronic module includes a connection area for electrically connecting with the sensor, and the spacer is configured to fit on the first housing and cover the electronic module in such a way that the connection area is exposed by the groove-shaped portion; when the first housing is assembled to the second housing, the spacer is located between the second housing and the first housing, and the protrusion deforms in the direction from the second housing to the first housing, and the mounting seat is located in the groove-shaped portion and the sensor is electrically connected to the electronic module through the connection area.

[0007] In the split-type medical device according to the first aspect of the present disclosure, the spacer fits on the first housing and partially covers the electronic module, which can preliminarily seal the electronic module. And because the spacer has a groove-shaped portion for exposing the connection area and matching the mounting seat for disposing the sensor, when the first housing is assembled to the second housing, the sensor can be electrically connected to the connection area, and thus the split-type medical device can obtain the target physiological information; in addition, because the spacer has a protrusion surrounding the groove-shaped portion, when the first housing is assembled to the second housing, the protrusion surrounding the groove-shaped portion will be squeezed by the second housing and thus deform, so that the spacer can fit more closely to the second housing when the first housing is assembled to the second housing. Therefore, the sealing effect of the groove-shaped portion can be achieved, that is, the connection area can be sealed, and the sealing effect on the electronic module can be further improved.

[0008] In addition, in the split-type medical device according to the first aspect of the present disclosure, optionally, the protrusion surrounding the groove-shaped portion is defined as a first protrusion, and the groove-shaped portion has a second protrusion surrounding the connection area. When the first housing is assembled to the second housing, the second protrusion deforms in the direction from the second housing to the first housing. In this case, when the first housing is assembled to the second housing, the second protrusion will be squeezed by the mounting seat and thus deform, so that the second protrusion can fit more closely to the mounting seat, and the connection area can be in a sealed space, that is, the sealing effect on the connection area can be improved by the mutual cooperation of the second protrusion and the mounting seat. Therefore, the sealing effect on the electronic module can be improved.

[0009] In addition, in the split-type medical device according to the first aspect of the present disclosure, optionally, the split-type medical device includes a power supply module configured to supply power to the electronic module. Let the groove-shaped portion matching the mounting seat be the first groove-shaped portion. The spacer has a second groove-shaped portion configured to accommodate the power supply module, and the protrusion surrounds the first groove-shaped portion and the second groove-shaped portion. In this case, the protrusion surrounds the first groove-shaped portion and the second groove-shaped portion. When the first housing is assembled to the second housing, the protrusion surrounding the first groove-shaped portion and the second groove-shaped portion will be squeezed by the second housing and thus deformed, so that the spacer can fit more closely to the second housing when the first housing is assembled to the second housing, and can seal the connection area located in the first groove-shaped portion and the power supply module located in the second groove-shaped portion. Therefore, the sealing effect of the split-type medical device can be improved.

[0010] In addition, in the split-type medical device according to the first aspect of the present disclosure, optionally, let the protrusion surrounding the groove-shaped portion be the first protrusion, and a third protrusion connected to the first protrusion and configured to isolate the first groove-shaped portion and the second groove-shaped portion is provided on the functional surface. In the direction from the first housing to the second housing, the extension length of the third protrusion is the same as the extension length of the first protrusion. In this case, when the first housing is assembled to the second housing, since the extension lengths of the first protrusion and the third protrusion are the same, the second housing can simultaneously exert a squeezing effect on the first protrusion and the third protrusion, so that both the first protrusion and the third protrusion can fit closely to the second housing. Through the mutual cooperation of the first protrusion, the third protrusion and the second housing, two independent sealed spaces respectively including the first groove-shaped portion and the second groove-shaped portion can be formed. Therefore, the connection area and the mounting seat located in the first groove-shaped portion, and the power supply module located in the second groove-shaped portion can be sealed respectively.

[0011] In addition, in the split-type medical device according to the first aspect of the present disclosure, optionally, the mounting base includes a positioning base and a base. The positioning base has a through hole penetrating the second housing, and the sensor is positioned in the second housing through the through hole. The base is configured to accommodate a conductive component electrically connected to the sensor, and the sensor is electrically connected to the connection area through the conductive component. When the first housing is assembled to the second housing, the base presses the second protrusion, and the base and the second protrusion cooperate to form a sealed space. In this case, when the first housing is assembled to the second housing, the second protrusion can be subjected to the pressing action from the base, and then the base can be closely attached to the second protrusion to form a sealed space for accommodating the conductive component and the connection area. In addition, the sensor can be disposed on the mounting base through the through hole of the positioning base. When the first housing is assembled to the second housing, the electrical connection between the sensor and the electronic module can be achieved through the electrical connection between the conductive component and the connection area. The through hole penetrates the second housing at the position of the positioning base. In other words, the through hole is independent of the sealed space. Thus, the undesired substances entering the split-type medical device through the through hole can be isolated from the sealed space, and further, the protection effect on the electrical connection part of the split-type medical device can be improved.

[0012] In addition, in the split-type medical device according to the first aspect of the present disclosure, optionally, the second housing has at least one hole for positioning the second housing. When the first housing is assembled to the second housing, the at least one hole is located on the side of the third protrusion away from the second groove portion. In this case, before the split-type medical device is used, the second housing can be positioned through the hole in the component for accommodating the second housing. Since the hole is located on the side of the third protrusion away from the second groove portion, when the first housing is assembled to the second housing, the hole can be independent of the sealed space including the second groove portion, and then the undesired substances entering the split-type medical device through the hole can be isolated from the sealed space including the second groove portion. Thus, the sealing effect on the power module can be improved.

[0013] In addition, in the split-type medical device according to the first aspect of the present disclosure, optionally, at least one fourth protrusion matching the at least one hole is provided on the functional surface. When the first housing is assembled to the second housing, the at least one fourth protrusion is deformed in the direction from the second housing to the first housing. In this case, the fourth protrusion can block the hole to prevent undesired substances from entering the split-type medical device along the hole. Thus, the sealing effect of the split-type medical device can be further improved.

[0014] In addition, in the split-type medical device according to the first aspect of the present disclosure, optionally, the isolation member is elastic and the isolation member is adhered to the inner contour of the first housing. In this case, when the first housing and the second housing are assembled, since the isolation member is elastic, it will produce a rebound effect after being squeezed, so that the isolation member can fit more closely with the second housing, thereby enhancing the sealing effect of the split-type medical device; since the isolation member is adhered to the first housing, the part where the isolation member is in contact with the first housing can fit closely, thus preventing unwanted substances from penetrating into the electronic module from the above-mentioned contacting part.

[0015] The second aspect of the present disclosure provides a method for manufacturing an electronic component, the electronic component includes the electronic module, the isolation member and the first housing according to any one of the first aspect of the present disclosure, and the method for manufacturing the electronic component includes: preparing the first housing provided with the electronic module; coupling the first housing with a mold having a preset shape, the preset shape matching the shape of the isolation member; supplying an injection molding material with a preset temperature to the mold; removing the mold after the injection molding material cools to obtain the isolation member; and obtaining the electronic component. In the second aspect of the present disclosure, for the electronic component obtained by supplying the injection molding material to the mold, the isolation member therein can be tightly adhered to the first housing and seal the electronic module provided in the first housing. The preset shape of the mold matches the shape of the isolation member, which can enable the injection molding material to form an isolation member with a desired structure after cooling, and the structure of the isolation member can improve the sealing effect of the electronic component after assembly; at the same time, the isolation member can also play a role in stabilizing the various electronic components of the electronic module.

[0016] In addition, in the method for manufacturing an electronic component according to the second aspect of the present disclosure, optionally, the injection molding material includes silicone. In this case, the isolation member can have high waterproofness and elasticity, thereby improving the sealing effect on the electronic module; in addition, if the injection molding material includes silicone, the injection molding material can be injected by a low-pressure method. Since the injection pressure of low-pressure injection molding is low, the damage to the electronic component during the injection molding process can be reduced.

[0017] In addition, in the method for manufacturing an electronic component according to the second aspect of the present disclosure, optionally, the preset temperature is 150 degrees Celsius to 200 degrees Celsius. In this case, during the injection molding process, the injection molding material with a relatively low temperature can be injected into the mold, thereby further reducing the damage to the electronic component during the injection molding process.

[0018] In addition, in the method for manufacturing an electronic component according to the second aspect of the present disclosure, optionally, the hardness of the injection molding material after curing is 10 to 60 degrees. In this case, the spacer can have high elasticity.

[0019] According to the present disclosure, a split-type medical device capable of improving the sealing effect and a method for manufacturing an electronic component thereof can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 FIG. is an application scenario diagram of the split-type medical device according to the example of the present disclosure.

[0021] Figure 2 FIG. is a front view of the split-type medical device according to the example of the present disclosure.

[0022] Figure 3 FIG. is an exploded schematic view of the split-type medical device according to the example of the present disclosure.

[0023] Figure 4A FIG. is a schematic structural diagram of the second housing from a first perspective according to the example of the present disclosure; Figure 4B FIG. is a schematic structural diagram of the second housing from a second perspective according to the example of the present disclosure.

[0024] Figure 5A FIG. is a schematic structural diagram of the electronic component from a first perspective according to the example of the present disclosure; Figure 5B FIG. is a schematic structural diagram of the electronic component from a second perspective according to the example of the present disclosure.

[0025] Figure 6 FIG. is a flowchart of the method for manufacturing an electronic component according to the example of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. In the following description, the same reference numerals are given to the same components, and redundant description is omitted. In addition, the drawings are only schematic diagrams, and the dimensional ratios between components or the shapes of components may be different from the actual ones.

[0027] A first aspect of the present disclosure relates to a split-type medical device. The split-type medical device according to the present disclosure can be applied to the surface of a user's skin, obtain the analyte information of the user, and after processing the analyte information, send the analyte information of the user to a smart device. Thus, the analyte information of the user can be monitored. In some examples, the analyte information may also be referred to as the target physiological information. In the split-type medical device according to the present disclosure, by covering the spacer on the electronic module, the sealing effect on the electronic module can be improved.

[0028] The second aspect of the present disclosure relates to a method for manufacturing an electronic component. The manufacturing method according to the present disclosure obtains the electronic component by supplying an injection molding material to a mold. The spacer in the electronic component can be tightly adhered to the first housing, seal the electronic module disposed in the first housing, and the structure of the spacer can improve the sealing effect of the electronic component after assembly. At the same time, the spacer can also play a role in stabilizing the various electronic components of the electronic module.

[0029] The third aspect of the present disclosure relates to a medical device set including the split medical device according to the first aspect of the present disclosure.

[0030] Figure 1 FIG. shows an application scenario diagram of the split medical device 10 according to an example of the present disclosure. Figure 2 FIG. shows a front view of the split medical device 10 according to an example of the present disclosure. Figure 3 FIG. shows an exploded schematic view of the split medical device 10 according to an example of the present disclosure.

[0031] In some examples, referring to Figure 1 , the medical device set 1 may include a split medical device 10 and an application device 20. In some examples, the split medical device 10 is a split medical device 10 that can be applied to a target skin surface. In some examples, the split medical device 10 may also be referred to as a split medical device or a patch assembly. In some examples, the target may be a host with physiological functions.

[0032] In some examples, the split medical device 10 can be applied to the host skin surface by means of the application device 20. Thus, the split medical device 10 can be applied to a desired position.

[0033] In some examples, referring to Figure 1 , the split medical device 10 can transmit data information wirelessly with the smart device 30. Thus, the analyte information obtained by the split medical device 10 can be read and monitored in real time through the smart device 30.

[0034] In some examples, the medical device set 1 may include a cartridge device 40 that matches the application device 20. In some examples, the split medical device 10 can be assembled with the aid of the application device 20 and the cartridge device 40 that matches the application device 20. Thus, the split medical device 10 can be completely assembled into one body. In some examples, the medical device set 1 may not include the cartridge device 40, and the split medical device 10 can be directly accommodated in the application device 20 in a fully assembled form.

[0035] In some examples, referring to Figure 2, the split-type medical device 10 may include a main body portion 11 and a sensor 12 disposed on the main body portion 11. Among them, the main body portion 11 may be applied to the skin surface, and the sensor 12 may be placed subcutaneously. Specifically, the sensor 12 may be placed subcutaneously at the target. In some examples, the sensor 12 may obtain analyte information, and the main body portion 11 may receive the analyte information and send the analyte information to the smart device 30. In this case, real-time monitoring of the analyte information can be achieved.

[0036] In some examples, referring to Figure 3 , the main body portion 11 may include an electronic component 100 and a second housing 200. In some examples, the electronic component 100 may include a first housing 110, an electronic module 120, and a spacer 130. In some examples, the electronic module 120 and the spacer 130 may be disposed in the first housing 110. In some examples, the electronic module 120 may be located between the first housing 110 and the spacer 130. Thus, the electronic module 120 can be protected. In some examples, when the electronic component 100 is assembled to the second housing 200, the spacer 130 may be located between the second housing 200 and the first housing 110.

[0037] Figure 4A is a schematic structural diagram of the second housing 200 involved in the examples of the present disclosure from a first perspective. Figure 4B is a schematic structural diagram of the second housing 200 involved in the examples of the present disclosure from a second perspective.

[0038] In some examples, the second housing 200 may be detachably assembled with the electronic component 100. Thus, the flexibility of the split-type medical device 10 can be improved.

[0039] In some examples, the second housing 200 may be applied to the skin surface. In some examples, the second housing 200 may be detachably assembled with the first housing 110. Thus, it is convenient to install the electronic component 100 on the second housing 200 or disassemble the electronic component 100 from the second housing 200.

[0040] In some examples, the sensor 12 may be disposed on the second housing 200. Specifically, the second housing 200 may include a mounting seat 210 for disposing the sensor 12 (refer to Figure 4A or Figure 4B ).

[0041] In some examples, referring to Figure 4A or Figure 4B , the mounting seat 210 may include a positioning seat 211. In some examples, the positioning seat 211 may be configured to position the sensor 12.

[0042] In some examples, the positioning seat 211 may have a through hole 2110 penetrating the second housing 200. The sensor 12 may be positioned in the second housing 200 through the through hole 2110. Thus, the sensor 12 can be fixed to the second housing 200.

[0043] In some examples, the through hole 2110 can be used to position the sensor 12. The sensor 12 can be disposed on the mounting seat 210 through the through hole 2110, and the sensor 12 can pass through this through hole 2110.

[0044] In some examples, the mounting seat 210 may include a base 212. In some examples, the base 212 may be configured to accommodate a conductive component 2120 electrically connected to the sensor 12. The sensor 12 can be electrically connected to the electronic module 120 through the conductive component 2120. Thus, the electronic module 120 can obtain the analyte information collected by the sensor 12.

[0045] In some examples, referring to Figure 4A or Figure 4B , the second housing 200 may have at least one hole 220 for positioning the second housing. In some examples, the second housing 200 can be held in the cartridge device 40 through the hole 220. In other words, the second housing 200 can be positioned in the cartridge device 40 through the hole 220. In this case, before the split medical device 10 is used, the second housing 200 can be positioned in a component (i.e., the cartridge device 40) for receiving the second housing 200 through the hole 220.

[0046] In some examples, the number of the holes 220 can be one. In some examples, the number of the holes 220 can be multiple. For example, the second housing 200 may have four positioning holes 220, and the four positioning holes 220 can be the hole 220a, the hole 220b, the hole 220c, and the hole 220d respectively. Thus, the hole 220a, the hole 220b, the hole 220c, and the hole 220d can position the second housing 200 more stably. In other words, the hole 220a, the hole 220b, the hole 220c, and the hole 220d can position the second housing 200 more stably in the cartridge device 40.

[0047] Figure 5A is a schematic structural diagram of the electronic component 100 involved in the example of the present disclosure from a first perspective. Figure 5B is a schematic structural diagram of the electronic component 100 involved in the example of the present disclosure from a second perspective.

[0048] In some examples, referring to Figure 5A or Figure 5B, in some examples, the electronic module 120 can be reused. In other words, the electronic module 120 can be utilized multiple times. The electronic module 120 can be disposed in the first housing 110. In this case, the electronic module 120 can be detachably assembled with the second housing 200 following the first housing 110.

[0049] In some examples, the electronic module 120 can be bonded to the first housing 110. Thereby, the stability of the electronic module 120 disposed in the first housing 110 can be improved.

[0050] In some examples, the electronic module 120 can receive the analyte information from the sensor 12, process the analyte information, and then send the processed analyte information to the smart device 30 in real time.

[0051] In some examples, the electronic module 120 can include a connection area 121 (see Figure 5A or Figure 5B ) electrically connected to the sensor 12. In some examples, when the first housing 110 is assembled to the second housing 200, the sensor 12 can be electrically connected to the connection area 121. Thereby, the split-type medical device 10 can obtain the analyte information. In some examples, the sensor 12 can be electrically connected to the connection area 121 through the conductive component 2120.

[0052] In some examples, the connection area 121 can have electrical contacts 1210 that can be electrically connected to the conductive component 2120. In this case, when the first housing 110 is assembled to the second housing 200, the electrical connection between the conductive component 2120 and the electrical contacts 1210 can achieve the electrical connection between the sensor 12 and the electronic module 120.

[0053] As described above, in some examples, the main body 11 can further include a separator 130 (see Figure 3 ). In some examples, the separator 130 can be used to seal the electronic module 120. Thereby, it can prevent and protect the electronic module 102 from being affected by undesired substances.

[0054] In some examples, the undesired substances can refer to water, sweat, dandruff, dust, etc.

[0055] In some examples, the separator 130 can be attached to the first housing 110. Thereby, it can prevent undesired substances from entering the position where the electronic module 120 is located from the junction between the separator 130 and the first housing 110. In some examples, the separator 130 can cover the electronic module 120. Thereby, the sealing of the electronic module 120 can be achieved.

[0056] In some examples, the spacer 130 can be elastic. In this case, after the first housing 110 and the second housing 200 are assembled, since the spacer 130 is elastic, it will produce a rebound effect after being squeezed, enabling the spacer 130 to fit more closely with the second housing 200, thereby enhancing the sealing effect of the split medical device 10.

[0057] In some examples, the spacer 130 can be sticky. For example, the spacer 130 can be a colloidal sticky component. In some examples, the spacer 130 can be adhered to the inner contour of the first housing 110. In this case, since the spacer 130 is adhered to the first housing 110, the part where the spacer 130 is in contact with the first housing 110 can fit closely, thereby preventing unwanted substances from infiltrating into the electronic module 120 from the above-mentioned contacting part.

[0058] In some examples, the spacer 130 can cover the surface of the electronic module 120 and be adhered to the inner contour of the first housing 110. Thereby, the sealing effect on the electronic module 120 can be enhanced. In addition, the assembly stability of the electronic module 120 can also be improved.

[0059] In some examples, the spacer 130 can have a groove portion 131 (see Figure 5A ). In some examples, the groove portion 131 can match the mounting seat 210. In some examples, the groove portion 131 matching the mounting seat 210 can mean that the mounting seat 210 can be received in the groove portion 131. In other words, the spacer 130 can have a groove portion 131 for receiving the mounting seat 210.

[0060] In some examples, when the first housing 110 is assembled to the second housing 200, the mounting seat 210 can be located in the groove portion 131 and the sensor 12 can be electrically connected to the electronic module 120 through the connection area 121. Thus, by positioning the mounting seat 210 in the groove portion 131, the conductive component 2110 (described later) provided on the mounting seat 210 can be electrically connected to the connection area 121 located in the groove portion 131.

[0061] In some examples, the spacer 130 can cover the electronic module 120 in such a way that the groove portion 131 exposes the connection area 121. In this case, when the first housing 110 is assembled to the second housing 200, the sensor 12 can be electrically connected to the connection area 121 through the conductive component 2120 received in the base 212, thereby enabling the split medical device 10 to obtain analyte information.

[0062] In some examples, the spacer 130 can have a functional surface 132 facing away from the electronic module 120 (see Figure 5A orFigure 5B )。In some examples, a protrusion 133 may be provided on the functional surface 132. In some examples, the protrusion 133 may surround the groove portion 131. In this case, through the cooperation of the protrusion 133 and the second housing 200, the groove portion 131 can be sealed, and thus the electronic module 120 can be sealed.

[0063] In some examples, when the first housing 110 is assembled to the second housing 200, the spacer 130 may be located between the second housing 200 and the first housing 110.

[0064] In some examples, when the first housing 110 is assembled to the second housing 200, the protrusion 133 may be deformed in the direction from the second housing 200 towards the first housing 110. In this case, the protrusion 133 surrounding the groove portion 131 will be squeezed by the second housing 200 and thus deformed, so that the spacer 130 can fit more closely to the second housing 200 when the first housing 110 is assembled to the second housing 200. Thus, the sealing of the groove portion 131 can be achieved, that is, the connection area 121 can be sealed, and the sealing effect of the electronic module 120 can be further improved.

[0065] Hereinafter, for the convenience of describing the present disclosure, the protrusion 133 surrounding the groove portion 131 is referred to as the first protrusion 133.

[0066] In some examples, let the protrusion 133 surrounding the groove portion 131 be referred to as the first protrusion 133.

[0067] In some examples, the groove portion 131 may be generally in the shape of a groove.

[0068] In some examples, the groove portion 131 may include a bottom plate 134 (see Figure 5A ). In some examples, the bottom plate 134 may have a through hole 1340 exposing the connection area 121 (see Figure 5A ). In other words, the through hole 1340 may penetrate the bottom plate 134. Thus, the connection area 121 can be exposed.

[0069] In some examples, the groove portion 131 may have a second protrusion 1341 surrounding the connection area 121 (see Figure 5A)。In some examples, when the first housing 110 is assembled to the second housing 200, the second protrusion 1341 may be deformed in the direction from the second housing 200 towards the first housing 110. In this case, when the first housing 110 is assembled to the second housing 200, the second protrusion 1341 is subjected to the extrusion force from the mounting seat 210 and thus deformed, so that the second protrusion 1341 can fit more closely to the mounting seat 210, enabling the connection area 121 to be in a sealed space. That is to say, through the mutual cooperation of the second protrusion 1341 and the mounting seat 210, the sealing effect of the connection area 121 can be improved, and thus the sealing effect of the electronic module 120 can be enhanced.

[0070] In some examples, the second protrusion 1341 may be formed on the bottom plate 134 in a manner surrounding the connection area 121.

[0071] In some examples, when the first housing 110 is assembled to the second housing 200, the base 212 may squeeze the second protrusion 1341, and the base 212 and the second protrusion 1341 may cooperate to form a sealed space. In this case, when the first housing 110 is assembled to the second housing 200, the second protrusion 1341 is subjected to the extrusion force from the base 212, and then the base 212 can fit closely to the second protrusion 1341 to form a sealed space for accommodating the conductive component 2120 and the connection area 121.

[0072] As described above, in some examples, the mounting seat 210 may include a positioning seat 211 and a base 212, and the positioning seat 211 may have a through hole 2110 penetrating the second housing 200, and the sensor 12 can be positioned in the second housing 200 through the through hole 2110. In this case, the sensor 12 can be disposed on the mounting seat 210 through the through hole 2110 of the positioning seat 211. When the first housing 110 is assembled to the second housing 200, the electrical connection between the sensor 12 and the electronic module 120 can be achieved through the electrical connection between the conductive component 2120 and the connection area 121. The through hole 2120 penetrates the second housing 200 at the position of the positioning seat 211. In other words, the through hole 2120 is independent of the sealed space. Thus, the unwanted substances entering the split medical device 10 through the through hole 2120 can be isolated from the sealed space, and further the protection effect on the electrical connection part of the split medical device 10 can be improved.

[0073] Hereinafter, for the convenience of describing the present disclosure, the groove portion 131 exposing the connection area 121 is referred to as the first groove portion 131. In other words, the groove portion 131 matching the mounting seat 210 can be defined as the first groove portion 131.

[0074] In some examples, the electronic component 100 may include a power supply module 140 (seeFigure 3 )。That is to say, the separable medical device 10 may include a power supply module 140.

[0075] In some examples, the power supply module 140 may be disposed in the spacer 130. In some examples, the spacer 130 may have a second groove portion 135 for accommodating the power supply module 140 (see Figure 5A ).

[0076] In some examples, the power supply module 140 may be configured to supply energy to the electronic module 120.

[0077] In some examples, the protrusion 133 may surround the first groove portion 131 and the second groove portion 135. That is to say, the first protrusion 133 may surround the first groove portion 131 and the second groove portion 135. In this case, the protrusion 133 surrounds the first groove portion 131 and the second groove portion 135. When the first housing 110 is assembled to the second housing 200, the protrusion 133 surrounding the first groove portion 131 and the second groove portion 135 will be squeezed by the second housing 200 and thus deformed. As a result, the spacer 130 can fit more closely to the second housing 200 when the first housing 110 is assembled to the second housing 200, and can seal the connection area 121 located in the first groove portion 131 and the power supply module 140 located in the second groove portion 135. Therefore, the sealing effect of the separable medical device 10 can be improved.

[0078] In some examples, a third protrusion 136 may be provided on the functional surface 132 (see Figure 5A ). In some examples, the third protrusion 136 may be configured to be connected to the first protrusion 133 and isolate the first groove portion 131 and the second groove portion 135. In this case, when the first housing 110 is assembled to the second housing 200, through the mutual cooperation of the first protrusion 133, the third protrusion 136 and the second housing 200, two independent sealed spaces respectively including the first groove portion 131 and the second groove portion 135 can be formed. Therefore, the connection area 121 and the mounting seat 310 located in the first groove portion 131 and the power supply module 140 located in the second groove portion 135 can be sealed respectively.

[0079] In some examples, the third protrusion 136 may be located within the closed shape formed by the first protrusion 133. In some examples, the third protrusion 136 may be connected to the first protrusion 133 to form two closed shapes. In some examples, the first groove portion 131 and the second groove portion 135 are respectively located within the two closed shapes. Thus, when the first housing 110 is assembled to the second housing 200, the first groove portion 131 and the second groove portion 135 can be located in different sealed spaces.

[0080] In some examples, in the direction in which the first housing 110 points to the second housing 200, the extension length of the third protrusion 136 may be the same as the extension length of the first protrusion 133. In this case, when the first housing 110 is assembled to the second housing 200, the second housing 200 can simultaneously exert a squeezing effect on the first protrusion 133 and the third protrusion 136, so that both the first protrusion 133 and the third protrusion 136 can closely fit against the second housing 200.

[0081] In some examples, the second housing 200 may have at least one hole 220 for positioning the second housing 200. In some examples, when the first housing 110 is assembled to the second housing 200, at least one hole 220 on the second housing 200 may be located on a side of the third protrusion 136 away from the second groove portion 135. In this case, since the hole 220 is located on the side of the third protrusion 136 away from the second groove portion 135, when the first housing 110 is assembled to the second housing 200, the hole 220 can be independent of the sealed space including the second groove portion 135, and thus isolate the undesired substances entering the split medical device 10 through the hole 220 from the sealed space including the second groove portion 135. Therefore, the sealing effect on the power module 140 can be improved. It should be noted that the statement that at least one hole 220 may be located on the side of the third protrusion 136 away from the second groove portion 135 means that all the holes 220 for positioning the second housing 200 are located on the side of the third protrusion 136 away from the second groove portion 135.

[0082] In some examples, at least one fourth protrusion 137 (see Figure 5A ) matching the at least one hole 220 may be provided on the functional surface 132. In this case, the fourth protrusion 137 can block the hole 220 and prevent undesired substances from entering the split medical device 10 along the hole 220. Therefore, the sealing effect of the split medical device 10 can be further improved.

[0083] In some examples, the shape of the fourth protrusion 137 may match the shape of the hole 220. For example, when the shape of the hole 220 is circular, the shape of the fourth protrusion 137 may also be circular.

[0084] In some examples, the radial dimension of the fourth protrusion 137 may not be less than the radial dimension of the hole 220. In some examples, the circumferential dimension of the fourth protrusion 137 may not be less than the circumferential dimension of the hole 220. Thereby, the probability of undesired substances entering the split medical device 10 can be reduced.

[0085] In some examples, the number of the fourth protrusions 137 may be the same as the number of the holes 220. For example, as described above, when the first housing 110 has holes 220a, 220b, 220c, and 220d, the spacer 130 may correspondingly be provided with fourth protrusions 137a, 137b, 137c, and 137d corresponding to the four holes 220.

[0086] In some examples, when the first housing 110 is assembled to the second housing 200, at least one of the fourth protrusions 137 may be squeezed and deformed in the direction from the second housing 200 towards the first housing 110. In this case, the fourth protrusion 137 can block the hole 220, preventing undesired substances from entering the split medical device 10 along the hole 220. Thus, the sealing effect of the split medical device 10 can be further improved.

[0087] Figure 6 FIG. is a flowchart showing a method for manufacturing the electronic component 100 according to the examples of the present disclosure.

[0088] In some examples, the electronic component 100 may include an electronic module 120, a spacer 130, and a first housing 110.

[0089] As described above, the present disclosure also relates to a method for manufacturing an electronic component 100 (hereinafter may be simply referred to as the manufacturing method). In some examples, the electronic component 100 obtained by the manufacturing method of the present disclosure may be the electronic component 100 of the split medical device 10 according to the first aspect of the present disclosure. In other words, the electronic component 100 obtained by the manufacturing method of the present disclosure may include the electronic module 120, the spacer 130, and the first housing 110 as described above.

[0090] In some examples, refer to Figure 6, the manufacturing method may include: preparing a first housing 110 provided with an electronic module 120 (step S100), coupling the first housing 110 with a mold having a preset shape (step S200), supplying an injection molding material with a preset temperature to the mold (step S300), waiting for the injection molding material to cool, removing the mold to obtain a spacer 130 (step S400), and obtaining an electronic component (step S500). In this case, for the electronic component 100 obtained by supplying the injection molding material to the mold, the spacer 130 therein can be tightly adhered to the first housing 110 and seal the electronic module 120 provided in the first housing 110. The preset shape of the mold matches the shape of the spacer 130, which can enable the injection molding material to form a spacer 130 with a desired structure after cooling. The structure of the spacer 130 can improve the sealing effect of the electronic component 100 after assembly; meanwhile, the spacer 130 can also play a role in stabilizing the various electronic components of the electronic module 120.

[0091] As described above, in some examples, in step S100, a first housing 110 provided with an electronic module 120 can be prepared. In some examples, the electronic module 120 can be placed inside the first housing 110. In some examples, the electronic module 120 can be adhered to the inside of the first housing 110.

[0092] In some examples, in step S200, the first housing 110 can be coupled with a mold having a preset shape. In some examples, the preset shape matches the shape of the spacer 130. In some examples, the inner contour of the mold can match the outer contour of the spacer 130. In this case, it can enable the injection molding material to form a spacer 130 with a desired structure after cooling, and the structure of the spacer 130 can improve the sealing effect of the electronic component 100 after assembly.

[0093] In some examples, the mold can have an injection port for supplying the injection molding material.

[0094] In some examples, in step S300, an injection molding material with a preset temperature can be supplied to the mold. In some examples, the preset temperature can be 150 degrees Celsius to 200 degrees Celsius. For example, the preset temperature can be 150 degrees Celsius, 160 degrees Celsius, 170 degrees Celsius, 180 degrees Celsius, 190 degrees Celsius, or 200 degrees Celsius, etc. In this case, during the injection molding process, the injection molding material with a lower temperature can be used to inject the mold, thereby further reducing the damage to the electronic component 100 during the injection molding process.

[0095] In some examples, the injection molding material may include silicone. In this case, the spacer 130 formed after the injection molding material cools can have high waterproofness and elasticity, thereby improving the sealing effect on the electronic module 120.

[0096] In some examples, the injection molding material may include silicone and a functional agent, and the functional agent may be an active agent for bonding between the silicone and the first housing 110. For example, the functional agent may be epoxy resin glue, neoprene glue, acrylic glue, polyurethane glue, etc.

[0097] In some examples, when the injection molding material includes silicone, the injection molding material can be supplied to the mold in a low-pressure manner. Low-pressure injection molding is a packaging process that injects the injection molding material into the mold using a relatively low injection pressure (generally between 0.15 megapascals and 4 megapascals, and megapascal is a unit of pressure). Thereby, the damage to the electronic component 100 during the injection molding process can be reduced.

[0098] In some examples, in step S400, the mold can be removed after the injection molding material cools to obtain the spacer 130.

[0099] In some examples, the injection molding material can be cooled at normal room temperature. In some examples, the injection molding material can solidify into a solid component after cooling. In some examples, the injection molding material will not adhere to the mold after cooling. Thereby, the mold can be easily removed.

[0100] In some examples, the spacer 130 can cover the electronic module 120. Thereby, the sealing of the electronic module 120 can be achieved.

[0101] In some examples, the spacer 130 can cover the electronic module 120 in such a way that the connection area 121 where the electronic module 120 needs to be electrically connected to the sensor 12 is exposed. Thereby, the sensor 12 can be electrically connected to the connection area 121, and further, the split-type medical device 10 can obtain analyte information, and the electronic module 120 can obtain analyte information through the electrical connection.

[0102] In some examples, the hardness of the injection molding material after curing can be 10 degrees to 60 degrees. For example, the hardness can be 10 degrees, 15 degrees, 30 degrees, 45 degrees, or 60 degrees. In this case, the spacer 130 can have high elasticity.

[0103] Generally speaking, the physical unit of the hardness of silicone after curing is Shore hardness. Shore hardness can be used to characterize the softness and hardness of materials. The smaller the hardness, the softer the material. Silicone with a hardness of 10 degrees has a relatively soft elasticity, can be easily squeezed and produce a rebounding effect, and can play a good sealing role. Silicone with a hardness of 60 degrees also has elasticity, can be squeezed and produce a rebounding effect. Compared with silicone with a lower hardness, it also has the characteristics of being more firm and less prone to wear.

[0104] In some examples, in step S500, the electronic component 100 can be obtained. In some examples, the spacer 130 in the obtained electronic component 100 can seal the electronic module 120. In some examples, the electronic component 100 can be assembled with the second housing 200 and applied to the target.

[0105] In some examples, the electronic component 100 may further include a power module 140. In some examples, after the injection molding material is cured to obtain the spacer 130, the power module 140 can be installed in the second groove portion 135. In some examples, the power module 140 may include a battery compartment 141 and a battery 142 (see Figure 3 ).

[0106] In the split-type medical device 10 involved in the present disclosure, the spacer 130 fits on the first housing 110 and partially covers the electronic module 120, and can initially seal the electronic module 120. And because the spacer 130 has a groove portion 131 for exposing the connection area 121 and matching with the mounting seat 210 for setting the sensor 12, when the first housing 110 is assembled to the second housing 200, the sensor 12 can be electrically connected to the connection area 121, and thus the split-type medical device 10 can obtain analyte information; in addition, because the spacer 130 has a protrusion 133 surrounding the groove portion 131, when the first housing 110 is assembled to the second housing 200, the protrusion 133 surrounding the groove portion 131 will be squeezed by the second housing 200 and thus deformed, so that the spacer 130 can fit more closely to the second housing 200 when the first housing 110 is assembled to the second housing 200. Thus, the sealing of the groove portion 131 can be achieved, that is, the connection area 121 can be sealed, and the sealing effect on the electronic module 120 can be further improved.

[0107] In addition, through the preparation method of the involved electronic component 100, the first housing 110 and the spacer 130 can be tightly bonded, and the structure of the spacer 130 can improve the sealing effect of the electronic component 100 after assembly; at the same time, the spacer 130 can also play a role in stabilizing the various electronic components of the electronic module 120.

[0108] Although the present disclosure has been specifically described above in conjunction with the accompanying drawings and embodiments, it is to be understood that the above description does not limit the present disclosure in any way. Those skilled in the art may make modifications and variations to the present disclosure as needed without departing from the essence and scope of the present disclosure, and these modifications and variations all fall within the scope of the present disclosure.

Claims

1. A split-type medical device, characterized in that, The split-type medical device includes a first housing, an electronic module and a spacer disposed in the first housing, a second housing detachably assembled with the first housing, and a sensor disposed in the second housing. The second housing includes a mounting seat for disposing a sensor that can be placed subcutaneously. The spacer has a groove-shaped portion matching the mounting seat and a functional surface facing away from the electronic module, and a protrusion surrounding the groove-shaped portion is provided on the functional surface. The electronic module includes a connection area for electrically connecting with the sensor, and the spacer is configured to fit on the first housing and cover the electronic module in such a way that the connection area is exposed by the groove-shaped portion. When the first housing is assembled to the second housing, the spacer is located between the second housing and the first housing, and the protrusion deforms in the direction from the second housing to the first housing, and the mounting seat is located in the groove-shaped portion and the sensor is electrically connected to the electronic module through the connection area.

2. The split-type medical device according to claim 1, wherein Let the protrusion surrounding the groove-shaped portion be the first protrusion, and the groove-shaped portion has a second protrusion surrounding the connection area. When the first housing is assembled to the second housing, the second protrusion deforms in the direction from the second housing to the first housing.

3. The split-type medical device according to claim 1 or 2, characterized in that, The split-type medical device includes a power module configured to supply energy to the electronic module. Let the groove-shaped portion matching the mounting seat be the first groove-shaped portion, and the spacer has a second groove-shaped portion configured to accommodate the power module, and the protrusion surrounds the first groove-shaped portion and the second groove-shaped portion.

4. The split-type medical device according to claim 3, wherein Let the protrusion surrounding the groove-shaped portion be the first protrusion, and a third protrusion connected to the first protrusion and configured to isolate the first groove-shaped portion and the second groove-shaped portion is provided on the functional surface. In the direction from the first housing to the second housing, the extension length of the third protrusion is the same as that of the first protrusion.

5. The split-type medical device according to claim 2, wherein, The mounting seat includes a positioning seat and a base. The positioning seat has a through hole penetrating the second housing, and the sensor is positioned in the second housing through the through hole. The base is configured to accommodate a conductive component electrically connected to the sensor, and the sensor is electrically connected to the connection area through the conductive component. When the first housing is assembled to the second housing, the base presses the second protrusion, and the base and the second protrusion cooperate to form a sealed space.

6. The split-type medical device according to claim 4, wherein, The second housing has at least one hole for positioning the second housing. When the first housing is assembled to the second housing, the at least one hole is located on a side of the third protrusion away from the second groove-shaped portion.

7. The split-type medical device according to claim 6, characterized in that, At least one fourth protrusion matching the at least one hole is provided on the functional surface. When the first housing is assembled to the second housing, the at least one fourth protrusion deforms in the direction from the second housing to the first housing.

8. The split-type medical device according to claim 1, wherein, The spacer is elastic and the spacer is bonded to the inner contour of the first housing.

9. A method for preparing an electronic component, characterized in that The electronic component includes an electronic module, a spacer, and a first housing as described in any one of claims 1 to 8, and the method for manufacturing the electronic component includes: Preparing the first housing provided with the electronic module; Coupling the first housing with a mold having a preset shape, the preset shape matching the shape of the spacer; Supplying an injection molding material having a preset temperature to the mold; Removing the mold after the injection molding material cools to obtain the spacer; and Obtaining the electronic component.

10. The method for preparing an electronic component according to claim 9, characterized in that, The injection molding material includes silicone.

11. The method for preparing an electronic component according to claim 9, wherein, The preset temperature is 150 degrees Celsius to 200 degrees Celsius.

12. The method for preparing an electronic component according to claim 9, wherein, The hardness of the injection molding material after curing is 10 degrees to 60 degrees.

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