Automatic processing equipment for semiconductor chip

Abstract

The invention discloses automatic processing equipment for semiconductor chips, which is used for feeding of material pipes and comprises a horizontally arranged material conveying bottom plate, a left baffle plate vertically mounted on one side of the material conveying bottom plate, a right baffle plate vertically mounted on the other side of the material conveying bottom plate and a material bin arranged above the rear end of the material conveying bottom plate, a left belt and a right belt which can move forwards synchronously are installed on the material conveying bottom plate, a rotating shaft is rotatably installed between the left baffle and the right baffle and located above the ends, close to the stock bin, of the left belt and the right belt, and the rotating shaft is sleeved with a plurality of material scattering wheels arranged at intervals in the length direction of the rotating shaft. At least two guide through holes are formed in the lower end of the guide plate and located between the left belt and the right belt at intervals, and a push block capable of moving front and back is arranged in each guide through hole. On the basis that continuous feeding of the material pipes is achieved, the material pipes can be arranged one by one, normal conveying of the material pipes is not affected, and meanwhile the stuck state caused by mutual stacking and squeezing of the material pipes is broken through.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to an automated processing device for semiconductor chips. Background Art

[0002] After the material tubes are poured into the silo, current semiconductor packaging equipment needs to arrange them and then transport them to the workstations of subsequent processes. However, the existing technology cannot arrange several material tubes one by one after they are poured into the silo. Several material tubes are prone to stacking and squeezing, resulting in a stuck state. Usually, the equipment needs to be shut down and manually handled, which not only affects the continuity of material feeding, but also affects the normal transportation of the material tubes. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide an automated processing equipment for semiconductor chips. The automated processing equipment for semiconductor chips can arrange the material tubes one by one on the basis of realizing continuous loading of the material tubes, and at the same time break the stuck state caused by the stacking and squeezing of the material tubes without affecting the normal transportation of the material tubes.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: an automated processing equipment for semiconductor chips, used for loading material tubes, comprising: a horizontally arranged material transport base plate, a left baffle plate vertically installed on one side of the material transport base plate, a right baffle plate vertically installed on the other side of the material transport base plate, and a material bin arranged above the rear end of the material transport base plate, the material bin is installed between the rear ends of the left baffle plate and the right baffle plate, a left belt and a right belt that can move forward synchronously are installed on the material transport base plate, and the upper surfaces of the left belt and the right belt that are arranged in parallel and at intervals are respectively used to overlap and contact with the lower surface of one end of the material tube, so that The material conveying bottom plate is also equipped with a second left belt and a second right belt in the same extension direction as the left belt and the right belt. The upper surfaces of the second left belt and the second right belt, which are arranged in parallel and at intervals, are respectively used for overlapping contact with the lower surface of the material tube. The rear ends of the second left belt and the second right belt are respectively located between the front ends of the left belt and the right belt, so that the second left belt and the second right belt partially overlap with the left belt and the right belt in the front-to-back direction. The left belt and the right belt are both connected to a driving assembly in transmission connection, and the second left belt and the second right belt are both connected to another driving assembly in transmission connection; The lower end of the material guiding plate of the inclined silo is located directly above the left belt and the right belt and is arranged close to the left belt and the right belt. The upper end of the material guiding plate extends away from the left belt and the right belt. A rotating shaft is rotatably installed between the left baffle and the right baffle and above the ends of the left belt and the right belt close to the silo. One end of the rotating shaft passes through the left baffle or the right baffle and is connected to the output shaft of a motor. A plurality of material dredging wheels are sleeved on the rotating shaft and arranged at intervals along its length direction. The rotating direction of the material dredging wheels that can rotate with the rotating shaft is opposite to the moving direction of the left belt and the right belt. The height difference between the material dredging wheels and the left belt and the right belt in the vertical direction is equal to or slightly larger than the thickness of the material pipe; At least two guiding through holes are spaced apart between the lower ends of the material guiding plates and located between the left belt and the right belt. A push block that can move back and forth is arranged in each guiding through hole. The rear end of the push block is connected to the piston rod of a cylinder through a connecting plate. The front end of the push block extends towards the material dredging wheel and reaches between the left belt and the right belt. The upper surface of the front end of the push block is an inclined surface, and the front end of this inclined surface is lower than its rear end. The front end of the inclined surface on the push block is flush with or lower than the upper surfaces of the left belt and the right belt.

[0005] The further improved solutions in the above technical solutions are as follows: 1. In the above solution, a transmission module is arranged between the left baffle and the right baffle and above the material conveying bottom plate. A support plate is installed on the movable part of the transmission module that can move back and forth. Two sensors are installed at both ends of the support plate extending left and right. The two sensors with their sensing ends facing downwards are used to detect whether the material pipes on the belt are inclined. Two vertical cylinders are installed on the support plate at intervals. A material pushing plate extending left and right is respectively connected to the lower ends of the piston rods of the two vertical cylinders. When the piston rods of the two vertical cylinders that synchronously expand and contract are both in the extended state, the lower part of the material pushing plate can be inserted between two adjacent material pipes.

[0006] 2. In the above solution, the sensor is a fiber optic sensor.

[0007] 3. In the above solution, the horizontal part of the L-shaped support plate is installed on the movable part of the transmission module, and the sensor and the vertical cylinder are both installed on the vertical part of the support plate.

[0008] 4. In the above solution, the vertically arranged material pushing plate and the piston rods of the two vertical cylinders are respectively connected through a mounting seat.

[0009] 5. In the above solution, at least one sensing piece is arranged on the material pushing plate, and a sensor that cooperates with the sensing piece is arranged on the support plate. When the piston rod of the vertical cylinder is in the extended state and the contracted state, the sensor generates different sensing signals respectively.

[0010] 6. In the above solution, an L-shaped pressing plate is provided between the left baffle and the left belt, and between the right baffle and the right belt. The vertical part of the L-shaped pressing plate is installed on the left baffle or the right baffle. The lower surface of the horizontal part of the L-shaped pressing plate is higher than the upper surfaces of the left belt and the right belt, and there is a spacing between the upper surface of one end of the material pipe in contact with the lower surface of the horizontal part of the L-shaped pressing plate by lapping with the upper surfaces of the left belt and the right belt and the horizontal part of the L-shaped pressing plate directly above it, and this spacing is smaller than the thickness of the material pipe.

[0011] 7. In the above solution, the cylinder is installed on the lower surface of the material transporting bottom plate.

[0012] 8. In the above solution, the driving assembly further includes: a motor installed on the lower surface of the material transporting bottom plate, a driving wheel installed on the output shaft of the motor, and a driven wheel drivingly connected to the driving wheel through a synchronous belt. The driven wheel is sleeved on a synchronous shaft extending left and right. A left driving wheel drivingly connected to the left belt or the second left belt is installed at the left end of the synchronous shaft rotatably installed on the lower surface of the material transporting bottom plate, and a right driving wheel drivingly connected to the right belt or the second right belt is installed at the right end of the synchronous shaft.

[0013] 9. In the above solution, a flexible rubber layer is coated on the outer circumferential surface of the material dredging wheel.

[0014] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The automatic processing equipment for semiconductor chips of the present invention can, on the basis of continuously feeding the material pipes through the belt, arrange multiple material pipes from the material bin on the belt one by one through the material dredging wheel rotating in the opposite direction to the belt, which is convenient for the transportation of the material pipes and various subsequent operations. Also, through the reverse movement of the left belt, right belt and the second left belt, second right belt in a short time and the vibration generated by the forward and backward movement of the push block, while not affecting the normal transportation of the material pipes at the front end, it breaks the stuck state caused by the mutual stacking and extrusion between the rear end guide plate and the belt connection and between the belt and the material dredging wheel, improving the stability, smoothness and continuity of the material pipe feeding.

[0015] 2. The automatic processing equipment for semiconductor chips of the present invention can continuously and cyclically detect the arrangement of multiple material pipes on the belt to identify the inclined material pipes, and then correct the inclination by pushing the inclined material pipes with the downward moving material deflecting plate, thereby ensuring the position accuracy and stability of the material pipes during transportation, effectively avoiding the situation of mutual extrusion deformation or material scattering of the material pipes during transportation, and also avoiding interfering with the material pipes and protecting the material pipes from damage by the contraction of the material deflecting plate. Description of the Drawings

[0016] AppendixFigure 1 It is a schematic diagram of the overall structure of the automatic processing equipment for the semiconductor chip of the present invention; Appendix Figure 2 It is a schematic diagram of the partial structure of the automatic processing equipment for the semiconductor chip of the present invention Figure 1 ; Appendix Figure 3 It is a schematic diagram of the structure of the driving component of the automatic processing equipment for the semiconductor chip of the present invention; Appendix Figure 4 It is a schematic diagram of the structure of the push block of the automatic processing equipment for the semiconductor chip of the present invention; Appendix Figure 5 It is a schematic diagram of the partial structure of the automatic processing equipment for the semiconductor chip of the present invention Figure 2 ; Appendix Figure 6 It is for the present invention appendix Figure 5 The schematic cross-sectional structure diagram; Appendix Figure 7 It is a schematic diagram of the partial structure of the automatic processing equipment for the semiconductor chip of the present invention Figure 3 ; Appendix Figure 8 It is for appendix Figure 7 The enlarged schematic diagram at position A in;

[0017] In the above drawings: 100, material pipe; 1, transmission module; 101, movable part; 2, support plate; 201, horizontal part; 202, vertical part; 3, sensor; 4, vertical cylinder; 401, mounting seat; 5, material pushing plate; 501, strip hole; 6, bridge; 7, bolt; 81, induction piece; 82, inductor; 91, left baffle; 92, right baffle; 11, material transporting bottom plate; 12, left belt; 13, right belt; 14, second left belt; 15, second right belt; 161, motor; 162, driving wheel; 163, synchronous belt; 164, driven wheel; 165, synchronous shaft; 166, left transmission wheel; 167, right transmission wheel; 168, bearing seat; 171, belt pulley; 172, wheel seat; 18, avoidance through hole; 19, material bin; 191, material guiding plate; 20, L-shaped pressing plate; 21, vertical part; 22, horizontal part; 23, rotating shaft; 231, bearing seat; 24, motor; 25, material dredging wheel; 251, flexible rubber layer; 26, spacer sleeve; 27, guiding through hole; 28, push block; 29, connecting plate; 30, cylinder. Embodiment

[0018] The present patent can be further clearly understood through the following specific embodiments, but they do not limit the present patent.

[0019] Embodiment 1: An automated processing device for semiconductor chips, used for loading a material tube 100, comprising: a horizontally arranged material transport base plate 11, a left baffle plate 91 vertically installed on one side of the material transport base plate 11, a right baffle plate 92 vertically installed on the other side of the material transport base plate 11, and a material bin 19 arranged above the rear end of the material transport base plate 11, wherein the material bin 19 is installed between the rear ends of the left baffle plate 91 and the right baffle plate 92, and the material transport base plate 11 is provided with a left belt 12 and a right belt 13 which can move forward synchronously, and the upper surfaces of the left belt 12 and the right belt 13 which are arranged in parallel and at intervals are respectively used to overlap and contact with the lower surface of one end of the material tube 100, and the material transport base plate 11 is also provided with a There are a second left belt 14 and a second right belt 15 which are in the same extension direction as the left belt 12 and the right belt 13. The upper surfaces of the second left belt 14 and the second right belt 15 which are arranged in parallel and at intervals are used to overlap and contact with the lower surface of the material tube 100. The rear ends of the second left belt 14 and the second right belt 15 are located between the front ends of the left belt 12 and the right belt 13, so that the second left belt 14 and the second right belt 15 partially overlap with the left belt 12 and the right belt 13 in the front-to-back direction. The left belt 12 and the right belt 13 are both connected to a driving assembly in a transmission manner, and the second left belt 14 and the second right belt 15 are both connected to another driving assembly in a transmission manner. The lower end of the guide plate 191 of the inclined material bin 19 is located directly above the left belt 12 and the right belt 13 and is arranged close to the left belt 12 and the right belt 13. The upper end of the guide plate 191 extends away from the left belt 12 and the right belt 13. A rotating shaft 23 is rotatably installed between the left baffle plate 91 and the right baffle plate 92 and located above the left belt 12 and the right belt 13 near one end of the material bin 19. One end of the rotating shaft 23 passes through the left baffle plate 91 or the right baffle plate 92 and is connected to the output shaft of a second motor 24. A plurality of material dispersing wheels 25 arranged at intervals along the length direction thereof are mounted on the rotating shaft 23. The rotating direction of the material dispersing wheel 25 that can rotate with the rotating shaft 23 is opposite to the moving direction of the left belt 12 and the right belt 13. The height difference between the material dispersing wheel 25 and the left belt 12 and the right belt 13 in the vertical direction is equal to or slightly greater than the thickness of the material tube 100. The lower end of the guide plate 191 is located between the left belt 12 and the right belt 13 and is provided with at least two guide holes 27 at intervals. A push block 28 that can move forward and backward is provided in each of the guide holes 27. The rear end of the push block 28 is connected to the piston rod of a cylinder 30 through a connecting plate 29. The front end of the push block 28 extends toward the material dispersing wheel 25 to between the left belt 12 and the right belt 13. The upper surface of the front end of the push block 28 is an inclined surface, and the front end of the inclined surface is lower than its rear end. The front end of the inclined surface on the push block 28 is flush with the upper surface of the left belt 12 and the right belt 13 or lower than the upper surface of the left belt 12 and the right belt 13.

[0020] A transmission module 1 is arranged between the above-mentioned left baffle 91 and right baffle 92 and above the material conveying bottom plate 11. A support plate 2 is installed on the movable part 101 of the transmission module 1 that can move back and forth. Sensors 3 are installed at both ends of the support plate 2 extending left and right. The two sensors 3 with their sensing ends all facing downwards are used to detect whether the material pipes 100 on the belt are tilted. Two vertical cylinders 4 are installed on the support plate 2 at intervals. A material pushing plate 5 extending left and right is respectively connected to the lower ends of the piston rods of the two vertical cylinders 4. When the piston rods of the two vertical cylinders 4 that synchronously expand and contract are both in the extended state, the lower part of the material pushing plate 5 can be inserted between two adjacent material pipes 100.

[0021] The above-mentioned sensor 3 is a fiber optic sensor.

[0022] A bridge 6 is spanned between the upper surfaces of the above-mentioned left baffle 91 and right baffle 92. The transmission module 1 is fixedly installed on this bridge 6.

[0023] The horizontal part 201 of the above-mentioned L-shaped support plate 2 is installed on the movable part 101 of the transmission module 1. The sensors 3 and vertical cylinders 4 are both installed on the vertical part 202 of the support plate 2.

[0024] The above-mentioned two sensors 3 are respectively located on the left side of the left belt 12 and the right side of the right belt 13.

[0025] One end of the above-mentioned material pushing plate 5 extends above the left belt 12, and the other end extends above the right belt 13.

[0026] The above-mentioned vertically arranged material pushing plate 5 and the piston rods of the two vertical cylinders 4 are respectively connected through a mounting seat 401.

[0027] Two strip-shaped holes 501 corresponding to the mounting seat 401 are formed on the above-mentioned material pushing plate 5. A bolt 7 passes through the vertically extending strip-shaped holes 501 and is connected to the mounting seat 401.

[0028] At least one sensing piece 81 is arranged on the above-mentioned material pushing plate 5, and a sensor 82 cooperating with the sensing piece 81 is arranged on the support plate 2. When the piston rod of the vertical cylinder 4 is in the extended state and the contracted state, the sensor 82 generates different sensing signals respectively.

[0029] The above-mentioned sensing pieces 81 and sensors 82 are both provided with two. Each sensor 82 is installed on the side of the vertical cylinder 4 opposite to the sensor 3.

[0030] A L-shaped pressing plate 20 is respectively arranged between the above-mentioned left baffle 91 and the left belt 12, and between the right baffle 92 and the right belt 13. The vertical portion 21 of the L-shaped pressing plate 20 is installed on the left baffle 91. The lower surface of the horizontal portion 22 of the L-shaped pressing plate 20 is higher than the upper surfaces of the left belt 12 and the right belt 13, and there is a spacing between the upper surface of one end of the material pipe 100 where the lower surface is in lap contact with the upper surfaces of the left belt 12 and the right belt 13 and the horizontal portion 22 of the L-shaped pressing plate 20 located directly above it, and this spacing is smaller than the thickness of the material pipe 100.

[0031] The above-mentioned air cylinder 30 is installed on the lower surface of the material transporting bottom plate 11.

[0032] The above-mentioned driving assembly further includes: a first motor 161 installed on the lower surface of the material transporting bottom plate 11, a driving wheel 162 installed on the output shaft of the first motor 161, and a driven wheel 164 drivingly connected to the driving wheel 162 through a synchronous belt 163. The driven wheel 164 is sleeved on a synchronous shaft 165 extending left and right. A left driving wheel 166 drivingly connected to the left belt 12 or the second left belt 14 is installed at the left end of the synchronous shaft 165 rotatably installed on the lower surface of the material transporting bottom plate 11. A right driving wheel 167 drivingly connected to the right belt 13 or the second right belt 15 is installed at the right end of the synchronous shaft 165.

[0033] A flexible rubber layer 251 is coated on the outer circumferential surface of the above-mentioned material dredging wheel 25.

[0034] Embodiment 2: An automatic processing device for semiconductor chips, used for loading the material pipe 100, including: a horizontally arranged material transporting bottom plate 11, a left baffle 91 vertically installed on one side of the material transporting bottom plate 11, a right baffle 92 vertically installed on the other side of the material transporting bottom plate 11, and a material bin 19 arranged above the rear end of the material transporting bottom plate 11. The material bin 19 is installed between the rear ends of the left baffle 91 and the right baffle 92. Left belts 12 and right belts 13 that can move forward synchronously are installed on the material transporting bottom plate 11. The upper surfaces of the parallel and spaced left belts 12 and right belts 13 are respectively used for lap contact with the lower surface of one end of the material pipe 100. Second left belts 14 and second right belts 15 extending in the same direction as the left belts 12 and the right belts 13 are also installed on the material transporting bottom plate 11. The upper surfaces of the parallel and spaced second left belts 14 and second right belts 15 are both used for lap contact with the lower surface of the material pipe 100. The rear ends of the second left belts 14 and the second right belts 15 are respectively located between the front ends of the left belts 12 and the right belts 13, so that the second left belts 14 and the second right belts 15 partially overlap with the left belts 12 and the right belts 13 in the front-rear direction. Both the left belts 12 and the right belts 13 are drivingly connected to a driving assembly, and both the second left belts 14 and the second right belts 15 are drivingly connected to another driving assembly; The lower end of the material guide plate 191 of the inclined silo 19 is located directly above the left belt 12 and the right belt 13 and is arranged close to the left belt 12 and the right belt 13. The upper end of the material guide plate 191 extends away from the left belt 12 and the right belt 13. Between the left baffle 91 and the right baffle 92 and above the end of the left belt 12 and the right belt 13 close to the silo 19, a rotating shaft 23 is rotatably installed. One end of the rotating shaft 23 passes through the left baffle 91 or the right baffle 92 and is connected to the output shaft of a second motor 24. A plurality of material dredging wheels 25 arranged at intervals along its length are sleeved on the rotating shaft 23. The rotating direction of the material dredging wheels 25 that can rotate with the rotating shaft 23 is opposite to the moving direction of the left belt 12 and the right belt 13. The height difference between the material dredging wheels 25 and the left belt 12 and the right belt 13 in the vertical direction is equal to or slightly greater than the thickness of the material pipe 100; At least two guiding through holes 27 are spaced apart between the lower ends of the material guide plate 191 and located between the left belt 12 and the right belt 13. A push block 28 that can move back and forth is arranged in each guiding through hole 27. The rear end of the push block 28 is connected to the piston rod of a cylinder 30 through a connecting plate 29. The front end of the push block 28 extends towards the material dredging wheels 25 to between the left belt 12 and the right belt 13. The upper surface of the front end of the push block 28 is an inclined surface, and the front end of this inclined surface is lower than its rear end. The front end of the inclined surface on the push block 28 is flush with or lower than the upper surfaces of the left belt 12 and the right belt 13.

[0035] The above-mentioned cylinder 30 is installed on the lower surface of the material transporting bottom plate 11.

[0036] The vertical part of the above-mentioned L-shaped connecting plate 29 is connected to the piston rod of the cylinder 30, and one end of the push block 28 is installed on the upper surface of the horizontal part of the connecting plate 29.

[0037] The inclined surface on the above-mentioned push block 28 is an arc-shaped inclined surface.

[0038] The inclination angle of the inclined surface on the above-mentioned push block 28 is the same as that of the material guide plate 191.

[0039] The above-mentioned driving assembly further includes: a first motor 161 installed on the lower surface of the material transporting bottom plate 11, a driving wheel 162 installed on the output shaft of the first motor 161, and a driven wheel 164 drivingly connected to the driving wheel 162 through a synchronous belt 163. The driven wheel 164 is sleeved on a synchronizing shaft 165 extending left and right. The left end of the synchronizing shaft 165 rotatably installed on the lower surface of the material transporting bottom plate 11 is installed with a left driving wheel 166 drivingly connected to the left belt 12 or the second left belt 14. The right end of the synchronizing shaft 165 is installed with a right driving wheel 167 drivingly connected to the right belt 13 or the second right belt 15.

[0040] The synchronous shaft 165 is mounted on the material transporting bottom plate 11 via at least two first bearing seats 168 spaced apart from each other.

[0041] Both ends of the left belt 12, the right belt 13, the second left belt 14, and the second right belt 15 are respectively matched with a pulley 171 for transmission. Each of the pulleys 171 is rotatably mounted on the lower surface of the material transport base plate 11 through a wheel seat 172. A plurality of avoidance holes 18 corresponding to the pulleys 171 are provided on the material transport base plate 11. The circumferential surface of the upper part of each of the pulleys 171 passing through the avoidance holes 18 is higher than the upper surface of the material transport base plate 11, so that the left belt 12, the right belt 13, the second left belt 14, and the second right belt 15 that are transmission-connected between the two pulleys 171 are spaced apart from the upper surface of the material transport base plate 11.

[0042] The outer circumferential surface of the sparse material wheel 25 is coated with a flexible rubber layer 251 .

[0043] One end of the rotating shaft 23 passes through the left baffle 91 and is connected to the output shaft of the second motor 24 mounted on the left baffle 91 , and the other end of the rotating shaft 23 is rotatably mounted on the right baffle 92 via a second bearing seat 231 .

[0044] A spacer sleeve 26 is mounted outside the rotating shaft 23 and between adjacent sparse material wheels 25 .

[0045] The working principle of the present invention is as follows: It can be used in various semiconductor packaging and automation equipment that use material tubes to transport materials, such as plugging machines, feeders, die bonding machines, etc. When in use, multiple material tubes are put into the silo at the same time. The material tubes slide down to the left and right belts along with the material guide plate of the silo and move forward under the transmission of the belts. When the material tubes stacked in the vertical direction move below the sparse material wheel, the material tubes located below move forward under the action of the belt, and the material tubes above move backward under the action of the sparse material wheel, thereby separating the stacked material tubes, so that the material tubes passing through the sparse material wheel are arranged one by one on the belt and move forward with the conveying of the belt; In the process of the material pipes moving forward one by one, the two sensors collect the positions of each material pipe in real time through the reciprocating movement in the material pipe conveying direction, so as to quickly determine the inclination of the material pipe (specifically, it can be determined by detecting the distance between two adjacent material pipes at both ends. If the difference between the distance between two adjacent material pipes at one end and the distance at the other end exceeds the set threshold, it means that the inclination of the material pipe is too large and needs to be corrected). In this process, the two vertical cylinders remain in a retracted state to avoid interference and damage to the material pipe by the material shifting plate; When the two sensors identify a material tube whose tilt exceeds the set threshold, the material stripper plate is moved between the material tube that is moving forward and the material tube in front of it, and the material stripper plate is driven to move down between the two material tubes by the extension of the two vertical cylinders. The material stripper plate is then driven by the transmission module to push the material tube in the opposite direction of the material feeding direction, and the material tube whose tilt exceeds the set threshold and the material tube behind it are pushed in the direction of the incoming material, thereby realizing the correction of the position of the material tube; Under normal circumstances, the cylinder remains in an extended or contracted state; however, during the above-mentioned process of conveying and calibrating the material tube, the connection between the lower end of the guide plate and the belt and between the belt and the sparse material wheel is often prone to jamming due to the stacking of the material tubes, which generally requires manual processing; The present application achieves vibration by coordinating the forward and backward movement of the push block with the reverse movement of the left belt and the right belt in a short period of time with the second left belt and the second right belt. That is, at set time intervals or when the belt is stuck and cannot be fed normally, the cylinder drives the push block to move back and forth multiple times to produce extrusion and vibration on the accumulated material pipes. At the same time, the left belt and the right belt are driven to move in the opposite direction of the conveying direction, thereby breaking the stuck state caused by excessive accumulation of material pipes at the connection between the guide plate and the belt, thereby improving the stability, smoothness and continuity of feeding the material pipes.

[0046] When the above-mentioned automated processing equipment for semiconductor chips is used, on the basis of realizing continuous feeding of material tubes through belts, multiple material tubes from the material bin can be arranged one by one on the belts through the material dispersing wheel rotating in the opposite direction to the belts, so as to facilitate the transportation of the material tubes and various subsequent operations. The left belt and the right belt can cooperate with the vibration generated by the forward and backward movement of the push block in a short period of time in conjunction with the reverse movement of the second left belt and the second right belt, without affecting the normal transportation of the material tubes at the front end, and the stuck state caused by the mutual stacking and squeezing of the material tubes at the connection between the rear end material guide plate and the belt and between the belt and the material dispersing wheel can be broken, thereby improving the stability, smoothness and continuity of feeding the material tubes. In addition, the arrangement of multiple material tubes on the belt can be detected in real time and cyclically to identify the tilted material tubes, and then the tilted material tubes can be corrected by pushing the tilted material tubes through the downward moving material stripping plate, so as to ensure the position accuracy and stability of the material tubes during transportation, and effectively avoid the mutual squeezing deformation or material spilling of the material tubes during transportation, and the contraction of the material stripping plate can avoid interference with the material tubes and protect the material tubes from damage.

[0047] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An automated processing device for a semiconductor chip, used for loading a material tube (100), comprising: A horizontally arranged material transport base plate (11), a left baffle plate (91) vertically installed on one side of the material transport base plate (11), a right baffle plate (92) vertically installed on the other side of the material transport base plate (11), and a material bin (19) arranged above the rear end of the material transport base plate (11), wherein the material bin (19) is installed between the rear ends of the left baffle plate (91) and the right baffle plate (92), and the material transport base plate (11) is provided with a left belt (12) and a right belt (13) which can move forward synchronously, and the upper surfaces of the left belt (12) and the right belt (13) which are arranged in parallel and at intervals are respectively used for overlapping contact with the lower surface of one end of the material pipe (100), characterized in that: the material transport base plate (11) is also provided with a left belt (12) and a right belt (13) which can move forward synchronously, and the left belt (12) and the right belt (13) which are arranged in parallel and at intervals are respectively used for overlapping contact with the lower surface of one end of the material pipe (100), characterized in that: A second left belt (14) and a second right belt (15) extending in the same direction, the upper surfaces of the second left belt (14) and the second right belt (15) being arranged in parallel and at intervals are used to overlap and contact with the lower surface of the material tube (100), the rear ends of the second left belt (14) and the second right belt (15) are located between the front ends of the left belt (12) and the right belt (13), so that the second left belt (14) and the second right belt (15) partially overlap with the left belt (12) and the right belt (13) in the front-to-back direction, the left belt (12) and the right belt (13) are both connected to a driving assembly, and the second left belt (14) and the second right belt (15) are both connected to another driving assembly; The lower end of the guide plate (191) of the inclined material bin (19) is located directly above the left belt (12) and the right belt (13) and is arranged close to the left belt (12) and the right belt (13); the upper end of the guide plate (191) extends in a direction away from the left belt (12) and the right belt (13); a rotating shaft (23) is rotatably installed between the left baffle plate (91) and the right baffle plate (92) and located above one end of the left belt (12) and the right belt (13) close to the material bin (19); the rotating shaft (23) 3) passes through the left baffle plate (91) or the right baffle plate (92) and is connected to the output shaft of a second motor (24); the rotating shaft (23) is provided with a plurality of material-dispersing wheels (25) arranged at intervals along its length direction; the material-dispersing wheels (25) can rotate with the rotating shaft (23) and the rotation direction is opposite to the movement direction of the left belt (12) and the right belt (13); the height difference between the material-dispersing wheels (25) and the left belt (12) and the right belt (13) in the vertical direction is equal to or slightly greater than the thickness of the material tube (100); At the lower end of the material guiding plate (191) and between the left belt (12) and the right belt (13), at least two guiding through holes (27) are provided at intervals. A pushing block (28) that can move back and forth is arranged in each guiding through hole (27). The rear end of the pushing block (28) is connected to the piston rod of a cylinder (30) through a connecting plate (29). The front end of the pushing block (28) extends towards the material separating wheel (25) and is located between the left belt (12) and the right belt (13). The upper surface of the front end of the pushing block (28) is an inclined surface, and the front end of this inclined surface is lower than its rear end. The front end of the inclined surface on the pushing block (28) is flush with the upper surfaces of the left belt (12) and the right belt (13) or lower than the upper surfaces of the left belt (12) and the right belt (13).

2. The automated processing equipment for semiconductor chips according to claim 1, characterized in that: A transmission module (1) is arranged between the left baffle (91) and the right baffle (92) and above the material transporting bottom plate (11). A support plate (2) is installed on the movable part (101) of the transmission module (1) that can move back and forth. Two sensors (3) are installed at both ends of the support plate (2) extending left and right. The two sensors (3) with their sensing ends all facing downwards are used to detect whether the material pipes (100) on the belt are inclined. Two vertical cylinders (4) are installed on the support plate (2) at intervals. A material pushing plate (5) extending left and right is respectively connected to the lower ends of the piston rods of the two vertical cylinders (4). When the piston rods of the two vertical cylinders (4) that synchronously expand and contract are both in the extended state, the lower part of the material pushing plate (5) can be inserted between two adjacent material pipes (100).

3. The automated processing equipment for semiconductor chips according to claim 1, wherein: The sensor (3) is a fiber optic sensor.

4. The automated processing equipment for semiconductor chips according to claim 1, characterized in that: The horizontal part (201) of the L-shaped support plate (2) is installed on the movable part (101) of the transmission module (1). The sensors (3) and the vertical cylinders (4) are both installed on the vertical part (202) of the support plate (2).

5. The automated processing equipment for semiconductor chips according to claim 1, wherein: The vertically arranged material pushing plate (5) is respectively connected to the piston rods of the two vertical cylinders (4) through a mounting seat (401).

6. The automated processing equipment for semiconductor chips according to claim 1, characterized in that: At least one sensing piece (81) is arranged on the material pushing plate (5), and a sensor (82) that cooperates with the sensing piece (81) is arranged on the support plate (2). When the piston rod of the vertical cylinder (4) is in the extended state and the contracted state, the sensor (82) generates different sensing signals respectively.

7. The automated processing equipment for semiconductor chips according to claim 1, wherein: An L-shaped pressing plate (20) is respectively arranged between the left baffle (91) and the left belt (12) and between the right baffle (92) and the right belt (13). The vertical part (21) of the L-shaped pressing plate (20) is installed on the left baffle (91) or the right baffle (92). The lower surface of the horizontal part (22) of the L-shaped pressing plate (20) is higher than the upper surfaces of the left belt (12) and the right belt (13), and there is a gap between the upper surface of one end of the material pipe (100) whose lower surface is in lap contact with the upper surfaces of the left belt (12) and the right belt (13) and the horizontal part (22) of the L-shaped pressing plate (20) located directly above it, and this gap is smaller than the thickness of the material pipe (100).

8. The automated processing equipment for semiconductor chips according to claim 1, characterized in that: The cylinder (30) is installed on the lower surface of the material transporting bottom plate (11).

9. The material pipe conveying mechanism according to claim 1, wherein: The driving assembly further includes: a first motor (161) installed on the lower surface of the material transporting bottom plate (11), a driving wheel (162) installed on the output shaft of the first motor (161), and a driven wheel (164) drivingly connected to the driving wheel (162) through a synchronous belt (163). The driven wheel (164) is sleeved on a synchronous shaft (165) extending left and right. A left driving wheel (166) drivingly connected to the left belt (12) or the second left belt (14) is installed at the left end of the synchronous shaft (165) rotatably installed on the lower surface of the material transporting bottom plate (11). A right driving wheel (167) drivingly connected to the right belt (13) or the second right belt (15) is installed at the right end of the synchronous shaft (165).

10. The automated processing equipment for semiconductor chips according to claim 1, characterized in that: A flexible rubber layer (251) is coated on the outer circumferential surface of the material dredging wheel (25).

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