Method and device for determining failure information of carrier-like plate, equipment, medium and product

Abstract

The invention relates to a failure information determination method, device and equipment of a similar carrier plate, a medium and a product. The method comprises the following steps: electrifying a resistance test system comprising a target carrier plate to obtain resistance change information of the target carrier plate; according to the resistance change information, determining an initial circuit layer causing failure of the target type carrier plate; burning the target type carrier plate by using a high-temperature burning device so as to expose the initial circuit layer on the surface layer of the target type carrier plate; and scanning the initial circuit layer by using a microscope system to obtain short-circuit failure information of the target carrier plate. By adopting the method, accurate and effective short-circuit failure positioning can be carried out in the carrier-like board.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to a method, apparatus, device, medium, and product for determining failure information of a substrate-like board. Background Art

[0002] As the line pitch of substrate-like boards becomes narrower and narrower, compared with printed circuit boards with a larger line pitch, substrate-like boards with a smaller line pitch are more likely to short-circuit during use, thereby causing product failure. In addition, the thickness of substrate-like boards is smaller than that of printed circuit boards, and generally, Ajinomoto build-up film (ABF) is used as the dielectric layer. This not only reduces the thickness of the dielectric layer, but also the surface of ABF can accept laser processing and direct copper plating.

[0003] However, due to the very thin layer pitch of substrate-like boards, for the short-circuit failure analysis of substrate-like boards, usually only the surface layer is analyzed or the short-circuit position between holes is analyzed by sectioning, and it is very difficult to locate the short-circuit failure within the dielectric layer by cutting and grinding the sample. Summary of the Invention

[0004] Based on this, in view of the above technical problems, it is necessary to provide a method, apparatus, device, medium, and product for determining failure information of a substrate-like board that can accurately and effectively locate the short-circuit failure within the substrate-like board surface.

[0005] In a first aspect, this application provides a method for determining failure information of a substrate-like board, including:

[0006] Power on a resistance test system including the target substrate-like board to obtain resistance change information of the target substrate-like board;

[0007] Determine an initial circuit layer that causes the target substrate-like board to fail according to the resistance change information;

[0008] Use a high-temperature burner to burn the target substrate-like board so that the initial circuit layer is exposed on the surface layer of the target substrate-like board;

[0009] Use a microscope system to scan the initial circuit layer to obtain short-circuit failure information of the target substrate-like board.

[0010] In one embodiment, the determining an initial circuit layer that causes the target substrate-like board to fail according to the resistance change information includes:

[0011] Determine fuzzy failure information of the target substrate-like board according to the resistance change information; wherein, the fuzzy failure information includes a fuzzy failure position that causes the target substrate-like board to fail;

[0012] Determine the initial circuit layer of the target type of carrier board according to the fuzzy failure information.

[0013] In one embodiment, the fuzzy failure information includes the fuzzy failure location;

[0014] The determining of the initial circuit layer of the target type of carrier board according to the fuzzy failure information includes:

[0015] Use an infrared thermal imaging device to collect a thermal imaging image at the fuzzy failure location in the target type of carrier board;

[0016] Determine the initial circuit layer of the target type of carrier board according to the thermal imaging image.

[0017] In one embodiment, the scanning of the initial circuit layer by the microscope system to obtain the short-circuit failure information of the target type of carrier board includes:

[0018] Control the microscope system to scan the initial circuit layer of the target type of carrier board to obtain the electrochemical migration situation of the initial circuit layer;

[0019] Determine the short-circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer.

[0020] In one embodiment, the number of the initial circuit layers is at least two;

[0021] The determining of the short-circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer includes:

[0022] For any initial circuit layer, if the electrochemical migration situation of the initial circuit layer is that electrochemical migration occurs, it is determined that there is a short-circuit failure situation in the initial circuit layer;

[0023] Determine the short-circuit failure information of the target type of carrier board according to all the initial circuit layers with short-circuit failure situations.

[0024] In one embodiment, the dielectric layer of the target type of carrier board is alkaline phenolic ABF resin or epoxy resin.

[0025] In a second aspect, the present application also provides a device for determining failure information of a type of carrier board, including:

[0026] An information acquisition module, configured to power on a resistance test system including a target type of carrier board to obtain resistance change information of the target type of carrier board;

[0027] A failure determination module, configured to determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information;

[0028] A high-temperature burning module for burning the target type of carrier board with a high-temperature burner to expose the initial circuit layer on the surface layer of the target type of carrier board;

[0029] An information determination module for scanning the initial circuit layer with a microscope system to obtain the short-circuit failure information of the target type of carrier board.

[0030] In a third aspect, the present application further provides a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0031] Power on the resistance test system including the target type of carrier board to obtain the resistance change information of the target type of carrier board;

[0032] Determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information;

[0033] Burn the target type of carrier board with a high-temperature burner to expose the initial circuit layer on the surface layer of the target type of carrier board;

[0034] Scan the initial circuit layer with a microscope system to obtain the short-circuit failure information of the target type of carrier board.

[0035] In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0036] Power on the resistance test system including the target type of carrier board to obtain the resistance change information of the target type of carrier board;

[0037] Determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information;

[0038] Burn the target type of carrier board with a high-temperature burner to expose the initial circuit layer on the surface layer of the target type of carrier board;

[0039] Scan the initial circuit layer with a microscope system to obtain the short-circuit failure information of the target type of carrier board.

[0040] In a fifth aspect, the present application further provides a computer program product, including a computer program. When the computer program is executed by a processor, the following steps are implemented:

[0041] Power on the resistance test system including the target type of carrier board to obtain the resistance change information of the target type of carrier board;

[0042] Determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information;

[0043] Use a high-temperature burner to burn the target type of carrier board so that the initial circuit layer is exposed on the surface layer of the target type of carrier board;

[0044] Use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target type of carrier board.

[0045] For the method, device, equipment, medium and product for determining the failure information of the above-mentioned type of carrier board, power on the resistance test system including the target type of carrier board to obtain the resistance change information of the target type of carrier board, and then determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information, so as to roughly and vaguely identify and screen the initial circuit layer; further, use a high-temperature burner to burn the target type of carrier board so that the initial circuit layer is exposed on the surface layer of the target type of carrier board, and use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target type of carrier board. Compared with the method of layer-by-layer grinding in the prior art, it avoids the situation of circuit damage caused by grinding. At the same time, combining the method of observing with a microscope system can facilitate the observation of short-circuit failure phenomena in the narrow-spacing dielectric layer, effectively improving the work efficiency and success rate of short-circuit analysis, and can accurately and effectively locate the short-circuit failure on the surface of the type of carrier board. Description of the Drawings

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0047] Figure 1 It is an application environment diagram of the method for determining the failure information of the type of carrier board in an embodiment;

[0048] Figure 2 It is a flowchart of the method for determining the failure information of the type of carrier board in an embodiment;

[0049] Figure 3 It is a flowchart of determining the initial circuit layer that causes the failure of the target type of carrier board in an embodiment;

[0050] Figure 4 It is a flowchart of determining the initial circuit layer of the target type of carrier board in an embodiment;

[0051] Figure 5 It is a flowchart of determining the short-circuit failure information of the target type of carrier board in an embodiment;

[0052] Figure 6 A flowchart of a method for determining failure information of a build-up printed circuit board in another embodiment;

[0053] Figure 7 A structural block diagram of a device for determining failure information of a build-up printed circuit board in one embodiment;

[0054] Figure 8 An internal structure diagram of a computer device in one embodiment. Detailed implementation manners

[0055] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0056] The method for determining failure information of a build-up printed circuit board provided in an embodiment of the present application can be applied to an Figure 1 application environment as shown. Among them, the target build-up printed circuit board 101 is a build-up printed circuit board that needs to be detected for short-circuit failure; the resistance test system 102 is used to monitor the resistance change of the target build-up printed circuit board 101; the high-temperature burner 103 is used to perform high-temperature burning on the dielectric layer of the target build-up printed circuit board; the microscope system 104 is used to scan and observe the initial circuit layer of the target build-up printed circuit board; the control device 105 can control the target build-up printed circuit board 101 to interact with the resistance test system 102, the high-temperature burner 103 and the microscope system 104 respectively.

[0057] In one embodiment, as Figure 2 shown, a method for determining failure information of a build-up printed circuit board is provided. Taking the application of this method to the Figure 1 control device 105 as an example, the specific steps are as follows:

[0058] S201, power on the resistance test system including the target build-up printed circuit board to obtain the resistance change information of the target build-up printed circuit board.

[0059] Among them, the build-up printed circuit board can be a printed circuit board similar to but not exactly the same as a carrier board, and is a circuit board component used to connect electronic components; in the embodiment of the present application, the target build-up printed circuit board is a build-up printed circuit board with a thinner dielectric layer. The dielectric layer of the target build-up printed circuit board can be alkaline phenolic ABF resin or other thinner epoxy resins. The number of layers of the target build-up printed circuit board ranges from 1 to 20 layers, and the size ≤ 20 cm * 20 cm. The resistance change information of the target build-up printed circuit board characterizes the resistance change of the target build-up printed circuit board during the power-on process of the resistance test system.

[0060] Optionally, a pre-set resistance testing device can be connected to the pads of the target type of carrier board to construct a resistance testing system including the target type of carrier board; further, the resistance testing system is powered on, and the resistance change of the target type of carrier board is tested during the power-on process to obtain the resistance change information of the target type of carrier board.

[0061] In the embodiments of the present application, the resistance testing device in the resistance testing system includes but is not limited to a high resistance meter or other resistance testing devices.

[0062] S202. Determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information.

[0063] Among them, the initial circuit layer is the circuit layer that fails in the target type of carrier board roughly determined according to the resistance change information. In the embodiments of the present application, the resistance change information can characterize the resistance change of the circuit network of each circuit layer of the target type of carrier board.

[0064] Optionally, the resistance change of the circuit network of each circuit layer of the target type of carrier board in the resistance change information can be obtained. If the resistance value of a certain circuit network shows 0, or is very small, or even remains unchanged, it indicates that there may be a failure in this circuit network, and then the circuit layer where this circuit network is located is used as the initial circuit layer.

[0065] S203. Burn the target type of carrier board with a high-temperature burner to expose the initial circuit layer on the surface layer of the target type of carrier board.

[0066] Among them, the high-temperature burner is used to burn the dielectric layer of the target type of carrier board.

[0067] Optionally, the target type of carrier board can be fixed with a fixture, specifically, it can be placed upright or inverted to facilitate burning with a high-temperature burner; further, the temperature of the high-temperature burner can be set between 400°C and 800°C, and the dielectric layer of the target type of carrier board is burned with the high-temperature burner. The burning time of each dielectric layer is generally 1 s - 1200 s, and the specific time is determined according to the actual situation of the dielectric layer until the initial circuit layer is exposed on the surface layer of the target type of carrier board, and then stop burning the target type of carrier board.

[0068] Further, it is also necessary to clean the ablated surface of the target type of carrier board after ablation to facilitate subsequent observation of the target type of carrier board. Specifically, it can be cleaned with a cleaning agent. The cleaning agent includes one or a combination or alternation of acetone, ethanol, methanol, deionized water, etc. The cleaning process cannot be too intense to avoid damaging the ablated circuit.

[0069] It should be noted that during the high-temperature burning process, influencing factors such as temperature, time, and intensity need to be strictly controlled to prevent excessive ablation from damaging the integrity of the circuit or causing the circuit to be destroyed. Try to control the ablation to only the specified dielectric layer area and thickness, and only expose the circuit layer.

[0070] S204, use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target type of carrier board.

[0071] Among them, the microscope system is used to scan and observe the initial circuit layer. In the embodiments of the present application, the microscope system can be an optical microscope, a scanning electron microscope, etc.

[0072] Among them, the short-circuit failure information of the target type of carrier board characterizes the failure situation caused by short circuit in the circuit network of the target type of carrier board. In the embodiments of the present application, the short-circuit failure information includes but is not limited to the location and quantity of the short-circuit failure.

[0073] Optionally, the microscope system can be controlled to scan the initial circuit layer of the target type of carrier board to obtain the scanning result of the initial circuit layer; further, the scanning result can be input into the short-circuit failure analysis model so that the short-circuit failure analysis model analyzes the scanning result and determines whether the initial circuit layer has a short-circuit failure. If it is determined that the initial circuit layer has no short-circuit failure, the short-circuit failure information is that there is no short-circuit failure; if it is determined that the initial circuit layer has a short-circuit failure, the short-circuit failure information can include the layer number where the initial circuit layer is located and the specific location of the short-circuit failure.

[0074] It should be noted that in the embodiments of the present application, the number of initial circuit layers can be one or multiple. When the number of initial circuit layers is one, it only needs to be burned once to expose the initial circuit layer. If the number of initial circuit layers is multiple, the target type of carrier board needs to be burned multiple times.

[0075] Exemplarily, if the target type of carrier board includes 10 circuit layers, after the target type of carrier board is placed upright by a fixture, the initial circuit layers are located on the 2nd, 5th, and 7th layers from bottom to top respectively. Then, the target type of carrier board needs to be burned for the first time until the 2nd circuit layer of the target type of carrier board is exposed on the surface layer of the target type of carrier board; further, a microscope system is used to scan the 2nd initial circuit layer to obtain the scanning information of the 2nd initial circuit layer; then, the exposed circuit on this layer is removed by acidic copper etching, and the target type of carrier board is continuously burned until the 5th circuit layer of the target type of carrier board is exposed on the surface layer of the target type of carrier board; further, a microscope system is used to scan the 5th initial circuit layer to obtain the scanning information of the 5th initial circuit layer; finally, the exposed circuit on this layer is removed by acidic copper etching, and the target type of carrier board is burned until the 7th circuit layer of the target type of carrier board is exposed on the surface layer of the target type of carrier board; further, a microscope system is used to scan the 7th initial circuit layer to obtain the scanning information of the 7th initial circuit layer.

[0076] Further, based on the scanning information of the 2nd, 5th, and 7th initial circuit layers respectively, the short - circuit failure information of the target type of carrier board is analyzed and determined.

[0077] In the above - mentioned method for determining the failure information of the type of carrier board, the resistance - testing system including the target type of carrier board is powered on to obtain the resistance change information of the target type of carrier board. Then, based on the resistance change information, the initial circuit layer causing the failure of the target type of carrier board can be roughly and vaguely identified and screened; further, a high - temperature burner is used to burn the target type of carrier board to expose the initial circuit layer on the surface layer of the target type of carrier board, and a microscope system is used to scan the initial circuit layer to obtain the short - circuit failure information of the target type of carrier board. Compared with the prior art method of grinding layer by layer, the situation of circuit damage caused by grinding is avoided. At the same time, the method combined with the observation of the microscope system can conveniently observe the short - circuit failure phenomenon in the narrow - pitch dielectric layer, effectively improving the working efficiency and success rate of short - circuit analysis, and can accurately and effectively locate the short - circuit failure in the surface of the type of carrier board.

[0078] Optionally, in one embodiment, as Figure 3 shown, a method for determining the initial circuit layer causing the failure of the target type of carrier board is provided to refine the above - mentioned S202, which specifically includes the following steps:

[0079] S301, based on the resistance change information, determine the fuzzy failure information of the target type of carrier board.

[0080] Among them, the fuzzy failure information characterizes the location and quantity of the circuit causing the failure of the target type of carrier board; in the embodiments of the present application, the fuzzy failure information includes the fuzzy failure location causing the failure of the target type of carrier board.

[0081] Optionally, based on the resistance change information, it can be determined whether each circuit layer has a short circuit or a micro short circuit failure, and the number of circuit paths with short circuits and failed circuit networks in the target type of carrier board can be determined as the fuzzy failure information of the target type of carrier board.

[0082] S302. Determine the initial circuit layer of the target type of carrier board according to the fuzzy failure information.

[0083] It can be understood that since the fuzzy failure information is roughly determined based on the resistance change information, it cannot be guaranteed whether the failed circuit layers included in the fuzzy failure information are correct. Therefore, it is necessary to further analyze the fuzzy failure information to determine the initial circuit layer of the target type of carrier board. Specifically, all the circuit paths with short circuits in the fuzzy failure information can be comprehensively analyzed to determine whether there is a conflict, and then the initial circuit layer of the target type of carrier board can be determined according to the analysis result.

[0084] In this embodiment, by introducing the fuzzy failure information and further analyzing the fuzzy failure information, the inaccuracy of the failure situation determined by the resistance change information is excluded, that is, the accuracy of the determined initial circuit layer of the target type of carrier board is ensured.

[0085] Optionally, in one embodiment, as Figure 4 shown, a method for determining the initial circuit layer of a target type of carrier board is provided to refine the above S302, which specifically includes the following steps:

[0086] S401. Use an infrared thermal imaging device to collect a thermal imaging image at the fuzzy failure position of the target type of carrier board.

[0087] Among them, the infrared thermal imaging device is used to perform thermal imaging shooting on the circuit layer of the target type of carrier board; in the embodiment of the present application, the infrared thermal imaging device can be an infrared thermal imaging camera.

[0088] Optionally, an infrared thermal imaging device can be used to take a picture at the fuzzy failure position of the target type of carrier board to obtain a thermal imaging image at the fuzzy failure position of the target type of carrier board.

[0089] S402. Determine the initial circuit layer of the target type of carrier board according to the thermal imaging image.

[0090] Optionally, a pre-constructed hot spot analysis system can be used to perform hot spot analysis on the thermal imaging image, and the initial circuit layer of the target type of carrier board can be determined according to the hot spot analysis result.

[0091] In this embodiment, by introducing an infrared thermal imaging device, the thermal imaging image at the fuzzy failure position of the target type of carrier board is collected, ensuring the accuracy of the collected thermal imaging image; further, the accuracy of the determined initial circuit layer is ensured.

[0092] Optionally, in one embodiment, as Figure 5 shown, a method for determining the short-circuit failure information of the target type of carrier board is provided to refine the above S204, which specifically includes the following steps:

[0093] S501, control the microscope system to scan the initial circuit layer of the target type of carrier board to obtain the electrochemical migration situation of the initial circuit layer.

[0094] Among them, the electrochemical migration situation characterizes whether electrochemical migration occurs in the initial circuit layer.

[0095] In the embodiment of the present application, the microscope system can be equipped with an intelligent vision module, and its function is to automatically scan and judge the electrochemical migration phenomenon.

[0096] Optionally, the microscope system can be controlled to scan the initial circuit layer of the target type of carrier board. The microscope system can automatically scan and judge the electrochemical migration phenomenon of the initial circuit layer based on the equipped intelligent vision module to obtain the electrochemical migration situation of the initial circuit layer.

[0097] S502, determine the short-circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer.

[0098] Optionally, if the electrochemical migration situation of the initial circuit layer is that electrochemical migration occurs, it is determined that there is a short-circuit failure situation in the initial circuit layer. Furthermore, the number of layers of the circuit layer where the target type of carrier board has a short-circuit failure can be determined according to the initial circuit layer, and the short-circuit failure information of the target type of carrier board can be determined according to the determined number of layers of the circuit layer where the short-circuit failure occurs.

[0099] It should be noted that the above-described process of determining the short-circuit failure information of the target type of carrier board is applicable to the case where the number of initial circuit layers is one. In actual applications, there may be a case where the number of initial circuit layers is at least two. In this case, in order to ensure the accuracy of the determined short-circuit failure information, the method for determining the short-circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer can also be: for any initial circuit layer, if the electrochemical migration situation of the initial circuit layer is that electrochemical migration occurs, it is determined that there is a short-circuit failure situation in the initial circuit layer; determine the short-circuit failure information of the target type of carrier board according to all the initial circuit layers with short-circuit failure situations. Specifically, the number of layers and the quantity of the circuit layers where the target type of carrier board has a short-circuit failure can be determined according to all the initial circuit layers with short-circuit failure situations.

[0100] In this embodiment, by introducing the electrochemical migration situation of the initial circuit layer, since the electrochemical migration situation characterizes to a certain extent whether a short circuit occurs in the circuit network, based on the electrochemical migration situation of the initial circuit layer, the accuracy of the short - circuit failure information of the determined target type of carrier board can be ensured.

[0101] Figure 6 FIG. is a schematic flow chart of a method for determining the failure information of a type of carrier board in another embodiment. On the basis of the above - mentioned embodiment, this embodiment provides an alternative example of a method for determining the failure information of a type of carrier board. Combining Figure 6 , the specific implementation process is as follows:

[0102] S601, power on the resistance test system including the target type of carrier board to obtain the resistance change information of the target type of carrier board.

[0103] S602, determine the fuzzy failure information of the target type of carrier board according to the resistance change information.

[0104] Among them, the fuzzy failure information includes the fuzzy failure location that causes the failure of the target type of carrier board.

[0105] S603, use an infrared thermal imaging device to collect the thermal imaging image at the fuzzy failure location of the target type of carrier board.

[0106] S604, determine the initial circuit layer of the target type of carrier board according to the thermal imaging image.

[0107] S605, use a high - temperature burner to burn the target type of carrier board so that the initial circuit layer is exposed on the surface layer of the target type of carrier board.

[0108] S606, control the microscope system to scan the initial circuit layer of the target type of carrier board to obtain the electrochemical migration situation of the initial circuit layer.

[0109] S607, determine the short - circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer.

[0110] For the specific processes of the above S601 - S607, reference can be made to the description of the above - mentioned method embodiment, and their implementation principles and technical effects are similar, so they will not be elaborated here.

[0111] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are sequentially shown according to the indications of the arrows, these steps are not necessarily executed sequentially in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0112] Based on the same inventive concept, an embodiment of the present application further provides a failure information determination device for a build-up printed circuit board for implementing the failure information determination method for the build-up printed circuit board involved above. The implementation solutions provided by this device to solve problems are similar to the implementation solutions described in the above method. Therefore, the specific limitations in one or more embodiments of the failure information determination device for the build-up printed circuit board provided below can refer to the limitations on the failure information determination method for the build-up printed circuit board in the above text, and will not be repeated here.

[0113] In an exemplary embodiment, as Figure 7 shown, a failure information determination device 700 for a build-up printed circuit board is provided, including: an information acquisition module 710, a failure determination module 720, a high-temperature burning module 730, and an information determination module 740, where:

[0114] The information acquisition module 710 is configured to power on a resistance test system including a target build-up printed circuit board to obtain resistance change information of the target build-up printed circuit board.

[0115] The failure determination module 720 is configured to determine an initial circuit layer that causes the target build-up printed circuit board to fail according to the resistance change information.

[0116] The high-temperature burning module 730 is configured to burn the target build-up printed circuit board with a high-temperature burner to expose the initial circuit layer on the surface of the target build-up printed circuit board.

[0117] The information determination module 740 is configured to scan the initial circuit layer with a microscope system to obtain short-circuit failure information of the target build-up printed circuit board.

[0118] The above-mentioned device for determining the failure information of the carrier board powers on the resistance test system including the target carrier board to obtain the resistance change information of the target carrier board, and then determines the initial circuit layer that causes the failure of the target carrier board according to the resistance change information, and can roughly and vaguely identify and screen the initial circuit layer; further, a high-temperature burner is used to burn the target carrier board to expose the initial circuit layer on the surface of the target carrier board, and a microscope system is used to scan the initial circuit layer to obtain the short-circuit failure information of the target carrier board. Compared with the method of layer-by-layer grinding in the prior art, it avoids the situation of circuit damage caused by grinding. At the same time, combining the method of observing with a microscope system can facilitate the observation of short-circuit failure phenomena in the narrow-spacing dielectric layer, effectively improving the work efficiency and success rate of short-circuit analysis, and can accurately and effectively locate the short-circuit failure in the carrier board surface.

[0119] In one embodiment, the failure determination module 720 includes:

[0120] An information determination unit, configured to determine the fuzzy failure information of the target carrier board according to the resistance change information; wherein, the fuzzy failure information includes the fuzzy failure position that causes the failure of the target carrier board.

[0121] A failure determination unit, configured to determine the initial circuit layer of the target carrier board according to the fuzzy failure information.

[0122] In one embodiment, the fuzzy failure information includes the fuzzy failure position; the failure determination unit is specifically configured to:

[0123] Use an infrared thermal imaging device to collect the thermal imaging image at the fuzzy failure position in the target carrier board; determine the initial circuit layer of the target carrier board according to the thermal imaging image.

[0124] In one embodiment, the information determination module 740 includes:

[0125] A scanning unit, configured to control the microscope system to scan the initial circuit layer of the target carrier board to obtain the electrochemical migration situation of the initial circuit layer.

[0126] A short-circuit determination unit, configured to determine the short-circuit failure information of the target carrier board according to the electrochemical migration situation of the initial circuit layer.

[0127] In one embodiment, the number of the initial circuit layers is at least two; the short-circuit determination unit is specifically configured to:

[0128] For any initial circuit layer, if the electrochemical migration situation of the initial circuit layer is that electrochemical migration occurs, it is determined that there is a short-circuit failure situation in the initial circuit layer; according to all the initial circuit layers with short-circuit failure situations, determine the short-circuit failure information of the target carrier board.

[0129] In one embodiment, the dielectric layer of the target build-up carrier is alkaline phenolic ABF resin or epoxy resin.

[0130] Each module in the failure information determination device of the above build-up carrier can be implemented in whole or in part by software, hardware, and their combination. Each of the above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0131] In one embodiment, a computer device is provided. The computer device can be a terminal, and its internal structure diagram can be as Figure 8 shown. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be implemented through WIFI, a mobile cellular network, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a method for determining the failure information of a build-up carrier.

[0132] Those skilled in the art can understand that Figure 8 the structure shown in

[0133] is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different component layout.

[0134] Power on the resistance test system including the target build-up carrier to obtain the resistance change information of the target build-up carrier;

[0135] According to the resistance change information, determine the initial circuit layer that causes the target build-up carrier to fail;

[0136] Use a high-temperature burner to burn the target build-up carrier so that the initial circuit layer is exposed on the surface of the target build-up carrier;

[0137] Use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target build-up carrier.

[0138] In one embodiment, when the processor executes a computer program to determine the initial circuit layer that causes the target type of carrier board to fail according to the resistance change information, the following steps are further implemented:

[0139] Determine the fuzzy failure information of the target type of carrier board according to the resistance change information; wherein, the fuzzy failure information includes the fuzzy failure position that causes the target type of carrier board to fail; determine the initial circuit layer of the target type of carrier board according to the fuzzy failure information.

[0140] In one embodiment, the fuzzy failure information includes the fuzzy failure position; when the processor executes a computer program to determine the initial circuit layer of the target type of carrier board according to the fuzzy failure information, the following steps are further implemented:

[0141] Use an infrared thermal imaging device to collect a thermal imaging image at the fuzzy failure position in the target type of carrier board; determine the initial circuit layer of the target type of carrier board according to the thermal imaging image.

[0142] In one embodiment, when the processor executes a computer program to scan the initial circuit layer with a microscope system to obtain the short-circuit failure information of the target type of carrier board, the following steps are further implemented:

[0143] Control the microscope system to scan the initial circuit layer of the target type of carrier board to obtain the electrochemical migration condition of the initial circuit layer; determine the short-circuit failure information of the target type of carrier board according to the electrochemical migration condition of the initial circuit layer.

[0144] In one embodiment, the number of initial circuit layers is at least two; when the processor executes a computer program to determine the short-circuit failure information of the target type of carrier board according to the electrochemical migration condition of the initial circuit layer, the following steps are further implemented:

[0145] For any initial circuit layer, if the electrochemical migration condition of the initial circuit layer is that electrochemical migration occurs, it is determined that there is a short-circuit failure condition in the initial circuit layer; determine the short-circuit failure information of the target type of carrier board according to all the initial circuit layers with short-circuit failure conditions.

[0146] In one embodiment, the dielectric layer of the target type of carrier board is alkaline phenolic ABF resin or epoxy resin.

[0147] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0148] Power on the resistance test system including the target type of carrier board to obtain the resistance change information of the target type of carrier board;

[0149] Determine the initial circuit layer that causes the target type of carrier board to fail according to the resistance change information;

[0150] Use a high-temperature burner to burn the target type of carrier board so that the initial circuit layer is exposed on the surface layer of the target type of carrier board;

[0151] Use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target type of carrier board.

[0152] In one embodiment, when the processor executes a computer program to determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information, the following steps are further implemented:

[0153] According to the resistance change information, determine the fuzzy failure information of the target type of carrier board; wherein, the fuzzy failure information includes the fuzzy failure position that causes the failure of the target type of carrier board; according to the fuzzy failure information, determine the initial circuit layer of the target type of carrier board.

[0154] In one embodiment, the fuzzy failure information includes the fuzzy failure position; when the processor executes a computer program to determine the initial circuit layer of the target type of carrier board according to the fuzzy failure information, the following steps are further implemented:

[0155] Use an infrared thermal imaging device to collect the thermal imaging image at the fuzzy failure position in the target type of carrier board; according to the thermal imaging image, determine the initial circuit layer of the target type of carrier board.

[0156] In one embodiment, when the processor executes a computer program to use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target type of carrier board, the following steps are further implemented:

[0157] Control the microscope system to scan the initial circuit layer of the target type of carrier board to obtain the electrochemical migration situation of the initial circuit layer; according to the electrochemical migration situation of the initial circuit layer, determine the short-circuit failure information of the target type of carrier board.

[0158] In one embodiment, the number of initial circuit layers is at least two; when the processor executes a computer program to determine the short-circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer, the following steps are further implemented:

[0159] For any initial circuit layer, if the electrochemical migration situation of the initial circuit layer is electrochemical migration, it is determined that the initial circuit layer has a short-circuit failure situation; according to all the initial circuit layers with short-circuit failure situations, determine the short-circuit failure information of the target type of carrier board.

[0160] In one embodiment, the dielectric layer of the target type of carrier board is alkaline phenolic ABF resin or epoxy resin.

[0161] In one embodiment, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the following steps are implemented:

[0162] Power on the resistance test system including the target type of carrier board to obtain the resistance change information of the target type of carrier board;

[0163] Determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information;

[0164] Use a high-temperature burner to burn the target type of carrier board so that the initial circuit layer is exposed on the surface layer of the target type of carrier board;

[0165] Use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target type of carrier board.

[0166] In one embodiment, when the processor executes a computer program to determine the initial circuit layer that causes the failure of the target type of carrier board according to the resistance change information, the following steps are also implemented:

[0167] Determine the fuzzy failure information of the target type of carrier board according to the resistance change information; wherein, the fuzzy failure information includes the fuzzy failure position that causes the failure of the target type of carrier board; determine the initial circuit layer of the target type of carrier board according to the fuzzy failure information.

[0168] In one embodiment, the fuzzy failure information includes the fuzzy failure position; when the processor executes a computer program to determine the initial circuit layer of the target type of carrier board according to the fuzzy failure information, the following steps are also implemented:

[0169] Use an infrared thermal imaging device to collect the thermal imaging image at the fuzzy failure position in the target type of carrier board; determine the initial circuit layer of the target type of carrier board according to the thermal imaging image.

[0170] In one embodiment, when the processor executes a computer program to use a microscope system to scan the initial circuit layer to obtain the short-circuit failure information of the target type of carrier board, the following steps are also implemented:

[0171] Control the microscope system to scan the initial circuit layer of the target type of carrier board to obtain the electrochemical migration situation of the initial circuit layer; determine the short-circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer.

[0172] In one embodiment, the number of initial circuit layers is at least two; when the processor executes a computer program to determine the short-circuit failure information of the target type of carrier board according to the electrochemical migration situation of the initial circuit layer, the following steps are also implemented:

[0173] For any initial circuit layer, if the electrochemical migration situation of the initial circuit layer is electrochemical migration, determine that there is a short-circuit failure situation in the initial circuit layer; determine the short-circuit failure information of the target type of carrier board according to all the initial circuit layers with short-circuit failure situations.

[0174] In one embodiment, the dielectric layer of the target carrier board is alkaline phenolic ABF resin or epoxy resin.

[0175] It should be noted that the data involved in this application (including but not limited to data for analysis, stored data, displayed data, etc.) are all information and data that have been fully authorized by all parties, and the collection, use, and processing of relevant data need to comply with relevant regulations.

[0176] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in this application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in this application can be general-purpose processors, central processors, graphics processors, digital signal processors, programmable logic devices, data processing logics based on quantum computing, etc., without limitation.

[0177] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0178] The embodiments described above merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. A method for determining failure information of a similar carrier board, characterized in that: The method comprises: Powering on a resistance testing system including a target type carrier board to obtain resistance change information of the target type carrier board; Determining, based on the resistance change information, an initial circuit layer causing failure of the target type substrate; Using a high-temperature burner to burn the target type carrier board so that the initial circuit layer is exposed on the surface layer of the target type carrier board; The initial circuit layer is scanned by a microscope system to obtain short circuit failure information of the target type substrate.

2. The method according to claim 1, characterized in that The determining, according to the resistance change information, the initial circuit layer causing the target type substrate to fail, comprises: Determine fuzzy failure information of the target type carrier board according to the resistance change information; wherein the fuzzy failure information includes a fuzzy failure position causing the target type carrier board to fail; An initial circuit layer of the target type substrate is determined according to the fuzzy failure information.

3. The method according to claim 2, characterized in that The step of determining the initial circuit layer of the target type substrate according to the fuzzy failure information includes: Using infrared thermal imaging equipment to collect thermal imaging images of the fuzzy failure position in the target type carrier board; The initial circuit layer of the target type substrate is determined according to the thermal imaging image.

4. The method according to claim 1, characterized in that The step of scanning the initial circuit layer with a microscope system to obtain short circuit failure information of the target type substrate includes: Controlling the microscope system to scan the initial circuit layer of the target type substrate to obtain the electrochemical migration status of the initial circuit layer; According to the electrochemical migration of the initial circuit layer, short circuit failure information of the target type substrate is determined.

5. The method according to claim 4, characterized in that The number of the initial circuit layers is at least two; The determining of the short circuit failure information of the target type substrate according to the electrochemical migration of the initial circuit layer includes: For any initial circuit layer, if the electrochemical migration condition of the initial circuit layer is that electrochemical migration occurs, it is determined that the initial circuit layer has a short circuit failure condition; According to all initial circuit layers having short circuit failure conditions, short circuit failure information of the target type of substrate is determined.

6. The method according to any one of claims 1 to 5, characterized in that: The dielectric layer of the target type carrier board is alkaline phenolic ABF resin or epoxy resin.

7. A device for determining failure information of a similar carrier board, characterized in that: The device comprises: An information acquisition module, used to power on a resistance test system including a target type carrier board to obtain resistance change information of the target type carrier board; A failure determination module, used to determine the initial circuit layer causing the failure of the target type carrier board according to the resistance change information; A high-temperature burning module, used for burning the target type carrier board with a high-temperature burner, so that the initial circuit layer is exposed to the surface layer of the target type carrier board; The information determination module is used to scan the initial circuit layer using a microscope system to obtain short circuit failure information of the target type carrier board.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

Images