Power module and inverter

Abstract

The invention relates to the technical field of electronic equipment, in particular to a power module and an inverter. A plurality of first wires are arranged in a first uniform temperature plate in the power module, one ends of the plurality of first wires are used for being electrically connected with a positive electrode direct current input end, a plurality of second wires and a plurality of third wires are arranged in a second uniform temperature plate, and one ends of the plurality of second wires and one ends of the plurality of third wires are used for being electrically connected with an alternating current output end; the multiple first power tubes are arranged on the surface of the side, provided with the first wire, of the first uniform temperature plate, one end of each first power tube is electrically connected with the other end of the first wire, and the other end of each first power tube is used for being electrically connected with the other end of the second wire. The second power tube is arranged on the surface of the side, provided with the second wire and the third wire, of the second uniform temperature plate, one end of the second power tube is used for being electrically connected with the negative electrode direct current input end, and the other end of the second power tube is electrically connected with the other end of the third wire. The power module is few in internal wiring and simple in structure.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a power module and an inverter. Background Art

[0002] Due to characteristics such as high integration, easy application, and excellent product performance, power modules are widely used in vehicle motor controllers or servers. When a power module is packaged, there are many external traces connecting the transistors inside the power module to the AC output terminals and DC input terminals, resulting in a complex internal structure of the power module. Summary of the Invention

[0003] An embodiment of this application provides a power module and an inverter. In this power module, the number of external traces is small, and the internal structure of the power module is simplified.

[0004] In a first aspect, this application provides a power module, which includes a heat spreader, a plurality of first power tubes, and a plurality of second power tubes. The heat spreader includes a first heat spreader and a second heat spreader. The first heat spreader includes a plurality of first traces, and one end of each of the plurality of first traces is used for electrically connecting to the positive DC input terminal. The second heat spreader includes a plurality of second traces and a plurality of third traces. One end of each of the plurality of second traces and one end of each of the plurality of third traces are both used for electrically connecting to the AC output terminal. The plurality of first power tubes are disposed on the surface of the first heat spreader on the side having the first traces. The plurality of first power tubes are arranged at intervals along a first direction. One end of a first power tube is electrically connected to the other end of the first trace, and the other end of the first power tube is used for electrically connecting to the other end of the second trace. The second power tubes are disposed on the surface of the second heat spreader on the side having the second traces and the third traces. The plurality of second power tubes are arranged at intervals along the first direction. One end of a second power tube is used for electrically connecting to the negative DC input terminal, and the other end of the second power tube is electrically connected to the other end of the third trace. In this application, the first heat spreader can absorb the heat generated by the first power tubes disposed on the first heat spreader, so that the operating temperature of the first power tubes is relatively low, thereby ensuring the stability of the operation of the first power tubes. The second heat spreader can absorb the heat generated by the second power tubes disposed on the second heat spreader so that the operating temperature of the second power tubes is relatively low, thereby ensuring the stability of the operation of the second power tubes. The first traces included in the first heat spreader can realize the function of electrically connecting the first power tubes to the positive DC input terminal. The second traces included in the second heat spreader can realize the electrical connection between the first power tubes and the AC output terminal. The third traces included in the second heat spreader can also realize the electrical connection between the second power tubes and the AC output terminal. The other ends of the second power tubes are electrically connected to the negative DC input terminal through external traces. This way can reduce the number of external traces in the power module and simplify the structure of the power module.

[0005] In one embodiment, the temperature equalizing plate includes a top plate, a bottom plate, a side plate, a condensation layer and an evaporation layer. The side plate is used to connect the bottom plate and the top plate. The top plate, the bottom plate and the side plate are enclosed to form a sealed heat exchange cavity. The evaporation layer is arranged on the side of the top plate facing the bottom plate, and the condensation layer is arranged on the side of the bottom plate facing the top plate. The condensation layer and the evaporation layer are arranged at intervals along the arrangement direction of the top plate and the bottom plate. The top plate is used to absorb the heat generated by the first power tube and the second power tube to dissipate the heat of the first power tube and the second power tube.

[0006] In one embodiment, the top plate of the first temperature equalizing plate includes a plurality of first wirings, and a plurality of first power tubes, a positive DC input terminal, and a negative DC input terminal are arranged on a side of the top plate of the first temperature equalizing plate away from the top plate of the first temperature equalizing plate. In this way, it is convenient to electrically connect the first power tube to the positive DC input terminal through the first wirings.

[0007] In one embodiment, the top plate of the second temperature equalizer includes a plurality of second wirings and a plurality of third wirings, and the AC output terminal is arranged on the side of the top plate of the second temperature equalizer away from the bottom plate of the second temperature equalizer, so that the first power tube is electrically connected to the AC output terminal through the second wiring, and the second power tube is electrically connected to the negative DC input terminal through the external wiring.

[0008] In one embodiment, the power module further includes a first heat sink, and a side of the first temperature averaging plate facing away from the first power tube and a side of the second temperature averaging plate facing away from the second power tube are both connected to the first heat sink. The first heat sink can provide cooling capacity for the first temperature averaging plate and the second temperature averaging plate to dissipate heat for the first power tube and the second power tube.

[0009] In one embodiment, the power module further includes a first thermally conductive insulating layer, and the first thermally conductive insulating layer is located between the first heat sink and the first and second thermally conductive insulating layers. The provision of the first thermally conductive insulating layer can improve the stability of the power module and ensure the heat exchange efficiency between the first heat sink and the second heat sink.

[0010] In one embodiment, in order to improve the stability of the connection between the first heat sink and the first temperature equalizing plate and the second temperature equalizing plate, and to make the heat transfer efficiency between the first heat sink and the first temperature equalizing plate and the second temperature equalizing plate higher, in the projection of the first heat sink, the first thermally conductive insulation layer completely covers the first temperature equalizing plate and the second temperature equalizing plate.

[0011] In one embodiment, the power module further includes a first conductive connector, the other end of the first power tube is electrically connected to one end of the first conductive connector, and the other end of the first conductive connector is electrically connected to the other end of the second wiring. The first conductive connector can be an external wiring or a conductive copper bus, and the first conductive connector is provided to facilitate the electrical connection of the first power tube with the second wiring.

[0012] In one embodiment, the power module includes a third heat spreader, a second conductive connector, and a third conductive connector. The third heat spreader is located on the side of the first power transistor away from the first heat spreader. One end of the second conductive connector is electrically connected to the other end of the first power transistor, the other end of the second conductive connector is electrically connected to the third heat spreader, the other end of the third conductive connector is electrically connected to the other end of the second trace, and the other end of the second conductive connector and one end of the third conductive connector are electrically connected through the third heat spreader. The setting of the third heat spreader can improve the heat dissipation efficiency of the first power transistor and the second power transistor. And in this way, the third heat spreader can serve as a conductive structure to connect the second conductive connector and the third conductive connector, which can simplify the structure of the power module and improve the heat dissipation efficiency of the power transistor. Among them, the structure of the third heat spreader is the same as that of the first heat spreader and the second heat spreader. Multiple fourth traces can be arranged in the third heat spreader, and the fourth traces are used to electrically connect the second conductive connector and the third conductive connector.

[0013] In one embodiment, the power module includes a metal heat conductor, a second conductive connector, and a third conductive connector. The metal heat conductor is located on the side of the first power transistor away from the first heat spreader. One end of the second conductive connector is electrically connected to the other end of the first power transistor, the other end of the second conductive connector is electrically connected to the metal heat conductor, one end of the third conductive connector is electrically connected to the metal heat conductor, and the other end of the third conductive connector is electrically connected to the other end of the second trace. The setting of the metal heat conductor can improve the heat dissipation efficiency of the first power transistor and the second power transistor. And in this way, the metal heat conductor can serve as a conductive structure to connect the second conductive connector and the third conductive connector, which can simplify the structure of the power module and improve the heat dissipation efficiency of the power transistor. Among them, the material of the metal heat conductor can be copper.

[0014] In one embodiment, the power module includes a second radiator, and the second radiator is fixed to the side of the third heat spreader away from the first heat spreader through a second thermally conductive insulating layer. In this way, the first power transistor can dissipate heat from both sides, improving the heat dissipation efficiency of the first power transistor and the second power transistor.

[0015] In one embodiment, the power module includes a second radiator, and the second radiator is fixed to the side of the metal heat conductor away from the first heat spreader through a second thermally conductive insulating layer. In this way, the first power transistor can dissipate heat from both sides, improving the heat dissipation efficiency of the first power transistor and the second power transistor.

[0016] In a second aspect, the present application also provides an inverter, a capacitor module, and multiple power modules, and the multiple power modules are electrically connected to the capacitor module. In this embodiment, the heat dissipation efficiency of the power module is relatively high, so that the heat dissipation efficiency of the inverter with this power module is relatively high, which can improve the working stability of the inverter.

[0017] In one embodiment, the first radiator includes a first inlet and a first outlet. Among two adjacent first radiators, the first outlet of the previous first radiator is used to communicate with the first inlet of the subsequent first radiator. At this time, the multiple first radiators included in the multiple power modules are connected in series.

[0018] In one embodiment, the first radiator includes a first inlet and a first outlet. The first inlet is used to communicate with the liquid inlet pipe, and the first outlet is used to communicate with the liquid outlet pipe. At this time, the multiple first radiators included in the multiple power modules are connected in parallel. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of a power module provided by an embodiment of the present application;

[0020] Figure 2 It is another schematic structural diagram of a power module provided by an embodiment of the present application;

[0021] Figure 3 It is a schematic structural diagram of a heat pipe in a power module provided by an embodiment of the present application;

[0022] Figure 4 It is a top view of a power module provided by an embodiment of the present application;

[0023] Figure 5 It is another schematic structural diagram of a power module provided by an embodiment of the present application;

[0024] Figure 6 It is another schematic structural diagram of a power module provided by an embodiment of the present application;

[0025] Figure 7 It is a schematic structural diagram of the series connection of the first radiators in a power module provided by an embodiment of the present application;

[0026] Figure 8 It is a schematic structural diagram of the parallel connection of the first radiators in a power module provided by an embodiment of the present application.

[0027] Reference Signs:

[0028] 10 - Heat pipe; 10a - First heat pipe; 10b - Second heat pipe; 11, 11a, 11b - Top plate; 12 - Bottom plate; 13 - Side plate; 14 - Condensation layer; 15 - Evaporation layer; 16 - Cavity layer; 17 - First trace; 18 - Second trace; 20a - First power transistor; 20b - Second power transistor; 21 - First conductive connection; 22 - Second conductive connection; 23 - Third conductive connection; 30 - Positive DC input terminal; 40 - Negative DC input terminal; 50 - AC output terminal; 60 - First radiator; 61 - Heat dissipation plate; 610 - First inlet; 611 - First outlet; 62 - Heat dissipation fins; 70 - First thermally conductive insulating layer; 80 - Third heat pipe; 800 - First top plate; 801 - First bottom plate; 802 - First side plate; 81 - Metal thermally conductive part; 82 - Second thermally conductive insulating layer; 90 - Second radiator. Detailed implementation manners

[0029] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0030] With the continuous improvement of the functions of in - vehicle motor controllers, the power consumption of the power modules in in - vehicle motor controllers is also increasing continuously, resulting in an increasing amount of heat generated by the power modules. Similarly, the processing capacity of servers is also continuously improving, and the power consumption of the power modules in servers is also increasing continuously with the improvement of the server processing capacity.

[0031] However, in the prior art, the heat dissipation capacity of the power modules is limited. When the power modules are working, the temperature of the power modules is too high, which in turn affects the performance and service life of the power modules.

[0032] In addition, there are many traces inside the power modules, making the structure inside the power modules complex. When the temperature of the power modules is relatively high, the temperature of the traces will also continuously increase, which will affect the performance of the power modules and may also cause danger to the power modules.

[0033] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above - mentioned", "said" and "this" are also intended to include the forms such as "one or more", unless there is a clear contrary indication in the context.

[0034] References to "one embodiment" or "some embodiments" or the like described in this specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having" and their variants all mean "including but not limited to", unless otherwise specifically emphasized.

[0035] An embodiment of the present application provides an inverter. The inverter includes a capacitor module and a plurality of power modules. The plurality of power modules are electrically connected to the capacitor module, and the power module is used to convert the direct current output by the capacitor module into alternating current. In some embodiments, the inverter can be applied to the field of electric vehicles. Specifically, the inverter is applied to the motor controller included in an electric vehicle. At this time, the capacitor module can correspond to the low-frequency ripple voltage caused by the motor back electromotive force, and play a role in filtering and smoothing the voltage for the main circuit and providing reactive power compensation. In some embodiments, the inverter can also be applied to the photovoltaic field. Specifically, the inverter can be applied to a photovoltaic system. In some embodiments, the inverter can also be used in a charging pile.

[0036] The power module will be introduced in detail below. Figure 1 is a schematic structural diagram of a power module provided by an embodiment of the present application; Figure 2 is another schematic structural diagram of a power module provided by an embodiment of the present application. Refer to Figure 1 and Figure 2, in some embodiments, each power module includes a first heat sink 60, a heat pipe 10, a plurality of first power transistors 20a, and a plurality of second power transistors 20b. The heat pipe 10 includes a first heat pipe 10a and a second heat pipe 10b. The plurality of first power transistors 20a are arranged on the surface of the first heat pipe 10a along the first direction X, and the plurality of second power transistors 20b are arranged on the surface of the second heat pipe 10b along the first direction X. The first heat sink 60 is located on the side of the first heat pipe 10a away from the first power transistors 20a and on the side of the second heat pipe 10b away from the second power transistors 20b. Wherein, the first heat pipe 10a includes a plurality of first traces 17, and one end of each of the plurality of first traces 17 is electrically connected to the positive DC input terminal 30. The second heat pipe 10b includes a plurality of second traces 18 and a plurality of third traces. One end of each of the plurality of second traces 18 is electrically connected to the AC output terminal 50, and one end of each of the plurality of third traces is electrically connected to the AC output terminal 50. The positive DC input terminal 30, the negative DC input terminal, and the plurality of first power transistors 20a are all arranged on the surface of the first heat pipe 10a on the side with the first traces 17, and the AC output terminal 50 and the plurality of second power transistors 20b are arranged on the surface of the second heat pipe 10b on the side with the second traces 18 and the third traces. The other end of the first trace 17 is electrically connected to one end of the first power transistor 20a, and the other end of the first power transistor 20a is electrically connected to the other end of the second trace 18; one end of the second power transistor 20b is electrically connected to the negative DC input terminal, and the other end of the second power transistor 20b is electrically connected to the other end of the third trace.

[0037] Wherein, the first heat sink 60 can be a liquid-cooled heat sink or an air-cooled heat sink.

[0038] In this embodiment, after a part of the heat generated by the first power transistor 20a and the second power transistor 20b is dissipated by the first heat spreader 10a and the second heat spreader 10b, part of the heat will be transferred to the first radiator 60 through the first heat spreader 10a and the second heat spreader 10b. The first radiator 60 can absorb the heat transferred through the first heat spreader 10a and the second heat spreader 10b, thereby reducing the temperatures of the first heat spreader 10a and the second heat spreader 10b to dissipate heat from the first power transistor 20a and the second power transistor 20b. Among them, due to the arrangement of the first heat spreader 10a and the second heat spreader 10b, the heat flux density of the heat transferred to the first radiator 60 can be greatly reduced, and the heat dissipation efficiency of the first radiator 60 for the first heat spreader 10a and the second heat spreader 10b can also be improved. In addition, during the transmission of the current, the first trace 17 provided in the first heat spreader 10a enables the first heat spreader 10a to achieve the function of conducting electricity, and the second trace 18 and the third trace provided in the second heat spreader 10b enable the second heat spreader 10b to achieve the function of conducting electricity, which can reduce the number of traces in the internal space of the power module, simplify the internal structure of the power module, and simplify the structure of the power module. Moreover, the first heat spreader 10a and the second heat spreader 10b can also cool the traces in the first heat spreader 10a and the second heat spreader 10b to reduce the possibility of danger.

[0039] In one embodiment, the power module includes a first thermally conductive insulating layer 70. The first heat spreader 10a and the second heat spreader 10b are connected to the first radiator 60 through the first thermally conductive insulating layer 70. In one embodiment, the first heat spreader 10a and the second heat spreader 10b are connected to the first radiator 60 by welding.

[0040] Figure 3 It is a schematic structural diagram of the heat spreader in the power module provided by the embodiment of the present application. Refer to Figure 3 , the heat spreader 10 includes a top plate 11, a bottom plate 12, and a side plate 13. The side plate 13 connects the top plate 11 and the bottom plate 12, and the side plate 13, the top plate 11, and the bottom plate 12 enclose a sealed heat exchange cavity. For ease of understanding, the arrangement direction of the top plate 11 and the bottom plate 12 is defined as the second direction Y, the arrangement direction of the first heat spreader and the second heat spreader is the third direction Z, and the direction perpendicular to the second direction X and the third direction Z is the first direction X.

[0041] In some embodiments, the heat pipe vapor chamber further includes a condensation layer 14 and an evaporation layer 15. The evaporation layer 15 is disposed on the side of the top plate 11 facing the bottom plate 12, and the condensation layer 14 is disposed on the side of the bottom plate 12 facing the top plate 11. The condensation layer 14 and the evaporation layer 15 are arranged at intervals along the second direction Y. Wherein, the heat transfer coefficients of the condensation layer 14 and the evaporation layer 15 are not less than 300,000 W / (m²·K). It can be understood that the gap between the condensation layer 14 and the evaporation layer 15 is a cavity layer 16. When the first power tube 20a generates heat during operation, since the evaporation layer included in the first heat pipe vapor chamber 10a is connected to the side of the top plate 11a included in the first heat pipe vapor chamber 10a facing the bottom plate, the evaporation layer included in the first heat pipe vapor chamber 10a can quickly absorb the heat generated by the first power tube 20a to reduce the operating temperature of the first power tube 20a. Similarly, when the second power tube 20b generates heat during operation, since the evaporation layer included in the second heat pipe vapor chamber 10b is connected to the side of the top plate 11b included in the second heat pipe vapor chamber 10b facing the bottom plate, the evaporation layer included in the second heat pipe vapor chamber 10b can quickly absorb the heat generated by the second power tube 20b to reduce the operating temperature of the second power tube 20b.

[0042] Wherein, along the third direction Z, the thickness of the top plate 11 is less than 1 / 5 of the thickness of the heat pipe vapor chamber 10, the thickness of the bottom plate 12 is less than 1 / 5 of the thickness of the heat pipe vapor chamber 10, the thickness of the cavity layer 16 is less than 1 / 2 of the thickness of the heat pipe vapor chamber 10, the thickness of the condensation layer 14 is less than 1 / 5 of the thickness of the heat pipe vapor chamber 10, and the thickness of the evaporation layer 15 is less than 1 / 5 of the thickness of the heat pipe vapor chamber 10. Both the evaporation layer 15 and the condensation layer 14 can be capillary structures. The materials of the side plate 13 and the bottom plate 12 are both copper. Or the materials of the top plate 11, the side plate 13 and the bottom plate 12 are insulating and heat-conducting materials.

[0043] Continue to refer to Figure 1 and Figure 2, in the above embodiments, multiple first traces 17 are disposed in the top plate 11a of the first heat spreader 10a. A plurality of first power transistors 20a are arranged along the first direction X on the side of the top plate 11a facing away from the bottom plate. One end of the positive DC input terminal 30 and one end of the negative DC input terminal 40 are arranged on the side of the top plate 11a facing away from the bottom plate. Multiple second traces 18 and multiple third traces are both disposed in the top plate 11b of the second heat spreader 10b. A plurality of first power transistors 20a are arranged along the first direction X on the side of the top plate 11a facing away from the bottom plate. One end of the AC output terminal 50 is arranged on the side of the top plate facing away from the bottom plate. One end of a plurality of first power transistors 20a can be fixed to the surface of the top plate 11a included in the first heat spreader 10a by welding and is electrically connected to the other end of the first trace 17 in the top plate 11a. The other ends of the plurality of first power transistors 20a are used to be connected to the other end of the second trace 18 on the top plate 11b included in the second heat spreader 10b. The other ends of a plurality of second power transistors 20b can also be fixed to the surface of the top plate 11b included in the second heat spreader 10b by welding and are electrically connected to the other end of the third trace in the second heat spreader 10b. In this way, the top plate 11a included in the first heat spreader 10a can realize the function of electrically connecting the first power transistor 20a fixed on the top plate 11a to the positive DC input terminal 30. The top plate 11b included in the second heat spreader 10b can realize the electrical connection between the first power transistor 20a and the AC output terminal 50. The top plate 11b included in the second heat spreader 10b can also realize the electrical connection between the second power transistor 20b and the AC output terminal 50. The other end of the second power transistor 20b is electrically connected to the negative DC input terminal through an external trace, which can reduce the number of external traces in the power module and simplify the structure of the power module.

[0044] Figure 4 is a top view of the power module provided by the embodiment of the present application. Refer to Figure 2 and Figure 4 , the power module further includes a first conductive connection member 21 for electrically connecting the other end of the first power transistor 20a to the other end of the second trace 18. Specifically, the number of both the first power transistors 20a and the second power transistors 20b is four. The four first power transistors 20a are arranged at intervals along the first direction X on the top plate 11a included in the first heat spreader 10a. The four second power transistors 20b are arranged at intervals along the first direction X on the top plate 11b included in the second heat spreader 10b.

[0045] The positive DC input terminal 30 and the two negative DC input terminals 40 are connected to the side of the top plate 11a of the first heat spreader 10a away from the second heat spreader 10b along the second direction Y. Among them, the positive DC input terminal 30 is located between the two negative DC input terminals 40. The AC output terminal 50 is connected to the side of the top plate 11b of the second heat spreader 10b away from the first heat spreader 10a. The direct current passes through the positive DC input terminal 30 and the first trace 17 and flows through the first power transistor 20a. The other end of the first power transistor 20a is electrically connected to the other end of the second trace 18 in the top plate 11b through the first conductive connection member 21, and the current flows through the second trace 18 to the AC output terminal 50. The AC output terminal 50 is electrically connected to the four second power transistors 20b through the third trace in the top plate 11b. Among them, two of the second power transistors 20b are connected to one negative DC input terminal 40 through one trace, and the other two second power transistors 20b are connected to the other negative DC input terminal 40 through another trace. In this way, when the first power transistor 20a and the second power transistor 20b perform DC-AC conversion, the heat generated by the first power transistor 20a can be directly dissipated through the first heat spreader 10a, and the heat generated by the second power transistor 20b can be directly dissipated through the second heat spreader 10b to ensure the stability of the operation of the first power transistor 20a and the second power transistor 20b. In addition, during the transmission of the current, both the top plate 11a included in the first heat spreader 10a and the top plate 11b included in the second heat spreader 10b can play the role of conducting electricity, which can reduce the number of traces in the power module and simplify the internal structure of the power module, making the structure of the power module simpler. Moreover, by directly fixing the first power transistor 20a on the first heat spreader 10a and the second power transistor 20b on the second heat spreader 10b, the heat dissipation efficiency of the power module can be further improved.

[0046] Among them, the first power transistor 20a can also be directly connected to the top plate 11a included in the first heat spreader 10a through a sintering process, and the second power transistor 20b can also be directly connected to the top plate 11b included in the second heat spreader 10b through a sintering process.

[0047] In an embodiment, the projection of the first heat sink 60 along the third direction Z completely covers the projections of the first heat spreader 10a and the second heat spreader 10b connected to the first heat sink 60. To ensure the stability of the connection between the first heat spreader 10a and the second heat spreader 10b and the first heat sink 60. In addition, the heat transfer rate between the first heat spreader 10a and the second heat spreader 10b and the first heat sink 60 can also be guaranteed.

[0048] Figure 5 Another structural schematic diagram of the power module provided by the embodiment of the present application, refer to Figure 5, In one embodiment, the power module includes a third heat spreader 80, which is located on the side of the first power transistor 20a facing away from the first heat spreader 10a and the second power transistor 20b facing away from the second heat spreader 10b. It can be understood that, along the third direction Z, one side of the first power transistor 20a is cooled by the first heat spreader 10a, and the other side of the first power transistor 20a is cooled by the third heat spreader 80, thereby improving the heat dissipation efficiency of the first power transistor 20a in the power module.

[0049] In some embodiments, the packaging structure packages the first power transistor 20a and the second power transistor 20b on the surfaces of the first heat spreader 10a and the second heat spreader 10b. The third heat spreader is attached to the surface of the packaging structure to dissipate heat from the packaged first power transistor 20a and second power transistor 20b.

[0050] In some embodiments, when the packaging structure packages the first power transistor 20a and the second power transistor 20b, the third heat spreader 80 can be packaged on the side facing the first heat spreader 10a. At this time, one ends of the four first power transistors 20a fixed on the top plate 11a included in the first heat spreader 10a are electrically connected to the positive DC input terminal 30 through the first trace 17 in the top plate 11a, and the other ends of the first power transistors 20a are electrically connected to the side of the third heat spreader 80 facing the first heat spreader 10a through the second conductive connector 22. The third heat spreader 80 and the top plate 11b included in the second heat spreader 10b are electrically connected through the third conductive connector 23 and are electrically connected to the AC output terminal 50 through the second trace 18 in the top plate 11b. One ends of the four second power transistors 20b fixed on the top plate 11b included in the second heat spreader 10b are electrically connected to the negative DC input terminal through an external trace, and the other ends of the four second power transistors 20b fixed on the top plate 11b included in the second heat spreader 10b are electrically connected to the AC output terminal 50 through the third trace in the top plate 11b. In this setting, the side of the third heat spreader 80 facing the first heat spreader 10a serves as a part of the packaging structure, which can not only dissipate heat from the first power transistor 20a but also serve as a structure for electrically connecting the first power transistor 20a and the second trace 18. In addition, the third heat spreader 80 and the first heat spreader 10a enable the first power transistor 20a to dissipate heat bidirectionally, further improving the heat dissipation efficiency of the first power transistor 20a. Moreover, the third heat spreader 80, as a part of the electrical connection structure, can also reduce the layout of the traces.

[0051] Continue to refer to Figure 5, the third heat pipe 80 includes a first top plate 800, a first bottom plate 801 and a first side plate 802. The first side plate 802 is used to hermetically connect the first top plate 800 and the first bottom plate 801. The first top plate 800, the first bottom plate 801 and the first side plate 802 enclose a sealed heat exchange cavity. In the projection in the third direction Z, the third heat pipe 80 at least partially overlaps with the first heat pipe and the second heat pipe. One end of the first power tube 20a on the top plate 11a of the first heat pipe 10a is electrically connected to the positive DC input terminal 30 through the first wiring 17 in the top plate 11a, and the other end of the first power tube 20a is electrically connected to the first top plate 800 through the second conductive connector 22. The first top plate 800 is also electrically connected to the second wiring 18 in the top plate 11b through the third conductive connector 23. In this way, the first top plate 800 can be regarded as a conductive structural member. In the third direction Z, the first top plate 800 overlaps with the top plate 11a and the top plate 11b to facilitate the electrical connection between the first top plate 800 and the second conductive connector 22 and the third conductive connector 23. Among them, the first top plate 800 may include a plurality of fourth wirings. One end of the fourth wiring is electrically connected to the second conductive member 22, and the other end of the fourth wiring is electrically connected to the third conductive member 23.

[0052] It is worth mentioning that the number of the third heat pipes 80 can be one, two, three or more, as long as the first top plate 800 included in each third heat pipe 80 can electrically connect the first power tube 20a on the top plate 11a to the second wiring 18 in the top plate 11b. The third heat pipe 80 has the same structure as the first heat pipe 10a and the second heat pipe 10b. The third heat pipe 80 also includes a first evaporation layer and a first condensation layer. The first evaporation layer is arranged on the side of the first top plate 800 facing the first bottom plate 801, and the first condensation layer is arranged on the side of the first bottom plate 801 facing the first top plate 800. The first evaporation layer and the first condensation layer are arranged at intervals along the third direction Z, and the gap between the first evaporation layer and the first condensation layer is the first cavity layer.

[0053] Figure 6 Another structural schematic diagram of the power module provided by the embodiment of the present application. Refer to Figure 6, In one embodiment, the power module includes a metal heat conducting member 81. The projection of the metal heat conducting member 81 along the third direction Z coincides at least partially with the projections of the first heat spreader 10a and the second heat spreader 10b. It can be understood that in the projection along the third direction Z, the projection of the metal heat conducting member 81 coincides at least partially with the projections of the top plate 11a and the top plate 11b. One end of the first power transistor 20a on the top plate 11a is electrically connected to the positive DC input terminal 30 through the first trace 17 in the top plate 11a, and the other end of the first power transistor 20a on the top plate 11a is electrically connected to the metal heat conducting member 81 through the second conductive connector 22. The metal heat conducting member 81 is also electrically connected to the second trace 18 in the top plate 11b through the third conductive connector 23. In this way, the metal heat conducting member 81 is a conductive structural member, and the metal heat conducting member 81 overlaps with the top plate 11a and the top plate 11b in the projection in the first direction, so as to facilitate the electrical connection between the metal heat conducting member 81 and the second conductive connector 22 and the third conductive connector 23.

[0054] It is worth mentioning that the number of the metal heat conducting members 81 can be one, two, three or more, as long as each metal heat conducting member 81 can electrically connect the first power transistor 20a on the top plate 11a to the second trace 18 in the top plate 11b. The material of the metal heat conducting member 81 is copper.

[0055] Refer to Figure 5 and Figure 6 , In the above embodiment, the power module includes a second radiator 90. The second radiator 90 is thermally connected to the third heat spreader 80 through a second thermally conductive insulating layer 82. It can be understood that the second radiator 90 is thermally connected to the first bottom plate 801 through the second thermally conductive insulating layer 82. The second radiator 90 can also be thermally connected to the metal heat conducting member 81 through the second thermally conductive insulating layer 82. At this time, the heat generated by the first power transistor 20a and the second power transistor 20b can be transferred to the first radiator 60 through the first heat spreader 10a and the second heat spreader 10b for heat dissipation. The heat generated by the first power transistor 20a can also be transferred to the second radiator 90 through the third heat spreader 80 or the metal heat conducting member for heat dissipation. Among them, the second radiator 90 can be a liquid-cooled radiator or an air-cooled radiator.

[0056] Figure 7 This is a schematic structural diagram of the first radiator in series in the power module provided by the embodiment of the present application. Refer to Figure 7, in the above embodiments, when the power module is applied to an inverter, the inverter includes three power modules. When each power module includes a first radiator 60, each first radiator 60 includes a heat dissipation plate 61 and a plurality of heat dissipation fins 62 fixedly connected to the heat dissipation plate. The plurality of heat dissipation fins 62 are uniformly distributed on the side of the heat dissipation plate 61 facing away from the first thermally conductive insulating layer 70. The side of the first thermally conductive insulating layer 70 facing away from the heat dissipation plate 61 is used to fix the first heat pipe 10a and the second heat pipe 10b. Wherein, each heat dissipation plate 61 includes a first inlet 610 and a first outlet 611, and the first inlet 610 and the first outlet 611 are arranged at intervals along the second direction Y. Two adjacent first cold night radiators 60 can be connected in series. It can be understood that the first inlet 610 of the first radiator 60 located at the head end along the second direction Y is used to communicate with the liquid inlet pipe, the first outlet 611 of the first radiator 60 located at the head end is communicated with the first inlet 610 of the second first radiator 60, the first outlet 611 of the second first radiator 60 is communicated with the first inlet 610 of the third first radiator 60, and the first outlet 611 of the third first radiator 60 is used to communicate with the liquid outlet pipe, so that the refrigerant can complete the transmission and the first radiator can be cooled.

[0057] Figure 8 Schematic diagram of the parallel connection of the first radiators in the power module provided by the embodiment of the present application. Refer to Figure 8 , in one embodiment, the first inlet 610 of each first radiator 60 is communicated with the liquid inlet pipe, and the first outlet 611 of each first radiator 60 is communicated with the liquid outlet pipe. At this time, the three first radiators 60 are in a parallel connection state. Or, among the three first radiators 60, two adjacent first radiators 60 are connected in parallel and connected in series with the other first radiator 60.

[0058] In the above embodiments, when each power module includes a second radiator and a second radiator, the setting method of the second radiator can be the same as that of the first radiator. And when the three first radiators are connected in series, the three second radiators can be connected in series, in parallel or partially in series and then in parallel.

[0059] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. A power module, characterized in that, The power module comprises: A temperature averaging plate, wherein the temperature averaging plate comprises a first temperature averaging plate and a second temperature averaging plate; The first temperature homogenizing plate includes a plurality of first wirings, and one end of the plurality of first wirings is used to be electrically connected to the positive DC input terminal; The second temperature homogenizing plate includes a plurality of second wirings and a plurality of third wirings, and one end of the plurality of second wirings and one end of the plurality of third wirings are both used to be electrically connected to the AC output end; A plurality of first power tubes, wherein the plurality of first power tubes are arranged on a surface of the first temperature homogenizing plate on one side of the first wiring, the plurality of first power tubes are arranged at intervals along a first direction, one end of the first power tube is electrically connected to the other end of the first wiring, and the other end of the first power tube is used to be electrically connected to the other end of the second wiring; A plurality of second power tubes are arranged on a surface of the second temperature equalizing plate having the second wiring and the third wiring on one side, the plurality of second power tubes are arranged at intervals along a first direction, one end of the second power tube is used to be electrically connected to the negative DC input terminal, and the other end of the second power tube is electrically connected to the other end of the third wiring.

2. The power module according to claim 1, wherein The temperature equalizing plate comprises a top plate, a bottom plate, a side plate, a condensation layer and an evaporation layer, the side plate is used to connect the bottom plate and the top plate, and the top plate, the bottom plate and the side plate enclose to form a sealed heat exchange cavity; The evaporation layer is arranged on a side of the top plate facing the bottom plate, the condensation layer is arranged on a side of the bottom plate facing the top plate, and the condensation layer and the evaporation layer are arranged at intervals along an arrangement direction of the top plate and the bottom plate.

3. The power module according to claim 1 or 2, characterized in that, The top plate of the first temperature equalizing plate includes the plurality of first wirings, and the plurality of first power tubes, the positive DC input terminal and the negative DC input terminal are arranged on a side of the top plate of the first temperature equalizing plate away from the bottom plate of the first temperature equalizing plate.

4. The power module according to claim 3, wherein, The top plate of the second temperature equalizing plate includes the plurality of second wirings and the plurality of third wirings, and the AC output end is arranged on a side of the top plate of the second temperature equalizing plate away from the bottom plate of the second temperature equalizing plate.

5. The power module according to any one of claims 1 to 4, characterized in that The power module includes a first radiator, and a side of the first temperature averaging plate facing away from the first power tube and a side of the second temperature averaging plate facing away from the second power tube are both connected to the first radiator.

6. The power module according to claim 5, wherein, The power module includes a first heat-conducting insulating layer, and the first heat-conducting insulating layer is located between the first heat sink and the first and second temperature-vaporizing plates.

7. The power module according to claim 6, wherein, In the projection of the first heat sink, the first thermally conductive insulating layer completely covers the first temperature vapor chamber and the second temperature vapor chamber.

8. The power module according to any one of claims 5 to 7, characterized in that, The power module includes a first conductive connector, the other end of the first power tube is electrically connected to one end of the first conductive connector, and the other end of the first conductive connector is electrically connected to the other end of the second wiring.

9. The power module according to any one of claims 5 to 7, characterized in that The power module includes a third temperature averaging plate, a second conductive connector and a third conductive connector, the third temperature averaging plate is located on a side of the first power tube away from the first temperature averaging plate, one end of the second conductive connector is electrically connected to the other end of the first power tube, the other end of the second conductive connector is electrically connected to the third temperature averaging plate, one end of the third conductive connector is electrically connected to the third temperature averaging plate, and the other end of the third conductive connector is electrically connected to the other end of the second trace, wherein: The other end of the second conductive connection member and one end of the third conductive connection member are electrically connected through the third temperature homogenizing plate.

10. The power module according to any one of claims 5 to 7, characterized in that, The power module includes a metal heat conductor, a second conductive connector and a third conductive connector. The metal heat conductor is located on the side of the first power tube away from the first temperature equalizing plate, one end of the second conductive connector is electrically connected to the other end of the first power tube, the other end of the second conductive connector is electrically connected to the metal heat conductor, one end of the third conductive connector is electrically connected to the metal heat conductor, and the other end of the third conductive connector is electrically connected to the other end of the second trace.

11. The power module according to claim 9, wherein The power module includes a second heat sink, and the second heat sink is fixed to a side of the third temperature averaging plate away from the first temperature averaging plate through a second heat conductive insulating layer.

12. The power module according to claim 10, wherein, The power module includes a second heat sink, and the second heat sink is fixed to a side of the metal heat conductive member away from the first temperature homogenizing plate through a second heat conductive insulating layer.

13. An inverter, characterized in that, It comprises a capacitor module and a plurality of power modules as claimed in any one of claims 5 to 12, wherein the plurality of power modules are electrically connected to the capacitor module.

14. The inverter according to claim 13, wherein The first radiator includes a first inlet and a first outlet; In two adjacent first radiators, the first outlet of the preceding first radiator is used to communicate with the first inlet of the succeeding first radiator; or the first inlet is used to communicate with the liquid inlet pipe, and the first outlet is used to communicate with the liquid outlet pipe.

Images