Module power supply for communication equipment

Abstract

The invention relates to the technical field of power supplies, in particular to a module power supply for communication equipment, which comprises an input filtering unit, at least two stages of power conversion units, an output voltage stabilization unit, an intelligent control module, a fault reconstruction unit and a composite heat dissipation structure, the input filtering unit is connected with the power conversion unit, the power conversion unit is connected with the output voltage stabilization unit, the output voltage stabilization unit is connected with a load end, and the input filtering unit, the power conversion unit, the output voltage stabilization unit, the fault reconstruction unit and the composite heat dissipation structure are respectively connected with the intelligent control module. The composite heat dissipation structure comprises a metal heat conduction substrate, a phase change material layer and a micro-channel liquid cooling module, the phase change material layer is arranged on the metal heat conduction substrate, the micro-channel liquid cooling module is arranged on the phase change material layer, and the metal heat conduction substrate is connected with the power device through heat conduction silica gel for heat conduction; when the fault reconstruction unit detects local failure, the damaged module is switched to be in a bypass state, current sharing parameters of the remaining modules are reconfigured, and the output power of the power supply is maintained to be not lower than 75% of a rated value. Compared with the prior art, the module power supply for the communication equipment has high-efficiency conversion and wide adaptability, and the efficiency is optimized in a full-load range; intelligent thermal management and reliability are enhanced, temperature rise control is obviously optimized, the phase change material layer absorbs transient thermal shock, temperature fluctuation is reduced, flow of the micro-channel liquid cooling module is adaptively adjusted, and power consumption is reduced; dynamic performance and stability are improved, multi-module parallel current sharing precision is improved, circulating current loss is reduced, and faults can be rapidly recovered.

Description

Technical Field

[0001] The present invention relates to the technical field of power supplies, and particularly to a modular power supply for communication devices.

Background Art

[0002] The heat dissipation efficiency of the existing communication power supplies is low, the reliability decreases in high-temperature environments, and the circulating current problem during parallel connection of multiple modules easily leads to efficiency loss.

Summary of the Invention

[0003] In order to overcome the above problems, the present invention proposes a modular power supply for communication devices that can effectively solve the above problems.

[0004] A technical solution provided by the present invention to solve the above technical problems is: to provide a modular power supply for communication devices, including an input filtering unit, at least two-stage power conversion units, an output voltage regulation unit, an intelligent control module, a fault reconstruction unit, and a composite heat dissipation structure; the input filtering unit is connected to the power conversion unit, the power conversion unit is connected to the output voltage regulation unit, and the output voltage regulation unit is connected to the load end. The input filtering unit, the power conversion unit, the output voltage regulation unit, the fault reconstruction unit, and the composite heat dissipation structure are respectively connected to the intelligent control module; the composite heat dissipation structure includes a metal heat conduction substrate, a phase change material layer, and a microchannel liquid cooling module. The phase change material layer is provided on the metal heat conduction substrate, and the microchannel liquid cooling module is provided on the phase change material layer. The metal heat conduction substrate is connected to the power device through thermal conductive silicone for heat conduction; when the fault reconstruction unit detects a local failure, it switches the damaged module to a bypass state and reconfigures the current sharing parameters of the remaining modules to maintain the power output of the power supply not less than 75% of the rated value.

[0005] Preferably, the intelligent control module includes a load prediction unit, which establishes an ARIMA prediction model by collecting historical load data and dynamically adjusts the switching frequency and dead time of the power device.

[0006] Preferably, the input filtering unit uses a combination of a third-order EMI filter and a TVS transient suppression diode, and integrates an active common-mode interference cancellation circuit.

[0007] Preferably, the planar transformer in the power conversion unit adopts a magnetic integration structure, and the primary winding and the secondary winding are staggered on a multi-layer PCB board, and a nanocrystalline shielding layer is provided between the windings.

[0008] Preferably, the output voltage regulation unit includes a digitally adjustable parallel voltage regulation circuit, and realizes 0.5% precision adjustment of the output voltage through a DAC module.

[0009] Preferably, the phase change material layer is a graphene-enhanced composite phase change material with a thickness of 1.2 mm and embedded distributed fiber optic temperature sensors.

[0010] Preferably, the cross-section of the microchannel liquid cooling module is trapezoidal, with the upper base being 0.25 mm, the lower base being 0.35 mm, and the height being 0.8 mm. It adopts a gradient density layout, with a channel spacing of 0.5 mm in the inlet area and 1.0 mm in the outlet area.

[0011] Preferably, the intelligent control module includes a fault arc detection unit, which realizes microsecond-level fault isolation through a dual judgment mechanism of high-frequency current ripple analysis and ultraviolet photosensitive detection.

[0012] Preferably, the intelligent control module integrates a wireless communication unit, supports Bluetooth 5.0 and LoRa dual-mode communication, and can upload working state parameters in real time and receive remote control instructions.

[0013] Preferably, the intelligent control module includes a dual-core heterogeneous processor architecture and a load prediction model based on transfer learning. The input features include historical load sequences, ambient temperature, and network traffic data.

[0014] Compared with the prior art, the modular power supply for communication devices of the present invention has the following beneficial effects:

[0015] 1. High-efficiency conversion and wide adaptability, with optimized efficiency within the full load range;

[0016] 2. Intelligent thermal management and enhanced reliability, with significantly optimized temperature rise control. The phase change material layer absorbs transient thermal shocks, reduces temperature fluctuations, and the microchannel liquid cooling module adaptively adjusts the flow rate, reducing power consumption;

[0017] 3. Improved dynamic performance and stability, with improved current sharing accuracy in parallel connection of multiple modules, reducing circulating current losses, and the ability to quickly recover from faults.

Description of the Drawings

[0018] Figure 1 It is a functional block diagram of the modular power supply for communication devices of the present invention.

Specific Embodiments

[0019] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0020] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only relative positions on the specified views, rather than absolute positions.

[0021] In addition, in the present invention, descriptions such as "first" and "second" are for descriptive purposes only, and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0022] Please refer to Figure 1 , the module power supply for communication equipment of the present invention includes an input filtering unit, at least two-stage power conversion units, an output voltage stabilizing unit, an intelligent control module, and a composite heat dissipation structure; the input filtering unit is connected to the power conversion unit, the power conversion unit is connected to the output voltage stabilizing unit, and the output voltage stabilizing unit is connected to the load terminal. The input filtering unit, the power conversion unit, the output voltage stabilizing unit, and the composite heat dissipation structure are respectively connected to the intelligent control module.

[0023] The power conversion unit adopts a cascaded structure of an LLC resonant converter and a DC-DC converter, and the second-stage converter includes a switchable topology module;

[0024] The composite heat dissipation structure is a three-dimensional heat dissipation component including a metal heat conduction substrate, a phase change material layer, and a microchannel liquid cooling module. A phase change material layer is provided on the metal heat conduction substrate, and a microchannel liquid cooling module is provided on the phase change material layer. The metal heat conduction substrate is connected to the power device through heat-conducting silica gel for heat conduction.

[0025] The metal heat conduction substrate is an AlSiC metal substrate (thermal conductivity ≥ 240 W / m·K), with a thickness of 2.5 mm.

[0026] The phase change material layer is a graphene-enhanced composite phase change material (phase change temperature 72 ± 2 °C, latent heat ≥ 200 J / g), with a thickness of 1.2 mm, and an embedded distributed optical fiber temperature sensor (spatial resolution 1 mm).

[0027] The channel cross-section of the microchannel liquid cooling module has a trapezoidal structure (upper base 0.25 mm, lower base 0.35 mm, height 0.8 mm), and is arranged with a gradient density (channel spacing in the inlet area is 0.5 mm, and in the outlet area is 1.0 mm).

[0028] The intelligent control module includes a load prediction unit. The load prediction unit establishes an ARIMA prediction model by collecting historical load data, and dynamically adjusts the switching frequency and dead time of the power device. The power device adopts a hybrid packaging structure of GaN-HEMT and Si-SBD, and the adjustable switching frequency range is 200 kHz - 1 MHz.

[0029] The intelligent control module includes:

[0030] a) Dual-core heterogeneous processor architecture (ARM Cortex-M7 main control core + DSP digital power core);

[0031] b) Load prediction model based on transfer learning, with input features including historical load sequence, ambient temperature, and network traffic data;

[0032] c) Multi-physical field collaborative control strategy, synchronously optimizing switching loss (≤2.8 μJ / A), thermal stress (ΔT ≤ 15 °C), and EMI noise (<30 dBμV).

[0033] The load prediction model uses a spatio-temporal attention mechanism neural network, and the input dimensions include:

[0034] Historical load time series (sampling interval 10 ms, time window length 5 min);

[0035] Base station traffic prediction data (5G NR subframe scheduling information);

[0036] Environmental parameters (temperature, humidity, altitude);

[0037] Operating status of adjacent modules (obtained through CAN FD bus);

[0038] The model output is the load change curve within the next 30 seconds, and the prediction error ≤ 3%; the DSP digital power core dynamically adjusts according to the prediction result:

[0039] a) GaN HEMT gate drive voltage (regulation range +5V / -2V);

[0040] b) LLC resonance frequency (regulation accuracy ±5 kHz);

[0041] c) Microchannel coolant flow rate (PID control coefficients Kp, Ki, Kd).

[0042] The input filter unit uses a combination of a third-order EMI filter and a TVS transient suppression diode, and integrates an active common-mode interference cancellation circuit.

[0043] The input filter unit includes a three-stage EMI filter network composed of X2 / Y1 safety capacitors, common-mode inductors, and transient suppression diodes. An active surge absorption circuit based on SiC-JFET is integrated at its front end, and this circuit is triggered for dynamic clamping by a dU / dt detection module (sampling rate ≥ 10 MS / s).

[0044] The active surge absorption circuit includes:

[0045] Surge feature extraction module: uses a dual-channel parallel ADC (16-bit, 200 MS / s) to synchronously collect voltage / current differential signals;

[0046] Dynamic clamping circuit: A cascaded absorption network is formed by a SiC-JFET (1700V / 25A) and a TVS diode (SMBJ series);

[0047] Energy recovery unit: The absorbed energy is converted to the auxiliary power bus through a flyback topology (efficiency ≥ 82%);

[0048] The circuit achieves in the 8 / 20 μs surge waveform test:

[0049] Residual voltage ratio ≤ 1.3 (compared with the traditional MOV solution ≥ 1.8);

[0050] Response time ≤ 5 ns (IEC 61000-4-5 Class 4 standard).

[0051] The planar transformer in the power conversion unit adopts a magnetic integration structure, with the primary winding and the secondary winding staggered on a multi-layer PCB board, and a nanocrystalline shielding layer is arranged between the windings.

[0052] The power conversion unit adopts a hybrid topology architecture, including:

[0053] a) The front-stage PFC circuit adopts an interleaved parallel totem-pole topology, configured with a hybrid switch combination of GaN-HEMT (650V / 60A) and SiC-MOSFET (1200V / 30A), and dynamically distributes the conducting devices according to the input voltage range (85 - 305VAC);

[0054] b) The intermediate-stage LLC resonant converter adopts a magnetic integration planar transformer, and its resonant cavity parameters (Lr = 22 μH ± 5%, Cr = 47 nF ± 2%) can be adjusted online by ±15% through a digital potentiometer;

[0055] c) The rear-stage DCX converter is configured with two operating modes: zero-voltage switching mode (load > 40%) and pulse frequency modulation mode (load ≤ 40%).

[0056] The magnetic integration planar transformer adopts:

[0057] A six-layer stacked PCB winding structure (2 oz copper thickness, line width / spacing = 0.15 mm / 0.1 mm);

[0058] A composite magnetic core of nanocrystalline alloy (Fe-Si-B-Cu, thickness 25 μm) and ferrite (Mn-Zn, initial magnetic permeability ≥ 12000);

[0059] A distributed air gap adjustment mechanism (driven by a stepper motor, adjustment accuracy ±0.01 mm);

[0060] Through ANSYS Maxwell simulation optimization, the following are achieved at a working frequency of 500 kHz:

[0061] Leakage inductance ≤ 0.5%;

[0062] Proximity effect loss reduced by 62%;

[0063] Winding AC resistance (Rac / Rdc) ≤ 1.2.

[0064] The output voltage regulation unit includes a digitally adjustable shunt voltage regulation circuit, and realizes 0.5% precision regulation of the output voltage through the DAC module.

[0065] The digitally adjustable shunt voltage regulation circuit includes:

[0066] Adaptive ripple compensation module: Real-time decomposes the output voltage ripple component based on Hilbert-Huang transform;

[0067] Multi-objective optimization controller: Establishes a cost function including efficiency, ripple, and thermal stress:

[0068] J = α·η -1 +β·V ripple +γ·T j ;

[0069] Gallium nitride-driven LDO voltage regulator (voltage drop ≤ 0.15V@10A);

[0070] In the dynamic load (10%-90% step change) test, the following are achieved:

[0071] Output voltage recovery time ≤ 20μs;

[0072] Overshoot ≤ 0.8%;

[0073] Cross-regulation rate ≤ ±0.5%.

[0074] The phase change material layer of the composite heat dissipation structure contains graphene-enhanced composite phase change material, whose phase change temperature is 65-75°C and is doped with carbon nanotube thermal conductivity enhancer.

[0075] The composition of the graphene-enhanced composite phase change material includes:

[0076] Matrix materials: paraffin wax (70-75wt%), stearic acid (15-20wt%);

[0077] Thermal conductivity enhancer: three-dimensional graphene foam (5-8wt%, specific surface area ≥ 1500m 2 / g);

[0078] Nanoscale additive: boron nitride nanotubes (2-3wt%, diameter 50-80nm);

[0079] The test by differential scanning calorimetry (DSC) shows that:

[0080] Phase change enthalpy value: 210 - 225 J / g;

[0081] Thermal cycle stability: the enthalpy value decay ≤ 3% after 500 cycles;

[0082] Anisotropic thermal conductivity: in-plane ≥ 25 W / m·K, normal direction ≥ 8 W / m·K.

[0083] The intelligent control module includes a fault arc detection unit, and the fault arc detection unit realizes microsecond-level fault isolation through a dual judgment mechanism of high-frequency current ripple analysis and ultraviolet photosensitive detection.

[0084] The fault arc detection unit adopts a fault arc detection method, and the fault arc detection method includes:

[0085] High-frequency harmonic analysis: capturing the current waveform through a 12-bit ADC at a sampling rate of 50 MS / s and extracting the characteristics of the 2 - 20 MHz frequency band;

[0086] Ultraviolet spot positioning: adopting a 16×16 array ultraviolet sensor (response wavelength 180 - 260 nm);

[0087] Multi-modal fusion decision-making: establishing a deep residual network (ResNet-18) classification model;

[0088] The training data set includes:

[0089] 5000 groups of normal arc (welding, relay operation) samples;

[0090] 8000 groups of fault arc (poor contact, insulation breakdown) samples;

[0091] The test results show that:

[0092] The detection accuracy rate ≥ 99.2%;

[0093] The false alarm rate ≤ 0.15%;

[0094] The response time ≤ 8 μs.

[0095] The module power supply for communication equipment of the present invention supports N + 1 redundant parallel operation, and dynamic current sharing control is carried out between modules through the CAN bus, and the current sharing accuracy is better than ±2%.

[0096] The dynamic current sharing control includes:

[0097] Active current sharing technology based on impedance reshaping: measuring the impedance difference between modules by injecting a small signal perturbation of 10 - 100 kHz;

[0098] Nonlinear robust controller:

[0099]

[0100] where δ is the adaptive sliding mode gain;

[0101] Experimental data show that:

[0102] When 8 modules are connected in parallel, the current sharing accuracy ≤ ±1.2%;

[0103] The system stability margin ≥ 45°;

[0104] The dynamic response bandwidth is increased to 2 kHz.

[0105] The intelligent control module integrates a wireless communication unit, supports Bluetooth 5.0 and LoRa dual-mode communication, and can upload working state parameters in real time and receive remote control instructions.

[0106] The wireless communication unit supports:

[0107] Physical layer security protocol: Key exchange mechanism based on post-quantum cryptographic algorithm (NTRUEncrypt);

[0108] Dual-band concurrent transmission: Intelligent switching between Sub-6GHz (3.5GHz) and millimeter wave (28GHz);

[0109] Digital pre-distortion compensation: Using the Volterra series model to correct the nonlinearity of the power amplifier;

[0110] Measured performance:

[0111] Transmission distance: Line-of-sight environment ≥ 200m (compared with the traditional scheme ≤ 50m);

[0112] Data throughput: 15Mbps upstream / 30Mbps downstream;

[0113] Bit error rate (BER): ≤ 1×10 -9 (when SNR = 15dB).

[0114] The module power supply for communication equipment of the present invention includes a fault reconstruction unit, which is connected to the intelligent control module. When a local failure is detected, the damaged module is switched to the bypass state through the topology reconstruction controller, and the current sharing parameters of the remaining modules are reconfigured to maintain the power output of the power supply not less than 75% of the rated value.

[0115] The fault reconstruction unit includes:

[0116] High-speed sampling circuit:

[0117] Adopt a 4-channel synchronous ADC (AD7606C-18, 18-bit, 8 MS / s);

[0118] Monitoring parameters: output voltage ripple (0 - 60 V), module current (0 - 50 A), device junction temperature (-40 - 150 °C), arc ultraviolet intensity (0 - 500 nW / cm 2 );

[0119] Fault feature extractor:

[0120] FPGA (Xilinx Artix-7) implements the wavelet transform algorithm to extract high-frequency noise components of 2 - 20 MHz;

[0121] Ultraviolet pulse counter (resolution 1 ns);

[0122] Fast disconnector array:

[0123] Main power path: SiC MOSFETs (C3M0065100K, 1000 V / 60 A) and mechanical relays (TE Connectivity KILOVAC series) are configured in parallel;

[0124] Bypass path: GaN HEMT (EPC2053) with ultra-low on-resistance (RDS(on) = 2 mΩ);

[0125] Driver circuit: Isolated driver chip (ADI ADuM4121, propagation delay < 15 ns);

[0126] Topology reconfiguration controller:

[0127] Dual-redundant MCU (TI TMS320F28379D, dual-core C28x);

[0128] Configuration parameter storage: FRAM (4 MB, read / write cycle 50 ns).

[0129] The working process of the fault reconfiguration unit includes:

[0130] 1. Fault detection stage:

[0131] Multi-dimensional criteria:

[0132]

[0133] Parallel processing mechanism: Three detection channels operate independently, adopting a "two-out-of-three" voting logic; 2. Fault isolation stage:

[0134] Timing control:

[0135] At t0 + 50 ns, turn off the PWM signal of the faulty module;

[0136] At t0 + 100 ns, turn on the bypass GaN switch;

[0137] At t0 + 200 ns, cut off the main power SiC MOSFET;

[0138] Energy dissipation path: Absorb the residual energy through the RCD buffer circuit (R = 10 Ω, C = 4.7 μF); 3. System reconstruction stage:

[0139] Calculation of the remaining module capacity:

[0140]

[0141] where α = 0.03% / °C and ΔT is the temperature difference between modules;

[0142] Dynamic adjustment of current sharing parameters:

[0143] Modify the CAN bus node ID and reconstruct the communication topology;

[0144] Update the droop control coefficient (Rdroop adjustment range 0 - 5 mΩ).

[0145] Compared with the prior art, the modular power supply for communication equipment of the present invention has the following beneficial effects:

[0146] 4. High-efficiency conversion and wide adaptability, with optimized efficiency within the full load range;

[0147] 5. Intelligent thermal management and enhanced reliability, with significantly optimized temperature rise control, the phase change material layer absorbs transient thermal shocks, reduces temperature fluctuations, and the flow rate of the microchannel liquid cooling module is adaptively adjusted, reducing power consumption; 6. Improved dynamic performance and stability, with improved current sharing accuracy for multi-module parallel connection, reducing circulating current losses,

[0148] and faults can be quickly recovered.

[0149] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any modifications, equivalent replacements, and improvements made within the concept of the present invention should be included within the patent protection scope of the present invention.

Claims

1. A module power supply for communication equipment, characterized in that: It includes an input filter unit, at least two-stage power conversion units, an output voltage stabilizing unit, an intelligent control module, a fault reconstruction unit and a composite heat dissipation structure; the input filter unit is connected to the power conversion unit, the power conversion unit is connected to the output voltage stabilizing unit, the output voltage stabilizing unit is connected to the load end, and the input filter unit, the power conversion unit, the output voltage stabilizing unit, the fault reconstruction unit and the composite heat dissipation structure are respectively connected to the intelligent control module; The composite heat dissipation structure comprises a metal heat-conducting substrate, a phase-change material layer and a micro-channel liquid cooling module, wherein the metal heat-conducting substrate is provided with a phase-change material layer, and the micro-channel liquid cooling module is provided on the phase-change material layer, and the metal heat-conducting substrate is connected to the power device through heat-conducting silica gel for heat conduction; When the fault reconstruction unit detects a local failure, it switches the damaged module to a bypass state and reconfigures the current sharing parameters of the remaining modules to maintain the power output power of the power supply not less than 75% of the rated value.

2. The modular power supply for communication equipment according to claim 1, characterized in that: The intelligent control module includes a load prediction unit, which establishes an ARIMA prediction model by collecting historical load data and dynamically adjusts the switching frequency and dead time of the power device.

3. The modular power supply for communication equipment according to claim 1, characterized in that: The input filter unit adopts a combination of a third-order EMI filter and a TVS transient suppression diode, and integrates an active common-mode interference elimination circuit.

4. The modular power supply for communication equipment according to claim 1, characterized in that: The planar transformer in the power conversion unit adopts a magnetic integrated structure, the primary winding and the secondary winding are arranged alternately on a multi-layer PCB board, and a nanocrystalline shielding layer is arranged between the windings.

5. The modular power supply for communication equipment according to claim 1, characterized in that: The output voltage stabilization unit includes a digitally adjustable parallel voltage stabilization circuit, and achieves 0.5% precision regulation of the output voltage through a DAC module.

6. The modular power supply for communication equipment according to claim 1, characterized in that: The phase change material layer is a graphene-enhanced composite phase change material with a thickness of 1.2 mm and an embedded distributed optical fiber temperature sensor.

7. The modular power supply for communication equipment according to claim 1, characterized in that: The channel cross-section of the microchannel liquid cooling module is a trapezoidal structure, with an upper bottom of 0.25 mm, a lower bottom of 0.35 mm, and a height of 0.8 mm. It adopts a gradient density arrangement, a channel spacing of 0.5 mm in the inlet area, and a spacing of 1.0 mm in the outlet area.

8. The modular power supply for communication equipment according to claim 1, characterized in that: The intelligent control module includes a fault arc detection unit, which realizes microsecond-level fault isolation through a dual judgment mechanism of high-frequency current ripple analysis and ultraviolet light-sensitive detection.

9. The modular power supply for communication equipment according to claim 1, characterized in that: The intelligent control module integrates a wireless communication unit, supports Bluetooth 5.0 and LoRa dual-mode communication, and can upload working status parameters and receive remote control instructions in real time.

10. The modular power supply for communication equipment according to claim 1, characterized in that: The intelligent control module includes a dual-core heterogeneous processor architecture and a load prediction model based on transfer learning, and the input features include historical load sequences, ambient temperature and network traffic data.

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