Photoelectric module and laser radar

Abstract

The embodiment of the invention discloses a photoelectric module and a laser radar. The photoelectric module comprises a plurality of lasers, a circuit board and a heat conduction supporting piece. The circuit board comprises multiple layers of daughter boards and a heat dissipation structure, the heat dissipation structure comprises a top layer copper sheet, a solid copper hole and a bottom layer copper sheet, the solid copper hole penetrates through the multiple layers of daughter boards, the two ends of the solid copper hole are connected with the top layer copper sheet and the bottom layer copper sheet respectively, and the top layer copper sheet is arranged on the top surface of the circuit board and connected with the laser; the heat conduction supporting piece is connected with a bottom layer copper sheet arranged on the bottom face of the circuit board and used for supporting the circuit board. According to the embodiment of the invention, a single circuit board is used for solving the problems of layout wiring of the driving circuit and heat dissipation of the photoelectric module, a transmitting loop of the photoelectric module is greatly optimized, and unnecessary energy loss is reduced, so that the photoelectric module has lower power consumption and lower heat productivity.

Description

Technical Field

[0001] This application relates to the field of optoelectronic technologies, and particularly to an optoelectronic module and a lidar. Background Art

[0002] In related technologies, in order to improve the heat dissipation efficiency, high thermal conductivity plates such as ceramic plates are usually used to manufacture lasers or the heat dissipation structures of lasers. Ceramic plates are expensive, fragile in material, and usually multiple layers of ceramic plates need to be stacked in sequence to improve the heat dissipation effect. If the materials (compositions) between different layers of ceramic plates are different, due to the different expansion coefficients between ceramic plates of different materials, during the heat dissipation process, the ceramic plates of different materials will crack, resulting in reliability problems. Summary of the Invention

[0003] Embodiments of this application provide an optoelectronic module and a lidar, which can reduce the heat dissipation cost of the optoelectronic module and improve the electrical connection reliability and structural reliability of the optoelectronic module.

[0004] In a first aspect, embodiments of this application provide an optoelectronic module, which includes:

[0005] Multiple lasers;

[0006] A circuit board, including multiple sub-boards and a heat dissipation structure, the heat dissipation structure includes a top-layer copper foil, solid copper vias, and a bottom-layer copper foil, the solid copper vias penetrate through multiple sub-boards and are respectively connected to the top-layer copper foil and the bottom-layer copper foil at both ends, and the top-layer copper foil is arranged on the top surface of the circuit board and is connected to the lasers;

[0007] A heat conduction support member, which is connected to the bottom-layer copper foil arranged on the bottom surface of the circuit board and is used to support the circuit board.

[0008] Optionally, the area of the top-layer copper foil is larger than the area of the lasers connected thereto.

[0009] Optionally, the area of the bottom-layer copper foil is larger than the area of the top-layer copper foil.

[0010] Optionally, the solid copper vias of different sub-boards are arranged in alignment or misalignment along the thickness direction of the circuit board.

[0011] Optionally, the thickness of the circuit board is not less than 0.2 mm and not more than 0.5 mm.

[0012] Optionally, the drive circuit of the lasers is a high-side drive circuit, the heat dissipation structure is connected to the cathodes of the lasers, and the top-layer copper foils of different heat dissipation structures are connected to each other, and the bottom-layer copper foils of different heat dissipation structures are connected to each other.

[0013] Optionally, the driving circuit of the laser is a low-side driving circuit. The heat dissipation structure is connected to the cathode of the laser, and the top-layer copper foils of different heat dissipation structures are insulated from each other, and the bottom-layer copper foils of different heat dissipation structures are insulated from each other. The optoelectronic module further includes:

[0014] A thermally conductive insulating layer is disposed between the thermally conductive support and the circuit board and fills the space between the bottom-layer copper foils of different heat dissipation structures.

[0015] Optionally, the bottom-layer copper foil and the thermally conductive insulating member are fitted into the thermally conductive support.

[0016] Optionally, the driving circuit of the laser is a low-side driving circuit. The heat dissipation structure is connected to the cathode of the laser, and the top-layer copper foils of different heat dissipation structures are insulated from each other, and the bottom-layer copper foils of different heat dissipation structures are connected to each other. The circuit board further includes:

[0017] An insulating dielectric layer is disposed between the bottom-layer copper foil and the solid copper hole to insulate the solid copper hole from the bottom-layer copper foil.

[0018] In a second aspect, an embodiment of the present application provides a lidar, which includes a detection module and the optoelectronic module according to any one of the above. The detection module is capable of receiving the laser emitted by the optoelectronic module and reflected by a target object to be detected.

[0019] Based on the optoelectronic module and the lidar provided by the present application, at least the following effects are achieved:

[0020] 1. By designing a single circuit board formed by laminating multiple sub-boards, a complex driving circuit of the laser can be designed on the multiple sub-boards. Compared with designing the complex driving circuit on multiple circuit boards and then connecting different circuit boards through connecting wires, the integration degree is higher and the electrical connection reliability is better. Moreover, the materials of the multiple sub-boards are the same, and FR4 material can be used for all of them. The expansion coefficients between different sub-boards are the same, and cracking will not occur due to different expansion coefficients when heated, so the structural reliability is higher. And the circuit board is made of FR4, and the production of the optoelectronic module can be completed with lower-cost materials and more mature processing technologies, and the cost is lower;

[0021] 2. By designing the top-layer copper foil, the contact area between the top-layer copper foil and the laser can be increased. By designing an extremely thin circuit board, the heat conduction path of the solid copper vias can be shortened, improving the heat conduction efficiency. By designing the bottom-layer copper foil, the contact area between the bottom-layer copper foil and the heat conduction support can be increased, further improving the heat dissipation efficiency. By designing the heat conduction support, on the one hand, the contact area between the heat conduction support and the air is larger, and the heat conduction support has a high heat conduction coefficient. Therefore, heat can be quickly dissipated into the air through the heat conduction support, thereby improving the heat dissipation efficiency. In addition, the support circuit board has sufficient structural strength. Therefore, the circuit board and the laser can be stably supported, avoiding deformation that is likely to occur when the optoelectronic module is stressed.

[0022] Therefore, in the embodiments of the present application, a single circuit board is used to solve the layout routing of the drive circuit and the heat dissipation problem of the optoelectronic module, greatly optimizing the emission loop of the optoelectronic module and reducing unnecessary energy loss, so that the optoelectronic module has lower power consumption and smaller heat generation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 is a schematic structural diagram of an optoelectronic ranging system provided by an embodiment of the present application;

[0025] Figure 2 is a schematic structural diagram of an optoelectronic module provided by an embodiment of the present application;

[0026] Figure 3 is a schematic structural diagram of an optoelectronic module provided by another embodiment of the present application;

[0027] Figure 4 is a schematic structural diagram of an optoelectronic module provided by still another embodiment of the present application.

[0028] Description of the reference numerals in the drawings:

[0029] 100, optoelectronic module; 10, laser; 20, circuit board; 21, daughter board; 22, heat dissipation structure; 23, top-layer copper foil; 24, solid copper via; 25, top-layer copper foil; 30, heat conduction support; 40, heat conduction insulating layer; 50, insulating dielectric layer; 200, detection module; 300, lidar. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] To make the objectives, technical solutions, and advantages of this application more clear, the following will further describe the embodiments of this application in detail with reference to the accompanying drawings.

[0031] When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. On the contrary, they are merely examples of devices and methods that are consistent with some aspects of this application as detailed in the appended claims.

[0032] Please refer to Figure 1 , an embodiment of this application provides an optoelectronic ranging system (not shown in the figure), including but not limited to a lidar 300, an infrared ranging system, a camera, etc. The lidar 300 includes an optoelectronic module 100 and a detection module 200. The optoelectronic module 100 is used to emit laser light. The laser light emitted by the optoelectronic module 100 forms reflected light after being reflected by an external target object to be detected and is received by the detection module 200, that is, the detection module 200 can receive the laser light (i.e., reflected light) emitted by the optoelectronic module 100 and reflected by the target object to be detected.

[0033] Please refer to Figure 2 , in some embodiments, the optoelectronic module 100 includes a plurality of lasers 10, a circuit board 20, and a heat-conducting support 30. The lasers 10 are used to emit laser light when driven. The lasers 10 include laser diodes. When the lasers 10 are driven, the drive current flows into the anode of the laser diode and out of the cathode of the laser diode. The laser diode is stimulated to emit laser light, realizing the electro-optical conversion. Since the current optoelectronic conversion efficiency of the lasers 10 is low, a large amount of heat is generated when the lasers 10 emit light. If the heat is not dissipated in time, the optoelectronic conversion efficiency will be further reduced, resulting in a vicious cycle. In order to increase the emission power of the lidar 300, the current mainstream solution arranges a plurality of lasers 10 in an array. The laser array has a higher integration degree, and its heat density is higher during the laser emission process, requiring higher heat dissipation requirements.

[0034] In related technologies, in order to improve the heat dissipation efficiency, a high-heat-conducting plate such as a ceramic plate is usually used to manufacture the heat dissipation structure 22 of the lasers 10. The ceramic plate is expensive, the material is fragile, and usually multiple ceramic plates need to be stacked in sequence to improve the heat dissipation effect. If the materials (components) between different layers of ceramic plates are different, due to the different expansion coefficients between ceramic plates of different materials, the ceramic plates of different materials will crack during the heat dissipation process, resulting in reliability problems.

[0035] In addition, in the related art, for the circuit board made of the commonly used FR4 material, on the one hand, due to its low thermal conductivity, and on the other hand, because it needs to support components such as the laser 10 and the driving circuit of the laser 10, or considering that the circuit board needs to be stably installed in the lidar 300, the circuit board made of the FR4 material needs to have sufficient structural strength. Therefore, it needs to have a relatively thick thickness, and the circuit board made of the FR4 material with a relatively thick thickness further reduces its heat dissipation performance.

[0036] To solve the above technical problems, in this embodiment, the circuit board 20 may not consider the structural strength or may have a relatively weak structural strength, so as to make the circuit board 20 as thin as possible, and the circuit board 20 is supported by the heat-conducting support 30.

[0037] Please refer to Figure 2 , specifically, the circuit board 20 includes multiple sub-boards 21 and a heat dissipation structure 22. The multiple sub-boards 21 are stacked in sequence along the thickness direction. The driving circuit and the control circuit of the laser 10 can be fabricated on the sub-board 21. The driving circuit of the laser 10 generally includes an anode driving circuit and / or a cathode driving circuit. The anode driving circuit and the cathode driving circuit are respectively connected to the anode and the cathode of the laser 10. In the laser array, an addressable driving method is usually adopted to independently drive a single laser 10 or to independently drive a laser group composed of multiple lasers. This requires that each laser 10 needs to be connected to its respective anode driving circuit and cathode driving circuit. Therefore, the number of layers of the sub-board 21 depends on the number of lasers 10. The more the number of lasers 10, the more anode driving circuits and cathode driving circuits need to be fabricated, and the more the number of layers of the sub-board 21. Exemplarily, the number of layers of the sub-board 21 can be 3 layers or 4 layers, or can also be 7 layers or 8 layers.

[0038] The multiple sub-boards 21 are pressed together to form a circuit board 20. Since there is no need to consider the structural strength and support performance of the circuit board 20, the sub-board 21 can be made as thin as possible and the number of layers of the sub-board 21 can be minimized to reduce the thickness of the circuit board 20. Even when the circuit board 20 is made of the FR4 board, it is beneficial to dissipate heat from the laser 10 disposed on the circuit board 20. As an optional implementation manner, the sub-boards 21 are all made of the same material, that is, the FR4 board. It can be understood that the expansion coefficients of the same boards are the same, and there will be no situation where the boards crack due to different expansion coefficients when heated, and the reliability is high.

[0039] Exemplarily, in some embodiments, the thickness of the circuit board 20 is not less than 0.2 mm and not greater than 0.5 mm. That is to say, the circuit board 20 formed by laminating multiple sub-boards 21 has an extremely thin thickness. The circuit board 20 does not need to consider structural strength and support performance, and the entire circuit board 20 can even be a flexible circuit board. In the related art, considering that the circuit board material needs to have sufficient structural strength and support performance, the thickness of the circuit board material is generally 1.2 mm - 1.8 mm, which is at least 2.4 times the thickness of the circuit board 20 in this embodiment.

[0040] Further, in order to improve the heat dissipation efficiency of the laser 10, the heat dissipation structure 22 of this embodiment includes a top layer copper foil 23, a solid copper hole 24, and a bottom layer copper foil 25.

[0041] The top layer copper foil 23, the solid copper hole 24, and the bottom layer copper foil 25 are all made of copper material with high thermal conductivity. The top layer copper foil 23 is disposed on the top surface of the circuit board 20 and connected to the laser 10. Specifically, the top layer copper foil 23 is connected to the substrate of the laser 10 through a conductive and heat-conductive material (such as conductive silver paste). In this way, both the heat transfer connection between the top layer copper foil 23 and the laser 10 and the electrical connection between the top layer copper foil 23 and the laser 10 are realized. Furthermore, the laser 10 can be connected to its driving circuit through the top layer copper foil 23, the solid copper hole 24, and the wiring in the sub-board 21.

[0042] Please continue to refer to Figure 2 , in some embodiments, the area of the top layer copper foil 23 is larger than the area of the laser 10 it is connected to. In this way, the top layer copper foil 23 has a larger heat absorption area. In addition to directly absorbing heat from the laser 10, it can also absorb the heat dissipated by the laser 10 into the surrounding air, further increasing the heat dissipation area and improving the heat dissipation efficiency. In addition, the larger-area top layer copper foil 23 can be connected to more solid copper holes 24, with higher heat transfer efficiency and better heat dissipation effect.

[0043] The solid copper hole 24 penetrates through the multiple sub-boards 21. Specifically, in some embodiments, after laminating the multiple sub-boards 21 to form the circuit board 20, through holes penetrating the multiple sub-boards 21 can be drilled on the multiple sub-boards 21, and then liquid copper is filled into the through holes. After the liquid copper solidifies, the solid copper hole 24 is formed. At this time, the solid copper holes 24 of different sub-boards 21 are arranged in alignment along the thickness direction of the circuit board 20. In this way, not only is the process simple, but also the top layer copper foil 23, the solid copper hole 24, and the bottom layer copper foil 25 can be formed together in a single process. That is to say, the top layer copper foil 23, the solid copper hole 24, and the bottom layer copper foil 25 are integrally formed, which can further simplify the production process, improve the connection stability among the top layer copper foil 23, the solid copper hole 24, and the bottom layer copper foil 25, and also improve the heat transfer efficiency among the top layer copper foil 23, the solid copper hole 24, and the bottom layer copper foil 25.

[0044] In some other embodiments, through holes may be drilled in each sub-board 21 before lamination, and liquid copper is filled in the through holes and on the surface of the sub-board 21. After the liquid copper is solidified, solid copper holes 24 of the sub-board 21 and an intermediate copper layer (not shown in the figure) connected to the solid copper holes 24 on the surface of the sub-board 21 are formed. Then, multiple sub-boards 21 are combined together to form a circuit board 20. In this way, the solid copper holes 24 of different sub-boards 21 can be arranged in a staggered manner along the thickness direction of the circuit board 20, and the solid copper holes 24 on different sub-boards 21 are connected through the intermediate copper layer. The solid copper holes 24 can be arranged at positions where the driving circuit is not provided, without considering the alignment between the solid copper holes 24 of different layers, making the positions of the solid copper holes 24 more flexible.

[0045] Since the solid copper holes 24 penetrate through multiple sub-boards 21, that is, through the circuit board 20, both ends of the solid copper holes 24 can be respectively connected to the top copper layer 23 located on the top surface of the circuit board 20 and the bottom copper layer 25 located on the bottom surface of the circuit board 20. Since the top copper layer 23 is arranged on the top surface of the circuit board 20 and is connected to the laser 10, the top copper layer 23 can absorb the heat emitted when the laser 10 operates and transfer it to the bottom copper layer 25 through the solid copper holes 24. Since the thickness of the circuit board 20 is very thin and the heat transfer path from the top copper layer 23 to the bottom copper layer 25, that is, the length of the solid copper holes 24, is very short, the laser 10 can be efficiently cooled. It can be understood that in order to further improve the heat dissipation efficiency, one top copper layer 23 can be connected to the bottom copper layer 25 through multiple solid copper holes 24, that is, the heat dissipation efficiency can be improved by increasing the number of solid copper holes 24.

[0046] The bottom copper layer 25 is arranged on the bottom surface of the circuit board 20 and is used to receive the heat conducted by the solid copper holes 24 and conduct it to the heat-conducting support 30. In order to further improve the heat conduction efficiency, in some embodiments, the area of the bottom copper layer 25 is larger than the area of the top copper layer 23. In this way, the bottom copper layer 25 has a larger area for heat transfer and heat dissipation, can absorb heat from the solid copper holes 24 more efficiently, and conduct heat to the heat-conducting support 30 more efficiently.

[0047] The heat-conducting support 30 is connected to the bottom copper layer 25 disposed on the bottom surface of the circuit board 20. The bottom copper layer 25 conducts the heat absorbed from the solid copper hole 24 into the heat-conducting support 30. The heat-conducting support 30 has a larger contact area with the air than the bottom copper layer 25, and the heat-conducting support 30 has a high heat-conducting coefficient. Therefore, the heat can be quickly conducted out through the heat-conducting support 30, thereby improving the heat dissipation efficiency. In addition, the heat-conducting support 30 has sufficient structural strength. Therefore, the circuit board 20 and the laser 10 can be stably supported, avoiding deformation that easily occurs when the optoelectronic module 100 is stressed. The material of the heat-conducting support 30 can be exemplarily stainless steel, copper, tungsten, etc. The present application does not make a unique limitation on the material of the heat-conducting support 30.

[0048] In some embodiments, the driving circuit of the laser 10 is a low-side driving circuit. The low-side driving circuit includes a low-side emission switch. The low-side emission switch is connected to the cathode of the laser 10. By gating the low-side emission switch, the laser 10 connected to the conducted low-side emission switch can be driven to emit light. At this time, the heat dissipation structures 22 connected to the cathodes of different lasers 10 cannot be connected to each other, so that different lasers 10 are electrically independent of each other, thereby realizing the cathode addressing drive of the lasers 10. To achieve this function, first, the top copper layers 23 of different heat dissipation structures 22 should be insulated from each other, so that different heat dissipation structures 22 cannot be connected to each other through the top copper layer 23. And it is necessary to ensure that different heat dissipation structures 22 cannot be connected to each other through the bottom copper layer 25. At this time, there are two embodiments:

[0049] In the first embodiment, please refer to Figure 2 , the optoelectronic module 100 further includes a heat-conducting insulating layer 40. The heat-conducting insulating layer 40 is disposed between the heat-conducting support 30 and the circuit board 20, and is filled between the bottom copper layers 25 of different heat dissipation structures 22. That is, the bottom copper layers 25 of different heat dissipation structures 22 are separated by the heat-conducting insulating layer 40, so that different heat dissipation structures 22 cannot be connected to each other through the bottom copper layer 25, and the cathodes of different lasers 10 are also electrically independent of each other. In this way, when a low-side emission switch connected to the cathode of the laser 10 is gated, only the laser 10 connected to the conducted low-side emission switch emits light, realizing the cathode independent addressing drive function. The heat-conducting insulating layer 40 can be exemplarily a heat-conducting silicone grease layer.

[0050] Please continue to refer to Figure 2, Further, based on this first embodiment, the bottom copper foil 25 and the thermally conductive insulating layer 40 are fitted into the thermally conductive support member 30. In this way, the contact area between the bottom copper foil 25 and the thermally conductive insulating member and the thermally conductive support member 30 can be increased, thereby improving the connection stability between the bottom copper foil 25 and the thermally conductive insulating layer 40 and the thermally conductive support member 30, and moreover, the heat transfer efficiency between the bottom copper foil 25 and the thermally conductive insulating layer 40 and the thermally conductive support member 30 can be improved.

[0051] In the second embodiment, please refer to Figure 3 , the circuit board 20 further includes an insulating dielectric layer 50. The insulating dielectric layer 50 is disposed between the bottom copper foil 25 and the solid copper hole 24 and is used to insulate the solid copper hole 24 from the bottom copper foil 25. At this time, different low-side emission switches of the low-side drive circuit are connected to different mutually insulated solid copper holes 24 or different top copper foils 23 and will not be connected to the bottom copper foil 25. Therefore, at this time, the bottom copper foil 25 can be designed as a whole, and it will not cause the cathodes of different lasers 10 to be connected together. Different lasers 10 are electrically independent of each other. In this way, when a low-side emission switch connected to the cathode of the laser 10 is gated, only the laser 10 connected to the gated low-side emission switch emits light, realizing the addressing drive function. And designing the bottom copper foil 25 as a whole, that is, the bottom copper foils 25 of different heat dissipation structures 22 are all connected together, can increase the contact area between the bottom copper foil 25 and the thermally conductive support member 30 and improve the heat dissipation efficiency.

[0052] Please refer to Figure 4 , In some embodiments, the drive circuit of the laser 10 is a high-side drive circuit. The high-side drive circuit includes a high-side emission switch. The high-side emission switch is connected to the anode of the laser 10. By gating the high-side emission switch, the laser 10 connected to the gated high-side emission switch can be driven to emit light. At this time, the heat dissipation structure 22 is connected to the cathode of the laser 10 and grounded. At this time, the top copper foils 23 of different heat dissipation structures 22 can be connected to each other and grounded, and the bottom copper foils 25 of different heat dissipation structures 22 can be connected to each other and grounded. In this way, on the basis of realizing the addressing drive of the laser 10, the areas of the top copper foil 23 and the bottom copper foil 25 are further increased, thereby improving the heat dissipation efficiency.

[0053] In summary, the optoelectronic module 100 and the optoelectronic ranging system of the present application at least have the following effects:

[0054] 1. By designing a single circuit board 20 formed by laminating multiple sub-boards 21, a complex drive circuit of the laser 10 can be designed on the multiple sub-boards 21. Compared with designing the complex drive circuit on multiple circuit boards and then connecting different circuit boards 20 through connecting wires, the integration degree is higher and the electrical connection reliability is better. Moreover, the materials of the multiple sub-boards 21 are the same, and FR4 material can be used for all of them. The expansion coefficients between different sub-boards 21 are the same, and cracking will not occur due to different expansion coefficients when heated, so the structural reliability is higher. And the circuit board 20 is made of FR4, and the production of the optoelectronic module 100 can be completed with lower-cost materials and more mature processing technologies, and the cost is lower.

[0055] 2. By designing the top-layer copper foil 23, the contact area between the top-layer copper foil 23 and the laser 10 can be increased. By designing an extremely thin circuit board 20, the heat conduction path of the solid copper hole 24 can be shortened, and the heat conduction efficiency can be improved. By designing the bottom-layer copper foil 25, the contact area between the bottom-layer copper foil 25 and the heat conduction support 30 can be increased, further improving the heat dissipation efficiency. By designing the heat conduction support 30, on the one hand, the contact area between the heat conduction support 30 and the air is larger, and the heat conduction support 30 has a high heat conduction coefficient. Therefore, the heat can be quickly dissipated into the air through the heat conduction support 30, thereby improving the heat dissipation efficiency. In addition, the support circuit board 20 has sufficient structural strength. Therefore, the circuit board 20 and the laser 10 can be stably supported, avoiding deformation of the optoelectronic module 100 when it is stressed.

[0056] Therefore, in the embodiment of the present application, a single circuit board 20 is used to solve the layout and routing of the drive circuit and the heat dissipation problem of the optoelectronic module 100, greatly optimizing the emission loop of the optoelectronic module 100 and reducing unnecessary energy loss, so that the optoelectronic module 100 has lower power consumption and smaller heat generation.

[0057] In the description of the present application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations. In addition, in the description of the present application, unless otherwise specified, "multiple layers" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the description of this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0059] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0060] The above embodiments only represent several implementation manners of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of this patent application shall be subject to the appended claims.

Claims

1. An optoelectronic module, characterized in that, The optoelectronic module includes: Multiple lasers; A circuit board, including multiple sub-boards and a heat dissipation structure. The heat dissipation structure includes a top-layer copper foil, solid copper vias, and a bottom-layer copper foil. The solid copper vias penetrate through multiple sub-boards and are respectively connected to the top-layer copper foil and the bottom-layer copper foil at both ends. The top-layer copper foil is disposed on the top surface of the circuit board and is connected to the lasers; A thermally conductive support member, connected to the bottom-layer copper foil disposed on the bottom surface of the circuit board, and used to support the circuit board.

2. The optoelectronic module according to claim 1, characterized in that, The area of the top-layer copper foil is larger than the area of the lasers connected thereto.

3. The optoelectronic module according to claim 1, characterized in that, The area of the bottom-layer copper foil is larger than the area of the top-layer copper foil.

4. The optoelectronic module according to claim 1, characterized in that, The solid copper vias of different sub-boards are arranged in alignment or misalignment along the thickness direction of the circuit board.

5. The optoelectronic module according to claim 1, characterized in that, The thickness of the circuit board is not less than 0.2 mm and not more than 0.5 mm.

6. The optoelectronic module according to claim 1, characterized in that, The driving circuit of the lasers is a high-side driving circuit. The heat dissipation structure is connected to the cathodes of the lasers, and the top-layer copper foils of different heat dissipation structures are connected to each other, and the bottom-layer copper foils of different heat dissipation structures are connected to each other.

7. The optoelectronic module according to claim 1, characterized in that, The driving circuit of the lasers is a low-side driving circuit. The heat dissipation structure is connected to the cathodes of the lasers, and the top-layer copper foils of different heat dissipation structures are insulated from each other, and the bottom-layer copper foils of different heat dissipation structures are insulated from each other. The optoelectronic module further includes: A thermally conductive insulating layer, disposed between the thermally conductive support member and the circuit board, and filled between the bottom-layer copper foils of different heat dissipation structures.

8. The optoelectronic module according to claim 7, characterized in that, The bottom-layer copper foil and the thermally conductive insulating member are fitted into the thermally conductive support member.

9. The optoelectronic module according to claim 1, wherein The driving circuit of the lasers is a low-side driving circuit. The heat dissipation structure is connected to the cathodes of the lasers, and the top-layer copper foils of different heat dissipation structures are insulated from each other, and the bottom-layer copper foils of different heat dissipation structures are connected to each other. The circuit board further includes: An insulating dielectric layer, disposed between the bottom-layer copper foil and the solid copper via, for insulating the solid copper via from the bottom-layer copper foil.

10. A lidar, characterized in that, Including a detection module and the optoelectronic module according to any one of claims 1-9. The detection module is capable of receiving the laser emitted by the optoelectronic module and reflected by the target detection object.

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