Copper-clad ceramic plate, three-channel power module, three-phase full-bridge module and inverter

Abstract

The invention discloses a copper-clad ceramic plate, a three-channel power module, a three-phase full-bridge module and an inverter, and relates to the field of power modules, the copper-clad ceramic plate comprises a double-sided copper-clad ceramic substrate, and a third flow channel extending in the longitudinal direction is formed in a ceramic layer of the double-sided copper-clad ceramic substrate. According to the invention, the third flow channel in the double-sided copper-clad ceramic substrate is used as a cooling liquid channel, the heat dissipation capability of the copper-clad ceramic substrate can be effectively improved through the cooperation of the third flow channel, the first flow channel and the second flow channel, and the light weight of the power module is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of inverter power modules, and particularly to a copper-clad ceramic plate, a three-channel power module, a three-phase full-bridge module, and an inverter. Background Art

[0002] As the core unit inside the inverter, the power module has a significant impact on the overall performance of the electric control. Higher voltage withstand, higher volume power density, and faster switching characteristics determine the upper limit of the performance output of the power module. Whether the heat dissipation design is reasonable or not further determines whether the power module can stably output the best performance for a long time.

[0003] The mainstream packaging forms of power modules on the market are mainly HPD packaging, followed by DCM packaging. The main structures of both include power chips, copper-clad ceramic plates, copper substrates with heat dissipation fins, connecting copper bars, and bonding wires, and the housing is encapsulated with a plastic shell or epoxy resin. Both HPD packaging and DCM packaging adopt a single-sided copper substrate direct water cooling scheme, and their heat dissipation methods are to set heat dissipation channels on the fin side of the copper substrate to dissipate heat from the power chips on the upper side of the copper-clad ceramic plate. The carrier of the heat dissipation channels can be a water cooling plate or a water channel housing.

[0004] However, power modules packaged using HPD / DCM packaging have two disadvantages. On the one hand, the heat dissipation path is single. The lower surface of the power chip can only first pass through the copper-clad ceramic plate, then through the copper substrate, and finally most of the heat is conducted away by the fin structure of the copper substrate. However, the upper surface of the power chip is bonded with bonding wires, and the heat generated by the bonding wires due to current conduction cannot be effectively conducted away, which will affect the full performance of the power chip. On the other hand, the copper substrate has a large density, and coupled with the unique fin structure, the mass ratio of the copper substrate in the power module exceeds 60%, which is not conducive to the lightweight of the power module. Summary of the Invention

[0005] To solve the technical problems in the background art, the present invention proposes a copper-clad ceramic plate, a three-channel power module, a three-phase full-bridge module, and an inverter.

[0006] In a first aspect, a copper-clad ceramic plate proposed by the present invention includes a double-sided copper-clad ceramic substrate, and a third flow channel extending longitudinally is provided in the ceramic layer of the double-sided copper-clad ceramic substrate.

[0007] Preferably, a metal plate is embedded in the ceramic layer of the double-sided copper-clad ceramic substrate, and a third flow channel extending longitudinally is provided on the metal plate.

[0008] Preferably, one or more through holes penetrating longitudinally are provided on the metal plate, and the one or more longitudinally penetrating through holes form a third flow channel in combination.

[0009] Preferably, one or more upper grooves extending longitudinally along the housing are formed on the top surface of the metal plate, and the one or more upper grooves form a third flow channel.

[0010] Preferably, one or more lower grooves extending longitudinally along the housing are formed on the bottom surface of the metal plate, and the one or more lower grooves are combined to form a third flow channel.

[0011] Preferably, one or more upper grooves extending longitudinally along the housing are formed on the top surface of the metal plate, and one or more lower grooves extending longitudinally along the housing are formed on the bottom surface of the metal plate. The one or more upper grooves and the one or more lower grooves are combined to form a third flow channel.

[0012] Preferably, both ends of the metal plate in the longitudinal direction protrude from the double-sided copper clad ceramic substrate.

[0013] Preferably, the double-sided copper clad ceramic substrate is a DBC double-sided copper clad ceramic substrate.

[0014] In a second aspect, the present invention further provides a three-channel power module, including: a housing and the copper clad ceramic plate as described in any one of the first aspect;

[0015] The copper clad ceramic plate is horizontally installed inside the middle of the housing, and divides the inside of the housing into two sealed and independent chambers;

[0016] Power chip layers are respectively provided on the top surface and the bottom surface of the copper clad ceramic plate. An isolation protection layer is provided on the surface of each power chip layer. A gap is reserved between the isolation protection layer above the copper clad ceramic plate and the top wall of the housing to form a first flow channel;

[0017] A gap is reserved between the isolation protection layer below the copper clad ceramic plate and the bottom wall of the housing to form a second flow channel;

[0018] At both ends of the housing in the longitudinal direction, a first flow port communicating with the first flow channel is provided at the corresponding position of the first flow channel, a second flow port communicating with the second flow channel is provided at the corresponding position of the second flow channel, and a third flow port communicating with the third flow channel is provided at the corresponding position of the third flow channel.

[0019] Preferably, each power chip layer includes a power chip group. One side of each power chip group facing the copper clad ceramic plate is welded and fixed to the copper clad ceramic plate, and the other side of each power chip group facing away from the copper clad ceramic plate is connected to the copper clad ceramic plate through a bonding wire. The isolation protection layer covers the power chip group, the bonding wire and the copper clad layer of the copper clad ceramic plate.

[0020] Preferably, each power chip group includes a plurality of power chips, and the power chips are double-sided welding chips.

[0021] Preferably, the isolation and protection layer is a silicone gel layer or an epoxy layer.

[0022] Preferably, the housing includes a support frame and two sealing plates; the support frame includes two first support plates and two second support plates; the two first support plates are arranged at intervals in sequence along the transverse direction of the housing, and one of the second support plates is respectively connected between the first ends of the two first support plates, and the other second support plate is connected between the second ends of the two second support plates; wherein, the bottom walls of the second support plates are all located above the bottom walls of the first support plates, and the top walls of the second support plates are all located below the tops of the second support plates;

[0023] One of the sealing plates is located above the first support plate, and the other sealing plate is located below the first support plate, and both ends of each sealing plate in the transverse direction are respectively and sealingly fixedly connected to the two first support plates;

[0024] A housing is formed between the two first support plates, the two second support plates and the two sealing plates;

[0025] Gaps between the top walls of the two second support plates and both ends of the sealing plate located above respectively form a first fluid port, and gaps between the bottom walls of the two second support plates and both ends of the sealing plate located below respectively form a second fluid port;

[0026] Both ends of the copper-clad ceramic plate in the transverse direction are respectively and sealingly fixedly connected to the middle parts of the two first support plates, and both ends of the copper-clad ceramic plate in the longitudinal direction are respectively and sealingly fixedly connected to the middle parts of the two second support plates; a third fluid port is respectively opened at the corresponding position of the third flow channel of the two second support plates and the copper-clad ceramic plate.

[0027] Preferably, both the support frame and the sealing plates are made of plastic materials, and the support frame and the sealing plates are spliced and fixed by a laser welding process.

[0028] Preferably, a Pin-fin fin-shaped heat dissipation structure arranged in an array is provided on the side surface of each sealing plate facing the copper-clad ceramic plate, and a gap is reserved between the Pin-fin fin-shaped heat dissipation structure and the corresponding isolation and protection layer.

[0029] In a further embodiment, the gap is 0.1 - 0.5 mm.

[0030] Preferably, rib paths are provided on the side surface of each sealing plate facing away from the copper-clad ceramic plate.

[0031] Preferably, it further includes a first adapter and a second adapter; the first adapter is hermetically fixed on the first end of the housing in the longitudinal direction, a groove is formed on the side of the first adapter facing away from the housing, and a first upper notch communicating with the first flow port located at the first end, a first middle notch communicating with the second flow port located at the first end, and a first lower notch communicating with the third flow port located at the first end are respectively formed at corresponding positions on the bottom wall of the groove and the first flow port, the second flow port, and the third flow port located at the first end;

[0032] The second adapter is hermetically fixed on the second end of the housing in the longitudinal direction, a boss is provided on the side of the second adapter facing away from the housing, and a second upper notch communicating with the first flow port located at the second end, a second middle notch communicating with the second flow port located at the second end, and a second lower notch communicating with the third flow port located at the second end are respectively provided at corresponding positions of the boss and the first flow port, the second flow port, and the third flow port located at the second end.

[0033] Preferably, both the first adapter and the second adapter are made of plastic, and the first adapter and the second adapter are spliced and fixed to the support frame by a laser welding process.

[0034] Preferably, a sealing ring for sealing the boss and the groove is sleeved on the outer periphery of the boss.

[0035] Preferably, the sealing ring is used to achieve both radial and end face seals between the boss and the groove.

[0036] Preferably, a plurality of wavy protrusions are provided on both the radial sealing surface and the end face sealing surface of the sealing ring.

[0037] In a third aspect, the present invention further provides a three-phase full-bridge module, including three three-channel power modules as described in any one of the second aspects.

[0038] Preferably, the three three-channel power modules are sequentially spliced and fixed through the first adapter and the second adapter.

[0039] In a fourth aspect, the present invention further provides an inverter, including the three-phase full-bridge module as described in any one of the third aspects.

[0040] In the present invention, for the copper-clad ceramic plate, the three-channel power module, the three-phase full-bridge module, and the inverter proposed, the third flow channel in the double-sided copper-clad ceramic substrate is used as the channel for the coolant, and the cooperation between the third flow channel and the first flow channel and the second flow channel can effectively improve the heat dissipation capacity of the copper-clad ceramic plate and is also beneficial to the lightweight of the power module. Description of the Drawings

[0041] Figure 1 It is a schematic structural diagram of the copper-clad ceramic plate in an embodiment proposed by the present invention.

[0042] Figure 2 is Figure 1 a partial enlarged view of part A in

[0043] Figure 3 a schematic structural view of a metal plate in an embodiment proposed by the present invention.

[0044] Figure 4 is Figure 3 a partial enlarged view of part B in

[0045] Figure 5 a schematic structural view of a three-channel power module in an embodiment proposed by the present invention.

[0046] Figure 6 a schematic structural view of a power chip layer in an embodiment proposed by the present invention.

[0047] Figure 7 an exploded view of a housing in an embodiment proposed by the present invention.

[0048] Figure 8 a schematic structural view of a support frame in an embodiment proposed by the present invention.

[0049] Figure 9 a schematic structural view of a sealing plate in an embodiment proposed by the present invention Figure 1 .

[0050] Figure 10 a schematic structural view of a sealing plate in an embodiment proposed by the present invention Figure 2 .

[0051] Figure 11 a schematic structural view of a first adapter in an embodiment proposed by the present invention.

[0052] Figure 12 a schematic structural view of a second adapter in an embodiment proposed by the present invention.

[0053] Figure 13 a sectional view of a three-channel power module in an embodiment proposed by the present invention.

[0054] Figure 14 is Figure 13 a partial enlarged view of part C in

[0055] Figure 15 a schematic structural view of a three-phase full-bridge module in an embodiment proposed by the present invention.

[0056] Figure 16 a sectional view of a three-phase full-bridge module in an embodiment proposed by the present invention.

[0057] Figure 17 Schematic structural diagram of an inverter in an embodiment proposed by the present invention.

[0058] Figure 18 Schematic cross-sectional view of a three-phase full-bridge module assembled in an inverter in an embodiment proposed by the present invention.

[0059] Figure 19 is Figure 18 Partial enlarged schematic diagram at D in

[0060] Figure 20 is Figure 18 Partial enlarged schematic diagram at E in Detailed implementation manners

[0061] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0062] In a first aspect, as Figures 1-4 shown, a copper-clad ceramic board proposed by the present invention includes a double-sided copper-clad ceramic substrate 108, and a third flow channel extending longitudinally is provided in the ceramic layer of the double-sided copper-clad ceramic substrate 108.

[0063] The third flow channel provided in the ceramic layer of the double-sided copper-clad ceramic substrate 108 in the present invention can be used as a channel for the coolant, which can effectively improve the heat dissipation capacity of the copper-clad ceramic board and is beneficial to weight reduction.

[0064] In this embodiment, a metal plate 111 is embedded in the ceramic layer of the double-sided copper-clad ceramic substrate 108, and a third flow channel extending longitudinally is provided on the metal plate 111.

[0065] With this setting in this embodiment, in addition to using the metal plate 111 as the strengthened support in the middle layer of the power module, the third flow channel on the metal plate 111 is also used as the channel for the coolant, effectively strengthening the strength and heat dissipation capacity of the structure and achieving weight reduction.

[0066] In one specific embodiment, one or more through holes penetrating longitudinally are provided on the metal plate 111, and the one or more through holes penetrating longitudinally are combined to form the third flow channel.

[0067] In another specific embodiment, one or more upper grooves 111A extending longitudinally along the housing are provided on the top surface of the metal plate 111, and one or more lower grooves 111A' extending longitudinally along the housing are provided on the bottom surface of the metal plate 111. The one or more upper grooves 111A and the one or more lower grooves 111A' are combined to form the third flow channel.

[0068] This embodiment can further enhance the strength and heat dissipation ability of the structure, and the heat dissipation of the power chips on both sides of the double-sided copper-clad ceramic substrate 108 is more uniform, and the degree of light weight is effectively improved.

[0069] It should be noted that when the data of the upper groove 111A and the lower groove 111A' are both multiple, the multiple upper grooves 111A are distributed at intervals along the transverse direction of the housing on the top surface of the metal plate 111, and the multiple lower grooves 111A' are distributed at intervals along the transverse direction of the housing on the bottom surface of the metal plate 111.

[0070] Of course, in order to ensure the uniformity of heat dissipation of the copper-clad ceramic plate and the uniformity of reinforcement support, and further achieve light weight, the multiple upper grooves 111A in this embodiment are evenly and spaced along the transverse direction of the housing on the top surface of the metal plate 111, and the multiple lower grooves 111A' are evenly and spaced along the transverse direction of the housing on the bottom surface of the metal plate 111.

[0071] In another specific embodiment, one or more upper grooves 111A are provided on the top surface of the metal plate 111 along the longitudinal direction of the housing, and the one or more upper grooves 111A form a third flow channel in combination.

[0072] In a specific embodiment, a plurality of lower grooves 111A' are provided on the bottom surface of the metal plate 111 along the longitudinal direction of the housing, and the one or more lower grooves 111A' form a third flow channel in combination.

[0073] Among them, the double-sided copper-clad ceramic substrate in this embodiment is a DBC double-sided copper-clad ceramic substrate.

[0074] In one specific embodiment, both ends of the metal plate in the longitudinal direction protrude from the double-sided copper-clad ceramic substrate.

[0075] With such a setting, the structure is simplified, which is convenient for the formation of the upper groove 111A and the lower groove 111A', and is convenient for the connection of the flow ports at both ends of the third flow channel with other flow ports.

[0076] Second aspect, as Figures 5-14 shown, a three-channel power module 100 proposed by the present invention includes: a housing and a copper-clad ceramic plate as described in any one of the first aspect;

[0077] The copper-clad ceramic plate is horizontally installed in the middle of the housing, and divides the inside of the housing into two closed and independent chambers;

[0078] Power chip layers are respectively provided on the top surface and the bottom surface of the copper-clad ceramic plate, and an isolation protection layer 112 is provided on the surface of each power chip layer. A gap is reserved between the isolation protection layer 112 above the copper-clad ceramic plate and the top wall of the housing to form a first flow channel;

[0079] A gap is reserved between the isolation and protection layer 112 below the copper-clad ceramic board and the bottom wall of the housing to form a second flow channel;

[0080] At both longitudinal ends of the housing, a first flow port communicating with the first flow channel is provided at the corresponding position of the first flow channel, a second flow port communicating with the second flow channel is provided at the corresponding position of the second flow channel, and a third flow port communicating with the third flow channel is provided at the corresponding position of the third flow channel.

[0081] In this embodiment, a third flow channel extending longitudinally is provided in the ceramic layer of the copper-clad ceramic substrate. The third flow channel and the third flow ports at both longitudinal ends of the housing cooperate as the channel for the coolant, which can effectively improve the heat dissipation capacity of the copper-clad ceramic board and achieve lightweight; moreover, in this embodiment, the isolation and protection layer 112 is used to isolate and protect the copper-clad layer on the copper-clad ceramic board, as well as the chips and bonding wires in the power chip layer. At the same time, a first flow channel and a second flow channel are respectively formed between the isolation and protection layer and the corresponding top wall and bottom wall of the housing. The first flow channel and the second flow channel cooperate with the third flow channel to achieve three-channel heat dissipation, effectively improving the heat dissipation efficiency of the three-channel power module 100.

[0082] In one specific embodiment, the isolation and protection layer 112 is a silicone gel layer or an epoxy layer.

[0083] Of course, in other specific embodiments, the isolation and protection layer 112 can also be a coating agent layer with isolation and protection functions.

[0084] In this embodiment, at one transverse end of the housing, positive and negative copper bars 105 for connecting the copper-clad ceramic board and the DC input side are provided, and at the other transverse end of the housing, phase copper bars 106 for connecting the copper-clad ceramic board and the AC output side are provided.

[0085] In this embodiment, the power chip layer includes a power chip group 109. One side of each power chip group 109 facing the copper-clad ceramic board is welded and fixed to the copper-clad ceramic board, and the other side of each power chip group 109 facing away from the copper-clad ceramic board is welded and connected to the copper-clad ceramic board through bonding wires.

[0086] Among them, each power chip group 109 includes a plurality of power chips, and the power chips are double-sided welding chips. The three-channel heat dissipation structure in this embodiment can effectively dissipate heat from the double-sided welding chips located on the upper and lower sides of the copper-clad ceramic board.

[0087] In order to facilitate signal monitoring, several pins 107 for signal monitoring and control are also connected to the copper-clad ceramic board in this embodiment.

[0088] It should be known that the housing in this embodiment is made of an insulating material.

[0089] In this embodiment, the housing includes a support frame 101 and two sealing plates 104; the support frame 101 includes two first support plates and two second support plates; the two first support plates are arranged at intervals in sequence along the transverse direction of the housing, and one of the second support plates is respectively connected between the first ends of the two first support plates, and the other second support plate is connected between the second ends of the two second support plates; wherein, the bottom walls of the second support plates are all located above the bottom walls of the first support plates, and the top walls of the second support plates are all located below the tops of the second support plates;

[0090] One of the sealing plates 104 is located above the first support plate, and the other sealing plate 104 is located below the first support plate, and both ends of each sealing plate 104 in the transverse direction are respectively and sealingly fixedly connected to the two first support plates;

[0091] A housing is formed among the two first support plates, the two second support plates and the two sealing plates 104;

[0092] Gaps between the top walls of the two second support plates and the two ends of the sealing plate 104 located above respectively form a first flow port, and gaps between the bottom walls of the two second support plates and the two ends of the sealing plate 104 located below respectively form a second flow port;

[0093] Both ends of the copper-clad ceramic plate in the transverse direction are respectively and sealingly fixedly connected to the middle parts of the two first support plates, and both ends of the copper-clad ceramic plate in the longitudinal direction are respectively and sealingly fixedly connected to the middle parts of the two second support plates; a third flow port is respectively opened at the corresponding position of the third flow channel of the two second support plates and the copper-clad ceramic plate.

[0094] The support frame 101 in this embodiment can effectively protect the copper-clad ceramic plate and the power chip layer, silicone gel layer or epoxy layer and copper bus structure located on the copper-clad ceramic plate, and effectively avoid the serial ports of the flow ports.

[0095] As Figure 13 shown, in one specific embodiment, both ends of the metal plate in the longitudinal direction protrude from the double-sided copper-clad ceramic substrate, which simplifies the structure and facilitates the formation of the upper groove 111A and the lower groove 111A'.

[0096] Among them, the support frame 101 is made of plastic material, and the sealing plate 104 is also made of plastic material. The sealing plate 104 and the support frame 101 can be spliced and fixed by laser welding process, which is beneficial to further realize lightweight.

[0097] In a further embodiment, an array of Pin-fin fin-shaped heat dissipation structures 104B are provided on the side surface of each sealing plate 104 facing the copper-clad ceramic plate, and a gap is reserved between the Pin-fin fin-shaped heat dissipation structure and the corresponding isolation protection layer.

[0098] As Figure 13 shown, the arrangement of the Pin-fin finned heat dissipation structure 104B on the upper sealing plate 104 forms a plurality of upper Pin-fin channels 104B' inside the first flow channel; the arrangement of the Pin-fin finned heat dissipation structure 104B on the lower sealing plate 104 forms a plurality of lower Pin-fin channels 104B'' inside the second flow channel. When the coolant passes through, the Pin-fin finned heat dissipation structure 104B is used to reduce the flow rate of the coolant to ensure that the coolant can take away more heat from the power chip set 109 per unit time.

[0099] In a further embodiment, the gap is 0.1 - 0.5 mm.

[0100] In a still further embodiment, the gap is 0.1 mm.

[0101] In a further embodiment, rib paths 104A are provided on the side of each sealing plate 104 facing away from the copper-clad ceramic plate to improve the structural stiffness of the sealing plate 104.

[0102] In a further embodiment, it further includes a first adapter 102 and a second adapter 103; the first adapter 102 is hermetically fixed on the first longitudinal end of the housing, and a groove is formed on the side of the first adapter 102 facing away from the housing. At the corresponding positions of the bottom wall of the groove and the first flow port, the second flow port, and the third flow port located at the first end, a first upper slot 102A' communicating with the first flow port located at the first end, a first middle slot 102B communicating with the second flow port located at the first end, and a first lower slot 102A' communicating with the third flow port located at the first end are respectively provided;

[0103] The second adapter 103 is hermetically fixed on the second longitudinal end of the housing, and a boss is provided on the side of the second adapter 103 facing away from the housing. At the corresponding positions of the boss and the first flow port, the second flow port, and the third flow port located at the second end, a second upper slot 103A communicating with the first flow port located at the second end, a second middle slot 103B communicating with the second flow port located at the second end, and a second lower slot 103A' communicating with the third flow port located at the second end are respectively provided.

[0104] This embodiment is arranged in this way, which is beneficial to realizing the splicing of power modules. When three identical power modules are spliced, only by inserting the respective first adapters 102 and the adjacent second adapters 103 into each other, a three-phase full-bridge module is formed, the three first flow channels are sequentially connected, the three second flow channels are sequentially connected, and the three third flow channels are sequentially connected.

[0105] Specifically, from Figure 13 and 14It can be seen that the first flow channel in the three channels is, from left to right, the first upper notch 102A → the upper layer Pin-fin channel 104B' → the second upper notch 103A; the third channel in the three channels is, from left to right, the first middle notch 102B → the upper groove 111A or the lower groove 111A' → the second middle notch 103B; the second flow channel in the three channels is, from left to right, the first lower notch 102A' → the lower layer Pin-fin channel 104B" → the second lower notch 103A'. When the coolant is introduced into the first adapter 102 from the left, it will be split through the three channel notches on the first adapter 102 to the upper layer Pin-fin channel 104B', the lower layer Pin-fin channel 104B", and the upper groove 111A and the lower groove 111A' of the metal plate embedded in the middle layer of the copper-clad ceramic plate.

[0106] In a further specific embodiment, both the first adapter 102 and the second adapter 103 are made of plastic, and both can be spliced and fixed to the support frame 101 by laser welding technology.

[0107] Of course, in order to ensure the sealing performance, a sealing ring 201 for sealing the boss and the groove is sleeved on the outer periphery of the boss in this embodiment.

[0108] In order to further improve the sealing performance, the cross-section of the sealing ring 201 in this embodiment is L-shaped, and this sealing ring is used to achieve both radial and end face sealing of the boss and the groove.

[0109] In a further embodiment, wavy protrusions 201A are provided on both the radial sealing surface and the end face sealing surface of the sealing ring 201, forming multiple seals, greatly improving the sealing reliability.

[0110] In the third aspect, as Figure 15 and 16 shown, the present invention also proposes a three-phase full-bridge module 200, which includes three three-channel power modules 100 as described in any one of the second aspect. The three three-channel power modules 100 are spliced and fixed in sequence, and the first flow channels of the three three-channel power modules 100 are connected in sequence, the second flow channels of the three three-channel power modules 100 are connected in sequence, and the third flow channels of the three three-way power modules 100 are connected in sequence.

[0111] In one specific embodiment, the second adapter 103 of the middle three-channel power module 100 is plugged and fixed to the first adapter 102 of the adjacent subsequent three-channel power module 100, and the first adapter 102 of the middle three-channel power module 100 is plugged and fixed to the second adapter 103 of the adjacent previous three-channel power module 100, so that the first flow channels of the three three-channel power modules 100 are sequentially connected, the second flow channels of the three three-channel power modules 100 are sequentially connected, and the third flow channels of the three three-way power modules 100 are sequentially connected.

[0112] Fourthly, as Figure 17 and Figure 18 shown, the present invention also proposes an inverter 300, which includes the three-phase full-bridge module 200 described in any one of the third aspects.

[0113] Specifically, in the inverter 300, a water inlet joint 304 and a water outlet joint 305 are respectively installed on the left and right sides of the three-phase full-bridge module 200. Among them, a plurality of symmetrically distributed pressing blocks 302 and screws 303 are added around the three-phase full-bridge module 200. The pressing blocks 302 and screws 303 are used to fix the module, ensuring the overall stability of the module. A drive board assembly 306 is provided directly above the three-phase full-bridge module 200. The drive board assembly 306 is plugged into the pins 107 on each phase power module 100, so as to realize the monitoring and control of electrical signals.

[0114] From Figures 18-20 it can be seen that the external water inlet 301A at the water inlet end and the external water outlet 301B at the water outlet end are both arranged on the inverter housing 301. The external water inlet 301A is communicated with the main water inlet channel 304A on the water inlet joint 304. The main water inlet channel 304A is further divided into three branch water inlet slots, namely the first branch upper water inlet slot 304B, the first branch middle water inlet slot 304C, and the first branch lower water inlet slot 304B';

[0115] Among them, the first branch upper water inlet slot 304B is communicated with the second upper slot 103A on the second adapter 103, the first branch middle water inlet slot 304C is communicated with the second middle slot 103B on the second adapter 103, and the first branch lower water inlet slot 304B' is communicated with the second lower slot 103A' on the second adapter 103; the external water outlet 301B is communicated with the main water outlet channel 305A on the water outlet joint 305. The main water outlet channel 305A is also divided into three branch water outlet slots, namely the second branch upper water inlet slot 305B, the second branch middle water inlet slot 305C, and the second branch lower water inlet slot 305B'.

[0116] Among them, the upper water inlet slot 305B on the second branch communicates with the first upper slot 102A on the first adapter 102, the middle water inlet slot 305C on the second branch communicates with the first middle slot 102B on the first adapter 102, and the lower water inlet slot 305B' on the second branch communicates with the second lower slot 102A' on the first adapter 102.

[0117] In order to ensure the sealing performance of the water inlet and outlet ends on both sides of the module, sealing rings 201 are used between the external water inlet 301A on the sealed inverter housing 301 and the water inlet connector 304, between the water inlet connector 304 and the second adapter 103, between the first adapter 102 and the water outlet connector 305, and between the water outlet connector 305 and the external water outlet 301B on the inverter housing 301 in this embodiment.

[0118] As mentioned above, the above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent replacements or changes should be covered within the protection scope of the present invention.

Claims

1. A copper-clad ceramic plate, characterized in that: The invention comprises a double-sided copper-clad ceramic substrate, wherein a third flow channel extending in the longitudinal direction is provided in the ceramic layer of the double-sided copper-clad ceramic substrate.

2. The copper-clad ceramic board according to claim 1, characterized in that: A metal plate is embedded in the ceramic layer of the double-sided copper-clad ceramic substrate, and a third flow channel extending in the longitudinal direction is provided on the metal plate; Preferably, the metal plate is provided with one or more through holes penetrating in the longitudinal direction, and the one or more through holes penetrating in the longitudinal direction are combined to form a third flow channel; Preferably, one or more upper grooves are provided on the top surface of the metal plate and are arranged in the longitudinal direction of the shell, and the one or more upper grooves form a third flow channel; Preferably, one or more lower grooves are provided on the bottom surface of the metal plate and are arranged along the longitudinal direction of the shell, and the one or more lower grooves are combined to form a third flow channel; Preferably, one or more upper grooves arranged along the longitudinal direction of the shell are opened on the top surface of the metal plate, and one or more lower grooves arranged along the longitudinal direction of the shell are opened on the bottom surface of the metal plate. One or more upper grooves and one or more lower grooves are combined to form a third flow channel.

3. The three-channel power module according to claim 2, characterized in that: Both ends of the metal plate in the longitudinal direction protrude from the double-sided copper-clad ceramic substrate.

4. A three-channel power module, characterized in that: include: A housing and a copper-clad ceramic plate as claimed in any one of claims 1 to 3; The copper-clad ceramic plate is horizontally installed in the middle of the shell, and the inside of the shell is divided into two closed and independent chambers; Power chip layers are respectively arranged on the top and bottom surfaces of the copper-clad ceramic board, and an isolation protection layer is arranged on the surface of each power chip layer. A gap is reserved between the isolation protection layer above the copper-clad ceramic board and the top wall of the shell to form a first flow channel; A gap is reserved between the isolation protection layer located below the copper-clad ceramic plate and the bottom wall of the shell to form a second flow channel; A first flow channel opening connected to the first flow channel is provided at both ends of the shell in the longitudinal direction corresponding to the first flow channel, a second flow channel opening connected to the second flow channel is provided at both ends of the shell in the longitudinal direction corresponding to the second flow channel, and a third flow channel opening connected to the third flow channel is provided at both ends of the shell in the longitudinal direction corresponding to the third flow channel.

5. The three-channel power module according to claim 4, characterized in that: The power chip layer includes a power chip group, and the side of each power chip group facing the copper-clad ceramic board is welded and fixed to the copper-clad ceramic board, and the side of each power chip group facing away from the copper-clad ceramic board is connected to the copper-clad ceramic board through a binding wire, and the isolation protection layer covers the power chip group, the binding wire and the copper clad layer of the copper-clad ceramic board; Preferably, each power chip group includes a plurality of power chips, and the power chips are double-sided welded chips; Preferably, the isolation protection layer is a silicone gel layer or an epoxy layer.

6. The three-channel power module according to claim 4, characterized in that: The shell comprises a support frame and two sealing plates; the support frame comprises two first support plates and two second support plates; the two first support plates are arranged in sequence and spaced apart along the transverse direction of the shell, wherein one second support plate is respectively connected between the first ends of the two first support plates, and the other second support plate is connected between the second ends of the two second support plates; wherein the bottom walls of the second support plates are all located above the bottom walls of the first support plates, and the top walls of the second support plates are all located below the tops of the second support plates; One of the sealing plates is located above the first supporting plate, the other sealing plate is located below the first supporting plate, and both ends of each sealing plate in the transverse direction are respectively sealed and fixedly connected to the two first supporting plates; A shell is formed between the two first support plates, the two second support plates and the two sealing plates; The gaps between the top walls of the two second support plates and the two ends of the sealing plate located above form a first flow channel opening, and the gaps between the bottom walls of the two second support plates and the two ends of the sealing plate located below form a second flow channel opening; The two ends of the copper-clad ceramic plate in the horizontal direction are respectively sealed and fixedly connected to the middle of the two first support plates, and the two ends of the copper-clad ceramic plate in the vertical direction are respectively sealed and fixedly connected to the middle of the two second support plates; a third flow channel opening is respectively provided at the corresponding positions of the two second support plates and the third flow channel of the copper-clad ceramic plate; Preferably, the support frame and the sealing plate are both made of plastic material, and the support frame and the sealing plate are spliced ​​and fixed by laser welding process; Preferably, each sealing plate is provided with an array of Pin-fin pin-fin heat dissipation structures on the side facing the copper-clad ceramic plate, and a gap is reserved between the Pin-fin pin-fin heat dissipation structure and the corresponding isolation protection layer; In a further embodiment, the gap is 0.1-0.5 mm; Preferably, each sealing plate is provided with ribs on the side facing away from the copper-clad ceramic plate.

7. The three-channel power module according to claim 4, characterized in that: It also includes a first adapter and a second adapter; the first adapter is sealed and fixed on the first end of the shell in the longitudinal direction, a groove is provided on the side of the first adapter facing away from the shell, and a first upper notch communicating with the first flow channel opening at the first end, a first middle notch communicating with the second flow channel opening at the first end, and a first lower notch communicating with the third flow channel opening at the first end are respectively provided on the bottom wall of the groove at positions corresponding to the first flow channel opening, the second flow channel opening, and the third flow channel opening at the first end; The second adapter is sealed and fixed on the second end of the shell in the longitudinal direction, and a boss is provided on the side of the second adapter facing away from the shell, and the boss is respectively provided with a second upper notch communicating with the first flow channel opening at the second end, a second middle notch communicating with the second flow channel opening at the second end, and a second lower notch communicating with the third flow channel opening at the second end at the corresponding positions of the first flow channel opening, the second flow channel opening and the third flow channel opening at the second end; Preferably, the first adapter and the second adapter are both made of plastic, and the first adapter and the second adapter are spliced ​​and fixed to the support frame by a laser welding process.

8. The three-channel power module according to claim 7, characterized in that: The outer periphery of the boss is sleeved with a sealing ring for sealing the boss and the groove; Preferably, the sealing ring is used to achieve radial and end face sealing between the boss and the groove at the same time; Preferably, a plurality of wave-shaped protrusions are provided on the radial sealing surface and the end sealing surface of the sealing ring.

9. A three-phase full-bridge module, characterized in that: It comprises three three-channel power modules as described in any one of claims 4-8.

10. An inverter, characterized in that: Comprising the three-phase full-bridge module as claimed in claim 9.

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