Electronic control circuit board with centralized heat dissipation function

Abstract

The invention discloses a centralized heat dissipation electronic control circuit board, which comprises a mounting plate, a circuit board body is fixedly mounted above the mounting plate, an upper heat dissipation assembly is arranged above the circuit board body, and the upper heat dissipation assembly comprises a heat dissipation cover and a heat dissipation plate. A lower heat dissipation mechanism is arranged between the mounting plate and the circuit board body, the lower heat dissipation mechanism comprises two side heat conduction plates, heat dissipation fins and a bottom heat conduction plate, the bottom heat conduction plate is arranged below the circuit board body, the number of the side heat conduction plates is two, and the number of the heat dissipation fins is two. The two side heat conduction plates are arranged on the two sides of the bottom heat conduction plate respectively and fixedly connected with the bottom heat conduction plate. The concentrated heat dissipation capability of the circuit board is realized, and the practicability is improved, so that the problems that heat cannot be quickly dissipated in the use process of the circuit board, and the internal heat accumulation performance of the circuit board is easily reduced are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and particularly to an electronic and electrical control circuit board with centralized heat dissipation. Background Art

[0002] An electronic and electrical control circuit board is a component that plays a key role in electronic devices. It combines electronic technology and control theory to achieve precise management and control of electronic devices. An electronic and electrical control circuit board is a board that integrates various control devices, components, input and output ports, etc. to form an integrated control electronic device. It controls the modules of internal electronic components through a program to achieve functions such as automatic control and intelligent control; For example, the patent with the publication number CN220023478U (an electronic control circuit board with a heat dissipation structure): includes a circuit board main body, several electronic components are installed on the top end of the circuit board main body, a heat dissipation plate is slidably connected to the bottom end of the circuit board main body, an installation groove is opened inside the heat dissipation plate, a condensation pipe is installed in the installation groove, a condensation liquid is filled in the condensation pipe, a liquid storage box is fixedly connected to the right end of the heat dissipation plate, a cavity is opened inside the liquid storage box, one end of the condensation pipe extends to communicate with the cavity, the other end of the condensation pipe is communicated with a liquid outlet pipe, and a liquid inlet pipe is communicated between the liquid outlet pipe and the cavity; Although the above-mentioned prior art can dissipate heat from the circuit board main body and accelerate the heat dissipation speed, it can only dissipate heat from the bottom during heat dissipation and does not have the ability of centralized heat dissipation. Therefore, during the use of the circuit board, it cannot dissipate heat quickly, which easily leads to the decline of the heat accumulation performance inside the circuit board and poor practicability; Therefore, there is an urgent need in the market to develop an electronic and electrical control circuit board with centralized heat dissipation to help people solve existing problems. Summary of the Invention

[0003] The purpose of the present invention is to provide an electronic and electrical control circuit board with centralized heat dissipation to solve the problems of slow heat dissipation during the use of the circuit board, easy decline of the heat accumulation performance inside the circuit board, and poor practicability proposed in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solution: An electronic and electrical control circuit board with centralized heat dissipation, including a mounting plate, a circuit board main body is fixedly installed above the mounting plate, an upper heat dissipation component is arranged above the circuit board main body, the upper heat dissipation component includes a heat dissipation cover and a heat dissipation plate, a lower heat dissipation mechanism is arranged between the mounting plate and the circuit board main body, the lower heat dissipation mechanism includes a side heat conduction plate, heat dissipation fins and a bottom heat conduction plate, the bottom heat conduction plate is arranged below the circuit board main body, there are two side heat conduction plates, and the two side heat conduction plates are respectively arranged on both sides of the bottom heat conduction plate and fixedly connected to the bottom heat conduction plate.

[0005] Preferably, a plurality of heat dissipation fins are provided, and the heat dissipation fins are arranged inside the side heat conduction plate. A plurality of first ventilation holes are arranged inside the heat dissipation fins.

[0006] Preferably, a bottom groove is arranged on the upper end surface of the mounting plate. The bottom heat conduction plate is arranged inside the bottom groove. A compression spring is arranged below the bottom heat conduction plate inside the bottom groove of the mounting plate.

[0007] Preferably, an upper mounting seat is fixedly installed above the compression spring. The upper mounting seat is fixedly connected to the bottom heat conduction plate. A lower mounting seat is fixedly installed below the compression spring. The lower mounting seat is fixedly connected to the mounting plate.

[0008] Preferably, the heat dissipation cover is arranged above the circuit board body. A thermal phase change heat conduction pad is arranged inside the heat dissipation cover.

[0009] Preferably, a plurality of heat dissipation plates are provided, and the heat dissipation plates are fixedly installed above the heat dissipation cover. A plurality of second ventilation holes are arranged inside the heat dissipation plates.

[0010] Preferably, a vertical plate is fixedly installed on one side above the mounting plate. A heat dissipation fan is fixedly installed inside the vertical plate.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: Through the arrangement of the upper heat dissipation assembly and the lower heat dissipation mechanism, the heat dissipation speed is accelerated, the temperature of the circuit board can be transferred upward for unified heat dissipation treatment, the accumulation of heat inside the circuit board is avoided, the performance degradation is prevented, the heat dissipation efficiency and practicability are improved, and the stability and reliability of the circuit board during long-term use are ensured.

[0012] By arranging the compression spring and connecting the compression spring to the bottom heat conduction plate, the bottom heat conduction plate can elastically adhere to the lower end surface of the circuit board body, which helps to improve the heat dissipation efficiency.

[0013] By arranging the thermal phase change heat conduction pad inside the heat dissipation cover, the thermal phase change heat conduction pad will undergo a phase change when reaching a specific temperature, absorb a large amount of heat, thereby effectively regulating the temperature rise of the circuit board, protecting sensitive components from high temperature, and improving the reliability of the device. Description of the Drawings

[0014] Figure 1 It is the front view of an electronically controlled circuit board with centralized heat dissipation according to the present invention; Figure 2 It is the side sectional view of the mounting plate of the present invention; Figure 3 It is the enlarged schematic view of part A of the present invention; Figure 4Side view of the vertical plate of the present invention.

[0015] In the figure: 1, mounting plate; 101, bottom groove; 2, circuit board body; 3, heat dissipation cover; 4, heat dissipation plate; 5, side heat conduction plate; 6, heat dissipation fins; 7, vertical plate; 8, bottom heat conduction plate; 9, compression spring; 901, upper mounting seat; 902, lower mounting seat; 10, heat dissipation fan. Detailed implementation manners

[0016] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0017] Please refer to Figures 1-4 , an embodiment provided by the present invention: an electronic and electrical control circuit board with centralized heat dissipation, including a mounting plate 1, a circuit board body 2 is fixedly installed above the mounting plate 1, an upper heat dissipation component is arranged above the circuit board body 2, the upper heat dissipation component includes a heat dissipation cover 3 and a heat dissipation plate 4, a lower heat dissipation mechanism is arranged between the mounting plate 1 and the circuit board body 2, the lower heat dissipation mechanism includes a side heat conduction plate 5, heat dissipation fins 6 and a bottom heat conduction plate 8, the side heat conduction plate 5, the heat dissipation fins 6 and the bottom heat conduction plate 8 are all made of die-cast aluminum alloy, the bottom heat conduction plate 8 is arranged below the circuit board body 2, there are two side heat conduction plates 5, and the two side heat conduction plates 5 are respectively arranged on both sides of the bottom heat conduction plate 8 and fixedly connected to the bottom heat conduction plate 8.

[0018] The upper heat dissipation component arranged above the circuit board body 2 and the lower heat dissipation mechanism arranged between the mounting plate 1 and the circuit board body 2 accelerate the heat dissipation speed, and also have the ability of centralized heat dissipation, can transfer the temperature of the circuit board to the upper part for unified heat dissipation treatment, thereby avoiding the accumulation of heat inside the circuit board, preventing performance degradation, and improving the heat dissipation efficiency and practicability.

[0019] Further, a plurality of heat dissipation fins 6 are provided, and the heat dissipation fins 6 are arranged inside the side heat conduction plate 5, and a plurality of ventilation holes I are arranged inside the heat dissipation fins 6.

[0020] The arrangement of the heat dissipation fins 6 and the ventilation holes I increases the heat dissipation area, improves the heat conduction efficiency, and at the same time promotes air flow through the ventilation holes I, enhances the heat dissipation effect, and helps to further reduce the temperature of the circuit board.

[0021] Furthermore, a bottom groove 101 is provided on the upper end surface of the mounting plate 1, and the bottom heat conducting plate 8 is disposed inside the bottom groove 101. A compression spring 9 is disposed below the bottom heat conducting plate 8 inside the bottom groove 101 of the mounting plate 1. An upper mounting seat 901 is fixedly installed above the compression spring 9, and the upper mounting seat 901 is fixedly connected to the bottom heat conducting plate 8. A lower mounting seat 902 is fixedly installed below the compression spring 9, and the lower mounting seat 902 is fixedly connected to the mounting plate 1.

[0022] The bottom heat conducting plate 8 is connected to the bottom groove 101 of the mounting plate 1 through the compression spring 9, and can make minute adjustments according to the thermal expansion and contraction effect generated when the circuit board works, so that the bottom heat conducting plate 8 can elastically adhere to the lower end surface of the circuit board body 2, which helps to improve the heat dissipation efficiency.

[0023] Furthermore, a heat dissipation cover 3 is disposed above the circuit board body 2, and the components above the circuit board body 2 are inside the heat dissipation cover 3. A heat phase change heat conducting pad is provided inside the heat dissipation cover 3.

[0024] The heat dissipation cover 3 not only covers the components above the circuit board body 2, but also a heat phase change heat conducting pad is provided inside it. This design provides an additional thermal protection layer. The heat phase change heat conducting pad will undergo a phase change when reaching a specific temperature and absorb a large amount of heat, thereby effectively controlling the temperature rise of the circuit board, protecting sensitive components from high temperatures, and improving the reliability of the device.

[0025] Furthermore, a plurality of heat dissipation plates 4 are provided, and the heat dissipation plates 4 are fixedly installed above the heat dissipation cover 3. Both the heat dissipation plates 4 and the heat dissipation cover 3 are made of die-cast aluminum alloy. A plurality of second ventilation holes are provided inside the heat dissipation plates 4.

[0026] The combination of the plurality of heat dissipation plates 4 and the design of the second ventilation holes can effectively dissipate heat, increase the heat dissipation surface area, and improve the heat dissipation efficiency. The high thermal conductivity of the die-cast aluminum alloy enables heat to be quickly transferred to the heat dissipation plates and exchange heat with the outside air through the ventilation holes, increasing the practicality.

[0027] Furthermore, a vertical plate 7 is fixedly installed on one side above the mounting plate 1, and a heat dissipation fan 10 is fixedly installed inside the vertical plate 7.

[0028] After the heat dissipation fan 10 is started, the air flow above the circuit board can be accelerated, improving the efficiency of centralized heat dissipation and increasing the practicality.

[0029] Working principle: When in use, the heat generated at the bottom of the circuit board body 2 during operation is transferred through the bottom heat conduction plate 8, and the heat is further transferred to the heat dissipation fins 6 through the side heat conduction plate 5. The ventilation holes I provided inside the heat dissipation fins 6 enhance the natural heat dissipation effect. At the same time, the components above the circuit board body 2 are covered by the heat dissipation cover 3. The thermal phase change heat conduction pad inside the heat dissipation cover 3 undergoes a phase change when reaching a specific temperature, absorbing and dispersing a large amount of heat. The multiple heat dissipation plates 4 above the heat dissipation cover 3 are made of die-cast aluminum alloy and have high thermal conductivity. The ventilation holes II provided inside them further promote the dissipation of heat. In addition, after the heat dissipation fan 10 is started, it can accelerate the air flow above the circuit board, improve the efficiency of centralized heat dissipation, realize the efficient transfer and dissipation of heat, effectively avoid the accumulation of heat inside the circuit board, and improve the heat dissipation efficiency and the overall performance of the device.

[0030] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. An electronic control circuit board with centralized heat dissipation, comprising a mounting plate (1), characterized in that: A circuit board body (2) is fixedly mounted above the mounting plate (1); an upper heat dissipation component is arranged above the circuit board body (2); the upper heat dissipation component comprises a heat dissipation cover (3) and a heat dissipation plate (4); a lower heat dissipation mechanism is arranged between the mounting plate (1) and the circuit board body (2); the lower heat dissipation mechanism comprises a side heat conduction plate (5), heat dissipation fins (6) and a bottom heat conduction plate (8); the bottom heat conduction plate (8) is arranged below the circuit board body (2); two side heat conduction plates (5) are arranged; the two side heat conduction plates (5) are respectively arranged on both sides of the bottom heat conduction plate (8) and are fixedly connected to the bottom heat conduction plate (8).

2. The electronic control circuit board with centralized heat dissipation according to claim 1, characterized in that: A plurality of heat dissipation fins (6) are provided, and the heat dissipation fins (6) are arranged on the inner side of the side heat conduction plate (5), and a plurality of ventilation holes are arranged inside the heat dissipation fins (6).

3. The electronic control circuit board with centralized heat dissipation according to claim 2, characterized in that: A bottom groove (101) is provided on the upper end surface of the mounting plate (1), the bottom heat conduction plate (8) is arranged inside the bottom groove (101), and a compression spring (9) is provided inside the bottom groove (101) of the mounting plate (1) along the bottom of the bottom heat conduction plate (8).

4. The electronic control circuit board with centralized heat dissipation according to claim 3, characterized in that: An upper mounting seat (901) is fixedly mounted above the compression spring (9), and the upper mounting seat (901) is fixedly connected to the bottom heat conduction plate (8). A lower mounting seat (902) is fixedly mounted below the compression spring (9), and the lower mounting seat (902) is fixedly connected to the mounting plate (1).

5. The electronic control circuit board with centralized heat dissipation according to claim 1, characterized in that: The heat dissipation cover (3) is arranged above the circuit board body (2), and a thermal phase change heat conduction pad is arranged inside the heat dissipation cover (3).

6. The electronic control circuit board with centralized heat dissipation according to claim 5, characterized in that: A plurality of heat dissipation plates (4) are provided, and the heat dissipation plates (4) are fixedly mounted above the heat dissipation cover (3), and a plurality of ventilation holes 2 are provided inside the heat dissipation plates (4).

7. The electronic control circuit board with centralized heat dissipation according to claim 1, characterized in that: A vertical plate (7) is fixedly mounted on one side above the mounting plate (1), and a heat dissipation fan (10) is fixedly mounted inside the vertical plate (7).

Images