Electronic element surface mounting device and method with solder paste detection and compensation

Abstract

The invention relates to an electronic element surface mounting device and method with solder paste detection and compensation, and the device comprises a limiting plate which is provided with a through hole, and a pressing plate, a turnover motor and a first lifting unit are disposed right above the limiting plate. A solder paste scraping part is arranged on the edge of the pressing plate, and a transverse moving unit is further arranged over the limiting plate; a positioning groove is formed in the surface of the pressing plate, the bottom surface of the positioning groove is a mirror surface, the depth of the positioning groove is smaller than the thickness of a shell of the electronic component, and a vacuum adsorption unit is arranged on the pressing plate; a visual identification unit is arranged on one side of the hold-down plate, and a solder paste compensation unit is arranged on the other side of the hold-down plate; through photographing at two angles of the front surface and the side surface, a more accurate solder paste state can be obtained, solder paste compensation is set for the solder paste state which does not meet the condition, secondary positioning is carried out on an electronic element, the height position of pressing and mounting is precisely limited, and the mounting consistency of the electronic element is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component soldering paste detection and compensation, and more specifically, to an electronic component soldering device and method with solder paste detection and compensation. Background Art

[0002] The general process adopted by the SMT soldering process is solder paste printing - component mounting - reflow soldering - inspection and repair. In order to ensure the yield of products, some production lines also add a solder paste inspection process; currently, for the inspection of solder paste, usually after taking pictures with a vision camera, image recognition processing is carried out. Due to the top-down shooting angle, it is not easy to identify the surface flatness of the non-edge part of the solder paste. If this part is not flat, it is also easy to cause false soldering. At the same time, for the identified defective solder paste parts, it is necessary to specifically perform manual solder paste filling or reprint the solder paste process, which involves multiple material transfer operations, time-consuming and laborious. Moreover, in the subsequent component mounting process, it is not easy to control the mounting angle and height. There is a need for an electronic component soldering device and method with solder paste detection and compensation that can solve the above series of problems. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an electronic component soldering device with solder paste detection and compensation, and also provide an electronic component soldering method with solder paste detection and compensation in view of the above defects of the prior art.

[0004] The technical solution adopted by the present invention to solve its technical problems is:

[0005] Construct an electronic component placement device with solder paste detection and compensation. Among them, it includes a limiting plate. The thickness of the limiting plate is the set height value after the normal placement of the electronic component. Through holes corresponding one by one to the printed solder paste blocks on the circuit board are provided on the limiting plate. The length and width dimensions of the through holes match the length and width dimensions of the corresponding solder paste blocks. A plurality of overflow holes are provided at the edges of the through holes. A pressing plate, a flipping motor for driving the pressing plate to longitudinally flip, and a first lifting unit for driving the flipping motor to longitudinally lift are arranged directly above the limiting plate. A solder paste scraping part is arranged at the edge of the pressing plate. A transverse movement unit for driving the first lifting unit to move horizontally is also arranged directly above the limiting plate. A positioning groove for secondary positioning of the electronic component is arranged on the surface of the pressing plate, and the bottom surface of the positioning groove is a mirror surface. The depth of the positioning groove is less than the thickness of the housing of the electronic component. A vacuum adsorption unit for vacuum-adsorbing the electronic component in the positioning groove is arranged on the pressing plate. A vision recognition unit for collecting the image of the solder paste block reflected by the mirror surface and performing image recognition is arranged on one side of the pressing plate, and a solder paste compensation unit is arranged on the other side. The device also includes a control host, and the control host receives the data of the vision recognition unit and controls the operation of the flipping motor, the first lifting unit, the transverse movement unit, the vacuum adsorption unit, and the solder paste compensation unit.

[0006] For the electronic component placement device with solder paste detection and compensation according to the present invention, among them, the device further includes a bracket. The transverse movement unit is arranged on the bracket, and a second lifting unit for driving the limiting plate to lift is also arranged on the bracket.

[0007] For the electronic component placement device with solder paste detection and compensation according to the present invention, among them, the device further includes a processing table. The bracket is fixed on the processing table, and a placement station for positioning the circuit board with printed solder paste is arranged on the processing table.

[0008] For the electronic component placement device with solder paste detection and compensation according to the present invention, among them, a positioning table for primary positioning of the electronic component and a transfer manipulator for picking up the electronic component from the positioning table and transferring it to the positioning groove are also arranged on the processing table.

[0009] For the electronic component placement device with solder paste detection and compensation according to the present invention, among them, the vacuum adsorption unit includes a plurality of capillary tubes penetrating through the pressing plate and a vacuum generator for providing negative pressure to the plurality of capillary tubes.

[0010] For the electronic component placement device with solder paste detection and compensation according to the present invention, among them, the solder paste compensation unit includes a solder paste extrusion pump and a compensation manipulator for driving the solder paste extrusion pump to move.

[0011] The electronic component chip mounter with solder paste detection and compensation according to the present invention, wherein the solder paste scraping part includes a solder paste scraping inclined surface arranged at the edge of the pressing plate, and a storage groove for temporarily storing the scraped solder paste is formed on the solder paste scraping inclined surface.

[0012] An electronic component chip mounting method with solder paste detection and compensation, which is applied to the electronic component chip mounter with solder paste detection and compensation as described above. The method includes the steps:

[0013] Transfer the circuit board printed with solder paste to the chip mounting station. The limiting plate descends to press the circuit board, and the through holes on the limiting plate correspond to the printed solder paste blocks on the circuit board one by one.

[0014] The control host controls the first lifting unit to operate, so that the pressing plate descends to the set first height position. The control host controls the flipping motor to operate, driving the pressing plate to be longitudinally flipped to the first inclined state with an inclination angle of 45 degrees. The visual recognition unit acquires the top view image of the solder paste block reflected on the mirror surface.

[0015] The control host controls the first lifting unit and the transverse movement unit to operate, so that the pressing plate descends to the second height position and transversely moves a set distance. The control host controls the flipping motor to operate, driving the pressing plate to be longitudinally flipped to the inclined state with an inclination angle of 60 degrees. The visual recognition unit acquires the oblique view image of the solder paste block reflected on the mirror surface.

[0016] The control host receives the two image data collected by the visual recognition unit, and performs recognition and analysis on whether there are surface unevenness or defects in the solder paste. If not, it directly enters the next step; if so, the limiting plate is lifted up until the upper surface of the limiting plate is flush with the upper surface of the solder paste block. The control host controls the solder paste compensation unit to fill the uneven or defective parts of the solder paste block with solder paste. The control host controls the flipping motor and the first lifting unit to operate so that the solder paste scraping part of the pressing plate fits the limiting plate. The control host controls the transverse movement unit to operate to drive the solder paste scraping part to transversely move to perform the solder paste scraping action.

[0017] The control host controls the flipping motor to operate so that the pressing plate is flipped to make the positioning groove face upwards. The positioning groove receives the fed electronic component and performs secondary positioning on the electronic component. The control host controls the vacuum adsorption unit to operate to adsorb the electronic component, and then the control host controls the flipping motor to operate so that the pressing plate is flipped to make the positioning groove face downwards.

[0018] The control host controls the first lifting unit to operate, driving the pressing plate to descend and contact the limiting plate to complete the chip mounting action of the electronic component. The control host controls the vacuum adsorption unit to release the electronic component, and controls the flipping motor, the first lifting unit and the transverse movement unit to reset the pressing plate, and the limiting plate ascends to reset.

[0019] The beneficial effects of the present invention are as follows: The circuit board printed with solder paste is transferred to the chip mounting station, and the limiting plate descends to press the circuit board. The through holes on the limiting plate correspond one by one to the printed solder paste blocks on the circuit board. The control host controls the operation of the first lifting unit to lower the pressing plate to the set first height position. The control host controls the operation of the flipping motor to drive the pressing plate to longitudinally flip to the first diagonal state with a 45-degree inclination angle, and the visual recognition unit obtains the top-down image of the solder paste block reflected on the mirror surface. The control host controls the operation of the first lifting unit and the transverse movement unit to lower the pressing plate to the second height position and transversely move a set distance. The control host controls the operation of the flipping motor to drive the pressing plate to longitudinally flip to the diagonal state with a 60-degree inclination angle, and the visual recognition unit obtains the diagonal image of the solder paste block reflected on the mirror surface.

[0020] The control host receives the two image data collected by the visual recognition unit, and identifies and analyzes whether there are surface unevenness or defects in the solder paste. If not, it directly proceeds to the next step. If so, the limiting plate is lifted up until the upper surface of the limiting plate is flush with the upper surface of the solder paste block. The control host controls the solder paste compensation unit to fill the uneven or defective parts of the solder paste block with solder paste. The control host controls the operation of the flipping motor and the first lifting unit to make the solder paste scraping part of the pressing plate fit the limiting plate. The control host controls the operation of the transverse movement unit to drive the solder paste scraping part to transversely move to perform the solder paste scraping action. The control host controls the operation of the flipping motor to make the pressing plate flip so that the positioning groove faces upward. The positioning groove receives the fed electronic components and performs secondary positioning on the electronic components. The control host controls the operation of the vacuum adsorption unit to adsorb the electronic components, and then the control host controls the operation of the flipping motor to make the pressing plate flip so that the positioning groove faces downward. The control host controls the operation of the first lifting unit to drive the pressing plate to descend and contact the limiting plate to complete the chip mounting action of the electronic components. The control host controls the vacuum adsorption unit to release the electronic components, and controls the flipping motor, the first lifting unit, and the transverse movement unit to reset the pressing plate, and the limiting plate ascends to reset.

[0021] By applying the method of the present application, taking pictures from two angles, the front and the side, can obtain a more accurate solder paste state. And for the solder paste state that does not meet the conditions, solder paste compensation is set. Secondary positioning is performed on the electronic components, and the height position of the pressing and mounting is accurately limited to ensure the consistency of the chip mounting of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will further illustrate the present invention in conjunction with the drawings and embodiments. The drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts:

[0023] Figure 1Schematic diagram of the structure of an electronic component chip mounter with solder paste detection and compensation according to a preferred embodiment of the present invention;

[0024] Figure 2 Partial cross-sectional view of the limit plate of the electronic component chip mounter with solder paste detection and compensation according to a preferred embodiment of the present invention;

[0025] Figure 3 Cross-sectional view of the pressing plate of the electronic component chip mounter with solder paste detection and compensation according to a preferred embodiment of the present invention;

[0026] Figure 4 Flowchart of the method for mounting electronic components with solder paste detection and compensation according to a preferred embodiment of the present invention. Detailed implementation manners

[0027] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] The electronic component chip mounter with solder paste detection and compensation according to a preferred embodiment of the present invention, as Figure 1 shown, and referring to Figure 2 and Figure 3 , includes a limit plate 1. The thickness of the limit plate 1 is the height value after the normal chip mounting of the set electronic component 2. Through holes 10 corresponding one by one to the printed solder paste blocks 30 on the circuit board 3 are formed on the limit plate 1. The length and width dimensions of the through holes 10 match the length and width dimensions of the corresponding solder paste blocks. A plurality of overflow holes 11 are provided at the edges of the through holes 10; A pressing plate 4, a flipping motor 40 for driving the pressing plate 4 to flip longitudinally, and a first lifting unit 41 for driving the flipping motor to lift longitudinally are arranged directly above the limit plate 1; A solder paste scraping portion 43 is arranged at the edge of the pressing plate 4. A transverse movement unit 42 for driving the first lifting unit 41 to move horizontally is also arranged directly above the limit plate 1; A positioning groove 44 for repositioning the electronic component 2 is arranged on the surface of the pressing plate 4, and the bottom surface of the positioning groove 44 is a mirror surface 440. The depth of the positioning groove 44 is less than the thickness of the housing of the electronic component 2. A vacuum adsorption unit 45 for adsorbing the electronic component in the positioning groove 44 is arranged on the pressing plate 4; A vision recognition unit 5 for collecting the image of the solder paste block reflected by the mirror surface 440 and performing image recognition is arranged on one side of the pressing plate 4, and a solder paste compensation unit 6 is arranged on the other side; The device further includes a control host 7. The control host 7 receives the data of the vision recognition unit 5 and controls the operation of the flipping motor 40, the first lifting unit 41, the transverse movement unit 42, the vacuum adsorption unit 45, and the solder paste compensation unit 6;

[0029] Transfer the printed circuit board 3 with solder paste to the chip placement station. The limiting plate 1 moves downward to press and hold the circuit board 3 to prevent the circuit board from shifting. The through holes 10 on the limiting plate 1 correspond one by one to the printed solder paste blocks 30 on the circuit board 3. The control host 7 controls the operation of the first lifting unit 41 to lower the pressing plate 4 to a set first height position. The control host 7 controls the operation of the flipping motor 40 to drive the pressing plate 4 to longitudinally flip to a first diagonal state with a 45-degree inclination angle, and the visual recognition unit 5 obtains the top-down image of the solder paste block reflected on the mirror surface. The control host 7 controls the operation of the first lifting unit 41 and the transverse movement unit 42 to lower the pressing plate 4 to a second height position and transversely move a set distance. The control host 7 controls the operation of the flipping motor 40 to drive the pressing plate 4 to longitudinally flip to an inclined state with a 60-degree inclination angle, and the visual recognition unit 5 obtains the oblique image of the solder paste block reflected on the mirror surface. After the acquisition is completed, the control host 7 controls the pressing plate 4 to return to the position directly facing the solder paste block.

[0030] The control host 7 receives the two image data collected by the visual recognition unit 5 and performs recognition and analysis on whether there are surface unevenness or defects in the solder paste. If not, it directly proceeds to the next step. If so, the limiting plate 1 is lifted upward until the upper surface of the limiting plate 1 is flush with the upper surface of the solder paste block 30. The control host 7 controls the solder paste compensation unit 6 to replenish the solder paste at the uneven or defective part of the solder paste block 30. The control host 7 controls the operation of the flipping motor 40 and the first lifting unit 41 to make the solder paste scraping part 43 of the pressing plate 4 fit the limiting plate 1. The control host 7 controls the operation of the transverse movement unit 42 to drive the solder paste scraping part 43 to transversely move to perform the solder paste scraping action. After the solder paste replenishment action is completed, the control host 7 controls the limiting plate 1 to move downward and reset.

[0031] The control host 7 controls the operation of the flipping motor 40 to flip the pressing plate 4 so that the positioning groove 44 faces upward. The positioning groove 44 receives the fed electronic component 2 (the back surface of the electronic component fits the mirror surface, and the pins face the outside of the positioning groove 44) and performs secondary positioning on the electronic component 2. The control host 7 controls the operation of the vacuum adsorption unit 45 to adsorb the electronic component 2, and then the control host 7 controls the operation of the flipping motor 40 to flip the pressing plate 4 so that the positioning groove 44 faces downward. The control host 7 controls the operation of the first lifting unit 41 to drive the pressing plate 4 to move downward and contact the limiting plate 1 to complete the chip placement action of the electronic component 2. The control host 7 controls the vacuum adsorption unit 45 to release the electronic component 2, and controls the flipping motor 40, the first lifting unit 41, and the transverse movement unit 42 to reset the pressing plate 4, and the limiting plate 1 moves upward and resets.

[0032] By applying the method of the present application, taking pictures from two angles, namely the front and the side, can obtain clear contour images and upper surface images, thus more accurately judging the solder paste state. Moreover, when taking pictures, the camera remains stationary, and the mirror on the bottom of the positioning groove on the pressing plate is used to obtain images. By quickly adjusting the position of the pressing plate, the image acquisition operation at two angles can be quickly completed, which is convenient and fast. In this way, according to needs, a single camera is set to collect images reflected by multiple mirrors to improve the utilization rate of the device. In addition, a solder paste compensation mechanism is set for the solder paste state that does not meet the conditions. According to this mechanism, the circuit board does not need to be moved, and the squeegee operation can be completed by using the limiting plate and the pressing plate, significantly improving the processing efficiency. Moreover, the positioning groove performs secondary positioning on the electronic components, and in combination with the limiting plate, accurately limits the height position of the pressing and mounting, thereby effectively ensuring the mounting efficiency and mounting consistency.

[0033] It should be noted that when implementing the method of the present application, multiple workstations can be set, and only a limited number of components are mounted at each workstation. For example, if 8 parts need to be mounted on a circuit board, it is divided into 4 - 8 workstations, and only 1 - 2 components are mounted at each workstation to ensure fully automatic batch mounting operations while ensuring sufficient setting space for the device.

[0034] Preferably, the device further includes a bracket 8. The transverse movement unit 42 is arranged on the bracket 8. The bracket 8 is also provided with a second lifting unit 80 for driving the limiting plate 1 to lift. The second lifting unit 80 is controlled by the control host 7 to facilitate adjusting the height of the limiting plate 1. The second lifting unit 80 is preferably implemented by a precision lead screw assembly to ensure the adjustment accuracy. The device further includes a processing table 9. The bracket 8 is fixed on the processing table 9. The processing table 9 is provided with a chip mounting station 90 for positioning the circuit board 3 on which the solder paste has been printed. The processing table 9 is also provided with a positioning table 91 for performing primary positioning on the electronic components and a material transfer manipulator 92 for picking up materials from the positioning table and transferring them to the positioning groove, which is convenient for positioning the circuit board 3 and performing primary positioning and material transfer operations on the electronic components.

[0035] Preferably, the vacuum adsorption unit 45 includes multiple capillary tubes 450 penetrating through the pressing plate 4 and a vacuum generator 451 for providing negative pressure to the multiple capillary tubes 450. The structure is simple and the operation is convenient.

[0036] Preferably, the solder paste compensation unit 6 includes a solder paste extrusion pump 60 and a compensation manipulator 61 for driving the solder paste extrusion pump to move. The structure is simple. Of course, it can be understood that other existing structural forms for compensating the solder paste can also be adopted.

[0037] Preferably, the solder paste scraping part 43 includes a solder paste scraping inclined surface 430 provided at the edge of the pressing plate 4, and a storage groove 431 for temporarily storing the scraped solder paste is formed on the solder paste scraping inclined surface 430; the structure is simple and the operation is convenient.

[0038] A method for mounting electronic components with solder paste detection and compensation, which applies the device for mounting electronic components with solder paste detection and compensation as described above, as Figure 4 shown, the method includes the steps:

[0039] S01: Transfer the circuit board printed with solder paste to the mounting station, lower the limiting plate to press the circuit board, and the through holes on the limiting plate correspond to the printed solder paste blocks on the circuit board one by one;

[0040] S02: The control host controls the operation of the first lifting unit to lower the pressing plate to a set first height position, the control host controls the operation of the flipping motor to drive the pressing plate to longitudinally flip to a first inclined state with an inclination angle of 45 degrees, and the visual recognition unit obtains a top view image of the solder paste block reflected on the mirror surface;

[0041] S03: The control host controls the operation of the first lifting unit and the transverse movement unit to lower the pressing plate to a second height position and transverse movement a set distance, the control host controls the operation of the flipping motor to drive the pressing plate to longitudinally flip to an inclined state with an inclination angle of 60 degrees, and the visual recognition unit obtains an oblique image of the solder paste block reflected on the mirror surface;

[0042] S04: The control host receives the two image data collected by the visual recognition unit, and identifies and analyzes whether there are surface unevenness or defects in the solder paste. If not, it directly enters the next step; if so, the limiting plate is lifted up until the upper surface of the limiting plate is flush with the upper surface of the solder paste block, the control host controls the solder paste compensation unit to fill the uneven or defective part of the solder paste block with solder paste, the control host controls the flipping motor and the first lifting unit to make the solder paste scraping part of the pressing plate fit the limiting plate, and the control host controls the transverse movement unit to drive the solder paste scraping part to perform the solder paste scraping action transversely;

[0043] S05: The control host controls the flipping motor to operate so that the pressing plate flips to make the positioning groove face up, the positioning groove receives the fed electronic components and performs secondary positioning on the electronic components, the control host controls the vacuum adsorption unit to adsorb the electronic components, and then the control host controls the flipping motor to operate so that the pressing plate flips to make the positioning groove face down;

[0044] S06: The control host controls the operation of the first lifting unit to drive the pressing plate to descend and contact the limiting plate to complete the mounting action of the electronic components, the control host controls the vacuum adsorption unit to release the electronic components, and controls the flipping motor, the first lifting unit and the transverse movement unit to reset the pressing plate, and the limiting plate ascends to reset;

[0045] By applying the method of the present application, taking photos from both the front and side angles can obtain a more accurate solder paste state. For the solder paste state that does not meet the conditions, solder paste compensation is set. The electronic components are repositioned, and the height position of the pressing and mounting is precisely defined to ensure the consistency of the electronic component mounting.

[0046] It should be understood that those of ordinary skill in the art can make improvements or modifications according to the above description, and all such improvements and modifications should fall within the protection scope of the appended claims of the present invention.

Claims

1. An electronic component placement device with solder paste detection and compensation, characterized in that: It includes a limiting plate, the thickness of which is the height value of the electronic component after normal mounting, the limiting plate is provided with through holes corresponding to the solder paste blocks printed on the circuit board, the length and width of the through holes match the length and width of the corresponding solder paste blocks, and the edges of the through holes are provided with a plurality of overflow holes; a holding plate, a flip motor for driving the holding plate to flip longitudinally, and a first lifting unit for driving the flip motor to lift longitudinally are provided directly above the limiting plate; a solder paste scraping part is provided at the edge of the pressing plate, and a lateral movement unit for driving the first lifting unit to move laterally is also provided directly above the limiting plate; the surface of the pressing plate is provided with A positioning groove for secondary positioning of electronic components, and the bottom surface of the positioning groove is a mirror surface, the depth of the positioning groove is less than the thickness of the shell of the electronic component, and the holding plate is provided with a vacuum adsorption unit for vacuum adsorbing the electronic components in the positioning groove; a visual recognition unit for collecting the image of the solder paste block reflected by the mirror surface and performing image recognition is provided on one side of the holding plate, and a solder paste compensation unit is provided on the other side; the device also includes a control host, the control host receives data from the visual recognition unit and controls the operation of the flip motor, the first lifting unit, the lateral movement unit, the vacuum adsorption unit and the solder paste compensation unit.

2. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that: The device also includes a bracket, the transverse movement unit is arranged on the bracket, and the bracket is also provided with a second lifting unit for driving the limit plate to rise and fall.

3. The electronic component placement device with solder paste detection and compensation according to claim 2, characterized in that: The device also includes a processing table, the bracket is fixed on the processing table, and the processing table is provided with a patch station for positioning the circuit board on which the solder paste has been printed.

4. The electronic component placement device with solder paste detection and compensation according to claim 3, characterized in that: The processing table is also provided with a positioning table for once positioning the electronic components and a material transfer robot for taking materials from the positioning table and transferring the materials to the positioning grooves.

5. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that: The vacuum adsorption unit includes a plurality of capillaries penetrating the holding plate and a vacuum generator for providing negative pressure to the capillaries.

6. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that: The solder paste compensation unit includes a solder paste extrusion pump and a compensation robot that drives the solder paste extrusion pump to move.

7. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that: The solder paste scraping part comprises a solder paste scraping inclined surface arranged at the edge of the holding plate, and a storage groove for temporarily storing the scraped solder paste is opened on the solder paste scraping inclined surface.

8. An electronic component placement method with solder paste detection and compensation, using the electronic component placement device with solder paste detection and compensation as described in any one of claims 1 to 7, characterized in that: The method comprises the steps of: The printed circuit board is transferred to the patch station, and the limit plate is pressed downward to hold the circuit board. The through holes on the limit plate correspond to the printed solder paste blocks on the circuit board one by one. The control host controls the first lifting unit to operate, so that the holding plate is lowered to a set first height position, and the control host controls the flip motor to operate, so as to drive the holding plate to flip longitudinally to a first oblique state with an inclination angle of 45 degrees, and the visual recognition unit obtains a top view image of the solder paste block reflected on the mirror surface; The control host controls the operation of the first lifting unit and the transverse movement unit, so that the holding plate is lowered to the second height position and transversely moves a set distance. The control host controls the operation of the flip motor to drive the holding plate to flip longitudinally to an oblique state with an inclination angle of 60 degrees. The visual recognition unit obtains an oblique image of the solder paste block reflected on the mirror surface. The control host receives the two image data collected by the visual recognition unit, and performs recognition and analysis to determine whether the solder paste has surface unevenness or defects. If not, it directly proceeds to the next step; if so, it moves the limit plate upward until the limit plate is flush with the upper surface of the solder paste block, and the control host controls the solder paste compensation unit to fill the solder paste on the uneven or defective parts of the solder paste block. The control host controls the flip motor and the first lifting unit to operate so that the solder paste scraping part of the holding plate fits the limit plate, and the control host controls the lateral movement unit to drive the solder paste scraping part to move horizontally to perform the solder paste scraping action; The control host controls the flip motor to operate so that the holding plate flips to the position where the positioning slot is facing upwards, the positioning slot receives the electronic components fed in and performs secondary positioning on the electronic components, the control host controls the vacuum adsorption unit to operate to adsorb the electronic components, and then the control host controls the flip motor to operate so that the holding plate flips to the position where the positioning slot is facing downwards; The control host controls the first lifting unit to operate, driving the holding plate downward and contacting the limit plate to complete the placement of the electronic components. The control host controls the vacuum adsorption unit to release the electronic components, and controls the flip motor, the first lifting unit and the transverse movement unit to reset the holding plate and the limit plate upward.

Images