Integrated semiconductor chip assembly mounting structure

Abstract

The present invention relates to the field of semiconductor chip assembly technology, and more specifically, to an integrated semiconductor chip assembly mounting structure, comprising a package bottom shell, an infrared chip, a longitudinal card holder, and a transverse card holder. The package bottom shell is provided with a mounting groove and a plug-in groove, and a flexible thermal insulation member is provided on the longitudinal card holder. The longitudinal card holder and the transverse card holder are respectively plugged into the plug-in groove so that the transverse card holder abuts against the transverse sides of the infrared chip, and the longitudinal card holder abuts against the longitudinal sides of the infrared chip so that the flexible thermal insulation member presses the infrared chip against the bottom surface of the mounting groove. The integrated semiconductor chip assembly mounting structure provided by the invention utilizes the longitudinal card holder and the transverse card holder to be plugged into the plug-in groove to abut and fix the infrared chip, and the flexible thermal insulation member presses the infrared chip against the bottom surface of the mounting groove. There is no need to use a colloid to fix the infrared chip, thus avoiding the problem of the infrared chip being offset due to poor thermal expansion and contraction of the colloid filled between the infrared chip and the package bottom shell.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip assembly, and in particular to an integrated semiconductor chip component mounting structure. Background Art

[0002] An integrated semiconductor chip refers to a chip manufactured by first integrating transistors into core particles with specific functions, and then integrating the core particles into chips through semiconductor technology according to application requirements. Infrared chips are also integrated semiconductor chips.

[0003] According to publication number CN118398676A, publication (announcement) date: 2024.07.26, an infrared detector packaging assembly and its production method are disclosed, including a packaging shell, an infrared chip and a sheet-like getter; the infrared chip is arranged in the cavity of the packaging shell; the sheet-like getter is arranged above the infrared chip, and the projection of the sheet-like getter covers the reference shielding area of the infrared chip and avoids the working area of the infrared chip. In the present invention, the sheet-like getter is directly arranged above the infrared chip as a shielding layer, blocking the reference shielding area of the infrared chip that needs to be shielded during actual work, so that the sheet-like getter can maintain the vacuum in the cavity of the assembly while taking into account the function of the light-blocking sheet, simplifying the structure of the infrared detector packaging assembly. At the same time, compared with the related art, the stacked sheet-like getter and infrared chip greatly increase the ratio of the size of the infrared chip to the size of the entire packaging assembly, thereby reducing the size of the infrared detector packaging assembly.

[0004] In the prior art including the above-mentioned patents, during the production process of infrared detectors, the infrared chip is fixed to the cavity of the packaging shell by dispensing glue, and then the infrared chip and the bonding finger gold wire are bonded to complete the electrical connection of the infrared chip, that is, the colloid is used to fix the infrared chip before welding. When the infrared detector is used on a solar energy prime mover, the coefficients of thermal expansion and contraction of the colloid and the packaging shell are inconsistent. Due to the temperature difference between day and night in the infrared detector, the infrared chip is displaced due to the difference in thermal expansion and contraction of the colloid and the packaging shell, causing the working area of the infrared chip to be offset. Summary of the Invention

[0005] The object of the present invention is to provide an integrated semiconductor chip assembly mounting structure for solving the above-mentioned problems.

[0006] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: an integrated semiconductor chip component installation structure, including a packaging bottom shell, an infrared chip, a longitudinal card seat and a transverse card seat, the packaging bottom shell is provided with a mounting groove and a plug-in slot arranged in a linear array on the bottom surface of the mounting groove, the longitudinal card seat is provided with a flexible thermal insulation member, the longitudinal card seat and the transverse card seat are respectively inserted into the plug-in slot so that the transverse card seat contacts the transverse sides of the infrared chip, and the longitudinal card seat contacts the longitudinal sides of the infrared chip so that the flexible thermal insulation member presses the infrared chip to the bottom surface of the mounting groove.

[0007] Preferably, it also includes a connecting seat and gold wire symmetrically arranged on both sides of the infrared chip, and the infrared chip and the connecting seat are respectively provided with connecting fingers and bonding fingers in a linear array, and the flexible thermal insulation member is provided with an arc-shaped wrapping groove and a through-slit connected to the wrapping groove in a linear array. The flexible thermal insulation member is located between the connecting seat and the infrared chip, and the gold wire is wedge-shaped and bonded to the connecting finger and the bonding finger so that the middle part of the gold wire is supported by the wrapping groove.

[0008] Preferably, a flexible mounting roll in the shape of a spiral is provided on the first end of the longitudinal card seat, and a spiral through groove is opened on the flexible thermal insulation member to form a connecting portion that cooperates with the flexible mounting roll, and the longitudinal card seat is inserted into the plug-in groove so that the flexible mounting roll is located between the infrared chip and the connecting seat.

[0009] Preferably, it also includes a getter, with welding parts at both ends. A working area and a reference area are provided on the first side of the infrared chip. The welding parts are respectively welded in the bottom shell of the package so that the middle part of the getter is parallel to the reference area and exposes the working area, and the flexible thermal insulation part is supported below the middle part of the getter.

[0010] Preferably, a linear array of supporting grooves spaced apart from the wrapping grooves is provided on the flexible thermal insulation member, the middle portion of the getter is wavy to form a curved portion, and the supporting grooves are supported on the bottom of the curved portion.

[0011] Preferably, a horizontal extension portion is arranged in a linear array on the longitudinal card seat, and the longitudinal card seat is inserted into the insertion slot so that the extension portion contacts the connecting seat, and the extension portion is spaced apart from the bonding fingers.

[0012] Preferably, a movable plate is rotatably provided on the extension portion, and sliding grooves are provided in a symmetrical linear array in the installation groove. The first end of the movable plate is a contact end, and the contact end extends to the outside of the extension portion. The longitudinal card seat enters the plug-in slot so that the movable plate is driven to rotate until the contact end contacts the inner wall of the sliding slot.

[0013] Preferably, a counterweight portion is provided on the second end of the movable plate so that the movable plate is horizontal and parallel to the extension portion in the default state, and the movable plate is driven to rotate in an inclined shape so that the end face of the contact end contacts the inner wall of the sliding groove and enters the sliding groove.

[0014] Preferably, the extension portion is aligned with the supporting groove, and an extrusion portion is provided on the second end of the movable plate. The extension portion abuts against the connecting seat so that the extrusion portion of the movable plate abuts against the connecting seat, and the top of the counterweight portion supports the bottom of the curved portion of the getter.

[0015] Preferably, the insertion slot is symmetrically provided with a limiting portion, and the longitudinal card seat and the transverse card seat are symmetrically provided with limiting slots respectively. The longitudinal card seat and the transverse card seat are inserted into the insertion slot so that the limiting portion contacts the limiting slot.

[0016] In the above technical solution, the present invention provides an integrated semiconductor chip assembly installation structure with the following beneficial effects: the infrared chip is fixed horizontally by means of a longitudinal card holder and a transverse card holder inserted into the insertion slot, and the longitudinal card holder also enables the flexible thermal insulation component to press the infrared chip against the bottom surface of the installation slot while being inserted and fixed, thereby improving the stability of the infrared chip fixation and eliminating the need to use a colloid to fix the infrared chip, thereby avoiding the problem of the infrared chip being offset due to the thermal expansion and contraction deformation of the colloid filled between the infrared chip and the bottom shell of the package, thereby improving the accuracy of the detection data of the infrared detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments described in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0018] Figure 1 A schematic diagram of the overall structure provided by an embodiment of the present invention;

[0019] Figure 2 A schematic cross-sectional view of the overall gold wire structure provided by an embodiment of the present invention;

[0020] Figure 3 A schematic cross-sectional view of the overall movable plate structure provided by an embodiment of the present invention;

[0021] Figure 4 A schematic structural diagram of a package bottom shell provided by an embodiment of the present invention;

[0022] Figure 5 A schematic diagram of the structure of an infrared chip and a horizontal card holder provided in an embodiment of the present invention;

[0023] Figure 6 A schematic diagram of the exploded structure of the longitudinal holder, flexible heat insulation member, gold wire and movable plate provided in an embodiment of the present invention;

[0024] Figure 7 A schematic diagram of the exploded structure of the package bottom shell, infrared chip and getter provided in an embodiment of the present invention;

[0025] Figure 8 The embodiment of the present invention provides Figure 2 A partial enlarged schematic diagram of point A in the middle;

[0026] Figure 9 The embodiment of the present invention provides Figure 3 A partial enlarged schematic diagram of point B in the middle;

[0027] Figure 10 This is a schematic structural diagram of the flexible thermal insulation member provided in an embodiment of the present invention when the infrared chip is not squeezed.

[0028] Description of reference numerals:

[0029] 1. Package bottom shell; 11. Mounting slot; 111. Insertion slot; 1111. Limiting part; 112. Sliding slot; 12. Connecting seat; 121. Bonding finger; 13. Welding slot; 2. Package top shell; 21. Infrared window; 3. Infrared chip; 31. Working area; 32. Reference area; 33. Connecting finger; 4. Longitudinal card seat; 41. Embedding part; 42. Flexible mounting roll; 43. Extension part; 5. Horizontal card seat; 51. Cross section; 6. Flexible thermal insulation member; 61. Connecting part; 62. Wrapping slot; 621. Through seam; 63. Supporting slot; 7. Getter; 71. Bending part; 72. Welding part; 8. Movable plate; 81. Contact end; 82. Extrusion part; 83. Counterweight part; 9. Gold wire; 91. Limiting slot. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0031] like Figure 1-10As shown, an integrated semiconductor chip component mounting structure includes a packaging bottom shell 1, an infrared chip 3, a longitudinal card seat 4 and a transverse card seat 5. A mounting groove 11 and plugging grooves 111 arranged in a linear array on the bottom surface of the mounting groove 11 are opened in the packaging bottom shell 1. A flexible thermal insulation member 6 is provided on the longitudinal card seat 4. The longitudinal card seat 4 and the transverse card seat 5 are respectively inserted into the plugging groove 111 so that the transverse card seat 5 contacts the transverse sides of the infrared chip 3, and the longitudinal card seat 4 contacts the longitudinal sides of the infrared chip 3 so that the flexible thermal insulation member 6 presses the infrared chip 3 against the bottom surface of the mounting groove 11.

[0032] Specifically, it also includes a package top shell 2, which is provided with an infrared window 21, and a horizontal block portion 51 is symmetrically provided on the horizontal card seat 5. First, the horizontal card seat 5 is inserted into the insertion slot 111, and then the infrared chip 3 is installed into the installation slot 11, so that the horizontal block portion 51 of the horizontal card seat 5 is in contact with the horizontal ends of the infrared chip 3, completing the horizontal fixation of the infrared chip 3, and then the longitudinal card seat 4 is inserted into the insertion slot 111, so that the longitudinal card seat 4 moves to contact the longitudinal ends of the infrared chip 3, completing the longitudinal fixation of the infrared chip 3, and along with the insertion of the longitudinal card seat 4, the flexible heat insulation member 6 moves synchronously to squeeze the infrared chip 3 and fix it. The bottom of the mounting groove 11 completes the fixation of the infrared chip 3, thereby facilitating the subsequent welding and wiring process of the infrared chip 3. The longitudinal card holder 4 and the transverse card holder 5 are plugged into the plug-in groove 111 to fix the infrared chip 3 horizontally. While the longitudinal card holder 4 is plugged in and fixed, the flexible thermal insulation component 6 presses the infrared chip 3 against the bottom surface of the mounting groove 11, thereby improving the stability of the fixation of the infrared chip 3. At the same time, there is no need to use colloid to fix the infrared chip 3, thereby avoiding the problem of the infrared chip 3 being offset due to the poor deformation of the colloid filled between the infrared chip 3 and the package bottom shell 1 due to thermal expansion and contraction, thereby improving the accuracy of the detection data of the infrared detector.

[0033] When the package top shell 2 is connected to the package bottom shell 1 through the solder sheet, the infrared window 21 of the package top shell 2 is aligned with the infrared chip 3 in the mounting groove 11 .

[0034] Furthermore, limiting portions 1111 are symmetrically provided in the insertion slot 111, and limiting slots 91 are symmetrically provided on the longitudinal card holder 4 and the transverse card holder 5, respectively. The longitudinal card holder 4 and the transverse card holder 5 are inserted into the insertion slot 111 so that the limiting portions 1111 abut against the limiting slots 91. The limiting slots 91 are symmetrically provided on the embedding portion 41 of the longitudinal card holder 4. When the longitudinal card holder 4 and the transverse card holder 5 are inserted into the insertion slot 111, the limiting portions 1111 abut against the limiting slots 91 to improve the fixing stability of the longitudinal card holder 4 and the transverse card holder 5 in the insertion slot 111, thereby avoiding the problem of displacement of the infrared chip 3 due to the detachment of the longitudinal card holder 4 or the transverse card holder 5.

[0035] In the above technical solution, the longitudinal card holder 4 and the transverse card holder 5 are inserted into the insertion slot 111 to fix the infrared chip 3 horizontally, and the longitudinal card holder 4 also enables the flexible thermal insulation component 6 to press the infrared chip 3 against the bottom surface of the installation slot 11 while plugging and fixing. This improves the stability of the fixation of the infrared chip 3 and does not require the use of colloid to fix the infrared chip 3, avoiding the problem of the infrared chip 3 being offset due to the thermal expansion and contraction deformation of the colloid filled between the infrared chip 3 and the package bottom shell 1, thereby improving the accuracy of the detection data of the infrared detector.

[0036] As another embodiment provided by the present invention, it also includes a connecting seat 12 and a gold wire 9 symmetrically arranged on both sides of the infrared chip 3, and the infrared chip 3 and the connecting seat 12 are respectively provided with connecting fingers 33 and bonding fingers 121 in a linear array, and the flexible thermal insulation member 6 is provided with an arc-shaped wrapping groove 62 and a through seam 621 connected to the wrapping groove 62 in a linear array. The flexible thermal insulation member 6 is located between the connecting seat 12 and the infrared chip 3, and the gold wire 9 is wedge-shaped bonded to the connecting finger 33 and the bonding finger 121 so that the middle part of the gold wire 9 is supported by the wrapping groove 62.

[0037] Specifically, such as Figure 5 As shown, the infrared chip 3 is symmetrically provided with connection fingers 33, and the connection base 12 symmetrically provided in the mounting groove 11 is also provided with bonding fingers 121, and the connection base 12 is distributed on both sides of the infrared chip 3 so that the bonding fingers 121 and the connection fingers 33 are aligned one by one, and the pins electrically connected to the bonding fingers 121 are provided on the outside of the package bottom shell 1, as shown in FIG. Figure 8 As shown, when the longitudinal clamping seat 4 is inserted into the insertion slot 111 to complete the fixing of the infrared chip 3, the longitudinal clamping seat 4 and the flexible thermal insulation member 6 are located between the connecting seat 12 and the infrared chip 3. When the gold wire 9 is used to form a wedge-shaped bond to electrically connect the bonding finger 121 and the connecting finger 33, one end of the gold wire 9 is first welded to the connecting finger 33. Then, the welding head pulls the gold wire 9 toward the connecting seat 12. The welding head forces the gold wire 9 along the through-slit 621 and is pressed into the wrapping groove 62 for support. The welding head then welds the gold wire 9 to the bonding finger 121 and cuts it, completing the electrical connection between the infrared chip 3 and the connecting seat 12. The wrapping groove 62 of the flexible thermal insulation member 6 supports the wedge-shaped arched portion of the gold wire 9 during the welding process, ensuring the stability and accuracy of the gold wire 9 during the bonding process and preventing the problem of poor connection caused by the bonding position of the gold wire 9 shifting. Secondly, the wrapping groove 62 is used to wrap and protect the wedge-shaped arched portion of the gold wire 9, thereby improving the protection of the gold wire 9 and preventing the gold wire 9 from being accidentally bumped or pulled during the subsequent packaging process, resulting in poor connection.

[0038] As another embodiment provided by the present invention, a flexible mounting roll 42 in a spiral shape is provided on the first end of the longitudinal card seat 4, and a spiral-shaped through groove is opened on the flexible thermal insulation member 6 to form a connecting portion 61 that cooperates with the flexible mounting roll 42. The longitudinal card seat 4 is inserted into the insertion groove 111 so that the flexible mounting roll 42 is located between the infrared chip 3 and the connecting seat 12.

[0039] Specifically, such as Figure 8 As shown, the end of the longitudinal holder 4 close to the connecting seat 12 is the first end, and a flexible mounting roll 42 is provided on the first end of the longitudinal holder 4, and a spiral-shaped through groove is provided on the flexible thermal insulation member 6 to form a connecting portion 61. The flexible thermal insulation member 6 is plugged into one piece with the flexible mounting roll 42 through the connecting portion 61, thereby improving the installation stability of the flexible thermal insulation member 6 on the longitudinal holder 4.

[0040] Since the infrared detector is inevitably affected by the temperature difference between day and night when used on a solar energy prime mover, and the gold wire 9 is a hard metal wire, it is easy to crack and damage when the gold wire 9 is subjected to axial pressure or tension. When the infrared chip 3 is heated and the volume expands, the infrared chip 3 will apply axial pressure to the gold wire 9, or when the infrared chip 3 is cooled and the volume decreases, the infrared chip 3 will apply axial pressure to the gold wire 9. Therefore, when the infrared chip 3 is affected by the reciprocating temperature difference between day and night, the gold wire 9 is easily subjected to the reciprocating action of axial pressure and tension, which leads to cracking of the surface plating of the gold wire 9, thereby causing the service life of the gold wire 9 to be reduced or even damaged.

[0041] When the longitudinal card seat 4 is inserted into the plug-in slot 111 to fix the infrared chip 3, the flexible heat insulation member 6 and the flexible mounting coil 42 are located between the infrared chip 3 and the connecting seat 12, and then the vortex-shaped flexible mounting coil 42 and the flexible heat insulation member 6 are used to realize the flexible buffering and support of the infrared chip 3 and the connecting seat 12. When the infrared chip 3 expands due to heat and increases in volume, the infrared chip 3 squeezes the flexible heat insulation member 6 and the flexible mounting coil 42 in the horizontal direction. At this time, the flexible mounting coil 42 is squeezed in the horizontal direction and extends in the vertical direction, so that the flexible heat insulation member 6 is pressed against the gold wire. 9 applies radial pressure away from the infrared chip 3, thereby reducing the horizontal extension distance of the gold wire 9 and no longer being subjected to the axial pressure of the infrared chip 3; and if the infrared chip 3 shrinks in volume due to cooling, the flexible mounting coil 42 and the flexible thermal insulation member 6 extend horizontally and adhere to the infrared chip 3 due to their own elastic force, and the flexible mounting coil 42 and the flexible thermal insulation member 6 deform and shrink along the vertical direction, so that the flexible thermal insulation member 6 applies radial pressure on the gold wire 9 close to the infrared chip 3, thereby increasing the horizontal extension distance of the gold wire 9 and no longer being subjected to the axial tension of the infrared chip 3.

[0042] The flexible mounting roll 42 and the flexible thermal insulation member 6 are used to adjust the radial pressure on the gold wire 9 according to the volume change of the infrared chip 3, thereby converting the axial pressure on the gold wire 9 into radial pressure, further improving the protection of the gold wire 9, and preventing the gold wire 9 from being damaged by the volume change of the infrared chip 3 due to thermal expansion and contraction.

[0043] As another embodiment provided by the present invention, it also includes an absorbent 7, with welding parts 72 at both ends. A working area 31 and a reference area 32 are provided on the first side of the infrared chip 3. The welding parts 72 are respectively welded in the bottom shell 1 of the package so that the middle part of the absorbent 7 parallelly blocks the reference area 32 and exposes the working area 31, and the flexible thermal insulation part 6 is supported below the middle part of the absorbent 7.

[0044] Specifically, such as Figure 4 As shown, welding grooves 13 are symmetrically arranged in the package bottom shell 1. Figure 5 As shown, the top surface of the infrared chip 3 is the first side surface, and the working area 31 and the reference area 32 on the infrared chip 3 are located between the connecting fingers 33 .

[0045] If a sheet-like getter 7 is used as a light-blocking sheet and arranged vertically above the infrared chip 3 to block the reference area 32, this method can reduce the longitudinal size of the infrared sensor. Since the getter 7 will produce volume expansion problems during the process of absorbing gas, it is necessary to maintain a certain vertical distance between the getter 7 and the infrared chip 3 to avoid contact interference of the getter 7 on the infrared chip 3.

[0046] After the infrared chip 3 and the connection base 12 are electrically connected by the gold wire 9, the welding portion 72 of the getter 7 can be welded into the welding groove 13 to complete the fixed installation of the getter 7. After the getter 7 is fixed, it is covered above the reference area 32 and the working area 31 is exposed. Figure 9 As shown, the flexible thermal insulation member 6 is now supported on the bottom of the getter 7, thereby utilizing the flexible thermal insulation member 6 to support the getter 7. This prevents the getter 7 from sagging vertically after expanding in volume due to gas absorption. This reduces the vertical spacing between the getter 7 and the infrared chip 3, further reducing the vertical dimensions of the infrared detector and the space occupied by the infrared detector packaging assembly. Furthermore, because the flexible thermal insulation member 6 is used to wrap the gold wire 9 to separate it from the getter 7, the top of the gold wire 9, which is bonded in a wedge shape, is separated from the getter 7 by the flexible thermal insulation member 6. This prevents the high temperature generated by the getter 7 absorbing gas, which could degrade the coating quality on the gold wire 9, further improving the protection of the gold wire 9.

[0047] As another embodiment provided by the present invention, a linear array of supporting grooves 63 are provided on the flexible thermal insulation member 6, which are spaced apart from the wrapping grooves 62. The middle part of the getter 7 is wavy to form a curved portion 71, and the supporting grooves 63 are supported on the bottom of the curved portion 71.

[0048] Specifically, such as Figure 6 As shown, the supporting groove 63 is located on the flexible thermal insulation member 6 and is spaced apart from the wrapping groove 62, and the middle part of the getter 7 is wavy to form a curved portion 71. When the welding portions 72 of the getter 7 are respectively welded in the welding grooves 13, the supporting groove 63 of the flexible thermal insulation member 6 is supported on the bottom of the curved portion 71, so that the wavy curved portion 71 of the getter 7 is utilized to further increase the surface area of the getter 7, increase the speed and amount of gas absorbed by the getter 7, and improve the use effect of the getter 7. Secondly, due to the increase in the surface area of the getter 7, the heat dissipation efficiency of the getter 7 can be further improved, thereby avoiding the problem of heat accumulation on the getter 7 causing degradation of the surface plating of the gold wire 9.

[0049] Secondly, since the bottom of the bent portion 71 is in contact with the supporting groove 63, when the vacuum degree in the infrared detector drops significantly after a long period of use, the getter 7 expands in volume after absorbing the gas so that the top of the bent portion 71 arches vertically away from the infrared chip 3 to further avoid the problem of contact interference of the getter 7 on the infrared chip 3, thereby improving the protection of the infrared chip 3.

[0050] After absorbing the gas, the getter 7 expands in volume so that the bottom of the curved portion 71 applies pressure to the inner wall of the supporting groove 63. The supporting groove 63 of the flexible thermal insulation member 6 is pressurized so that the wrapping groove 62 of the flexible thermal insulation member 6 is pressed and tightly wrapped around the surface of the gold wire 9, thereby alleviating the surface oxidation problem of the gold wire 9 caused by the decrease in vacuum degree, further improving the protection of the gold wire 9, and improving the service life and connection stability of the gold wire 9.

[0051] As another embodiment provided by the present invention, a horizontal extension portion 43 is arranged in a linear array on the longitudinal card seat 4. The longitudinal card seat 4 is inserted into the insertion slot 111 so that the extension portion 43 contacts the connecting seat 12, and the extension portion 43 is spaced apart from the bonding finger 121.

[0052] Specifically, such as Figure 6 As shown, the plurality of extensions 43 provided on the longitudinal card holder 4 are perpendicular to the embedded portion 41 of the longitudinal card holder 4, as shown in FIG. Figure 9As shown, when the embedded portion 41 is fully inserted into the insertion slot 111, the bottom of the extension portion 43 contacts the connector 12, thereby improving the installation stability of the longitudinal connector 4 and further preventing the infrared chip 3 from shifting due to loosening of the longitudinal connector 4. The extension portion 43 is spaced apart from the bonding fingers 121 so that the extension portion 43 is separated between each bonding finger 121. This prevents short circuits caused by accidental displacement of the gold wire 9 when soldered to the bonding finger 121, thereby improving stability during the bonding process.

[0053] As another embodiment provided by the present invention, a movable plate 8 is rotatably provided on the extension portion 43, and a sliding groove 112 is opened in a symmetrical linear array in the installation groove 11. The first end of the movable plate 8 is the contact end 81, and the contact end 81 extends to the outside of the extension portion 43. The longitudinal card seat 4 enters the plug-in slot 111 so that the movable plate 8 is driven to rotate until the contact end 81 contacts the inner wall of the sliding slot 112.

[0054] Specifically, such as Figure 9 As shown, the movable plate 8 is rotatably set on the extension part 43, and the end of the movable plate 8 facing away from the infrared chip 3 is the first end, and the end of the movable plate 8 close to the infrared chip 3 is the second end. When the longitudinal card seat 4 needs to be inserted into the plug-in slot 111 to fix the infrared chip 3, the movable plate 8 is rotated to allow the contact end 81 to enter and abut against the sliding slot 112. When the longitudinal card seat 4 slides into the plug-in slot 111, the contact end 81 abuts against and slides in the sliding slot 112 to improve the vertical sliding stability of the longitudinal card seat 4, improve the horizontal support force of the longitudinal card seat 4, and avoid the problem that the longitudinal card seat 4 is squeezed by the flexible thermal insulation member 6 and deformed on the side facing away from the infrared chip 3, thereby further improving the fixing stability of the longitudinal card seat 4 and the flexible thermal insulation member 6 to the infrared chip 3.

[0055] As another embodiment provided by the present invention, a counterweight portion 83 is provided on the second end of the movable plate 8 so that the movable plate 8 is horizontal and parallel to the extension portion 43 in the default state, and the movable plate 8 is driven to rotate in an inclined state so that the end face of the contact end 81 contacts the inner wall of the sliding groove 112 and enters the sliding groove 112.

[0056] Specifically, such as Figure 10As shown, due to the counterweight portion 83 provided on the movable plate 8, the weight of the counterweight portion 83 will make the movable plate 8 horizontal and parallel to the extension portion 43 in the default state, and the distance the contact end 81 of the movable plate 8 extends in the default state is greater than the distance the contact end 81 extends when the movable plate 8 is in an inclined state, thereby making the movable plate 8 in the default state. The longitudinal card seat 4 is stuck by the movable plate 8 and cannot be inserted into the plug-in slot 111. It is necessary to first extend the contact end 81 of the movable plate 8 into the sliding slot 112, and then apply horizontal pressure to the longitudinal card seat 4 until the end face of the contact end 81 of the movable plate 8 contacts the inner wall of the sliding slot 112, and the longitudinal card seat 4 is exactly parallel to the plug-in slot 111. Then the longitudinal card seat 4 can be inserted into the plug-in slot 111, thereby using the movable plate 8 to complete the pre-positioning of the longitudinal card seat 4 before insertion, further improving the fixing stability of the infrared chip 3 when the longitudinal card seat 4 is inserted into the plug-in slot 111.

[0057] As another embodiment provided by the present invention, the extension portion 43 is aligned with the supporting groove 63, and an extrusion portion 82 is provided on the second end of the movable plate 8. The extension portion 43 abuts against the connecting seat 12 so that the extrusion portion 82 of the movable plate 8 abuts against the connecting seat 12, and the top of the counterweight portion 83 supports the bottom of the curved portion 71 of the getter 7.

[0058] Specifically, when the flexible heat insulation member 6 and the flexible installation roll 42 are installed as a whole, the extension portion 43 is aligned with the supporting groove 63, as shown in FIG. Figure 9 As shown, when the longitudinal card seat 4 is inserted into the insertion slot 111 to fix the infrared chip 3, the extrusion portion 82 of the movable plate 8 abuts against the connecting seat 12, the end face of the contact end 81 of the movable plate 8 abuts against the inner wall of the sliding slot 112, and the top of the counterweight portion 83 supports the bottom of the curved portion 71 of the getter 7. When the vacuum level inside the infrared detector drops significantly after prolonged use, the getter 7 expands in volume after absorbing gas, causing the bottom of the curved portion 71 to apply pressure to the inner wall of the support groove 63. The curved portion 71 of the getter 7 bends downward to apply pressure to the counterweight portion 83, and the movable plate 8 is pressed to drive the movable plate 8 to rotate and reset to the default state. The contact end 81 of the movable plate 8 abuts against the sliding groove 112, causing the second end of the movable plate 8 to apply horizontal pressure to the flexible mounting coil 42, thereby causing the flexible mounting coil 42 and the flexible thermal insulation member 6 to deform and stretch vertically to increase the distance between the getter 7 and the infrared chip 3, further avoiding the problem of the expanded getter 7 contacting and interfering with the infrared chip 3, and improving the protection of the infrared chip 3. Secondly, the flexible thermal insulation member 6 is also squeezed by the flexible mounting coil 42 and the getter 7 to further tightly wrap the gold wire 9, further improving the wrapping protection of the gold wire 9.

[0059] Working principle: First, insert the horizontal card seat 5 into the plug-in slot 111, and then install the infrared chip 3 into the installation slot 11, so that the cross-piece 51 of the horizontal card seat 5 abuts against the horizontal ends of the infrared chip 3, completing the horizontal fixation of the infrared chip 3, and then the contact end 81 of the movable plate 8 extends into the sliding slot 112, and horizontal pressure is applied to the longitudinal card seat 4 until the end face of the contact end 81 of the movable plate 8 abuts against the inner wall of the sliding slot 112, and the longitudinal card seat 4 is exactly parallel to the plug-in slot 111, and then the longitudinal card seat 4 can be inserted into the plug-in slot 111 and then the longitudinal card seat 4 is inserted into the plug-in slot 111 to complete the longitudinal fixation of the infrared chip 3, and along with the insertion of the longitudinal card seat 4, the flexible heat insulation member 6 moves synchronously to squeeze the infrared chip 3 and fix it to the bottom of the installation slot 11, completing the fixation of the infrared chip 3;

[0060] Then, the welding head first welds one end of the gold wire 9 to the connecting finger 33, and then the welding head pulls the gold wire 9 to move toward the connecting seat 12. The welding head drives the gold wire 9 along the through slit 621 and is pressed into the wrapping groove 62 for support. Then, the welding head welds the gold wire 9 to the bonding finger 121 and cuts it, completing the electrical connection between the infrared chip 3 and the connecting seat 12.

[0061] The welding portions 72 of the getter 7 are welded to the welding grooves 13 to complete the fixed installation of the getter 7. After the getter 7 is fixed, it is shielded above the reference area 32 and exposes the working area 31. The supporting groove 63 of the flexible thermal insulation member 6 is supported at the bottom of the bent portion 71 of the getter 7.

[0062] Finally, the package bottom shell 1 and the package top shell 2 are welded together using solder sheets, and the infrared window 21 of the package top shell 2 is aligned with the working area 31 of the infrared chip 3 .

[0063] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims.

Claims

1. An integrated semiconductor chip assembly mounting structure, characterized in that: The invention comprises a packaging bottom shell (1), an infrared chip (3), a longitudinal card seat (4) and a transverse card seat (5); a mounting groove (11) and plugging grooves (111) arranged in a linear array on the bottom surface of the mounting groove (11) are provided in the packaging bottom shell (1); a flexible heat insulating member (6) is provided on the longitudinal card seat (4); the longitudinal card seat (4) and the transverse card seat (5) are respectively plugged into the plugging groove (111) so that the transverse card seat (5) contacts the transverse sides of the infrared chip (3); and the longitudinal card seat (4) contacts the longitudinal sides of the infrared chip (3) so that the flexible heat insulating member (6) presses the infrared chip (3) against the bottom surface of the mounting groove (11).

2. The integrated semiconductor chip assembly mounting structure according to claim 1, wherein: The invention also includes a connecting seat (12) and a gold wire (9) symmetrically arranged on both sides of the infrared chip (3); the infrared chip (3) and the connecting seat (12) are respectively provided with connecting fingers (33) and bonding fingers (121) in a linear array; the flexible thermal insulation member (6) is provided with an arc-shaped wrapping groove (62) and a through slit (621) connected to the wrapping groove (62) in a linear array; the flexible thermal insulation member (6) is located between the connecting seat (12) and the infrared chip (3); and the gold wire (9) is bonded to the connecting finger (33) and the bonding finger (121) in a wedge shape so that the middle part of the gold wire (9) is supported by the wrapping groove (62).

3. The integrated semiconductor chip assembly mounting structure according to claim 2, wherein: A vortex-shaped flexible mounting roll (42) is provided on the first end of the longitudinal card seat (4); a vortex-shaped through groove is provided on the flexible heat insulating member (6) to form a connecting portion (61) that matches the flexible mounting roll (42); the longitudinal card seat (4) is plugged into the plug-in groove (111) so that the flexible mounting roll (42) is located between the infrared chip (3) and the connecting seat (12).

4. The integrated semiconductor chip assembly mounting structure according to claim 3, characterized in that: The invention also includes a getter (7) having welding portions (72) at both ends. A working area (31) and a reference area (32) are provided on the first side of the infrared chip (3). The welding portions (72) are respectively welded to the bottom shell (1) of the package so that the middle of the getter (7) parallelly blocks the reference area (32) and exposes the working area (31). The flexible heat insulating member (6) is supported below the middle of the getter (7).

5. The integrated semiconductor chip assembly mounting structure according to claim 4, characterized in that: The flexible thermal insulation member (6) is provided with a linear array of supporting grooves (63) spaced apart from the wrapping grooves (62); the middle portion of the getter (7) is wavy to form a curved portion (71); and the supporting grooves (63) are supported on the bottom of the curved portion (71).

6. The integrated semiconductor chip assembly mounting structure according to claim 5, characterized in that: The longitudinal card seat (4) is provided with a horizontal extension portion (43) arranged in a linear array. The longitudinal card seat (4) is inserted into the insertion slot (111) so that the extension portion (43) contacts the connecting seat (12), and the extension portion (43) and the bonding finger (121) are spaced apart.

7. The integrated semiconductor chip assembly mounting structure according to claim 6, characterized in that: A movable plate (8) is rotatably provided on the extension portion (43), and a sliding groove (112) is provided in a symmetrical linear array in the installation groove (11). The first end of the movable plate (8) is a contact end (81), and the contact end (81) extends to the outside of the extension portion (43). The longitudinal card seat (4) enters the plug-in groove (111) so that the movable plate (8) is driven to rotate until the contact end (81) contacts the inner wall of the sliding groove (112).

8. The integrated semiconductor chip assembly mounting structure according to claim 7, characterized in that: A counterweight portion (83) is provided on the second end of the movable plate (8) so that the movable plate (8) is horizontal and parallel to the extension portion (43) in a default state, and the movable plate (8) is driven to rotate in an inclined state so that the end surface of the contact end (81) contacts the inner wall of the sliding groove (112) and enters the sliding groove (112).

9. The integrated semiconductor chip assembly mounting structure according to claim 8, characterized in that: The extension portion (43) is aligned with the supporting groove (63), and an extrusion portion (82) is provided on the second end of the movable plate (8). The extension portion (43) abuts against the connecting seat (12) so that the extrusion portion (82) of the movable plate (8) abuts against the connecting seat (12), and the top of the counterweight portion (83) supports the bottom of the curved portion (71) of the getter (7).

10. The integrated semiconductor chip assembly mounting structure according to claim 1, characterized in that: A limiting portion (1111) is symmetrically arranged in the insertion slot (111), and limiting slots (91) are symmetrically provided on the longitudinal card seat (4) and the transverse card seat (5), respectively. The longitudinal card seat (4) and the transverse card seat (5) are inserted into the insertion slot (111) so that the limiting portion (1111) abuts against the limiting slot (91).

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