Modularized thermal photoelectric conversion device

Abstract

The invention discloses a modularized thermal photoelectric conversion device, which solves the problem that a radioactive source is unstable in property and difficult to obtain by replacing the radioactive source with an electric heating simulation heat source. An emitter assembly, a filter assembly and an infrared photovoltaic device are outwards arranged on the periphery of an electric heating simulation heat source layer by layer, and heat generated by the electric heating simulation heat source is fully utilized; the emitting electrode assembly, the filter assembly and the infrared photovoltaic device are arranged in a modularized mode, and are matched with the detachable connection mode of the supporting assembly, so that processing, dismounting and mounting are more convenient. According to the main technical scheme, a vacuum cavity is formed in an outer shell, and a thermal photoelectric conversion module is fixed in the vacuum cavity through a supporting assembly; an emitter assembly of the thermophotovoltaic conversion module is located on the periphery of the electric heating simulation heat source, a filter assembly is located on the periphery of the emitter assembly, and an infrared photovoltaic device is located on the periphery of the filter assembly. The invention is mainly used for thermal photoelectric conversion.

Description

Technical Field

[0001] The present invention relates to the field of nuclear science and technology, and in particular, to a modular thermophotovoltaic conversion device. Background Art

[0002] As one of the alternative solutions for future thermoelectric nuclear batteries, the Radioisotope Thermophotovoltaic (RTPV) system not only has the characteristics of high energy density, long life, strong anti-interference, etc., but also has technical advantages such as high energy conversion rate, wide power range, no moving parts, small volume and light weight. It is one of the best power supply systems required for deep space exploration and ocean exploration fields. Its working principle is to convert the decay energy of radioactive isotopes into heat energy, heat the emitter to generate high temperature, and emit infrared radiation. The infrared radiation is then converted into electrical energy through some semiconductor infrared photovoltaic conversion devices with specific bandgaps.

[0003] Due to the unstable nature of radioactive substances and the difficulty in obtaining them, it is difficult to conduct research and testing on electrical energy conversion using radioactive substances in the prior art. In addition, the existing electrical energy conversion devices usually have insufficient utilization of the released energy of the heat source, and it is usually difficult to process the emitter, conversion devices, etc., and the installation is not flexible. Summary of the Invention

[0004] In view of this, in order to solve at least one of the above technical problems, the present invention provides a modular thermophotovoltaic conversion device.

[0005] To achieve the above object, the present invention mainly provides the following technical solutions:

[0006] The present invention provides a modular thermophotovoltaic conversion device, including:

[0007] An outer housing (100), a thermophotovoltaic conversion module, and a support assembly (500). A vacuum chamber (101) is provided on the outer housing (100), and the thermophotovoltaic conversion module is fixed in the vacuum chamber (101) through the support assembly (500);

[0008] The thermophotovoltaic conversion module at least includes an electrically heated analog heat source (200), an emitter assembly (300), a filter assembly (400), and an infrared photovoltaic device;

[0009] The emitter assembly (300) is located on the outer periphery of the electrically heated analog heat source (200), the filter assembly (400) is located on the outer periphery of the emitter assembly (300), and the infrared photovoltaic device is located on the outer periphery of the filter assembly (400).

[0010] Among them, the electric heating simulation heat source (200) includes a plurality of simulation sub-heat sources, which are stacked in the vertical direction. The electric heating simulation heat source (200) is at least used to simulate the heat flow and temperature field distribution of a radioactive isotope heat source to generate heat energy.

[0011] Among them, the emitter assembly (300) includes a plurality of emitters (310), an emitter upper cover plate (320), an emitter lower cover plate (330), a plurality of emitter bars (340) and an emitter bracket (350);

[0012] The emitter upper cover plate (320) and the emitter lower cover plate (330) are respectively located on the top side and the bottom side of the electric heating simulation heat source (200), and are directly or indirectly connected to the support assembly (500). The emitter bracket (350) is located on the peripheral side of the electric heating simulation heat source (200), and the top end and the bottom end of the emitter bracket (350) are respectively connected to the emitter upper cover plate (320) and the emitter lower cover plate (330). The emitters (310) and the emitter bars (340) are detachably arranged between the emitter bracket (350), the emitter upper cover plate (320) and the emitter lower cover plate (330), so that the emitters (310) are located on the peripheral side of the electric heating simulation heat source (200);

[0013] The emitter (310) is used to convert the heat energy of the electric heating simulation heat source (200) into infrared light.

[0014] Among them, at least one emitter (310) is respectively arranged on the four sides of the electric heating simulation heat source (200).

[0015] Among them, the thermophotovoltaic conversion module further includes: an upper heat insulation module (610), which is fixed in the vacuum chamber (101) through the support assembly (500), and is arranged between the emitter upper cover plate (320) and the support assembly (500) above;

[0016] A lower heat insulation module (620), which is fixed in the vacuum chamber (101) through the support assembly (500), and is arranged between the emitter lower cover plate (330) and the support assembly (500) below;

[0017] A lead hole is formed in the lower heat insulation module (600), and the lead hole is used for threading cables.

[0018] Among them, the filter assembly (400) includes a plurality of filters (410), a filter upper frame (420), a filter lower frame (430), a plurality of filter bars (440) and a plurality of filter columns (450);

[0019] The upper filter frame (420) and the lower filter frame (430) are arranged at intervals in the vertical direction and are directly or indirectly connected to the support assembly (500). The upper filter frame (420) surrounds the outer side of the top end of the emitter assembly (300), and the lower filter frame (430) surrounds the outer side of the bottom end of the emitter assembly (300).

[0020] The filter columns (450) are detachably connected between the upper filter frame (420) and the lower filter frame (430). The filter bars (440) and the filter (410) are detachably arranged between the filter columns (450), the upper filter frame (420) and the lower filter frame (430), so that the filter (410) is located on the peripheral side of the emitter assembly (300).

[0021] The filter (410) is used to filter and reflect the infrared light emitted by the emitter assembly (300) and transmit the infrared light in a preset wavelength band.

[0022] Wherein, the device further includes:

[0023] A radiator (700), which is fixed in the vacuum chamber (101) through the support assembly (500) and is located on the outer periphery of the filter assembly (400). The infrared photovoltaic devices are arranged in an array on the radiator (700);

[0024] The radiator (700) is used to cool the infrared photovoltaic devices.

[0025] Wherein, the radiator (700) includes a main body;

[0026] The radiator (700) further includes a plurality of heat dissipation fins connected to the main body;

[0027] And / or, the radiator (700) further includes a coolant flow channel, a coolant inlet pipe interface (701), and a coolant outlet pipe interface (702). The coolant flow channel is opened on the main body, and the coolant flow channel is communicated with the coolant inlet pipe interface (701) and the coolant outlet pipe interface (702).

[0028] Wherein, the support assembly (500) includes a plurality of first-layer columns (510), a first-layer upper cover plate (520), a first-layer lower cover plate (530), a plurality of second-layer columns (540), a second-layer upper cover plate (550), and a second-layer lower cover plate (560);

[0029] The first-layer upper cover plate (520) and the first-layer lower cover plate (530) are arranged at intervals, and the thermophotovoltaic conversion module is clamped between the first-layer upper cover plate (520) and the first-layer lower cover plate (530). The first-layer columns (510) are connected to the first-layer upper cover plate (520) and the first-layer lower cover plate (530) to fix the relative positions of the first-layer upper cover plate (520) and the first-layer lower cover plate (530);

[0030] The upper cover plate (550) of the second layer and the lower cover plate (560) of the second layer are arranged at intervals. The upper cover plate (550) of the second layer is connected to the lower cover plate (530) of the first layer, the lower cover plate (560) of the second layer is connected to the housing (100), and the upright column (540) of the second layer is connected to the upper cover plate (550) and the lower cover plate (560) of the second layer to fix the relative positions of the upper cover plate (550) and the lower cover plate (560) of the second layer;

[0031] The modular thermophotovoltaic conversion device further includes a control member (800), and the control member (800) is arranged on one side of the lower cover plate (560) of the second layer opposite to the upper cover plate (550) of the second layer.

[0032] Among them, the support assembly (500) further includes a lead box (570) and a corundum tube (580). The lead box (570) is connected to one side of the upper cover plate (550) of the second layer opposite to the lower cover plate (560) of the second layer. The corundum tube (580) is connected to the thermophotovoltaic conversion module and passes through the upper cover plate (550) and the lower cover plate (530) of the first layer. After the cable of the thermophotovoltaic conversion module passes through the corundum tube (580), it is connected to the wiring member (571) in the lead box (570).

[0033] A modular thermophotovoltaic conversion device proposed by the present invention uses an electrically heated simulated heat source to replace the radiation source, simulating a real heat source both structurally and thermophysically, and solves the problems of unstable properties and difficulty in obtaining of the radiation source in the prior art when researching and testing thermophotovoltaic conversion devices. The emitter assembly, the filter assembly, and the infrared photovoltaic device are successively arranged outward around the electrically heated simulated heat source, making full use of the heat generated by the electrically heated simulated heat source. At the same time, the emitter assembly, the filter assembly, and the infrared photovoltaic device are all arranged in a modular manner, and in cooperation with the detachable connection method of the support assembly, processing and disassembly are more convenient. Description of the Drawings

[0034] Figure 1 It is a schematic cross-sectional structure diagram of a modular thermophotovoltaic conversion device provided by an embodiment of the present invention from a first perspective;

[0035] Figure 2 It is a schematic structure diagram of a part of a modular thermophotovoltaic conversion device provided by an embodiment of the present invention from a second perspective;

[0036] Figure 3 It is a schematic structure diagram of a part of a modular thermophotovoltaic conversion device provided by an embodiment of the present invention from a third perspective;

[0037] Figure 4 is Figure 1 A partial enlarged structure diagram of the modular thermophotovoltaic conversion device shown in;

[0038] Figure 5 A partial enlarged schematic view of a part of the emitter assembly in a thermophotovoltaic conversion device provided by an embodiment of the present invention;

[0039] Figure 6 A partial enlarged schematic view of a part of the emitter assembly and the filter assembly in a thermophotovoltaic conversion device provided by an embodiment of the present invention;

[0040] Figure 7 A schematic view of the lead box, the wiring member, and the corundum tube in a thermophotovoltaic conversion device provided by an embodiment of the present invention. Detailed implementation manners

[0041] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following, in conjunction with the drawings and preferred embodiments, details the specific implementation manners, structures, features, and effects of the modular thermophotovoltaic conversion device proposed according to the present invention as follows.

[0042] As Figures 1-4 shown, an embodiment of the present invention provides a modular thermophotovoltaic conversion device, including:

[0043] A housing (100), a thermophotovoltaic conversion module, and a support assembly (500). A vacuum chamber (101) is provided on the housing (100), and the thermophotovoltaic conversion module is fixed in the vacuum chamber (101) through the support assembly (500);

[0044] The thermophotovoltaic conversion module at least includes an electrically heated analog heat source (200), an emitter assembly (300), a filter assembly (400), and an infrared photovoltaic device;

[0045] The emitter assembly (300) is located on the outer periphery of the electrically heated analog heat source (200), the filter assembly (400) is located on the outer periphery of the emitter assembly (300), and the infrared photovoltaic device is located on the outer periphery of the filter assembly (400).

[0046] The electrically heated analog heat source (200) may further include a plurality of analog sub-heat sources, and the plurality of analog sub-heat sources are stacked in the vertical direction, and the shape of a single analog sub-heat source is approximately a cuboid. As Figure 1 、 3As shown, the electrically heated simulated heat source (200) includes four groups of simulated sub-heat sources stacked vertically. In the following embodiments, taking four groups of vertically stacked simulated sub-heat sources as an example, it can be understood that the number and stacking method of the simulated sub-heat sources in the electrically heated simulated heat source (200) can be changed according to needs. The design parameters of other components, such as the emitter assembly (300), the filter assembly (400), and the size and number of the infrared photovoltaic device, can be adjusted according to the actual structure of the electrically heated simulated heat source (200), which is applicable to the design of thermophotovoltaic conversion systems for different mission requirements.

[0047] The electrically heated simulated heat source (200) is used to simulate a radiation source. The electrically heated simulated heat source (200) is at least used to simulate the heat flow and temperature field distribution of a radioactive isotope heat source to generate heat energy, that is, it is necessary to ensure that the structure of the electrically heated simulated heat source (200) is basically the same as that of a real radioactive heat source. More specifically, the simulated sub-heat source mainly includes a heat source outer shell, a heat source inner shell, a heat source core body, and a heating wire. The heat source outer shell, the heat source inner shell, and the heat source core body are connected in a sleeved manner. The heating wire is screwed into the internal thread of the heat source core body to simulate the heat generation of the radiation source. The heating wire generates heat evenly, and the surface temperature field and heat flow path of the heat source core body are basically the same as those of a real isotope heat source. The heating wire can use an electrically heated molybdenum wire or a tungsten wire coil to simulate a radioactive isotope heat source. The rated power of the simulated sub-heat source can be 250W - 696W, and the power of the simulated sub-heat source is adjustable between 0W - 696W. The heat source core body and the inner cladding material are boron nitride, and the outer cladding and the cladding material of the heat source core body are isotropic graphite. Any group of simulated sub-heat sources includes two heating wires arranged horizontally side by side, and the operating temperature of the simulated sub-heat source is between 1000°C and 1100°C. The simulated sub-heat source is used to test and verify the performance and parameters of each component in the device, such as the emitter assembly (300), the filter assembly (400), and the infrared photovoltaic device, and to test the output electrical performance of the device, so that the research progress is not restricted by the radioactive heat source material, which not only speeds up the research progress but also reduces the research cost.

[0048] The outer contour of the electrically heated simulated heat source (200) is approximately a cuboid structure. Subsequently, the overall thermophotovoltaic conversion module has a hexahedron configuration, including the planes in four directions on the periphery and the top and bottom sides. Subsequently, the functional components in the emitter assembly (300), the filter assembly (400), and the infrared photovoltaic device, such as the emitter (310) of the emitter assembly (300) and the filter (410) of the filter assembly (400), can be set as flat plate structures, and the manufacturing process is mature. The components in the thermophotovoltaic conversion module are designed based on the modular concept and can cooperate with the support assembly (500) to achieve rapid loading and unloading, which improves the speed of iterative optimization.

[0049] The vacuum chamber (101) opened on the outer shell (100) is used to provide a vacuum environment for the normal operation of the thermophotovoltaic conversion module, and the vacuum degree ≤ 10-2 Pa. A number of interfaces are provided on the vacuum chamber (101) for testing lead wires, coolant pipes, vacuum pump interfaces, etc.; the upper part of the vacuum chamber (101) is open and is configured with a lid and a sealing strip. The lid and the outer housing (100) are fastened and sealed by bolts, thereby sealing the vacuum chamber (101).

[0050] The electric heating simulation heat source (200), the emitter assembly (300), the filter assembly (400), and the infrared photovoltaic device are directly or indirectly fixed by the support assembly (500), such as by extrusion clamping fixation. Subsequently, the disassembly of the support assembly (500) can be achieved, facilitating the disassembly and assembly of the electric heating simulation heat source (200), the emitter assembly (300), the filter assembly (400), and the infrared photovoltaic device. The specific installation method will be described in more detail in the following embodiments.

[0051] A modular thermophotovoltaic conversion device proposed in an embodiment of the present invention replaces the radioactive source with an electric heating simulation heat source, simulating a real heat source structurally and thermophysically, and solving the problems of unstable properties and difficulty in obtaining radioactive sources in the prior art. The emitter assembly, the filter assembly, and the infrared photovoltaic device are arranged layer by layer outwardly around the electric heating simulation heat source, making full use of the heat generated by the electric heating simulation heat source. At the same time, the emitter assembly, the filter assembly, and the infrared photovoltaic device are all arranged in a modular manner, and in cooperation with the detachable connection method of the support assembly, processing, disassembly, and assembly are more convenient.

[0052] In one embodiment, as Figures 4-5 shown, the emitter assembly (300) includes a plurality of emitters (310), an emitter upper cover plate (320), an emitter lower cover plate (330), a plurality of emitter bars (340), and an emitter support (350). The emitter upper cover plate (320) and the emitter lower cover plate (330) are respectively located on the top side and the bottom side of the electric heating simulation heat source (200) and are directly or indirectly connected to the support assembly (500). The emitter support (350) is located on the peripheral side of the electric heating simulation heat source (200), and the top end and the bottom end of the emitter support (350) are respectively connected to the emitter upper cover plate (320) and the emitter lower cover plate (330). The emitters (310) and the emitter bars (340) are detachably arranged between the emitter support (350), the emitter upper cover plate (320), and the emitter lower cover plate (330) so that the emitters (310) are located on the peripheral side of the electric heating simulation heat source (200). The emitters (310) are used to convert the thermal energy of the electric heating simulation heat source (200) into infrared light.

[0053] Specifically, there can be 8 emitters (310). The electric heating simulation heat source (200) has the aforementioned approximate cuboid structure. The four sides of the electric heating simulation heat source (200) respectively correspond to two emitters (310). The two emitters (310) located on the same side of the electric heating simulation heat source (200) are arranged side by side in the vertical direction. The emitter upper cover plate (320) and the emitter lower cover plate (330) are both plate-like structures, and their coverage ranges on the horizontal plane exceed the top surface and the bottom surface of the electric heating simulation heat source (200). Embedding grooves are oppositely formed near the edges of the emitter upper cover plate (320) and the emitter lower cover plate (330). As Figure 5 shown in, the emitter support (350) is a support structure surrounding the four sides of the outer periphery of the electric heating simulation heat source (200). Embedding strips (352) are respectively arranged at the top edge and the bottom edge of the emitter support (350). The emitter support (350) is embedded and connected between the emitter upper cover plate (320) and the emitter lower cover plate (330) through the embedding strips (352). Emitter support plug-in slots (351) are arranged in the areas of the emitter support (350) corresponding to the four vertical edges on the circumferential direction of the electric heating simulation heat source (200). Two opposite emitter support plug-in slots (351) are arranged on each side of the emitter support (350). Then, the opposite sides of the emitter (310) and the emitter bar (340) can be respectively embedded into the opposite emitter support plug-in slots (351), and vertical limit is achieved through the emitter upper cover plate (320) and the emitter lower cover plate (330). The emitter bar (340) can be only arranged on the upper and lower sides and is connected to the emitter upper cover plate (320) and the emitter lower cover plate (330). Or, it can be arranged between the two emitters (310) on the same side. After the emitter upper cover plate (320) and the emitter lower cover plate (330) are installed, the emitter upper cover plate (320), the emitter lower cover plate (330) and the emitter support (350) cooperate to limit the electric heating simulation heat source (200), thereby avoiding the damage to the structure of the electric heating simulation heat source (200) caused by fixation, and enabling the heat energy of the electric heating simulation heat source (200) to be more fully utilized. The emitter (310) has a plate-like structure adapted to the side wall of the electric heating simulation heat source (200), which is convenient to process and is closer to the position of the electric heating simulation heat source (200).

[0054] In one embodiment, the thermophotovoltaic conversion module further includes an upper thermal insulation module (610). The upper thermal insulation module (610) is fixed in the vacuum chamber (101) through a support assembly (500), and the upper thermal insulation module (610) is disposed between the upper cover plate (320) of the emitter and the support assembly (500). It is used for adiabatically insulating the upper end face of the electrically heated simulation heat source (200), so that most of the heat flow of the electrically heated simulation heat source (200) flows out from the four sides with the emitter (310), is converted into infrared light, and then improves the thermal energy utilization rate of the electrically heated simulation heat source (200). The lower surface of the upper thermal insulation module (610) may be provided with an upper thermal insulation module groove, and the top part of the upper cover plate (320) of the emitter is embedded in the upper thermal insulation module groove, so that the connection stability between the upper thermal insulation module (610) and the upper cover plate (320) of the emitter is better.

[0055] The thermophotovoltaic conversion module further includes a lower thermal insulation module (620). The lower thermal insulation module (620) is fixed in the vacuum chamber (101) through a support assembly (500), and the lower thermal insulation module (620) is disposed between the lower cover plate (330) of the emitter and the support assembly (500). It is used for adiabatically insulating the lower end face of the electrically heated simulation heat source (200), so that most of the heat flow of the electrically heated simulation heat source (200) flows out from the four sides with the emitter (310), is converted into infrared light, and then improves the thermal energy utilization rate of the electrically heated simulation heat source (200). The lower surface of the lower thermal insulation module (620) may be provided with a lower thermal insulation module groove, and the bottom part of the lower cover plate (330) of the emitter is embedded in the lower thermal insulation module groove, so that the connection stability between the lower thermal insulation module (620) and the lower cover plate (330) of the emitter is better.

[0056] The lower thermal insulation module (600) is provided with a lead hole, and the lead hole is used for threading cables, such as the cables between the heating wire of the electrically heated simulation heat source (200) and the power supply and the thermocouple lead-out cable.

[0057] In one embodiment, such as Figure 4 、 Figure 6As described above, the filter assembly (400) includes a plurality of filters (410), an upper filter frame (420), a lower filter frame (430), a plurality of filter bars (440) and a plurality of filter columns (450). The upper filter frame (420) and the lower filter frame (430) are arranged at intervals in the vertical direction and are directly or indirectly connected to the support assembly (500). The upper filter frame (420) surrounds the outer side of the top end of the emitter assembly (300), and the lower filter frame (430) surrounds the outer side of the bottom end of the emitter assembly (300). The filter columns (450) are detachably connected between the upper filter frame (420) and the lower filter frame (430). The filter bars (440) and the filters (410) are detachably arranged between the filter columns (450), the upper filter frame (420) and the lower filter frame (430), so that the filters (410) are located on the peripheral side of the emitter assembly (300). The filters (410) are used to filter and reflect the infrared light emitted by the emitter assembly (300) and transmit the infrared light in a preset band.

[0058] The infrared light in the preset band refers to the infrared light wave in the available band of the infrared photovoltaic device. Specifically, there can be 8 filters (410). The electric heating simulation heat source (200) has the aforementioned approximate cuboid structure. Two filters (410) correspond to each of the four sides of the electric heating simulation heat source (200). The two filters (410) located on the same side of the electric heating simulation heat source (200) are arranged side by side in the vertical direction. Both the upper filter frame (420) and the lower filter frame (430) are rectangular frame structures. The upper filter frame (420) surrounds the outer periphery of the emitter upper cover plate (320), and the lower filter frame (430) surrounds the outer periphery of the emitter lower cover plate (330). There are four filter columns (450), which are corner structures and are respectively arranged corresponding to the four vertical side edges in the circumferential direction of the electric heating simulation heat source (200). As Figure 6 shown, a first filter slot (451) is formed on the filter column (450). The upper filter frame (420) and the lower filter frame (430) are respectively provided with a second filter slot (421). The filter bars (440) and the filters (410) are inserted into the first filter slot (451), and the filter column (450) is inserted into the second filter slot (421). Then, the filter bars (440) and the filters (410) are limited in the vertical direction by the upper filter frame (420) and the lower filter frame (430), and then the filters (410) are fixed to the outer side of the emitter (310). The filter bars (440) can be arranged only on the upper and lower sides and are connected to the upper filter frame (420) and the lower filter frame (430). Or, they can be arranged between the two filters (410) on the same side. The filters (410) are in a plate-like structure adapted to the emitter (310), which is convenient for processing.

[0059] In addition, the aforementioned upper heat insulation module (610) also covers above the upper frame (420) of the filter at the same time, and the lower heat insulation module (620) covers below the lower frame (430) of the filter at the same time. Then, the upper heat insulation module (610) and the lower heat insulation module (620) clamp the top and bottom ends of the emitter assembly (300) and the filter assembly (400) at the same time. The positions of the upper heat insulation module (610) and the lower heat insulation module (620) are fixed by the support assembly (500). The emitter assembly (300) and the filter assembly (400) are indirectly connected to the support assembly (500) through the upper heat insulation module (610) and the lower heat insulation module (620). Then, the installation and limitation of the emitter assembly (300) and the filter assembly (400) are realized, modular installation is achieved, and there is no need for fixed connection such as bolts, which is convenient for disassembly and assembly, has better structural stability, and is easier to process.

[0060] In one implementation, as Figures 1-2 shown, the device further includes: a radiator (700). The radiator (700) is fixed in the vacuum chamber (101) through the support assembly (500) and is located on the outer periphery of the filter assembly (400). The infrared photovoltaic devices are arranged in an array on the radiator (700). The radiator (700) is used to cool the infrared photovoltaic devices.

[0061] The function of the radiator (700) is to cool the infrared photovoltaic devices so that they work within a normal and stable range. There are a total of four groups of radiators (700), which are arranged on the four sides of the periphery of the thermophotovoltaic conversion module. The radiator (700) is of an approximate flat plate structure and can be fixed to the support assembly (500) through upper pins and lower pins. Further description will be given below in combination with the structure of the support assembly (500).

[0062] The function of the infrared photovoltaic device array is to convert the infrared light emitted by the emitter (310) into electric energy and output it to the user. There are a total of four groups of infrared photovoltaic device arrays, each group is arranged in 20 rows × 9 columns. Each group is combined into a device array by infrared photovoltaic devices through the method of low-temperature soldering. The device array is bonded to the surface of the radiator (700) by thermal conductive silicone grease.

[0063] The radiator (700) can achieve heat dissipation in various ways. For example, in one implementation, the radiator (700) includes a main body, and the radiator (700) further includes a plurality of heat dissipation fins connected to the main body. By increasing the contact area between the radiator (700) and the outside through the heat dissipation fins, the heat dissipation is accelerated.

[0064] Alternatively, the heat sink (700) may include coolant flow channels, a coolant inlet pipe interface (701), and a coolant outlet pipe interface (702). The coolant flow channels are formed on the main body and communicate with the coolant inlet pipe interface (701) and the coolant outlet pipe interface (702). The coolant inlet pipe interface (701) and the coolant outlet pipe interface (702) are used to connect to the coolant pipe (710) as shown in Figure 2 to achieve temperature reduction by introducing a cooling medium into the coolant flow channels.

[0065] In one embodiment, as shown in Figures 1-3 , the support assembly (500) includes a plurality of first-layer columns (510), a first-layer upper cover plate (520), a first-layer lower cover plate (530), a plurality of second-layer columns (540), a second-layer upper cover plate (550), and a second-layer lower cover plate (560). The first-layer upper cover plate (520) and the first-layer lower cover plate (530) are spaced apart, and the thermophotovoltaic conversion module is clamped between the first-layer upper cover plate (520) and the first-layer lower cover plate (530). The first-layer columns (510) are connected to the first-layer upper cover plate (520) and the first-layer lower cover plate (530) to fix the relative positions of the first-layer upper cover plate (520) and the first-layer lower cover plate (530). The second-layer upper cover plate (550) and the second-layer lower cover plate (560) are spaced apart. The second-layer upper cover plate (550) is connected to the first-layer lower cover plate (530), the second-layer lower cover plate (560) is connected to the housing (100), and the second-layer columns (540) are connected to the second-layer upper cover plate (550) and the second-layer lower cover plate (560) to fix the relative positions of the second-layer upper cover plate (550) and the second-layer lower cover plate (560). The modular thermophotovoltaic conversion device further includes a control member (800) disposed on one side of the second-layer lower cover plate (560) opposite to the second-layer upper cover plate (550).

[0066] The support assembly (500) may further include an upper heat insulation bracket (591) and a lower heat insulation bracket (592). An upper cover plate (520) abuts against the top end of the upper heat insulation module (610) through the upper heat insulation bracket (591), and a lower cover plate (530) abuts against the bottom end of the lower heat insulation module (620) through the lower heat insulation bracket (592). Then, the upper heat insulation module (610) and the lower heat insulation module (620) are fixed by a layer of upright columns (510), thereby playing the role of clamping and fixing the emitter assembly (300) and the filter assembly (400) as described above. The connection between the layer of upright columns (510) and the upper heat insulation module (610) and the lower heat insulation module (620) can be achieved by passing through and fixing with nuts. Slots are respectively provided on the upper cover plate (520) and the lower cover plate (530) of a layer, and slots are also provided on the main body of the radiator (700) as described above. By inserting upper pins into the slots of the upper cover plate (520) of a layer and the slots of the main body of the radiator (700) at the same time, and inserting lower pins into the slots of the lower cover plate (530) of a layer and the slots of the main body of the radiator (700) at the same time, and cooperating with the vertical limit of the upper cover plate (520) and the lower cover plate (530) of a layer, the radiator (700) is fixed.

[0067] The second-layer upright columns (540), the second-layer upper cover plate (550) and the second-layer lower cover plate (560) form a space for placing the control component (800) and the wiring component (571), playing the role of protecting the wiring and control equipment and blocking high temperature.

[0068] In one implementation, the support assembly (500) further includes a lead box (570) and a corundum tube (580). The lead box (570) is connected to the side of the second-layer upper cover plate (550) opposite to the second-layer lower cover plate (560). The corundum tube (580) is connected to the thermophotovoltaic conversion module and passes through the second-layer upper cover plate (550) and the lower cover plate (530) of a layer. After the cables of the thermophotovoltaic conversion module pass through the corundum tube (580), they are connected to the wiring component (571) in the lead box (570).

[0069] The aforementioned lower heat insulation module (600) is provided with lead holes, and there may be four lead holes, as Figure 7 shown, and there are also four corundum tubes (580). The four corundum tubes (580) are inserted into the lead holes. A wiring groove is provided on the side of the emitter bracket (350) opposite to the electrothermal simulation heat source (200). The cables between the heating wire of the electrothermal simulation heat source (200) and the power supply, the thermocouple at the center of the electrothermal simulation heat source (200), and the lead-out cables of the thermocouples for temperature measurement provided on the emitter bracket (350) are routed through the wiring groove, and then pass through the four corundum tubes (580) and are led out to the wiring component (571) in the lead box (570) to be further connected to instruments, control components (800), etc.

[0070] As described above, it is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims described above.

Claims

1. A modular thermophotoelectric conversion device, characterized in that: include: An outer shell (100), a thermophotoelectric conversion module and a support assembly (500), wherein a vacuum chamber (101) is provided on the outer shell (100), and the thermophotoelectric conversion module is fixed in the vacuum chamber (101) via the support assembly (500); The thermophotoelectric conversion module comprises at least an electric heating simulated heat source (200), an emitter component (300), a filter component (400) and an infrared photovoltaic device; The emitter component (300) is located at the periphery of the electric heating simulated heat source (200), the filter component (400) is located at the periphery of the emitter component (300), and the infrared photovoltaic device is located at the periphery of the filter component (400).

2. The modular thermophotoelectric conversion device according to claim 1, characterized in that: The electrically heated simulated heat source (200) comprises a plurality of simulated sub-heat sources, which are stacked in a vertical direction. The electrically heated simulated heat source (200) is at least used to simulate the heat flow and temperature field distribution of a radioactive isotope heat source to generate thermal energy.

3. The modular thermophotoelectric conversion device according to claim 1, characterized in that: The emitter assembly (300) comprises a plurality of emitters (310), an emitter upper cover plate (320), an emitter lower cover plate (330), a plurality of emitter block bars (340) and an emitter support (350); The emitter upper cover plate (320) and the emitter lower cover plate (330) are respectively located on the top side and the bottom side of the electrically heated simulated heat source (200), and are directly or indirectly connected to the support assembly (500); the emitter bracket (350) is located on the peripheral side of the electrically heated simulated heat source (200), and the top and bottom ends of the emitter bracket (350) are respectively connected to the emitter upper cover plate (320) and the emitter lower cover plate (330); the emitter (310) and the emitter block bar (340) are detachably arranged between the emitter bracket (350), the emitter upper cover plate (320) and the emitter lower cover plate (330), so that the emitter (310) is located on the peripheral side of the electrically heated simulated heat source (200); The emitter (310) is used to convert the thermal energy of the electric heating simulated heat source (200) into infrared light.

4. The modular thermophotoelectric conversion device according to claim 3, characterized in that: At least one emitter (310) is respectively arranged on four circumferential sides of the electric heating simulated heat source (200).

5. The modular thermophotoelectric conversion device according to claim 3, characterized in that: The thermal photoelectric conversion module further comprises an upper thermal insulation module (610), wherein the upper thermal insulation module (610) is fixed in the vacuum chamber (101) via the support assembly (500), and the upper thermal insulation module (610) is arranged above the emitter upper cover plate (320) and between the support assembly (500); A lower heat insulation module (620), wherein the lower heat insulation module (620) is fixed in the vacuum chamber (101) through the support assembly (500), and the lower heat insulation module (620) is arranged below the emitter lower cover plate (330) and between the support assembly (500); The lower heat insulation module (600) is provided with a wire lead hole, and the wire lead hole is used for passing cables.

6. The modular thermophotoelectric conversion device according to claim 1, characterized in that: The filter assembly (400) comprises a plurality of filters (410), a filter upper frame (420), a filter lower frame (430), a plurality of filter stop bars (440) and a plurality of filter columns (450); The filter upper frame (420) and the filter lower frame (430) are arranged at intervals in the vertical direction and are directly or indirectly connected to the support assembly (500); the filter upper frame (420) surrounds the outer side of the top end of the emitter assembly (300), and the filter lower frame (430) surrounds the outer side of the bottom end of the emitter assembly (300); The filter column (450) is detachably connected between the filter upper frame (420) and the filter lower frame (430), and the filter stop bar (440) and the filter (410) are detachably arranged between the filter column (450), the filter upper frame (420) and the filter lower frame (430), so that the filter (410) is located on the peripheral side of the emitter assembly (300); The filter (410) is used to filter and reflect the infrared light emitted by the emitter component (300) and transmit infrared light in a preset wavelength band.

7. The modular thermophotoelectric conversion device according to claim 5, characterized in that: The device also includes: A heat sink (700), the heat sink (700) being fixed in the vacuum chamber (101) through the support assembly (500) and being located at the periphery of the filter assembly (400), and the infrared photovoltaic devices being arranged in an array on the heat sink (700); The heat sink (700) is used to cool the infrared photovoltaic device.

8. The modular thermophotoelectric conversion device according to claim 7, characterized in that: The heat sink (700) comprises a main body; The heat sink (700) further comprises a plurality of heat dissipation fins connected to the main body; And / or, the radiator (700) further includes a coolant flow channel, a coolant inlet pipe interface (701), and a coolant outlet pipe interface (702), wherein the coolant flow channel is opened on the main body, and the coolant flow channel is connected to the coolant inlet pipe interface (701) and the coolant outlet pipe interface (702).

9. The modular thermophotoelectric conversion device according to claim 1, characterized in that: The support assembly (500) comprises a plurality of first-layer columns (510), a first-layer upper cover plate (520), a first-layer lower cover plate (530), a plurality of second-layer columns (540), a second-layer upper cover plate (550) and a second-layer lower cover plate (560); The layer of upper cover plate (520) and the layer of lower cover plate (530) are arranged at intervals, the thermal photoelectric conversion module is sandwiched between the layer of upper cover plate (520) and the layer of lower cover plate (530), and the layer of columns (510) are connected to the layer of upper cover plate (520) and the layer of lower cover plate (530) to fix the relative positions of the layer of upper cover plate (520) and the layer of lower cover plate (530); The second-layer upper cover plate (550) and the second-layer lower cover plate (560) are arranged at intervals, the second-layer upper cover plate (550) is connected to the first-layer lower cover plate (530), the second-layer lower cover plate (560) is connected to the shell (100), and the second-layer column (540) is connected to the second-layer upper cover plate (550) and the second-layer lower cover plate (560) to fix the relative positions of the second-layer upper cover plate (550) and the second-layer lower cover plate (560); The modularized thermophotoelectric conversion device further comprises a control component (800), and the control component (800) is arranged on a side of the second-layer lower cover plate (560) opposite to the second-layer upper cover plate (550).

10. The modular thermophotoelectric conversion device according to claim 9, characterized in that: The support assembly (500) further comprises a lead box (570) and a corundum tube (580); the lead box (570) is connected to a side of the second-layer upper cover plate (550) opposite to the second-layer lower cover plate (560); the corundum tube (580) is connected to the thermophotoelectric conversion module and is connected through the second-layer upper cover plate (550) and the first-layer lower cover plate (530); and the cable of the thermophotoelectric conversion module is connected to the wiring member (571) in the lead box (570) after being connected through the corundum tube (580).

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