Cooling device for solder wire production and using method

Abstract

The invention discloses a cooling device for solder wire production and a use method, and particularly relates to the technical field of solder wire production, the cooling device comprises a mounting bracket, a material placing frame is fixedly mounted on the mounting bracket, and a plurality of production mechanisms are uniformly distributed at the top end of the material placing frame; the production mechanism comprises a wire drawing die, a wire drawing penetrating groove is formed in the middle of the wire drawing die, a first buffer pipe is fixedly installed at one end of the wire drawing die, a drawing agent cylinder is fixedly installed at the end, away from the wire drawing die, of the first buffer pipe, and a second buffer pipe is fixedly installed at the end, away from the first buffer pipe, of the wire drawing die. By arranging the production mechanism, the surface of a soldering tin bar to be subjected to wire drawing operation is evenly sprayed with wire drawing liquid for lubrication, the wire drawing liquid used for lubrication is left on one side of the wire drawing die and guided into the drawing agent barrel through the first buffer pipe, the used wire drawing liquid is prevented from flowing out, and the wire drawing liquid used subsequently can be independently recycled conveniently.

Description

Technical Field

[0001] The present invention relates to the technical field of solder wire production, and specifically relates to a cooling device and a using method for solder wire production. Background Art

[0002] Solder wire is a material used for soldering electronic components and circuit boards. It is usually an alloy wire synthesized by tin and other metals (such as lead, silver, copper, etc.) in a specific proportion. It will melt when heated and solidify after cooling, thus forming a firm electrical connection.

[0003] When the solder wire is drawn and produced, the solder bar needs to be drawn and formed through a drawing die. When the solder bar is drawn through the drawing die, a cooling device is required to cool the drawn solder wire. Traditional cooling devices are mostly arranged above the drawing die, and the coolant is guided out to cool it. The coolant guided out by this kind of cooling device mostly flows on the surface of the solder wire, and the cooling effect is average. A large amount of coolant needs to be guided out. Moreover, when the solder bar is drawn and formed, drawing fluid needs to be guided. Among them, the cooled coolant directly flows out and mixes with the drawing fluid, which is not convenient for the secondary recycling of the coolant and the drawing fluid. Therefore, we propose a cooling device and a using method for solder wire production to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a cooling device and a using method for solder wire production to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A cooling device for solder wire production, including an installation bracket, on which a material placement frame is fixedly installed, and a plurality of production mechanisms are evenly distributed at the top of the material placement frame;

[0006] The production mechanism includes a drawing die, a drawing through groove is opened in the middle of the drawing die, a first buffer pipe is fixedly installed at one end of the drawing die, a pumping agent cylinder is fixedly installed at the end of the first buffer pipe away from the drawing die, a second buffer pipe is fixedly installed at the end of the drawing die away from the first buffer pipe, a pumping liquid cylinder is fixedly installed at the end of the second buffer pipe away from the drawing die, a connecting bracket is fixedly installed at the end of the pumping liquid cylinder away from the second buffer pipe, and a drying cylinder is fixedly installed at the end of the connecting bracket away from the pumping liquid cylinder.

[0007] As a preferred technical solution of the present invention, an installation card slot corresponding to the production mechanism is opened at the top of the material placement frame, and the production mechanism is movably clamped in the corresponding installation card slot through the drawing die, the first buffer pipe, the pumping agent cylinder, the second buffer pipe, the pumping liquid cylinder, the connecting bracket and the drying cylinder.

[0008] As a preferred technical solution of the present invention, a buffer agent cavity is provided on one side of the wire drawing die close to the first buffer tube. A first clamping tube communicating with the buffer agent cavity is fixedly installed at the bottom of the wire drawing die. A discharge agent through groove communicating with the buffer agent cavity is provided on the inner wall of the wire drawing die. A buffer liquid cavity is provided on one side of the wire drawing die close to the second buffer tube. A second clamping tube communicating with the buffer liquid cavity is fixedly installed at the bottom of the wire drawing die. A discharge liquid through groove communicating with the buffer liquid cavity is provided on the inner wall of the wire drawing die;

[0009] A first clamping through groove corresponding to the first clamping tube is provided on the material placing frame. The first clamping tube is hermetically clamped in the corresponding first clamping through groove. A second clamping through groove corresponding to the second clamping tube is provided on the material placing frame. The second clamping tube is hermetically clamped in the corresponding second clamping through groove;

[0010] A first main pipe corresponding to the first clamping through groove is provided at the bottom end of the material placing frame. A plurality of first branch pipes corresponding to the first clamping through groove are fixedly installed at the top of the first main pipe. The first branch pipes are fixedly installed at the bottom end of the material placing frame. The first branch pipes communicate with the bottom of the corresponding first clamping through groove. A second main pipe corresponding to the second clamping through groove is provided at the bottom end of the material placing frame. A plurality of second branch pipes corresponding to the second clamping through groove are fixedly installed at the top of the second main pipe. The second branch pipes are fixedly installed at the bottom end of the material placing frame. The second branch pipes communicate with the bottom of the corresponding second clamping through groove.

[0011] As a preferred technical solution of the present invention, a third clamping tube is fixedly installed at the middle position of the bottom of the agent extraction cylinder. A plurality of front agent extraction grooves evenly distributed are provided on one side of the inner wall of the agent extraction cylinder close to the first buffer tube. A plurality of rear agent extraction grooves evenly distributed are provided on one side of the inner wall of the agent extraction cylinder far from the first buffer tube;

[0012] A third clamping through groove corresponding to the third clamping tube is provided on the material placing frame. The third clamping tube is hermetically clamped in the corresponding third clamping through groove;

[0013] A third main pipe corresponding to the third clamping through groove is provided at the bottom end of the material placing frame. A plurality of third branch pipes corresponding to the third clamping through groove are fixedly installed at the top of the third main pipe. The third branch pipes are fixedly installed at the bottom end of the material placing frame. The third branch pipes communicate with the bottom of the corresponding third clamping through groove.

[0014] As a preferred technical solution of the present invention, a fourth clamping tube is fixedly installed at the middle position of the bottom of the liquid extraction cylinder. A plurality of front liquid extraction grooves evenly distributed are provided on one side of the inner wall of the liquid extraction cylinder close to the second buffer tube. A plurality of rear liquid extraction grooves evenly distributed are provided on one side of the inner wall of the liquid extraction cylinder far from the second buffer tube;

[0015] A fourth card through groove corresponding to the fourth card tube is formed in the material placing frame, and the fourth card tube is hermetically clamped in the corresponding fourth card through groove;

[0016] A fourth main pipe corresponding to the fourth card through groove is provided at the bottom end of the material placing frame. A plurality of fourth branch pipes corresponding to the fourth card through groove are fixedly installed at the top of the fourth main pipe. The fourth branch pipes are fixedly installed at the bottom end of the material placing frame, and the fourth branch pipes communicate with the bottom of the corresponding fourth card through groove.

[0017] As a preferred technical solution of the present invention, fifth card tubes are fixedly installed on both sides of the bottom of the drying cylinder, and a plurality of uniformly distributed drying grooves are formed in the inner wall of the liquid pumping cylinder;

[0018] A fifth card through groove corresponding to the fifth card tube is formed in the material placing frame, and the fifth card tube is hermetically clamped in the corresponding fifth card through groove;

[0019] A fifth main pipe corresponding to the fifth card through groove is provided at the bottom end of the material placing frame. A plurality of fifth branch pipes corresponding to the fifth card through groove are fixedly installed at the top of the fifth main pipe. The fifth branch pipes are fixedly installed at the bottom end of the material placing frame, and the fifth branch pipes communicate with the bottom of the corresponding fifth card through groove.

[0020] As a preferred technical solution of the present invention, a first limit block is fixedly installed at one end of the installation card slot, a second limit block is fixedly installed at the end of the installation card slot away from the first limit block, one end of the drying cylinder away from the connecting bracket contacts the first limit block, and one end of the agent pumping cylinder away from the first buffer pipe contacts the second limit block.

[0021] As a preferred technical solution of the present invention, a top fixing bracket is rotatably installed at the top end of the material placing frame. A magnetic head is fixedly installed at the end of the top fixing bracket. A magnetic suction groove corresponding to the magnetic head is formed in the material placing frame. The magnetic head is magnetically clamped in the magnetic suction groove. A fixing card slot corresponding to the production mechanism is formed in the top fixing bracket, and the production mechanism is movably clamped in the corresponding fixing card slot.

[0022] As a preferred technical solution of the present invention, the temperature reduction device for solder wire production further includes a wire drawing liquid output system, a wire drawing liquid suction system, a coolant output system, a coolant suction system, and a drying suction pump. The output port of the wire drawing liquid output system is fixedly installed at the end of the first main pipe. The output port of the coolant output system is fixedly installed at the end of the second main pipe. The suction port of the wire drawing liquid suction system is fixedly installed at the end of the third main pipe. The suction port of the coolant suction system is fixedly installed at the end of the fourth main pipe. The suction port of the drying suction pump is fixedly installed at the end of the fifth main pipe.

[0023] A method for using a cooling device for solder wire production, comprising the following steps:

[0024] Step 1: Pass the solder bars to be drawn through the extraction cylinder, the first buffer tube, the wire drawing die, the second buffer tube, the liquid extraction cylinder and the drying cylinder in sequence. The solder bars pass through the wire drawing slots;

[0025] Step 2: Actively clamp the wire drawing die, the first buffer tube, the extraction cylinder, the second buffer tube, the liquid extraction cylinder, the connecting bracket and the drying cylinder in the corresponding installation card slots, so that one end of the drying cylinder away from the connecting bracket contacts the first limit block, and one end of the extraction cylinder away from the first buffer tube contacts the second limit block. Positionally and clampingly install the production mechanism and the inserted solder bars in the corresponding installation card slots;

[0026] At the same time, the first clamping tube is hermetically clamped in the corresponding first clamping slot to connect the first clamping tube and the first clamping slot. The second clamping tube is hermetically clamped in the corresponding second clamping slot to connect the second clamping tube and the second clamping slot. The third clamping tube is hermetically clamped in the corresponding third clamping slot to connect the third clamping tube and the third clamping slot. The fourth clamping tube is hermetically clamped in the corresponding fourth clamping slot to connect the fourth clamping tube and the fourth clamping slot. The fifth clamping tube is hermetically clamped in the corresponding fifth clamping slot to connect the fifth clamping tube and the fifth clamping slot;

[0027] Subsequently, rotate the top fixing bracket so that the magnetic suction head is magnetically clamped in the magnetic suction slot, and fix the position of the production mechanism through the top fixing bracket;

[0028] Step 3: Pull the solder bar to form wire drawing. At the same time, control the opening of the wire drawing liquid output system. The wire drawing liquid is introduced into multiple first branch pipes through the first main pipe, and is introduced into the corresponding buffer agent chambers through the corresponding first clamping slots and the first clamping tubes. Then, it is evenly discharged through multiple agent discharge slots and sprayed on the surface of the solder bar to lubricate the surface of the solder bar, facilitating the subsequent wire drawing of the solder bar through the wire drawing slots. The wire drawing liquid after lubrication use remains on one side of the wire drawing die and is introduced into the extraction cylinder through the first buffer tube;

[0029] After the solder bar is drawn into solder wire, it is transmitted to the other side of the wire drawing die. By controlling the opening of the coolant output system, the coolant is introduced into multiple second branch pipes through the second main pipe, and is introduced into the corresponding buffer liquid chambers through the corresponding second clamping slots and the second clamping tubes. Then, it is evenly discharged through multiple liquid discharge slots and sprayed on the surface of the solder wire to immediately cool the surface of the solder wire. The coolant after cooling remains on the other side of the wire drawing die and is introduced into the liquid extraction cylinder through the second buffer tube;

[0030] Meanwhile, by turning on the wire drawing liquid suction system to suck the third main pipe, a negative pressure is formed in multiple front suction agent tanks and multiple rear suction agent tanks. The used wire drawing liquid introduced into the suction agent cylinder is first sucked into the suction agent cylinder through multiple front suction agent tanks, and the remaining used wire drawing liquid is sucked into the suction agent cylinder through multiple rear suction agent tanks, realizing the separate recycling of the used wire drawing liquid. The used wire drawing liquid sucked into the suction agent cylinder is introduced into the wire drawing liquid suction system for recycling;

[0031] By turning on the coolant suction system to suck the fourth main pipe, a negative pressure is formed in multiple front liquid suction tanks and multiple rear liquid suction tanks. The cooled coolant introduced into the liquid suction cylinder is first sucked into the liquid suction cylinder through multiple front liquid suction tanks, and the remaining cooled coolant is sucked into the liquid suction cylinder through multiple rear liquid suction tanks, realizing the separate recycling of the cooled coolant. The cooled coolant sucked into the liquid suction cylinder is introduced into the coolant suction system for recycling;

[0032] By turning on the drying suction pump to suck the fifth main pipe, a negative pressure is formed at multiple drying tanks to suck and dry the coolant attached to the surface of the cooled solder wire.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0034] 1. By setting up the production mechanism, the wire drawing liquid is evenly sprayed and lubricated on the surface of the solder bar about to be wire drawn. The used wire drawing liquid after lubrication is left on one side of the wire drawing die and introduced into the suction agent cylinder through the first buffer pipe, preventing the used wire drawing liquid from flowing out and facilitating the separate recycling of the used wire drawing liquid.

[0035] 2. By setting up the production mechanism, the coolant is sprayed on the surface of the solder wire after the solder bar is wire drawn into the solder wire to immediately cool the surface of the solder wire. The cooled coolant is left on the other side of the wire drawing die and introduced into the liquid suction cylinder through the second buffer pipe, preventing the cooled coolant from flowing out and facilitating the recycling of the cooled coolant, and preventing the mixture of the used coolant and wire drawing liquid from affecting the subsequent recycling of the coolant and wire drawing liquid.

[0036] 3. By setting up the production mechanism, sucking the fifth main pipe, a negative pressure is formed at multiple drying tanks to suck and dry the coolant attached to the surface of the cooled solder wire. Description of the Drawings

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0038] Figure 1 This is a schematic structural diagram of the present invention.

[0039] Figure 2 This is a schematic diagram of the structural connection after the present invention is disassembled.

[0040] Figure 3 This is the present invention Figure 2 An enlarged view of part A in the present invention.

[0041] Figure 4 This is the present invention Figure 2 An enlarged view of part B in the present invention.

[0042] Figure 5 This is the present invention Figure 2 An enlarged view of part C in the present invention.

[0043] Figure 6 This is a schematic diagram of the structural connection between the material placement frame and the top fixing bracket in the present invention.

[0044] Figure 7 This is the present invention Figure 6 An enlarged view of part D in the present invention.

[0045] Figure 8 This is a schematic structural diagram of another angle of the material placement frame in the present invention.

[0046] Figure 9 This is a schematic diagram of the structural connection of the production mechanism in the present invention.

[0047] Figure 10 This is a schematic structural diagram of the wire drawing die in the present invention.

[0048] Figure 11 This is a schematic structural diagram of the extraction cylinder in the present invention.

[0049] Figure 12 This is a schematic structural diagram of the liquid extraction cylinder in the present invention.

[0050] Figure 13 This is a schematic structural diagram of the drying cylinder in the present invention.

[0051] In the figure: 1, mounting bracket; 2, material placing frame; 21, first limiting block; 22, second limiting block; 23, top fixing bracket; 24, magnetic head; 201, mounting card slot; 202, fixing card slot; 203, magnetic slot; 3, production mechanism; 401, first card through slot; 402, second card through slot; 403, third card through slot; 404, fourth card through slot; 405, fifth card through slot; 51, first main pipe; 511, first branch pipe; 52, second main pipe; 521, second branch pipe; 53, third main pipe; 531, third branch pipe; 54, fourth main pipe; 541, fourth branch pipe; 55, fifth main pipe; 551, fifth branch pipe; 61, wire drawing liquid output system; 62, coolant output system; 63, wire drawing liquid suction system; 64, coolant suction system; 65, drying suction pump; 31, wire drawing die; 311, wire drawing through slot; 312, inhibitor cavity; 3121, first clamping pipe; 3122, agent discharge through slot; 313, buffer liquid cavity; 3131, second clamping pipe; 3132, liquid discharge through slot; 32, first buffer pipe; 33, agent extraction cylinder; 331, third clamping pipe; 332, front agent extraction slot; 333, rear agent extraction slot; 34, second buffer pipe; 35, liquid extraction cylinder; 351, fourth clamping pipe; 352, front liquid extraction slot; 353, rear liquid extraction slot; 36, connecting bracket; 37, drying cylinder; 371, fifth clamping pipe; 372, drying slot. Detailed implementation manner

[0052] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0053] Embodiment: As Figure 1-13 shown, the present invention provides a temperature reduction device for solder wire production, including a mounting bracket 1, a material placing frame 2 is fixedly installed on the mounting bracket 1, and a plurality of production mechanisms 3 are evenly arranged at the top of the material placing frame 2;

[0054] The production mechanism 3 includes a wire drawing die 31. A wire drawing slot 311 is opened in the middle of the wire drawing die 31. By opening the wire drawing slot 311, the solder strip to be wire drawn is passed through the wire drawing slot 311, and wire drawing is performed by pulling the solder strip. One end of the wire drawing die 31 is fixedly installed with a first buffer tube 32. One end of the first buffer tube 32 away from the wire drawing die 31 is fixedly installed with a pumping agent cylinder 33. One end of the wire drawing die 31 away from the first buffer tube 32 is fixedly installed with a second buffer tube 34. One end of the second buffer tube 34 away from the wire drawing die 31 is fixedly installed with a liquid pumping cylinder 35. One end of the liquid pumping cylinder 35 away from the second buffer tube 34 is fixedly installed with a connecting bracket 36. One end of the connecting bracket 36 away from the liquid pumping cylinder 35 is fixedly installed with a drying cylinder 37. During use, the solder strip to be wire drawn is sequentially passed through the pumping agent cylinder 33, the first buffer tube 32, the wire drawing die 31, the second buffer tube 34, the liquid pumping cylinder 35, and the drying cylinder 37.

[0055] An installation card slot 201 corresponding to the production mechanism 3 is opened at the top of the material placing frame 2. The production mechanism 3 is movably clamped in the corresponding installation card slot 201 through the wire drawing die 31, the first buffer tube 32, the pumping agent cylinder 33, the second buffer tube 34, the liquid pumping cylinder 35, the connecting bracket 36, and the drying cylinder 37. A first limiting block 21 is fixedly installed at one end of the installation card slot 201. A second limiting block 22 is fixedly installed at the end of the installation card slot 201 away from the first limiting block 21. One end of the drying cylinder 37 away from the connecting bracket 36 contacts the first limiting block 21. One end of the pumping agent cylinder 33 away from the first buffer tube 32 contacts the second limiting block 22, positioning and clamping the production mechanism 3 and the inserted solder strip in the corresponding installation card slot 201.

[0056] A top fixing bracket 23 is rotatably installed at the top of the material placing frame 2. A magnetic head 24 is fixedly installed at the end of the top fixing bracket 23. A magnetic attraction slot 203 corresponding to the magnetic head 24 is opened on the material placing frame 2. The magnetic head 24 is magnetically clamped in the magnetic attraction slot 203. A fixing card slot 202 corresponding to the production mechanism 3 is opened on the top fixing bracket 23. The production mechanism 3 is movably clamped in the corresponding fixing card slot 202, fixing the position of the production mechanism 3 through the top fixing bracket 23.

[0057] One side of the wire drawing die 31 close to the first buffer pipe 32 is provided with a buffer agent cavity 312. A first clamping pipe 3121 communicating with the buffer agent cavity 312 is fixedly installed at the bottom of the wire drawing die 31. A discharge agent through groove 3122 communicating with the buffer agent cavity 312 is formed in the inner wall of the wire drawing die 31. A first clamping through groove 401 corresponding to the first clamping pipe 3121 is formed in the material placing frame 2. The first clamping pipe 3121 is hermetically clamped in the corresponding first clamping through groove 401 to connect the first clamping pipe 3121 and the first clamping through groove 401. A first main pipe 51 corresponding to the first clamping through groove 401 is arranged at the bottom end of the material placing frame 2. A plurality of first branch pipes 511 corresponding to the first clamping through groove 401 are fixedly installed at the top of the first main pipe 51. The first branch pipes 511 are fixedly installed at the bottom end of the material placing frame 2. The first branch pipes 511 communicate with the bottoms of the corresponding first clamping through grooves 401. During the wire drawing forming operation, the wire drawing liquid is introduced into the plurality of first branch pipes 511 through the first main pipe 51, and is introduced into the corresponding buffer agent cavities 312 through the corresponding first clamping through grooves 401 and first clamping pipes 3121, and then is uniformly discharged through the plurality of discharge agent through grooves 3122 and sprayed on the surface of the solder bar to lubricate the surface of the solder bar, facilitating the subsequent wire drawing forming of the solder bar through the wire drawing through groove 311. The wire drawing liquid after lubrication use remains on one side of the wire drawing die 31 and is introduced into the agent extraction cylinder 33 through the first buffer pipe 32, preventing the outflow of the wire drawing liquid after use and facilitating the recycling of the wire drawing liquid after subsequent use.

[0058] One side of the wire drawing die 31 close to the second buffer pipe 34 is provided with a buffer liquid cavity 313. A second clamping pipe 3131 communicating with the buffer liquid cavity 313 is fixedly installed at the bottom of the wire drawing die 31. A liquid discharge through groove 3132 communicating with the buffer liquid cavity 313 is formed in the inner wall of the wire drawing die 31. A second clamping through groove 402 corresponding to the second clamping pipe 3131 is formed in the material placing frame 2. The second clamping pipe 3131 is hermetically clamped in the corresponding second clamping through groove 402 to communicate between the second clamping pipe 3131 and the second clamping through groove 402. A second main pipe 52 corresponding to the second clamping through groove 402 is arranged at the bottom end of the material placing frame 2. A plurality of second branch pipes 521 corresponding to the second clamping through groove 402 are fixedly installed at the top of the second main pipe 52. The second branch pipes 521 are fixedly installed at the bottom end of the material placing frame 2. The second branch pipes 521 communicate with the bottom of the corresponding second clamping through grooves 402. After the solder bar is drawn into solder wire, it is transmitted to the other side of the wire drawing die 31. The coolant is introduced into a plurality of second branch pipes 521 through the second main pipe 52, and is introduced into the corresponding buffer liquid cavity 313 through the corresponding second clamping through groove 402 and the second clamping pipe 3131, and then is evenly discharged through a plurality of liquid discharge through grooves 3132, sprayed on the surface of the solder wire, and the surface of the solder wire is immediately cooled. The cooled coolant remains on the other side of the wire drawing die 31 and is introduced into the liquid pumping cylinder 35 through the second buffer pipe 34, preventing the cooled coolant from flowing out, facilitating the subsequent recycling of the cooled coolant, and preventing the mixed use of the coolant and the wire drawing liquid after use from affecting the subsequent recycling of the coolant and the wire drawing liquid.

[0059] A third clamping pipe 331 is fixedly installed at the middle position of the bottom of the agent pumping cylinder 33. A plurality of front agent pumping grooves 332 evenly distributed are formed on one side of the inner wall of the agent pumping cylinder 33 close to the first buffer pipe 32. A plurality of rear agent pumping grooves 333 evenly distributed are formed on one side of the inner wall of the agent pumping cylinder 33 far from the first buffer pipe 32. A third clamping through groove 403 corresponding to the third clamping pipe 331 is formed in the material placing frame 2. The third clamping pipe 331 is hermetically clamped in the corresponding third clamping through groove 403 to communicate between the third clamping pipe 331 and the third clamping through groove 403. A third main pipe 53 corresponding to the third clamping through groove 403 is arranged at the bottom end of the material placing frame 2. A plurality of third branch pipes 531 corresponding to the third clamping through groove 403 are fixedly installed at the top of the third main pipe 53. The third branch pipes 531 are fixedly installed at the bottom end of the material placing frame 2. The third branch pipes 531 communicate with the bottom of the corresponding third clamping through grooves 403. By pumping the third main pipe 53, negative pressure is formed in a plurality of front agent pumping grooves 332 and a plurality of rear agent pumping grooves 333. The used wire drawing liquid introduced into the agent pumping cylinder 33 is first pumped into the agent pumping cylinder 33 through a plurality of front agent pumping grooves 332, and the remaining used wire drawing liquid is pumped into the agent pumping cylinder 33 through a plurality of rear agent pumping grooves 333, realizing the separate recycling of the used wire drawing liquid and preventing the used wire drawing liquid from flowing.

[0060] At the middle position of the bottom of the liquid extraction cylinder 35, a fourth clamping tube 351 is fixedly installed. On one side of the inner wall of the liquid extraction cylinder 35 close to the second buffer tube 34, a plurality of evenly distributed front liquid extraction grooves 352 are provided. On the side of the inner wall of the liquid extraction cylinder 35 far from the second buffer tube 34, a plurality of evenly distributed rear liquid extraction grooves 353 are provided; on the material placing frame 2, a fourth clamping through groove 404 corresponding to the fourth clamping tube 351 is provided. The fourth clamping tube 351 is hermetically clamped in the corresponding fourth clamping through groove 404 to connect the fourth clamping tube 351 and the fourth clamping through groove 404; at the bottom end of the material placing frame 2, a fourth main pipe 54 corresponding to the fourth clamping through groove 404 is provided. At the top of the fourth main pipe 54, a plurality of fourth branch pipes 541 corresponding to the fourth clamping through groove 404 are fixedly installed. The fourth branch pipes 541 are fixedly installed at the bottom end of the material placing frame 2. The fourth branch pipes 541 communicate with the bottom of the corresponding fourth clamping through grooves 404. By sucking the fourth main pipe 54, negative pressure is formed in the plurality of front liquid extraction grooves 352 and the plurality of rear liquid extraction grooves 353. The cooled coolant introduced into the liquid extraction cylinder 35 is first sucked into the liquid extraction cylinder 35 through the plurality of front liquid extraction grooves 352, and the remaining cooled coolant is sucked into the liquid extraction cylinder 35 through the plurality of rear liquid extraction grooves 353, realizing the separate recovery and use of the cooled coolant and preventing the cooled coolant from flowing.

[0061] On both sides of the bottom of the drying cylinder 37, fifth clamping tubes 371 are fixedly installed. On the inner wall of the liquid extraction cylinder 35, a plurality of evenly distributed drying grooves 372 are provided; on the material placing frame 2, a fifth clamping through groove 405 corresponding to the fifth clamping tube 371 is provided. The fifth clamping tube 371 is hermetically clamped in the corresponding fifth clamping through groove 405 to connect the fifth clamping tube 371 and the fifth clamping through groove 405; at the bottom end of the material placing frame 2, a fifth main pipe 55 corresponding to the fifth clamping through groove 405 is provided. At the top of the fifth main pipe 55, a plurality of fifth branch pipes 551 corresponding to the fifth clamping through groove 405 are fixedly installed. The fifth branch pipes 551 are fixedly installed at the bottom end of the material placing frame 2. The fifth branch pipes 551 communicate with the bottom of the corresponding fifth clamping through grooves 405. By sucking the fifth main pipe 55, negative pressure is formed at the plurality of drying grooves 372 to suck and dry the coolant attached to the surface of the cooled solder wire.

[0062] The cooling device for solder wire production further includes a wire drawing liquid output system 61, a wire drawing liquid suction system 63, a coolant output system 62, a coolant suction system 64 and a drying suction pump 65. The output port of the wire drawing liquid output system 61 is fixedly installed at the end of the first main pipe 51. By controlling the opening of the wire drawing liquid output system 61, the wire drawing liquid is introduced into the plurality of first branch pipes 511 through the first main pipe 51;

[0063] The output port of the coolant output system 62 is fixedly installed at the end of the second main pipe 52. By controlling the opening of the coolant output system 62, the coolant is introduced into the plurality of second branch pipes 521 through the second main pipe 52;

[0064] The suction port of the wire drawing liquid suction system 63 and the end of the third main pipe 53 are fixedly installed. By turning on the wire drawing liquid suction system 63, the third main pipe 53 is suctioned, and the used wire drawing liquid drawn into the suction agent cylinder 33 is introduced into the wire drawing liquid suction system 63 for recycling;

[0065] The suction port of the coolant suction system 64 and the end of the fourth main pipe 54 are fixedly installed. By turning on the coolant suction system 64, the fourth main pipe 54 is suctioned, and the cooled coolant drawn into the liquid suction cylinder 35 is introduced into the coolant suction system 64 for recycling;

[0066] The suction port of the dry suction pump 65 and the end of the fifth main pipe 55 are fixedly installed. By controlling the turning on of the dry suction pump 65, the fifth main pipe 55 is suctioned.

[0067] A method for using a cooling device for solder wire production includes the following steps:

[0068] Step 1: Pass the solder bar to be drawn through the suction agent cylinder 33, the first buffer pipe 32, the wire drawing die 31, the second buffer pipe 34, the liquid suction cylinder 35, and the drying cylinder 37 in sequence, and the solder bar passes through the wire drawing slot 311;

[0069] Step 2: Actively clamp the wire drawing die 31, the first buffer pipe 32, the suction agent cylinder 33, the second buffer pipe 34, the liquid suction cylinder 35, the connecting bracket 36, and the drying cylinder 37 in the corresponding installation card slots 201, so that one end of the drying cylinder 37 away from the connecting bracket 36 contacts the first limit block 21, and one end of the suction agent cylinder 33 away from the first buffer pipe 32 contacts the second limit block 22, and positionally clamp and install the production mechanism 3 and the inserted solder bar in the corresponding installation card slots 201;

[0070] At the same time, the first clamping pipe 3121 is hermetically clamped in the corresponding first clamping slot 401 to connect the first clamping pipe 3121 and the first clamping slot 401, the second clamping pipe 3131 is hermetically clamped in the corresponding second clamping slot 402 to connect the second clamping pipe 3131 and the second clamping slot 402, the third clamping pipe 331 is hermetically clamped in the corresponding third clamping slot 403 to connect the third clamping pipe 331 and the third clamping slot 403, the fourth clamping pipe 351 is hermetically clamped in the corresponding fourth clamping slot 404 to connect the fourth clamping pipe 351 and the fourth clamping slot 404, and the fifth clamping pipe 371 is hermetically clamped in the corresponding fifth clamping slot 405 to connect the fifth clamping pipe 371 and the fifth clamping slot 405;

[0071] Subsequently, rotate the top fixing bracket 23 so that the magnetic head 24 is magnetically clamped in the magnetic slot 203, and fix the position of the production mechanism 3 through the top fixing bracket 23;

[0072] Step 3: Pull the solder bar to form wire drawing, and at the same time control the opening of the wire drawing fluid output system 61. The wire drawing fluid is introduced into multiple first branch pipes 511 through the first main pipe 51, and is introduced into the corresponding inhibitor chambers 312 through the corresponding first card through slots 401 and first card pipes 3121, and then is evenly discharged through multiple agent discharge through slots 3122 and sprayed on the surface of the solder bar to lubricate the surface of the solder bar, facilitating the subsequent wire drawing of the solder bar through the wire drawing through slot 311. The wire drawing fluid after lubrication use is left on one side of the wire drawing die 31 and is introduced into the agent extraction cylinder 33 through the first buffer pipe 32;

[0073] After the solder bar is drawn into solder wire, it is transmitted to the other side of the wire drawing die 31. By controlling the opening of the coolant output system 62, the coolant is introduced into multiple second branch pipes 521 through the second main pipe 52, and is introduced into the corresponding coolant chambers 313 through the corresponding second card through slots 402 and second card pipes 3131, and then is evenly discharged through multiple liquid discharge through slots 3132 and sprayed on the surface of the solder wire to immediately cool the surface of the solder wire. The coolant after cooling is left on the other side of the wire drawing die 31 and is introduced into the liquid extraction cylinder 35 through the second buffer pipe 34;

[0074] At the same time, by opening the wire drawing fluid suction system 63 and sucking the third main pipe 53, a negative pressure is formed in multiple front agent extraction slots 332 and multiple rear agent extraction slots 333. The wire drawing fluid after lubrication use is left on one side of the wire drawing die 31 and is introduced into the agent extraction cylinder 33 through the first buffer pipe 32. The used wire drawing fluid introduced into the agent extraction cylinder 33 is first sucked into the agent extraction cylinder 33 through multiple front agent extraction slots 332, and the remaining used wire drawing fluid is sucked into the agent extraction cylinder 33 through multiple rear agent extraction slots 333, realizing the separate recycling of the used wire drawing fluid. The used wire drawing fluid introduced into the agent extraction cylinder 33 is introduced into the wire drawing fluid suction system 63 for recycling;

[0075] By opening the coolant suction system 64 and sucking the fourth main pipe 54, a negative pressure is formed in multiple front liquid extraction slots 352 and multiple rear liquid extraction slots 353. The coolant after cooling is left on the other side of the wire drawing die 31 and is introduced into the liquid extraction cylinder 35 through the second buffer pipe 34. The cooled coolant introduced into the liquid extraction cylinder 35 is first sucked into the liquid extraction cylinder 35 through multiple front liquid extraction slots 352, and the remaining cooled coolant is sucked into the liquid extraction cylinder 35 through multiple rear liquid extraction slots 353, realizing the separate recycling of the cooled coolant. The cooled coolant introduced into the liquid extraction cylinder 35 is introduced into the coolant suction system 64 for recycling;

[0076] By opening the drying suction pump 65 and sucking the fifth main pipe 55, a negative pressure is formed at multiple drying slots 372 to suck and dry the coolant attached to the surface of the cooled solder wire.

[0077] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling device for solder wire production, comprising a mounting bracket (1), characterized in that: A material placing frame (2) is fixedly installed on the installation bracket (1), and a plurality of production mechanisms (3) are evenly distributed at the top of the material placing frame (2); The production mechanism (3) includes a wire drawing die (31). A wire drawing through groove (311) is formed in the middle of the wire drawing die (31). One end of the wire drawing die (31) is fixedly installed with a first buffer pipe (32). One end of the first buffer pipe (32) far from the wire drawing die (31) is fixedly installed with a pumping agent cylinder (33). One end of the wire drawing die (31) far from the first buffer pipe (32) is fixedly installed with a second buffer pipe (34). One end of the second buffer pipe (34) far from the wire drawing die (31) is fixedly installed with a liquid pumping cylinder (35). One end of the liquid pumping cylinder (35) far from the second buffer pipe (34) is fixedly installed with a connecting bracket (36). One end of the connecting bracket (36) far from the liquid pumping cylinder (35) is fixedly installed with a drying cylinder (37).

2. The cooling device for solder wire production according to claim 1, characterized in that: Installation clamping grooves (201) corresponding to the production mechanisms (3) are formed at the top of the material placing frame (2). The production mechanisms (3) are movably clamped in the corresponding installation clamping grooves (201) through the wire drawing die (31), the first buffer pipe (32), the pumping agent cylinder (33), the second buffer pipe (34), the liquid pumping cylinder (35), the connecting bracket (36) and the drying cylinder (37).

3. The cooling device for solder wire production according to claim 2, characterized in that: A buffer agent cavity (312) is formed on one side of the wire drawing die (31) close to the first buffer pipe (32). A first clamping pipe (3121) communicated with the buffer agent cavity (312) is fixedly installed at the bottom of the wire drawing die (31). A discharge agent through groove (3122) communicated with the buffer agent cavity (312) is formed in the inner wall of the wire drawing die (31). A buffer liquid cavity (313) is formed on one side of the wire drawing die (31) close to the second buffer pipe (34). A second clamping pipe (3131) communicated with the buffer liquid cavity (313) is fixedly installed at the bottom of the wire drawing die (31). A discharge liquid through groove (3132) communicated with the buffer liquid cavity (313) is formed in the inner wall of the wire drawing die (31); A first clamping through groove (401) corresponding to the first clamping pipe (3121) is formed on the material placing frame (2). The first clamping pipe (3121) is hermetically clamped in the corresponding first clamping through groove (401). A second clamping through groove (402) corresponding to the second clamping pipe (3131) is formed on the material placing frame (2). The second clamping pipe (3131) is hermetically clamped in the corresponding second clamping through groove (402); The bottom end of the material placing frame (2) is provided with a first main pipe (51) corresponding to the first card through groove (401). The top of the first main pipe (51) is fixedly installed with a plurality of first branch pipes (511) corresponding to the first card through groove (401). The first branch pipes (511) are fixedly installed at the bottom end of the material placing frame (2). The first branch pipes (511) communicate with the bottom of the corresponding first card through groove (401). The bottom end of the material placing frame (2) is provided with a second main pipe (52) corresponding to the second card through groove (402). The top of the second main pipe (52) is fixedly installed with a plurality of second branch pipes (521) corresponding to the second card through groove (402). The second branch pipes (521) are fixedly installed at the bottom end of the material placing frame (2). The second branch pipes (521) communicate with the bottom of the corresponding second card through groove (402).

4. A cooling device for solder wire production according to claim 3, characterized in that: A third clamping pipe (331) is fixedly installed at the middle position of the bottom of the extraction agent cylinder (33). A plurality of uniformly distributed front extraction agent grooves (332) are formed on one side of the inner wall of the extraction agent cylinder (33) close to the first buffer pipe (32). A plurality of uniformly distributed rear extraction agent grooves (333) are formed on one side of the inner wall of the extraction agent cylinder (33) away from the first buffer pipe (32). A third card through groove (403) corresponding to the third clamping pipe (331) is formed on the material placing frame (2). The third clamping pipe (331) is hermetically clamped in the corresponding third card through groove (403). The bottom end of the material placing frame (2) is provided with a third main pipe (53) corresponding to the third card through groove (403). The top of the third main pipe (53) is fixedly installed with a plurality of third branch pipes (531) corresponding to the third card through groove (403). The third branch pipes (531) are fixedly installed at the bottom end of the material placing frame (2). The third branch pipes (531) communicate with the bottom of the corresponding third card through groove (403).

5. The cooling device for solder wire production according to claim 4, characterized in that: A fourth clamping pipe (351) is fixedly installed at the middle position of the bottom of the liquid extraction cylinder (35). A plurality of uniformly distributed front liquid extraction grooves (352) are formed on one side of the inner wall of the liquid extraction cylinder (35) close to the second buffer pipe (34). A plurality of uniformly distributed rear liquid extraction grooves (353) are formed on one side of the inner wall of the liquid extraction cylinder (35) away from the second buffer pipe (34). A fourth card through groove (404) corresponding to the fourth clamping pipe (351) is formed on the material placing frame (2). The fourth clamping pipe (351) is hermetically clamped in the corresponding fourth card through groove (404). The bottom end of the material placing frame (2) is provided with a fourth main pipe (54) corresponding to the fourth card through groove (404). The top of the fourth main pipe (54) is fixedly installed with a plurality of fourth branch pipes (541) corresponding to the fourth card through groove (404). The fourth branch pipes (541) are fixedly installed at the bottom end of the material placing frame (2). The fourth branch pipes (541) communicate with the bottom of the corresponding fourth card through groove (404).

6. The cooling device for solder wire production according to claim 5, characterized in that: Fifth clamping pipes (371) are fixedly installed on both sides of the bottom of the drying cylinder (37). A plurality of uniformly distributed drying grooves (372) are formed on the inner wall of the liquid extraction cylinder (35). A fifth card slot (405) corresponding to the fifth card tube (371) is formed in the material placing frame (2), and the fifth card tube (371) is hermetically clamped in the corresponding fifth card slot (405); A fifth main pipe (55) corresponding to the fifth card slot (405) is provided at the bottom end of the material placing frame (2). A plurality of fifth branch pipes (551) corresponding to the fifth card slot (405) are fixedly installed at the top of the fifth main pipe (55). The fifth branch pipes (551) are fixedly installed at the bottom end of the material placing frame (2), and the fifth branch pipes (551) communicate with the bottom of the corresponding fifth card slots (405).

7. The cooling device for solder wire production according to claim 6, characterized in that: A first limiting block (21) is fixedly installed at one end of the installation card slot (201), and a second limiting block (22) is fixedly installed at the end of the installation card slot (201) away from the first limiting block (21). One end of the drying cylinder (37) away from the connecting bracket (36) contacts the first limiting block (21), and one end of the extraction agent cylinder (33) away from the first buffer tube (32) contacts the second limiting block (22).

8. The cooling device for solder wire production according to claim 7, characterized in that: A top fixing bracket (23) is rotatably installed at the top end of the material placing frame (2). A magnetic head (24) is fixedly installed at the end of the top fixing bracket (23). A magnetic attraction groove (203) corresponding to the magnetic head (24) is formed in the material placing frame (2), and the magnetic head (24) is magnetically clamped in the magnetic attraction groove (203). A fixing card slot (202) corresponding to the production mechanism (3) is formed in the top fixing bracket (23), and the production mechanism (3) is movably clamped in the corresponding fixing card slot (202).

9. The cooling device for solder wire production according to claim 8, characterized in that: The temperature reduction device for soldering wire production further includes a wire drawing liquid output system (61), a wire drawing liquid suction system (63), a coolant output system (62), a coolant suction system (64) and a drying suction pump (65). The output port of the wire drawing liquid output system (61) is fixedly installed at the end of the first main pipe (51). The output port of the coolant output system (62) is fixedly installed at the end of the second main pipe (52). The suction port of the wire drawing liquid suction system (63) is fixedly installed at the end of the third main pipe (53). The suction port of the coolant suction system (64) is fixedly installed at the end of the fourth main pipe (54). The suction port of the drying suction pump (65) is fixedly installed at the end of the fifth main pipe (55).

10. A method for using the cooling device for solder wire production according to claim 9, characterized in that, Including the following steps: Step 1: Pass the solder bars to be drawn through the extraction agent cylinder (33), the first buffer tube (32), the wire drawing die (31), the second buffer tube (34), the liquid extraction cylinder (35) and the drying cylinder (37) in sequence, and the solder bars pass through the wire drawing slot (311); Step 2: Actively snap the wire drawing die (31), the first buffer tube (32), the extractant cylinder (33), the second buffer tube (34), the liquid extraction cylinder (35), the connecting bracket (36), and the drying cylinder (37) into the corresponding installation card slots (201), so that one end of the drying cylinder (37) away from the connecting bracket (36) contacts the first limit block (21), and one end of the extractant cylinder (33) away from the first buffer tube (32) contacts the second limit block (22). Positionally snap and install the production mechanism (3) and the inserted solder strip into the corresponding installation card slots (201); Meanwhile, the first clamping tube (3121) is hermetically snapped into the corresponding first clamping through slot (401) to connect the first clamping tube (3121) and the first clamping through slot (401). The second clamping tube (3131) is hermetically snapped into the corresponding second clamping through slot (402) to connect the second clamping tube (3131) and the second clamping through slot (402). The third clamping tube (331) is hermetically snapped into the corresponding third clamping through slot (403) to connect the third clamping tube (331) and the third clamping through slot (403). The fourth clamping tube (351) is hermetically snapped into the corresponding fourth clamping through slot (404) to connect the fourth clamping tube (351) and the fourth clamping through slot (404). The fifth clamping tube (371) is hermetically snapped into the corresponding fifth clamping through slot (405) to connect the fifth clamping tube (371) and the fifth clamping through slot (405); Subsequently, rotate the top fixing bracket (23) so that the magnetic head (24) is magnetically snapped into the magnetic slot (203) to fix the position of the production mechanism (3) through the top fixing bracket (23); Step 3: Pull the solder strip for wire drawing and forming. Meanwhile, control the opening of the wire drawing liquid output system (61). The wire drawing liquid is introduced into multiple first branch pipes (511) through the first main pipe (51), and then through the corresponding first clamping through slot (401) and the first clamping tube (3121) into the corresponding inhibitor cavity (312). Subsequently, it is evenly discharged through multiple agent discharge through slots (3122), sprayed on the surface of the solder strip to lubricate the surface of the solder strip, facilitating the subsequent wire drawing and forming of the solder strip through the wire drawing through slot (311). The used wire drawing liquid remains on one side of the wire drawing die (31) and is introduced into the extractant cylinder (33) through the first buffer tube (32); After the solder strip is wire drawn and formed into solder wire, it is transmitted to the other side of the wire drawing die (31). By controlling the opening of the coolant output system (62), the coolant is introduced into multiple second branch pipes (521) through the second main pipe (52), and then through the corresponding second clamping through slot (402) and the second clamping tube (3131) into the corresponding coolant cavity (313). Subsequently, it is evenly discharged through multiple liquid discharge through slots (3132), sprayed on the surface of the solder wire to immediately cool the surface of the solder wire. The cooled coolant remains on the other side of the wire drawing die (31) and is introduced into the liquid extraction cylinder (35) through the second buffer tube (34); Meanwhile, by turning on the wire drawing fluid suction system (63) to suck the third main pipe (53), a negative pressure is formed in multiple front suction agent tanks (332) and multiple rear suction agent tanks (333). The used wire drawing fluid introduced into the suction agent cylinder (33) is first sucked into the suction agent cylinder (33) through the multiple front suction agent tanks (332), and the remaining used wire drawing fluid is sucked into the suction agent cylinder (33) through the multiple rear suction agent tanks (333), realizing the separate recycling of the used wire drawing fluid. The used wire drawing fluid sucked into the suction agent cylinder (33) is introduced into the wire drawing fluid suction system (63) for recycling; By turning on the coolant suction system (64) to suck the fourth main pipe (54), a negative pressure is formed in multiple front suction fluid tanks (352) and multiple rear suction fluid tanks (353). The cooled coolant introduced into the suction fluid cylinder (35) is first sucked into the suction fluid cylinder (35) through the multiple front suction fluid tanks (352), and the remaining cooled coolant is sucked into the suction fluid cylinder (35) through the multiple rear suction fluid tanks (353), realizing the separate recycling of the cooled coolant. The cooled coolant sucked into the suction fluid cylinder (35) is introduced into the coolant suction system (64) for recycling; By turning on the drying suction pump (65) to suck the fifth main pipe (55), a negative pressure is formed at multiple drying tanks (372) to suck and dry the coolant attached to the surface of the cooled solder wire.

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