Pressing plate, capsule film, polishing pressure head, equipment and method for polishing square substrate

Abstract

The invention discloses a pressing plate, a capsule film, a polishing pressure head, equipment and a method for polishing a square substrate, the pressing plate comprises an elastic plate and a circular hole, the circular hole is located in the middle of the elastic plate, the outer surface of the elastic plate comprises a pressure applying surface, and the outer edge contour of the pressure applying surface is matched with the outer edge contour of the square substrate to be polished; the pressure applying face is a spherical face protruding towards the square base plate, in the process of transmitting pressure to the square base plate through the pressure applying face, the pressure applying face generates elastic deformation and is gradually attached to the square base plate from inside to outside, and pressure distribution which is gradually reduced from inside to outside is formed on the square base plate. The technical effect that the material removal uniformity and the surface flatness of the ultra-large and ultra-thin square substrate in the polishing process are improved is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing equipment, and in particular, to a pressing plate, a bladder, a polishing head, a polishing equipment and a polishing method for polishing a square substrate. Background Art

[0002] As a chip advanced packaging technology, TGV (Through Glass Via) has been extensively researched and developed in various countries around the world. Its core material is a glass substrate, and the polishing of the glass substrate is involved in the production process. As the package becomes larger and larger, there are higher and thinner requirements for the size of the glass substrate.

[0003] However, the polishing of ultra-large and ultra-thin glass substrates (for example, glass substrates with dimensions of more than 500 mm in length, more than 500 mm in width, and a thickness between 0.5 mm and 1 mm) is still in the research and development stage in the laboratory. Due to the extremely large size, the polishing speed difference between the edge area and the central area of the glass substrate is extremely large. Due to the ultra-thin thickness, there are extremely high requirements for the surface flatness of the glass substrate, usually at the micron level.

[0004] In the prior art, the polishing accuracy of ultra-large and ultra-thin glass substrates fails to meet the requirements of mass production. Summary of the Invention

[0005] The main object of the present invention is to provide a pressing plate, a bladder, a polishing head and a polishing equipment for polishing a square substrate, so as to solve the problems in the related art that when polishing an ultra-large and ultra-thin square substrate, the material removal of the square substrate is uneven and the surface flatness is relatively low.

[0006] To achieve the above object, the present invention provides a pressing plate for polishing a square substrate. The pressing plate includes an elastic plate and a circular hole. The circular hole is located in the middle of the elastic plate. The outer surface of the elastic plate includes a pressing surface. The outer edge contour of the pressing surface matches the outer edge contour of the square substrate to be polished. The pressing surface is a spherical surface protruding towards the square substrate. During the process of transmitting pressure to the square substrate through the pressing surface, the pressing surface undergoes elastic deformation and gradually fits with the square substrate from the inside to the outside, forming a pressure distribution that gradually decreases from the inside to the outside on the square substrate.

[0007] Optionally, the pressing plate further includes a support plate, and the support plate is attached to the side of the elastic plate facing away from the pressing surface.

[0008] Optionally, the material of the elastic plate is rubber or elastic resin.

[0009] According to another aspect of the present invention, there is provided a bladder for polishing a square substrate, comprising: a membrane body and the above-mentioned pressing plate, the membrane body includes a first pressurizing cavity, the pressing plate is arranged in the first pressurizing cavity, and the pressure transmitted from the pressing surface of the pressing plate to the square substrate is controlled by controlling the pressure in the first pressurizing cavity.

[0010] Optionally, the first pressurizing cavity corresponds to a first area of the square substrate, the membrane body further includes a second pressurizing cavity, the second pressurizing cavity is located in the circular hole, the second pressurizing cavity corresponds to a second area of the square substrate, and pressure is transmitted to the second area by controlling the pressure in the second pressurizing cavity.

[0011] Optionally, the pressing plate is wrapped in the membrane body, and the pressing plate is located outside the first pressurizing cavity.

[0012] Optionally, a first pressure transmission member is arranged at the bottom of the first pressurizing cavity, the first pressure transmission member corresponds axially to the pressing plate, and the pressure in the first pressurizing cavity is transmitted to the pressing plate through the first pressure transmission member.

[0013] Optionally, an annular groove is arranged on the outer ring side of the membrane body, the annular groove is located between the first pressurizing cavity and the pressing plate, a second pressure transmission member is arranged in the annular groove, the pressure in the first pressurizing cavity is transmitted to the second pressure transmission member through the first pressure transmission member, and then transmitted to the pressing plate by the second pressure transmission member.

[0014] Optionally, the second pressurizing cavity includes a plurality of inner ring pressurizing cavities arranged in sequence from outside to inside, the plurality of inner ring pressurizing cavities respectively correspond to a plurality of areas of the second area, and pressure is transmitted to different areas in the second area by separately controlling the pressure in each inner ring pressurizing cavity.

[0015] Optionally, at least a part of the side wall of the first pressurizing cavity and the side wall of the inner ring pressurizing cavity are bent to form a bent part, and the bent part unfolds during the downward movement of the membrane body to provide a displacement amount for the unbent part on the side wall.

[0016] According to another aspect of the present invention, there is provided a polishing chuck, comprising the above-mentioned bladder.

[0017] Optionally, the polishing chuck further includes: a connection disk, a pressure connection block, a housing, a housing connection member, a retaining ring and a retaining ring connection member; The membrane body is connected to the connection disk, the pressure connection block is used for fixedly connecting with machine equipment, the housing is connected to the pressure connection block through the housing connection member, the retaining ring is connected to the housing through the retaining ring connection member, the retaining ring surrounds the membrane body, and the retaining ring is used to confine the square substrate within the retaining ring.

[0018] Optionally, the housing connector includes an annular sealant film, the inner ring of the sealant film is fixedly connected to the pressure connection block, and the outer ring of the sealant film is fixedly connected to the housing; A closed pressure control chamber is defined among the sealant film, the pressure connection block, the housing and the connection disk, and the pressure in the pressure control chamber is transmitted to the polishing pad through the housing and the retaining ring.

[0019] Optionally, the inner ring of the sealant film is fixedly connected to the pressure connection block through a first sealing press ring, and the outer ring of the sealant film is fixedly connected to the housing through a second sealing press ring.

[0020] Optionally, the plurality of inner ring pressurizing chambers are respectively a first inner cavity, a second inner cavity, a third inner cavity and a fourth inner cavity arranged in sequence from outside to inside; The connection disk includes a first inner spacer ring, a sealing ring, and a second inner spacer ring; The end of the inner side cavity wall of the first inner cavity is tightly fixed between the first inner spacer ring and the housing, and the end of the outer side cavity wall of the first pressurizing cavity is tightly fixed between the housing and the retaining ring connector; The ends of the inner side cavity wall and the outer side cavity wall of the second inner cavity are tightly fixed between the sealing ring and the first inner spacer ring; The ends of the inner side cavity wall and the outer side cavity wall of the fourth inner cavity are tightly fixed between the second inner spacer ring and the first inner spacer ring.

[0021] Optionally, a connection post is provided on the second inner spacer ring, and the connection post extends into the pressure connection block and is slidably connected to the pressure connection block in the axial direction.

[0022] According to another aspect of the present invention, a polishing device is provided, including the above-mentioned pressing plate, or the above-mentioned bladder, or the above-mentioned polishing head.

[0023] According to another aspect of the present invention, a polishing method is provided, using the above-mentioned polishing head to polish a square substrate.

[0024] In the embodiment of the present invention, the pressing plate for polishing a square substrate includes an elastic plate and a circular hole. The circular hole is located in the middle of the elastic plate. The outer surface of the elastic plate includes a pressing surface, and the outer edge contour of the pressing surface matches the outer edge contour of the square substrate to be polished. The pressing surface is a spherical surface protruding towards the square substrate. During the process of transmitting pressure to the square substrate through the pressing surface, the pressing surface undergoes elastic deformation and gradually fits with the square substrate from the inside to the outside, forming a pressure distribution that gradually decreases from the inside to the outside on the square substrate.

[0025] On the one hand, during the process of transmitting pressure to the square substrate through the pressing surface of the elastic plate, the spherical pressing surface can generate elastic deformation, enabling a pressure distribution that gradually decreases from the inside to the outside to be formed on the square substrate, so as to compensate for the difference in material removal rate caused by the speed difference between the inner and outer regions of the square substrate, thereby achieving the technical effect of improving the material removal uniformity and surface flatness of the square substrate; On the other hand, when performing pressure zoning control on the square substrate, since the edge region of the square substrate also includes the corner regions, it is difficult for conventional control means to perform multi-zone pressure control on the corner regions, and there are obvious differences in material removal rate in the corner regions. In this embodiment, the spherical pressing surface can cover the corner regions at the same time, and also form a pressure distribution that gradually decreases from the inside to the outside in the corner regions, thereby ensuring the consistency of the material removal rate in the corner regions; On the further hand, since the pressing surface is a spherical surface protruding outward, the edge region of the pressing surface is higher than the central region, so as to compensate for the deformation caused by the self-weight of the edge region of the large-size polishing press head, and adjust the pressure additionally applied to the square substrate due to the deformation in the edge region of the polishing press head during the polishing process, further improving the material removal uniformity and surface flatness of the square substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings forming a part of the present invention are used to provide a further understanding of the present invention, making other features, objects, and advantages of the present invention more obvious. The schematic embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 is a schematic structural diagram of the pressing plate in an embodiment of the present invention; Figure 2 is a top view structural diagram of the pressing plate in an embodiment of the present invention; Figure 3 is Figure 2 a cross-sectional structural diagram of A-A in Figure 4 is Figure 2 a cross-sectional structural diagram of B-B in Figure 5 is a schematic diagram of the pressure distribution of the square substrate in an embodiment of the present invention; Figure 6 is a schematic diagram of the speed change on the square substrate in an embodiment of the present invention; Figure 7 is a schematic diagram of the pressure distribution of the square substrate in the P1 region in an embodiment of the present invention; Figure 8 is a schematic structural diagram of the film body in an embodiment of the present invention; Figure 9is a top view structural schematic diagram of the film body in an embodiment of the present invention; Figure 10 is Figure 9 a cross-sectional structural schematic diagram taken along C-C in; Figure 11 is Figure 9 a cross-sectional structural schematic diagram taken along D-D in; Figure 12 is a cross-sectional structural schematic diagram of the film body in an embodiment of the present invention; Figure 13 is Figure 12 a partial enlarged structural schematic diagram of; Figure 14 is a structural schematic diagram of the second pressure transmission member in an embodiment of the present invention; Figure 15 is a cross-sectional structural schematic diagram of the polishing head in an embodiment of the present invention; Figure 16 is a structural schematic diagram of each gas path channel of the polishing head in an embodiment of the present invention.

[0027] Wherein, 1, pressing plate; 101, pressing surface; 102, elastic plate; 103, support plate; 104, circular hole; 3, square substrate; 4, film body; 40, first pressurizing cavity; 41, second pressurizing cavity; 410, first inner cavity; 411, second inner cavity; 412, third inner cavity; 413, fourth inner cavity; 414, pressure control chamber; 415, annular groove; 416, auxiliary cavity; 5, first pressure transmission member; 6, second pressure transmission member; 7, support disk; 70, pressure connection block; 71, housing connection member; 72, housing; 73, retaining ring connection member; 74, retaining ring; 75, first sealing press ring; 76, second sealing press ring; 8, connection disk; 80, first inner spacer ring; 81, sealing ring; 82, second inner spacer ring; 820, connection column. Detailed implementation manners

[0028] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to implement the embodiments of the present invention described herein.

[0030] In the present invention, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0031] Moreover, in addition to being able to represent an orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0032] In addition, terms such as "arranged", "provided with", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In addition, the meaning of the term "a plurality of" should be two or more.

[0034] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0035] To solve the related technical problems, as Figures 1 to 4 shown, an embodiment of the present invention provides a pressing plate for polishing a square substrate. The pressing plate 1 includes an elastic plate 102 and a circular hole 104. The circular hole 104 is located in the middle of the elastic plate 102. The outer surface of the elastic plate 102 includes a pressing surface 101. The outer edge contour of the pressing surface 101 matches the outer edge contour of the square substrate 3 to be polished. The pressing surface 101 is a spherical surface protruding towards the square substrate 3. During the process of transmitting pressure to the square substrate through the pressing surface 101, the pressing surface 101 undergoes elastic deformation and gradually fits with the square substrate 3 from the inside to the outside, forming a pressure distribution that gradually decreases from the inside to the outside on the square substrate 3.

[0036] In this embodiment, the pressing plate 1 is adapted to the polishing pressure head and is used to transmit pressure to the polishing sheet during the polishing process. The pressing plate 1 can directly transmit the pressure head to the polishing sheet or transmit pressure to the polishing sheet through the film body 4 wrapped on the pressing plate 1. The pressing plate 1 includes an elastic plate 102 and a circular hole 104, wherein the circular hole 102 is located in the middle of the elastic plate 102, wherein the diameter of the circular hole is smaller than the maximum inscribed circle diameter of the square substrate. The side of the elastic plate facing the square substrate 3 is a pressure surface 101, and the side facing away from the square substrate 3 is connected to the polishing pressure head or the film body 4. The edge contour of the pressure surface 101 matches the edge contour of the square substrate 3. Specifically, the projection of the pressure surface 101 on the square substrate 3 can cover the edge of the square substrate 3, ensuring that the edge area of ​​the square substrate 3 can be subjected to pressure from the pressure surface 101. In one embodiment, the edge size of the pressure surface 101 is consistent with the edge size of the square substrate 3, or is larger in length and width.

[0037] The main reason for the different material removal rates between the inner and outer regions of the square substrate 3 is the difference in linear velocity between the inner and outer regions and the pressure difference caused by the edge deformation of the polishing head. Figure 5 and Figure 6 As shown, assuming that the square substrate 3 is divided into regions P1-P5, the square substrate 3 rotates around the center point O at an angular velocity of Rotation. Assume that in the square substrate 3, the distance from the center point O to the right angle point is , then the linear velocity of rotation in this area is approximately . The distance from the center point O to the right angle side is , then the linear velocity of rotation in this area is approximately .

[0038] Obviously in the square substrate 3, , According to Preston equation ( is the material removal rate, is the Preston constant, is the polishing pressure, is the instantaneous relative velocity of any point on the surface of the square substrate 3 relative to the polishing pad), under the same polishing pressure The material removal rate in the area is less than Material removal rate in the area.

[0039] like Figure 5 and Figure 6As shown, P2, P3, P4, and P5 are circular regions. The velocity distribution is a gradient distribution along the radial direction, the same in the circumferential direction, and gradually increases from the inside to the outside. To achieve a uniform material removal rate, the pressure distribution trend of the square substrate 3 is P5 > P4 > P3 > P2 > P1. Since the P1 pressure region is located at the edge region of the square substrate 3, and the edge region is square, the linear velocity distribution is different in the circumferential direction, that is . Therefore, the pressure distribution in the P1 region should correspond to the velocity.

[0040] According to the material removal rate equation, to maintain the same material removal rate, when the relative velocity increases, the pressure can be reduced. And reducing the pressure can also compensate for the pressure change caused by the edge deformation of the polishing head. For this reason, as Figure 1 、 Figure 3 and Figure 4 shown, in this embodiment, the elastic plate 102 has elasticity, and the pressure application surface 101 on the elastic plate 102 is set as a spherical surface protruding towards the square substrate 3. The material of the elastic plate 102 is rubber or elastic resin.

[0041] Specifically, after such a setting, during the process of transmitting pressure to the square substrate 3 through the pressure application surface 101, the elastic plate 102 deforms and the spherical pressure application surface 101 gradually fits with the square substrate 3 from the inside to the outside, so that the inner region of the square substrate 3 bears a greater pressure and the outer region bears a smaller pressure. Finally, a pressure distribution that gradually decreases from the inside to the outside is formed on the square substrate 3, and the pressure distribution trend is a linear change. Since the pressure in the outer region is smaller, even if the relative velocity in the outer region is greater, a consistent material removal rate can be maintained. Especially for the corner regions of the square substrate 3 (that is, the regions near the four corners of the P1 region), a pressure distribution that gradually decreases from the inside to the outside can also be formed to ensure the consistency of the material removal rate in this region. At the same time, the reduced pressure in the outer region can also synchronously compensate for the pressure change caused by the deformation of the polishing head.

[0042] When polishing an extra-large and ultra-thin square substrate 3, due to the large size of the glass substrate, if it is necessary to transmit pressure to the entire glass substrate through the pressure application surface 101 of the pressing plate 1, the pressure application surface 101 needs to be a complete spherical surface, and the height difference between the central region and the edge region of the pressure application surface 101 is relatively large. When the pressure application surface 101 is completely attached to the glass substrate, the middle region of the pressure application surface 101 may apply too much pressure to the glass substrate, resulting in breakage of the relatively thin glass substrate.

[0043] For this reason, in this embodiment, it is preferably that the pressure application surface 101 only transmits pressure to the edge region of the square substrate 3, that is, only transmits pressure to the P1 region. To achieve this purpose, as Figure 1 and Figure 2As shown in the figure, a circular hole 104 is provided in the middle of the pressing plate 1, and the middle circular area of the square substrate 3, that is, the P2 - P5 area, is avoided through the circular hole 104.

[0044] Specifically, in this embodiment, by providing a circular hole 104 in the middle of the pressing plate 1, the circular hole 104 corresponds to the middle circular area of the square substrate 3, so that when the pressing plate 1 transfers pressure to the substrate, it can avoid the middle circular area of the square substrate 3 and only transfer the pressure to the edge area of the square substrate 3. When the pressing plate 1 and the square substrate 3 are vertically corresponding, during the polishing process, the edge areas of the square substrate 3 outside the circular hole 104 are all subjected to the pressure transmitted by the pressing surface 101. After being combined with the film body 4, the film body 4 can separately transfer pressure to the middle circular area of the square substrate 3 through the circular hole 104.

[0045] In one implementation, the diameter of the circular hole 104 is slightly smaller than the length of the short side of the square substrate 3, so as to minimize the contact area between the pressing surface 101 of the pressing plate 1 and the square substrate 3 during the polishing process. However, in any case, the pressing surface 101 of the pressing plate 1 always needs to transfer the pressure to the corner areas of the square substrate 3. The corner areas are part of the edge areas, and it is difficult to perform zonal pressure control on the corner areas through the film body 4. By using the pressing plate 1 in this embodiment, a linearly varying pressure distribution can be formed in the corner areas relatively simply to ensure the consistency of the material removal rate.

[0046] Specifically, as Figure 7 shown, the edge area P1 of the square substrate 3 corresponding to the pressing surface 101 can be divided into a P1 - 2 pressure area, a P1 - 3 pressure area, a P1 - 4 pressure area, and a P1 - 5 pressure area. Among them, the P1 - 2 pressure area is the area including the inscribed circle of the square substrate 3, and the P1 - 3 pressure area, the P1 - 4 pressure area, and the P1 - 5 pressure area are for the corner areas of the square substrate 3. From the perspective of relative speed, P1 - 2 < P1 - 3 < P1 - 4 < P1 - 5, and from the perspective of pressure distribution, P1 - 2 > P1 - 3 > P1 - 4 > P1 - 5. Therefore, according to the material removal rate equation, a relatively uniform material removal rate can be obtained in practical applications, so as to achieve a better polishing effect. It should be noted that since the pressing surface 101 is a spherical surface, for each pressure area, its pressure distribution is still a gradually decreasing distribution form from the inside to the outside, so that the entire pressure area can present a linearly varying pressure distribution.

[0047] On the one hand, in the process of transmitting pressure to the square substrate 3 through the pressing surface 101 of the pressing plate 1, the spherical pressing surface 101 can produce elastic deformation, so that a pressure distribution gradually decreasing from the inside to the outside can be formed on the square substrate 3, so as to compensate for the difference in material removal rate caused by the speed difference between the inner and outer regions of the square substrate 3, thus achieving the technical effect of improving the material removal uniformity and surface flatness of the square substrate 3; On the other hand, when performing pressure zone control on the square substrate 3, since the edge region of the square substrate 3 also includes the vertex region, it is difficult for conventional control means to perform multi-zone pressure control on the vertex region, and there are obvious differences in material removal rate in the vertex region. In this embodiment, the spherical pressing surface 101 can cover the vertex region at the same time, and also form a pressure distribution gradually decreasing from the inside to the outside in the vertex region, so as to ensure the consistency of the material removal rate in the vertex region; On the other hand, since the pressing surface 101 is a spherical surface protruding outward, the edge region of the pressing surface 101 is higher than the central region, so that the deformation caused by the self-weight of the edge region of the large-size polishing head can be compensated, so as to adjust the pressure additionally applied to the square substrate 3 due to the deformation in the edge region of the polishing head during the polishing process, and further improve the material removal uniformity and surface flatness of the square substrate 3.

[0048] In an embodiment of the pressing plate 1, due to the elastic plate 102 of the pressing plate 1 and the need to produce deformation when transmitting pressure. Therefore, in order to better transmit the pressure to the pressing surface 101 of the elastic plate 102, as Figure 1 shown, the pressing plate 1 in this embodiment further includes a support plate 103, and the support plate 103 is attached to the side of the elastic plate 102 facing away from the pressing surface 101.

[0049] Specifically, in this embodiment, the edges of the support plate 103 and the elastic plate 102 coincide. The support plate 103 can be a rigid plate body with higher stiffness, so that the pressure can be directly transmitted to the elastic plate 102. Both side surfaces of the support plate 103 can be flat surfaces. The elastic plate 102 is an elastic member with lower rigidity, so that it can better produce deformation to achieve the set pressure distribution form. One side surface of the elastic plate 102 is a flat surface, and the other side surface is a spherical pressing surface 101. The flat side of the elastic plate 102 is attached to any surface of the support plate 103 and bonded into a whole.

[0050] In an embodiment, as Figure 1 and Figure 5As shown, the pressing plate 1 is a square plate body, and the outer contour of the pressing plate 1 matches the outer contour of the square substrate 3. Specifically, in this embodiment, the length and width dimensions of the pressing plate 1 are the same as those of the square substrate 3, which improves the shape matching degree between the pressing plate 1 and the square substrate 3. When adapting to the polishing head, it does not occupy a larger space, and to a certain extent, reduces the size of the polishing head.

[0051] According to another aspect of the present invention, as Figures 8 to 14 shown, a capsule film for polishing a square substrate is provided, including: a film body 4 and the above-mentioned pressing plate 1. The film body 4 includes a first pressurizing cavity 40, and the pressing plate 1 is arranged in the first pressurizing cavity 40. The pressure transmitted from the pressing surface 101 of the pressing plate 1 to the square substrate 3 is controlled by controlling the pressure in the first pressurizing cavity 40.

[0052] In this embodiment, as Figures 10 to 12 shown, the pressure of the pressing plate 1 comes from the pressure in the first pressurizing cavity 40 in the film body 4. The film body 4 can be adapted to the polishing head and has a certain elasticity. When forming a closed chamber, the pressure transmitted outward by the film body 4 can be controlled by controlling the pressure in the chamber. As Figure 8 and Figure 9 shown, the middle part of the film body 4 has a circular side wall, and the edge has a square side wall. The film body 4 includes at least a first pressurizing cavity 40. The square side wall at the edge of the film body 4 and a part of the circular side wall outside the middle circular side wall form the wall of the first pressurizing cavity 40. The pressing plate 1 can be installed inside the film body 4 or on the side of the film body 4 close to the square substrate 3. When the pressing plate 1 is installed inside the film body 4, the film body 4 can be located at the bottom of the first pressurizing cavity 40, so that the pressure change in the first pressurizing cavity 40 can be transmitted to the pressing plate 1. In this embodiment, the pressure transmitted from the pressing surface 101 of the pressing plate 1 to the square substrate 3 is controlled by controlling the pressure in the first pressurizing cavity 40.

[0053] In one implementation manner, the first pressurizing cavity 40 corresponds to the first area of the square substrate 3. The film body 4 further includes a second pressurizing cavity 41. The second pressurizing cavity 41 is located in the circular hole 104 on the pressing plate 1, and the second pressurizing cavity 41 corresponds to the second area of the square substrate 3. The pressure is transmitted to the second area by controlling the pressure in the second pressurizing cavity 41; The second area is the inner ring area of the square substrate 3 (i.e., the P2 - P5 area), and the first area is the edge area outside the inner ring area of the square substrate 3 (i.e., the P1 area).

[0054] In this embodiment, as Figure 12As shown, the membrane body 4 includes a first pressure chamber 40 and a second pressure chamber 41. The first pressure chamber 40 is used to transmit pressure to the first area of the square substrate 3, and during the polishing process, the first pressure chamber 40 corresponds to the first area of the square substrate 3. The second pressure chamber 41 is used to transmit pressure to the second area of the square substrate 3, and during the polishing process, the second pressure chamber 41 corresponds to the second area of the square substrate 3. The pressure is transmitted to the entire square substrate 3 through the first pressure chamber 40 and the second pressure chamber 41. In this embodiment, the second pressure chamber 41 can be integrally in a circular area, and correspondingly, the second area corresponding to the second pressure chamber 41 is the inner circular area of the square substrate 3, such as Figure 5 the P2 to P5 areas shown, and this area is integrally circular. The second pressure chamber 41 is close to the edge of the membrane body 4, and correspondingly, the first area corresponding to the first pressure chamber 40 is the edge area of the square substrate 3 outside the inner circular area, such as Figure 5 the P1 area shown, and this area includes the four corner areas of the square substrate 3.

[0055] In this embodiment, the pressure of the first pressure chamber 40 is transmitted to the square substrate 3 through the pressing plate 1. The circular through-hole on the pressing plate 1 is in the area of the second pressure chamber 41, so that the part of the membrane body 4 corresponding to the area of the second pressure chamber 41 can contact the square substrate 3 through the circular through-hole, so that the pressure of the second pressure chamber 41 can be directly transmitted to the square substrate 3. In this embodiment, the pressures in the first pressure chamber 40 and the second pressure chamber 41 can be controlled separately, so that the pressures borne by the inner circular area and the edge area of the square substrate 3 can be controlled separately.

[0056] For the edge area, since the pressure is transmitted through the pressing plate 1, the spherical pressing surface 101 on the pressing plate 1 can form a pressure distribution that gradually decreases from the inside to the outside on the edge area. For the inner circular area, the zoned pressure control can also be carried out. Since the inner circular area is a regular circular area, the zoned pressure control is relatively easy. In one implementation, the inner circular area can be divided into multiple concentric areas, such as Figure 5 the P2 to P5 shown. Correspondingly, as Figure 12 shown, the second pressure chamber 41 can be divided into chambers corresponding to P2 to P5 respectively. By controlling the pressure in each chamber separately, the pressure transmitted to each concentric area can be controlled, so as to form a pressure distribution with a gradient change in the inner circular area of the square substrate 3. Finally, the entire square substrate 3 has a pressure distribution form in which the pressure decreases from the inside to the outside, and combined with the change in the speed of each area on the square substrate 3, a uniform material removal rate is achieved.

[0057] In one embodiment, the inner circle area of the square substrate 3 is a circular area, and it is easier and more flexible to control the pressure in zones. Therefore, to reduce the overall control difficulty, the divided inner circle area is close to the edge of the square substrate 3, that is, the diameter of the inner circle area is close to the length of the short side of the square substrate 3. At this time, the obtained edge area includes a narrow area near the foot of the perpendicular from the center of the inner circle area to each side of the square substrate 3.

[0058] Since the first pressure chamber 40 corresponds to the edge area, when the first pressure chamber 40 includes the first pressure chamber 400, the first pressure chamber 400 also has a narrow area corresponding to the narrow area on the edge area. As Figure 8 shown, since the film body 4 further includes a second pressure chamber 41 corresponding to the inner circle area, a part of the second pressure chamber 41 will be close to the narrow area on the first pressure chamber 400. To prevent the second pressure chamber 41 from squeezing the narrow area on the first pressure chamber 400 due to increased pressure, in this embodiment, the positions of the first pressure chamber 400 and the second pressure chamber 41 on the film body 4 are adjusted. Specifically, as Figure 12 shown, in this embodiment, the first pressure chamber 400 is located at the edge position of the film body 4 and at the first end of the film body 4. As Figure 12 shown, the first pressure chamber 400 is located at the upper part of the film body 4.

[0059] The pressing plate 1 is arranged at the second end of the film body 4. The pressing plate 1 is axially corresponding to the first pressure chamber 400. The pressure in the first pressure chamber 400 is transmitted downward to the pressing plate 1 and then transmitted downward by the pressing plate 1. The second pressure chamber 41 is located at the second end of the film body 4, that is, at the lower part of the film body 4. The pressure in the second pressure chamber 41 is directly transmitted to the inner circle area of the square substrate 3 through the lower end of the film body 4.

[0060] Since in this embodiment, the first pressure chamber 400 of the first pressure chamber 40 and the second pressure chamber 41 are respectively arranged at the upper and lower parts of the film body 4, the squeezing effect on the first pressure chamber 400 caused by the increase in the pressure of the second pressure chamber 41 can be reduced, thereby ensuring normal pressure control in the first pressure chamber 400.

[0061] In one embodiment, as Figure 12 shown, the pressing plate 1 is wrapped in the film body 4, and the edge of the second end of the film body 4 can be closely attached to the surface of the pressing plate 1.

[0062] Specifically, in this embodiment, after the second end of the film body 4 is wrapped around the pressing plate 1, the lower end surface of the film body 4 is a flat surface, enabling the lower end surface of the film body 4 to fully conform to the square substrate 3. At this time, the pressing plate 1 transmits pressure to the square substrate 3 through the corresponding part of the lower end surface of the film body 4 that corresponds to the edge area of the square substrate 3. The pressure in the second pressure chamber 41 is transmitted to the square substrate 3 through the part of the lower end surface of the film body 4 that corresponds to the inner ring area of the square substrate 3.

[0063] Meanwhile, the film body 4 has good flexibility. After wrapping the pressing plate 1, the pressure of the pressing plate 1 needs to be transmitted to the square substrate 3 through the film body 4, and the film body 4 can also play a role in protecting the square substrate 3.

[0064] As described above, the first pressure chamber 400 has a narrow area. To avoid being squeezed by the second pressure chamber 41, the first pressure chamber 400 is arranged at the first end (i.e., the upper part) of the film body 4, while the pressing plate 1 is arranged at the second end (i.e., the lower part) of the film body 4. At this time, to ensure that the pressure in the first pressure chamber 400 can be transmitted to the pressing plate 1, as Figure 12 shown, in this embodiment, a first pressure transmission member 5 is provided at the bottom of the first pressure chamber 400. The first pressure transmission member 5 corresponds axially to the pressing plate 1, and the pressure in the first pressure chamber 400 is transmitted to the pressing plate 1 through the first pressure transmission member 5.

[0065] Specifically, the first pressure transmission member 5 has a relatively high-rigidity structure, such as a metal bar or a metal column. The first pressure transmission member 5 is embedded in the lower part of the first pressure chamber 400 and corresponds to the pressing plate 1 vertically. After setting the first pressure transmission member 5, the lower part of the first pressure chamber 400 has higher rigidity, and the upper part of the first pressure chamber 400 remains a cavity. The pressure in the cavity of the first pressure chamber 400 is transmitted downward to the pressing plate 1 through the first pressure transmission member 5, and is transmitted to the square substrate 3 by the pressing plate 1 through the lower end surface of the film body 4.

[0066] In one embodiment, as Figures 8 to 11 shown, the first pressure transmission member 5 is a metal column, and a plurality of first pressure transmission members 5 are provided and arranged orderly in the lower part of the first pressure chamber 400.

[0067] On the basis of the above embodiment, to better conduct pressure transmission, as Figure 12 and Figure 13 shown, in this embodiment, an annular groove 415 is provided on the outer ring side of the film body 4. The annular groove 415 is located between the first pressure chamber 400 and the pressing plate 1. A second pressure transmission member 6 is provided in the annular groove 415. The pressure in the first pressure chamber 400 is transmitted to the second pressure transmission member 6 through the first pressure transmission member 5, and then is transmitted to the pressing plate 1 by the second pressure transmission member 6.

[0068] Specifically, in this embodiment, the second pressure transmission member 6 can be a plate-like structure with a relatively high stiffness (such as Figure 14 shown). The middle part of the outer ring side of the film body 4 is recessed to form an annular groove 415. The upper end surface of the second pressure transmission member 6 is attached to the top surface of the annular groove 415, and the lower end surface of the second pressure transmission member 6 is attached to the bottom surface of the annular groove 415.

[0069] In one embodiment, as Figure 12 shown, the first pressurizing chamber 40 includes a first pressurizing chamber 400. The second pressurizing chamber 41 includes a plurality of inner ring pressurizing chambers arranged in sequence from outside to inside. The plurality of inner ring pressurizing chambers respectively correspond to a plurality of regions in the second region, and the pressure in each inner ring pressurizing chamber is separately controlled to transmit pressure to different regions in the second region.

[0070] Specifically, in this embodiment, in order to achieve zoned pressure control of the inner ring region of the square substrate 3, the second pressurizing chamber 410 is set as a plurality of inner ring pressurizing chambers, and the plurality of inner ring pressurizing chambers are distributed radially. The plurality of inner ring pressurizing chambers can be concentrically arranged, and they respectively correspond to the regions concentrically distributed on the inner ring region (i.e., the second region) of the square substrate 3. In this embodiment, the pressure transmitted from the lower end surface of the film body 4 to different regions in the inner ring region is controlled by separately controlling the pressure in each inner ring pressurizing chamber.

[0071] In one embodiment, as Figure 12 shown, the plurality of inner ring pressurizing chambers are respectively a first inner cavity 410, a second inner cavity 411, a third inner cavity 412, and a fourth inner cavity 413 arranged in sequence from outside to inside. As Figure 5 shown, the inner ring region of the square substrate 3 is divided into a P2 pressure region, a P3 pressure region, a P4 pressure region, and a P5 pressure region. The second pressurizing chamber 410 corresponds to the P2 pressure region, the second inner cavity 411 corresponds to the P3 pressure region, the third inner cavity 412 corresponds to the P4 pressure region, and the fourth inner cavity 413 corresponds to the P5 pressure region.

[0072] For the film body 4, each pressurizing chamber is a cavity with an upper opening on the film body 4. To achieve pressure control, the opening of this cavity needs to be closed. In the specific implementation process, the film body 4 can be cooperatively installed on the rigid structure of the polishing head, and the openings of each cavity are closed through the rigid structure, so as to form a plurality of independent pressurizing chambers in the film body 4. The pressure in each pressurizing chamber can be separately controlled, thereby achieving zoned pressure control of the square substrate 3.

[0073] When the pressures in the first pressure chamber 400 and the inner ring pressure chamber increase, the bottom of the diaphragm 4 corresponding to the first pressure chamber 400 and the inner ring pressure chamber is subjected to a downward pressure. The side walls of the first pressure chamber 400 and the side walls of the inner ring pressure chamber generate an upward tensile elastic force under the action of this downward pressure, resulting in an upward convex deformation at the positions of the bottom of the diaphragm 4 corresponding to the respective side walls. This causes the diaphragm 4 to be unable to exert a uniform pressure on the polishing wafer, and the polishing effect deteriorates.

[0074] Therefore, in this embodiment, as Figure 13 shown, at least a part of the side wall of the first pressure chamber 400 and the side wall of the inner ring pressure chamber are bent to form a bent portion. During the downward movement of the diaphragm 4, the bent portion unfolds to provide a displacement amount for the unbent part of the side wall.

[0075] Specifically, the first pressure chamber 400 includes side walls 4-1 and 4-2, the second pressure chamber 410 includes side walls 4-2 and 4-3, the second inner cavity 411 includes side walls 4-3 and 4-4, the third inner cavity 412 includes side walls 4-4 and 4-5, and the fourth inner cavity 413 includes side wall 4-5. Bent portions are formed by bending the upper parts of the respective side walls. The bent portions are 4-1-1, 4-2-1, 4-3-1, 4-4-1, 4-5-1 as Figure 13 shown. When the pressures in the respective pressure chambers increase, the respective side walls generate an upward tensile elastic force. The elastic force acts on the bent portion to cause a certain degree of unfolding of the bent portion, thereby absorbing the tensile force of the side wall on the bottom of the diaphragm 4, and further preventing the bottom of the diaphragm 4 from generating an upward convexity. In one embodiment of the bent portion, the bent portion is a semi-circular structure.

[0076] To facilitate the rigid structure connection between the diaphragm 4 and the polishing head to seal the respective pressure chambers, in this embodiment, a sealing ring structure is provided at the opening positions of the diaphragm 4 corresponding to the respective pressure chambers, such as Figure 13 4-1-2, 4-2-2, 4-3-2, 4-4-2, 4-5-2 shown. The sealing ring structure and the corresponding rigid structure cooperate to play an airtight role.

[0077] According to another aspect of the present invention, as Figure 15 and Figure 16 shown, a polishing head is provided, including the above-mentioned bladder membrane.

[0078] In one embodiment, it further includes a support disk 7 and a connection disk 8. The diaphragm 4 is connected to the support disk 7 through the connection disk 8. The first pressure chamber 40 is located between the diaphragm 4 and the support disk 7, and the second pressure chamber 41 is located between the diaphragm 4 and the connection disk 8.

[0079] In this embodiment, the upper opening of the first pressurizing chamber 40 on the membrane body 4 is closed by the support disc 7, and the upper opening of the area of the second pressurizing chamber 410 is closed by the connecting disc 8. At the same time, the membrane body is fixedly connected to the support disc 7, so that the membrane body 4 is installed on the support disc 7. For the convenience of pressure control, a plurality of gas path channels are provided in the support disc 7, and the plurality of gas path channels are respectively communicated with the first pressurizing chamber 40 and the second pressurizing chamber 41.

[0080] In one implementation, as Figure 15 shown, the support disc 7 includes a pressure connection block 70, a housing 72, a housing connection member 71, a retaining ring 74, and a retaining ring connection member 73; The pressure connection block 70 is used for fixedly connecting with the machine tool equipment. The housing 72 is connected to the pressure connection block 70 through the housing connection member 71, and the retaining ring 74 is connected to the housing 72 through the retaining ring connection member 73. The retaining ring 74 surrounds the periphery of the membrane body 4; The first pressurizing chamber 40 is located between the membrane body 4 and the housing 72, and the connecting disc 8 is connected to the housing 72.

[0081] Specifically, in this embodiment, the pressure connection block 70 is the middle structure of the support disc 7. The upper end of the pressure connection block 70 is used for fixedly connecting with the machine tool equipment. The lower end of the pressure connection block 70 is connected to the housing 72 through the housing connection member 71, and the lower end of the housing 72 is connected to the retaining ring 74 through the retaining ring connection member 73. For the polishing of the square substrate 3, in this embodiment, both the housing 72 and the retaining ring 74 are square. The membrane body 4 is connected to the housing 72 through the connecting disc 8, and the lower part of the membrane body 4 is located in the space surrounded by the retaining ring 74. During the polishing process, the lower end surface of the retaining ring 74 contacts the polishing pad and transmits pressure to the polishing pad, and the membrane body 4 contacts the square substrate 3 on the polishing pad and transmits pressure to the square substrate 3. The first pressurizing chamber 40 on the membrane body 4 corresponds to the inner edge area of the housing 72, and the first pressurizing chamber 40 is closed by the housing 72.

[0082] In one implementation, the housing connection member 71 includes an annular sealing rubber film. The inner ring of the sealing rubber film is fixedly connected to the pressure connection block 70, and the outer ring of the sealing rubber film is fixedly connected to the housing 72; A closed pressure control chamber 414 is formed among the sealing rubber film, the pressure connection block 70, the housing 72, and the connecting disc 8. The pressure in the pressure control chamber 414 is transmitted to the polishing pad through the housing 72 and the retaining ring 74.

[0083] Specifically, in this embodiment, after the pressure control chamber 414 is formed by the sealing film, the pressure in the pressure control chamber 414 can be controlled to press the housing 72, the retaining ring connector 73, the retaining ring 74, the connecting disk 8 and the film body 4 downward relative to the pressure connection block 70, so as to apply a certain pressure to the polishing pad. On this basis, the first pressurizing chamber 40 and the second pressurizing chamber 41 on the film body 4 can also be used to apply pressure to the square substrate 3 separately.

[0084] In one embodiment, the sealing film is annular. The inner ring of the sealing film is fixedly connected to the pressure connection block 70 through the first sealing pressing ring 75, and the outer ring of the sealing film is fixedly connected to the housing 72 through the second sealing pressing ring 76. Specifically, the inner ring of the sealing film is tightly fixed on the upper surface of the pressure connection block 70 through the first sealing pressing ring 75, and the outer ring of the sealing film is tightly fixed on the upper surface of the housing 72 through the second sealing pressing ring 76. To ensure sufficient airtightness, corresponding sealing structures can be provided for the inner ring and the outer ring of the sealing film.

[0085] The middle part of the sealing film can be bent downward, and the bent part is used to provide displacement for the stretching of the sealing film, so as to facilitate the downward movement of the housing 72, the retaining ring connector 73, the retaining ring 74, the connecting disk 8 and the film body 4 as a whole relative to the pressure connection block 70.

[0086] In one embodiment, as Figure 15 shown, the multiple inner ring pressurizing chambers are respectively the second pressurizing chamber 410, the second inner cavity 411, the third inner cavity 412 and the fourth inner cavity 413 arranged in sequence from outside to inside; The connecting disk 8 includes a first inner spacer 80, a sealing ring 81, and a second inner spacer 82; The end of the inner cavity wall of the first pressurizing chamber 400 is tightly fixed between the first inner spacer 80 and the housing 72, and the end of the outer cavity wall of the first pressurizing chamber 400 is tightly fixed between the housing 72 and the retaining ring connector 73; The ends of the inner cavity wall and the outer cavity wall of the second inner cavity 411 are tightly fixed between the sealing ring 81 and the first inner spacer 80; The ends of the inner cavity wall and the outer cavity wall of the fourth inner cavity 413 are tightly fixed between the second inner spacer 82 and the first inner spacer 80; The second pressurizing chamber 410 is located between the edge area of the first inner spacer 80 and the film body 4, the second inner cavity 411 is located between the sealing ring 81 and the film body 4, the third inner cavity 412 is located between the middle area of the first inner spacer 80 and the film body 4, and the fourth inner cavity 413 is located between the second inner spacer 82 and the film body 4.

[0087] Specifically, in this embodiment, the second pressure chamber 410, the second inner chamber 411, the third inner chamber 412, and the fourth inner chamber 413 are concentrically distributed, forming the P2 pressure region, the P3 pressure region, the P4 pressure region, and the P5 pressure region as shown in the figure respectively. The fourth inner chamber 413 is a circular chamber, and the second pressure chamber 410, the second inner chamber 411, and the third inner chamber 412 are all annular. To facilitate the installation of the pressing plate 1, in this embodiment, the lower part of the membrane body 4 further includes a secondary chamber 416. The secondary chamber 416 is located at the lower edge position of the membrane body 4, matches the shape of the pressing plate 1, and is communicated with the second pressure chamber 410. The pressing plate 1 can be installed into the secondary chamber 416 through the second pressure chamber 410.

[0088] The first inner spacer 80 is an annular plate-like structure, the second inner spacer 82 is a circular plate-like structure, and the sealing ring 81 is an annular plate-like structure. The first pressure chamber 400 includes an inner chamber wall and an outer chamber wall distributed oppositely. The upper end of the outer chamber wall is tightly fixed between the lower end of the housing 72 and the upper end of the retaining ring connecting member 73, and the upper end of the outer chamber wall is tightly fixed between the inner top surface of the housing 72 and the upper end surface of the first inner spacer 80. The outer chamber wall and the inner chamber wall of the second inner chamber 411 are both tightly fixed between the lower end surface of the first inner spacer 80 and the upper end surface of the sealing ring 81, thereby closing the second inner chamber 411. At the same time, the second pressure chamber 410 is closed by the first inner spacer 80. The inner chamber wall and the outer chamber wall of the fourth inner chamber 413 are both tightly fixed between the lower end surface of the first inner spacer 80 and the upper end surface of the second inner spacer 82. At the same time, the third inner chamber 412 is closed by the first inner spacer 80.

[0089] Since the housing 72 and the pressure connection block 70 are connected by a sealing glue film, and the sealing glue film has a certain flexibility, it is easy for the housing 72 and the parts connected to the housing 72 to be displaced radially. At the same time, since the housing 72 and the parts connected to the housing 72 need to move axially relative to the pressure connection block 70. Therefore, to limit the radial position of the housing 72 and the parts connected to the housing 72 and provide guidance for its axial movement, in this embodiment, connection columns are provided on the second inner spacer 82. The connection columns extend into the pressure connection block 70 and are slidably connected to the pressure connection block 70 axially.

[0090] To achieve independent control of the pressures in each pressure chamber and the pressure control chamber, as Figure 16 shown, in this embodiment, the air passage channels on the polishing pressing head include a first channel 90, a second channel 98, a third channel 91, a fourth channel 97, a fifth channel 92, a sixth channel 94, a seventh channel 93, an eighth channel 96, and a ninth channel 95.

[0091] The first channel 90 is provided on the housing 72 and communicates with the first pressurizing chamber 400. A pipe joint is provided at the upper end of the first channel 90 and is connected to an air pump through the pipe joint to supply and pressurize the first pressurizing chamber 400.

[0092] The second channel 98 is provided on the first inner spacer 80 and communicates with the second pressurizing chamber 410. The third channel 91 is provided on the pressure connection block 70. The third channel 91 and the second channel 98 are connected through a pipe joint and a hose, and the third channel 91 is connected to an air pump to supply and pressurize the second pressurizing chamber 410.

[0093] The fourth channel 97 is provided on the first inner spacer 80 and the sealing ring 81. The fifth channel 92 is provided on the pressure connection block 70. The fourth channel 97 and the fifth channel 92 are connected through a pipe joint and a hose, and the fifth channel 92 is connected to an air pump to supply and pressurize the second inner cavity 411.

[0094] The sixth channel 94 is provided on the pressure connection block 70 and communicates with the pressure control chamber. The sixth channel 94 is also connected to an air pump to supply and pressurize the pressure control chamber 414.

[0095] The seventh channel 93 is provided on the second inner spacer 82 and can penetrate the connecting column on the second inner spacer 82. The seventh channel 93 communicates with the fourth inner cavity 413 and is connected to an air pump to supply and pressurize the fourth inner cavity 413.

[0096] The eighth channel 96 is provided on the first inner spacer 80 and communicates with the third inner cavity 412. The ninth channel 95 is provided on the pressure connection block 70. The eighth channel 96 and the ninth channel 95 are connected through a pipe joint and a hose, and the ninth channel 95 is connected to an air pump to supply and pressurize the third inner cavity 412.

[0097] According to another aspect of the present invention, there is provided a polishing device including the above-mentioned pressing plate 1, or the above-mentioned capsule film, or the above-mentioned polishing head.

[0098] According to another aspect of the present invention, there is provided a polishing method using the above-mentioned polishing head to polish a square substrate.

[0099] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A pressing plate for polishing a square substrate, characterized in that, The pressing plate includes an elastic plate and a circular hole, wherein the circular hole is located in the middle of the elastic plate, and the outer surface of the elastic plate includes a pressure surface, wherein the outer edge contour of the pressure surface matches the outer edge contour of the square substrate to be polished, and the pressure surface is a spherical surface protruding toward the square substrate. In the process of transmitting pressure to the square substrate through the pressure surface, the pressure surface undergoes elastic deformation and gradually fits with the square substrate from the inside to the outside, thereby forming a pressure distribution on the square substrate that gradually decreases from the inside to the outside.

2. The platen for polishing a square substrate according to claim 1, wherein, The pressing plate further comprises a supporting plate, and the supporting plate is in contact with a side of the elastic plate which is away from the pressing surface.

3. The pressing plate for polishing a square substrate according to claim 1, wherein The elastic plate is made of rubber or elastic resin.

4. A bladder film for polishing a square substrate, characterized in that, include: A membrane body and a pressure plate as described in any one of claims 1 to 3, wherein the membrane body includes a first pressurizing chamber, the pressure plate is arranged in the first pressurizing chamber, and the pressure transmitted from the pressure surface to the square substrate is controlled by controlling the pressure in the first pressurizing chamber.

5. The bladder film for polishing a square substrate according to claim 4, wherein The first pressurized chamber corresponds to the first area of ​​the square substrate, and the membrane body also includes a second pressurized chamber, which is located in the circular hole. The second pressurized chamber corresponds to the second area of ​​the square substrate, and pressure is transmitted to the second area by controlling the pressure in the second pressurized chamber.

6. The bladder film for polishing a square substrate according to claim 4, wherein, The pressing plate is wrapped in the membrane body, and the pressing plate is located outside the first pressurizing chamber.

7. The bladder film for polishing a square substrate according to claim 6, characterized in that, A first pressure transmission component is disposed at the bottom of the first pressurizing chamber. The first pressure transmission component corresponds to the pressure plate axially, and the pressure in the first pressurizing chamber is transmitted to the pressure plate through the first pressure transmission component.

8. The bladder film for square substrate polishing according to claim 7, wherein An annular groove is provided on the outer ring side of the membrane body, and the annular groove is located between the first pressurizing chamber and the pressure plate. A second pressure transmission component is provided in the annular groove. The pressure in the first pressurizing chamber is transmitted to the second pressure transmission component through the first pressure transmission component, and then transmitted to the pressure plate by the second pressure transmission component.

9. The bladder film for polishing a square substrate according to claim 5, characterized in that, The second pressurizing chamber includes a plurality of inner ring pressurizing chambers arranged sequentially from the outside to the inside, and the plurality of inner ring pressurizing chambers respectively correspond to a plurality of areas of the second region. Pressure is transmitted to different areas within the second region by individually controlling the pressure in each inner ring pressurizing chamber.

10. The bladder film for polishing a square substrate according to claim 9, wherein, At least a portion of the side wall of the first pressurizing chamber and the side wall of the inner ring pressurizing chamber are bent to form a bent portion, and the bent portion is expanded during the downward pressing movement of the membrane to provide displacement for the unbent portion of the side wall.

11. A polishing head, characterized in that, Comprising the capsule membrane according to any one of claims 4 to 10.

12. The polishing head according to claim 11, wherein, The polishing pressure head also includes: a connecting plate, a pressure connecting block, a housing, a housing connecting piece, a retaining ring and a retaining ring connecting piece; The membrane body is connected to the connecting plate, the pressure connecting block is used to be fixedly connected to the machine equipment, the shell is connected to the pressure connecting block through a shell connecting piece, the retaining ring is connected to the shell through the retaining ring connecting piece, the retaining ring surrounds the membrane body, and the retaining ring is used to constrain the square substrate within the retaining ring.

13. The polishing head according to claim 12, wherein, The housing connector includes an annular sealing rubber film, the inner ring of the sealing rubber film is fixedly connected to the pressure connection block, and the outer ring of the sealing rubber film is fixedly connected to the housing; A closed pressure control chamber is formed among the sealing rubber film, the pressure connection block, the housing and the connection disc, and the pressure in the pressure control chamber is transmitted to the polishing pad through the housing and the retaining ring.

14. The polishing head according to claim 13, wherein The inner ring of the sealing rubber film is fixedly connected to the pressure connection block through a first sealing pressing ring, and the outer ring of the sealing rubber film is fixedly connected to the housing through a second sealing pressing ring.

15. The polishing head according to claim 14, characterized in that, When the film body further includes a second pressurizing chamber, and the second pressurizing chamber includes a plurality of inner ring pressurizing chambers arranged in sequence from outside to inside, the plurality of inner ring pressurizing chambers are respectively a first inner cavity, a second inner cavity, a third inner cavity and a fourth inner cavity arranged in sequence from outside to inside; The connection disc includes a first inner spacer, a sealing ring and a second inner spacer; The end of the inner side wall of the first inner cavity is tightly fixed between the first inner spacer and the housing, and the end of the outer side wall of the first pressurizing chamber is tightly fixed between the housing and the retaining ring connector; The ends of the inner side wall and the outer side wall of the second inner cavity are tightly fixed between the sealing ring and the first inner spacer; The ends of the inner side wall and the outer side wall of the fourth inner cavity are tightly fixed between the second inner spacer and the first inner spacer.

16. The polishing head according to claim 15, characterized in that, A connection post is arranged on the second inner spacer, and the connection post extends into the pressure connection block and is slidably connected to the pressure connection block in the axial direction.

17. A polishing device, characterized in that, Including the pressing plate according to any one of claims 1 to 3, or the bladder film according to any one of claims 4 to 10, or the polishing press head according to any one of claims 11 to 16.

18. A polishing method, characterized in that, Polishing a square substrate with the polishing press head according to any one of claims 11 to 16.

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