Pressing plate, capsule, polishing press head, equipment and method for polishing square substrate

Abstract

The present invention discloses a pressure plate, capsule, polishing head, equipment, and method for polishing square substrates. The pressure plate includes an elastic plate and a circular hole located in the middle of the elastic plate. The outer surface of the elastic plate includes a pressure surface. The outer edge profile of the pressure surface matches the outer edge profile of the square substrate to be polished. The pressure surface is a spherical surface convex toward the square substrate. During the process of transmitting pressure to the square substrate through the pressure surface, the pressure surface undergoes elastic deformation and gradually conforms to the square substrate from the inside to the outside, forming a pressure distribution on the square substrate that gradually decreases from the inside to the outside. The present invention achieves the technical effect of improving the material removal uniformity and surface flatness of ultra-large and ultra-thin square substrates during the polishing process.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing equipment, and in particular to a pressing plate, a capsule membrane, a polishing pressure head, a polishing equipment and a polishing method for polishing a square substrate. Background Art

[0002] Through-Glass Via (TGV), an advanced chip packaging technology, has attracted significant research and development investment worldwide. Its core material is a glass substrate, and the production process involves polishing the glass substrate. As packages grow larger, the demand for larger and thinner glass substrates is increasing.

[0003] However, the polishing of ultra-large and ultra-thin glass substrates (e.g., glass substrates with dimensions exceeding 500mm in length, 500mm in width, and thicknesses between 0.5mm and 1mm) is still being researched and developed in the laboratory. Due to their large size, the polishing speed difference between the edge and center of the glass substrate is significant. Furthermore, due to their ultra-thinness, the surface flatness requirements for the glass substrate are extremely high, typically at the micron level.

[0004] The polishing accuracy of ultra-large and ultra-thin glass substrates in the existing technology does not meet the requirements of large-scale production. Summary of the Invention

[0005] The main purpose of the present invention is to provide a pressing plate, a capsule, a pressing head and an apparatus for polishing a square substrate, so as to solve the problem in the related art that the material removal of the square substrate is uneven and the surface flatness is low when polishing an ultra-large or ultra-thin square substrate.

[0006] In order to achieve the above-mentioned purpose, the present invention provides a pressure plate for polishing a square substrate, the pressure plate including an elastic plate and a circular hole, the circular hole being located in the middle of the elastic plate, the outer surface of the elastic plate including a pressure surface, the outer edge contour of the pressure surface matching the outer edge contour of the square substrate to be polished, the pressure surface being a spherical surface protruding toward the square substrate, and in the process of transmitting pressure to the square substrate through the pressure surface, the pressure surface undergoes elastic deformation and gradually adheres to the square substrate from the inside to the outside, forming a pressure distribution on the square substrate that gradually decreases from the inside to the outside.

[0007] Optionally, the pressure plate further includes a support plate, and the support plate is in contact with a side of the elastic plate facing away from the pressure surface.

[0008] Optionally, the elastic plate is made of rubber or elastic resin.

[0009] According to another aspect of the present invention, a capsule membrane for polishing a square substrate is provided, comprising: a membrane body and the above-mentioned pressure plate, wherein the membrane body comprises a first pressurizing chamber, the pressure plate is arranged in the first pressurizing chamber, and the pressure transmitted to the square substrate by the pressure-applying surface of the pressure plate is controlled by controlling the pressure of the first pressurizing chamber.

[0010] Optionally, the first pressurized chamber corresponds to the first area of the square substrate, and the membrane body also includes a second pressurized chamber, which is located in the circular hole. The second pressurized chamber corresponds to the second area of the square substrate, and pressure is transferred to the second area by controlling the pressure in the second pressurized chamber.

[0011] Optionally, a pressure plate is wrapped in the membrane body, and the pressure plate is located outside the first pressurizing chamber.

[0012] Optionally, a first pressure transmission component is provided at the bottom of the first pressurizing chamber, the first pressure transmission component is axially corresponding to the pressure plate, and the pressure in the first pressurizing chamber is transmitted to the pressure plate through the first pressure transmission component.

[0013] Optionally, an annular groove is provided on the outer ring side of the membrane body, and the annular groove is located between the first pressurizing chamber and the pressure plate. A second pressure transmission component is provided in the annular groove, and the pressure in the first pressurizing chamber is transmitted to the second pressure transmission component through the first pressure transmission component, and then transmitted to the pressure plate by the second pressure transmission component.

[0014] Optionally, the second pressurization chamber includes a plurality of inner ring pressurization chambers arranged in sequence from the outside to the inside, and the plurality of inner ring pressurization chambers respectively correspond to a plurality of areas of the second region, and pressure is transferred to different areas within the second region by individually controlling the pressure in each of the inner ring pressurization chambers.

[0015] Optionally, at least a portion of the side wall of the first pressurizing chamber and the side wall of the inner ring pressurizing chamber are bent to form a bent portion, and the bent portion is expanded during the downward pressing movement of the membrane to provide displacement for the unbent portion of the side wall.

[0016] According to another aspect of the present invention, a polishing press head is provided, comprising the capsule membrane described above.

[0017] Optionally, the polishing pressure head further comprises: a connecting disc, a pressure connecting block, a housing, a housing connecting piece, a retaining ring and a retaining ring connecting piece;

[0018] The membrane body is connected to the connecting plate, the pressure connecting block is used to be fixedly connected to the machine equipment, the shell is connected to the pressure connecting block through a shell connecting piece, the retaining ring is connected to the shell through the retaining ring connecting piece, the retaining ring surrounds the four sides of the membrane body, and the retaining ring is used to constrain the square substrate within the retaining ring.

[0019] Optionally, the housing connection member comprises an annular sealing film, an inner ring of the sealing film is fixedly connected to the pressure connection block, and an outer ring of the sealing film is fixedly connected to the housing;

[0020] A closed pressure control chamber is formed between the sealing film, the pressure connection block, the shell and the connection plate. The pressure in the pressure control chamber is transmitted to the polishing pad via the shell and the retaining ring.

[0021] Optionally, the inner ring of the sealing rubber film is fixedly connected to the pressure connection block via a first sealing pressure ring, and the outer ring of the sealing rubber film is fixedly connected to the housing via a second sealing pressure ring.

[0022] Optionally, the plurality of inner ring pressurized chambers are respectively a first inner chamber, a second inner chamber, a third inner chamber and a fourth inner chamber which are arranged in sequence from the outside to the inside;

[0023] The connecting disk includes a first inner spacer, a sealing ring, and a second inner spacer;

[0024] The end of the inner wall of the first inner cavity is pressed and fixed between the first inner spacer and the housing, and the end of the outer wall of the first pressurized cavity is pressed and fixed between the housing and the retaining ring connector;

[0025] The ends of the inner cavity wall and the outer cavity wall of the second inner cavity are pressed and fixed between the sealing ring and the first inner spacer;

[0026] Ends of the inner cavity wall and the outer cavity wall of the fourth inner cavity are pressed and fixed between the second inner spacer and the first inner spacer.

[0027] Optionally, a connecting column is provided on the second inner spacer, and the connecting column extends into the pressure connecting block and is slidably connected to the pressure connecting block in the axial direction.

[0028] According to another aspect of the present invention, a polishing device is provided, comprising the above-mentioned pressing plate or the above-mentioned capsule or the above-mentioned polishing pressure head.

[0029] According to another aspect of the present invention, a polishing method is provided, which uses the above-mentioned polishing head to polish a square substrate.

[0030] In an embodiment of the present invention, a pressure plate for polishing a square substrate includes an elastic plate and a circular hole, the circular hole is located in the middle of the elastic plate, the outer surface of the elastic plate includes a pressure surface, the outer edge contour of the pressure surface matches the outer edge contour of the square substrate to be polished, and the pressure surface is a spherical surface protruding toward the square substrate. In the process of transmitting pressure to the square substrate through the pressure surface, the pressure surface produces elastic deformation and gradually fits the square substrate from the inside to the outside, forming a pressure distribution on the square substrate that gradually decreases from the inside to the outside.

[0031] On the one hand, in the process of transmitting pressure to the square substrate through the pressure-applying surface of the elastic plate, the spherical pressure-applying surface can produce elastic deformation, so that a pressure distribution that gradually decreases from the inside to the outside of the square substrate can be formed, thereby compensating for the difference in material removal rate caused by the speed difference between the inner and outer areas of the square substrate, thereby achieving the technical effect of improving the material removal uniformity and surface flatness of the square substrate;

[0032] On the other hand, when performing zoned pressure control on a square substrate, because the edge area of the square substrate also includes the top corner area, conventional control methods cannot perform multi-zone pressure control in the top corner area, and there is a significant difference in material removal rate in the top corner area. In this embodiment, the spherical pressure surface can simultaneously cover the top corner area and also form a pressure distribution that gradually decreases from the inside to the outside of the top corner area, thereby ensuring a consistent material removal rate in the top corner area.

[0033] On the other hand, since the pressure surface is a spherical surface protruding outward, the edge area of the pressure surface is higher than the central area, thereby being able to compensate for the deformation of the edge area of the large-size polishing head due to its own weight, so as to adjust the additional pressure applied to the square substrate due to the deformation of the edge area of the polishing head during the polishing process, thereby further improving the material removal uniformity and surface flatness of the square substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention and to make other features, objects, and advantages of the present invention more apparent. The accompanying drawings and descriptions of the exemplary embodiments of the present invention are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0035] Figure 1 is a schematic structural diagram of a pressing plate according to an embodiment of the present invention;

[0036] Figure 2 is a schematic top view of the structure of a pressing plate according to an embodiment of the present invention;

[0037] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure of AA;

[0038] Figure 4 yes Figure 2 Schematic diagram of the cross-sectional structure of the middle BB;

[0039] Figure 5 is a schematic diagram of pressure distribution on a square substrate according to an embodiment of the present invention;

[0040] Figure 6 is a schematic diagram of velocity variation on a square substrate according to an embodiment of the present invention;

[0041] Figure 7 2 is a schematic diagram of pressure distribution of a square substrate in region P1 according to an embodiment of the present invention;

[0042] Figure 8 is a schematic structural diagram of a membrane body according to an embodiment of the present invention;

[0043] Figure 9 is a schematic diagram of a top view of the membrane body according to an embodiment of the present invention;

[0044] Figure 10 yes Figure 9 Schematic diagram of the cross-sectional structure of CC;

[0045] Figure 11 yes Figure 9 Schematic diagram of the cross-sectional structure of DD;

[0046] Figure 12 is a schematic diagram of the cross-sectional structure of the membrane body according to an embodiment of the present invention;

[0047] Figure 13 yes Figure 12 Schematic diagram of a local enlarged structure;

[0048] Figure 14 is a schematic structural diagram of a second pressure transmission member according to an embodiment of the present invention;

[0049] Figure 15 is a schematic cross-sectional view of a polishing indenter according to an embodiment of the present invention;

[0050] Figure 16 Schematic diagram of the structure of each gas path of the polishing pressure head according to an embodiment of the present invention.

[0051] Among them, 1. pressure plate; 101. pressure surface; 102. elastic plate; 103. support plate; 104. circular hole; 3. square substrate; 4. membrane; 40. first pressurized chamber; 41. second pressurized chamber; 410. first inner chamber; 411. second inner chamber; 412. third inner chamber; 413. fourth inner chamber; 414. pressure control chamber; 415. annular groove; 416. sub-chamber; 5. first pressure transmission member; 6. second pressure transmission member; 7. support plate; 70. pressure connecting block; 71. shell connecting member; 72. shell; 73. retaining ring connecting member; 74. retaining ring; 75. first sealing pressure ring; 76. second sealing pressure ring; 8. connecting plate; 80. first inner spacer; 81. sealing ring; 82. second inner spacer; 820. connecting column. DETAILED DESCRIPTION

[0052] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0053] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that the terms used in this manner are interchangeable where appropriate to facilitate the description of the embodiments of the present invention.

[0054] In the present invention, the terms "upper," "lower," "inner," and the like indicate positions or locations based on those shown in the accompanying drawings. These terms are primarily intended to better describe the present invention and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0055] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0056] Furthermore, the terms "disposed," "provided with," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0057] Additionally, the term "plurality" shall mean two or more.

[0058] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0059] To solve related technical problems, such as Figures 1 to 4 As shown, an embodiment of the present invention provides a pressure plate for polishing a square substrate, wherein the pressure plate 1 includes an elastic plate 102 and a circular hole 104, wherein the circular hole 104 is located in the middle of the elastic plate 102, and the outer surface of the elastic plate 102 includes a pressure surface 101, wherein the outer edge contour of the pressure surface 101 matches the outer edge contour of the square substrate 3 to be polished, and the pressure surface 101 is a spherical surface protruding toward the square substrate 3. In the process of transmitting pressure to the square substrate through the pressure surface 101, the pressure surface 101 generates elastic deformation and gradually fits the pressure surface 101 with the square substrate 3 from the inside to the outside, thereby forming a pressure distribution on the square substrate 3 that gradually decreases from the inside to the outside.

[0060] In this embodiment, the pressure plate 1 is adapted to the polishing pressure head and is used to transmit pressure to the polishing sheet during the polishing process. The pressure plate 1 can transmit pressure to the polishing sheet directly or through the membrane 4 wrapped around the pressure plate 1. The pressure plate 1 includes an elastic plate 102 and a circular hole 104. The circular hole 102 is located in the middle of the elastic plate 102, wherein the diameter of the circular hole is smaller than the maximum inscribed circle diameter of the square substrate. The side of the elastic plate facing the square substrate 3 is the pressure surface 101, and the side facing away from the square substrate 3 is connected to the polishing pressure head or the membrane 4. The edge contour of the pressure surface 101 matches the edge contour of the square substrate 3. Specifically, the projection of the pressure surface 101 on the square substrate 3 can cover the edge of the square substrate 3, ensuring that the edge area of the square substrate 3 can all be subjected to pressure from the pressure surface 101. In one embodiment, the edge size of the pressure surface 101 is consistent with the edge size of the square substrate 3, or is larger in length and width.

[0061] The main reasons for the different material removal rates between the inner and outer regions of the square substrate 3 are the difference in linear velocity between the inner and outer regions and the pressure difference caused by the edge deformation of the polishing head. Figure 5 and Figure 6 As shown, it is assumed that the square substrate 3 is divided into regions P1-P5. During the polishing process, the square substrate 3 rotates around the center point O at an angular velocity of Rotation. Assume that in the square substrate 3, the distance from the center point O to the right angle point is , then the linear velocity of rotation in this area is approximately The distance from the center point O to the right angle side is , then the linear velocity of rotation in this area is approximately .

[0062] Obviously in the square substrate 3, , According to Preston equation ( is the material removal rate, is the Preston constant, is the polishing pressure, is the instantaneous relative velocity of any point on the surface of the square substrate 3 relative to the polishing pad), under the same polishing pressure conditions The material removal rate in the area is less than Material removal rate of the area.

[0063] like Figure 5 and Figure 6 As shown, P2, P3, P4, and P5 are circular areas, and the velocity distribution is gradient along the radial direction, the same in the circumferential direction, and gradually increases from the inside to the outside. In order to achieve a uniform material removal rate, the pressure distribution trend of the square substrate 3 is P5>P4>P3>P2>P1. Since the P1 pressure area is located at the edge area of the square substrate 3, the edge area is square, and the linear velocity distribution in the circumferential direction is different. Therefore, the pressure distribution in the P1 region must correspond to the velocity.

[0064] According to the material removal rate equation, in order to maintain the same material removal rate, the pressure can be reduced when the relative speed increases. Reducing the pressure can also compensate for the pressure change caused by the edge deformation of the polishing head. Figure 1 、 Figure 3 and Figure 4 As shown, in this embodiment, the elastic plate 102 is elastic, and the pressure surface 101 on the elastic plate 102 is configured as a spherical surface convex toward the square substrate 3. The elastic plate 102 is made of rubber or elastic resin.

[0065] Specifically, after such a configuration, in the process of transmitting pressure to the square substrate 3 through the pressure-applying surface 101, the elastic plate 102 deforms and causes the spherical pressure-applying surface 101 to gradually conform to the square substrate 3 from the inside to the outside, so that the inner area of the square substrate 3 is subjected to greater pressure, and the outer area is subjected to less pressure. Ultimately, a pressure distribution that gradually decreases from the inside to the outside is formed on the square substrate 3, and the pressure distribution trend changes linearly. Because the pressure in the outer area is lower, a consistent material removal rate can be maintained even if the relative speed in the outer area is higher. In particular, for the top corner area of the square substrate 3 (i.e., the area near the four top corners of the P1 area), a pressure distribution that gradually decreases from the inside to the outside can be formed, ensuring the consistency of the material removal rate in this area. At the same time, the reduced pressure in the outer area can also synchronously compensate for the pressure changes caused by the deformation of the polishing head.

[0066] When polishing an ultra-large, ultra-thin square substrate 3, due to the large size of the glass substrate, if it is necessary to fully transmit pressure to the glass substrate through the pressure surface 101 of the pressure plate 1, the pressure surface 101 needs to be a complete spherical surface, and the height difference between the central area and the edge area of the pressure surface 101 is large. When the pressure surface 101 is completely in contact with the glass substrate, the central area of the pressure surface 101 may apply excessive pressure to the glass substrate, causing damage to the thinner glass substrate.

[0067] To this end, in this embodiment, it is preferred that the pressure surface 101 only transmits pressure to the edge area of the square substrate 3, that is, only transmits pressure to the P1 area. Figure 1 and Figure 2 As shown, a circular hole 104 is provided in the middle of the pressing plate 1 , through which the central circular area of the square substrate 3 , ie, the P2 - P5 area, is avoided.

[0068] Specifically, in this embodiment, a circular hole 104 is provided in the center of the pressure plate 1. This hole 104 corresponds to the central circular area of the square substrate 3. This allows the pressure plate 1 to avoid the central circular area when transmitting pressure to the substrate, transferring pressure only to the edge areas of the square substrate 3. When the pressure plate 1 and the square substrate 3 are aligned vertically, during the polishing process, the edge areas of the square substrate 3 outside the circular hole 104 are all subjected to pressure transmitted by the pressure surface 101. When coupled with the membrane 4, the membrane 4 can transmit pressure solely to the central circular area of the square substrate 3 through the circular hole 104.

[0069] In one embodiment, the diameter of the circular hole 104 is slightly smaller than the length of the short side of the square substrate 3, thereby minimizing the area where the pressure surface 101 of the pressure plate 1 contacts the square substrate 3 during the polishing process. However, in any case, the pressure surface 101 of the pressure plate 1 always needs to transfer pressure to the top corner area of the square substrate 3. The top corner area is part of the edge area, and it is difficult to perform zoned pressure control in the top corner area through the membrane body 4. The pressure plate 1 in this embodiment can relatively easily form a linearly changing pressure distribution in the top corner area to ensure the consistency of the material removal rate.

[0070] Specifically, such as Figure 7 As shown, the edge area P1 of the square substrate 3 corresponding to the pressure surface 101 can be divided into P1-2 pressure area, P1-3 pressure area, P1-4 pressure area and P1-5 pressure area, wherein the P1-2 pressure area is the area including the inscribed circle of the square substrate 3, and the P1-3 pressure area, P1-4 pressure area and P1-5 pressure area are for the top corner area of the square substrate 3. From the perspective of relative speed, P1-2<P1-3<P1-4<P1-5, and from the perspective of pressure distribution, P1-2>P1-3>P1-4>P1-5. Therefore, according to the material removal rate equation, a more uniform material removal rate can be obtained in actual application, thereby achieving a better polishing effect. It should be noted that since the pressure surface 101 is a spherical surface, for each pressure area, its pressure distribution is still a distribution form that gradually decreases from the inside to the outside, so that the entire pressure area can present a linearly changing pressure distribution.

[0071] On one hand, the present invention achieves the goal of achieving, during the process of transmitting pressure to the square substrate 3 through the pressure surface 101 of the pressure plate 1, the spherical pressure surface 101 can produce elastic deformation, so that a pressure distribution that gradually decreases from the inside to the outside can be formed on the square substrate 3, thereby compensating for the difference in material removal rate caused by the speed difference between the inner and outer areas of the square substrate 3, thereby achieving the technical effect of improving the material removal uniformity and surface flatness of the square substrate 3;

[0072] On the other hand, when performing pressure zone control on a square substrate 3, because the edge region of the square substrate 3 also includes the top corner region, conventional control methods cannot perform multi-zone pressure control in the top corner region, and there is a significant difference in material removal rate in the top corner region. In this embodiment, the spherical pressure surface 101 can simultaneously cover the top corner region and also form a pressure distribution that gradually decreases from the inside to the outside of the top corner region, thereby ensuring a consistent material removal rate in the top corner region.

[0073] On the other hand, since the pressure surface 101 is a spherical surface protruding outward, the edge area of the pressure surface 101 is higher than the central area, thereby being able to compensate for the deformation of the edge area of the large-size polishing head due to its own weight, so as to adjust the additional pressure applied to the square substrate 3 due to the deformation of the edge area of the polishing head during the polishing process, thereby further improving the material removal uniformity and surface flatness of the square substrate 3.

[0074] In one embodiment of the pressure plate 1, the elastic plate 102 of the pressure plate 1 needs to be deformed when transmitting pressure. Therefore, in order to better transmit the pressure to the pressure surface 101 of the elastic plate 102, as shown in FIG. Figure 1 As shown, the pressing plate 1 in this embodiment further includes a supporting plate 103 , which is in contact with a side of the elastic plate 102 facing away from the pressing surface 101 .

[0075] Specifically, in this embodiment, the edges of the support plate 103 and the elastic plate 102 overlap. The support plate 103 can be a rigid plate with high rigidity, thereby directly transmitting pressure to the elastic plate 102. Both sides of the support plate 103 can be flat. The elastic plate 102 is an elastic component with low rigidity, which allows it to deform well to achieve a predetermined pressure distribution. One side of the elastic plate 102 is flat, and the other side is a spherical pressure surface 101. The flat side of the elastic plate 102 is in contact with and bonded to any surface of the support plate 103 to form a single unit.

[0076] In one embodiment, Figure 1 and Figure 5 As shown, the pressing plate 1 is a square plate, and the outer contour of the pressing plate 1 matches the outer contour of the square substrate 3. Specifically, in this embodiment, the length and width of the pressing plate 1 are consistent with the length and width of the square substrate 3, which improves the shape matching between the pressing plate 1 and the square substrate 3, does not occupy a larger space when adapted to the polishing head, and reduces the size of the polishing head to a certain extent.

[0077] According to another aspect of the present invention, Figures 8 to 14 As shown, a capsule membrane for polishing a square substrate is provided, comprising: a membrane body 4 and the above-mentioned pressure plate 1, the membrane body 4 comprising a first pressure chamber 40, the pressure plate 1 being arranged in the first pressure chamber 40, and the pressure of the pressure surface 101 of the pressure plate 1 being transmitted to the square substrate 3 by controlling the pressure of the first pressure chamber 40.

[0078] In this embodiment, if Figures 10 to 12 As shown, the pressure of the pressure plate 1 comes from the pressure in the first pressurized cavity 40 in the membrane body 4. The membrane body 4 can be adapted to the polishing pressure head and has a certain elasticity. When forming a closed cavity, the pressure transmitted outward by the membrane body 4 can be controlled by controlling the pressure in the cavity. Figure 8 and Figure 9As shown, the middle portion of the membrane body 4 has a circular sidewall and the edge has a square sidewall. The membrane body 4 includes at least a first pressurized chamber 40, and the square sidewalls at the edge of the membrane body 4 and a portion of the outer circular sidewall in the middle constitute the wall of the first pressurized chamber 40. The pressure plate 1 can be installed inside the membrane body 4 or on a side of the membrane body 4 close to the square substrate 3. When the pressure plate 1 is installed in the membrane body 4, the membrane body 4 can be located at the bottom of the first pressurized chamber 40, so that the pressure change in the first pressurized chamber 40 can be transmitted to the pressure plate 1. In this embodiment, the pressure in the first pressurized chamber 40 is controlled to control the pressure on the pressure surface 101 of the pressure plate 1 transmitted to the square substrate 3.

[0079] In one embodiment, the first pressurized chamber 40 corresponds to the first area of the square substrate 3, and the membrane body 4 further includes a second pressurized chamber 41. The second pressurized chamber 41 is located in the circular hole 104 on the pressure plate 1. The second pressurized chamber 41 corresponds to the second area of the square substrate 3, and pressure is transmitted to the second area by controlling the pressure in the second pressurized chamber 41.

[0080] The second region is the inner region of the square substrate 3 (ie, the P2-P5 region), and the first region is the edge region of the square substrate 3 outside the inner region (ie, the P1 region).

[0081] In this embodiment, if Figure 12 As shown, the membrane body 4 includes a first pressurizing chamber 40 and a second pressurizing chamber 41. The first pressurizing chamber 40 is used to transmit pressure to the first area of the square substrate 3. During the polishing process, the first pressurizing chamber 40 corresponds to the first area of the square substrate 3. The second pressurizing chamber 41 is used to transmit pressure to the second area of the square substrate 3. During the polishing process, the second pressurizing chamber 41 corresponds to the second area of the square substrate 3. Pressure is transmitted to the square substrate 3 as a whole through the first pressurizing chamber 40 and the second pressurizing chamber 41. In this embodiment, the second pressurizing chamber 41 can be a circular area as a whole, and the second area corresponding to the corresponding second pressurizing chamber 41 is the inner circle area of the square substrate 3, as shown in FIG. Figure 5 The second pressurized cavity 41 is close to the edge of the membrane 4, and the first area corresponding to the first pressurized cavity 40 is the edge area of the square substrate 3 outside the inner circle area, as shown in FIG. Figure 5 The P1 region shown includes the four corner regions of the square substrate 3 .

[0082] In this embodiment, the pressure in the first pressurized chamber 40 is transmitted to the square substrate 3 via the pressure plate 1. The circular through-hole in the pressure plate 1 and the area of the second pressurized chamber 41 allow the portion of the membrane 4 in the area of the second pressurized chamber 41 to contact the square substrate 3 through the circular through-hole, thereby directly transmitting the pressure in the second pressurized chamber 41 to the square substrate 3. In this embodiment, the pressures in the first and second pressurized chambers 40, 41 can be controlled independently, thereby independently controlling the pressures in the inner and edge areas of the square substrate 3.

[0083] For the edge area, since the pressure is transmitted through the pressure plate 1, the spherical pressure surface 101 on the pressure plate 1 can form a pressure distribution that gradually decreases from the inside to the outside in the edge area. For the inner circle area, zoned pressure control can also be performed. Since the inner circle area is a regular circular area, zoned pressure control is relatively easy. In one embodiment, the inner circle area can be divided into multiple concentric areas, such as Figure 5 P2 to P5 shown. Figure 12 As shown, the second pressurized chamber 41 can be divided into chambers corresponding to P2 to P5. By individually controlling the pressure within each chamber, the pressure transmitted to each concentric area is controlled, thereby forming a gradient pressure distribution in the inner area of the square substrate 3. Ultimately, the square substrate 3 exhibits a pressure distribution that decreases from the inside to the outside. Combined with the changes in speed across each area of the square substrate 3, a uniform material removal rate is achieved.

[0084] In one embodiment, the inner circle of the square substrate 3 is a circular area, making zoned pressure control easier and more flexible. Therefore, to reduce the overall control difficulty, the inner circle is located close to the edge of the square substrate 3, meaning that the diameter of the inner circle is close to the length of the short side of the square substrate 3. In this case, the resulting edge region includes a narrow area located near the foot of the perpendicular from the center of the inner circle to each side of the square substrate 3.

[0085] Since the first pressurizing chamber 40 corresponds to the edge region, when the first pressurizing chamber 40 includes the first pressurizing chamber 400, the first pressurizing chamber 400 also has a narrower region corresponding to the narrower region on the edge region. Figure 8 As shown, since the membrane body 4 also includes a second pressurized chamber 41, which corresponds to the inner circle area, a portion of the second pressurized chamber 41 will be close to the narrower area on the first pressurized chamber 400. In order to prevent the second pressurized chamber 41 from squeezing the narrower area on the first pressurized chamber 400 due to increased pressure, the positions of the first pressurized chamber 400 and the second pressurized chamber 41 on the membrane body 4 are adjusted in this embodiment. Specifically, as Figure 12 As shown, in this embodiment, the first pressurizing chamber 400 is located at the edge of the membrane body 4 and at the first end of the membrane body 4, as shown in FIG. Figure 12As shown, the first pressurizing chamber 400 is located at the upper part of the membrane body 4 .

[0086] The pressure plate 1 is located at the second end of the membrane body 4, axially corresponding to the first pressurized chamber 400. The pressure in the first pressurized chamber 400 is transmitted downward to the pressure plate 1, and then transmitted downward by the pressure plate 1. The second pressurized chamber 41 is located at the second end of the membrane body 4, that is, at the bottom of the membrane body 4. The pressure in the second pressurized chamber 41 is directly transmitted through the bottom end of the membrane body 4 to the inner circle area of the square substrate 3.

[0087] Since the first pressurizing chamber 400 and the second pressurizing chamber 41 of the first pressurizing chamber 40 in this embodiment are respectively arranged at the upper and lower parts of the membrane body 4, the squeezing effect on the first pressurizing chamber 400 caused by the increase in pressure of the second pressurizing chamber 41 can be reduced, thereby ensuring normal pressure control in the first pressurizing chamber 400.

[0088] In one embodiment, Figure 12 As shown, the pressing plate 1 is wrapped in the film body 4 , and the edge of the second end of the film body 4 can be tightly fitted with the surface of the pressing plate 1 .

[0089] Specifically, in this embodiment, after the second end of the membrane 4 is wrapped around the pressure plate 1, the lower end surface of the membrane 4 is flat, allowing it to completely adhere to the square substrate 3. At this point, the pressure plate 1 transmits pressure to the square substrate 3 through the portion of the lower end surface of the membrane 4 corresponding to the edge of the square substrate 3. The pressure within the second pressurizing chamber 41 is then transmitted to the square substrate 3 through the portion of the lower end surface of the membrane 4 corresponding to the inner circle of the square substrate 3.

[0090] At the same time, the film body 4 has good flexibility. After wrapping the pressing plate 1, the pressure of the pressing plate 1 needs to be transmitted to the square substrate 3 through the film body 4, and the film body 4 can also play a protective role on the square substrate 3.

[0091] As mentioned above, the first pressurizing chamber 400 has a narrow area. To avoid being squeezed by the second pressurizing chamber 41, the first pressurizing chamber 400 is arranged at the first end (i.e., the upper part) of the membrane 4, while the pressure plate 1 is arranged at the second end (i.e., the lower part) of the membrane 4. At this time, to ensure that the pressure in the first pressurizing chamber 400 can be transmitted to the pressure plate 1, as shown in FIG. Figure 12 As shown, in this embodiment, a first pressure transmission member 5 is provided at the bottom of the first pressurizing chamber 400 , and the first pressure transmission member 5 corresponds axially to the pressure plate 1 , and the pressure in the first pressurizing chamber 400 is transmitted to the pressure plate 1 through the first pressure transmission member 5 .

[0092] Specifically, the first pressure transmission member 5 is a highly rigid structure, such as a metal bar or column. It is embedded in the lower portion of the first pressurized chamber 400, corresponding to the upper and lower portions of the pressurized plate 1. The installation of the first pressure transmission member 5 imparts increased rigidity to the lower portion of the first pressurized chamber 400, while the upper portion of the first pressurized chamber 400 remains hollow. The pressure within the first pressurized chamber 400 is transmitted downward through the first pressure transmission member 5 to the pressurized plate 1, from which it is then transmitted through the lower end surface of the membrane 4 to the square substrate 3.

[0093] In one embodiment, Figures 8 to 11 As shown, the first pressure transmission member 5 is a metal column, and the first pressure transmission member 5 is provided in plurality and is arranged in order at the lower part of the first pressurizing chamber 400 .

[0094] On the basis of the above implementation, in order to better transmit pressure, as Figure 12 and Figure 13 As shown, in this embodiment, an annular groove 415 is provided on the outer ring side of the membrane body 4, and the annular groove 415 is located between the first pressurizing chamber 400 and the pressure plate 1. A second pressure transmission component 6 is provided in the annular groove 415. The pressure in the first pressurizing chamber 400 is transmitted to the second pressure transmission component 6 through the first pressure transmission component 5, and then transmitted to the pressure plate 1 by the second pressure transmission component 6.

[0095] Specifically, in this embodiment, the second pressure transmission member 6 may be a plate-shaped structure with high rigidity (such as Figure 14 The middle portion of the outer ring side of the membrane body 4 is concave to form an annular groove 415. The upper end surface of the second pressure transmission member 6 is in contact with the top surface of the annular groove 415, and the lower end surface of the second pressure transmission member 6 is in contact with the bottom surface of the annular groove 415.

[0096] In one embodiment, Figure 12 As shown, the first pressurization chamber 40 includes a first pressurization chamber 400, and the second pressurization chamber 41 includes a plurality of inner ring pressurization chambers arranged in sequence from the outside to the inside. The plurality of inner ring pressurization chambers respectively correspond to a plurality of areas of the second region, and the pressure is transferred to different areas in the second region by individually controlling the pressure in each inner ring pressurization chamber.

[0097] Specifically, in this embodiment, to achieve zoned pressure control within the inner region of the square substrate 3, the second pressurization chamber 410 is configured as multiple inner-circle pressurization chambers. These multiple inner-circle pressurization chambers are radially distributed and concentrically arranged to correspond to concentrically distributed regions within the inner region (i.e., the second region) of the square substrate 3. This embodiment controls the pressure within each inner-circle pressurization chamber to control the pressure transmitted to different regions within the inner region from the lower end surface of the membrane 4.

[0098] In one embodiment, Figure 12As shown, the multiple inner ring pressurized chambers are respectively the first inner chamber 410, the second inner chamber 411, the third inner chamber 412 and the fourth inner chamber 413 which are arranged in sequence from the outside to the inside. Figure 5 As shown, the inner area of the square substrate 3 is divided into pressure areas P2, P3, P4, and P5. The second pressurized chamber 410 corresponds to the P2 pressure area, the second inner chamber 411 corresponds to the P3 pressure area, the third inner chamber 412 corresponds to the P4 pressure area, and the fourth inner chamber 413 corresponds to the P5 pressure area.

[0099] For the membrane body 4, each pressurized cavity is a cavity with an upper opening on the membrane body 4. In order to achieve pressure control, the cavity needs to be closed. In the specific implementation process, the membrane body 4 can be installed on the rigid structure of the polishing pressure head, and the openings of each cavity are closed by the rigid structure, thereby forming multiple independent pressurized cavities in the membrane body 4. The pressure in each pressurized cavity can be controlled individually, thereby achieving zoned pressure control of the square substrate 3.

[0100] When the pressure in the first pressurized chamber 400 and the inner ring pressurized chamber increases, the bottom of the membrane body 4 corresponding to the first pressurized chamber 400 and the inner ring pressurized chamber is subjected to downward pressure, and the side walls of the first pressurized chamber 400 and the side walls of the inner ring pressurized chamber generate an upward stretching elastic force under the action of the downward pressure, resulting in an upward convex deformation of the bottom of the membrane body 4 and the positions corresponding to the side walls, causing the membrane body 4 to be unable to generate uniform pressure on the polishing sheet, and the polishing effect is deteriorated.

[0101] For this reason, in this embodiment, Figure 13 As shown, at least a portion of the side wall of the first pressurizing chamber 400 and the side wall of the inner ring pressurizing chamber are bent to form a bent portion. During the downward movement of the membrane 4, the bent portion expands to provide displacement for the unbent portion of the side wall.

[0102] Specifically, the first pressurized chamber 400 includes sidewalls 4-1 and 4-2, the second pressurized chamber 410 includes sidewalls 4-2 and 4-3, the second inner chamber 411 includes sidewalls 4-3 and 4-4, the third inner chamber 412 includes sidewalls 4-4 and 4-5, and the fourth inner chamber 413 includes sidewall 4-5. The upper portion of each sidewall is bent to form a bent portion. Figure 13 4-1-1, 4-2-1, 4-3-1, 4-4-1, and 4-5-1 are shown. When the pressure in each pressurized chamber increases, each sidewall generates an upward stretching elastic force. This elastic force acts on the bent portion, causing it to expand to a certain extent, thereby absorbing the tensile force of the sidewalls on the bottom of the membrane body 4, thereby preventing the bottom of the membrane body 4 from bulging upward. In one embodiment of the bent portion, the bent portion has a semicircular structure.

[0103] In order to facilitate the connection between the membrane body 4 and the rigid structure of the polishing pressure head to seal each pressurized cavity, in this embodiment, the membrane body 4 is provided with a sealing ring structure at the opening position corresponding to each pressurized cavity, such as Figure 13 4-1-2, 4-2-2, 4-3-2, 4-4-2, and 4-5-2 shown in the figure play an airtight role by cooperating with the sealing ring structure and the corresponding rigid structure.

[0104] According to another aspect of the present invention, Figure 15 and Figure 16 As shown, a polishing press head is provided, comprising the above-mentioned capsule membrane.

[0105] In one embodiment, it further includes a support plate 7 and a connecting plate 8. The membrane body 4 is connected to the support plate 7 via the connecting plate 8. The first pressurizing chamber 40 is located between the membrane body 4 and the support plate 7. The second pressurizing chamber 41 is located between the membrane body 4 and the connecting plate 8.

[0106] In this embodiment, the upper opening of the first pressurized chamber 40 of the membrane body 4 is sealed by the support plate 7, and the upper opening of the second pressurized chamber 410 is sealed by the connecting plate 8. The membrane body and the support plate 7 are fixedly connected, thereby mounting the membrane body 4 on the support plate 7. To facilitate pressure control, the support plate 7 is provided with multiple air passages, each of which communicates with the first pressurized chamber 40 and the second pressurized chamber 41.

[0107] In one embodiment, Figure 15 As shown, the support plate 7 includes a pressure connection block 70, a housing 72, a housing connector 71, a retaining ring 74 and a retaining ring connector 73;

[0108] The pressure connection block 70 is used to be fixedly connected to the machine equipment. The housing 72 is connected to the pressure connection block 70 via the housing connector 71. The retaining ring 74 is connected to the housing 72 via the retaining ring connector 73. The retaining ring 74 surrounds the membrane body 4.

[0109] The first pressurizing chamber 40 is located between the membrane 4 and the housing 72 , and the connecting plate 8 is connected to the housing 72 .

[0110] Specifically, in this embodiment, the pressure connection block 70 is the central structure of the support plate 7. The upper end of the pressure connection block 70 is used to be fixedly connected to the machine equipment. The lower end of the pressure connection block 70 is connected to the housing 72 via the housing connector 71, and the lower end of the housing 72 is connected to the retaining ring 74 via the retaining ring connector 73. For polishing the square substrate 3, in this embodiment, both the housing 72 and the retaining ring 74 are square. The membrane body 4 is connected to the housing 72 via the connecting plate 8, and the lower portion of the membrane body 4 is located within the space enclosed by the retaining ring 74. During the polishing process, the lower end surface of the retaining ring 74 contacts the polishing pad and transmits pressure to the polishing pad, while the membrane body 4 contacts the square substrate 3 on the polishing pad and transmits pressure to the square substrate 3. The first pressurized chamber 40 on the membrane body 4 corresponds to the inner edge area of the housing 72, and the first pressurized chamber 40 is sealed by the housing 72.

[0111] In one embodiment, the housing connector 71 includes an annular sealing film, the inner ring of the sealing film is fixedly connected to the pressure connection block 70, and the outer ring of the sealing film is fixedly connected to the housing 72;

[0112] A closed pressure control chamber 414 is formed between the sealing film, the pressure connection block 70 , the housing 72 and the connection plate 8 . The pressure in the pressure control chamber 414 is transmitted to the polishing pad via the housing 72 and the retaining ring 74 .

[0113] Specifically, in this embodiment, after the sealant film forms a pressure control chamber 414, the pressure within the pressure control chamber 414 can be controlled to press the housing 72, retaining ring connector 73, retaining ring 74, connecting plate 8, and membrane body 4 downward relative to the pressure connection block 70, thereby applying a certain pressure to the polishing pad. Furthermore, pressure can also be applied to the square substrate 3 independently through the first and second pressurized chambers 40, 41 in the membrane body 4.

[0114] In one embodiment, the sealing film is annular, with the inner ring of the sealing film fixedly connected to the pressure connection block 70 via a first sealing pressure ring 75, and the outer ring of the sealing film fixedly connected to the housing 72 via a second sealing pressure ring 76. Specifically, the inner ring of the sealing film is pressed and fixed to the upper surface of the pressure connection block 70 by the first sealing pressure ring 75, while the outer ring of the sealing film is pressed and fixed to the upper surface of the housing 72 by the second sealing pressure ring 76. To ensure sufficient airtightness, corresponding sealing structures can be provided on the inner and outer rings of the sealing film.

[0115] The middle part of the sealing film can be bent downward, and the bent part is used to provide displacement for the stretching of the sealing film, thereby facilitating the downward pressing movement of the shell 72, retaining ring connector 73, retaining ring 74, connecting plate 8 and membrane body 4 as a whole relative to the pressure connection block 70.

[0116] In one embodiment, Figure 15As shown, the multiple inner ring pressurized chambers are respectively arranged from the outside to the inside in sequence as the second pressurized chamber 410, the second inner chamber 411, the third inner chamber 412 and the fourth inner chamber 413;

[0117] The connecting plate 8 includes a first inner spacer 80, a sealing ring 81, and a second inner spacer 82;

[0118] The end of the inner wall of the first pressurized chamber 400 is pressed and fixed between the first inner spacer 80 and the housing 72 , and the end of the outer wall of the first pressurized chamber 400 is pressed and fixed between the housing 72 and the retaining ring connector 73 ;

[0119] The ends of the inner and outer walls of the second inner cavity 411 are pressed and fixed between the sealing ring 81 and the first inner spacer 80;

[0120] The ends of the inner cavity wall and the outer cavity wall of the fourth inner cavity 413 are pressed and fixed between the second inner spacer 82 and the first inner spacer 80;

[0121] The second pressurized chamber 410 is located between the edge area of the first inner spacer 80 and the membrane body 4, the second inner chamber 411 is located between the sealing ring 81 and the membrane body 4, the third inner chamber 412 is located between the middle area of the first inner spacer 80 and the membrane body 4, and the fourth inner chamber 413 is located between the second inner spacer 82 and the membrane body 4.

[0122] Specifically, in this embodiment, the second pressurized chamber 410, the second inner chamber 411, the third inner chamber 412, and the fourth inner chamber 413 are concentrically distributed, forming the P2 pressure region, the P3 pressure region, the P4 pressure region, and the P5 pressure region, respectively, as shown in the figure. The fourth inner chamber 413 is a circular chamber, and the second pressurized chamber 410, the second inner chamber 411, and the third inner chamber 412 are all annular. To facilitate the installation of the pressure plate 1, the lower portion of the membrane body 4 in this embodiment also includes a sub-cavity 416. The sub-cavity 416 is located at the lower edge of the membrane body 4, matches the shape of the pressure plate 1, and is connected to the second pressurized chamber 410. The pressure plate 1 can be installed in the sub-cavity 416 through the second pressurized chamber 410.

[0123] The first inner spacer 80 is an annular plate-shaped structure, the second inner spacer 82 is a circular plate-shaped structure, and the sealing ring 81 is an annular plate-shaped structure. The first pressurized chamber 400 includes an inner wall and an outer wall that are arranged opposite each other. The upper end of the outer wall is pressed and fixed between the lower end of the housing 72 and the upper end of the retaining ring connector 73, while the upper end of the outer wall is pressed and fixed between the inner top surface of the housing 72 and the upper end surface of the first inner spacer 80. The outer and inner walls of the second inner chamber 411 are both pressed and fixed between the lower end surface of the first inner spacer 80 and the upper end surface of the sealing ring 81, thereby sealing the second inner chamber 411. Simultaneously, the first inner spacer 80 seals the second pressurized chamber 410. The inner and outer walls of the fourth inner chamber 413 are both pressed and fixed between the lower end surface of the first inner spacer 80 and the upper end surface of the second inner spacer 82. Simultaneously, the first inner spacer 80 seals the third inner chamber 412.

[0124] Because the housing 72 and the pressure connection block 70 are connected by a sealing film, which has a certain degree of flexibility, the housing 72 and its connected parts are susceptible to radial displacement. Furthermore, because the housing 72 and its connected parts need to move axially relative to the pressure connection block 70, in this embodiment, a connecting post is provided on the second inner spacer 82 to limit the radial position of the housing 72 and its connected parts and to guide their axial movement. The connecting post extends into the pressure connection block 70 and is axially slidably connected to the pressure connection block 70.

[0125] In order to realize the individual control of the pressure in each pressurized chamber and pressure control chamber, Figure 16 As shown, the gas path channels on the polishing pressure head in this embodiment include a first channel 90, a second channel 98, a third channel 91, a fourth channel 97, a fifth channel 92, a sixth channel 94, a seventh channel 93, an eighth channel 96 and a ninth channel 95.

[0126] The first channel 90 is provided on the housing 72 and communicates with the first pressurizing chamber 400 . A pipe joint is provided at the upper end of the first channel 90 , which is connected to an air pump via the pipe joint to supply air and pressurize the first pressurizing chamber 400 .

[0127] The second channel 98 is arranged on the first inner spacer 80 and is connected to the second pressurized chamber 410. The third channel 91 is arranged on the pressure connecting block 70. The third channel 91 is connected to the second channel 98 through a pipe joint and a hose. The third channel 91 is connected to the air pump to supply air and pressurize the second pressurized chamber 410.

[0128] The fourth channel 97 is arranged on the first inner spacer 80 and the sealing ring 81, and the fifth channel 92 is arranged on the pressure connection block 70. The fourth channel 97 and the fifth channel 92 are connected through a pipe joint and a hose, and the fifth channel 92 is connected to the air pump to supply air and pressurize the second inner cavity 411.

[0129] The sixth channel 94 is provided on the pressure connection block 70 and communicates with the pressure control chamber. The sixth channel 94 is also connected to the air pump to supply air and pressurize the pressure control chamber 414 .

[0130] The seventh channel 93 is provided on the second inner spacer 82 and can pass through the connecting column on the second inner spacer 82 . The seventh channel 93 is communicated with the fourth inner cavity 413 and is connected to the air pump to supply air and pressurize the fourth inner cavity 413 .

[0131] The eighth channel 96 is arranged on the first inner spacer 80 and is connected to the third inner cavity 412. The ninth channel 95 is arranged on the pressure connection block 70. The eighth channel 96 is connected to the ninth channel 95 through a pipe joint and a hose. The ninth channel 95 is connected to the air pump to supply air and pressurize the third inner cavity 412.

[0132] According to another aspect of the present invention, a polishing device is provided, comprising the above-mentioned pressing plate 1 or the above-mentioned capsule membrane or the above-mentioned polishing press head.

[0133] According to another aspect of the present invention, a polishing method is provided, which uses the above-mentioned polishing head to polish a square substrate.

[0134] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A pressing plate for polishing a square substrate, characterized in that: The pressure plate includes an elastic plate and a circular hole, the circular hole is located in the middle of the elastic plate, the outer surface of the elastic plate includes a pressure surface, the outer edge contour of the pressure surface matches the outer edge contour of the square substrate to be polished, and the pressure surface is a spherical surface protruding toward the square substrate. In the process of transmitting pressure to the square substrate through the pressure surface, the pressure surface produces elastic deformation and gradually fits with the square substrate from the inside to the outside, forming a pressure distribution on the square substrate that gradually decreases from the inside to the outside.

2. The pressing plate for polishing a square substrate according to claim 1, characterized in that: The pressure plate further includes a support plate, and the support plate is in contact with a side of the elastic plate that is away from the pressure surface.

3. The pressing plate for polishing a square substrate according to claim 1, characterized in that: The elastic plate is made of rubber or elastic resin.

4. A capsule film for polishing a square substrate, characterized in that: include: A membrane body and a pressure plate as described in any one of claims 1 to 3, wherein the membrane body includes a first pressure chamber, the pressure plate is arranged in the first pressure chamber, and the pressure transmitted from the pressure surface to the square substrate is controlled by controlling the pressure in the first pressure chamber.

5. The capsule membrane for polishing a square substrate according to claim 4, characterized in that: The first pressurized chamber corresponds to the first area of the square substrate. The membrane body also includes a second pressurized chamber, which is located in the circular hole. The second pressurized chamber corresponds to the second area of the square substrate, and pressure is transferred to the second area by controlling the pressure in the second pressurized chamber.

6. The capsule membrane for polishing a square substrate according to claim 4, characterized in that: The pressing plate is wrapped in the membrane body and is located outside the first pressurizing chamber.

7. The capsule membrane for polishing a square substrate according to claim 6, characterized in that: A first pressure transmission component is provided at the bottom of the first pressurizing chamber. The first pressure transmission component corresponds to the pressure plate axially. The pressure in the first pressurizing chamber is transmitted to the pressure plate through the first pressure transmission component.

8. The capsule membrane for polishing a square substrate according to claim 7, characterized in that: An annular groove is provided on the outer ring side of the diaphragm body, and the annular groove is located between the first pressurizing chamber and the pressure plate. A second pressure transmission component is provided in the annular groove. The pressure in the first pressurizing chamber is transmitted to the second pressure transmission component through the first pressure transmission component, and then transmitted to the pressure plate by the second pressure transmission component.

9. The capsule film for polishing a square substrate according to claim 5, characterized in that: The second pressurization chamber includes multiple inner ring pressurization chambers arranged in sequence from the outside to the inside, and the multiple inner ring pressurization chambers respectively correspond to multiple areas of the second region. The pressure is transmitted to different areas in the second region by individually controlling the pressure in each inner ring pressurization chamber.

10. The capsule film for polishing a square substrate according to claim 9, characterized in that: At least a portion of the side wall of the first pressurizing chamber and the side wall of the inner ring pressurizing chamber is bent to form a bent portion, which expands during the downward movement of the membrane to provide displacement for the unbent portion of the side wall.

11. A polishing indenter, characterized in that: The capsule membrane comprises the capsule membrane according to any one of claims 4 to 10.

12. The polishing press head according to claim 11, characterized in that: The polishing pressure head further comprises: a connecting plate, a pressure connecting block, a housing, a housing connecting piece, a retaining ring and a retaining ring connecting piece; The membrane body is connected to the connecting plate, the pressure connecting block is used to be fixedly connected to the machine equipment, the shell is connected to the pressure connecting block through a shell connecting piece, the retaining ring is connected to the shell through the retaining ring connecting piece, the retaining ring surrounds the four sides of the membrane body, and the retaining ring is used to constrain the square substrate within the retaining ring.

13. The polishing press head according to claim 12, characterized in that: The housing connector includes an annular sealing film, the inner ring of the sealing film is fixedly connected to the pressure connection block, and the outer ring of the sealing film is fixedly connected to the housing; A closed pressure control chamber is formed between the sealing film, the pressure connection block, the shell and the connection plate. The pressure in the pressure control chamber is transmitted to the polishing pad via the shell and the retaining ring.

14. The polishing press head according to claim 13, characterized in that: The inner ring of the sealing rubber film is fixedly connected to the pressure connection block via a first sealing pressure ring, and the outer ring of the sealing rubber film is fixedly connected to the housing via a second sealing pressure ring.

15. The polishing press head according to claim 14, characterized in that: When the membrane body further includes a second pressurized cavity, and the second pressurized cavity includes a plurality of inner ring pressurized cavities sequentially arranged from the outside to the inside, the plurality of inner ring pressurized cavities are respectively a first inner cavity, a second inner cavity, a third inner cavity and a fourth inner cavity sequentially arranged from the outside to the inside; The connecting disk includes a first inner spacer, a sealing ring, and a second inner spacer; The end of the inner wall of the first inner cavity is pressed and fixed between the first inner spacer and the housing, and the end of the outer wall of the first pressurized cavity is pressed and fixed between the housing and the retaining ring connector; The ends of the inner cavity wall and the outer cavity wall of the second inner cavity are pressed and fixed between the sealing ring and the first inner spacer; Ends of the inner cavity wall and the outer cavity wall of the fourth inner cavity are pressed and fixed between the second inner spacer and the first inner spacer.

16. The polishing press head according to claim 15, characterized in that: The second inner spacer is provided with a connecting column, which extends into the pressure connecting block and is slidably connected to the pressure connecting block in the axial direction.

17. A polishing device, characterized in that: It comprises the pressing plate according to any one of claims 1 to 3, the capsule membrane according to any one of claims 4 to 10, or the polishing indenter according to any one of claims 11 to 16.

18. A polishing method, characterized in that: A square substrate is polished using the polishing head according to any one of claims 11 to 16.

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