Ceramic disc for attaching wafer and temperature control method thereof

Abstract

The invention relates to the technical field of semiconductor chemical mechanical polishing, and discloses a ceramic disc for attaching a wafer and a temperature control method thereof.The ceramic disc comprises a ceramic base body, an induction groove is formed in the ceramic base body, and an electromagnetic induction layer is embedded in the induction groove; an insulating layer is arranged on the surface of the electromagnetic induction layer; the electromagnetic induction layer is correspondingly provided with an electromagnetic heating assembly; the front face of the ceramic base body is an attaching face, a heat dissipation micro-channel is formed in the back face of the ceramic base body, and the heat dissipation micro-channel is connected with a cooling liquid circulation assembly. The ceramic plate is heated through electromagnetic induction, and the wax removal efficiency of the surface of the ceramic plate is improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor chemical mechanical polishing, and particularly to a ceramic disk for attaching a wafer and a temperature control method thereof. Background Art

[0002] CMP, namely chemical mechanical polishing, is a surface planarization technology that combines chemical action and mechanical action. During the CMP process, the wafer is fixed on a rotating polishing table. At the same time, a polishing liquid containing abrasive particles and chemical reagents is evenly sprayed on the wafer surface. The polishing head with a polishing pad contacts the wafer surface and applies a certain pressure. Under the relative rotational movement of the polishing table and the polishing head, the abrasive particles remove the material on the wafer surface through mechanical friction, while the chemical reagents react with the material on the wafer surface to form a thin film that is easy to remove, thereby achieving planarization polishing of the wafer surface.

[0003] In the current semiconductor industry, ceramic disks play a key role in the CMP field, mainly used for attaching wafers to achieve planarization processing of the wafers. After the planarization processing of the wafers is completed, wax remains on the surface of the ceramic disk, and the wax on the surface of the ceramic disk needs to be cleaned. During the cleaning process, a wafer dicing machine is needed to slice and remove the wax. When the wafer dicing machine removes the wax, the wax on the surface of the ceramic disk is cooled and solidified, so the process of removing wax by the wafer dicing machine is not smooth, affecting the preparation process of other process flows. Summary of the Invention

[0004] In order to improve the efficiency of wax removal on the surface of the ceramic disk, this application provides a ceramic disk for attaching a wafer and a temperature control method thereof.

[0005] In a first aspect, this application provides a ceramic disk for attaching a wafer, adopting the following technical solution: A ceramic disk for attaching a wafer includes a ceramic substrate. An induction groove is arranged inside the ceramic substrate, and an electromagnetic induction layer is embedded in the induction groove; an insulating layer is arranged on the surface of the electromagnetic induction layer; an electromagnetic heating component is correspondingly arranged for the electromagnetic induction layer; The front surface of the ceramic substrate is an attachment surface, and a heat dissipation microchannel is opened on the back surface of the ceramic substrate. The heat dissipation microchannel is connected with a coolant circulation component.

[0006] By adopting the above technical solution, the electromagnetic induction layer cooperates with the electromagnetic heating component. When removing wax from the dicing machine, the wax on the surface of the ceramic disk can be heated by electromagnetic induction so that the wax is no longer in a cooled and solidified state, reducing the hardness and viscosity of the wax, making the wax scraping process in the dicing process of the dicing machine smoother, thereby improving the efficiency of wax removal on the surface of the ceramic disk and avoiding affecting the preparation process of other process flows. Electromagnetic induction heating can achieve relatively precise temperature control, and can quickly adjust the temperature of the ceramic disk according to actual needs to meet the requirements for wax treatment in different process stages, ensuring the stability and consistency of the wax removal effect. The setting of the insulating layer can effectively prevent the leakage of the current generated by the electromagnetic induction layer, protect the structural integrity of the ceramic disk, extend the service life of the ceramic disk, and also ensure the safety during use. The heat dissipation microchannels on the back of the ceramic substrate are connected to the coolant circulation component. During the operation of the ceramic disk, the excess heat generated by electromagnetic induction heating and the like can be taken away in time, keeping the ceramic disk within a suitable working temperature range, avoiding affecting the performance of the ceramic disk and the effect of attaching the wafer due to excessive temperature, and ensuring the stability and reliability of the entire process. The structural design of this ceramic disk enables it to meet the requirements of attaching the wafer during the CMP process and also meet the requirements of subsequent processes such as wax removal through temperature control, with strong process adaptability, improving the versatility and practicality of the ceramic disk in the semiconductor manufacturing process.

[0007] Optionally, the electromagnetic heating component includes a heating controller, an alternating magnetic field generator, and an infrared temperature sensor. The heating controller is electrically connected to both the alternating magnetic field generator and the infrared temperature sensor; The heating controller obtains the infrared temperature data of the infrared temperature sensor; and inversely controls the working power of the alternating magnetic field generator according to the infrared temperature data; the higher the infrared temperature data, the lower the working power of the alternating magnetic field generator; the higher the infrared temperature data, the higher the working power of the alternating magnetic field generator.

[0008] By adopting the above technical solution, the infrared temperature sensor monitors the temperature of the ceramic disc in real time and transmits the data to the heating controller. The heating controller adjusts the operating power of the alternating magnetic field generator in a reverse correlation manner based on this accurate infrared temperature data. This means that when the temperature of the ceramic disc approaches the preset value, the power of the alternating magnetic field generator decreases to prevent the temperature from being too high; when the temperature is too low, the power is increased to ensure that the temperature of the ceramic disc can be accurately maintained within the set range, greatly improving the accuracy of temperature control and meeting the stringent process requirements for the temperature during the wax treatment on the surface of the ceramic disc. The reverse correlation control mechanism can effectively prevent the temperature of the ceramic disc from being too high due to the continuous high-power operation of the alternating magnetic field generator. Overheating may not only affect the performance of the ceramic disc itself but also cause damage to the attached wafer. By adjusting the power in real time, the occurrence of overheating is avoided, ensuring the safety of the ceramic disc and the wafer and extending the service life of the equipment. Dynamically adjusting the power of the alternating magnetic field generator according to the actual temperature of the ceramic disc avoids unnecessary energy waste. When the temperature reaches the appropriate range, the power of the generator is reduced, reducing energy consumption while ensuring the wax removal effect, which conforms to the concept of energy conservation and emission reduction and helps to reduce production costs. The heating controller, the alternating magnetic field generator, and the infrared temperature sensor work together to form an automated temperature control system. Without frequent manual intervention, the heating power can be automatically adjusted according to the temperature change of the ceramic disc, improving the automation degree of the production process, reducing human operation errors, and enhancing the stability of production efficiency and product quality.

[0009] Optionally, the coolant circulation assembly includes a cooling controller, a circulation pump, and a water temperature sensor, and the cooling controller is electrically connected to both the circulation pump and the water temperature sensor; The cooling controller obtains the water temperature data of the water temperature sensor; controls the operating power of the circulation pump in a positive correlation manner according to the water temperature data; the higher the water temperature data, the higher the operating power of the circulation pump; the lower the water temperature data, the lower the operating power of the circulation pump.

[0010] By adopting the above technical solution, the water temperature sensor monitors the temperature of the coolant in real time and transmits the water temperature data to the cooling controller. Based on this accurate water temperature data, the cooling controller adjusts the working power of the circulation pump in a positive correlation. When the water temperature is high, it means that more heat is generated by the ceramic disc. At this time, increasing the working power of the circulation pump can accelerate the circulation speed of the coolant, enhance the heat dissipation capacity, timely take away the heat on the ceramic disc, and ensure that the temperature of the ceramic disc is within a suitable range. When the water temperature is low, it indicates that less heat is generated by the ceramic disc. Reducing the working power of the circulation pump can avoid energy waste caused by too fast circulation speed of the coolant, realizing precise control of the heat dissipation of the ceramic disc. Stable heat dissipation control can effectively prevent the performance degradation or damage of the ceramic disc due to excessive temperature. By dynamically adjusting the power of the circulation pump according to the water temperature, the ceramic disc is always maintained at an appropriate working temperature, ensuring the stability and reliability of the ceramic disc during the processes of attaching the wafer and other related processes, prolonging the service life of the ceramic disc, and thus guaranteeing the smooth progress of the semiconductor manufacturing process. Controlling the working power of the circulation pump in a positive correlation according to the water temperature data avoids energy waste caused by the continuous high-power operation of the circulation pump. When the water temperature is low, reducing the power of the circulation pump reduces unnecessary energy consumption, enabling the coolant circulation system to operate in a more energy-efficient manner on the premise of meeting the heat dissipation requirements, meeting the requirements of energy conservation and emission reduction, and helping to reduce production costs. The cooling controller, the circulation pump and the water temperature sensor constitute an automated coolant circulation control system. This system can automatically adjust the working state of the circulation pump according to the change of the water temperature, without frequent manual intervention, improving the automation degree and intelligent level of the production process, reducing human operation errors, enhancing the stability of production efficiency and product quality, and making the entire semiconductor manufacturing process more efficient and reliable.

[0011] Optionally, the ceramic disc is formed by hot pressing and sintering of aluminum nitride ceramic material, and the induction groove is formed by laser micromachining; The electromagnetic induction layer has a plurality of induction zones, each of the induction zones is correspondingly provided with the alternating magnetic field generator, and heat insulation walls are arranged on the peripheries of each of the induction zones.

[0012] By adopting the above technical solution, the ceramic disk is formed by hot pressing and sintering of aluminum nitride ceramic material, and the aluminum nitride ceramic material has excellent properties such as high thermal conductivity, high hardness, high temperature resistance, and good chemical stability. The high thermal conductivity helps the ceramic disk to transfer heat better. Cooperating with the coolant circulation component, it can dissipate heat more efficiently and maintain the temperature stability of the ceramic disk. The high hardness and high temperature resistance enable the ceramic disk to withstand large pressures and temperature changes during the CMP process and processes such as wax removal, and it is not easily damaged, thus extending the service life of the ceramic disk. Good chemical stability can reduce the possibility of chemical reactions with polishing fluid, chemical reagents, etc., ensuring the reliability of the ceramic disk in a complex process environment and improving the stability of the entire semiconductor manufacturing process. The induction grooves are formed by laser micromachining, and the laser micromachining technology has the advantages of high precision, good processing quality, and non-contact processing. High-precision processing can ensure the accuracy of the size, shape, and position of the induction grooves, enabling the electromagnetic induction layer to be better embedded therein, and ensuring the stability and consistency of the electromagnetic induction effect. Non-contact processing avoids mechanical damage to the surface of the ceramic disk, maintains the integrity and surface quality of the ceramic disk, and is beneficial to improving the performance of the ceramic disk in attaching the wafer and subsequent processes. The electromagnetic induction layer has multiple induction zones, and each induction zone corresponds to an alternating magnetic field generator one by one. This design enables independent temperature control of different regions of the ceramic disk. In the actual semiconductor manufacturing process, since the process requirements of different parts of the wafer may be different, or during the wax removal process, the wax residue conditions in different regions of the ceramic disk surface may vary. By separately controlling the power of the alternating magnetic field generator for each induction zone, precise adjustment of the temperature of different regions of the ceramic disk can be achieved, meeting the process requirements of different regions, improving the flexibility and precision of the temperature control of the ceramic disk, and further enhancing the process adaptability and product quality.

[0013] Optionally, the electromagnetic induction layer is a copper wire or a copper tube; when the electromagnetic induction layer is a copper tube, the copper tube is communicated with the heat dissipation microchannel.

[0014] By adopting the above technical solution, the copper wire has good electrical conductivity and electromagnetic induction characteristics. According to the principle of electromagnetic induction, when an alternating magnetic field acts on the copper wire, an induced electromotive force and an induced current will be generated in the wire, and then Joule heat will be generated to realize the heating function of the ceramic disc to meet the temperature requirements of the ceramic disc in processes such as dewaxing. When the electromagnetic induction layer is a copper tube and is connected to the heat dissipation microchannel, the copper tube has good heat conduction performance and can quickly transfer the heat generated inside the ceramic disc to the heat dissipation microchannel. The coolant circulates in the heat dissipation microchannel and can take away these heats in time to achieve efficient heat dissipation, which helps to maintain the temperature stability of the ceramic disc and avoid affecting its performance and life due to overheating. Combining the electromagnetic induction and heat dissipation functions makes the structure of the ceramic disc more compact. It reduces additional heat dissipation components and complex connection structures, which is beneficial to improving the integration of the device, saving space, and at the same time reducing the complexity and cost of the system. Through the connection between the copper tube and the heat dissipation microchannel, the coolant can be more evenly distributed inside the ceramic disc, so that the heat dissipation of each part of the ceramic disc is more uniform, avoiding local overheating or overcooling, improving the temperature uniformity of the ceramic disc, and being beneficial to ensuring the consistency and stability of wafer attachment and subsequent processes.

[0015] In a second aspect, the present application provides a temperature control method for a ceramic disc for attaching a wafer, adopting the following technical solution: A temperature control method for a ceramic disc for attaching a wafer, based on a ceramic substrate, in which induction grooves are provided in the ceramic substrate, and an electromagnetic induction layer is embedded in the induction grooves; an insulating layer is provided on the surface of the electromagnetic induction layer; an electromagnetic heating component is correspondingly provided for the electromagnetic induction layer; the electromagnetic heating component includes a heating controller, an alternating magnetic field generator, and an infrared temperature sensor, and the heating controller is electrically connected to both the alternating magnetic field generator and the infrared temperature sensor; The front surface of the ceramic substrate is an attachment surface, and a heat dissipation microchannel is provided on the back surface of the ceramic substrate. The heat dissipation microchannel is connected to a coolant circulation component, and the coolant circulation component includes a cooling controller, a circulation pump, and a water temperature sensor. The cooling controller is electrically connected to both the circulation pump and the water temperature sensor; The method includes the following steps: The heating controller obtains the infrared temperature data of the infrared temperature sensor; Calculate the first temperature difference between the infrared temperature data and the preset heating reference temperature data; According to the first temperature difference, inversely adjust the working power of the alternating magnetic field generator; the larger the first temperature difference, the smaller the working power of the alternating magnetic field generator; the smaller the first temperature difference, the larger the working power of the alternating magnetic field generator; The cooling controller obtains the water temperature data of the water temperature sensor; Calculate a second temperature difference between the water temperature data and a preset cooling reference temperature data; Adjust the working power of the circulation pump in positive correlation with the second temperature difference; the larger the second temperature difference, the greater the working power of the circulation pump; the smaller the second temperature difference, the smaller the working power of the circulation pump.

[0016] By adopting the above technical solution, with the help of the infrared temperature sensor and the water temperature sensor, the system can obtain the surface temperature of the ceramic disc and the temperature of the coolant in real time and accurately. By calculating the difference between the actual temperature and the preset reference temperature, and correspondingly adjusting the power of the alternating magnetic field generator in inverse correlation and the power of the circulation pump in positive correlation, precise control of the temperature of the ceramic disc is achieved. In the wax removal stage, the temperature of the ceramic disc can be stably maintained within the most suitable range for wax shoveling, avoiding poor wax removal effect caused by too high or too low temperature, and ensuring the stability and reliability of the process. Dynamically adjusting the power of the heating and cooling equipment according to the deviation between the actual temperature and the preset value avoids continuous full-load operation of the equipment. When the temperature of the ceramic disc approaches the heating reference temperature, reduce the working power of the alternating magnetic field generator to reduce unnecessary energy consumption; when the temperature of the coolant is low, reduce the working power of the circulation pump to achieve the purpose of energy saving. This intelligent energy consumption management strategy effectively reduces the production cost while meeting the process requirements. The method can automatically adjust the intensity of heating and cooling according to the heat change of the ceramic disc in different working stages. Whether in the process of attaching the wafer or in subsequent processes such as wax removal, it can quickly adapt to different temperature requirements of the process without manual intervention. For example, during wax removal, due to the presence of wax on the surface of the ceramic disc, there are specific temperature requirements, and the system can automatically adjust to the appropriate temperature; in other process stages, it can be adjusted accordingly according to new requirements. Stable temperature control can reduce the thermal stress and mechanical stress on components such as the ceramic disc, the electromagnetic induction layer, and the cooling system caused by temperature fluctuations. Avoid fatigue damage of components caused by frequent thermal expansion and contraction, thereby extending the overall service life of the equipment and reducing the maintenance and replacement costs of the equipment. Precise temperature control ensures that the ceramic disc is always in the best working state, reducing process interruptions and product defect rates caused by temperature problems.

[0017] Optionally, the electromagnetic induction layer has a plurality of induction zones, each of the induction zones is correspondingly provided with the alternating magnetic field generator, and each of the induction zones is correspondingly provided with the infrared temperature sensor; The method further includes the following steps: The heating controller is controllably connected to a plurality of the alternating magnetic field generators and a plurality of the infrared temperature sensors; The heating controller controls all the alternating magnetic field generators to heat the induction zones at a set test power for a preset test duration, and obtains the zone temperature data of each induction zone through the corresponding infrared temperature sensor; According to the difference between the zone temperature data and the corresponding preset test temperature data, the adjustment gain value of the operating power of the alternating magnetic field generator corresponding to the zone temperature data is adjusted in an inverse correlation; the greater the difference, the smaller the adjustment gain value of the operating power of the corresponding alternating magnetic field generator; the smaller the difference, the greater the adjustment gain value of the operating power of the corresponding alternating magnetic field generator.

[0018] By adopting the above technical solution, multiple induction zones, alternating magnetic field generators and infrared temperature sensors correspond one by one, enabling the heating controller to independently monitor and control each area of the ceramic disc. Compared with overall temperature control, this avoids process deviations caused by uneven local temperature of the ceramic disc, ensuring the consistency of processes such as wafer attachment and wax removal in different areas. For example, during wax removal, the wax residue conditions at the edge and center of the ceramic disc may be different. Through zone temperature control, targeted heating can be performed on different areas to improve the wax removal effect. After setting the test power and duration, the heating controller can dynamically adjust the adjustment gain value of the alternating magnetic field generator according to the temperature change of each induction zone. When the difference between the zone temperature data and the preset test temperature data is small, the adjustment gain value is increased, enabling the alternating magnetic field generator to respond more quickly to temperature changes and accelerating the heating process; when the difference is large, the adjustment gain value is decreased to prevent temperature overshoot, realizing the dynamic optimization of the heating process, effectively improving the heating efficiency and reducing the overall process time.

[0019] Optionally, the method further includes the following steps: The heating controller is connected to control multiple alternating magnetic field generators and multiple infrared temperature sensors; The heating controller controls all the alternating magnetic field generators to heat the induction zones at a set test power for a preset test duration, and obtains the zone temperature data of each induction zone through the corresponding infrared temperature sensor; According to the difference between the zone temperature data and the corresponding preset test temperature data, the starting phase angle of the alternating magnetic field generator corresponding to the zone temperature data is adjusted in a positive correlation; the greater the difference, the greater the starting phase angle of the corresponding alternating magnetic field generator; the smaller the difference, the smaller the starting phase angle of the corresponding alternating magnetic field generator.

[0020] By adopting the above technical solution, the opening phase angle of the alternating magnetic field generator is positively adjusted based on the difference between the temperature data of the induction partition and the preset test temperature data. When the temperature of the partition deviates greatly from the preset value, the opening phase angle is increased so that the alternating magnetic field generator can be put into operation faster and the temperature of the induction partition is quickly increased. This instant response mechanism greatly shortens the time for the ceramic disk to reach the target temperature, meets the requirements of the semiconductor manufacturing process for rapid temperature adjustment, reduces waiting time, and improves overall production efficiency. Different induction partitions may have uneven temperature distribution due to factors such as position and heat dissipation conditions in actual work. By independently adjusting the opening phase angle of the alternating magnetic field generator for each partition, the temperature difference can be compensated in a targeted manner. For example, for a partition with a lower temperature, the opening phase angle of its alternating magnetic field generator is increased to make it heat up faster, thereby effectively narrowing the temperature gap between the partitions, ensuring that the surface temperature of the ceramic disk is uniform, providing a stable and consistent temperature environment for the attachment and subsequent processes of the wafer, and improving the consistency of product quality. Compared with continuous heating with a fixed power, the method of dynamically adjusting the opening phase angle according to the temperature difference avoids energy waste caused by excessive heating. When the partition temperature is close to the preset value, the opening phase angle of the alternating magnetic field generator is reduced to reduce its working intensity. While ensuring the temperature control effect, it significantly reduces energy consumption, conforms to the concept of green production, and helps enterprises reduce production costs. Stable and accurate temperature control reduces the pressure on the equipment due to frequent temperature fluctuations and overload operation. By reasonably adjusting the opening phase angle of the alternating magnetic field generator, the equipment is prevented from being in a high-load state for a long time, the wear and aging of equipment components are reduced, the overall service life of the equipment is extended, and the cost of equipment maintenance and replacement is reduced, which provides a guarantee for the long-term stable production of the enterprise.

[0021] Optionally, the method further comprises the following steps: Calculate the discrete values ​​of the plurality of partition temperature data as partition discrete values; If the partition discrete value is greater than a preset reference discrete value, the coolant circulation component is started and continuously runs for a preset working time, and the difference between the partition discrete value and the reference discrete value is calculated as a discrete difference; The value of the working time is adjusted according to the positive correlation of the discrete difference; the larger the discrete difference is, the longer the value of the working time is; the smaller the discrete difference is, the larger the value of the working time is.

[0022] By adopting the above technical solution, during the dewaxing process of the ceramic disk, due to uneven wax residue amount and distribution in each partition, there are differences in temperature changes. By calculating the discrete value of the partition temperature data and comparing it with the reference discrete value, the temperature uniformity can be judged. When the partition discrete value is greater than the reference discrete value, the coolant circulation component is started, and the working duration is adjusted according to the discrete difference to take away the excess heat, balance the temperatures of each partition, avoid local overheating or overcooling, improve the dewaxing effect, and ensure that the wafer is in a stable temperature environment. The independent control of the partition temperature combined with the coolant circulation control based on the temperature discrete value can accurately regulate heating and heat dissipation according to the wax residue conditions in different areas, prevent incomplete dewaxing or carbonization of the wax layer, and improve the yield rate. At the same time, monitoring the partition discrete value and reasonably controlling the working duration of the coolant circulation component can extend the working duration to ensure temperature uniformity when the temperature difference is large, and shorten the working duration when the temperature is relatively uniform, avoid energy waste, realize efficient energy utilization, and reduce production costs. In addition, this method can timely adjust the temperatures of each partition, avoid damage to the ceramic disk and the wafer caused by local high temperature, reduce the thermal stress of the equipment, extend the service life of the equipment, and ensure the quality and performance of the wafer.

[0023] Optionally, the method further includes the following steps: Calculate the differences between the temperature data of multiple adjacent said partitions to obtain multiple temperature differences; Calculate the discrete value of multiple said temperature differences as the difference discrete value; Regulate the working speed of the circulation pump positively correlatively according to the difference discrete value; the larger the difference discrete value, the larger the working speed of the circulation pump; the smaller the difference discrete value, the smaller the working speed of the circulation pump.

[0024] By adopting the above technical solution, in the chip scraping and dewaxing link, the uneven distribution of the wax residue amount causes the temperature changes of each partition of the ceramic disk to be asynchronous. By calculating the temperature differences between adjacent partitions and the difference discrete value, the temperature abnormal area can be accurately located. When the difference discrete value is large, it indicates that the temperature distribution is unstable. At this time, increasing the rotation speed of the circulation pump can enhance heat dissipation, promote heat transfer, prevent abnormal melting of the wax layer and damage to the wafer, ensure the smooth progress of the process, reduce the defective rate, and can flexibly adapt to the requirements of different semiconductor manufacturing processes for the temperature uniformity of the ceramic disk. When the difference discrete value is small, it means that the temperature distribution is relatively uniform. Reducing the rotation speed of the circulation pump can avoid energy waste and reduce production costs. Compared with the traditional fixed rotation speed control, dynamically regulating the rotation speed of the circulation pump based on the difference discrete value can reasonably allocate heat dissipation resources and reduce energy consumption. In addition, accurately regulating the rotation speed of the circulation pump can balance the temperatures of each area of the ceramic disk, reduce the thermal stress of the equipment, extend the service life of key components such as the ceramic disk and the electromagnetic induction layer, reduce the equipment maintenance cost, stabilize the operation of the equipment, and ensure the continuity and reliability of the production process.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: The electromagnetic induction layer cooperates with the electromagnetic heating component, which can heat the ceramic disk during the wax removal of the dicing machine, reduce the hardness and viscosity of the wax, improve the wax removal efficiency, and avoid affecting the subsequent process flow.

[0026] The temperature is monitored in real time through the infrared temperature sensor and the water temperature sensor. The power of the alternating magnetic field generator and the circulation pump is adjusted respectively by combining the heating controller and the cooling controller, so as to realize the precise control of the temperature of the ceramic disk and ensure the process stability and reliability.

[0027] The power of the heating and cooling equipment is dynamically adjusted according to the deviation between the actual temperature and the preset value, avoiding the continuous full-load operation of the equipment, reducing energy consumption, and lowering production costs.

[0028] The heating controller, the alternating magnetic field generator, the infrared temperature sensor, the cooling controller, the circulation pump, and the water temperature sensor work together to form an automated temperature control and coolant circulation control system, reducing human operation errors and improving production efficiency and product quality stability.

[0029] The ceramic disk is made of aluminum nitride ceramic material, making it have the characteristics of high thermal conductivity, high hardness, high temperature resistance, and good chemical stability, prolonging the service life of the ceramic disk and improving the stability of the semiconductor manufacturing process.

[0030] The induction grooves are formed by laser micro-machining, ensuring the accuracy and stability of the embedding of the electromagnetic induction layer, avoiding mechanical damage to the surface of the ceramic disk, and improving the performance of the ceramic disk.

[0031] The multiple induction zones of the electromagnetic induction layer respectively correspond to the alternating magnetic field generator and the infrared temperature sensor, and can independently control the temperature of different regions of the ceramic disk, meeting the process requirements of different regions, improving the flexibility and accuracy of temperature control, and enhancing the process adaptability and product quality. Description of the Drawings

[0032] Figure 1 It is a side view of the ceramic disk for attaching the wafer.

[0033] Figure 2 It is Figure 1 The sectional view taken along the line A-A in

[0034] Figure 3 It is the bottom view of the ceramic disk for attaching the wafer, Figure 1 View in the direction of B in

[0035] Figure 4 It is Figure 3 The enlarged view of part C in

[0036] Reference Numerals: 1, ceramic substrate; 2, electromagnetic induction layer; 3, insulating layer; 4, heat dissipation microchannel; 5, induction zone; 6, heat insulation wall. Detailed implementation manners

[0037] The following details the implementation manners of the present application. Examples of the implementation manners are shown in the accompanying drawings.

[0038] In the description of this specification, the description with reference to the terms "certain implementation manners", "one implementation manner", "some implementation manners", "schematic implementation manners", "examples", "specific examples" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the implementation manner or example are included in at least one implementation manner or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation manner or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more implementation manners or examples.

[0039] An embodiment of the present application discloses a ceramic disk for attaching a wafer. Referring to Figure 1 and Figure 2 , it includes a disk-shaped ceramic substrate 1. Induction grooves are formed inside the ceramic substrate 1 by laser micromachining. This processing method has high precision, can ensure the accurate size, shape and position of the induction grooves, and avoid mechanical damage to the surface of the ceramic disk. An electromagnetic induction layer 2 is embedded in the induction grooves. By generating an alternating magnetic field through the coil of the external electromagnetic induction layer 2, an eddy current is generated in the electromagnetic induction layer 2 inside the ceramic disk, realizing rapid heating of a specific area. The surface of the electromagnetic induction layer 2 is covered with an aluminum nitride insulating coating by plasma spraying technology to form an insulating layer 3, preventing current leakage, protecting the structural integrity of the ceramic disk, and improving the use safety.

[0040] The ceramic disk is formed by hot pressing and sintering of aluminum nitride ceramic material, ensuring a low coefficient of thermal expansion and high thermal conductivity. The aluminum nitride ceramic material has excellent properties such as high thermal conductivity, high hardness, high temperature resistance, and good chemical stability. High thermal conductivity helps the ceramic disk transfer heat better. Cooperating with the coolant circulation component, it can dissipate heat more efficiently and maintain the temperature of the ceramic disk stable; the high hardness and high temperature resistance enable the ceramic disk to withstand greater pressure and temperature changes during the CMP process and processes such as wax removal, and are not easily damaged, extending the service life of the ceramic disk; good chemical stability can reduce the possibility of chemical reactions with polishing liquids, chemical reagents, etc., ensuring the reliability of the ceramic disk in a complex process environment and improving the stability of the entire semiconductor manufacturing process.

[0041] The electromagnetic induction layer 2 is correspondingly provided with an electromagnetic heating component, which includes a heating controller, an alternating magnetic field generator and an infrared temperature sensor, and the three are electrically connected to each other. The infrared temperature sensor monitors the temperature of the ceramic disc in real time and transmits the data to the heating controller. The heating controller inversely correlates and controls the working power of the alternating magnetic field generator according to the infrared temperature data. For example, in the wax removal process of the dicing machine, when the temperature of the ceramic disc approaches the preset wax removal temperature, the power of the alternating magnetic field generator is reduced to prevent the temperature from being too high; when the temperature is too low, the power is increased to ensure that the temperature of the ceramic disc is accurately maintained within the set range, improving the stability of the wax removal effect. The infrared temperature sensor monitors the temperature of the ceramic disc in real time and transmits the data to the heating controller. The heating controller inversely correlates and adjusts the working power of the alternating magnetic field generator according to these accurate infrared temperature data. This means that when the temperature of the ceramic disc approaches the preset value, the power of the alternating magnetic field generator is reduced to prevent the temperature from being too high; when the temperature is too low, the power is increased to ensure that the temperature of the ceramic disc can be accurately maintained within the set range, greatly improving the accuracy of temperature control and meeting the strict process requirements for the temperature during the wax treatment on the surface of the ceramic disc. The inverse correlation control mechanism can effectively prevent the temperature of the ceramic disc from being too high due to the continuous high-power operation of the alternating magnetic field generator. Overheating may not only affect the performance of the ceramic disc itself, but also damage the attached wafer. By adjusting the power in real time, the occurrence of overheating is avoided, ensuring the safety of the ceramic disc and the wafer, and extending the service life of the equipment. Dynamically adjusting the power of the alternating magnetic field generator according to the actual temperature of the ceramic disc avoids unnecessary energy waste. When the temperature reaches the appropriate range, the power of the generator is reduced, reducing energy consumption while ensuring the wax removal effect, which conforms to the concept of energy conservation and emission reduction and helps to reduce production costs. The heating controller, the alternating magnetic field generator and the infrared temperature sensor work together to form an automated temperature control system. Without frequent manual intervention, the heating power can be automatically adjusted according to the temperature change of the ceramic disc, improving the automation degree of the production process, reducing human operation errors, and enhancing the stability of production efficiency and product quality.

[0042] Refer to Figure 3 and Figure 4 , the front surface of the ceramic substrate 1 is the attachment surface, and a heat dissipation microchannel 4 is formed on the back surface of the ceramic substrate 1. The heat dissipation microchannel 4 is connected with a coolant circulation component. In this embodiment, the heat dissipation microchannel 4 is a plurality of through holes arranged in an array, and the through holes are hexagonal column-shaped heat dissipation holes, which increase the heat dissipation area, and the heat can also be carried away by the liquid flowing in the coolant circulation component. The coolant circulation component includes a cooling controller, a circulation pump and a water temperature sensor, and the cooling controller is electrically connected to both the circulation pump and the water temperature sensor.

[0043] The cooling controller obtains the water temperature data of the water temperature sensor; controls the working power of the circulation pump in a positive correlation according to the water temperature data; the higher the water temperature data, the higher the working power of the circulation pump; the lower the water temperature data, the lower the working power of the circulation pump.

[0044] For example, in the initial stage of wax removal, the temperature of the ceramic disc is low, and the water temperature sensor detects that the coolant temperature is 28°C. The cooling controller accordingly reduces the working power of the circulation pump, making the circulation pump operate at a relatively low power, for example, 30% of the rated power. When the ceramic disc starts electromagnetic induction heating for wax removal, the temperature rises rapidly, and the coolant temperature reaches 38°C. The cooling controller increases the power of the circulation pump to 60% of the rated power according to the increased water temperature data, accelerating the circulation of the coolant and preventing the ceramic disc from being overheated and affecting the wax removal effect and its own performance.

[0045] The water temperature sensor monitors the temperature of the coolant in real time and transmits the water temperature data to the cooling controller. The cooling controller adjusts the working power of the circulation pump in a positive correlation based on these accurate water temperature data. When the water temperature is high, it means that the ceramic disc generates more heat. At this time, increasing the working power of the circulation pump can accelerate the circulation speed of the coolant, enhance the heat dissipation capacity, timely take away the heat on the ceramic disc, and ensure that the temperature of the ceramic disc is within a suitable range; when the water temperature is low, it indicates that the ceramic disc generates less heat, reducing the working power of the circulation pump to avoid energy waste caused by too fast a circulation speed of the coolant, achieving precise control of the heat dissipation of the ceramic disc. Stable heat dissipation control can effectively prevent the ceramic disc from deteriorating or being damaged due to excessive temperature. By dynamically adjusting the power of the circulation pump according to the water temperature, the ceramic disc is always maintained at an appropriate working temperature, ensuring the stability and reliability of the ceramic disc during the process of attaching the wafer and other related processes, extending the service life of the ceramic disc, and thus ensuring the smooth progress of the semiconductor manufacturing process. Controlling the working power of the circulation pump in a positive correlation according to the water temperature data avoids energy waste caused by the continuous high-power operation of the circulation pump. When the water temperature is low, reducing the power of the circulation pump reduces unnecessary energy consumption, enabling the coolant circulation system to operate in a more energy-efficient manner on the premise of meeting the heat dissipation requirements, meeting the requirements of energy conservation and emission reduction, and helping to reduce production costs. The cooling controller, the circulation pump, and the water temperature sensor constitute an automated coolant circulation control system. This system can automatically adjust the working state of the circulation pump according to the change of the water temperature, without frequent manual intervention, improving the automation degree and intelligent level of the production process, reducing human operation errors, enhancing the stability of production efficiency and product quality, and making the entire semiconductor manufacturing process more efficient and reliable.

[0046] There are two implementation methods for the electromagnetic induction layer 2: The first type uses copper wires as the electromagnetic induction layer 2. The copper wires are in the shape of a spiral coil. Copper wires have good electrical conductivity and electromagnetic induction characteristics. According to the principle of electromagnetic induction, when an alternating magnetic field acts on the copper wires, induced electromotive force and induced current will be generated in the wires, and then Joule heat will be generated. In the wax removal process, it can meet the temperature requirements of the ceramic disc, reduce the hardness and viscosity of the wax, and make the wax scraping process of the wafer dicing machine smoother.

[0047] The second type uses a copper tube as the electromagnetic induction layer 2. The copper tube is also in the shape of a spiral coil and is connected to the heat dissipation microchannel 4. The copper tube has good heat conduction performance and can quickly transfer the heat generated inside the ceramic disc to the heat dissipation microchannel 4. The coolant circulates in the heat dissipation microchannel 4 to take away the heat in time, realizing efficient heat dissipation. Combining the electromagnetic induction and heat dissipation functions together makes the structure of the ceramic disc more compact. It reduces additional heat dissipation components and complex connection structures, which is beneficial to improving the integration of the equipment, saving space, and at the same time reducing the complexity and cost of the system. Through the connection between the copper tube and the heat dissipation microchannel 4, the coolant can be more evenly distributed inside the ceramic disc, so that the heat dissipation of each part of the ceramic disc is more uniform, avoiding local overheating or overcooling, improving the temperature uniformity of the ceramic disc, and being beneficial to ensuring the consistency and stability of the wafer attachment and subsequent processes.

[0048] In the actual semiconductor manufacturing process, due to the possible different process requirements for different parts of the wafer, or the possible differences in the wax residue conditions on different regions of the ceramic disc surface during the wax removal process, the electromagnetic induction layer 2 has multiple induction zones 5. In this embodiment, the shape of the induction zone 5 is an equally divided fan shape. Each induction zone 5 corresponds to an alternating magnetic field generator one by one, and each independent region can be controlled to generate heat separately. It can achieve precise adjustment of the temperature of different regions of the ceramic disc, meet the process requirements of different regions, improve the flexibility and precision of the temperature control of the ceramic disc, and thus enhance the adaptability of the process and the product quality.

[0049] To better achieve the separate control of heat generation, a heat insulation wall 6 is provided on the periphery of each induction zone 5. The heat insulation wall 6 is made of heat insulation material to form a shielding outer wall, reducing the temperature interference between adjacent induction zones 5.

[0050] In the semiconductor manufacturing process, the electromagnetic induction layer 2 works in cooperation with the electromagnetic heating component, playing a crucial role during the wax removal operation of the dicing machine. Through electromagnetic induction heating, the wax on the surface of the ceramic disk can be detached from the cooled and solidified state, effectively reducing the hardness and viscosity of the wax. This change makes the wax removal process during the dicing process of the dicing machine smoother, significantly improving the wax removal efficiency on the surface of the ceramic disk and avoiding the impact on the preparation process of other process flows due to untimely or incomplete wax removal. Electromagnetic induction heating has precise temperature control capabilities, and it can quickly adjust the temperature of the ceramic disk according to actual needs. Therefore, in different process stages, the requirements for wax treatment can be met, ensuring stable and consistent wax removal effects. The reasonable setting of the insulating layer 3 is crucial, as it can effectively prevent the leakage of the current generated by the electromagnetic induction layer 2. This can not only protect the structural integrity of the ceramic disk and extend its service life but also ensure the safety of operators and equipment during use. The heat dissipation microchannels 4 on the back of the ceramic substrate 1 are connected to the coolant circulation component, which can timely remove the excess heat generated by electromagnetic induction heating and other means during the operation of the ceramic disk. Thus, the ceramic disk can always be maintained within a suitable working temperature range, avoiding adverse effects on the performance of the ceramic disk and the effect of attaching the wafer due to excessive temperature, and further ensuring the stability and reliability of the entire process. The unique structural design of this ceramic disk enables it to meet the requirements of attaching the wafer during the chemical mechanical polishing (CMP) process and also meet the requirements of subsequent processes such as wax removal through precise temperature control. This design endows the ceramic disk with strong process adaptability, greatly improving its versatility and practicality in the semiconductor manufacturing process.

[0051] The embodiment of this application also discloses a temperature control method for a ceramic disk used for attaching a wafer. Based on the ceramic substrate 1, the ceramic substrate 1 is used as the core component, and induction grooves are formed inside through high-precision laser microfabrication technology. Inside the induction grooves, the electromagnetic induction layer 2 is precisely embedded. To prevent the leakage of the current generated by the electromagnetic induction layer 2, a layer of aluminum nitride insulating coating is covered on its surface through plasma spraying technology to form the insulating layer 3. Corresponding to the electromagnetic induction layer 2, an electromagnetic heating component is configured. The electromagnetic heating component consists of a heating controller, an alternating magnetic field generator, and an infrared temperature sensor, and the three are electrically connected through a stable circuit to build an accurate temperature sensing and heating regulation system. At the same time, the front surface of the ceramic substrate 1 serves as the attachment surface for attaching the wafer; the back surface of the ceramic substrate 1 is provided with heat dissipation microchannels 4, and the heat dissipation microchannels 4 are connected to the coolant circulation component. The coolant circulation component includes a cooling controller, a circulation pump, and a water temperature sensor, and the three are also electrically connected to jointly achieve the heat dissipation control of the ceramic disk.

[0052] The method includes the following steps: The heating controller first obtains the infrared temperature data of the ceramic disk surface monitored in real time by the infrared temperature sensor. Then, it compares this infrared temperature data with the pre-set heating reference temperature data according to the process requirements and calculates the first temperature difference between the two. Based on this difference, the heating controller inversely adjusts the working power of the alternating magnetic field generator. When the first temperature difference is larger, it means that the current temperature of the ceramic disk is farther from the pre-set heating reference temperature, and at this time, the working power of the alternating magnetic field generator is correspondingly smaller; conversely, when the first temperature difference is smaller, the working power of the alternating magnetic field generator is larger.

[0053] For example, in the wax removal process of the dicing saw in the semiconductor manufacturing process, the pre-set heating reference temperature is 80°C. At the initial stage of wax removal, the infrared temperature sensor detects that the surface temperature of the ceramic disk is 30°C. At this time, the first temperature difference is as high as 50°C, and the heating controller accordingly greatly increases the working power of the alternating magnetic field generator to quickly raise the temperature of the ceramic disk. As the temperature of the ceramic disk gradually rises, when the detected temperature reaches 75°C, the first temperature difference shrinks to 5°C, and the heating controller then reduces the working power of the alternating magnetic field generator to slow down the heating speed and avoid excessive temperature.

[0054] The cooling controller obtains the coolant water temperature data collected in real time by the water temperature sensor, compares this water temperature data with the pre-set cooling reference temperature data, and calculates the second temperature difference. Then, it directly adjusts the working power of the circulation pump according to the second temperature difference. That is, the larger the second temperature difference, the greater the working power of the circulation pump; the smaller the second temperature difference, the smaller the working power of the circulation pump.

[0055] Assume that the pre-set cooling reference temperature is 25°C. At the beginning of wax removal, the ceramic disk generates less heat. The water temperature sensor detects that the coolant temperature is 22°C, and the second temperature difference is 3°C. The cooling controller reduces the working power of the circulation pump to reduce the circulation flow rate of the coolant and avoid energy waste caused by excessive cooling. As the wax removal work continues, the ceramic disk generates a large amount of heat due to factors such as electromagnetic induction heating, and the coolant temperature rises to 30°C. The second temperature difference expands to 5°C, and the cooling controller immediately increases the working power of the circulation pump to accelerate the circulation speed of the coolant and enhance the heat dissipation effect to ensure the stability of the ceramic disk temperature.

[0056] This temperature control method has significant advantages. With the help of an infrared temperature sensor and a water temperature sensor, the system can obtain the surface temperature of the ceramic disc and the coolant temperature in real time and accurately. By calculating the difference between the actual temperature and the preset reference temperature, and accordingly adjusting the power of the alternating magnetic field generator in an inverse correlation and the power of the circulation pump in a positive correlation, precise control of the ceramic disc temperature is achieved. During the wax removal stage, the temperature of the ceramic disc can be stably maintained within the most suitable range for wax shoveling, avoiding carbonization of the wax layer due to excessive temperature, which affects the wax removal quality, or difficulty in wax shoveling due to too low temperature, which fails to effectively reduce the hardness and viscosity of the wax, thus ensuring the stability and reliability of the process.

[0057] Dynamically adjusting the power of the heating and cooling equipment according to the deviation between the actual temperature and the preset value avoids continuous full-load operation of the equipment. When the temperature of the ceramic disc approaches the heating reference temperature, the working power of the alternating magnetic field generator is reduced to reduce unnecessary energy consumption; when the coolant temperature is low, the working power of the circulation pump is reduced to achieve the purpose of energy saving. This intelligent energy consumption management strategy effectively reduces production costs while meeting the process requirements.

[0058] This method can automatically adjust the intensity of heating and cooling according to the heat change of the ceramic disc in different working stages. Whether in the process of attaching the wafer or in subsequent processes such as wax removal, it can quickly adapt to different temperature requirements of the process without manual intervention. For example, during the CMP process, the temperature requirements of the ceramic disc are very different from those during wax removal, and the system can automatically identify and quickly adjust to the appropriate temperature state.

[0059] Stable temperature control can reduce the thermal stress and mechanical stress on components such as the ceramic disc, the electromagnetic induction layer 2, and the cooling system caused by temperature fluctuations. It avoids fatigue damage to components caused by frequent thermal expansion and contraction, thereby extending the overall service life of the equipment and reducing the maintenance and replacement costs of the equipment. Precise temperature control ensures that the ceramic disc is always in the best working state, reduces process interruptions and product defect rates caused by temperature problems, and improves the production efficiency and product quality of semiconductor manufacturing.

[0060] During the wax removal process of the dicing machine, the wax residue situation and thickness in different areas of the ceramic disc surface may be different, and the required temperatures are also different; therefore, the electromagnetic induction layer 2 is divided into multiple induction zones 5. Each induction zone 5 is correspondingly equipped with a dedicated alternating magnetic field generator and an infrared temperature sensor; and a heat insulation wall 6 made of heat insulation material is provided at the periphery of each induction zone 5.

[0061] Based on the above hardware structure, this temperature control method further includes the following steps: The heating controller is connected to multiple alternating magnetic field generators and multiple infrared temperature sensors in a controlled manner.

[0062] Before officially entering the production process, the heating controller will control all alternating magnetic field generators to heat each induction zone 5 at a preset test power for a preset test duration. During this period, the infrared temperature sensors corresponding to each induction zone 5 will monitor the temperature changes in real time and obtain the zone temperature data of each induction zone 5.

[0063] The heating controller will compare the obtained zone temperature data with the corresponding preset test temperature data and calculate the difference between the two. Based on this difference, the adjustment gain value of the operating power of the alternating magnetic field generator corresponding to this zone temperature data will be adjusted in an inverse correlation. Specifically, the larger the difference, the smaller the adjustment gain value of the operating power of the corresponding alternating magnetic field generator; the smaller the difference, the larger the adjustment gain value of the operating power of the corresponding alternating magnetic field generator.

[0064] For example, the ceramic disc is in the shape of a disc and is evenly divided into 6 fan-shaped induction zones 5, which are respectively marked as F1, F2, F3, F4, F5, and F6. Each fan-shaped zone has a dedicated alternating magnetic field generator and an infrared temperature sensor, and heat insulation walls 6 are provided around the zones to avoid heat interference. The preset test temperature is 95 °C, and the heating controller first controls all alternating magnetic field generators to heat each zone at a test power of 130 W for 7 minutes.

[0065] Zone F1: Temperature detection: After 7 minutes, the infrared temperature sensor in zone F1 feeds back that the temperature is 80 °C, which is 15 °C different from the preset test temperature. For example, the wax layer in this zone is thicker, so the temperature rises slowly.

[0066] Adjustment gain value adjustment: Since the difference is large, the heating controller reduces the adjustment gain value of the alternating magnetic field generator in zone F1 from the initial 1.0 to 0.3. If it continues to be detected that the temperature in zone F1 rises slowly and the power needs to be increased, the power increase amplitude each time is controlled within 5 W to prevent the temperature from rising too fast and affecting the wax removal effect.

[0067] Zone F2: Temperature detection: The temperature in this zone is 85 °C, which is 10 °C different from the preset temperature. For example, the wax layer thickness is a little thinner than that in zone F1.

[0068] Adjustment gain value adjustment: The heating controller adjusts the adjustment gain value of the alternating magnetic field generator in zone F2 to 0.6. When the temperature rises subsequently, if the power needs to be increased, each increase is about 7 W, so that this zone can approach the preset temperature faster.

[0069] Zone F3: Temperature detection: The temperature is 90 °C, which is 5 °C different from the preset temperature. The wax layer in this zone is thinner.

[0070] Adjustment of the gain value: The adjustment of the gain value is increased to 0.9. If a slowdown in the temperature rise trend is detected, the heating controller will increase the power by about 10W each time to enable the F3 partition to reach the preset temperature as soon as possible.

[0071] F4 partition: Temperature detection: The temperature is 92°C, with a difference of 3°C from the preset temperature. The wax layer in the partition is relatively thin, and the temperature rises quickly.

[0072] Adjustment of the gain value: The heating controller increases the adjustment gain value of the alternating magnetic field generator in the F4 partition to 1.2. At this time, the temperature is close to the preset value, and fine adjustment is required. When there are slight fluctuations in the temperature, the power adjustment amplitude is controlled at about 2W each time.

[0073] F5 partition: Temperature detection: The temperature is 94°C, with a difference of 1°C from the preset temperature. The wax layer in this partition is very thin, and the temperature is close to the preset value.

[0074] Adjustment of the gain value: The adjustment gain value is further increased to 1.4. When a slight deviation in temperature is detected, the alternating magnetic field generator responds quickly, and the power adjustment amplitude is controlled at about 1W each time to ensure temperature stability.

[0075] F6 partition: Temperature detection: The temperature is 78°C, with a difference of 17°C from the preset temperature. The wax layer in this partition is the thickest among the 6 partitions.

[0076] Adjustment of the gain value: The adjustment gain value is reduced to 0.2. The subsequent power increase is slow, with each increase not exceeding 3W, to avoid temperature overshoot.

[0077] Independent temperature monitoring and control are carried out for the 6 fan-shaped partitions of the disc-shaped ceramic disc. The heating controller dynamically adjusts the adjustment gain value of the alternating magnetic field generator according to the difference between the actual temperature and the preset temperature of each partition. This method can perform targeted heating for the wax residue conditions in different partitions, avoid process deviations caused by uneven local temperature, improve the wax removal effect, achieve dynamic optimization of the heating process, improve heating efficiency, reduce the overall process time, and ensure the quality and consistency of the wax removal process for the wafer.

[0078] By making the multiple induction partitions 5, the alternating magnetic field generators and the infrared temperature sensors correspond one by one, the heating controller can independently monitor and control each area of the ceramic disc. Compared with overall temperature control, this avoids process deviations caused by uneven local temperature of the ceramic disc and ensures the consistency of processes such as wafer wax removal in different areas.

[0079] Taking the wax removal process as an example, in the actual production process, there are often differences in the wax residue situation between the edge and the center of the ceramic disk. Due to faster heat dissipation at the edge, there is relatively more wax residue, and the solidification degree may be more serious; while at the center position, the heat dissipation is slower, and the wax residue is relatively less. Through zone temperature control, when the difference between the zone temperature data of the edge area of the ceramic disk and the preset test temperature data is large, the heating controller will reduce the adjustment gain value of the alternating magnetic field generator in this area, and increase the power at a lower rate to avoid carbonization of the wax layer in the edge area caused by temperature overshoot. On the contrary, for the central area, if the difference between the zone temperature data and the preset test temperature data is small, the heating controller will increase the adjustment gain value of the alternating magnetic field generator in this area, making it respond to temperature changes more quickly and accelerating the heating process, so as to perform targeted heating on different areas and significantly improve the wax removal effect.

[0080] After setting the test power and duration, the heating controller can dynamically adjust the adjustment gain value of the alternating magnetic field generator according to the temperature changes of each induction zone 5. When the difference between the zone temperature data and the preset test temperature data is small, increase the adjustment gain value, so that the alternating magnetic field generator can respond to temperature changes more quickly and accelerate the heating process; when the difference is large, reduce the adjustment gain value to prevent temperature overshoot, realizing the dynamic optimization of the heating process, effectively improving the heating efficiency and reducing the overall process time. In the wafer attachment process, different areas have different requirements for the temperature response speed and the final temperature. Through this dynamically optimized heating control method, the temperature of each area can be quickly and accurately adjusted to the appropriate range, greatly improving the production efficiency and ensuring the product quality.

[0081] Based on the unique multi-zone design of the ceramic disk, the refined control of the temperature of each induction zone 5 is further deepened. The method also includes the following steps: The heating controller is connected to multiple alternating magnetic field generators and multiple infrared temperature sensors.

[0082] Before officially entering the production link, the heating controller will send instructions to all alternating magnetic field generators to heat each induction zone 5 with a preset test power. This heating process lasts for a preset test duration. During this period, the infrared temperature sensor corresponding to each induction zone 5 will monitor the temperature changes in real time and feed back the zone temperature data of each induction zone 5 collected to the heating controller.

[0083] The heating controller compares the obtained zone temperature data with the corresponding preset test temperature data and calculates the difference between the two. According to this difference, the opening phase angle of the alternating magnetic field generator corresponding to this zone temperature data is adjusted positively. That is to say, the larger the difference, the larger the opening phase angle of the corresponding alternating magnetic field generator; the smaller the difference, the smaller the opening phase angle of the corresponding alternating magnetic field generator.

[0084] In the wax removal process of the ingot lifter in semiconductor manufacturing, the ceramic disk is a disk-shaped ceramic disk evenly divided into 6 fan-shaped induction zones 5 (F1, F2, F3, F4, F5, and F6). Each zone is equipped with a dedicated alternating magnetic field generator and an infrared temperature sensor, and there is a heat insulation wall 6 around it. The preset test temperature is 95 °C. The heating controller first controls all the alternating magnetic field generators to heat each zone at a test power of 130 W for 7 minutes.

[0085] Situation of each zone and phase angle adjustment: Zone F1: Temperature detection and difference calculation: After 7 minutes, the infrared temperature sensor in zone F1 feeds back a temperature of 80 °C, which is 15 °C different from the preset test temperature. This zone has not reached the preset temperature.

[0086] Turn on phase angle adjustment: According to the positive correlation adjustment rule, the heating controller increases the turn-on phase angle of the alternating magnetic field generator corresponding to zone F1 from the initial 30° to 80°. The larger turn-on phase angle enables the alternating magnetic field generator to start working faster, enhancing the heating effect and allowing the temperature in zone F1 to rise more rapidly to narrow the gap with the preset temperature.

[0087] Zone F2: Temperature detection and difference calculation: The temperature in this zone is 85 °C, which is 10 °C different from the preset temperature. Compared with zone F1, the gap has decreased.

[0088] Turn on phase angle adjustment: The heating controller adjusts the turn-on phase angle of the alternating magnetic field generator in zone F2 to 60°. This angle is smaller than the adjustment angle of zone F1, but it can still make this zone heat up at an appropriate speed and gradually approach the preset temperature.

[0089] Zone F3: Temperature detection and difference calculation: The temperature is 90 °C, which is 5 °C different from the preset temperature. This indicates that this zone is already closer to the preset temperature.

[0090] Turn on phase angle adjustment: Adjust the turn-on phase angle to 45°. The smaller turn-on phase angle reduces the working intensity of the alternating magnetic field generator, preventing the temperature from rising too fast and exceeding the preset value, and ensuring that the temperature approaches the target steadily.

[0091] Zone F4: Temperature detection and difference calculation: The temperature is 92 °C, which is 3 °C different from the preset temperature. The temperature is already very close to the preset value.

[0092] Turn-on phase angle adjustment: The heating controller adjusts the turn-on phase angle of the alternating magnetic field generator in Zone F4 to 35°. By finely tuning the turn-on phase angle, precise temperature control is achieved, enabling the temperature in this zone to stably approach the preset temperature.

[0093] Zone F5: Temperature detection and difference calculation: The temperature is 94°C, with a 1°C difference from the preset temperature.

[0094] Turn-on phase angle adjustment: The turn-on phase angle is further reduced to 32°. Such a subtle adjustment ensures that the temperature in this zone remains stable near the preset value, avoiding temperature fluctuations.

[0095] Zone F6: Temperature detection and difference calculation: The temperature is 78°C, with a 17°C difference from the preset temperature. It has the largest temperature difference from the preset temperature among the 6 zones.

[0096] Turn-on phase angle adjustment: The heating controller increases the turn-on phase angle of the alternating magnetic field generator in Zone F6 to 90°. This maximizes the working efficiency of the alternating magnetic field generator, speeds up the heating rate in this zone, and enables it to reach the preset temperature as soon as possible.

[0097] By analyzing the difference between the temperature data of each induction zone 5 and the preset temperature data, and positively correlating to adjust the turn-on phase angle of the alternating magnetic field generator, precise heating control can be achieved for the actual temperature conditions of different zones. This refined control method enables each zone to heat up at the most appropriate speed and reach the preset temperature, avoiding situations of excessive or too low local temperature, further improving the temperature uniformity and stability of each zone of the ceramic disk, providing a more precise and reliable temperature environment for the wax removal process of the wafer, and thus enhancing the wax removal effect and product quality.

[0098] To ensure that the ceramic disk used for attaching the wafer always maintains a uniform and stable temperature environment during semiconductor manufacturing, the method further includes the following steps: The heating controller continuously collects the zone temperature data fed back by the infrared temperature sensors corresponding to multiple induction zones 5, and uses statistical methods to calculate the discrete value of these data. The obtained result is the zone discrete value. The discrete value is a key indicator for measuring the degree of data dispersion. In this scenario, it can intuitively reflect the temperature difference degree among the induction zones 5 of the ceramic disk.

[0099] Compare the calculated partition discrete value with the preset reference discrete value. If the partition discrete value is greater than the reference discrete value, it indicates that the temperature distribution in each area of the ceramic disc is severely uneven. At this time, the heating controller will immediately issue an instruction to start the coolant circulation component. After the coolant circulation component is started, it will continue to operate for a preset working duration. During this period, the coolant circulates in the heat dissipation microchannels 4 on the back of the ceramic disc, taking away the excess heat generated by electromagnetic induction heating of the ceramic disc, and helping to balance the temperature between each partition.

[0100] While the coolant circulation component is operating, the heating controller will calculate the difference between the partition discrete value and the reference discrete value, that is, the discrete difference. According to the discrete difference, the working duration of the coolant circulation component is adjusted in a positive correlation. The larger the discrete difference, the higher the degree of temperature unevenness. The system will correspondingly extend the working duration of the coolant circulation component to perform heat exchange more fully and improve the uneven temperature distribution; the smaller the discrete difference, the system will appropriately shorten the working duration to avoid excessive cooling, reduce energy consumption while ensuring temperature uniformity.

[0101] Assume a large partition temperature difference: During the dewaxing process, the temperatures of 6 partitions are collected, and the obtained temperature data are 80°C, 95°C, 100°C, 85°C, 110°C, and 90°C respectively. The calculated partition discrete value is 13.2°C, which is greater than the reference discrete value of 12°C. The system immediately starts the coolant circulation component and calculates the discrete difference as 13.2 - 12 = 1.2°C. Since the discrete difference is positive, and according to the positive correlation adjustment rule, the working duration of the coolant circulation component needs to be extended. Therefore, the working duration is extended from the preset 10 minutes to 13 minutes to enhance heat dissipation and balance the temperature of each partition. After 13 minutes of coolant circulation, the temperatures of each partition are detected again, and it is found that the temperature distribution is more uniform, and the discrete value has decreased to 10°C. The dewaxing effect has been significantly improved, effectively avoiding the dewaxing quality problems caused by too high or too low local temperature.

[0102] Assume a small partition temperature difference: Temperature acquisition and discrete value calculation: In another dewaxing operation, the temperature data of 6 partitions are 92°C, 94°C, 93°C, 95°C, 92°C, and 94°C respectively. After calculation, the partition discrete value is 1.3°C, which is significantly less than the reference discrete value of 12°C. Although the partition discrete value is less than the reference discrete value at this time, in order to maintain temperature stability, the system still starts the coolant circulation component. Calculate the discrete difference as 1.3 - 12 = -10.7°C. According to the positive correlation adjustment rule, when the discrete difference is negative, the working duration should be shortened, so the working duration is shortened from the preset 10 minutes to 3 minutes. After 3 minutes of coolant circulation, the temperatures of each partition remain stable, and the discrete value remains at a low level, not only ensuring the dewaxing effect but also avoiding energy waste caused by excessive cooling, achieving efficient use of energy.

[0103] When the ceramic disk is dewaxing, due to uneven wax residue and distribution in different zones, there are differences in the temperature changes of each zone during the heating process. By calculating the discrete values of the zone temperature data and comparing them with the reference discrete values, the temperature uniformity of each zone of the ceramic disk can be effectively judged. When the discrete value of a zone is greater than the reference discrete value, start the coolant circulation component and adjust the working duration according to the discrete difference, which can take away heat and balance the temperatures of each zone. When the temperature of some zones is too high due to a large amount of wax residue and high heating power, the coolant circulation system can accelerate heat dissipation, making the temperatures of each zone tend to be consistent, preventing dewaxing quality problems caused by local overheating or overcooling, and providing a stable temperature environment for the wafer. Precise temperature control is crucial for the dewaxing effect. Independent control of the zone temperature can perform precise heating according to the wax residue amount, while the coolant circulation control based on the temperature discrete value can avoid incomplete dewaxing or wax layer carbonization caused by uneven local temperature. For example, in some areas with less wax residue and a fast temperature rise, timely heat dissipation through the coolant circulation component can prevent the temperature of this area from being too high; while the areas with more wax residue continue to be heated appropriately to ensure that the wax melts sufficiently, thereby improving the overall dewaxing effect and the yield rate of the wafer. By monitoring the discrete value of the zone and reasonably controlling the working duration of the coolant circulation component, unnecessary energy consumption can be avoided. When the discrete value of the zone is close to or less than the reference discrete value, it indicates that the temperatures of each zone are relatively uniform. At this time, shorten the working duration of the coolant circulation component to reduce energy consumption. When the temperature difference is large, extend the working duration to ensure temperature uniformity, achieving efficient utilization of energy while ensuring the quality of the dewaxing process and reducing production costs. Continuous local high temperature will not only affect the dewaxing effect but also may cause damage to the ceramic disk and the wafer. By adjusting the temperature of each zone in a timely manner through this method, it is possible to avoid an increase in the thermal stress of the equipment and changes in the physical properties of the wafer caused by too high temperature, extend the service life of the equipment, reduce the equipment maintenance cost, and ensure the quality and performance of the wafer.

[0104] To further improve the regulation of the temperature uniformity of the ceramic disk, the method further includes the following steps: The heating controller continuously collects the zone temperature data fed back by the infrared temperature sensors corresponding to each induction zone 5. For multiple adjacent induction zones 5, calculate the differences in the temperature data between them one by one, thereby obtaining multiple temperature differences. This step can accurately capture the temperature changes between adjacent areas of the ceramic disk and provide basic data for subsequent analysis of the unevenness of the temperature distribution.

[0105] After obtaining multiple temperature differences, the heating controller uses statistical methods to calculate the discrete value of these temperature differences, which is defined as the difference discrete value. The difference discrete value can quantify the unevenness of the temperature distribution on the ceramic disc surface. The larger the discrete value, the more unstable the temperature difference between adjacent partitions, and the more uneven the temperature distribution; on the contrary, it indicates that the temperature distribution is relatively uniform.

[0106] The heating controller adjusts the working speed of the circulation pump in a positive correlation according to the calculated difference discrete value. Specifically, when the difference discrete value is large, it indicates a large temperature difference between adjacent partitions. At this time, the working speed of the circulation pump is increased to accelerate the circulation speed of the coolant in the heat dissipation microchannel 4, enhance the heat dissipation effect, so that heat can be transferred from the high-temperature area to the low-temperature area faster, and promote temperature balance; when the difference discrete value is small, it means that the temperature distribution is relatively uniform, and the working speed of the circulation pump is reduced to avoid excessive heat dissipation and reduce energy consumption.

[0107] For example, the ceramic disc is divided into 6 fan-shaped induction partitions 5, which are respectively marked as P1, P2, P3, P4, P5, and P6. Each partition is equipped with an exclusive alternating magnetic field generator and an infrared temperature sensor, and the disc body is provided with a heat dissipation microchannel 4 connected to the coolant circulation system.

[0108] In the initial stage of dewaxing: large temperature difference: At the beginning of the dewaxing operation, due to different wax residues in each partition, the temperature difference is obvious. The temperature difference between P1-P2 is 12 °C, P2-P3 is 8 °C, P3-P4 is 15 °C, P4-P5 is 10 °C, P5-P6 is 9 °C, and P6-P1 is 13 °C. After calculation by statistical methods, the discrete value of these temperature differences is 3.5 °C, and the value is relatively large, indicating that the temperature difference between adjacent partitions is unstable and the temperature distribution is uneven. The heating controller increases the circulation pump speed from the initial 800 revolutions per minute to 1500 revolutions per minute according to the difference discrete value. The high-speed circulating coolant accelerates heat transfer, enabling the heat in the high-temperature area (such as P3) to quickly flow to the low-temperature area, and promoting the temperature of each partition to tend to balance.

[0109] In the middle stage of dewaxing: the temperature tends to be uniform: As the dewaxing progresses, the wax layers in each partition gradually melt, and the temperature difference decreases. At this time, the temperature difference between P1-P2 is 4 °C, P2-P3 is 3 °C, P3-P4 is 5 °C, P4-P5 is 3 °C, P5-P6 is 2 °C, and P6-P1 is 4 °C. The discrete value of the temperature difference is calculated again, and the result is 1.2 °C, which is significantly lower than that in the initial stage, indicating that the temperature distribution between adjacent partitions tends to be uniform. The heating controller reduces the circulation pump speed to 1000 revolutions per minute to avoid excessive heat dissipation and reduce energy consumption.

[0110] Late wax removal stage: The temperature is basically balanced. By the late stage of wax removal, the wax layers in each partition are basically removed and the temperature is basically the same. The temperature difference between P1 and P2 is 1°C, between P2 and P3 is 0.5°C, between P3 and P4 is 1.2°C, between P4 and P5 is 0.8°C, between P5 and P6 is 0.6°C, and between P6 and P1 is 1°C. The calculated discrete value of the temperature difference is 0.3°C, which is very small, indicating that the temperature distribution in adjacent partitions is very uniform. The heating controller further reduces the rotational speed of the circulation pump to 600 revolutions per minute, maintaining heat dissipation while minimizing energy consumption.

[0111] In the wax scraping and removal process, the uneven distribution of wax residue causes the temperature changes in each partition of the ceramic disk to be asynchronous. By calculating the temperature difference and the discrete value of the difference between adjacent partitions, the abnormal temperature area can be accurately located. When the discrete value of the temperature difference between adjacent partitions is large, it indicates that the temperature distribution in these areas is extremely unstable. At this time, increasing the rotational speed of the circulation pump can quickly enhance the heat dissipation effect, promote the flow of heat from the high-temperature area to the low-temperature area, prevent problems such as insufficient melting of the wax layer and damage to the wafer due to local overheating or overcooling, ensure the smooth progress of the wax scraping and removal process, and significantly reduce the defective rate. Different semiconductor manufacturing processes have different requirements for the temperature uniformity of the ceramic disk. This regulation method based on the discrete value of the difference can flexibly adjust the rotational speed of the circulation pump according to the actual temperature distribution, enabling the ceramic disk to quickly adapt to various process requirements and providing a stable and reliable temperature environment for different process links.

[0112] When the discrete value of the difference is small, it indicates that the temperature distribution of the ceramic disk is relatively uniform. At this time, reducing the rotational speed of the circulation pump can avoid energy waste caused by excessive circulation of the coolant, and effectively reduce energy consumption on the premise of ensuring temperature uniformity. For example, in the late stage of the wax scraping and removal process, as the wax layer is gradually removed, the temperature in each partition tends to be balanced. By reducing the rotational speed of the circulation pump, unnecessary energy consumption can be significantly reduced and production costs can be lowered. Compared with the traditional fixed-speed circulation pump control method, dynamically adjusting the rotational speed of the circulation pump based on the discrete value of the difference can accurately control the heat dissipation intensity according to the real-time temperature distribution of the ceramic disk, achieve reasonable allocation of heat dissipation resources, and avoid unreasonable energy consumption.

[0113] Uneven temperature distribution of the ceramic disk will cause the equipment components to bear large thermal stresses, which are likely to cause problems such as equipment deformation and damage under long-term action. By precisely regulating the rotational speed of the circulation pump and timely balancing the temperature in each area of the ceramic disk, the thermal stress of the equipment can be effectively reduced, the service life of the key components of the equipment, such as the ceramic disk, electromagnetic induction layer 2, cooling system, etc., can be extended, and the equipment maintenance and replacement costs can be reduced. A stable temperature environment helps to maintain the performance stability of each component of the equipment, reduce the interference caused by temperature fluctuations to the operation of the equipment, ensure the long-term stable operation of the equipment, and improve the continuity and reliability of the production process.

[0114] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A ceramic plate for attaching a wafer, characterized in that: The invention comprises a ceramic substrate (1), wherein an induction groove is arranged in the ceramic substrate (1), and an electromagnetic induction layer (2) is embedded in the induction groove; an insulating layer (3) is arranged on the surface of the electromagnetic induction layer (2); and an electromagnetic heating component is arranged corresponding to the electromagnetic induction layer (2); The front side of the ceramic substrate (1) is an attachment side, and the back side of the ceramic substrate (1) is provided with a heat dissipation microchannel (4), wherein the heat dissipation microchannel (4) is connected to a cooling liquid circulation component.

2. The ceramic plate for attaching wafers according to claim 1, characterized in that: The electromagnetic heating assembly comprises a heating controller, an alternating magnetic field generator and an infrared temperature sensor, wherein the heating controller is electrically connected to the alternating magnetic field generator and the infrared temperature sensor; The heating controller obtains infrared temperature data of the infrared temperature sensor; and anti-correlatively controls the working power of the alternating magnetic field generator according to the infrared temperature data; the higher the infrared temperature data, the lower the working power of the alternating magnetic field generator; and the lower the infrared temperature data, the higher the working power of the alternating magnetic field generator.

3. The ceramic plate for attaching wafers according to claim 1, characterized in that: The coolant circulation assembly comprises a cooling controller, a circulation pump and a water temperature sensor, wherein the cooling controller is electrically connected to the circulation pump and the water temperature sensor; The cooling controller obtains water temperature data from the water temperature sensor; controls the working power of the circulation pump in a positive correlation with the water temperature data; the higher the water temperature data, the higher the working power of the circulation pump; the lower the water temperature data, the lower the working power of the circulation pump.

4. The ceramic plate for attaching wafers according to claim 1, characterized in that: The ceramic disc is made of aluminum nitride ceramic material by hot pressing and sintering, and the sensing groove is formed by laser micromachining; The electromagnetic induction layer (2) has a plurality of induction partitions (5), each of the induction partitions (5) corresponds to the alternating magnetic field generator, and a heat insulation wall (6) is arranged around the periphery of each induction partition (5).

5. The ceramic plate for attaching wafers according to claim 1, characterized in that: The electromagnetic induction layer (2) is a copper wire or a copper tube; when the electromagnetic induction layer (2) is a copper tube, the copper tube is connected to the heat dissipation microchannel (4).

6. A temperature control method for a ceramic plate for attaching a wafer, characterized in that: Based on a ceramic substrate (1), an induction groove is arranged in the ceramic substrate (1), and an electromagnetic induction layer (2) is embedded in the induction groove; an insulating layer (3) is arranged on the surface of the electromagnetic induction layer (2); an electromagnetic heating component is arranged corresponding to the electromagnetic induction layer (2); the electromagnetic heating component comprises a heating controller, an alternating magnetic field generator and an infrared temperature sensor, and the heating controller is electrically connected to the alternating magnetic field generator and the infrared temperature sensor; The front side of the ceramic substrate (1) is an attachment side, and the back side of the ceramic substrate (1) is provided with a heat dissipation microchannel (4), and the heat dissipation microchannel (4) is connected to a coolant circulation component, and the coolant circulation component comprises a cooling controller, a circulation pump and a water temperature sensor, and the cooling controller is electrically connected to the circulation pump and the water temperature sensor; The method comprises the following steps: The heating controller acquires infrared temperature data of the infrared temperature sensor; Calculating a first temperature difference between the infrared temperature data and preset heating reference temperature data; adjusting the operating power of the alternating magnetic field generator in an anti-correlated manner according to the first temperature difference; the larger the first temperature difference, the smaller the operating power of the alternating magnetic field generator; the smaller the first temperature difference, the larger the operating power of the alternating magnetic field generator; The cooling controller obtains water temperature data of the water temperature sensor; Calculating a second temperature difference between the water temperature data and preset cooling reference temperature data; adjusting the operating power of the circulation pump in a positive correlation with the second temperature difference; The larger the second temperature difference is, the greater the operating power of the circulating pump is; The smaller the second temperature difference is, the smaller the operating power of the circulation pump is.

7. The temperature control method for a ceramic plate for attaching wafers according to claim 6, characterized in that: The electromagnetic induction layer (2) has a plurality of induction partitions (5), each of the induction partitions (5) corresponds to the alternating magnetic field generator, and each of the induction partitions (5) corresponds to the infrared temperature sensor; The method further comprises the steps of: The heating controller controls and connects a plurality of the alternating magnetic field generators and a plurality of the infrared temperature sensors; The heating controller controls all the alternating magnetic field generators to heat the induction partitions (5) at a set test power for a preset test duration, and obtains partition temperature data of each of the induction partitions (5) through the corresponding infrared temperature sensor; According to the difference between the partition temperature data and the corresponding preset test temperature data, the adjustment gain value of the working power of the alternating magnetic field generator corresponding to the partition temperature data is anti-correlatedly adjusted; the larger the difference, the smaller the corresponding adjustment gain value of the working power of the alternating magnetic field generator; the smaller the difference, the larger the corresponding adjustment gain value of the working power of the alternating magnetic field generator.

8. The temperature control method for a ceramic plate for attaching wafers according to claim 7, characterized in that: The method further comprises the steps of: The heating controller controls and connects a plurality of the alternating magnetic field generators and a plurality of the infrared temperature sensors; The heating controller controls all the alternating magnetic field generators to heat the induction partitions (5) at a set test power for a preset test duration, and obtains partition temperature data of each of the induction partitions (5) through the corresponding infrared temperature sensor; According to the difference between the partition temperature data and the corresponding preset test temperature data, the opening phase angle of the alternating magnetic field generator corresponding to the partition temperature data is positively correlated and adjusted; the larger the difference is, the larger the corresponding opening phase angle of the alternating magnetic field generator is; the smaller the difference is, the smaller the corresponding opening phase angle of the alternating magnetic field generator is.

9. The temperature control method for a ceramic plate for attaching wafers according to claim 7, characterized in that: The method further comprises the steps of: Calculate the discrete values ​​of the plurality of partition temperature data as partition discrete values; If the partition discrete value is greater than a preset reference discrete value, the coolant circulation component is started and continuously runs for a preset working time, and the difference between the partition discrete value and the reference discrete value is calculated as a discrete difference; Adjust the value of the working time according to the positive correlation of the discrete difference; The larger the discrete difference is, the longer the working time is; The smaller the discrete difference is, the larger the value of the working time is.

10. The temperature control method for a ceramic plate for attaching wafers according to claim 9, characterized in that: The method further comprises the steps of: Calculating the difference between the temperature data of a plurality of adjacent partitions to obtain a plurality of temperature difference values; Calculate the discrete values ​​of the plurality of temperature differences as difference discrete values; The operating speed of the circulation pump is adjusted according to the positive correlation of the difference discrete value; the larger the difference discrete value, the greater the operating speed of the circulation pump; the smaller the difference discrete value, the smaller the operating speed of the circulation pump.

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