Semiconductor part chemical nickel device capable of swinging in three-dimensional mode

Abstract

The invention belongs to the technical field of chemical nickel equipment, and particularly relates to a three-dimensional swinging chemical nickel device for semiconductor parts, which comprises an outer groove, an inner groove, a support, a driving mechanism, a lifting mechanism, a transverse moving mechanism, a longitudinal moving mechanism, a swinging frame and a workpiece suspension frame, and the driving mechanism comprises a driving motor, a driving eccentric wheel, an adjusting rod, a linkage rocker and a driving shaft. The lifting mechanism comprises a lifting belt clamping plate assembly, a lifting rod, a lifting guide assembly, a vertical driving frame and a riding wheel assembly. When the driving shaft rotates, the lifting rod drives the swing frame to move up and down. The transverse moving mechanism comprises a linkage eccentric wheel, a linkage driving lever and a transverse cam groove plate, and the linkage driving lever drives the swing frame to move left and right when ascending and descending. The longitudinal moving mechanism comprises a longitudinal cam groove plate, a V seat fixing plate, a longitudinal moving guide rail and a guide rail support, and the V seat fixing plate longitudinally moves relative to the guide rail support. According to the invention, three-dimensional swinging of the workpiece can be realized, and the chemical nickel plating quality of semiconductor parts is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electroless nickel equipment, and particularly relates to an electroless nickel device for semiconductor components with three-dimensional swing. Background Art

[0002] Components of semiconductor manufacturing equipment, such as cavity components, transmission components, nozzles, bases, etc., usually work in high-temperature, strongly corrosive gas or plasma environments. Therefore, extremely strict requirements are imposed on the performance of surface coatings. Due to the extremely high requirements for cleanliness, corrosion resistance, and wear resistance in the semiconductor manufacturing environment, key components usually need to be surface-treated to improve their performance. Electroless nickel plating is a self-catalytic reduction reaction without an external power supply. By immersing a metal substrate in a plating solution containing nickel salts, reducing agents, and stabilizers, nickel is uniformly deposited on the surface of the substrate. Compared with traditional electroplating, electroless nickel plating can form a uniform coating on the surface of components with complex shapes and is not affected by the conductivity of the substrate.

[0003] During the electroless nickel plating process, the generation of bubbles is a common problem. Especially on the surface of semiconductor equipment components with complex shapes, bubbles may stay in local areas, resulting in coating defects such as pinholes, uneven coatings, or peeling. If the bubbles cannot escape in time, coating vacancies will form in local areas, affecting the continuity of the coating. Appropriate movement of the components can change the flow state of the plating solution, making it easier for bubbles to detach from the surface and preventing bubbles from shielding the contact between the plating solution and the substrate. Continuously shaking slightly or slowly rotating the workpiece can prevent bubbles from accumulating in specific areas and ensure that the plating solution uniformly covers the entire surface. At the same time, the movement of the components can promote the flow of the plating solution, continuously supplement fresh plating solution to the reaction interface, and improve the chemical reaction efficiency.

[0004] Chinese invention patent CN 216856492 U3 discloses a vibration device for an electroless nickel-palladium-gold production line for circuit boards, which can make the printed circuit board vibrate and shake during the soaking process in the medicine tank, ensure the vibration duration, and can improve the chemical treatment speed and degree of the printed circuit board. However, the structure of this production line is not suitable for the operation of a single device, and at the same time, the movement is relatively simple, unable to achieve compound movement in three direction dimensions, and the defoaming effect is not good. Summary of the Invention

[0005] Aiming at the above-mentioned deficiencies of the prior art, the problem to be solved by the present invention is that existing electroless nickel equipment cannot effectively remove surface bubbles from high-precision and complex-shaped semiconductor components, and the defects may reduce the corrosion resistance and wear resistance of the components and affect their stability in the semiconductor manufacturing environment. The present invention provides an electroless nickel device for semiconductor components with three-dimensional swing, which uses 3D swing and shaking to prevent bubbles from accumulating in specific areas and ensure that the plating solution uniformly covers the entire surface of the semiconductor components.

[0006] To achieve the above object, the present invention discloses a chemical nickel device for semiconductor components with three-dimensional swing, including an outer tank, an inner tank, a bracket, a driving mechanism, a lifting mechanism, a transverse movement mechanism, a longitudinal movement mechanism, a swing frame, and a workpiece suspension bracket.

[0007] The inner tank is installed inside the outer tank, and the workpiece undergoes chemical nickel reaction inside the inner tank. A bracket is installed on the periphery of the outer tank.

[0008] The driving mechanism includes a driving motor, a driving eccentric wheel, an adjusting rod, a linkage rocker, and a driving shaft. A driving rocker and a linkage rocker are installed on the driving shaft; the driving motor drives the driving eccentric wheel to rotate, and the driving eccentric wheel drives the driving shaft to perform reciprocating rotation within a certain angular range through the adjusting rod and the driving rocker.

[0009] The driving shaft drives the linkage rocker, and a linkage rod is installed between the linkage rocker of the driving shaft and the linkage rocker of the driven shaft. The driving shaft and the driven shaft rotate synchronously.

[0010] There are two sets of the lifting mechanism, the transverse movement mechanism, and the longitudinal movement mechanism, which are symmetrically arranged on both outer sides and are respectively driven by the driving shaft and the driven shaft to move synchronously; the swing frame is located at the upper part of the outer side.

[0011] The lifting mechanism includes a sling clamping plate assembly, a lifting rod, a lifting guide assembly, a vertical driving frame, and a supporting wheel assembly. The sling clamping plate assembly includes a sling fixed on the driving shaft or the driven shaft, a clamping plate locked on the sling, and a connecting plate. The connecting plate is fixedly connected with the lifting rod. The lifting rod is arranged vertically and is inserted into the lifting guide assembly. The upper part of the lifting rod is connected with the vertical driving frame, and a supporting wheel assembly is installed on the vertical driving frame. The supporting wheel assembly is provided with an upper roller and a lower roller, and the upper roller and the lower roller are sleeved on the swing frame. When the driving shaft rotates, the swing frame moves up and down through the lifting rod.

[0012] The transverse movement mechanism includes a linkage eccentric wheel, a linkage lever, and a transverse cam groove plate. The linkage eccentric wheel is installed at the end of the driving shaft or the driven shaft. A rectangular frame is arranged at the bottom of the linkage lever, and a cam follower on the linkage eccentric wheel is inserted into the rectangular frame. When the linkage eccentric wheel rotates and revolves, it drives the linkage lever to rise and fall; a cam follower is installed at the top of the linkage lever, and the cam of the cam follower is inserted into the inclined strip-shaped groove of the transverse cam groove plate. The transverse cam groove plate is fixedly connected to the swing frame. When the linkage lever rises and falls, it drives the swing frame to move left and right.

[0013] The longitudinal movement mechanism includes a longitudinal cam groove plate, a V-block fixing plate, longitudinal guide rails, and guide rail brackets. The vertical drive frame is connected to the longitudinal cam groove plate. The longitudinal cam groove plate is horizontally arranged. An inclined strip-shaped groove is provided in the longitudinal cam groove plate. The lower part of the V-block fixing plate is connected with a cam follower. The cam follower is inserted into the strip-shaped groove of the longitudinal cam groove plate. There are two guide rail brackets, which are symmetrically and fixedly connected to the swing frame. There are two longitudinal guide rails, which are installed on both sides of the V-block fixing plate. Cams are installed on the guide rail brackets and the cams cooperate with the longitudinal guide rails. When the swing frame moves relative to the vertical drive frame, the longitudinal cam groove plate drives the V-block fixing plate to move longitudinally relative to the guide rail brackets.

[0014] A V-block is installed on the V-block fixing plate. A workpiece suspension bracket is movably connected between the two V-blocks on both sides. The workpiece to be reacted is hoisted under the workpiece suspension bracket.

[0015] According to another embodiment of the present invention or any of the foregoing embodiments of the electroless nickel device, wherein the bracket includes a left support frame, a right support frame, and connecting rods. The left support frame and the right support frame respectively support the transverse movement mechanism, the longitudinal movement mechanism, and the lifting mechanism of the driving part and the driven part. There are more than four connecting rods, and the connecting rods connect the left support frame and the right support frame.

[0016] According to another embodiment of the present invention or any of the foregoing embodiments of the electroless nickel device, wherein a speed reducer is installed between the driving motor and the driving eccentric wheel, and the driving motor is installed on the bracket.

[0017] According to another embodiment of the present invention or any of the foregoing embodiments of the electroless nickel device, wherein each set of lifting mechanisms includes two sling splint assemblies, lifting rods, and lifting guide assemblies, which are symmetrically arranged. The tops of the two lifting rods are connected to the vertical drive frame.

[0018] According to another embodiment of the present invention or any of the foregoing embodiments of the electroless nickel device, wherein the swing frame is a rectangular frame body and surrounds the outside of the inner groove.

[0019] According to another embodiment of the present invention or any of the foregoing embodiments of the electroless nickel device, wherein the cross section of the lifting rod during lifting is diamond-shaped. The guide assembly includes two fixing plates. One of the fixing plates is installed on the bracket. More than two guide wheels are inserted between the two fixing plates. A V-shaped groove is provided in the middle of the guide wheel, and the lifting rod is embedded in the V-shaped groove.

[0020] According to another embodiment of the present invention or any of the foregoing embodiments of the electroless nickel device, wherein a guide rail is provided on the side of the linkage lever. The guide rail is installed on the vertical column, and the side of the linkage lever is matched with the guide rail through a slider.

[0021] According to the electroless nickel device of another embodiment of the present invention or any of the foregoing embodiments, when the lifting rod rises, the linkage lever descends; when the lifting rod descends, the linkage lever rises; the cam follower of the linkage lever applies a reverse force to the transverse cam groove plate to balance the lifting amplitude of the swing frame and improve stability.

[0022] According to the electroless nickel device of another embodiment of the present invention or any of the foregoing embodiments, the vertical drive frame is connected to the longitudinal cam groove plate through a hollow plate, and the longitudinal cam groove plate and the transverse cam groove plate are both provided with hollow holes for weight reduction.

[0023] According to the electroless nickel device of another embodiment of the present invention or any of the foregoing embodiments, two sets of cam followers are installed at the lower part of the V-seat fixing plate, and two oblique strip-shaped grooves are provided on the longitudinal cam groove plate to cooperate with the cam followers.

[0024] According to the electroless nickel device of another embodiment of the present invention or any of the foregoing embodiments, there are four V-shaped seats, which are symmetrically arranged in pairs on the V-seat fixing plates on both sides of the workpiece suspension bracket.

[0025] Advantages of the present invention:

[0026] The three-dimensional swing electroless nickel device for semiconductor components of the present invention realizes the three-dimensional swing of the workpiece suspension bracket through the lifting mechanism, the transverse movement mechanism and the longitudinal movement mechanism, making the semiconductor components move more three-dimensionally, changing the flow state of the plating solution, making it easier for bubbles to break away from the surface, and avoiding the shielding of the plating solution from contacting the substrate by bubbles. It can also promote the flow of the plating solution, continuously supplement fresh plating solution to the reaction interface, and improve the chemical reaction efficiency. Thereby improving the quality of electroless nickel plating of semiconductor components, making the components have excellent corrosion resistance, wear resistance and stability in a high-demand semiconductor manufacturing environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a three-dimensional schematic diagram of the three-dimensional swing electroless nickel device for semiconductor components of the present invention;

[0028] Figure 2 is a left view schematic diagram of the three-dimensional swing electroless nickel device for semiconductor components of the present invention;

[0029] Figure 3 is a front view schematic diagram of the three-dimensional swing electroless nickel device for semiconductor components of the present invention;

[0030] Figure 4 is a three-dimensional enlarged schematic diagram of the drive mechanism and the transverse movement mechanism of the present invention;

[0031] Figure 5 is a front view enlarged schematic diagram of the drive mechanism and the transverse movement mechanism of the present invention;

[0032] Figure 6 It is the enlarged front view schematic diagram of the lifting mechanism described in the present invention;

[0033] Figure 7 It is the enlarged right view schematic diagram of the lifting mechanism described in the present invention;

[0034] Figure 8 It is the enlarged three-dimensional schematic diagram of the longitudinal movement mechanism described in the present invention;

[0035] Figure 9 It is the enlarged bottom view schematic diagram of the longitudinal movement mechanism described in the present invention;

[0036] Figure 10 It is the three-dimensional color schematic diagram of the three-dimensional swing chemical nickel device for semiconductor components described in the present invention;

[0037] In the figure: 1. Outer tank; 2. Bracket; 3. Driving motor; 4. Adjusting rod; 5. Driving shaft; 6. Linkage eccentric wheel; 7. Linkage lever; 8. Transverse cam groove plate; 9. Swing frame; 10. Inner tank; 11. Suspender splint assembly; 12. Lifting rod; 13. Lifting guide assembly; 14. Linkage rocker; 15. Linkage rod; 16. Supporting wheel assembly; 17. Guide rail bracket; 18. V-block fixing plate; 19. Longitudinal cam groove plate; 20. Workpiece suspension hanger; 21. Vertical driving frame; 22. V-block; 23. Longitudinal movement guide rail; 24. Driven shaft. Specific embodiments

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] As Figure 1 、 10 shown, a three-dimensional swing chemical nickel device for semiconductor components includes an outer tank 1, an inner tank 10, a bracket 2, a driving mechanism, a lifting mechanism, a transverse movement mechanism, a longitudinal movement mechanism, a swing frame 9, and a workpiece suspension hanger 20. The swing frame 9 is a rectangular frame and surrounds the outside of the inner tank 10.

[0040] As Figure 1 、 10As shown in the figure, the inner groove 10 is installed in the outer groove 1. The workpiece undergoes chemical nickel reaction in the inner groove 10. A bracket 2 is installed around the outer groove 1. The bracket 2 includes a left support frame, a right support frame, and connecting rods. The left support frame and the right support frame respectively support the cross-movement mechanism, longitudinal movement mechanism, and lifting mechanism of the driving part and the driven part. There are more than four connecting rods, and the connecting rods connect the left support frame and the right support frame.

[0041] As Figure 1 , 2 , 4, and 5 show that the driving mechanism includes a driving motor 3, a driving eccentric wheel, an adjusting rod 4, a linkage rocker 14, and a driving shaft 5. A driving rocker and a linkage rocker 14 are installed on the driving shaft 5. The driving motor 3 drives the driving eccentric wheel to rotate. The driving eccentric wheel drives the driving shaft 5 to make a reciprocating rotation within a certain angular range through the adjusting rod 4 and the driving rocker. A speed reducer is installed between the driving motor 3 and the driving eccentric wheel, and the driving motor 3 is installed on the bracket 2.

[0042] As Figure 1 , 3 As shown in the figure, the driving shaft 5 drives the linkage rocker 14. A linkage rod 15 is installed between the linkage rocker 14 of the driving shaft 5 and the linkage rocker 14 of the driven shaft 24. The driving shaft 5 and the driven shaft 24 rotate synchronously.

[0043] As Figure 1 , 3 , and 4 show that there are two sets of lifting mechanisms, cross-movement mechanisms, and longitudinal movement mechanisms, which are symmetrically arranged on both outer sides and are respectively driven by the driving shaft 5 and the driven shaft 24 to move synchronously. The swing frame 9 is located in the upper part of the outer side.

[0044] As Figure 1 , 2 , 6, and 7 show that the lifting mechanism includes a sling clamping plate assembly 11, a lifting rod 12, a lifting guide assembly 13, a vertical driving frame 21, and a roller assembly 16. The sling clamping plate assembly 11 includes a sling fixed to the driving shaft 5 or the driven shaft 24, a clamping plate locked on the sling, and a connecting plate. The connecting plate is fixedly connected with a lifting rod 12. The lifting rod 12 is vertically arranged and is inserted into the lifting guide assembly 13. The upper part of the lifting rod 12 is connected with a vertical driving frame 21. A roller assembly 16 is installed on the vertical driving frame 21. The roller assembly 16 is provided with an upper roller and a lower roller, and the upper roller and the lower roller are sleeved on the swing frame 9. When the driving shaft 5 rotates, the swing frame 9 is driven to move up and down through the lifting rod 12. Each set of lifting mechanisms includes two sling clamping plate assemblies 11, lifting rods 12, and lifting guide assemblies 13, which are symmetrically arranged. The tops of the two lifting rods 12 are connected with the vertical driving frame 21. The lifting cross-section of the lifting rod 12 is diamond-shaped. The guide assembly includes two fixing plates, one of which is installed on the bracket 2. More than two guide wheels are inserted between the two fixing plates. A V-shaped groove is arranged in the middle of the guide wheels, and the lifting rod 12 is embedded in the V-shaped groove.

[0045] As Figure 1 、 3 、4, and 5 show, the transverse movement mechanism includes a linkage eccentric wheel 6, a linkage lever 7, and a transverse cam groove plate 8. The linkage eccentric wheel 6 is installed at the end of the drive shaft 5 or the driven shaft 24. A rectangular frame is provided at the bottom of the linkage lever 7, and the cam follower on the linkage eccentric wheel 6 is inserted into the rectangular frame. When the linkage eccentric wheel 6 rotates and revolves, it drives the linkage lever 7 to rise and fall. A cam follower is installed at the top of the linkage lever 7, and the cam of the cam follower is inserted into the inclined strip-shaped groove of the transverse cam groove plate 8. The transverse cam groove plate 8 is fixedly connected to the swing frame 9. When the linkage lever 7 rises and falls, it drives the swing frame 9 to move left and right. A guide rail is provided on the side of the linkage lever 7, and the guide rail is installed on the vertical column. The side of the linkage lever 7 is matched with the guide rail through a slider. When the lifting rod 12 rises, the linkage lever 7 descends. When the lifting rod 12 descends, the cam follower of the linkage lever 7 exerts a reverse force on the transverse cam groove plate 8 to balance the lifting amplitude of the swing frame 9 and improve stability.

[0046] As Figure 1 、 3 、8, and 9 show, the longitudinal movement mechanism includes a longitudinal cam groove plate 19, a V-seat fixing plate 18, longitudinal guide rails 23, and guide rail brackets 17. The vertical drive frame 21 is connected to the longitudinal cam groove plate 19. The longitudinal cam groove plate 19 is horizontally arranged, and an inclined strip-shaped groove is provided in the longitudinal cam groove plate 19. A cam follower is connected to the lower part of the V-seat fixing plate 18, and the cam follower is inserted into the strip-shaped groove of the longitudinal cam groove plate 19. There are two guide rail brackets 17, which are symmetrically and fixedly connected to the swing frame 9. There are two longitudinal guide rails 23, which are installed on both sides of the V-seat fixing plate 18. Cams are installed on the guide rail brackets 17 and the cams are matched with the longitudinal guide rails 23. When the swing frame 9 moves relative to the vertical drive frame 21, the longitudinal cam groove plate 19 drives the V-seat fixing plate 18 to move longitudinally relative to the guide rail brackets 17. The vertical drive frame 21 is connected to the longitudinal cam groove plate 19 through a hollow plate. The longitudinal cam groove plate 19 and the transverse cam groove plate 8 are both provided with hollow holes for weight reduction.

[0047] As Figure 1 、 6 、10 show, a V-shaped seat 22 is installed on the V-seat fixing plate 18. A workpiece suspension bracket 20 is movably connected between the two V-shaped seats 22 on both sides, and a workpiece to be reacted is suspended and hoisted under the workpiece suspension bracket 20. Two groups of cam followers are installed at the lower part of the V-seat fixing plate 18, and two inclined strip-shaped grooves are provided on the longitudinal cam groove plate 19 to cooperate with the cam followers. There are four V-shaped seats 22, and they are symmetrically arranged in pairs on the V-seat fixing plates 18 on both sides of the workpiece suspension bracket 20.

[0048] The working principle of the present invention:

[0049] During the electroless nickel plating process, the generation of bubbles is a common problem. Especially on the surface of semiconductor device components with complex shapes, bubbles may remain in local areas, resulting in coating defects such as pinholes, uneven coatings, or peeling. These defects may reduce the corrosion resistance and wear resistance of the components and affect their stability in the semiconductor manufacturing environment.

[0050] In the present invention, through a driving motor 3, under the action of the linkage rod 15, the coordinated linkage of the two sets of lifting mechanisms, transverse movement mechanisms, and longitudinal movement mechanisms on the driving side and the driven side is realized, enabling the semiconductor components to be plated to perform continuous and synchronous coordinated movements in the horizontal (X-axis), longitudinal (Y-axis), and vertical (Z-axis) directions. Among them, the lifting rod 12 drives the vertical driving frame 21 and the swing frame 9 to move up and down under the action of the sling splint, and the lifting guide assembly 13 limits its movement. The linkage lever 7 drives the cam follower, and under the action of the transverse cam groove plate 8, drives the swing frame 9 to reciprocate in the X-axis direction. When the longitudinal cam groove plate 19 moves relative to the swing frame 9 and the V-seat fixing plate 18, it drives the V-seat fixing plate 18 to perform longitudinal reciprocating movement. That is, in the X direction and Z direction, the swing frame 9 is moved, and in the Y direction, the V-seat fixing plate 18 is moved. Such a design method avoids the coordination problem of multi-degree-of-freedom interference of three-dimensional swing and reduces the design difficulty.

[0051] The above-mentioned mechanical perturbations with multiple degrees of freedom not only effectively improve the fluidity of the plating solution on the surface of the components but also significantly disrupt the aggregation and adhesion of bubbles on the local surface. Since the common bubble retention phenomenon during the electroless plating process often occurs at the dead corners, grooves, or inner cavities of the components, these areas are extremely prone to coating defects due to bubble coverage. Through the above-mentioned three-dimensional coordinated movement, the contact interface between the workpiece surface and the plating solution continuously changes, prompting the attached bubbles to be continuously peeled off and released, preventing them from staying on the surface to form blind spots.

[0052] In addition, the alternating movement of the components in different directions can also enhance the perturbation of the local plating solution, improve the plating solution circulation efficiency, avoid the formation of concentration gradients, and promote a more uniform and stable deposition reaction. Compared with the traditional static electroless plating process, the dynamic perturbation mechanism brought by this kind of linkage mechanism can significantly improve the density, adhesion, and uniformity of the coating without increasing additional energy consumption, effectively improving the finished product yield and service life.

[0053] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the above embodiments are only for explaining the technical concept and features of the present invention, and their purpose is to enable those familiar with this technology to understand the content of the present invention and implement it, and cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A three-dimensional swinging chemical nickel device for semiconductor components, comprising an outer tank (1), an inner tank (10), a bracket (2), a driving mechanism, a lifting mechanism, a lateral movement mechanism, a longitudinal movement mechanism, a swing frame (9), and a workpiece suspension frame (20), The inner tank (10) is installed in the outer tank (1), the workpiece undergoes a chemical nickel reaction in the inner tank (10), and a bracket (2) is installed on the periphery of the outer tank (1). Features: The driving mechanism comprises a driving motor (3), a driving eccentric wheel, an adjusting rod (4), a linkage rocker (14), and a driving shaft (5), wherein the driving rocker and the linkage rocker (14) are mounted on the driving shaft (5); the driving motor (3) drives the driving eccentric wheel to rotate, and the driving eccentric wheel drives the driving shaft (5) to reciprocate within a certain angle range through the adjusting rod (4) and the driving rocker; The driving shaft (5) drives the linkage rocker (14), and a linkage rod (15) is installed between the linkage rocker (14) of the driving shaft (5) and the linkage rocker (14) of the driven shaft (24), so that the driving shaft (5) and the driven shaft (24) rotate synchronously. The lifting mechanism, the transverse movement mechanism and the longitudinal movement mechanism are provided in two groups, which are symmetrically arranged on both sides of the outer side and are driven by the driving shaft (5) and the driven shaft (24) respectively, and move synchronously; the swing frame (9) is located at the upper part of the outer side. The lifting mechanism comprises a sling clamp plate assembly (11), a lifting rod (12), a lifting guide assembly (13), a vertical driving frame (21), and a supporting wheel assembly (16). The sling clamp plate assembly (11) comprises a sling fixedly connected to a driving shaft (5) or a driven shaft (24), a clamp plate locked on the sling, and a connecting plate. The connecting plate is fixedly connected to the lifting rod (12). The lifting rod (12) is vertically arranged. The lifting rod (12) is inserted into the lifting guide assembly (13). The upper part of the lifting rod (12) is connected to the vertical driving frame (21). The supporting wheel assembly (16) is installed on the vertical driving frame (21). The supporting wheel assembly (16) is provided with an upper roller and a lower roller. The upper roller and the lower roller are sleeved on the swing frame (9). When the driving shaft (5) rotates, the swing frame (9) is driven to move up and down through the lifting rod (12). The transverse movement mechanism comprises a linkage eccentric wheel (6), a linkage lever (7), and a transverse cam groove plate (8). The linkage eccentric wheel (6) is mounted on the end of a driving shaft (5) or a driven shaft (24). A rectangular frame is arranged at the bottom of the linkage lever (7). A cam follower on the linkage eccentric wheel (6) is inserted into the rectangular frame. When the linkage eccentric wheel (6) rotates and revolves, the linkage lever (7) is driven to rise and fall. A cam follower is arranged on the top of the linkage lever (7). The cam of the cam follower is inserted into the oblique strip groove of the transverse cam groove plate (8). The transverse cam groove plate (8) is fixedly connected to the swing frame (9). When the linkage lever (7) is raised or lowered, the swing frame (9) is driven to move left and right. The longitudinal movement mechanism comprises a longitudinal cam groove plate (19), a V-seat fixing plate (18), a longitudinal movement guide rail (23), and a guide rail bracket (17); the vertical driving frame (21) is connected to the longitudinal cam groove plate (19); the longitudinal cam groove plate (19) is arranged horizontally; an oblique strip groove is arranged in the longitudinal cam groove plate (19); a cam follower is connected to the lower part of the V-seat fixing plate (18); the cam follower is inserted into the strip groove of the longitudinal cam groove plate (19); there are two guide rail brackets (17), which are symmetrically fixedly connected to the swing frame (9); there are two longitudinal movement guide rails (23), which are installed on both sides of the V-seat fixing plate (18); a cam is installed on the guide rail bracket (17), and the cam cooperates with the longitudinal movement guide rail (23); when the swing frame (9) moves relative to the vertical driving frame (21), the longitudinal cam groove plate (19) drives the V-seat fixing plate (18) to move longitudinally relative to the guide rail bracket (17); A V-shaped seat (22) is installed on the V-shaped seat fixing plate (18), and a workpiece suspension frame (20) is movably connected between the V-shaped seats (22) on both sides, and the workpiece to be reacted is suspended under the workpiece suspension frame (20).

2. A three-dimensionally oscillating semiconductor component chemical nickel device according to claim 1, characterized in that: The bracket (2) comprises a left support frame, a right support frame, and connecting rods. The left support frame and the right support frame respectively support the transverse movement mechanism, the longitudinal movement mechanism, and the lifting mechanism of the driving part and the driven part. There are more than four connecting rods, and the connecting rods connect the left support frame and the right support frame.

3. A three-dimensionally oscillating chemical nickel device for semiconductor components according to claim 1 or 2, characterized in that: A reduction box is installed between the driving motor (3) and the driving eccentric wheel, and the driving motor (3) is installed on the bracket (2).

4. The three-dimensionally oscillating semiconductor component chemical nickel device according to claim 1, characterized in that: Each lifting mechanism comprises two sling clamping plate assemblies (11), a lifting rod (12), and a lifting guide assembly (13), which are symmetrically arranged, and the tops of the two lifting rods (12) are connected to a vertical driving frame (21).

5. The three-dimensionally oscillating chemical nickel device for semiconductor components according to claim 1, characterized in that: The swing frame (9) is a rectangular frame body surrounding the outer side of the inner groove (10).

6. The three-dimensionally oscillating semiconductor component chemical nickel device according to claim 1, characterized in that: The lifting cross-section of the lifting rod (12) is rhombus-shaped, and the guide assembly comprises two fixed plates, one of which is mounted on the bracket (2), and two or more guide wheels are inserted between the two fixed plates, and a V-shaped groove is arranged in the middle of the guide wheel, and the lifting rod (12) is embedded in the V-shaped groove.

7. The three-dimensionally oscillating chemical nickel device for semiconductor components according to claim 1, characterized in that: A guide rail is arranged on the side of the linkage lever (7), and the guide rail is installed on the vertical column. The side of the linkage lever (7) cooperates with the guide rail through a sliding block.

8. The three-dimensionally oscillating semiconductor component chemical nickel device according to claim 1, characterized in that: When the lifting rod (12) rises, the linkage lever (7) falls; when the lifting rod (12) falls, the linkage lever (7) rises; the cam follower of the linkage lever (7) applies a reverse force to the transverse cam slot plate (8) to balance the lifting and lowering range of the swing frame (9) and improve stability.

9. The three-dimensionally oscillating semiconductor component chemical nickel device according to claim 1, characterized in that: The vertical driving frame (21) is connected to the longitudinal cam slot plate (19) via a hollow plate, and the longitudinal cam slot plate (19) and the transverse cam slot plate (8) are both provided with hollow holes for weight reduction.

10. The three-dimensionally oscillating semiconductor component chemical nickel device according to claim 1, characterized in that: Two groups of cam followers are installed at the lower part of the V-seat fixing plate (18), and two oblique strip grooves are arranged on the longitudinal cam groove plate (19) to cooperate with the cam followers; there are four V-shaped seats (22), which are symmetrically arranged on the V-seat fixing plate (18) on both sides of the workpiece suspension frame (20).

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