Electroplating device, electroplating method, computer readable storage medium and computer carrier

Abstract

The invention relates to the technical field of semiconductors, in particular to an electroplating device, an electroplating method, a computer readable storage medium and a computer carrier, the electroplating device comprises an electroplating cavity, a clamp assembly and a flow forming element, and the flow forming element is provided with a flow surface facing the front face of a wafer. The flow surface is parallel to the front surface of the wafer and forms a flat flow channel with the front surface of the wafer, and the flat flow channel allows electroplating liquid to flow in from one side of the flat flow channel, horizontally and tangentially flow through the front surface of the wafer and then flow out from the other side of the flat flow channel; the first sealing part is annularly arranged around the periphery of the clamp assembly; the second sealing part is annularly arranged around the peripheral cavity opening of the electroplating cavity; when the wafer carried by the clamp assembly is completely immersed in the electroplating liquid for electroplating, the first sealing part and the second sealing part can be combined and sealed to form a sealing body, and the sealing body seals the electroplating liquid which flows in from one side of the flat flow channel, horizontally and tangentially flows through the front face of the wafer and flows out from the other side of the flat flow channel during electroplating.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to an electroplating device, an electroplating method, a computer-readable storage medium, and a computer carrier. Background Art

[0002] Wafer electroplating refers to the method of using an electrochemical reaction to reduce metal ions in the electroplating solution to metal and deposit them on specific areas of the wafer surface, which is an important link in the semiconductor manufacturing process.

[0003] In related technologies, the electroplating solution flows in one direction towards the wafer and forms a high-speed tangential flow field on the surface of the wafer, and then flows out in another direction. As Figure 1 shown, during the electroplating process, to ensure the uniformity and electroplating rate of electroplating, the electroplating solution needs to uniformly and rapidly form a tangential flow across the wafer surface. However, in the actual electroplating process, the fixture of the wafer and the electroplating cavity are not in a completely sealed state, and there is a physical gap between them during the electroplating solution. Due to the existence of this gap, in addition to the outlet direction of the electroplating solution, the physical gap in the circumferential direction is also a path for the electroplating solution to flow out.

[0004] When the electroplating solution overflows from the above gap, it will cause the electroplating solution to change the flow direction of the tangential flow, as Figure 2 shown, thereby affecting the uniformity and electroplating efficiency of electroplating. To avoid the above problems, a Teflon sealing ring is usually filled at the gap between the fixture and the electroplating cavity.

[0005] However, the above sealing ring cannot completely prevent the electroplating solution from overflowing, and it will still cause the electroplating solution to change the flow direction of the tangential flow, affecting the uniformity and electroplating efficiency of the electroplating solution. In addition, during the electroplating process, the fixture rotates relative to the electroplating cavity and the sealing ring at a speed of 5 to 200 revolutions per minute, and when the fixture enters and exits the electroplating cavity, the fixture moves up and down repeatedly relative to the electroplating cavity and the sealing ring. The relative rotation and up-and-down movement of the fixture cause the outside of the fixture to repeatedly rub against the sealing ring, resulting in wear of the sealing ring and causing the electroplating solution to overflow. Frequent replacement of the sealing ring will affect production efficiency, and the particles generated after the sealing ring wears will affect the product yield. Summary of the Invention

[0006] In view of this, embodiments of the present application provide an electroplating device, an electroplating method, a computer-readable storage medium, and a computer carrier to solve the problem that the sealing ring of the electroplating device cannot meet the usage requirements.

[0007] In a first aspect, an embodiment of the present application provides an electroplating device, including an electroplating cavity and a fixture assembly. The electroplating device further includes: a flow forming element having a flow surface facing the front surface of the wafer. The flow surface is parallel to the front surface of the wafer and separated from the front surface of the wafer when the fixture assembly carries the wafer for electroplating in the electroplating solution, forming a laminar flow channel through which the electroplating solution can flow horizontally. The laminar flow channel allows the electroplating solution to flow into from one side of the laminar flow channel during electroplating, flow horizontally tangentially across the front surface of the wafer, and then flow out from the other side of the laminar flow channel; a first sealing portion, which is annularly arranged around the outer periphery of the fixture assembly; a second sealing portion, which is annularly arranged at the outer peripheral opening of the electroplating cavity. The first sealing portion and the second sealing portion are corresponding to each other in the up-and-down position. When the wafer carried by the fixture assembly is completely immersed in the electroplating solution for electroplating, the first sealing portion and the second sealing portion can be combined to form a sealed body, and the sealed body can seal the electroplating solution that flows into from one side of the laminar flow channel during electroplating, flows horizontally tangentially across the front surface of the wafer, and then flows out from the other side of the laminar flow channel, so as to prevent the electroplating solution from overflowing in a direction other than that defined by the laminar flow channel.

[0008] In combination with the first aspect, the first sealing portion includes at least one downwardly arranged lower sealing protrusion. The uppermost ends of the lower sealing protrusions are located in the same plane or different planes, and at least one lower sealing groove is formed between two adjacent lower sealing protrusions.

[0009] In combination with the first aspect, the second sealing portion includes at least one upwardly arranged upper sealing protrusion. The lowermost ends of the upper sealing protrusions are located in the same plane or different planes, and at least one upper sealing groove is formed between two adjacent upper sealing protrusions; wherein each upper sealing groove can insert a corresponding lower sealing protrusion, and each lower sealing groove can insert a corresponding upper sealing protrusion, so that the first sealing portion and the second sealing portion form a sealed body.

[0010] In combination with the first aspect, when the fixture assembly gradually immerses the wafer into the electroplating solution, the lower sealing protrusions and the lower sealing grooves in the first sealing portion can move downward as the fixture assembly moves downward, so that part or all of the lower sealing protrusions are gradually inserted into the upper sealing grooves in the second sealing portion, and the lower sealing grooves gradually accommodate part or all of the upper sealing protrusions in the second sealing portion, forming a non-contact coupling combined seal.

[0011] In combination with the first aspect, when the wafer carried by the fixture assembly is completely immersed in the electroplating solution for fixed electroplating, the first sealing portion and the second sealing portion are relatively fixed. At this time, there is a first preset gap between the bottom of the lower sealing protrusion and the bottom of the upper sealing groove, and there is a second preset gap between the top of the upper sealing protrusion and the bottom of the lower sealing groove.

[0012] In combination with the first aspect, when part or all of the lower sealing protrusion is gradually inserted into the upper sealing groove in the second sealing portion, and when the lower sealing groove gradually accommodates part or all of the upper sealing protrusion in the second sealing portion, the lower sealing protrusion and the upper sealing protrusion have a preset spacing on both sides.

[0013] In combination with the first aspect, when the first sealing part and the second sealing part form a sealing body, in the sealing body, two adjacent preset spacings are connected through the first preset gap or the second preset gap, so that the preset spacing, the first preset gap and the second preset gap together form a blocking channel, and the blocking channel has a plurality of blocking corners formed by an upper sealing protrusion, an upper sealing groove, a lower sealing protrusion and a lower sealing groove. The blocking channel prevents the plating liquid from overflowing from the sealing body in the direction defined by the non-horizontal flow channel through the blocking corners.

[0014] In combination with the first aspect, the depths of the upper sealing groove and the lower sealing groove are both M, and the heights of the upper sealing protrusion and the lower sealing protrusion are both N. The corresponding settings of M and N can form a first preset gap between the top of the lower sealing protrusion and the bottom of the upper sealing groove, and form a second preset gap between the top of the upper sealing protrusion and the bottom of the lower sealing groove. The dimensions of the first preset gap and the second preset gap are between 0.1 mm and 5 mm, and M and N are both greater than 0.

[0015] In combination with the first aspect, M is equal to N, and the sizes of M and N are both between 10 mm and 50 mm.

[0016] In combination with the first aspect, a side of the first sealing portion close to the inside of the electroplating chamber is set as a first corner, and the first corner is composed of a plane connecting the side of the lower sealing protrusion closest to the inside of the electroplating chamber and the top of the lower sealing protrusion; a target upper sealing protrusion docked with the first corner is set on the side of the second sealing portion close to the inside of the electroplating chamber, and the upper surface width of the target upper sealing protrusion is greater than the upper surface width of the adjacent upper sealing protrusion; when the target upper sealing protrusion is docked with the first corner, a first plane gap is formed by the plane connecting the upper surface of the target upper sealing protrusion and the top of the lower sealing protrusion, and the first plane gap is respectively connected to the inside of the electroplating chamber and the blocking channel of the sealing body, so that the plating solution entering from the first plane gap during electroplating can flow into the blocking channel in the sealing body formed by the first sealing portion and the second sealing portion.

[0017] In combination with the first aspect, a second corner is arranged on a side of the second sealing portion close to the inside of the electroplating cavity, and the second corner is composed of a plane connecting the side surface of the upper sealing protrusion closest to the inside of the electroplating cavity and the bottom of the upper sealing protrusion; a target lower sealing protrusion docked with the second corner is arranged on the side of the first sealing portion close to the inside of the electroplating cavity, and the lower surface width of the target lower sealing protrusion is greater than the lower surface width of the adjacent lower sealing protrusion; when the target lower sealing protrusion docks with the second corner, a second plane gap is formed by a plane connecting the upper surface of the target lower sealing protrusion and the bottom of the upper sealing protrusion, and the second plane gap is respectively connected to the inside of the electroplating cavity and the blocking channel of the sealing body, so that the plating liquid entering from the second plane gap during electroplating can flow into the blocking channel in the sealing body formed by the first sealing portion and the second sealing portion.

[0018] In combination with the first aspect, the first sealing part has three lower sealing protrusions and two lower sealing grooves, the second sealing part has four upper sealing protrusions and three upper sealing grooves. During fixed electroplating, the three lower sealing protrusions are respectively inserted into the corresponding three upper sealing grooves, and the two lower sealing grooves respectively accommodate the middle two of the four upper sealing protrusions to form a sealing body. The flow-blocking channel in the sealing body has 10 flow-blocking corners to prevent the plating liquid from overflowing the sealing body.

[0019] In combination with the first aspect, there are three lower sealing protrusions, two lower sealing grooves, three upper sealing protrusions, and two upper sealing grooves. During fixed electroplating, the two lower sealing protrusions located on the outside of the electroplating cavity are respectively inserted into the corresponding two upper sealing grooves, and the two upper sealing protrusions located on the inside of the electroplating cavity are respectively inserted into the two lower sealing grooves to form a sealing body. The flow-blocking channel in the sealing body has 8 flow-blocking corners to prevent the plating liquid from overflowing the sealing body.

[0020] In combination with the first aspect, the planar widths of the lower sealing protrusion and the upper sealing protrusion are both greater than or equal to 2 mm and less than or equal to 10 mm.

[0021] In combination with the first aspect, a slope is provided on the top of the upper sealing protrusion, and the cross-sectional dimension of the slope gradually decreases from bottom to top.

[0022] In combination with the first aspect, an open groove is provided at the top of the upper sealing protrusion, and the cross-sectional dimension of the open groove gradually decreases in a direction from bottom to top.

[0023] Second aspect, an embodiment of the present application provides an electroplating method, which is applied to the electroplating device provided above. The electroplating method includes: the fixture assembly of the electroplating device carries the wafer and descends to a first position and then tilts by a preset angle; the fixture assembly carries the wafer and immerses it in the electroplating solution in an inclined state and descends to a second position; the fixture assembly is restored to a non-inclined state; the fixture assembly carries the wafer and descends, so that the first sealing part of the electroplating device is combined with the second sealing part of the electroplating device until the wafer descends to a third position after the first sealing part and the second sealing part form a sealed body; electroplating is performed by flowing the electroplating solution in from one side of the laminar flow channel, so that the electroplating solution flows tangentially across the front surface of the wafer horizontally to deposit a metal layer on the front surface of the wafer; the sealed body can seal the electroplating solution that flows in from one side of the laminar flow channel, flows tangentially across the front surface of the wafer horizontally, and then flows out from the other side of the laminar flow channel during electroplating, so as to prevent the electroplating solution from overflowing in a direction not defined by the laminar flow channel.

[0024] Combined with the second aspect, the step of the fixture assembly carrying the wafer and descending, so that the first sealing part of the electroplating device is combined with the second sealing part of the electroplating device until the wafer descends to a third position after the first sealing part and the second sealing part form a sealed body includes: controlling the first sealing part to perform a preset up and down movement to adjust the third position; wherein, the preset up and down movement is configured to allow the first sealing part to move up and down after the first sealing part and the second sealing part are combined to form a sealed body, so that while the first sealing part and the second sealing part maintain the combined form to form a sealed body and do not affect the sealing performance of the sealed body, the third position changes correspondingly; based on the adjusted third position, adjusting the corresponding electroplating process; based on the flow field and / or electric field in the adjusted electroplating process, flowing in a matching electroplating solution from one side of the laminar flow channel for electroplating, so that the electroplating solution flows tangentially across the front surface of the wafer horizontally to deposit a metal layer on the front surface of the wafer.

[0025] Third aspect, an embodiment of the present application provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of the electroplating method provided above are implemented.

[0026] Fourth aspect, an embodiment of the present application provides a computer carrier, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, the steps of the electroplating method provided above are implemented.

[0027] Applying the technical solution of the present application, the wafer is placed on the fixture assembly and the side of the wafer faces the electroplating cavity. Since the first sealing portion and the second sealing portion correspond to each other in the vertical position, the fixture assembly drives the wafer to move towards the electroplating cavity. When the wafer carried by the fixture assembly is completely immersed in the electroplating solution for electroplating, at this time, the first sealing portion and the second sealing portion can be combined and sealed to form a sealing body. The sealing body can seal the electroplating solution that flows in from one side of the laminar flow channel, horizontally tangentially flows across the front surface of the wafer, and then flows out from the other side of the laminar flow channel during electroplating, so as to prevent the electroplating solution from overflowing in the direction not defined by the laminar flow channel, and a uniform and stable high-speed tangential flow field is formed on the surface of the wafer. Compared with the sealing method using a Teflon sealing ring in the related art, the first sealing portion and the second sealing portion are sealed and matched to form a sealing body. There is no wear between the first sealing portion and the second sealing portion, and thus no wear particles are generated. The sealing performance does not change significantly over time, ensuring the uniformity and strength of the flow field. On the one hand, it does not affect the product yield, and on the other hand, it is not necessary to frequently replace the first sealing portion and the second sealing portion, improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] By describing the embodiments of the present application in more detail in conjunction with the drawings, the above and other objects, features, and advantages of the present application will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application, and do not constitute a limitation to the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0029] Figure 1 The figure shows a schematic diagram of the flow field of an electroplating device in the related art.

[0030] Figure 2 The figure shows another schematic diagram of the flow field of an electroplating device in the related art.

[0031] Figure 3 The figure shows a schematic structural diagram of an electroplating device provided in Embodiment 1 of the present application.

[0032] Figure 4 As shown in Figure 3 the enlarged partial view of part A in

[0033] Figure 5 The figure shows a partial structural diagram of an electroplating device provided in Embodiment 2 of the present application.

[0034] Figure 6 The figure shows a schematic structural diagram of an upper sealing protrusion provided in an embodiment of the present application.

[0035] Figure 7 The figure shows a schematic structural diagram of an upper sealing protrusion provided in another embodiment of the present application.

[0036] Figure 8 The following is a schematic structural diagram of the upper sealing projection provided by another embodiment of the present application.

[0037] Figure 9 The following is a schematic diagram of the flow field of the electroplating device provided by the embodiment of the present application.

[0038] Figure 10 The following is a flowchart of the electroplating method provided by the embodiment of the present application.

[0039] Reference numerals: 1. Wafer; 10. Electroplating cavity; 11. Flow formation element; 20. Fixture assembly; 30. Sealing body; 31. First sealing part; 311. Lower sealing projection; 312. Lower sealing groove; 314. Target lower sealing projection; 32. Second sealing part; 321. Upper sealing projection; 3211. Inclined surface; 3212. Opening groove; 322. Upper sealing groove; 323. Target upper sealing projection; 325. Carrier plate; 33. First planar gap; 34. Second planar gap; 40. Flow blocking channel; 41. First preset gap; 42. Second preset gap; 43. Preset spacing; 44. Flow blocking corner. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0041] Exemplarily, as Figure 3 and Figure 9 shown, Embodiment 1 of the present invention provides an electroplating device. The electroplating device includes an electroplating cavity 10 and a fixture assembly 20. The electroplating device further includes a flow formation element 11, a first sealing part 31, and a second sealing part 32.

[0042] The flow formation element 11 has a flow surface facing the front surface of the wafer 1. The flow surface is parallel to the front surface of the wafer 1 and separated from the front surface of the wafer 1 when the fixture assembly carries the wafer 1 for electroplating in the electroplating solution, forming a flat flow channel through which the electroplating solution can flow horizontally. The flat flow channel allows the electroplating solution to flow into from one side of the flow channel during electroplating, flow horizontally tangentially through the front surface of the wafer 1, and then flow out from the other side of the flow channel.

[0043] The first sealing portion 31 is disposed annularly around the fixture assembly 20, and the second sealing portion 32 is disposed annularly around the orifice of the electroplating cavity 10. The first sealing portion 31 and the second sealing portion 32 are correspondingly arranged in the up-and-down positions. When the wafer 1 carried by the fixture assembly 20 is completely immersed in the electroplating solution for electroplating, the first sealing portion 31 and the second sealing portion 32 can be combined and sealed to form a sealing body 30. The sealing body 30 can seal the electroplating solution that flows into from one side of the laminar flow channel, horizontally tangentially flows across the front surface of the wafer 1, and then flows out from the other side of the laminar flow channel during electroplating, so as to prevent the electroplating solution from overflowing in the direction not defined by the laminar flow channel.

[0044] Applying the technical solution of the present application, the wafer 1 is placed on the fixture assembly 20, and the wafer 1 faces one side of the electroplating cavity 10. Since the first sealing portion 31 and the second sealing portion 32 are correspondingly arranged in the up-and-down positions, the fixture assembly 20 drives the wafer 1 to move towards the electroplating cavity 10. When the wafer 1 carried by the fixture assembly 20 is completely immersed in the electroplating solution for electroplating, the first sealing portion 31 and the second sealing portion 32 can be combined and sealed to form a sealing body 30, so as to seal the electroplating solution that flows into from one side of the laminar flow channel, horizontally tangentially flows across the front surface of the wafer 1, and then flows out from the other side of the laminar flow channel during electroplating, so as to prevent the electroplating solution from overflowing in the direction not defined by the laminar flow channel, and a uniform and stable high-speed tangential flow field is formed on the surface of the wafer 1. Compared with the sealing method using a Teflon sealing ring in the related art, the first sealing portion 31 and the second sealing portion 32 are sealed and matched to form a sealing body 30. No wear will occur between the first sealing portion 31 and the second sealing portion 32, and thus no wear particles will be generated. The sealing performance will not change significantly over time, ensuring the uniformity and strength of the flow field. On the one hand, it will not affect the product yield, and on the other hand, it is not necessary to frequently replace the first sealing portion 31 and the second sealing portion 32, improving the production efficiency.

[0045] Wherein, during electroplating, the sealing body 30 is completely or partially immersed in the electroplating solution.

[0046] As Figure 9 shown, Figure 9 The figure shows a schematic diagram of the laminar flow channel. The arrow direction shown is that the electroplating solution flows into from one side of the laminar flow channel, horizontally tangentially flows across the front surface of the wafer 1, and then flows out from the other side of the laminar flow channel.

[0047] In order to make the electroplating solution form a uniform and high-speed tangential flow on the front side of the wafer 1, it is necessary to make the electroplating solution flow in from one side defined by the laminar flow channel as much as possible, and flow out from the other side after passing through the laminar flow channel, rather than flowing out from other than the two sides defined by the laminar flow channel, nor from other peripheries. That is, when the electroplating solution flows in from one side defined by the laminar flow channel, it cannot overflow from the side where it flows in and the periphery. When the electroplating solution flows out from the other side after passing through the laminar flow channel, it cannot overflow from the side where it flows out and the periphery. Thus, the electroplating solution can only flow in from one side defined by the laminar flow channel and flow out from the other side, thereby ensuring the flow rate and uniformity of the electroplating solution in the laminar flow channel, enabling the electroplating solution to form a uniform and high-speed tangential flow on the front side of the wafer, and guaranteeing the electroplating rate and uniformity on the front side of the wafer 1 during electroplating.

[0048] Among them, a wafer fixing position is provided on the fixture assembly 20, and the wafer 1 is placed at the wafer fixing position. The fixture assembly 20 can seal the back of the wafer, so that the electroplating solution will not corrode the back of the wafer during electroplating on the front side of the wafer.

[0049] In this embodiment, the electroplating cavity 10 and the fixture assembly 20 are arranged vertically. The fixture assembly 20 can move vertically relative to the electroplating cavity 10 to make the first sealing portion 31 and the second sealing portion 32 be in sealing cooperation or release the seal.

[0050] In some embodiments, after the wafer 1 is immersed in the electroplating solution, the electroplating solution will flow towards the surface of the wafer 1 at a certain speed, and the metal cations in the electroplating solution are reduced and deposited on the front side of the wafer 1 under the action of an electric current.

[0051] In one embodiment, the first sealing portion 31 and the second sealing portion 32 are sealed by means of clearance fit. For example, through the clearance sealing form of the lower sealing protrusion 311 and the lower sealing groove 312 of the present application, and the clearance sealing form of the upper sealing protrusion 321 and the upper sealing groove 322.

[0052] In other embodiments, during the electroplating process, since the fixture assembly 20 carries the wafer 1 for relative transfer, the corresponding first sealing portion 31 is also in rotation. The lower sealing protrusion 311 in the first sealing portion 31 is correspondingly in rotation. Therefore, the lower sealing protrusion 311 cannot directly contact the upper sealing groove 322 in the second sealing portion to avoid friction and contact damage during relative rotation.

[0053] In this embodiment, since the fixture assembly 20 will move up and down relative to the electroplating cavity 10, there is a physical gap between the fixture assembly 20 and the electroplating cavity 10 in the circumferential direction. The electroplating solution can overflow at this physical gap, causing pollution and damage, and may also weaken the uniformity and strength of the tangential flow field of the electroplating solution.

[0054] The distance between the front side of the wafer 1 and the flow surface of the flow forming element 11 facing the front side of the wafer is generally between 1 mm and 10 mm. Of course, the specific distance can be set according to the actual situation. By using the seal body 30 provided by the present invention, even if the distance between the wafer 1 and the flow forming element 11 is appropriately increased, for example, when the depth of the lower seal groove 312 is designed to be greater than 13 mm, it will not have a great impact on the sealing performance of the flow field.

[0055] As Figure 3 shown, the first seal portion 31 includes at least one downwardly disposed lower seal projection 311. The uppermost ends of the lower seal projections 311 are located in the same plane or different planes, and at least one lower seal groove 312 is formed between two adjacent lower seal projections 311. By using the above-mentioned first seal portion 31, the structure is simple and convenient for processing.

[0056] As Figure 3 shown, the second seal portion 32 includes at least one upwardly disposed upper seal projection 321. The lowermost ends of the upper seal projections 321 are located in the same plane or different planes, and at least one upper seal groove 322 is formed between two adjacent upper seal projections 321. Among them, each upper seal groove 322 can insert a corresponding lower seal projection 311, and each lower seal groove 312 can insert a corresponding upper seal projection 321, so that the first seal portion 31 and the second seal portion 32 form the seal body 30. By using the above-mentioned second seal portion 32, the structure is simple and convenient for processing.

[0057] Among them, when the upper seal projection 321 is inserted into the lower seal groove 312, a clearance fit can be formed, and neither the upper seal projection 321 nor the lower seal groove 312 will come into contact. When the lower seal projection 311 is inserted into the upper seal groove 322, a clearance fit can be formed, and neither the lower seal projection 311 nor the upper seal groove 322 will come into contact.

[0058] When there are multiple lower seal projections 311, the multiple lower seal projections 311 are arranged in sequence from the inside to the outside of the electroplating cavity 10. When there are multiple upper seal projections 321, the multiple upper seal projections 321 are arranged in sequence from the inside to the outside of the electroplating cavity 10. And, the number of the multiple lower seal projections 311 and the number of the multiple upper seal grooves 322 should be the same. The number of the multiple upper seal projections 321 and the number of the multiple lower seal grooves 312 should also be the same.

[0059] In Figure 3The lowermost ends of the upper sealing protrusions 321 shown in [Figure] are located in the same plane, and the uppermost ends of the lower sealing protrusions 311 are located in the same plane. This is just one form. In more cases, since the exterior of the fixture assembly is not a plane but has different heights, the lower sealing protrusions 311 in the first sealing body can be distributed from top to bottom in sequence along the outer periphery of the fixture assembly. Correspondingly, the lower sealing grooves 312 formed by the lower sealing protrusions 311 are distributed from top to bottom in sequence along the outer periphery of the fixture assembly. When designing the corresponding second sealing portion 32, the upper sealing protrusions 321 in the second sealing body need to be distributed from top to bottom in sequence starting from the side far from the interior of the electroplating cavity. Correspondingly, the upper sealing grooves 322 formed by the upper sealing protrusions 321 are also distributed from top to bottom in sequence starting from the side far from the interior of the electroplating cavity, forming a similar stepped distribution.

[0060] The specific shapes inside the first sealing body and the second sealing body can be designed based on the morphological matching of the outer periphery of the fixture assembly. Any different design that can implement the technical solution of this embodiment is within the achievable scope of this embodiment.

[0061] As Figure 3 shown, when the fixture assembly 20 gradually immerses the wafer 1 into the electroplating solution, the lower sealing protrusions 311 and the lower sealing grooves 312 in the first sealing portion 31 can move downward as the fixture assembly 20 moves downward, so that part or all of the lower sealing protrusions 311 are gradually inserted into the upper sealing grooves 322 in the second sealing portion 32, and the lower sealing grooves 312 gradually accommodate part or all of the upper sealing protrusions 321 in the second sealing portion 32, forming a non-contact coupled combined seal. During electroplating, by inserting the lower sealing protrusions 311 into the upper sealing grooves 322 and inserting the upper sealing protrusions 321 into the lower sealing grooves 312, a sealing body 30 can be formed, thereby preventing the electroplating solution from overflowing in a direction other than that defined by the non-parallel flow channels.

[0062] Among them, the height of the lower sealing protrusion 311 should be less than the depth of the upper sealing groove 322, and the height of the upper sealing protrusion 321 should be less than the depth of the lower sealing groove 312, so that the lower sealing protrusion 311 can be completely inserted into the upper sealing groove 322, and the upper sealing protrusion 321 can be completely inserted into the lower sealing groove 312. Of course, according to the actual situation, as long as the sealing body 30 can achieve a sealing effect, it is also possible that part of the lower sealing protrusion 311 is inserted into the upper sealing groove 322, and part of the upper sealing protrusion 321 is inserted into the lower sealing groove 312.

[0063] As Figure 3As shown, when the wafer 1 carried by the fixture assembly 20 is completely immersed in the electroplating solution for fixed electroplating, the first sealing portion 31 and the second sealing portion 32 are relatively fixed. At this time, there is a first preset gap 41 between the bottom of the lower sealing protrusion 311 and the bottom of the upper sealing groove 322, and there is a second preset gap 42 between the top of the upper sealing protrusion 321 and the bottom of the lower sealing groove 312. By setting the first preset gap 41, it is possible to prevent the bottom of the lower sealing protrusion 311 from contacting the bottom of the upper sealing groove 322, and prevent the bottom of the upper sealing protrusion 321 from contacting the bottom of the lower sealing groove 312. Furthermore, it is possible to avoid contact wear between the lower sealing protrusion 311 and the upper sealing groove 322, and contact wear between the upper sealing protrusion 321 and the lower sealing groove 312, avoid the generation of particle contamination problems, and extend the service life.

[0064] As Figure 3 shown, when part or all of the lower sealing protrusion 311 is gradually inserted into the upper sealing groove 322 in the second sealing portion 32, and when the lower sealing groove 312 gradually accommodates part or all of the upper sealing protrusion 321 in the second sealing portion 32, there is a preset spacing 43 on both sides of the lower sealing protrusion 311 and the upper sealing protrusion 321. By setting the preset spacing 43, it is possible to prevent the side of the lower sealing protrusion 311 from contacting the side of the upper sealing protrusion 321. Furthermore, it is possible to avoid contact wear between the side of the upper sealing protrusion 321 and the side of the lower sealing protrusion 311, avoid the generation of particle contamination problems, and extend the service life.

[0065] As Figure 3 shown, when the first sealing portion 31 and the second sealing portion 32 form the sealing body 30, in the sealing body 30, two adjacent preset spacings 43 are connected through the first preset gap 41 or the second preset gap 42, so that the preset spacing 43, the first preset gap 41 and the second preset gap 42 jointly form a flow blocking channel 40. The flow blocking channel 40 has a plurality of flow blocking corners 44 formed by the upper sealing protrusion 321, the upper sealing groove 322, the lower sealing protrusion 311 and the lower sealing groove 312. The flow blocking channel 40 prevents the electroplating solution from overflowing from the sealing body 30 to the outside of the electroplating cavity 10 through the flow blocking corners 44. Through the flow blocking channel 40, the electroplating solution entering the inside of the sealing body 30 can be blocked, and the electroplating solution is prevented from overflowing to the outside of the sealing body 30 through the flow blocking channel, so that the electroplating solution can only flow in the channel defined by the flat flow channel, so as to form a uniform and high-speed tangential flow on the front surface of the wafer, ensuring the uniformity and electroplating efficiency of electroplating.

[0066] Specifically, the flow-blocking principle of the flow-blocking channel 40 is as follows. The sealing body 30 formed by the first sealing portion 31 and the second sealing portion 32 in this embodiment utilizes the fact that when the electroplating solution passes through the flow-blocking turning points of the flow-blocking channel 40, namely the flow-blocking turning points of the upper sealing groove 322 and the lower sealing groove 312. Since the electroplating solution will encounter a relatively large flow resistance, pressure damage will be generated, causing its flow rate to decrease, thereby reducing the possibility of the electroplating solution overflowing from the gap between the fixture assembly 20 and the electroplating cavity 10.

[0067] To further enhance the sealing performance of the sealing body, setting a larger number of flow-blocking turning points can most effectively increase the sealing performance. Correspondingly, the depths of the upper sealing groove 322 and the lower sealing groove 312, as well as the corresponding lower sealing protrusion 311 and upper sealing protrusion 321, can be set, so as to form a larger number of flow-blocking turning points at the bottom of the upper sealing groove 322 and the corresponding bottom of the lower sealing groove 312.

[0068] As Figure 3 and Figure 4 shown, the depths of both the upper sealing groove 322 and the lower sealing groove 312 are M, and the heights of both the upper sealing protrusion 321 and the lower sealing protrusion 311 are N. The corresponding setting of M and N can enable the top of the lower sealing protrusion 311 to form a first preset gap 41 with the bottom of the upper sealing groove 322, and the top of the upper sealing protrusion 321 to form a second preset gap 42 with the bottom of the lower sealing groove 312. The sizes of the first preset gap 41 and the second preset gap 42 are between 0.1 mm and 5 mm, and both M and N are greater than 0. By adopting the above range, not only can the gap be small enough to enable the flow-blocking channel 40 in the sealing body 30 to form a relatively large flow resistance to prevent the electroplating solution from overflowing from the flow-blocking channel 40 of the sealing body 30, but also the lower sealing protrusion 311 and the upper sealing protrusion 321 have appropriate tolerance sizes, so that the processing requirements are not too high.

[0069] Among them, the sizes of the first preset gap 41 and the second preset gap 42 can be 0.1 mm, 0.5 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, and any value between 0.1 mm and 5 mm.

[0070] Preferably, the sizes of the first preset gap 41 and the second preset gap 42 are between 1 mm and 2 mm.

[0071] M is equal to N, and the sizes of both M and N are between 10 mm and 50 mm. By adopting the above size range, the upper sealing protrusion 321 and the lower sealing protrusion 311 have relatively high structural strength, enhancing the mechanical structure stability.

[0072] In some devices, it is not excluded that M and N exceed the boundary of 50 mm, and they are all within the achievable range of this embodiment.

[0073] Among them, the sizes of M and N can be 10mm, 20mm, 30mm, 40mm, 50mm and any value between 10mm and 50mm.

[0074] In this embodiment, since the sizes of M and N are equal, after the first sealing portion 31 and the second sealing portion 32 are sealed and matched, the sizes of the first preset gap 41 and the second preset gap 42 are also equal.

[0075] In some embodiments, the sizes of M and N may also be unequal. After the first sealing portion 31 and the second sealing portion 32 are sealed together, the sizes of the first preset gap 41 and the second preset gap 42 may also be unequal.

[0076] One side of the second sealing portion 32 close to the inside of the electroplating chamber 10 is set as a second corner, and the second corner is composed of a plane connecting the side surface of the upper sealing protrusion 321 closest to the inside of the electroplating chamber 10 and the bottom of the upper sealing protrusion 321.

[0077] Specifically, the plane widths of the lower sealing protrusion 311 and the upper sealing protrusion 321 are both greater than or equal to 2 mm and less than or equal to 10 mm. The above size range can facilitate processing while making the two sealing protrusions have stable mechanical properties.

[0078] The planar widths of the lower sealing protrusion 311 and the upper sealing protrusion 321 may be 2 mm, 4 mm, 6 mm, 8 mm, 10 mm, or any value greater than or equal to 2 mm and less than or equal to 10 mm.

[0079] like Figure 3 As shown, a target lower sealing protrusion 314 that docks with the second corner is provided on one side of the first sealing portion 31 close to the inside of the electroplating chamber 10 , and a lower surface width of the target lower sealing protrusion 314 is greater than a lower surface width of the adjacent lower sealing protrusion 311 .

[0080] like Figure 3 As shown, when the target lower sealing protrusion 314 is docked with the second corner, the upper surface of the target lower sealing protrusion 314 and the plane connected to the bottom of the upper sealing protrusion 321 form a second planar gap 34, and the second planar gap 34 is respectively connected to the inside of the electroplating cavity 10 and the blocking channel 40 of the sealing body 30, so that the plating solution entering from the second planar gap 34 during electroplating can flow into the blocking channel 40 in the sealing body 30 formed by the first sealing part 31 and the second sealing part 32.

[0081] By setting the target lower sealing protrusion 314 with a relatively large width dimension, the electroplating solution can have a longer flow path at the second planar gap 34, thereby extending the flow path for the electroplating solution to flow into the sealing body 30 and avoiding excessive electroplating solution from flowing into the flow blocking channel 40 through the second planar gap 34, further enhancing the sealing performance.

[0082] It should be noted that the target lower sealing protrusion 314 refers to the lower sealing protrusion 311 closest to the innermost side of the electroplating cavity 10.

[0083] As Figure 3 shown, there are 3 lower sealing protrusions 311, 2 lower sealing grooves 312, 3 upper sealing protrusions 321, and 2 upper sealing grooves 322. During fixed electroplating, the 2 lower sealing protrusions 311 located outside the electroplating cavity 10 are respectively inserted into the corresponding 2 upper sealing grooves 322, and the 2 upper sealing protrusions 321 located inside the electroplating cavity 10 are respectively inserted into the 2 lower sealing grooves 312 to form the sealing body 30. The flow blocking channel 40 in the sealing body 30 has 8 flow turning corners 44 that can prevent the electroplating solution from overflowing the sealing body 30.

[0084] In the first embodiment, the second sealing portion 32 further includes a bearing plate 325. The lower surface of the bearing plate 325 is connected to the upper end of the electroplating cavity 10, and the upper sealing protrusions 321 are sequentially connected to the upper surface of the bearing plate 325 from the inside to the outside. In order to increase the structural strength of the second sealing portion 32, the width dimension of the outermost upper sealing protrusion 321 is also relatively large. Moreover, in order to form the second planar gap 34, the inner side of the bearing plate 325 protrudes beyond the innermost upper sealing protrusion 321 to cooperate with the target lower sealing protrusion 314.

[0085] Among them, the flow turning corner 44 refers to the chamfer formed during the processing of the upper sealing groove 322 and the lower sealing groove 312, and the flow turning corner is preferably 90 degrees.

[0086] In some embodiments, as Figure 6 and Figure 7 shown, the top of the upper sealing protrusion 321 is provided with an inclined surface 3211, and the cross-sectional dimension of the inclined surface 3211 gradually decreases in the direction from bottom to top. By setting the inclined surface 3211, after the electroplating solution enters the sealing body 30, the flow resistance of the electroplating solution passing through the upper sealing protrusion 321 can be increased, the flow speed of the electroplating solution can be delayed, and thus the possibility of electroplating solution leakage can be reduced.

[0087] Among them, in a specific embodiment, the inner side of the upper sealing protrusion 321 close to the inside of the electroplating cavity is a plane in the vertical direction, and the outer top of the upper sealing protrusion 321 is set as the inclined surface 3211. In another specific embodiment, the inner top of the upper sealing protrusion 321 is set as a plane, and its outer side is set as a plane.

[0088] In other embodiments, Figure 8 As shown, an opening groove 3212 is provided at the top of the upper sealing protrusion 321, and the cross-sectional size of the opening groove 3212 gradually decreases from bottom to top. By providing the opening groove 3212, after the plating solution enters the sealing body 30, the flow resistance of the plating solution when passing through the upper sealing protrusion 321 can be increased, the flow speed of the plating solution can be slowed down, and the possibility of leakage of the plating solution can be reduced.

[0089] The opening groove 3212 may be configured as a V-shaped groove or a U-shaped groove.

[0090] In Embodiment 1, the depth of the upper sealing groove 322 and the depth of the lower sealing groove 312 both refer to the dimensions in the up-down direction, the height of the upper sealing protrusion 321 and the height of the lower sealing protrusion 311 also refer to the dimensions in the up-down direction, and the width of the upper sealing protrusion 321 and the width of the lower sealing protrusion 311 refer to the dimensions in the inside-out direction.

[0091] The second embodiment of the present invention provides an electroplating device. The difference between the second embodiment and the first embodiment is that in the second embodiment, Figure 5 As shown, one side of the first sealing portion 31 close to the inside of the electroplating chamber 10 is set as a first corner, and the first corner is composed of a plane connecting the side of the lower sealing protrusion 311 closest to the inside of the electroplating chamber 10 and the top of the lower sealing protrusion 311.

[0092] A target upper sealing protrusion 323 that is connected to the first corner is provided on one side of the second sealing portion 32 close to the inside of the electroplating chamber 10 . The upper surface width of the target upper sealing protrusion 323 is greater than the upper surface width of the adjacent upper sealing protrusion 321 .

[0093] When the upper sealing protrusion 323 of the target is docked with the first corner, the upper surface of the upper sealing protrusion 323 of the target is connected to the plane at the top of the lower sealing protrusion 311 to form a first plane gap 33, and the first plane gap 33 is respectively connected to the inside of the electroplating cavity 10 and the blocking channel 40 of the sealing body 30, so that the plating solution entering from the first plane gap 33 during electroplating can flow into the blocking channel 40 in the sealing body 30 formed by the first sealing part 31 and the second sealing part 32.

[0094] By setting a target upper sealing protrusion 323 with a larger width, the plating liquid can have a longer flow path at the first plane gap 33, thereby extending the flow path of the plating liquid into the sealing body 30, avoiding excessive plating liquid from flowing into the flow blocking channel 40 through the first plane gap 33, and further enhancing the sealing performance.

[0095] The plane to which the top of the lower sealing protrusion 311 is connected refers to the lower surface of the clamp assembly 20 .

[0096] It should be noted that the upper sealing protrusion 323 on the target refers to the upper sealing protrusion 321 closest to the innermost side of the electroplating cavity.

[0097] As Figure 5 shown, in the second embodiment, the lower sealing protrusions 311 in the first sealing portion 31 are three in number, the lower sealing grooves 312 are two in number, the upper sealing protrusions 321 in the second sealing portion 32 are four in number, and the upper sealing grooves 322 are three in number. During electroplating, the three lower sealing protrusions 311 are respectively inserted into the corresponding three upper sealing grooves 322, and the two lower sealing grooves 312 respectively accommodate the middle two of the four upper sealing protrusions 321 to form a sealing body 30. The flow resistance channels 40 in the sealing body 30 have ten flow resistance turning angles 44, which can prevent the electroplating solution from overflowing the sealing body 30.

[0098] That is to say, the sealing protrusion with a larger width dimension can be arranged on the inner side of the first sealing portion 31 or on the inner side of the second sealing portion 32. And when the sealing protrusion with a larger width dimension is arranged on the first sealing portion 31, it is necessary to cooperate with the second sealing portion 32 to form a second planar gap 34. When the sealing protrusion with a larger width dimension is arranged on the second sealing portion 32, it is necessary to cooperate with the fixture assembly 20 or the first sealing portion 31 to form a first planar gap 33, as long as it can extend the flow path of the electroplating solution flowing into the sealing body 30.

[0099] In the second embodiment, the target upper sealing protrusion 323 is connected to the inner side of the carrier plate 325.

[0100] It should be noted that except for the above structures, the electroplating device in the second embodiment is the same as the electroplating device in the first embodiment, and the repeated parts will not be described again.

[0101] Based on the same inventive concept, as Figure 10 shown, another embodiment of the present invention provides an electroplating method, which is applied to the electroplating device provided above. The electroplating method includes the following steps.

[0102] S1. After the fixture assembly of the electroplating device carries the wafer down to the first position, it tilts a preset angle. By tilting the wafer at a preset angle, it can prepare for the subsequent immersion of the wafer in the electroplating solution, so that the wafer is immersed in the electroplating solution in an inclined state, thereby avoiding the generation of bubbles on the surface of the wafer.

[0103] Specifically, the preset angle can be between 1° and 5°. For example, 1°, 2°, 3°, 4°, and 5°.

[0104] S2. The fixture assembly carries the wafer and immerses it in the plating solution in an inclined state and descends to the second position. By immersing the wafer in the plating solution in an inclined state, on the one hand, no bubbles will be generated on the surface of the wafer, and on the other hand, when the wafer is at the second position, the wafer can be completely immersed in the plating solution to prepare for the subsequent plating process.

[0105] S3. Restore the fixture assembly to a non-inclined state. This is beneficial to form a high-speed and uniform plating solution flow field on the surface of the wafer, enabling the metal to precipitate more evenly on the surface of the wafer.

[0106] S4. The fixture assembly carries the wafer and descends, so that the first sealing part of the plating device is combined with the second sealing part of the plating device until the wafer descends to the third position after the first sealing part and the second sealing part form a sealed body.

[0107] S5. Flow the plating solution in through one side of the laminar flow channel for plating, so that the plating solution flows tangentially horizontally across the front surface of the wafer to deposit a metal layer on the front surface of the wafer.

[0108] The sealed body can seal the plating solution that flows in through one side of the laminar flow channel, flows tangentially horizontally across the front surface of the wafer, and then flows out through the other side of the laminar flow channel during plating, so as to prevent the plating solution from overflowing in the direction not defined by the laminar flow channel.

[0109] Among them, the step S4 in which the fixture assembly carries the wafer and descends, so that the first sealing part of the plating device is combined with the second sealing part of the plating device until the wafer descends to the third position after the first sealing part and the second sealing part form a sealed body includes: S41. Control the first sealing part to perform a preset up and down movement to adjust the third position; wherein, the preset up and down movement is configured to allow the first sealing part to move up and down after the first sealing part and the second sealing part are combined to form a sealed body, so that while the first sealing part and the second sealing part maintain the combined form to form a sealed body and do not affect the sealing performance of the sealed body, the third position changes correspondingly.

[0110] S42. Based on the adjusted third position, adjust the corresponding plating process.

[0111] Based on the flow field or / and electric field in the adjusted plating process, flow the matching plating solution in through one side of the laminar flow channel for plating, so that the plating solution flows tangentially horizontally across the front surface of the wafer to deposit a metal layer on the front surface of the wafer.

[0112] Under different electroplating processes, the third position needs to be adjusted adaptively. Correspondingly, after the first sealing portion and the second sealing portion form a sealing body, the position of the first sealing portion can be adjusted adaptively so that the first sealing portion and the second sealing portion form a sealing body while not affecting the sealing performance, so as to adjust the third position adaptively. Here, not affecting the sealing performance means that the sealing bodies before and after the adjustment can both block the electroplating solution from overflowing in the direction defined by the non-uniform flow channel, and the effects are the same.

[0113] With the adaptive adjustment of the third position, based on the adjusted electroplating process (including the adjustment of different process contents such as the flow field or / and the electric field, etc.), a matching electroplating solution can be introduced through one side of the uniform flow channel for electroplating, so that the electroplating solution flows tangentially horizontally across the front surface of the wafer to deposit a metal layer on the front surface of the wafer.

[0114] Based on the same inventive concept, another embodiment of the present invention provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of the electroplating method provided above are implemented. Since the principle of solving problems in the computer-readable storage medium embodiment is similar to that of the electroplating device embodiment above, the implementation of the computer-readable storage medium embodiment can refer to the implementation of the electroplating device embodiment above, and the repeated parts will not be described again.

[0115] Based on the same inventive concept, still another embodiment of the present invention provides a computer carrier, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, the steps of the electroplating method provided above are implemented. Since the principle of solving problems in the computer carrier embodiment is similar to that of the electroplating device embodiment above, the implementation of the computer carrier embodiment can refer to the implementation of the electroplating device embodiment above, and the repeated parts will not be described again.

[0116] In the embodiments of the present disclosure, if the form of connection is not clearly defined, the form of connection can be a detachable connection form such as a bolt and nut, a screw, a buckle, a magnetic attraction, etc. In some connections, if there is no special requirement for the form of non-detachable cooperation, non-detachable connection can be carried out by means of welding, bonding, etc.

[0117] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, advantages, effects, etc. mentioned in the present application are only examples and not limitations. It cannot be considered that these advantages, advantages, effects, etc. are essential for each embodiment of the present application. In addition, the above-disclosed specific details are only for the purposes of illustration and easy understanding, rather than limitations. The above details do not limit the present application to necessarily adopt the above specific details to implement.

[0118] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "comprising," "including," "having," etc. are open-ended terms meaning "including but not limited to" and can be used interchangeably with each other. The word "or" and "and" used herein refer to the phrase "and / or" and can be used interchangeably with it, unless the context clearly indicates otherwise. The phrase "such as" used herein refers to the phrase "such as but not limited to" and can be used interchangeably with it.

[0119] It should also be noted that in the devices, equipment, and methods of this application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of this application.

[0120] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

[0121] The above description has been given for purposes of illustration and description. In addition, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions, and sub-combinations thereof.

Claims

1. An electroplating device, comprising an electroplating cavity and a fixture assembly, characterized in that, The electroplating device further includes: a flow forming element having a flow surface facing the front surface of the wafer. The flow surface is parallel to the front surface of the wafer and separated from the front surface of the wafer when the fixture assembly carries the wafer for electroplating in the electroplating solution, forming a laminar flow channel through which the electroplating solution can flow horizontally. The laminar flow channel allows the electroplating solution to flow into from one side of the laminar flow channel during electroplating, flow horizontally and tangentially across the front surface of the wafer, and then flow out from the other side of the laminar flow channel; a first sealing portion which is annularly arranged around the outer periphery of the fixture assembly; a second sealing portion which is annularly arranged at the outer peripheral opening of the electroplating cavity. The first sealing portion and the second sealing portion are corresponding to each other in the up-and-down position; When the wafer carried by the fixture assembly is completely immersed in the electroplating solution for electroplating, the first sealing portion and the second sealing portion can be combined to form a sealed body, and the sealed body can seal the electroplating solution that flows into from one side of the laminar flow channel during electroplating, flows horizontally and tangentially across the front surface of the wafer, and then flows out from the other side of the laminar flow channel, so as to prevent the electroplating solution from overflowing in a direction other than that defined by the laminar flow channel.

2. The electroplating device according to claim 1, wherein, The first sealing portion includes at least one downwardly disposed lower sealing protrusion. The uppermost ends of the lower sealing protrusions are located in the same plane or different planes, and at least one lower sealing groove is formed between two adjacent lower sealing protrusions.

3. The electroplating device according to claim 2, characterized in that, The second sealing portion includes at least one upwardly disposed upper sealing protrusion. The lowermost ends of the upper sealing protrusions are located in the same plane or different planes, and at least one upper sealing groove is formed between two adjacent upper sealing protrusions; wherein each upper sealing groove can insert a corresponding lower sealing protrusion, and each lower sealing groove can insert a corresponding upper sealing protrusion, so that the first sealing portion and the second sealing portion form the sealed body.

4. The electroplating device according to claim 3, wherein, When the fixture assembly carries the wafer and gradually immerses it into the electroplating solution, the lower sealing protrusions and the lower sealing grooves in the first sealing portion can move downward as the fixture assembly moves downward, so that part or all of the lower sealing protrusions are gradually inserted into the upper sealing grooves in the second sealing portion, and the lower sealing grooves gradually accommodate part or all of the upper sealing protrusions in the second sealing portion, forming a non-contact coupling combined seal.

5. The electroplating apparatus according to claim 4, characterized in that, When the wafer carried by the fixture assembly is completely immersed in the electroplating solution for fixed electroplating, the first sealing portion and the second sealing portion are relatively fixed. At this time, there is a first preset gap between the bottom of the lower sealing protrusion and the bottom of the upper sealing groove, and there is a second preset gap between the top of the upper sealing protrusion and the bottom of the lower sealing groove.

6. The electroplating apparatus according to claim 5, wherein, When part or all of the lower sealing protrusions are gradually inserted into the upper sealing grooves in the second sealing portion, and when the lower sealing grooves gradually accommodate part or all of the upper sealing protrusions in the second sealing portion, there is a preset spacing on both sides of the lower sealing protrusion and the upper sealing protrusion.

7. The electroplating device according to claim 6, wherein When the first sealing part and the second sealing part form the sealing body, in the sealing body, two adjacent preset spacings are connected through the first preset gap or the second preset gap, so that the preset spacing, the first preset gap and the second preset gap together form a blocking channel, and the blocking channel has a plurality of blocking corners formed by the upper sealing protrusion, the upper sealing groove, the lower sealing protrusion and the lower sealing groove, and the blocking channel prevents the plating solution from overflowing from the sealing body from a direction not defined by the horizontal flow channel through the blocking corners.

8. The electroplating apparatus according to claim 5, characterized in that, The depth of the upper sealing groove and the depth of the lower sealing groove are both M, the height of the upper sealing protrusion and the height of the lower sealing protrusion are both N, and the corresponding settings of M and N can enable the top of the lower sealing protrusion and the bottom of the upper sealing groove to form the first preset gap, and the top of the upper sealing protrusion and the bottom of the lower sealing groove to form the second preset gap, the dimensions of the first preset gap and the second preset gap are between 0.1 mm and 5 mm, and M and N are both greater than 0.

9. The electroplating apparatus according to claim 8, wherein, The M is equal to the N, and the sizes of the M and the N are both between 10 mm and 50 mm.

10. The electroplating device according to claim 7, characterized in that, A side of the first sealing portion close to the inside of the electroplating cavity is set as a first corner, and the first corner is composed of a plane connecting the side of the lower sealing protrusion closest to the inside of the electroplating cavity and the top of the lower sealing protrusion; A target upper sealing protrusion that is butted against the first corner is disposed on one side of the second sealing portion close to the inside of the electroplating cavity, and the upper surface width of the target upper sealing protrusion is greater than the upper surface width of the adjacent upper sealing protrusion; When the target upper sealing protrusion is docked with the first corner, the upper surface of the target upper sealing protrusion and the plane connected to the top of the lower sealing protrusion form a first planar gap, and the first planar gap is respectively connected to the inside of the electroplating cavity and the blocking channel of the sealing body, so that the plating solution entering from the first planar gap during electroplating can flow into the blocking channel in the sealing body formed by the first sealing part and the second sealing part.

11. The electroplating device according to claim 7, characterized in that: The side of the second sealing portion close to the inside of the electroplating cavity is set as a second corner, and the second corner is composed of a plane connecting the side of the upper sealing protrusion closest to the inside of the electroplating cavity and the bottom of the upper sealing protrusion; A target lower sealing protrusion that is butted against the second corner is disposed on one side of the first sealing portion close to the inside of the electroplating cavity, and a lower surface width of the target lower sealing protrusion is greater than a lower surface width of the adjacent lower sealing protrusion; After the target lower sealing protrusion is docked with the second corner, a second planar gap is formed between the upper surface of the target lower sealing protrusion and the plane connected to the bottom of the upper sealing protrusion. The second planar gap communicates with the inside of the electroplating cavity and the flow-blocking channel of the sealing body respectively, and can flow the electroplating solution entering from the second planar gap during electroplating into the flow-blocking channel in the sealing body formed by the first sealing portion and the second sealing portion.

12. The electroplating apparatus according to claim 7, wherein, There are 3 lower sealing protrusions in the first sealing portion, 2 lower sealing grooves, 4 upper sealing protrusions in the second sealing portion, and 3 upper sealing grooves. During fixed electroplating, the 3 lower sealing protrusions are respectively inserted into the corresponding 3 upper sealing grooves, and the 2 lower sealing grooves respectively accommodate the middle two of the 4 upper sealing protrusions to form the sealing body. The flow-blocking channel in the sealing body has 10 flow-blocking corners to prevent the electroplating solution from overflowing the sealing body.

13. The electroplating apparatus according to claim 7, wherein There are 3 lower sealing protrusions, 2 lower sealing grooves, 3 upper sealing protrusions, and 2 upper sealing grooves. During fixed electroplating, the 2 lower sealing protrusions located outside the electroplating cavity are respectively inserted into the corresponding 2 upper sealing grooves, and the 2 upper sealing protrusions located inside the electroplating cavity are respectively inserted into the 2 lower sealing grooves to form the sealing body. The flow-blocking channel in the sealing body has 8 flow-blocking corners to prevent the electroplating solution from overflowing the sealing body.

14. The electroplating device according to claim 3, wherein, The planar widths of the lower sealing protrusion and the upper sealing protrusion are both greater than or equal to 2 mm and less than or equal to 10 mm.

15. The electroplating apparatus according to any one of claims 3 to 14, characterized in that, The top of the upper sealing protrusion is provided with an inclined surface, and the cross-sectional dimension of the inclined surface gradually decreases in the upward direction.

16. The electroplating apparatus according to any one of claims 3 to 14, characterized in that, The top of the upper sealing protrusion is provided with an opening groove, and the cross-sectional dimension of the opening groove gradually decreases in the upward direction.

17. An electroplating method, applied to the electroplating device described in any one of claims 1 to 16, characterized in that, The electroplating method includes: The fixture assembly of the electroplating device carries the wafer down to the first position and then tilts at a preset angle; The fixture assembly carries the wafer and immerses it in the electroplating solution in an inclined state and descends to the second position; Restore the fixture assembly to a non-inclined state; The fixture assembly carries the wafer down to combine the first sealing portion of the electroplating device with the second sealing portion of the electroplating device until the wafer descends to the third position after the first sealing portion and the second sealing portion form a sealing body; Electroplating solution is introduced through one side of the advection channel, and the electroplating solution flows tangentially across the front surface of the wafer horizontally to deposit a metal layer on the front surface of the wafer; The sealing body can seal the electroplating solution that flows in from one side of the advection channel, flows tangentially across the front surface of the wafer horizontally, and then flows out from the other side of the advection channel during electroplating, so as to prevent the electroplating solution from overflowing in a direction other than that defined by the advection channel.

18. The electroplating method according to claim 17, wherein, The step that the fixture assembly carries the wafer down to combine the first sealing portion of the electroplating device with the second sealing portion of the electroplating device until the wafer descends to the third position after the first sealing portion and the second sealing portion form a sealing body includes: Control the first sealing part to perform a preset up and down movement to adjust the third position; wherein, the preset up and down movement is configured such that after the first sealing part and the second sealing part are combined to form a sealing body, allowing the up and down movement of the first sealing part to cause a corresponding change in the third position while the first sealing part and the second sealing part maintain the combined form to form a sealing body without affecting the sealing performance of the sealing body. Based on the adjusted third position, adjust the corresponding electroplating process.

19. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium, wherein the computer program, when executed by a processor, implements the steps of the electroplating method according to claim 17 or 18.

20. A computer carrier, characterized in that, It includes a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that when the processor executes the computer program, it implements the steps of the electroplating method according to claim 17 or 18.

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