Anti-condensation low-temperature test module and chip test equipment with same

Abstract

The invention provides an anti-condensation low-temperature test module and chip test equipment with the same. The low-temperature test module comprises a low-temperature dry gas supply device, a low-temperature chamber, a low-temperature generation device and a communication pipe. The low-temperature dry gas supply device is used for providing low-temperature dry gas to the chip slot of the test socket. The low-temperature generating device is arranged in the low-temperature chamber and is coupled with the test seat. The low temperature generating device is used for cooling the testing seat. Two ends of the communicating pipe are respectively communicated with the chip slot of the test seat and the low-temperature chamber.

Description

Technical Field

[0001] This application relates to chip low-temperature testing technology, and particularly to a low-temperature testing module with a dew condensation prevention function and a chip testing device equipped with this module. Background Art

[0002] Package on Package (PoP) is an integrated circuit packaging technology that combines multiple components into a packaged chip in a vertically stacked manner. Generally, the configuration of a PoP chip stacks a memory module or a communication module above a processing module. However, this configuration makes it impossible to use the upper surface conduction method for temperature control when testing a PoP chip at low temperatures (such as but not limited to -40°C to -20°C). There are two reasons for this: one is that due to the large thermal resistance between packages, the temperature control method of upper surface conduction may cause the memory module or communication module to be too cold or the processing module to be too hot; the other is that since there is a radio frequency circuit in the communication module, a metal shield (such as a metal heat sink for upper surface conduction) cannot be set above the PoP chip with a communication module to avoid the radio frequency circuit being interfered and failing. Therefore, the existing low-temperature testing technologies for POP chips all cool the chips solely through the test socket below the chips.

[0003] On the other hand, since the entire testing device and the chip under test are exposed to the atmosphere, dew condensation is likely to occur. Therefore, to solve the dew condensation problem, the existing technology uses a large chamber filled with dry gas and places all the low-temperature components in the testing device therein. However, the large chamber occupies a considerable amount of space, resulting in a large volume of the entire device, and the space inside the chamber also limits the selection of various testing devices or accessories, such as test boards. Moreover, to maintain the large chamber in a low-temperature and dry environment, the energy consumption problem is quite serious. Summary of the Invention

[0004] To solve the above problems, the inventors propose a low-temperature testing module with dew condensation prevention and a chip testing device equipped with this module. By simultaneously performing conduction cooling and convective cooling of low-temperature gas on the chip slot for accommodating the chip, the chip is immersed in a low-temperature environment, thereby ensuring rapid cooling of the chip and maintaining it at a low temperature. In addition, by continuously blowing low-temperature dry gas, the low-temperature testing module to be tested and related components can have a dew condensation prevention function, so as to avoid damage to the chip or the testing device caused by dew condensation on the chip during testing or on the testing device.

[0005] In some embodiments, a dew-proof low-temperature test module includes a low-temperature dry gas supply device, a low-temperature chamber, a low-temperature generating device, and a connecting pipe. The low-temperature dry gas supply device is used to provide a low-temperature dry gas to a chip slot of a test seat. The low-temperature generating device is disposed in the low-temperature chamber and is coupled to the test seat, and the low-temperature generating device is used to cool down the test seat. Two ends of the connecting pipe are respectively communicated with the chip slot of the test seat and the low-temperature chamber.

[0006] In some embodiments, the low-temperature chamber includes a support base and a chamber enclosure; the low-temperature generating device is disposed on the support base, the chamber enclosure is disposed on the support base and surrounds the low-temperature generating device, and an exhaust passage is included between the support base and the chamber enclosure.

[0007] In some embodiments, the support base includes a convex frame, the chamber enclosure and the convex frame overlap each other and are spaced apart by a specific distance; the chamber enclosure includes at least one elevation portion, and the at least one elevation portion is used to space the chamber enclosure from the support base by another specific distance, and these specific distances form the exhaust passage.

[0008] In some embodiments, the low-temperature test module further includes a test seat enclosure and a test seat plate, wherein the test seat enclosure surrounds at least a part of the test seat, and the test seat plate is disposed on the test seat and the test seat enclosure; wherein, the test seat plate includes a gas flow passage, and two ends of the gas flow passage are respectively communicated with the chip slot and the low-temperature dry gas supply device.

[0009] In some embodiments, the low-temperature test module further includes a normal-temperature dry gas supply device, and the normal-temperature dry gas supply device is used to provide a normal-temperature dry gas to the low-temperature chamber.

[0010] In some embodiments, a chip testing device includes a test seat, a low-temperature dry gas supply device, a low-temperature chamber, a low-temperature generating device, a connecting pipe, and a controller. The test seat includes a chip slot, and the chip slot is used to accommodate a chip under test. The low-temperature dry gas supply device is communicated with the chip slot of the test seat. The low-temperature generating device is disposed in the low-temperature chamber and is coupled to the test seat. Two ends of the connecting pipe are respectively communicated with the chip slot of the test seat and the low-temperature chamber. The controller is electrically connected to the test seat, the low-temperature dry gas supply device, and the low-temperature generating device, and the controller is used to control the low-temperature generating device to cool down the test seat, to control the low-temperature dry gas supply device to provide a low-temperature dry gas to the chip slot, and to control the test seat to test the chip under test.

[0011] In some embodiments, the chip testing device further includes a pressure testing head, the pressure testing head corresponds to the chip slot of the test seat and is electrically connected to the controller, and the controller is further used to control the pressure testing head to approach the chip slot to press against the chip under test or to control the pressure testing head to move away from the chip slot.

[0012] In summary, according to any of the above embodiments, the convective cooling of the low-temperature drying gas can be carried out inside the chip socket and the conductive cooling of the test socket can be carried out simultaneously, creating a low-temperature and dry test environment for the chip to be tested, ensuring that the chip to be tested is maintained at a low temperature and no condensation occurs. In addition, by connecting the low-temperature chamber and the chip socket of the test socket through a connecting pipe, the low-temperature drying gas inside the chip socket can enter the low-temperature chamber, that is, the low-temperature drying gas is recycled and reused, so that the relevant low-temperature components in the low-temperature chamber are maintained in a low-temperature and dry state, thereby achieving the anti-condensation effect of the chip testing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a perspective view of a chip testing device;

[0014] Figure 2 is Figure 1 the front view of the chip testing device in

[0015] Figure 3 is Figure 1 the sectional schematic view of the first embodiment of the chip testing device in

[0016] Figure 4 is Figure 1 the module block diagram of the chip testing device in

[0017] Figure 5 is Figure 3 the partial enlarged view of the chip testing device in

[0018] Figure 6 is Figure 1 the sectional schematic view of the low-temperature chamber in

[0019] Figure 7 is Figure 3 the front planar view of the pressure probe in

[0020] Figure 8 is Figure 1 the sectional schematic view of the second embodiment of the chip testing device in

[0021] Among them, reference numerals:

[0022] 10: Chip testing device

[0023] 100: Test socket

[0024] 101: Chip socket

[0025] 102: Test socket enclosure

[0026] 103: Test socket board

[0027] 104: Gas flow channel

[0028] 110: Low temperature test module

[0029] 111: Low temperature dry gas supply device

[0030] 112: Chamber

[0031] 1121: Support base

[0032] 1122: Chamber enclosure

[0033] 1123: Convex frame

[0034] 1124: Lifting part

[0035] 113: Low temperature generating device

[0036] 114: Connecting pipe

[0037] 120: Controller

[0038] 130: Test circuit board

[0039] 140: Test board fixing fixture

[0040] 141, 142: Support columns

[0041] 150: Heat conduction spacer

[0042] 160: Pressing test head

[0043] 161: Pressing test support column

[0044] 162: Lower surface

[0045] 170: Chamber

[0046] 180: Normal temperature dry gas supply device

[0047] 200: Chip under test

[0048] DG_LT: Low temperature dry gas

[0049] DG_RT: Normal temperature dry gas

[0050] G1, G2: Specific spacing

[0051] R1: Square frame

[0052] T1: Exhaust duct. Detailed implementation method

[0053] Please refer to Figures 1 to 4, the chip testing device 10 includes a test socket 100, a low-temperature testing module 110, and a controller 120. The test socket 100 includes a chip slot 101, and the chip slot 101 is used to accommodate a chip under test 200. In some embodiments, the low-temperature testing module 110 includes a low-temperature dry gas supply device 111, a low-temperature chamber 112, a low-temperature generating device 113, and a connecting pipe 114. The low-temperature generating device 113 is disposed in the low-temperature chamber 112, and two ends of the connecting pipe 114 are respectively connected to the chip slot 101.

[0054] As Figure 3 shown, in some embodiments, the low-temperature testing module 110 further includes a test socket enclosure 102 and a test socket board 103. The test socket enclosure 102 surrounds at least a part of the test socket 100, for example, surrounds the four circumferential side walls of the test socket 100, so as to isolate the test socket 100 to prevent dew condensation on the outer surface of the test socket 100 during low-temperature testing. In some embodiments, the test socket enclosure 102 can be made of foamed heat-insulating material, such as polystyrene resin. The test socket board 103 is disposed on the test socket 100 and the test socket enclosure 102. In some embodiments, the test socket board 103 includes a gas flow channel 104, and two ends of the gas flow channel 104 are respectively connected to the chip slot 101 and the low-temperature dry gas supply device 111.

[0055] As Figure 3 shown, in some embodiments, the chip testing device 10 further includes a test circuit board 130, and the test socket 100 is disposed on the test circuit board 130. In some embodiments, the test circuit board 130 is a dedicated test board for the chip under test 200; that is, when the chip under test 200 is changed, the test circuit board 130 will be replaced accordingly. Furthermore, as Figure 4 shown, the controller 120 is electrically connected to the test socket 100, the low-temperature dry gas supply device 111, and the low-temperature generating device 113.

[0056] As Figure 3 shown, in some embodiments, the low-temperature chamber 112 includes a support base 1121 and a chamber enclosure 1122. The low-temperature generating device 113 is disposed on the support base 1121, the chamber enclosure 1122 is disposed on the support base 1121 and surrounds the low-temperature generating device 113, and an exhaust channel T1 is included between the support base 1121 and the chamber enclosure 1122. In some embodiments, the chamber enclosure 1122 can include a casing and foamed heat-insulating material. The foamed heat-insulating material surrounds the outer periphery of the casing, and the foamed heat-insulating material can be made of polystyrene resin. In some embodiments, the foamed heat-insulating material is used to prevent the casing from directly contacting the atmosphere to prevent the occurrence of dew condensation.

[0057] As Figure 3As shown, in some embodiments, the low-temperature chamber 112 further includes a test board fixing fixture 140 and a heat conduction spacer 150. The test board fixing fixture 140 is disposed on the chamber enclosure 1122, and the heat conduction spacer 150 is disposed on the low-temperature generating device 113. The heat conduction spacer 150 passes through the test board fixing fixture 140 to directly contact the test circuit board 130, thereby coupling the low-temperature generating device 113 to the test socket 100. The low-temperature generating device 113 cools the test socket 100 through the heat conduction spacer 150. The heat conduction spacer 150 can be made of a metal material with a high heat conduction coefficient, such as copper.

[0058] In some embodiments, the test board fixing fixture 140 has a plurality of support posts 141, 142, which are used to support and fix the test circuit board 130 to prevent the chip under test 200 from being shaken by external forces during testing.

[0059] Please refer to Figures 1 to 6 , in some embodiments, the support base 1121 includes a convex frame 1123 that extends upward (in the Y direction). The chamber enclosure 1122 and the convex frame 1123 overlap each other and are spaced apart by a specific distance G1 (as shown in Figure 5 ), where Figure 5 corresponds to Figure 4 the dashed box R1). In some embodiments, the chamber enclosure 1122 includes at least one elevation portion 1124, which is used to space the chamber enclosure 1122 from the support base 1121 by another specific distance G2 (as shown in Figure 5 ), and these multiple specific distances G1, G2 form an exhaust channel T1. Taking Figure 6 as an example, in some embodiments, the elevation portions 1124 are disposed at the four corners of the bottom of the chamber enclosure 1122 to lift the chamber enclosure 1122, so that a specific distance G2 is generated between the chamber enclosure 1122 and the support base 1121, and then the specific distance G2 and the specific distance G1 jointly form the exhaust channel T1.

[0060] As Figure 5 shown, in some embodiments, the exhaust channel T1 formed by the specific distances G1, G2 has a labyrinth seal structure. The path of the labyrinth seal formed by the support base 1121, the chamber enclosure 1122, and the convex frame 1123 (corresponding to Figure 5 the exhaust channel T1) makes the structure of the low-temperature chamber 112 more stable and can effectively reduce the speed of gas flowing out of the exhaust channel T1.

[0061] Please refer to Figures 1 to 7 . As Figure 7As shown, in some embodiments, the chip testing device 10 further includes a pressure testing head 160, where the pressure testing head 160 corresponds to the chip slot 101 of the testing socket 100, and the pressure testing head 160 is electrically connected to the controller. In some embodiments, when the chip testing device 10 starts to operate, the controller 120 controls the pressure testing head 160 to approach the chip slot 101 to press against the chip under test 200, and at the same time, the controller 120 controls the low-temperature generating device 113 to conduct cooling to the testing socket 100. In some embodiments, the low-temperature generating device 113 can operate continuously for a long time to maintain the testing socket 100 in a low-temperature state. Wherein, when the pressure testing head 160 presses against the chip under test 200, the pressure testing head 160 and the chip slot 101 of the testing socket 100 form another sealed low-temperature chamber 170. For the convenience of distinguishing the low-temperature chambers 112 and 170, hereinafter, the low-temperature chamber 112 is referred to as the first chamber 112, and the low-temperature chamber 170 is referred to as the second chamber 170.

[0062] Next, the chip testing device 10 generates a low-temperature dry gas DG_LT through the low-temperature dry gas supply device 111 and supplies the low-temperature dry gas DG_LT to the chip slot 101 of the testing socket 100. Further explanation, at this time, the upper surface of the chip under test 200 contacts the low-temperature dry gas DG_LT, and the four circumferential side walls and the lower surface of the chip under test 200 contact the chip slot 101 of the testing socket 100; thereby, through the convection mechanism of the low-temperature dry gas DG_LT and the conduction mechanism of the testing socket 100, the chip under test 200 can be completely immersed in a low-temperature environment, and the chip under test 200 can be quickly cooled down and continuously maintained at a low temperature.

[0063] Subsequently, because the gas pressure in the second chamber 170 is greater than that in the first chamber 112, the low-temperature dry gas DG_LT will flow from the second chamber 170 into the first chamber 112 through the communication pipe 114. In addition, when the gas pressure inside the first chamber 112 is greater than the atmospheric pressure, the low-temperature dry gas DG_LT will flow out of the first chamber 112 through the exhaust channel T1. However, since the exhaust channel T1 in this embodiment adopts a labyrinth seal structure, it can form a large flow resistance, so it can prevent the low-temperature dry gas DG_LT from flowing out of the first chamber 112 quickly.

[0064] On the other hand, when the chip 200 to be tested reaches a specific temperature, such as -40°C, the controller 120 controls the test socket 100 to start testing the chip 200 to be tested. When the test is completed, the chip testing device 10 controls the pressure test head 160 to move away from the chip slot 101 through the controller 120, and then takes out the tested chip through a pick-and-place device (not shown in the figure) and places the next chip to be tested 200. However, in other embodiments, the tested chip can also be taken out and the next chip to be tested 200 can be placed after the chip testing device 10 and the chip 200 to be tested return to room temperature, which is also to avoid condensation.

[0065] Please refer to Figures 1 to 8 As Figure 8 shown, in some embodiments, the low-temperature test module 110 further includes a room-temperature dry gas supply device 180, which can be a gas pump combined with a gas drying system. The gas drying system can be, for example, a refrigerated dryer or an adsorption dryer. It should be noted that this embodiment is particularly applicable when the chip testing device 10 is in a high-temperature and humid environment because condensation is particularly likely to occur in a high-temperature and humid environment.

[0066] Furthermore, after the test is completed, the controller 120 can control the low-temperature dry gas supply device 111 to stop operating, and control the room-temperature dry gas supply device 180 to generate a room-temperature dry gas DG_RT and supply the room-temperature dry gas DG_RT to the first chamber 112. Subsequently, the room-temperature dry gas DG_RT flows from the first chamber 112 into the chip slot 101 through the communication pipe 114, so that the test socket 100 and the chip 200 to be tested quickly return to room temperature, and thereby keep the inside of the test socket 100 dry, thus avoiding condensation on the surfaces of the chip 200 to be tested and the chip 200 to be tested, which may cause damage to the chip or the testing device. In other words, in some embodiments, the first chamber 112 and the second chamber 170 are further used as a warming chamber and are not limited to only being used as a low-temperature chamber.

[0067] In some embodiments, the low-temperature dry gas DG_LT can be a gas that remains gaseous and dry at low temperatures (such as -20°C to -40°C), such as but not limited to nitrogen, oxygen, or argon. In other embodiments, the low-temperature dry gas supply device 111 can be a high-pressure steel cylinder or a common low-temperature gas generation device in the industry; in addition, a gas drying system can also be used, such as a refrigerated dryer or an adsorption dryer. In some embodiments, the room-temperature dry gas DG_RT can be a gas that remains gaseous and dry at room temperature (such as 20°C to 30°C), such as but not limited to inert gas, nitrogen, oxygen, or argon.

[0068] In some embodiments, the chip testing device 10 can control the flow rate of the low-temperature drying gas DG_LT generated by the low-temperature drying gas supply device 111 through the controller 120. Please refer to Table 1, which shows the temperatures of the chip under test 200 at different flow rates of the normal-temperature drying gas DG_RT. As shown in Table 1, in some embodiments, when the flow rate of the normal-temperature drying gas DG_RT is larger, it means that the low-temperature drying gas DG_LT flows out of the first chamber 112 more slowly (in other words, the newly generated low-temperature drying gas DG_LT flows into the second chamber 170 more slowly). At this time, the temperature of the chip under test 200 is higher, and the humidity of the first chamber 112 and the second chamber 170 is lower. In other embodiments, when the flow rate of the low-temperature drying gas DG_LT is smaller, it means that the low-temperature drying gas DG_LT flows out of the first chamber 112 more quickly (in other words, the newly generated low-temperature drying gas DG_LT flows into the second chamber 170 more quickly). At this time, the temperature of the chip under test 200 is lower, and the humidity of the first chamber 112 and the second chamber 170 is higher. Therefore, according to different ambient temperatures or humidities, the chip testing device 10 can adjust the flow rate of the normal-temperature drying gas DG_RT to an appropriate value to achieve a balance between the cooling function and the anti-condensation function.

[0069] Table 1

[0070]

[0071]

[0072] In some embodiments, the low-temperature generating device 113 can be a hardware component with a cooling function, such as but not limited to an evaporator, a semiconductor cooler, a thermoelectric cooling chip, or other cooling devices.

[0073] In some embodiments, the controller 120 may be a hardware component with control functions, such as but not limited to a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), a complex programmable logic device (CPLD), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or a microcontroller unit (MCU). In addition, the controller 120 can also be any single or multiple processor computing devices or systems capable of executing computer-readable instructions, examples including but not limited to: workstations, laptop computers, client terminals, servers, distributed computing systems, handheld devices, or any other computing system or device. In its most basic configuration, the controller 120 may include at least one processor and system memory.

[0074] In some embodiments, the test circuit board 130 may be a hardware component with a chip socket 101, such as but not limited to a printed circuit board (PCB), a motherboard, or a development board.

[0075] As Figure 7 shown, in some embodiments, the pressure test head 160 includes multiple pressure test struts 161, and the multiple pressure test struts 161 are evenly distributed on the lower surface 162 of the pressure test head 160, so that the pressure test head 160 can evenly press against the chip 200 to be tested, thereby ensuring that all pins on the chip 200 to be tested are electrically connected to the corresponding pin sockets on the chip socket 101 of the test socket 100. In addition, since an appropriate distance is left between the pressure test struts 161, it can ensure that the low-temperature dry gas DG_LT can flow through the chip socket 101 and contact the chip 200 to be tested.

[0076] In some embodiments, the chip 200 to be tested can be various types of packaged chips, such as but not limited to stacked package (PoP) chips, ball grid array package (BGA) chips, chip scale package (CSP) chips, plastic leaded chip carrier (PLCC) chips, dual in-line package (PDIP) chips, chip on board (COB), ceramic dual in-line package (CERDIP) chips, plastic metric quad flat package (MQFP) chips, thin quad flat package (TQFP) chips, system on a chip (SOIC), shrink small outline package (SSOP) chips, thin small outline package (TSOP) chips, system in package (SIP) chips, multi-chip package (MCP) chips, wafer level package (WFP) chips, wafer level processed stacked package (WSP) chips, or silicon photonics chips.

[0077] In summary, according to any of the above embodiments, the low-temperature test module 110 and the chip test device 10 can simultaneously perform convective cooling and conductive cooling on the chip 200 to be tested, immersing the chip 200 to be tested in a low-temperature and dry test environment to quickly cool the chip 200 to be tested and easily and stably maintain it at a predetermined temperature. In addition, according to any of the above embodiments, it can be ensured that no condensation will occur on the surface of the chip or the device during or after the test, avoiding damage to the chip or the test device. In this way, the test efficiency and the safety during the test can be effectively improved.

[0078] Although the present invention has disclosed the above embodiments, it is not intended to limit the present application. Any person of ordinary skill in the art can make some modifications and changes without departing from the spirit and scope of the content of the present application. However, these modifications and changes are still within the scope of the patent application of the present invention.

Claims

1. A low-temperature test module for preventing condensation, characterized in that Comprising: A low-temperature drying gas supply device for supplying a low-temperature drying gas to a chip slot of a test socket; A low-temperature chamber; A low-temperature generating device disposed in the low-temperature chamber and coupled to the test socket, the low-temperature generating device being used to cool the test socket; And A connecting pipe, the two ends of which are respectively connected to the chip slot of the test socket and the low-temperature chamber.

2. The low-temperature test module according to claim 1, characterized in that The low-temperature chamber includes a support base and a chamber enclosure; The low-temperature generating device is disposed on the support base, the chamber enclosure is disposed on the support base and surrounds the low-temperature generating device, and an exhaust passage is included between the support base and the chamber enclosure.

3. The low-temperature test module according to claim 2, wherein The support base includes a convex frame, and the chamber enclosure and the convex frame overlap each other and are spaced apart by a specific distance; The chamber enclosure includes at least one elevation portion, the at least one elevation portion being used to space the chamber enclosure from the support base by another specific distance, and a plurality of specific distances form the exhaust passage.

4. The low-temperature test module according to claim 1, characterized in that It further includes a test socket enclosure and a test socket plate, wherein the test socket enclosure surrounds at least a part of the test socket, and the test socket plate is disposed on the test socket and the test socket enclosure; Wherein, the test socket plate includes a gas flow channel, and the two ends of the gas flow channel are respectively connected to the chip slot and the low-temperature drying gas supply device.

5. The low-temperature test module according to claim 1, characterized in that It further includes a normal-temperature drying gas supply device, the normal-temperature drying gas supply device being used to supply a normal-temperature drying gas into the low-temperature chamber.

6. A chip testing device, characterized in that, Comprising: A test socket, including a chip slot for accommodating a chip under test; A low-temperature drying gas supply device connected to the chip slot of the test socket; A low-temperature chamber; A low-temperature generating device disposed in the low-temperature chamber and coupled to the test socket; A connecting pipe, the two ends of which are respectively connected to the chip slot of the test socket and the low-temperature chamber; And A controller electrically connected to the test socket, the low-temperature drying gas supply device and the low-temperature generating device, the controller being used to control the low-temperature generating device to cool the test socket, to control the low-temperature drying gas supply device to supply a low-temperature drying gas to the chip slot, and to control the test socket to test the chip under test.

7. The chip testing device according to claim 6, characterized in that, It further includes a test socket enclosure and a test socket plate, wherein the test socket enclosure surrounds at least a part of the test socket, and the test socket plate is disposed on the test socket and the test socket enclosure; Wherein, the test socket plate includes a gas flow channel, and the two ends of the gas flow channel are respectively connected to the chip slot and the low-temperature drying gas supply device.

8. The chip testing device according to claim 6, characterized in that, The low-temperature chamber includes a support base and a chamber enclosure; The low-temperature generating device is disposed on the support base, and the chamber enclosure is disposed on the support base and surrounds the low-temperature generating device; The support base includes a convex frame, and the chamber enclosure and the convex frame overlap each other and are spaced apart by a specific distance; The chamber enclosure includes at least one raised portion for spacing the chamber enclosure from the support base by another specific distance, and a plurality of specific distances form an exhaust passage.

9. The chip testing device according to claim 6, wherein It further includes a normal-temperature dry gas supply device electrically connected to the controller, and the controller is further configured to control the normal-temperature dry gas supply device to supply a normal-temperature dry gas to the low-temperature chamber.

10. The chip testing device according to claim 6, characterized in that, It further includes a pressure probe corresponding to the chip slot of the test socket and electrically connected to the controller, and the controller is further configured to control the pressure probe to approach the chip slot to press against the chip under test or control the pressure probe to move away from the chip slot.

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