Small test system and method for semiconductor parts

Abstract

The invention relates to the technical field of semiconductor component testing, and provides a small-sized testing system and method for semiconductor components, a valve terminal function detection module is used for verifying the function adaptability of a valve terminal in semiconductor equipment, and a temperature control module is used for receiving the input of thermocouple and thermal resistor temperature signals; the input signal detection module is used for being connected with a device to be detected through a connecting line, so that an operator can observe the signal change of the device to be detected through the human-computer interaction interface. The power supply module is respectively connected with the valve terminal function detection module, the temperature control module and the input signal detection module through external adaptive connecting wires and provides required power for the modules; the temperature control module is used for controlling and stably adjusting the temperature and automatically setting and optimizing PID parameters, and a plurality of functional modules are integrated or flexibly combined to reduce the size, so that the system universality is met, and the production space is not occupied.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor component testing, and particularly to a portable small testing system and testing method applicable to life testing, heating testing, power supply testing and other projects of semiconductor components. Background Art

[0002] In today's digital age, the semiconductor industry, as the core support of information technology, is showing a booming development trend. As the cornerstone of the industry, semiconductor components are extremely diverse in types, covering many key components such as lithography masks and wafer carriers in the chip manufacturing process, and lead frames and bonding wires in the packaging process.

[0003] Moreover, there are significant differences in the design concepts and manufacturing processes of semiconductor components from different brands. Even for products of different series under the same brand, due to the diversification of application scenarios, there are great differences in performance focus. Therefore, various performance tests need to be carried out on products of different brands or different series of the same brand. And the product iteration cycle is short. In order to meet the test requirements and avoid idleness caused by the fact that the functions of the test system do not meet the requirements due to product iteration, it is required that the test system be as general as possible and easy to maintain and adjust.

[0004] Currently, the test systems existing on the market have single functions. Or in order to be general, they are often relatively large in volume, occupying a large production space, while the test systems with smaller volumes have limited function designs for testing specific types or specific performance indicators.

[0005] At the same time, there are significant defects in the temperature control test link of the existing system. During the temperature control test, the temperature fluctuation range is large, and it is difficult to meet such high-precision requirements. The PID parameter tuning mainly relies on manual experience, lacking an automatic tuning method. Different semiconductor components with different thermal characteristics require different parameters, and it is difficult for manual tuning to reach the optimal value, and problems such as temperature overshoot and slow response are likely to occur. In addition, the basic parameter settings are unreasonable, the heating and cooling rates are fixed, and the temperature sampling period setting is not optimal, affecting the accuracy and efficiency of the test results. Summary of the Invention

[0006] In order to solve the above technical problems, the present invention provides a small testing system and method for semiconductor components, which precisely controls and stably adjusts the temperature through the PLC module of the temperature control module, realizes automatic tuning and optimization of PID parameters through the PID parameter tuning unit, and integrates and flexibly combines multiple functional modules to reduce the volume, meet the requirements of high-precision process temperature control of semiconductors, and achieve the generality of system functions without occupying a large amount of production space, so as to solve the problems in the prior art.

[0007] A small testing system for semiconductor components includes: Valve island function detection module, which is used to verify the functional adaptability of the valve island in semiconductor equipment; Power supply module, which is used to provide 24VDC power output, ±15VDC power output and 220VAC power output; Temperature control module, which consists of a solid-state relay and a thermocouple extension wire, and is used to receive the input of thermocouple and thermal resistance temperature signals and calculate the temperature deviation between each measurement point and the temperature control point; Input signal detection module, which is used to receive the input signal of the device under test and enable the operator to observe the signal change of the device under test through the human-machine interface; The valve island function detection module, power supply module, temperature control module and input signal detection module all have a unified appearance and each includes an adapter connecting wire, a PLC module, a power supply module, a stainless steel shell (2), an interface board (4), a human-machine interface (3) and a handle (1), and their dimensions are all 400mm×300mm×260mm; The power supply module is respectively connected to the valve island function detection module, temperature control module and input signal detection module through the adapter connecting wire to provide the required power for them.

[0008] Preferably, the PLC module in the temperature control module includes a PID parameter tuning unit, a temperature control unit and a temperature deviation calculation unit; The PID parameter tuning unit automatically obtains the system dynamic characteristics through a step response experiment and uses an adaptive algorithm to automatically optimize the PID parameters, and outputs the PID parameters suitable for the current working condition to ensure that the system quickly completes the self-tuning process; The temperature control unit is used to adjust the control output in real time, dynamically adjust the control parameters according to the temperature error and its change rate, and stabilize the temperature within the set value range; The temperature deviation calculation unit is used to calculate the temperature field distribution by using the real-time data of multiple temperature measurement points collected through the thermocouple extension wire, adopt statistical analysis and spatial interpolation algorithms to calculate the temperature deviation and uniformity of multiple measurement points, and output the maximum deviation and temperature field distribution.

[0009] Preferably, the specific parameter tuning process of the PID parameter tuning unit is as follows: First, define an ideal second-order reference model without overshoot and with fast response : ; Among them, s represents the complex variable of Laplace transform and is used for frequency domain analysis, represents the natural frequency, which is set based on the thermal inertia of the device to be heated, represents the damping ratio, which is set to 1.0, that is, critical damping; Then, a step response experiment is carried out by applying 50% of the rated power to the device to be heated, that is , and the temperature rise curve based on time is recorded ; Extract the characteristic parameter, the steady-state gain is: ; where is the steady-state temperature value of the system when the power of the device to be heated is , represents the initial temperature before the start of the step response experiment, and then the initial parameters based on the inverse ratio of the steady-state gain K; The equivalent time constant : ; where represents the intersection time of the tangent line at the point with the maximum slope and the initial temperature line, represents the intersection time of the tangent line at the point with the maximum slope and the steady-state temperature line, and 1.2 is an empirical correction coefficient derived from the Ziegler-Nichols tuning rule; Then, the Chien-Hrones-Reswick tuning rule is adopted, and based on the inverse ratio of the steady-state gain and the equivalent time constant the initial PID parameters, that is, the proportional parameter , the integral parameter and the derivative parameter ; Adaptive parameter adjustment, dynamically adjust the PID parameters according to the error between the reference model and the actual output: ; where represents time, , and are the gain coefficients for controlling the adjustment speed of the PID parameters, and the value range is 0.01∼0.1. The larger the value, the faster the convergence. , and represent the sensitivity of the error to the PID parameters, which is calculated by the numerical difference method. represents the temperature tracking error, that is, the real-time tracking error between the theoretical temperature discretely calculated from the reference model and the actual temperature ; Parameter convergence judgment, set the convergence condition according to the temperature control stability index H. When the temperature tracking error , determine that the parameter converges, stop tuning, and output the final , and .

[0010] Preferably, the specific temperature control calculation process of the temperature control unit is as follows: Set the target temperature value of temperature control to , and then based on the , , Derive the initial state space matrices A, B, and C through a second-order inertia link model, and establish a state space model; ; Among them, is the state vector composed of temperature and heating rate at indicating the control signal PWM signal of the solid-state relay, that is, the duty cycle of the control quantity. Then, predict the temperature values in the next n steps through the state space model, and construct an optimization objective function: ; Among them, represents the temperature value at a certain future moment predicted by the state space model based on the current state vector. j represents the temperature value index in the prediction step length n, and the value range is from 1 to n. is the weight for punishing the mutation of the control quantity. The larger the value, the smoother the control. Finally, solve the optimization problem through quadratic programming to obtain the optimal control sequence, and execute the at the current moment, and update the duty cycle of the control quantity of the solid-state relay.

[0011] Preferably, the specific calculation process of the temperature deviation calculation unit is as follows: Based on and and the temperature data of multiple measurement points of the thermocouple conduct temperature deviation statistics and calculate the single-point deviation : ; Calculate the maximum deviation : ; Calculate the temperature range R: ; Among them, y represents the temperature measurement point index of the temperature data of multiple measurement points of the thermocouple. It represents the temperature control target value corresponding to the temperature measurement point y. At the same time, an interpolation function is constructed using the RBF space interpolation method, and the temperature in the area without measurement points is estimated through the data of limited measurement points to generate a continuous temperature field cloud map, visually showing the high-temperature area and the low-temperature area.

[0012] Preferably, the valve island function detection module, power supply module, temperature control module, and input signal detection module all have data recording and export functions and emergency stop buttons, which can stop the system in case of an emergency. At the same time, the power plug is adapted to a common wall socket.

[0013] Preferably, the valve island function detection module, power supply module, temperature control module, and input signal detection module can each be tested as an independent state, and can also be combined for testing according to actual test requirements. Moreover, two or more units can be integrated in a stainless steel shell to further reduce the volume of the test system at the expense of the specified number of interfaces.

[0014] A small test method for semiconductor components, including: Step 1, power supply test: The operator adjusts the parameters of the power supply module to appropriate values according to the electrical parameters of the product to be tested, starts the power supply module, measures the interface output with a measuring tool. If it is normal, proceed to the next step; if not, check the specific reasons. After turning off the power supply module, use the interface board and the adapter connection cable to connect the test system to the product to be tested. After the connection is firm, turn on the power supply of the power supply module, and judge whether it is qualified according to the test purpose, so as to complete the power supply test of the sample to be tested. Step 2, valve island test: The operator selects the appropriate valve island type on the human-machine interface of the valve island function detection module according to the information about valve drive in the valve island manual or wiring diagram to be tested, selects the appropriate adapter connection cable according to the interface prompt, and uses it to connect the corresponding interface board to the valve island to be tested. At the same time, select the appropriate test parameters on the human-machine interface, and click start. After receiving the instruction, the PLC module sequentially outputs drive signals to the valve island to be tested according to the set process. The operator observes whether the actions of the valve island are carried out according to the preset parameters, so as to complete the function test of the valve island to be tested. Step 3, temperature control test: The operator sets the basic parameters on the human-machine interface in the temperature control module according to the heating requirements of the equipment to be heated, connects the power supply line and temperature signal line of the equipment to be heated to the corresponding interfaces of the temperature control module, and clicks the self-tuning button of this loop on the human-machine interface of the temperature control module. After receiving the instruction, the PLC module starts the PID self-tuning of the equipment to be heated. After the self-tuning is completed, the system automatically switches to the temperature control mode, and the PLC module controls the solid-state relay to continuously output PWM signals, so that the equipment to be heated is continuously maintained at the target temperature. To monitor the temperature at other points of the heating device, the temperature signal wire can be pasted at this position, and the signal is transmitted into the PLC module and displayed on the human-machine interface of the temperature control module; Step 4, input signal test. The operator selects according to the output signal type and interface of the product to be tested on the human-machine interface. According to the interface prompts, use the adapted connection wire to connect it to the corresponding interface board and the product to be tested. Start the product to be tested to make it output the corresponding signal, and observe the type of this signal on the human-machine interface in the signal detection module to complete the input signal test of the product to be tested.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the temperature control unit in the PLC module in the temperature control module dynamically adjusts the control parameters according to the temperature error and its change rate, and the temperature deviation calculation unit calculates the temperature deviation and uniformity of multiple measurement points, realizing precise control and stable adjustment of the temperature during the semiconductor component testing process, achieving the beneficial effect of meeting the temperature control requirements of semiconductor high-precision processes, and avoiding the problems of affecting the test accuracy and product yield due to large temperature fluctuations.

[0016] 2. In the present invention, the ideal second-order reference model is defined by the PID parameter tuning unit, the characteristic parameters are extracted through a step response experiment, the initial PID parameters are adopted using the Chien-Hrones-Reswick tuning rule, and then the PID parameters are dynamically adjusted according to the error between the reference model and the actual output and the convergence judgment is performed, realizing the automatic tuning and optimization of the PID parameters, achieving the beneficial effect of getting rid of the dependence on manual experience and quickly finding the optimal PID parameter combination suitable for the current working conditions, and solving the problems of difficult PID parameter tuning and easy occurrence of temperature overshoot and response delay in the prior art.

[0017] 3. In the present invention, by integrating the valve island function detection module, the power supply module, the temperature control module and the input signal detection module, each module has the functions of data recording and exporting and an emergency stop button, and can be tested independently or in combination. Two or more units can also be integrated in a stainless steel shell, realizing the versatility and flexibility of the test system function, while reducing the system volume, achieving the beneficial effect of being able to meet the testing requirements of various semiconductor components without occupying a large amount of production space, and avoiding the defects of single function or large volume of the existing test system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the appearance of a certain unit of the small test system for semiconductor components of the present invention; Figure 2 is a schematic diagram of the parameter tuning process of the PID parameter tuning unit in the temperature control module of the present invention; Figure 3It is a schematic diagram of the operation process of the temperature control unit and the temperature deviation calculation unit in the temperature control test of the present invention; Figure 4 It is a schematic diagram of the internal principle process of the system of the present invention; In the figure: 1. Handle; 2. Stainless steel shell; 3. Human-machine interface; 4. Interface board. Specific embodiments

[0019] The following further describes the embodiments of the present invention in detail in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0020] The present invention provides a small test system for semiconductor components, including: A valve island function detection module, which is used to verify the functional adaptability of the valve island in semiconductor equipment; A power supply module, which is used to provide 24VDC power output, ±15VDC power output and 220VAC power output; A temperature control module, which consists of a solid-state relay and a thermocouple extension wire, and is used to receive the input of thermocouple and thermal resistance temperature signals and calculate the temperature deviation between each measurement point and the temperature control point; An input signal detection module, which is used to receive the input signal of the device under test and enable the operator to observe the signal change of the device under test through the human-machine interface; The valve island function detection module, the power supply module, the temperature control module and the input signal detection module, each module has a unified appearance, and all include an adapter connecting wire, a PLC module, a power supply module, a stainless steel shell (2), an interface board (4), a human-machine interface (3) and a handle (1), and the size is 400mm×300mm×260mm; The power supply module is respectively connected to the valve island function detection module, the temperature control module and the input signal detection module through the adapter connecting wire to provide the required power for them.

[0021] Embodiment: As Figures 1-4 shown, in the production workshop of a semiconductor manufacturing enterprise in this embodiment, there are test problems brought about by a wide variety of products and a fast iteration speed. Recently, the enterprise has newly developed a batch of semiconductor components with different specifications, covering new valve islands, temperature-sensitive heating elements and chip components with complex signal outputs, and it is urgent to conduct comprehensive performance tests on these components to ensure that they meet the production standards and can be smoothly put into the subsequent production process.

[0022] Therefore, the enterprise decides to use a small test system and method of the present invention for semiconductor components to conduct in-out tests on semiconductors; the testers carry out the work according to the following steps: Step 1, power supply test. The operator adjusts the parameters of the power supply module to appropriate parameters according to the electrical parameters of the product to be tested, starts the power supply module, and uses a measuring tool to measure the interface output. If it is normal, proceed to the next step; if it is not normal, check the specific reasons again. After turning off the power supply module, use the interface board and the adapter connection cable to connect the test system to the product to be tested. After the connection is firm, turn on the power supply of the power supply module, and judge whether it is qualified according to the test purpose, so as to complete the power supply test of the sample to be tested; Step 2, valve island test. The operator selects the appropriate valve island type on the human-machine interface of the valve island function detection module according to the information about valve drive in the valve island manual to be tested or the wiring diagram, selects the appropriate adapter connection cable according to the interface prompt, and uses it to connect the corresponding interface board to the valve island to be tested. At the same time, select the appropriate test parameters on the human-machine interface, click start, and the dedicated PLC module receives the instruction and sequentially outputs drive signals to the valve island to be tested according to the set process. The operator observes whether the action of the valve island proceeds according to the preset parameters, so as to complete the function test of the valve island to be tested; Step 3, temperature control test. The operator sets the corresponding parameters on the human-machine interface according to the heating requirements of the equipment to be heated, and connects the power supply line and temperature signal line of the equipment to be heated to the corresponding interfaces of the temperature control module; Click the self-tuning button of this loop on the human-machine interface in the temperature control module. After the PLC module receives the instruction, it starts the PID self-tuning of the equipment to be heated. The PLC module in the temperature control module includes a PID parameter tuning unit, a temperature control unit, and a temperature deviation calculation unit; The PID parameter tuning unit automatically obtains the dynamic characteristics of the system through a step response experiment, and uses an adaptive algorithm to automatically optimize the PID parameters, and outputs the PID parameters suitable for the current working conditions to ensure that the system quickly completes the self-tuning process. The specific parameter tuning process of the PID parameter tuning unit is as follows: First, define an ideal second-order reference model without overshoot and with fast response : ; Among them, s represents the complex variable of Laplace transform, which is used for frequency domain analysis, represents the natural frequency, which is set based on the thermal inertia of the equipment to be heated, represents the damping ratio, which is set to 1.0, that is, critical damping; Then conduct a step response experiment, apply 50% of the rated power to the equipment to be heated, that is , and record the temperature rise curve based on time ; Extract characteristic parameters, steady-state gain is: ; wherein, is the steady-state temperature value of the system when the power of the device to be heated is , represents the initial temperature before the start of the step response experiment, and then the initial parameter based on the inverse of the steady-state gain K; Equivalent time constant : ; wherein, represents the intersection time of the tangent line at the maximum slope point and the initial temperature line, represents the intersection time of the tangent line at the maximum slope point and the steady-state temperature line, and 1.2 is an empirical correction coefficient derived from the Ziegler-Nichols tuning rule; Then, the Chien-Hrones-Reswick tuning rule is adopted, based on the inverse of the steady-state gain and the equivalent time constant to obtain the initial parameters of the PID parameters, i.e., the proportional parameter , the integral parameter and the derivative parameter ; Adaptive parameter adjustment, dynamically adjust the PID parameters according to the error between the reference model and the actual output: ; wherein, represents time, , and are the gain coefficients for controlling the adjustment speed of the PID parameters, and the value range is 0.01 to 0.1. The larger the value, the faster the convergence. , and represent the sensitivity of the error to the PID parameters, which is obtained by numerical differentiation. represents the temperature tracking error, i.e., the real-time tracking error between the theoretical temperature discretely calculated from the reference model and the actual temperature ; Parameter convergence judgment, set the convergence condition according to the temperature control stability index H. When the temperature tracking error , it is determined that the parameter converges, stop the tuning, and output the final , and .

[0023] The PID parameter tuning unit adopts an advanced method, defines an ideal second-order reference model, conducts a step response experiment to extract characteristic parameters, then initializes the PID parameters using tuning rules, and dynamically adjusts the PID parameters according to the error between the reference model and the actual output, finally achieving automatic convergence of the parameters. This intelligent parameter self-tuning method gets rid of the dependence on traditional manual experience, can quickly and accurately find the optimal PID parameter combination suitable for the current working conditions, greatly shortens the test preparation time, improves the test efficiency, and also avoids problems such as temperature overshoot and slow response caused by improper manual tuning.

[0024] After the self-tuning is completed, the system automatically switches to the temperature control mode, and the PLC module controls the solid-state relay to continuously output PWM signals, so that the device to be heated is continuously maintained at the target temperature; The temperature control unit is used to adjust the control output in real time, dynamically adjusts the control parameters according to the temperature error and its change rate, and stabilizes the temperature within the set value range. The specific temperature control calculation process of the temperature control unit is as follows: Set the temperature control target value as , and then based on the , , of the PID parameter tuning unit, initialize the state space matrices A, B, and C through the second-order inertia link model derivation, and establish a state space model; ; Among them, is the state vector composed of temperature and heating rate at , ; Among them, represents the temperature value at a certain future moment predicted by the state space model based on the current state vector, j represents the temperature value index in the prediction step n, and the value range is from 1 to n, is the weight for punishing the mutation of the control quantity, and the larger the value, the smoother the control. Finally, solve the optimization problem through quadratic programming to obtain the optimal control sequence, and execute the of the current moment, and update the duty cycle of the control quantity of the solid-state relay.

[0025] By dynamically adjusting the control parameters according to the temperature error and its change rate through the temperature control unit, high-precision temperature control and stable regulation can be achieved. In this temperature control test of the heating element, the temperature can be quickly stabilized near the target value, and the temperature deviation at each measurement point is extremely small, with excellent temperature uniformity, effectively avoiding the problems of affecting the accuracy of semiconductor component performance testing and the product yield due to large temperature fluctuations, fully meeting the stringent requirements of semiconductor high-precision processes for temperature control.

[0026] If you want to monitor the temperature at other points of the heating equipment, the temperature signal wire can be pasted at this position, and the signal will be transmitted into the dedicated PLC module; The temperature deviation calculation unit is used to collect real-time data of multiple temperature measurement points through the thermocouple extension wire, calculate the temperature field distribution using statistical analysis and spatial interpolation algorithms, calculate the temperature deviation and uniformity of multiple measurement points, and output the maximum deviation and temperature field distribution. The specific calculation process of the temperature deviation calculation unit is as follows: Based on and and the thermocouple multi-measurement point temperature data perform temperature deviation statistics and calculate the single-point deviation : ; Calculate the maximum deviation : ; Calculate the temperature range R: ; Among them, y represents the temperature measurement point index of the thermocouple multi-measurement point temperature data, represents the temperature control target value of the corresponding temperature measurement point y. At the same time, use the RBF spatial interpolation method to construct an interpolation function, estimate the temperature in the area where no measurement points are arranged through the finite measurement point data, generate a continuous temperature field cloud map, intuitively display the high-temperature area and the low-temperature area, and then display it on the human-machine interface of the temperature control module. Through the above operations, the temperature control test of the equipment to be heated is completed; Step 4, input signal test. The operator selects according to the output signal type and interface of the product to be tested on the human-machine interface. According to the interface prompts, use the appropriate connection wire to connect it to the corresponding interface board and the product to be tested, start the product to be tested, and let it output the corresponding signal. Observe the type of this signal on the human-machine interface in the signal detection module to complete the input signal test of the product to be tested.

[0027] The valve island function detection module, power supply module, temperature control module, and input signal detection module all have data recording and export functions and emergency stop buttons, which can stop the system in case of an emergency. At the same time, the power plug is compatible with ordinary wall sockets.

[0028] Meanwhile, the above-mentioned modules can all be tested in an independent state, can also be combined for testing according to actual testing requirements, and can integrate more than two units in a stainless steel shell, further reducing the volume of the testing system on the premise of sacrificing the specified number of interfaces.

[0029] The testing system and method integrate multiple functional modules such as valve island function detection, power supply, temperature control, and input signal detection. Each module can be tested independently or flexibly combined according to actual testing requirements. This design makes the system highly versatile and can meet the diverse testing requirements of different types of semiconductor components. At the same time, the appearance of each module is unified, and more than two units can be integrated in a stainless steel shell. On the premise of sacrificing a small number of specified interfaces, the system volume is effectively reduced, without occupying a large amount of production space, solving the problems of single function or large volume of existing testing systems, saving valuable space resources for the production workshops of enterprises, and improving the utilization rate of production sites.

[0030] The embodiments of the present invention are given for the purposes of illustration and description. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A small test system for semiconductor components, characterized in that, Comprising: A valve island function detection module, which is used to verify the functional compatibility of the valve island in semiconductor equipment; A power supply module, which is used to provide 24VDC power output, ±15VDC power output and 220VAC power output; A temperature control module, which consists of a solid-state relay and a thermocouple extension wire, and is used to receive the input of thermocouple and thermal resistance temperature signals and calculate the temperature deviation between each measuring point and the temperature control point; An input signal detection module, which is used to receive the input signal of the device under test and enable the operator to observe the signal change of the device under test through the human-machine interface; The valve island function detection module, the power supply module, the temperature control module and the input signal detection module, each module has a unified appearance and includes an adapter connecting wire, a PLC module, a power supply module, a stainless steel shell (2), an interface board (4), a human-machine interface (3) and a handle (1), and the size is 400mm×300mm×260mm; The power supply module is respectively connected to the valve island function detection module, the temperature control module and the input signal detection module through the adapter connecting wire to provide the required power for them.

2. The small test system for semiconductor components according to claim 1, wherein: The PLC module in the temperature control module includes a PID parameter tuning unit, a temperature control unit and a temperature deviation calculation unit; The PID parameter tuning unit automatically obtains the system dynamic characteristics through a step response experiment and automatically optimizes the PID parameters by using an adaptive algorithm, and outputs the PID parameters suitable for the current working condition to ensure that the system quickly completes the self-tuning process; The temperature control unit is used to adjust the control output in real time, dynamically adjust the control parameters according to the temperature error and its change rate, and stabilize the temperature within the set value range; The temperature deviation calculation unit is used to calculate the temperature field distribution by using the real-time data of multiple temperature measuring points collected through the thermocouple extension wire, adopt statistical analysis and spatial interpolation algorithms, calculate the temperature deviation and uniformity of multiple measuring points, and output the maximum deviation and the temperature field distribution.

3. The small test system for semiconductor components according to claim 2, wherein: The specific parameter tuning process of the PID parameter tuning unit is as follows: First, define an ideal second-order reference model without over-harmonic and with fast response : ； where s represents the complex variable of the Laplace transform for frequency-domain analysis, denotes the natural frequency, which is set based on the thermal inertia of the device to be heated, denotes the damping ratio, which is set to 1.0, i.e., critical damping; Next, a step response experiment is carried out by applying 50% of the rated power to the device to be heated, that is , and the temperature rise curve based on time is recorded ; Extract characteristic parameters, steady-state gain It is as follows: ； Among them, is the steady-state temperature value of the system when the power of the device to be heated is , represents the initial temperature before the start of the step response experiment, and then the initial parameter based on the inverse of the steady-state gain K; Equivalent time constant : ； Among them, denotes the intersection time of the tangent line at the maximum slope point and the initial temperature line, denotes the intersection time of the tangent line at the maximum slope point and the steady-state temperature line, and 1.2 is an empirical correction coefficient derived from the Ziegler-Nichols tuning rule; Then, the Chien-Hrones-Reswick tuning rule is adopted, based on the inverse ratio of the steady-state gain and the equivalent time constant to initialize the PID parameters, namely the proportional parameter , the integral parameter and the derivative parameter ; Adaptive parameter adjustment, dynamically adjusting the PID parameters according to the error between the reference model and the actual output: ； Among them, represents time, , and are gain coefficients for controlling the adjustment speed of PID parameters, with a value range of 0.01 to 0.

1. The larger the value, the faster the convergence, , and represent the sensitivity of the error to the PID parameters, which is obtained by numerical differentiation, represents the temperature tracking error, that is, the theoretical temperature discretely calculated by the reference model and the real-time tracking error of the actual temperature ; Parameter convergence judgment: set the convergence condition according to the temperature control stability index H. When the temperature tracking error is satisfied, it is determined that the parameter converges, the tuning is stopped, and the final , and are output.

4. The small test system for semiconductor components according to claim 3, characterized in that: The specific temperature control calculation process of the temperature control unit is as follows: Set the target temperature value of temperature control to , and then based on the , , of the PID parameter tuning unit, initialize the state space matrices A, B, and C through the second-order inertia link model derivation, and establish a state space model; ； Among them, is the state vector composed of temperature and heating rate at that time, represents the control signal PWM signal of the solid-state relay, that is, the duty cycle of the control quantity. Then, the temperature values in the future n steps are predicted through the state space model, and an optimization objective function is constructed: ； Among them, represents the temperature value at a certain future moment predicted by the state space model based on the current state vector. j represents the temperature value index in the prediction step length n, and its value range is from 1 to n. is the weight for penalizing the mutation of the control quantity. The larger the value, the smoother the control. Finally, the optimization problem is solved by quadratic programming to obtain the optimal control sequence, and the at the current moment is executed, and the duty ratio of the control quantity of the solid-state relay is updated.

5. The small test system for semiconductor components according to claim 4, wherein: The specific calculation process of the temperature deviation calculation unit is as follows: Based on and and the multi-point temperature data of the thermocouple perform temperature deviation statistics and calculate the single-point deviation : ； Calculate the maximum deviation : ； Calculate the temperature range R: ； Among them, y represents the temperature measurement point index of the thermocouple multi-measurement point temperature data. represents the temperature control target value corresponding to the temperature measurement point y. At the same time, the RBF space interpolation method is used to construct an interpolation function, and the temperature in the area where the measurement points are not arranged is estimated through the finite measurement point data to generate a continuous temperature field cloud map, intuitively showing the high-temperature area and the low-temperature area.

6. The small test system for semiconductor components according to claim 1, characterized in that: The valve island function detection module, the power supply module, the temperature control module and the input signal detection module all have data recording and exporting functions and emergency stop buttons, and can stop the system in case of an emergency. At the same time, the power plug is adapted to a common wall socket.

7. The small test system for semiconductor components according to claim 1, characterized in that: The valve island function detection module, the power supply module, the temperature control module and the input signal detection module, each module can be tested as an independent state, can also be combined for testing according to actual test requirements, and can integrate two or more units in a stainless steel shell to further reduce the volume of the test system on the premise of sacrificing the specified number of interfaces.

8. A small test method for semiconductor components, applicable to the small test system for semiconductor components according to any one of claims 1-7, characterized in that, Comprising: Step 1, power supply test: The operator adjusts the parameters of the power supply module to appropriate values according to the electrical parameters of the product under test, starts the power supply module, and measures the output of the interface with a measuring tool. If it is normal, proceed to the next step; if not, check the specific reasons. After turning off the power supply module, connect the test system to the product under test using the interface board and the adapter connection cable. After the connection is firm, turn on the power supply of the power supply module, and determine whether it is qualified according to the test purpose, thus completing the power supply test of the sample under test. Step 2, valve island test: The operator selects the appropriate valve island type on the human-machine interface of the valve island function detection module according to the information about valve drive in the valve island manual or wiring diagram of the product under test. According to the interface prompts, select the appropriate adapter connection cable and use it to connect the corresponding interface board to the valve island under test. At the same time, select the appropriate test parameters on the human-machine interface. After clicking "Start", the PLC module receives the instruction and sequentially outputs drive signals to the valve island under test according to the set process. The operator observes whether the actions of the valve island are carried out according to the preset parameters, thus completing the function test of the valve island under test. Step 3, temperature control test: The operator sets the basic parameters on the human-machine interface in the temperature control module according to the heating requirements of the equipment to be heated, connects the power supply wire and temperature signal wire of the equipment to be heated to the corresponding interfaces of the temperature control module, and clicks the self-tuning button for this loop on the human-machine interface of the temperature control module. After the PLC module receives the instruction, it starts the PID self-tuning of the equipment to be heated. After the self-tuning is completed, the system automatically switches to the temperature control mode, and the PLC module controls the solid-state relay to continuously output PWM signals, so that the equipment to be heated is continuously maintained at the target temperature. If it is necessary to monitor the temperature of other points of the heating equipment, the temperature signal wire can be pasted at this position, and the signal is transmitted into the PLC module and displayed on the human-machine interface of the temperature control module. Step 4, input signal test: The operator selects according to the output signal type and interface of the product under test on the human-machine interface. According to the interface prompts, use the adapter connection cable to connect it to the corresponding interface board and the product under test. Start the product under test to make it output the corresponding signal, and observe the type of this signal on the human-machine interface in the signal detection module, thus completing the input signal test of the product under test.

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