Full-automatic spin coater table compatible with multiple photoetching technologies and multiple sample sizes for scientific research

Abstract

The invention discloses a full-automatic photoresist uniformizing machine table compatible with multiple photoetching technologies and multiple sample sizes for scientific research, and relates to the technical field of semiconductor photoresist uniformizing. A first slide glass device and a second slide glass device are used for loading samples of different sizes; the glue uniformizing device and the baking device are respectively used for carrying out glue uniformizing and baking treatment on a sample; the transfer device is provided with a transfer carrier matched with the size of the second sample and used for bearing the first sample; the pretreatment device is used for sample pretreatment; the first sheet moving device is used for conveying samples, and the second sheet moving device is used for conveying the samples and transferring the carrier; the liquid moving device is connected with the first sheet moving device and is used for dispensing photoresist; the adsorption replacement device is used for replacing the adsorption module of the glue uniformizing device. The machine integrates the standard sheet and fragment glue uniformizing functions, can meet the glue uniformizing requirements of electron beam lithography, laser direct writing lithography, stepping lithography, contact lithography and other lithography technologies on samples of different sizes, effectively reduces the equipment cost, reduces the space occupation, and improves the scientific research efficiency.

Description

Technical Field

[0001] This application relates to the technical fields of various semiconductor lithography technologies and diverse sample size technologies, and particularly relates to a fully automatic spin coater compatible with multiple lithography technologies and diverse sample sizes for scientific research. Background Art

[0002] In the field of semiconductor micro-nano processing research, in the spin coating of photoresist in the lithography process, the wafer sample sizes can be divided into two types: 1. 1 cm × 1 cm and 2 cm × 2 cm (hereinafter referred to as "fragments"), which are the commonly used sizes in the early process exploration to reduce research costs; 2. 2-inch / 4-inch / 6-inch / 8-inch (hereinafter referred to as "standard wafers"), and when the process conditions are mature in the fragments, standard wafers are used for mass production.

[0003] For the spin coating of photoresist for these two types of samples, two spin coating methods are usually used. The first one: For both fragments and standard wafers, a manual spin coater is used. Manually clamp the sample and place the sample at the vacuum adsorption hole on the chuck of the spin coater by naked eyes. And for samples of different sizes, the corresponding chuck needs to be manually replaced. Manually suck the photoresist from the glue bottle with a dropper and drop it on the sample, and then perform the spin coating process of the sample. The disadvantages of this method are as follows: ① When placing the wafer, it is judged by naked eyes whether the sample is placed in the middle of the vacuum adsorption hole of the spin coater, and it cannot be guaranteed that it is in the same position every time. Moreover, manual glue dropping cannot guarantee the consistency of the glue dropping position and the glue dropping amount each time, which may all result in low process repeatability, poor stability, and low research efficiency of spin coating; ② As the size of the sample increases, the requirements for the manual spin coating method also increase accordingly, and it will be more and more difficult to obtain good single-time photoresist uniformity, let alone the stability between batches, and the process effect is very poor; ③ The residual photoresist needs to be manually wiped and cleaned by the researchers consciously, which is very costly for the management personnel, and it is very likely to come into contact with the photoresist during cleaning, endangering the health of the personnel; ④ Manually replacing the chucks for samples of different sizes reduces the experimental efficiency. The second one: Use 1 set of spin coater for fragments and 1 set of enterprise-level automated spin coater for standard wafers. This method can guarantee the process of standard wafers to a certain extent. However, this approach has led to a significant increase in costs because two complete sets of machine equipment need to be purchased and maintained. In addition, the laboratory space occupied has also increased significantly, which not only raises the operating costs of the laboratory but also may limit the development of other research activities.

[0004] In addition, in the field of semiconductor micro-nano processing, there are various lithography technologies, such as laser direct writing lithography, electron beam lithography, step-and-repeat lithography, contact lithography, etc. Different lithography technologies require the use of different types of photoresists. Among these many lithography technologies, the spin-coated photoresists of laser direct writing lithography, step-and-repeat lithography, and contact lithography technologies can all utilize the above-mentioned two spin-coating methods. However, in electron beam lithography technology, the electron beam photoresist used is a very special photoresist.

[0005] Currently, for the spin-coating of electron beam photoresists, whether it is for chips or standard wafers, only the first method can be used, that is, using a manual spin coater. This is determined by the characteristics of the electron beam photoresist. The electron beam photoresist needs to be stored in a -18°C freezer (such as HSQ electron beam photoresist) or a 2-8°C refrigerator (ARP electron beam photoresist, PMMA electron beam photoresist). When in use, it is taken out of the refrigerator, and a spin coater is used to spin-coat it on the sample. After spin-coating is completed, the electron beam photoresist needs to be immediately put back into the refrigerator for storage. The existing automated machines used by enterprises can only handle photoresists at room temperature, pumping the photoresist from a barrel through a glue pump, and are not suitable for electron beam photoresists that need to be stored frozen or refrigerated.

[0006] Therefore, there is an urgent need to provide a new solution to solve the above problems, which can not only meet the glue coating requirements for chips and standard wafers in laser direct writing lithography, step-and-repeat lithography, and contact lithography technologies, but also meet the special spin-coating requirements of electron beam photoresists in electron beam lithography technology, and ensure the stability of the standard wafer process. Summary of the Invention

[0007] In view of this, the purpose of this application is to provide a fully automatic glue coater for scientific research that is compatible with multiple lithography technologies and various sample sizes, which can meet the glue coating requirements for chips and standard wafers in laser direct writing lithography, step-and-repeat lithography, and contact lithography technologies, solve the technical problems of increased costs and restricted development of other scientific research activities existing in the existing two-machine set solution, and at the same time meet the special spin-coating requirements of electron beam photoresist technology in electron beam lithography, and ensure the stability of the standard wafer process.

[0008] To achieve the above technical objectives, this application provides a fully automatic glue coater for scientific research that is compatible with multiple lithography technologies and various sample sizes, including a first wafer loading device, a second wafer loading device, a liquid loading device, a first wafer transfer device, a second wafer transfer device, a liquid transfer device, a baking device, a glue coating device, an adsorption replacement device, a transfer device, and a pretreatment device;

[0009] The first wafer loading device is used to load the first sample;

[0010] The second wafer loading device is used to load the second sample whose size is larger than the first sample;

[0011] The spin coating device is used for spin coating the first sample or the second sample dropped with photoresist;

[0012] The baking device is used for baking the first sample and / or the second sample after spin coating;

[0013] The transfer device is provided with a transfer carrier that is adapted to the shape and size of the second sample and is used for carrying the first sample;

[0014] The pretreatment device is used for pretreating the first sample or the second sample;

[0015] The first wafer transfer device can transport the first sample between the first wafer carrier device, the transfer carrier, the spin coating device, and the baking device;

[0016] The second wafer transfer device can transport the second sample between the second wafer carrier device, the pretreatment device, the spin coating device, and the baking device;

[0017] The second wafer transfer device can also transport the transfer carrier between the transfer device and the pretreatment device;

[0018] The liquid transfer device is connected to the first wafer transfer device and can, under the drive of the first wafer transfer device, suck photoresist from the liquid storage device and drip it onto the first sample or the second sample;

[0019] The adsorption replacement device is used for replacing the adsorption module of the spin coating device.

[0020] Further, the second wafer transfer device can also transport the transfer carrier between the transfer device and the baking device.

[0021] Further, the first wafer transfer device is installed above the second wafer transfer device and includes a first multi-axis robotic arm, a first vision sensor, and a first wafer transfer actuator;

[0022] The first vision sensor is installed on the first multi-axis robotic arm;

[0023] The first wafer transfer actuator is detachably installed at the end of the first multi-axis robotic arm and can grasp the first sample.

[0024] Further, the first wafer transfer actuator is a gripper;

[0025] The clamping surfaces of the clamping fingers of the first wafer transfer actuator are provided with at least two spaced clamping protrusions;

[0026] The clamping protrusions can contact the side surface of the first sample.

[0027] Further, the liquid carrier device includes a liquid carrier container and a container fixing mechanism;

[0028] The liquid carrier container is used to hold photoresist;

[0029] The container fixing mechanism is used to fix the liquid carrier container.

[0030] Further, the liquid carrier container is equipped with a container lid that can be unscrewed;

[0031] The first wafer transfer device further includes a container actuator;

[0032] The container actuator is detachably connected to the end of the first multi-axis robotic arm and can grasp the liquid carrier container or turn the container lid.

[0033] Further, a low-temperature storage device is also included;

[0034] The low-temperature storage device is provided with a cold storage room and a freezer;

[0035] A label is provided on the liquid carrier container;

[0036] An information reader for reading the information on the label is also included;

[0037] The information reader is installed on the first wafer transfer device;

[0038] The first wafer transfer device is also used to transport the liquid carrier container in the low-temperature storage device.

[0039] Further, the transfer device includes a transfer base and the transfer carrier;

[0040] A carrier groove for placing the transfer carrier is provided at the top of the transfer base;

[0041] Transfer ejector pins are provided on the carrier groove for lifting the transfer carrier;

[0042] A sample groove for placing the first sample is provided at the top of the transfer carrier;

[0043] Avoidance through-holes are provided on the sample groove;

[0044] Sample ejector pins for lifting the first sample through the avoidance through-holes are also provided on the carrier groove.

[0045] Further, the transfer device further includes a transfer driver and a second vision sensor;

[0046] The transfer driver is connected to the transfer base and is used to drive the transfer base to rotate horizontally;

[0047] The second vision sensor is used to acquire the image information of the vehicle groove and the intermediate transfer vehicle.

[0048] Further, the adsorption replacement device includes a replacement seat, a replacement displacement mechanism, and a replacement clamping mechanism;

[0049] A plurality of module grooves for the adsorption modules to be inserted one by one are provided on the replacement seat;

[0050] The clamping mechanism is used to clamp the adsorption module;

[0051] The replacement displacement mechanism is connected to the clamping mechanism and is used to drive the clamping mechanism to move so as to transport the adsorption module between the module groove and the spin coating device.

[0052] Further, a module cleaning mechanism is further included;

[0053] A module fixture and a fixture driver are provided on the replacement seat;

[0054] The module fixture is used to fix the adsorption module;

[0055] The fixture driver is connected to the module fixture and is used to drive the module fixture to rotate horizontally;

[0056] The replacement displacement mechanism is further used to drive the clamping mechanism to move so as to transport the adsorption module between the module fixture and the spin coating device, or to transport the adsorption module between the module groove and the module fixture;

[0057] The module cleaning mechanism is arranged on one side of the replacement seat and is used to clean the adsorption module located on the module fixture.

[0058] Further, the module cleaning mechanism includes a mechanism main body, a first unwinder, a first rewinder, and a pressing belt mechanism;

[0059] The first unwinder is installed on the mechanism main body and is used to release the first cleaning belt;

[0060] The first rewinder is installed on the mechanism main body and is located on one side of the first unwinder and is used to wind up the first cleaning belt;

[0061] The pressing belt mechanism includes a pressing belt member and a pressing belt driver;

[0062] The pressing belt member has a first pressing belt portion and a second pressing belt portion;

[0063] The first cleaning belt passes around the first pressing belt portion and the second pressing belt portion;

[0064] The pressure belt driver is installed on the main body of the mechanism and is connected to the pressure belt member, and is used to drive the pressure belt member to move closer to or away from the module fixture, so that a part of the first cleaning belt wound around the first pressure belt portion is pressed against the top surface of the adsorption module and / or so that the other part of the first cleaning belt wound around the second pressure belt portion is pressed against the side surface of the adsorption module.

[0065] Further, the glue spreading device includes a device main body, a device cover, and a switch cover driver;

[0066] A glue spreading cavity is provided at the top of the device main body;

[0067] An adsorption module installation station is provided at the center of the glue spreading cavity;

[0068] The switch cover driver is connected to the device cover and is used to drive the device cover to close or open the glue spreading cavity.

[0069] Further, the glue spreading device further includes a first spraying mechanism and a second spraying mechanism;

[0070] The spraying end of the first spraying mechanism extends into the glue spreading cavity and is arranged upward, and is used to spray cleaning liquid on the back surface of the second sample;

[0071] The first wafer transfer device can also grasp a cleaning cloth and wipe and clean the inner wall surface of the glue spreading cavity and the inner wall surface of the device cover;

[0072] The spraying end of the second spraying mechanism extends into the device cover and is arranged downward, and is used to spray cleaning liquid on the edge of the second sample in the glue spreading cavity.

[0073] Further, the second spraying mechanism includes a spraying pipe and a spraying driver;

[0074] The spraying pipe is rotatably installed on the device cover, and one end extends into the device cover;

[0075] A spray head is connected to one end of the spraying pipe;

[0076] The end of the spray head is located on one side of the central axis of the spraying pipe;

[0077] The spraying driver is installed on the device cover and is connected to the spraying pipe, and is used to drive the spraying pipe to rotate.

[0078] Further, a sample cleaning device is further included;

[0079] The sample cleaning device is used to clean the first sample.

[0080] Further, the sample cleaning device includes a second unwinder, a first guide frame, a second guide frame, and a traction mechanism;

[0081] A second cleaning belt is wound around the second unwinder;

[0082] The traction mechanism is used to pull and release the second cleaning belt on the second unwinder;

[0083] The first guide frame and the second guide frame are sequentially arranged between the second unwinder and the traction mechanism;

[0084] The second cleaning belt passes around the first guide frame and the second guide frame;

[0085] The second guide frame is set at a height higher than that of the first guide frame, so that the second cleaning belt forms a first cleaning section with a certain inclination angle or a vertical setting between the first guide frame and the second guide frame;

[0086] A horizontal support surface is provided at the top of the second guide frame;

[0087] The width of the horizontal support surface is smaller than the width of the first sample;

[0088] The setting height of the traction mechanism is lower than that of the second guide frame, so that the second cleaning belt forms a second cleaning section that fits the horizontal support surface on the horizontal support surface;

[0089] The first sheet transferring device can also grab the first sample and make the side of the first sample contact with the first cleaning section;

[0090] The first sheet transferring device can also grab the first sample and make the back of the first sample contact with the second cleaning section.

[0091] Further, it also includes a spraying table;

[0092] The spraying table is arranged below the first guide frame and is used to spray cleaning liquid on a partial section of the second cleaning belt passing through the first guide frame.

[0093] Further, it also includes a shearing mechanism and a recycling box;

[0094] The shearing mechanism is arranged on one side of the discharge end of the traction mechanism and is used to shear the released second cleaning belt;

[0095] The recycling box is used to recycle the waste cleaning belt used by the shearing mechanism.

[0096] Further, it also includes a side-changing table;

[0097] The edge-changing table is provided with edge-changing adsorption holes for adsorbing the first sample.

[0098] Further, the second wafer transfer device includes a second multi-axis robotic arm and a second wafer transfer actuator;

[0099] The end of the second multi-axis robotic arm is connected to the second wafer transfer actuator for driving the second wafer transfer actuator to move;

[0100] The second wafer transfer actuator is used for picking up the second sample or picking up the intermediate carrier.

[0101] Further, it further includes a machine platform main body;

[0102] A working chamber is provided inside the machine platform main body;

[0103] The first wafer carrier device, the second wafer carrier device, the liquid loading device, the first wafer transfer device, the second wafer transfer device, the liquid transfer device, the baking device, the spin coating device, the adsorption replacement device, the intermediate transfer device, and the pretreatment device;

[0104] The second wafer transfer device is arranged directly below the first wafer transfer device;

[0105] The first wafer carrier device, the second wafer carrier device, the liquid loading device, the baking device, the spin coating device, the adsorption replacement device, the intermediate transfer device, and the pretreatment device are distributed circumferentially around the second wafer transfer device.

[0106] Further, a fan filter unit is installed on the top of the machine platform main body, which is communicated with the working chamber.

[0107] Further, it further includes a control device;

[0108] The control device is electrically connected to the first wafer carrier device, the second wafer carrier device, the liquid loading device, the first wafer transfer device, the second wafer transfer device, the liquid transfer device, the baking device, the spin coating device, the adsorption replacement device, the intermediate transfer device, and the pretreatment device.

[0109] As can be seen from the above technical solutions, the fully automatic glue spreading machine for scientific research designed in this application, which is compatible with multiple lithography technologies and various sample sizes, first realizes that the machine can respectively grasp samples of corresponding sizes through the combined design of the first wafer transfer device and the second wafer transfer device; furthermore, a transfer device with an adaptation to the second sample size is additionally designed, enabling the first sample to also be pre-treated adaptively, reducing the transformation cost of the pre-treatment equipment; further still, an adsorption replacement module is additionally designed to replace the adsorption module of the glue spreading device to adapt to the adsorption of samples of different sizes, thereby meeting the glue spreading requirements for different sizes in laser direct writing lithography, step-and-repeat lithography, and contact lithography technologies. Through the above design, the functions of standard wafer glue spreading and chip glue spreading are integrated on one machine, effectively reducing equipment costs, reducing the occupancy of laboratory space, and lowering operating costs. Description of the Drawings

[0110] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0111] Figure 1 Structural schematic diagram of the fully automatic glue spreading machine for scientific research, which is compatible with multiple lithography technologies and various sample sizes provided in this application, without the machine body

[0112] Figure 2 First partial structural schematic diagram of the fully automatic glue spreading machine for scientific research, which is compatible with multiple lithography technologies and various sample sizes provided in this application

[0113] Figure 3 Partial structural schematic diagram of the first wafer transfer device of the fully automatic glue spreading machine for scientific research, which is compatible with multiple lithography technologies and various sample sizes provided in this application

[0114] Figure 4 For Figure 3 Enlarged schematic diagram of position A in

[0115] Figure 5 Second partial structural schematic diagram of the fully automatic glue spreading machine for scientific research, which is compatible with multiple lithography technologies and various sample sizes provided in this application

[0116] Figure 6 Structural schematic diagram of the transfer device of the fully automatic glue spreading machine for scientific research, which is compatible with multiple lithography technologies and various sample sizes provided in this application

[0117] Figure 7Schematic diagram of the adsorption replacement device of the full-automatic multi-lithography technology and multi-sample size compatible spin coater for scientific research provided in this application;

[0118] Figure 8 First perspective view of the spin coating device of the full-automatic multi-lithography technology and multi-sample size compatible spin coater for scientific research provided in this application;

[0119] Figure 9 Second perspective view of the spin coating device of the full-automatic multi-lithography technology and multi-sample size compatible spin coater for scientific research provided in this application;

[0120] Figure 10 First perspective view of the sample cleaning device of the full-automatic multi-lithography technology and multi-sample size compatible spin coater for scientific research provided in this application;

[0121] Figure 11 Second perspective view of the sample cleaning device of the full-automatic multi-lithography technology and multi-sample size compatible spin coater for scientific research provided in this application;

[0122] Figure 12 Third perspective view of the sample cleaning device of the full-automatic multi-lithography technology and multi-sample size compatible spin coater for scientific research provided in this application with a recycling bin;

[0123] Figure 13 Perspective view of the spin coater for scientific research provided in this application with a machine body;

[0124] Figure 14 Perspective view of the spin coater for scientific research provided in this application with a control device;

[0125] In the figure: 101, the first wafer transfer device; 102, the second wafer transfer device; 201, the first wafer carrier device; 202, the second wafer carrier device; 301, the liquid carrier device; 302, the liquid transfer device; 400, the transfer device; 500, the pretreatment device; 601, the spin coating device; 602, the adsorption replacement device; 700, the baking device; 800, the sample cleaning device; 900, the machine body; 901, the observation window; 902, the fan filter unit; 1000, the control device; 11, the first multi-axis robotic arm; 12, the first wafer transfer actuator; 121, the finger; 122, the clamping protrusion; 123, the forming groove; 13, the second multi-axis robotic arm; 14, the second wafer transfer actuator; 15, the carrier; 16, the container actuator; 17, the first vision sensor; 21, the container fixing mechanism; 22, the liquid carrier container; 221, the container lid; 23, the low-temperature storage device; 231, the cold storage room; 232, the freezer; 31, the transfer base; 32, the transfer carrier; 321, the sample groove; 322, the avoidance through hole; 41, the replacement base; 42, the replacement displacement mechanism; 43, the replacement clamping mechanism; 44, the adsorption module; 45, the module cleaning mechanism; 451, the mechanism main body; 452, the first unwind reel; 453, the first wind reel; 454, the pressing belt member; 4541, the first pressing belt portion; 4542, the second pressing belt portion; 455, the first cleaning belt; 51, the device main body; 52, the device lid; 53, the switch lid driver; 54, the first spraying mechanism; 55, the second spraying mechanism; 551, the spraying driver; 552, the spraying pipe; 553, the spraying head; 61, the second unwind reel; 62, the first guiding frame; 63, the second guiding frame; 631, the horizontal supporting surface; 64, the traction mechanism; 65, the second cleaning belt; 651, the second cleaning section; 652, the first cleaning section; 66, the spraying table; 67, the shearing mechanism; 68, the recycling box; 681, the automatic switch lid mechanism; 69, the edge-changing table; 691, the edge-changing adsorption hole. Detailed implementation manners

[0126] Next, the technical solutions of the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the embodiments of the present application.

[0127] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present application. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0128] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0129] The embodiments of the present application disclose a full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes.

[0130] Please refer to Figure 1 , an embodiment of the full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes provided in the embodiments of the present application includes:

[0131] A first wafer carrier device 201, a second wafer carrier device 202, a liquid carrier device 301, a first wafer transfer device 101, a second wafer transfer device 102, a liquid transfer device 302, a baking device 700, a spin coating device 601, an adsorption replacement device 602, a transfer device 400, and a pretreatment device 500.

[0132] The first wafer carrier device 201 is used to load the first sample. There are several loading stations thereon. A lifting module is provided on the loading station for lifting the first sample to facilitate grasping the sample. For the specific design, reference can be made to the existing sample loading table with a lifting module, which will not be elaborated here.

[0133] The second wafer carrier device 202 is used to load the second sample whose size is larger than that of the first sample. The first sample can be understood as a chip (1 cm × 1 cm, 2 cm × 2 cm), while the second sample can be understood as a standard wafer (2 inches / 4 inches / 6 inches / 8 inches). The grasping of the standard wafer can be achieved by means of forking. For this reason, the second wafer carrier device 202 can include several forking stations, and brackets are arranged on the forking stations to facilitate the forking of the second sample. For the specific design, reference can be made to the existing loading table for large-sized samples, which will not be elaborated here.

[0134] The spin coating device 601 is used to perform spin coating on the first sample or the second sample with photoresist dropped thereon.

[0135] The baking device 700 is used to bake the first sample (chip) and / or the second sample (standard wafer) after spin coating. The baking device 700 is an existing device, which is provided with a hot plate area and a cold plate area. The hot plate area is used for baking, while the cold plate area is used for cooling after sample baking. Multiple hot plate areas and cold plate areas can be set to enable simultaneous baking and cooling of the first sample and the second sample. When the number of hot plate areas is limited, the first sample and the second sample are baked separately, and specific details are not elaborated here.

[0136] The transfer device 400 is provided with a transfer carrier 32 that is adapted to the shape and size of the second sample and is used to carry the first sample. Under this design, the pretreatment device 500 only needs to be designed according to the pretreatment requirements of the second sample, without the need to redesign for the first sample additionally, avoiding the cost increase problem caused by transformation. At the same time, it can also meet the pretreatment requirements of multiple first samples at a time, improving efficiency.

[0137] The pretreatment device 500 is used to perform pretreatment on the first sample or the second sample. The pretreatment device 500 can be an evaporation coater, which is used to deposit a thin film layer with specific functions on the sample surface, providing a necessary material basis for subsequent process steps (such as lithography and etching).

[0138] The first wafer transfer device 101 can transport the first sample between the first wafer carrier device 201, the transfer carrier 32, the spin coating device 601, and the baking device 700. The second wafer transfer device 102 can transport the second sample between the second wafer transfer device 102, the pretreatment device 500, the spin coating device 601, and the baking device 700. The second wafer transfer device 102 can also transport the transfer carrier 32 between the transfer device 400 and the pretreatment device 500. The second wafer transfer device 102 can also transport the transfer carrier 32 between the transfer device 400 and the baking device 700.

[0139] The pipetting device 302 is connected to the first wafer transfer device 101 and can suck photoresist from the liquid carrier device 301 and drop it onto the first sample or the second sample under the drive of the first wafer transfer device 101. The adsorption replacement device 602 is used to replace the adsorption module 44 of the spin coating device 601.

[0140] The spin coating process of the first sample is as follows:

[0141] 1. The first wafer transfer device 101 grabs the first sample from the first wafer carrier device 201 and transports it to the transfer carrier 32.

[0142] 2. The second wafer transfer device 102 transports the intermediate carrier 32 to the pre-treatment device 500 to pre-treat the first sample. After the pre-treatment is completed, the intermediate carrier 32 is transported back to the transfer device 400.

[0143] 3. The first wafer transfer device 101 grabs the first sample from the intermediate carrier 32 and transports it to the spin coating device 601. During the transportation to the spin coating device 601 or before that, the adsorption replacement device 602 operates to replace the adsorption module 44 matching the current size of the first sample into the spin coating device 601. After the first sample is transported in place, the adsorption module 44 adsorbs the first sample.

[0144] 4. The pipetting device 302 sucks the photoresist from the liquid carrier device 301 under the drive of the first wafer transfer device 101 and then drops it onto the first sample on the adsorption module 44. Then, the spin coating device 601 operates to perform spin coating on the first sample.

[0145] 5. The first wafer transfer device 101 transports the first sample with spin coating completed to the baking device 700 for baking, or transports it back to the intermediate carrier 32, and then the second wafer transfer device 102 transports the intermediate carrier 32 to the baking device 700 to bake the first sample on the intermediate carrier 32 together and then transports it back to the transfer device 400.

[0146] 6. The first wafer transfer device 101 transports the baked first sample back to the first wafer loading device 201 and waits to be taken away.

[0147] The spin coating process of the second sample is as follows:

[0148] 1. The second wafer transfer device 102 grabs the second sample from the second wafer loading device 202 and transports it to the pre-treatment device 500 for pre-treatment.

[0149] 2. The second wafer transfer device 102 grabs the second sample after the pre-treatment is completed and transports it to the spin coating device 601. During the transportation to the spin coating device 601 or before that, the adsorption replacement device 602 operates to replace the adsorption module 44 matching the current size of the second sample into the spin coating device 601. After the second sample is transported in place, the adsorption module 44 adsorbs the second sample.

[0150] 3. The pipetting device 302 sucks the photoresist from the liquid carrier device 301 under the drive of the first wafer transfer device 101 and then drops it onto the second sample on the adsorption module 44. Then, the spin coating device 601 operates to perform spin coating on the second sample.

[0151] 4. The second wafer transfer device 102 transports the second sample with spin coating completed to the baking device 700 for baking.

[0152] 5. The second wafer transfer device 102 transports the baked second sample back to the second wafer loading device 202 and waits to be taken away.

[0153] As can be seen from the above technical solutions, the fully automatic research-compatible multi-lithography technology and the spin coater for various sample sizes designed in this application are more flexible and efficient in terms of function realization. Specifically, through the collaborative operation of the first wafer transfer device 101 and the second wafer transfer device 102, samples of different sizes can be accurately grasped and transported, greatly improving the adaptability and flexibility of the spin coating operation. In addition, the design of the transfer device 400 cleverly solves the adaptation problem of fragmented samples during the pretreatment process, enabling both standard wafers and fragmented samples to be successfully pretreated on the same machine without additional modification of the pretreatment equipment, thus saving the retrofit cost. Furthermore, the design of the adsorption replacement module enables the spin coating device 601 to quickly replace the adsorption module 44 according to different sample sizes, ensuring the stability and uniformity of the sample during the spin coating process. This design not only improves the efficiency of the spin coating operation but also ensures the consistency and reliability of the spin coating quality.

[0154] In summary, the fully automatic research-compatible multi-lithography technology and the spin coater for various sample sizes designed in this application, through a series of innovative designs and technical means, have successfully achieved the goal of integrating the functions of standard wafer spin coating and fragmented wafer spin coating on one machine (meeting the spin coating requirements for different-sized samples in laser direct writing lithography, step-and-repeat lithography, and contact lithography technologies). This not only effectively reduces the equipment cost but also significantly reduces the occupation of laboratory space and the operating cost, providing a more convenient, efficient, and economical solution for semiconductor spin coating and baking research activities.

[0155] The above is the first embodiment of the spin coater for fully automatic research-compatible multi-lithography technology and various sample sizes provided by this application. The following is the second embodiment of the spin coater for fully automatic research-compatible multi-lithography technology and various sample sizes provided by this application. For details, please refer to Figures 1 to 14 。

[0156] Based on the solution of the above-mentioned first embodiment:

[0157] Furthermore, as Figures 2 to 4 shown, for the design of the first wafer transfer device 101, it is installed above the second wafer transfer device 102 and includes a first multi-axis robotic arm 11, a first vision sensor 17, and a first wafer transfer actuator 12; the first vision sensor 17 is installed on the first multi-axis robotic arm 11; the first wafer transfer actuator 12 is detachably installed at the end of the first multi-axis robotic arm 11 and can grasp the first sample.

[0158] The first multi-axis robotic arm 11 has multiple degrees of freedom and can flexibly move and rotate in three-dimensional space to ensure accurate positioning and grasping of the first sample (specifically, it can be a six-axis collaborative robotic arm / six-axis robotic arm). The first vision sensor 17 is used to capture the position and attitude information of the first sample in real time, providing precise navigation for the first multi-axis robotic arm 11, thereby improving the accuracy and efficiency of grasping.

[0159] Furthermore, as Figure 2 shown, the first wafer transfer actuator 12 can be a gripper, that is, it grasps the first sample in a clamping manner. Specifically, it can be a pneumatic cylinder gripper, which can firmly hold the first sample and prevent it from falling or shifting during movement. The gripper can also be fine-tuned according to the size of the first sample to adapt to the grasping requirements of different specifications of samples.

[0160] The clamping surface of the clamping fingers 121 of the first wafer transfer actuator 12 is provided with at least two spaced clamping protrusions 122, and the clamping protrusions 122 can contact the side surface of the first sample. Compared with the traditional direct surface contact, the improvement is that multiple clamping protrusions 122 are in contact, reducing the contact area between the clamping fingers 121 and the first sample (realizing the improvement from the original area to point contact. The clamping protrusions 122 can be regarded as point contact structures, which can be specifically strip-shaped. The forming method can be to open a forming groove 123 in the middle of the clamping surface. The width of the forming groove 123 is smaller than the width of the clamping surface, and its bottom extends to the bottom of the clamping surface, so that raised structures are formed on both sides of the forming groove 123, and the raised structures are the clamping protrusions 122. The width of the clamping protrusions 122 can be designed as small as possible to better reduce the contact area, and can be specifically designed according to actual needs without limitation). Furthermore, the viscosity generated between them is reduced (it has been found through research that there is some glue residue on the side surface of the first sample. In the direct surface contact design, the glue residue will be transferred to the clamping surface of the clamping fingers 121 to a large extent. When clamping again, it will increase the viscosity between the clamping fingers 121 and the sample, resulting in the sample being prone to deviation in placement and affecting the operation accuracy). Therefore, by adopting the design of multi-point contact, we not only improve the clamping stability, but also optimize the operation process, ensure the precise placement of the sample, and thus improve the overall operation accuracy and efficiency.

[0161] Furthermore, as Figure 5As shown, for the design of the liquid carrier device 301, it includes a liquid carrier container 22 and a container fixing mechanism 21; the liquid carrier container 22 is used to hold photoresist; the container fixing mechanism 21 is used to fix the liquid carrier container 22. The container fixing mechanism 21 can be a clamping mechanism, which fixes the liquid carrier container 22 in a clamping manner to ensure that it does not shake or tilt during operation, and guarantees the stable supply of photoresist. The design of the liquid carrier container 22 takes into account the characteristics and usage requirements of photoresist and is made of a chemical-resistant material to ensure that the photoresist does not react with the container and affect its performance.

[0162] Further, as Figure 2 and Figure 5 shown, the liquid carrier container 22 is equipped with a container lid 221 that can be unscrewed to prevent the photoresist from being oxidized or contaminated by air during long-term storage.

[0163] The first wafer transfer device 101 also includes a container actuator 16; the container actuator 16 is detachably connected to the end of the first multi-axis robotic arm 11 and can grasp the liquid carrier container 22 or turn the container lid 221.

[0164] The container actuator 16 can also be a gripper (such as a pneumatic cylinder gripper), which has sufficient gripping force and stability to firmly grasp the liquid carrier container 22 and prevent it from falling or leaking during movement. At the same time, the design of the container actuator 16 also needs to consider the operation of unscrewing the container lid 221, that is, the container actuator 16 has a rotation function and can perform unscrewing or tightening operations after gripping the container lid 221. This design not only improves the operation convenience of the liquid carrier device 301 but also ensures the safe storage and stable supply of photoresist, providing strong support for the spin coating operation. The container actuator 16 can be dedicated to container grasping or lid turning. If it is dedicated to a single operation, another container actuator can be additionally designed to specifically perform the other operation; for the case where the diameters of the container and the lid are not much different, it can be compatible with both operation methods, and those skilled in the art can make variable designs according to actual needs without limitation.

[0165] To facilitate the replacement of the container actuator 16 and the first wafer transfer actuator 12, a carrier 15 for carrying the container actuator 16 and the first wafer transfer actuator 12 is provided to fix the replaced actuators; the actuators are docked with the first multi-axis robotic arm 11 through quick-change joints to improve the replacement efficiency.

[0166] Further, as Figure 5As shown, it further includes a low-temperature storage device 23 (such as a freezer / refrigerator); the low-temperature storage device is provided with a refrigerating chamber 231 and a freezing chamber 232; a label (not shown in the figure) is provided on the liquid carrier container 22; it further includes an information reader (not shown in the figure) for reading the label; the information reader is installed on the first wafer transfer device 101; the first wafer transfer device 101 is further used for transporting the liquid carrier container 22 in the low-temperature storage device.

[0167] The design of the low-temperature storage device 23 takes into account the storage requirements of photoresist. Photoresist is a temperature-sensitive chemical material that needs to be stored under specific temperature conditions to maintain its stable performance. Therefore, the low-temperature storage device 23 provides two different storage areas, the refrigerating chamber 231 and the freezing chamber 232, to meet the storage temperature requirements of different photoresists. The refrigerating chamber 231 is suitable for storing photoresists with slightly lower temperature requirements, while the freezing chamber 232 is used for storing photoresists with more stringent temperature requirements.

[0168] The label (RFID label) on the liquid carrier container 22 is used to record key information such as the type, batch, and storage conditions of the photoresist. This information is crucial for ensuring the accuracy and traceability of the spin coating operation. The information reader is installed on the first wafer transfer device 101 and can automatically read the information on the label during the process of the first wafer transfer device 101 transporting the liquid carrier container 22. In this way, the first wafer transfer device 101 can accurately transport the liquid carrier container 22 to the designated storage location according to the read information, or select the correct photoresist during the spin coating operation.

[0169] In addition, the first wafer transfer device 101 also has the function of transporting the liquid carrier container 22 in the low-temperature storage device. This means that before the spin coating operation, the first wafer transfer device 101 can automatically take out the required liquid carrier container 22 from the low-temperature storage device 23 and transport it to the container fixing mechanism 21 of the liquid carrier device 301 for use. This design not only improves the automation level of the spin coating operation but also ensures the safety and stability of the photoresist during storage and transportation.

[0170] By designing the low-temperature storage device 23, the spin coater designed in this application can also meet the special requirements of spin coating electron beam photoresist in electron beam photoresist technology.

[0171] Furthermore, as Figure 6 shown, for the design of the transfer device 400, it includes a transfer base 31 and a transfer carrier 32; a carrier groove for placing the transfer carrier 32 is provided at the top of the transfer base 31; the transfer base 31 serves as a support structure, and the carrier groove at its top is used to stably place the transfer carrier 32.

[0172] A transfer ejector pin (not shown in the figure) is provided on the vehicle groove for lifting the transfer carrier 32. The transfer ejector pin can lift the transfer carrier 32 when needed, facilitating the grasping and placement operations of the first wafer transfer device 101 or the second wafer transfer device 102 on the transfer carrier 32.

[0173] A sample groove 321 for placing the first sample is provided on the top of the transfer carrier 32. An avoidance through-hole 322 is provided on the sample groove 321. A sample ejector pin (not shown in the figure) for lifting the first sample through the avoidance through-hole 322 is also provided on the vehicle groove. The design of the transfer carrier 32 also takes into account the placement requirements of the sample. The size of the sample groove 321 on its top matches the first sample, and it can stably carry the first sample. The avoidance through-hole 322 provided on the sample groove 321 is for cooperating with the sample ejector pin on the vehicle groove. When the first sample needs to be lifted, the sample ejector pin can lift the sample through the avoidance through-hole 322, enabling the sample to smoothly separate from the transfer carrier 32, facilitating the grasping or placement by the first wafer transfer device 101.

[0174] Furthermore, the transfer device 400 further includes a transfer driver (not shown in the figure) and a second vision sensor (not shown in the figure). The transfer driver is connected to the transfer base 31 for driving the transfer base 31 to rotate horizontally. The second vision sensor is used to obtain the image information of the vehicle groove and the transfer carrier 32.

[0175] When the transfer carrier 32 is transported to the pre-treatment device 500 or the baking device 700 and then reset, there may be a problem of inaccurate reset, that is, the avoidance through-hole 322 cannot be aligned with the sample ejector pin on the transfer base 31, resulting in problems with the lifting of the first sample, thereby affecting the grasping of the first sample. By designing the second vision sensor to be able to obtain the image information of the vehicle groove and the transfer carrier 32, the alignment situation between the avoidance through-hole 322 and the sample ejector pin between the two can be judged, and then the rotation angle can be adjusted through the transfer driver (such as a servo motor that can rotate forward and backward, not limited), ensuring that the transfer carrier 32 can be accurately placed on the transfer base 31.

[0176] Of course, the second vision sensor can also be not provided in this application, and the first vision sensor can be directly used for detection and judgment to save the cost of sensor arrangement and maintenance.

[0177] Furthermore, as Figure 7 shown, for the design of the adsorption replacement device 602, it includes a replacement base 41, a replacement displacement mechanism 42, and a replacement clamping mechanism 43. A number of module grooves for placing the adsorption modules 44 one by one are provided on the replacement base 41. The clamping mechanism is used to clamp the adsorption modules 44. The replacement displacement mechanism 42 is connected to the clamping mechanism for driving the clamping mechanism to move to transport the adsorption modules 44 between the module grooves and the spin coating device 601.

[0178] The replacement displacement mechanism 42 can be a multi-axis robotic arm (such as a six-axis robotic arm) or a linear motor module (XYZ three-axis module), which has sufficient movement accuracy and stability to ensure the safety and accuracy of the adsorption module 44 during transportation. The replacement clamping mechanism 43 can be a cylinder jaw or other suitable clamping device, which can firmly clamp the adsorption module 44 to prevent it from falling or being damaged during replacement. In addition, the number of module grooves provided on the replacement seat 41 can be set according to actual needs to adapt to the replacement requirements of different types and quantities of adsorption modules 44.

[0179] Furthermore, as Figure 7 shown, after the adsorption module 44 is used, there may be glue residues on its upper surface and side surfaces. To prevent these glue residues from contaminating the sample during the next use, the present application also adds a design of a module cleaning mechanism 45.

[0180] The replacement seat 41 is provided with a module fixture (not shown in the figure) and a fixture driver (not shown in the figure); the module fixture is used to fix the adsorption module 44; the fixture driver is connected to the module fixture and is used to drive the module fixture to rotate horizontally. The module fixture can be a clamping mechanism or a vacuum adsorption mechanism, which fixes the module fixture in a clamping or adsorption manner. The fixture driver can be a servo motor, and there is no specific limitation.

[0181] The replacement displacement mechanism 42 is also used to drive the clamping mechanism to move to transport the adsorption module 44 between the module fixture and the spin coater 601, or to transport the adsorption module 44 between the module groove and the module fixture; it can be understood that the replaced adsorption module 44 is first transported to the module fixture for fixation to prepare for cleaning, and after cleaning, it is transported to the module groove to wait for the next replacement.

[0182] The module cleaning mechanism 45 is arranged on one side of the replacement seat 41 and is used to clean the adsorption module 44 located on the module fixture.

[0183] It should be noted that generally, the cleaning is mainly aimed at the adsorption module 44 used for adsorbing and fixing debris. Since the debris is small in size and cannot cover the adsorption module 44, the part of the adsorption module 44 that is not covered by the debris is prone to splashing with glue and getting dirty. For the adsorption module 44 used for adsorbing and fixing the standard wafer, since the standard wafer is relatively large in size and can completely cover the adsorption module 44, the probability of getting dirty is relatively smaller, and it can also be cleaned by the module cleaning mechanism 45 when it gets dirty. Those that do not need to be cleaned are placed in the module groove and waiting to be taken, which will not be elaborated here.

[0184] Furthermore, as Figure 5 shown, for the design of the module cleaning mechanism 45, it includes a mechanism main body 451, a first unwind reel 452, a first wind reel 453, and a pressing belt mechanism.

[0185] The first unwinder 452 is installed on the mechanism main body 451 for unwinding the first cleaning belt 455; the first winder 453 is installed on the mechanism main body 451 and on one side of the first unwinder 452 for winding the first cleaning belt 455.

[0186] The belt pressing mechanism includes a belt pressing member 454 and a belt pressing driver (not shown in the figure); the belt pressing member 454 has a first belt pressing portion 4541 and a second belt pressing portion 4542; the first cleaning belt 455 passes around the first belt pressing portion 4541 and the second belt pressing portion 4542; the belt pressing driver is installed on the mechanism main body 451 and is connected to the belt pressing member 454 for driving the belt pressing member 454 to move closer to or away from the module fixture, so that a part of the first cleaning belt 455 passing around is pressed against the top surface of the adsorption module 44 and / or so that the other part of the first cleaning belt 455 passing around is pressed against the side surface of the adsorption module 44 by the second belt pressing portion 4542.

[0187] Through the design of the belt pressing mechanism, it can be ensured that the first cleaning belt 455 can closely adhere to the top surface and the side surface of the adsorption module 44 during the cleaning process, improving the cleaning effect. The belt pressing driver can be a multi-axis linear module (such as an XYZ three-axis linear module) or a multi-axis robotic arm (such as a six-axis robotic arm) or a rotary motor, as long as it can press the first belt pressing portion 4541 and / or the second belt pressing portion 4542 against the adsorption module 44, without limitation.

[0188] During the cleaning process, the first cleaning belt 455 is pressed against the top surface or the side surface of the adsorption module 44, and then the fixture driver is turned on to drive the adsorption module 44 to rotate. During the rotation, the dirt on the surface of the adsorption module 44 is wiped away by the first cleaning belt 455. In order to improve the wiping effect, the belt can be appropriately run, and the dirty part of the cleaning belt can be continued to be wiped with a clean section of the cleaning belt.

[0189] The design of the first unwinder 452 and the first winder 453 can conveniently realize the unwinding and winding of the first cleaning belt 455, facilitating the replacement and maintenance of the cleaning belt. The entire module cleaning mechanism 45 has a compact structure and a reasonable design, and can effectively complete the cleaning work of the adsorption module 44.

[0190] To further improve the cleaning effect, a spray mechanism for module cleaning (not shown in the figure) can be added, which is arranged between the first unwinder 452 and the belt pressing mechanism, and sprays cleaning liquid on the passing first cleaning belt 455 to improve the cleaning effect.

[0191] Furthermore, as Figure 8 and Figure 9 shown, for the design of the spin coater 601, it includes a device body 51, a device cover 52, and a switch cover driver 53.

[0192] At the top of the device body 51, there is a spin coating chamber; at the center of the spin coating chamber, there is an installation station for the adsorption module 44; the switch cover driver 53 is connected to the device cover 52 and is used to drive the device cover 52 to close or open the spin coating chamber.

[0193] When the device cover 52 is closed, the installation station for the adsorption module 44 can be enclosed in the spin coating chamber, maintaining the cleanliness of the spin coating chamber and avoiding the influence of external impurities on the spin coating process. When the device cover 52 is opened, it is convenient to install the adsorption module 44 onto the installation station for the adsorption module 44 or remove it from the installation station for the adsorption module 44 for replacement or maintenance operations. Such a design enables the operation of the spin coating device 601 to be automated, improving work efficiency. At the same time, corresponding spin coating components, such as a rotating motor, etc., are also configured in the spin coating chamber for uniformly spin coating the sample adsorbed on the adsorption module 44 to ensure that the glue layer on the surface of the sample is uniform and meets the requirements of subsequent processes, which will not be elaborated here.

[0194] The opening and closing of the device cover 52 can be achieved by vertical control. Correspondingly, the switch cover driver 53 can be a lifting mechanism (such as a telescopic rod, a linear module vertically arranged, etc.), without limitation.

[0195] Furthermore, the spin coating device 601 further includes a first spraying mechanism 54 and a second spraying mechanism 55.

[0196] The spraying end of the first spraying mechanism 54 extends into the spin coating chamber and is arranged upward, used to spray cleaning liquid on the back of the second sample to achieve the function of back washing the standard wafer. Of course, when there is no standard wafer placed, cleaning liquid can be sprayed on the inner wall surface of the device cover 52, and then the first wafer transfer device 101 can also grab a cleaning cloth and wipe and clean the inner wall surface of the spin coating chamber and the inner wall surface of the device cover 52. After spraying cleaning liquid on the device cover 52, the cleaning liquid will flow into the spin coating chamber, and then the device cover 52 is opened, and the first wafer transfer device 101 grabs a cleaning cloth to simulate the wiping operation of a human hand to wipe and clean the inner wall surface of the spin coating chamber and the inner wall surface of the device cover 52.

[0197] The device body 51 can also be connected to a drain pipe (not shown in the figure) communicating with the spin coating chamber for discharging the cleaning liquid, without specific limitation.

[0198] The spraying end of the second spraying mechanism 55 extends into the device cover 52 and is arranged downward, used to spray cleaning liquid on the edge of the second sample in the spin coating chamber to achieve the edge removal function.

[0199] Furthermore, as Figure 8 and Figure 9As shown, in order to accommodate the spraying of second samples of various sizes and ensure that the edges of second samples of each size can be sprayed in place, the second spraying mechanism 55 of the present application is designed to include a spray pipe 552 and a spray driver 551.

[0200] The spray pipe 552 is rotatably mounted on the device cover 52, and one end thereof extends into the device cover 52; one end of the spray pipe 552 is connected to a spray head 553; the end of the spray head 553 is located on one side of the central axis of the spray pipe 552, so that the spray head 553 can rotate on a preset circular trajectory, and by adjusting the rotation angle, its projection in the vertical direction can fall on the second sample, thereby accurately providing cleaning liquid to the edge of the second sample.

[0201] The spray driver 551 is installed on the device cover 52 and connected to the spray pipe 552 to drive the spray pipe 552 to rotate. The spray driver 551 can be a servo motor, which is connected to the spray pipe 552 through transmission components such as gears and belts to drive the spray pipe 552 to rotate.

[0202] Furthermore, although the present application adopts the method of backwashing and edge removal cleaning of the second sample directly in the glue-splitting chamber, this cleaning method is relatively more suitable for standard samples of larger size and not for fragment samples of smaller size; in order to meet the requirement that fragment samples of smaller size can also be cleaned, such as Figure 10 as well as Figure 11 As shown, the present application also additionally designs a sample cleaning device 800 .

[0203] The sample cleaning device 800 is used to clean the first sample, and the first sample after cleaning is sent for baking.

[0204] Furthermore, if Figure 10 as well as Figure 11 As shown, the sample cleaning device 800 is designed to include a second unwinder 61 , a first guide frame 62 , a second guide frame 63 and a traction mechanism 64 .

[0205] A second cleaning belt 65 is wound on the second unwinder 61; the traction mechanism 64 is used to pull the second cleaning belt 65 on the second unwinder 61 and release it; the second unwinder 61 is equipped with an unwinding motor, which can control the tension of the released second cleaning belt 65 in cooperation with the traction mechanism 64.

[0206] The first guide frame 62 and the second guide frame 63 are sequentially disposed between the second unwinder 61 and the traction mechanism 64 .

[0207] The second cleaning belt 65 winds around the first guiding frame 62 and the second guiding frame 63; the second guiding frame 63 is set at a height higher than that of the first guiding frame 62, so that a first cleaning section 652 with a certain inclination angle or vertical setting is formed between the first guiding frame 62 and the second guiding frame 63 (a certain inclination angle or vertical setting is convenient for fully fitting the side surface of the first sample).

[0208] A horizontal support surface 631 is provided at the top of the second guiding frame 63, and the width of the horizontal support surface 631 is smaller than the width of the first sample; the setting height of the traction mechanism 64 is lower than that of the second guiding frame 63, so that a second cleaning section 651 that fits the horizontal support surface 631 is formed on the horizontal support surface 631 by the second cleaning belt 65 (the second cleaning section 651 that is horizontally arranged and has a width smaller than the width of the first sample can well fit the back surface of the first sample, so as to fully clean the back surface of the first sample and avoid interference from the clamping finger 121).

[0209] The first sheet transferring device 101 can also grasp the first sample and make the side surface of the first sample contact with the first cleaning section 652; the first sheet transferring device 101 can also grasp the first sample and make the back surface of the first sample contact with the second cleaning section 651.

[0210] Through the above design, when the first sample is cleaned on the back surface, its back surface can be in full contact with the second cleaning section 651, ensuring the uniformity and thoroughness of the back surface cleaning. When the first sample is cleaned on the side surface, its side surface can be in full contact with the first cleaning section 652, making the side surface cleaning effect more ideal.

[0211] Furthermore, in order to improve the cleaning effect, a spraying table 66 is additionally designed; the spraying table 66 is arranged below the first guiding frame 62, and a plurality of spraying holes are provided thereon for spraying cleaning liquid on a partial section of the second cleaning belt 65 passing through the first guiding frame 62 (the spraying table 66 can be specifically designed with reference to a sprayer, without limitation). For the design of the first guiding frame 62, its structure can be a U-shaped guiding plate, and two horizontal passing gaps are formed between the U-shaped guiding plate and the spraying table 66. The partial section of the second cleaning belt 65 located between the passing gaps is a straight section part to be sprayed, improving the efficiency of wetting the cleaning belt with the cleaning liquid.

[0212] The spraying table 66 can be designed with a recovery cavity, and the excess cleaning liquid sprayed upwards can fall back into the recovery cavity for recycling. Those skilled in the art can make appropriate variant designs based on this, without limitation.

[0213] Furthermore, as Figure 11 and Figure 12 shown, this application further includes a shearing mechanism 67 and a recycling box 68.

[0214] The shearing mechanism 67 is arranged on one side of the discharge end of the traction mechanism 64 and is used for shearing the released second cleaning belt 65; the design of the shearing mechanism 67 can cut off and recycle the dirty second cleaning belt 65; or cut out a section of clean cleaning belt for the first sheet transferring device 101 to grab and simulate manual wiping use, and then recycle it after use.

[0215] The recycling bin 68 is used for recycling the used cleaning belt waste. The recycling bin 68 can be designed with an automatic cover opening and closing mechanism 681 to improve the degree of automation.

[0216] Further, as Figure 10 and Figure 11 shown, it further includes a side-changing table 69; the side-changing table 69 is provided with side-changing adsorption holes 691 for adsorbing the first sample. By setting the side-changing table 69, after wiping is completed on the two non-clamped side surfaces of the first sample, it can be placed on the side-changing adsorption holes 691 and temporarily adsorbed and fixed through the side-changing adsorption holes 691. Then, the first sheet transferring actuator 12 switches its orientation to clamp the side surface that has been wiped, exposing the other two side surfaces that could not be wiped due to clamping originally, and then wiping the exposed other two side surfaces, and at the same time, secondary cleaning of the back surface can be carried out, so as to ensure that each surface can be wiped thoroughly, effectively improving the wiping effect.

[0217] Further, as Figure 2 shown, the second sheet transferring device 102 includes a second multi-axis robotic arm 13 and a second sheet transferring actuator 14; the end of the second multi-axis robotic arm 13 is connected to the second sheet transferring actuator 14 and is used to drive the second sheet transferring actuator 14 to move; the second sheet transferring actuator 14 is used to fork the second sample or fork the intermediate carrier 32. The second sheet transferring device 102 designed as above can be designed with reference to the picking and placing structure of existing industrial-grade large-size samples, or directly adopted. The second multi-axis robotic arm can specifically be a four-axis robotic arm for wafer transfer, which will not be elaborated here.

[0218] Further, as Figure 13 shown, it further includes a machine body 900; a working chamber is provided inside the machine body 900; the first wafer loading device 201, the second wafer loading device 202, the liquid loading device 301, the first sheet transferring device 101, the second sheet transferring device 102, the liquid transferring device 302, the baking device 700, the spin coating device 601, the adsorption replacement device 602, the intermediate transfer device 400, and the pretreatment device 500. The design of the working chamber provides a closed and clean environment for the entire processing process, effectively avoiding the influence of external pollution on the sample and ensuring the quality of sample processing.

[0219] The second wafer transfer device 102 is disposed directly below the first wafer transfer device 101; the first wafer carrier device 201, the second wafer carrier device 202, the liquid delivery device 301, the baking device 700, the spin coating device 601, the adsorption replacement device 602, the transfer device 400, and the pretreatment device 500 are distributed around the circumferential circle of the second wafer transfer device 102. Such a layout design enables smoother cooperation between the devices, reduces the time loss during sample transfer, and improves the overall production efficiency. The first wafer transfer device 101 and the second wafer transfer device 102 are located at the central position, facilitating the rapid transfer of samples between various processing devices.

[0220] In addition, at least one side of the machine body 900 is provided with an observation window for observing the working conditions inside the working chamber.

[0221] Furthermore, a fan filter unit 902 is installed on the top of the machine body 900, which is connected to the working chamber. The fan filter unit 902 can supply clean air into the working chamber to maintain the cleanliness of the working chamber and further avoid the influence of external impurities on the sample processing process. At the same time, a corresponding exhaust system can also be provided inside the machine body 900 to discharge the waste gas in the working chamber to ensure a good working environment. The design of the entire machine body 900 fully considers the cleanliness and efficiency requirements of sample processing, providing a stable and reliable platform for the automated processing of samples.

[0222] Furthermore, as Figure 14 shown, it further includes a control device 1000; the control device 1000 is electrically connected to the first wafer carrier device 201, the second wafer carrier device 202, the liquid delivery device 301, the first wafer transfer device 101, the second wafer transfer device 102, the liquid transfer device 302, the baking device 700, the spin coating device 601, the adsorption replacement device 602, the transfer device 400, and the pretreatment device 500.

[0223] The control device 1000, as the "brain" of the entire system, is responsible for coordinating the actions between various devices to ensure the smooth progress of the entire processing flow. Through a preset program, the control device 1000 can accurately control the movement trajectory, movement speed, and action timing of each device, enabling each step of sample loading, spin coating, baking, cleaning, etc. to be automatically completed according to the predetermined sequence and conditions without manual intervention, greatly improving the production efficiency and automation level. At the same time, the control device 1000 also has a fault detection and alarm function. Once it detects a fault or abnormal situation in a certain device, it can immediately send an alarm signal and take corresponding protection measures to ensure the safe and stable operation of the entire system.

[0224] The control device 1000 can be integrated into the machine body 900 or designed independently of the machine body 900 and then communicatively connected through relevant cables, without specific limitation.

[0225] The above has introduced in detail the full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes provided by the present application. For those of ordinary skill in the art, according to the idea of the embodiments of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A full-automatic spin coater for scientific research, which is compatible with multiple lithography technologies and various sample sizes, is characterized in that It includes a first wafer carrier device (201), a second wafer carrier device (202), a liquid carrier device (301), a first wafer transfer device (101), a second wafer transfer device (102), a liquid transfer device (302), a baking device (700), a spin coating device (601), an adsorption replacement device (602), a transfer device (400), and a pretreatment device (500); The first wafer carrier device (201) is used to load a first sample; The second wafer carrier device (202) is used to load a second sample with a size larger than the first sample; The spin coating device (601) is used to perform spin coating on the first sample or the second sample with a photoresist dropped thereon; The baking device (700) is used to bake the first sample and / or the second sample after spin coating; The transfer device (400) is provided with a transfer carrier (32) that is adapted to the shape and size of the second sample and is used to carry the first sample; The pretreatment device (500) is used to perform pretreatment on the first sample or the second sample; The first wafer transfer device (101) can transport the first sample between the first wafer carrier device (201), the transfer carrier (32), the spin coating device (601), and the baking device (700); The second wafer transfer device (102) can transport the second sample between the second wafer carrier device (202), the pretreatment device (500), the spin coating device (601), and the baking device (700); The second wafer transfer device (102) can also transport the transfer carrier (32) between the transfer device (400) and the pretreatment device (500); The liquid transfer device (302) is connected to the first wafer transfer device (101) and can, under the drive of the first wafer transfer device (101), suck the photoresist from the liquid carrier device (301) and drop it onto the first sample or the second sample; The adsorption replacement device (602) is used to replace the adsorption module (44) of the spin coating device (601).

2. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 1, characterized in that, The second wafer transfer device (102) can also transport the transfer carrier (32) between the transfer device (400) and the baking device (700).

3. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 1, characterized in that, The first wafer transfer device (101) is installed above the second wafer transfer device (102) and includes a first multi-axis robotic arm (11), a first vision sensor (17), and a first wafer transfer actuator (12); The first vision sensor (17) is installed on the first multi-axis robotic arm (11); The first wafer transfer actuator (12) is detachably installed at the end of the first multi-axis robotic arm (11) and can grasp the first sample.

4. The full-automatic spin coater for scientific research, which is compatible with multiple lithography technologies and various sample sizes according to claim 3, is characterized in that, The first wafer transfer actuator (12) is a gripper; The clamping surface of the clamping fingers (121) of the first wafer transfer actuator (12) is provided with at least two spaced clamping protrusions (122); The clamping protrusions (122) can contact the side surface of the first sample.

5. The spin coater for scientific research that is fully automatic and compatible with multiple lithography technologies and various sample sizes according to claim 3, characterized in that, The liquid carrier device (301) includes a liquid carrier container (22) and a container fixing mechanism (21); The liquid carrier container (22) is used to hold the photoresist; The container fixing mechanism (21) is used to fix the liquid-carrying container (22).

6. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 5, characterized in that, The liquid-carrying container (22) is equipped with a container lid (221) that can be unscrewed. The first wafer transfer device (101) further includes a container actuator (16). The container actuator (16) is detachably connected to the end of the first multi-axis robotic arm (11) and can grasp the liquid-carrying container (22) or turn the container lid (221).

7. The full-automatic spin coater compatible with multiple lithography technologies and various sample sizes for scientific research according to claim 6, characterized in that, It further includes a low-temperature storage device (23). The low-temperature storage device is provided with a cold storage chamber (231) and a freezer chamber (232). The liquid-carrying container (22) is provided with a label. It further includes an information reader for reading the information on the label. The information reader is installed on the first wafer transfer device (101). The first wafer transfer device (101) is also used to transport the liquid-carrying container (22) in the low-temperature storage device.

8. The spin coater for scientific research that is fully automatic and compatible with multiple lithography technologies and various sample sizes according to claim 1, wherein The transfer device (400) includes a transfer base (31) and the transfer carrier (32). The top of the transfer base (31) is provided with a carrier groove for the transfer carrier (32) to be placed in. The carrier groove is provided with a transfer ejector pin for lifting the transfer carrier (32). The top of the transfer carrier (32) is provided with a sample groove (321) for the first sample to be placed in. The sample groove (321) is provided with an avoidance through-hole (322). The carrier groove is also provided with a sample ejector pin for lifting the first sample through the avoidance through-hole (322).

9. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 8, characterized in that, The transfer device (400) further includes a transfer driver and a second vision sensor. The transfer driver is connected to the transfer base (31) and is used to drive the transfer base (31) to rotate horizontally. The second vision sensor is used to obtain the image information of the carrier groove and the transfer carrier (32).

10. The spin coater for scientific research that is fully automatic and compatible with multiple lithography technologies and various sample sizes according to claim 1, wherein, The adsorption replacement device (602) includes a replacement base (41), a replacement displacement mechanism (42), and a replacement clamping mechanism (43). The replacement base (41) is provided with a number of module grooves for the adsorption modules (44) to be placed in one by one. The clamping mechanism is used to clamp the adsorption module (44). The replacement displacement mechanism (42) is connected to the clamping mechanism and is used to drive the clamping mechanism to move to transport the adsorption module (44) between the module groove and the spin coating device (601).

11. The full-automatic spin coater for scientific research, which is compatible with multiple lithography technologies and various sample sizes according to claim 10, is characterized in that, It further includes a module cleaning mechanism (45). The replacement base (41) is provided with a module fixture and a fixture driver. The module fixture is used to fix the adsorption module (44). The fixture driver is connected to the module fixture and is used to drive the module fixture to rotate horizontally. The replacement displacement mechanism (42) is also used to drive the clamping mechanism to move to transport the adsorption module (44) between the module fixture and the spin coating device (601), or to transport the adsorption module (44) between the module groove and the module fixture. The module cleaning mechanism (45) is arranged on one side of the replacement base (41) and is used to clean the adsorption module (44) located on the module fixture.

12. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 11, wherein The module cleaning mechanism (45) includes a mechanism main body (451), a first unwinder (452), a first winder (453), and a belt pressing mechanism; The first unwinder (452) is installed on the mechanism main body (451) for releasing a first cleaning belt (455); The first winder (453) is installed on the mechanism main body (451) and is located on one side of the first unwinder (452) for winding the first cleaning belt (455); The belt pressing mechanism includes a belt pressing member (454) and a belt pressing driver; The belt pressing member (454) has a first belt pressing portion (4541) and a second belt pressing portion (4542); The first cleaning belt (455) passes around the first belt pressing portion (4541) and the second belt pressing portion (4542); The belt pressing driver is installed on the mechanism main body (451) and is connected to the belt pressing member (454) for driving the belt pressing member (454) to move closer to or away from the module fixture, so that the first belt pressing portion (4541) presses a part of the first cleaning belt (455) passing around it against the top surface of the adsorption module (44) and / or so that the second belt pressing portion (4542) presses another part of the first cleaning belt (455) passing around it against the side surface of the adsorption module (44).

13. The full-automatic spin coater for scientific research, which is compatible with multiple lithography technologies and various sample sizes according to claim 1, is characterized in that, The glue spreading device (601) includes a device main body (51), a device cover (52), and a switch cover driver (53); A glue spreading cavity is provided at the top of the device main body (51); An adsorption module (44) installation station is provided at the center of the glue spreading cavity; The switch cover driver (53) is connected to the device cover (52) for driving the device cover (52) to close or open the glue spreading cavity.

14. The spin coater for scientific research that fully automates and is compatible with multiple lithography technologies and various sample sizes according to claim 13, wherein The glue spreading device (601) further includes a first spraying mechanism (54) and a second spraying mechanism (55); The spraying end of the first spraying mechanism (54) extends into the glue spreading cavity and is arranged upward for spraying a cleaning liquid on the back surface of the second sample; The first wafer transfer device (101) can also grasp a cleaning cloth and wipe and clean the inner wall surface of the glue spreading cavity and the inner wall surface of the device cover (52); The spraying end of the second spraying mechanism (55) extends into the device cover (52) and is arranged downward for spraying a cleaning liquid on the edge of the second sample in the glue spreading cavity.

15. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 14, characterized in that, The second spraying mechanism (55) includes a spray pipe (552) and a spray driver (551); The spray pipe (552) is rotatably installed on the device cover (52) and one end extends into the device cover (52); One end of the spray pipe (552) is connected with a spray head (553); The end of the spray head (553) is located on one side of the central axis of the spray pipe (552); The spray driver (551) is installed on the device cover (52) and is connected to the spray pipe (552) for driving the spray pipe (552) to rotate.

16. The full-automatic spin coater for scientific research, which is compatible with multiple lithography technologies and various sample sizes according to claim 1, is characterized in that, It further includes a sample cleaning device (800); The sample cleaning device (800) is used for cleaning the first sample.

17. The spin coater for scientific research that is fully automatic and compatible with multiple lithography technologies and various sample sizes according to claim 16, wherein The sample cleaning device (800) includes a second unwinder (61), a first guide frame (62), a second guide frame (63), and a traction mechanism (64); A second cleaning belt (65) is wound around the second unwinder (61); The traction mechanism (64) is used to pull and release the second cleaning belt (65) on the second unwinder (61); The first guide frame (62) and the second guide frame (63) are sequentially arranged between the second unwinder (61) and the traction mechanism (64); The second cleaning belt (65) passes around the first guide frame (62) and the second guide frame (63); The second guide frame (63) is set at a height higher than that of the first guide frame (62), so that a first cleaning section (652) with a certain inclination angle or vertical setting is formed between the first guide frame (62) and the second guide frame (63) for the second cleaning belt (65); A horizontal support surface (631) is provided at the top of the second guide frame (63); The width of the horizontal support surface (631) is smaller than the width of the first sample; The traction mechanism (64) is set at a height lower than that of the second guide frame (63), so that a second cleaning section (651) that fits the horizontal support surface (631) is formed on the horizontal support surface (631) for the second cleaning belt (65); The first sheet transferring device (101) can also grab the first sample and make the side of the first sample contact with the first cleaning section (652); The first sheet transferring device (101) can also grab the first sample and make the back of the first sample contact with the second cleaning section (651).

18. The full-automatic spin coater for scientific research, which is compatible with multiple lithography technologies and various sample sizes according to claim 17, is characterized in that It further includes a spraying table (66); The spraying table (66) is arranged below the first guide frame (62) and is used to spray cleaning liquid on a partial section of the second cleaning belt (65) passing through the first guide frame (62).

19. The full-automatic spin coater for scientific research, which is compatible with multiple lithography technologies and various sample sizes according to claim 17, is characterized in that, It further includes a shearing mechanism (67) and a recycling box (68); The shearing mechanism (67) is arranged on one side of the discharging end of the traction mechanism (64) and is used to shear the released second cleaning belt (65); The recycling box (68) is used to recycle the waste cleaning belt used by the shearing mechanism (67).

20. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 17, characterized in that, It further includes a side-changing table (69); The side-changing table (69) is provided with side-changing adsorption holes (691) for adsorbing the first sample.

21. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 1, characterized in that, The second sheet transferring device (102) includes a second multi-axis robotic arm (13) and a second sheet transferring actuator (14); The end of the second multi-axis robotic arm (13) is connected to the second sheet transferring actuator (14) and is used to drive the second sheet transferring actuator (14) to move; The second sheet transferring actuator (14) is used to fork the second sample or fork the intermediate carrier (32).

22. The spin coater for scientific research that is fully automatic and compatible with multiple lithography technologies and various sample sizes according to claim 1, wherein, It further includes a machine table main body (900); A working chamber is arranged inside the machine table main body (900); The first wafer carrier device (201), the second wafer carrier device (202), the liquid carrier device (301), the first wafer transfer device (101), the second wafer transfer device (102), the liquid transfer device (302), the baking device (700), the spin coating device (601), the adsorption replacement device (602), the transfer device (400), and the pretreatment device (500); The second wafer transfer device (102) is disposed directly below the first wafer transfer device (101); The first wafer carrier device (201), the second wafer carrier device (202), the liquid carrier device (301), the baking device (700), the spin coating device (601), the adsorption replacement device (602), the transfer device (400), and the pretreatment device (500) are circumferentially distributed around the second wafer transfer device (102).

23. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 22, characterized in that, A fan filter unit (902) is installed on the top of the machine body (900), and it is communicated with the working chamber.

24. The full-automatic spin coater for scientific research that is compatible with multiple lithography technologies and various sample sizes according to claim 1, characterized in that, It further includes a control device (1000); The control device (1000) is electrically connected to the first wafer carrier device (201), the second wafer carrier device (202), the liquid carrier device (301), the first wafer transfer device (101), the second wafer transfer device (102), the liquid transfer device (302), the baking device (700), the spin coating device (601), the adsorption replacement device (602), the transfer device (400), and the pretreatment device (500).

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