Digital Twin-Based Resonant Gyro Assembly Method, Device, Equipment and Medium
The assembly error between the oscillator and the detection electrode in the resonant gyroscope is identified through digital twin technology, which solves the problem of insufficient assembly accuracy in the prior art, and realizes high-precision resonant gyroscope assembly.
Patent Information
- Application Number
- CN202510709052.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-29
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2045-05-29
AI Technical Summary
The prior art is difficult to accurately identify the assembly error between the oscillator and the detection electrode in the resonant gyroscope, which affects the assembly accuracy, especially in the high-precision assembly process, which is difficult to ensure the overall performance of the resonant gyroscope.
Using digital twin technology, by measuring the capacitance value between the oscillator and the detection electrode, the pre-created digital twin model is used to identify assembly errors, and error recognition and adjustment are performed through mapping relationships until the preset error range is reached.
The assembly error recognition accuracy and efficiency during the resonant gyro assembly process is improved, the assembly accuracy of the resonant gyro is improved, and the high-precision assembly requirements are met.
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Figure CN120235013B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of intelligent manufacturing technology, and in particular to a resonant gyroscope assembly method, device, equipment and medium based on digital twins. Background Art
[0002] A resonant gyroscope (solid-state wave gyroscope) is a high-precision inertial attitude sensor widely used in a variety of military and civilian fields, including aviation, aerospace, navigation, precision guidance, and consumer electronics. Its operating principle relies on the precession effect of the standing wave of the resonator's vibration. The assembly accuracy of the resonator has a significant impact on the gyroscope's performance. Furthermore, due to the unique structure and extremely high precision requirements, ensuring the assembly accuracy of resonant gyroscopes has always been a significant challenge for the industry.
[0003] Currently, in the manufacturing process of resonant gyroscopes, the assembly process between the resonator and the detection electrode is a key step that affects the gyroscope's final performance. The detection electrode is located on the upper surface of the base, and measuring the assembly error between the resonator and the detection electrode during the assembly process has always been a major problem plaguing the industry. In particular, in the development of high-precision, high-performance resonant gyroscopes, measuring the assembly error between the resonator and the detection electrode is crucial to ensuring the gyroscope's overall performance.
[0004] However, the current mainstream assembly error measurement methods, such as microscope-based image measurement methods, confocal sensor-based measurement methods, and capacitance detection-based evaluation methods, all have some defects. For example, microscope-based image measurement methods typically use a microscope to measure the size of an object. This method can be used to measure parameters such as the length, area, and angle of tiny objects. However, traditional microscopes perform measurements manually using the graticule in the eyepiece, while modern microscopes use cameras, displays, and software to measure by pixel counting. Although this method can quickly measure multiple parameters of an object at a microscopic scale after proper calibration, its measurement reliability still depends on the equipment performance, operator experience, and measurement plan. At the same time, the measurement results are easily affected by image distortion caused by errors in the optical instrument itself. For another example, measurement methods based on confocal sensors typically use confocal technology for high-precision gap or distance measurement. This method emits light through a wide-spectrum light source. After passing through a dispersive objective lens, light of different wavelengths is focused at different positions. Only the wavelength focused on the surface of the object to be measured can pass through the detection aperture and be detected by the spectrometer. By extracting the peak wavelength, accurate measurement of the surface position of the object can be achieved. However, this method is costly, technically complex, and has high requirements for the light source.
[0005] In summary, how to identify the assembly error between the resonator and the detection electrode during the assembly process of the resonant gyroscope to improve its assembly accuracy is an issue that still needs to be further solved in this field. Summary of the Invention
[0006] In view of this, the purpose of this application is to provide a digital-twin-based resonant gyroscope assembly method, device, equipment and medium, which can improve the recognition accuracy and efficiency of assembly errors during the assembly process of the resonant gyroscope, and thus improve the assembly accuracy of the resonant gyroscope. The specific solutions are as follows:
[0007] In the first aspect, this application discloses a digital-twin-based resonant gyroscope assembly method, including:
[0008] Measure the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values;
[0009] Input the plurality of target capacitance values into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the plurality of target capacitance values and the pre-created mapping relationship, and obtain the current assembly error; the digital twin model includes 3D models and finite element models of the actual assembly resonator and the installation base established based on the characteristic parameters of the resonator and the installation base in the actual assembly, and the mapping relationship is the mapping relationship between the assembly error obtained through the digital twin model and the measured capacitance; the measured capacitance is the capacitance value of the capacitor formed by the capacitive effect between the coated end face of the resonator and different detection electrodes measured in advance;
[0010] Judge whether the current assembly error is within the preset error range;
[0011] If the current assembly error is not within the preset error range, adjust the assembly process of the target resonant gyroscope, and jump to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyroscope.
[0012] Optionally, the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values includes:
[0013] Measure the capacitance values of each detection electrode located on the upper surface of the base during the assembly process of the target resonant gyroscope multiple times to obtain a plurality of initial capacitance values corresponding to each detection electrode;
[0014] Calculate the average value of the multiple initial capacitance values corresponding to each of the detection electrodes respectively to obtain the target capacitance value corresponding to each of the detection electrodes.
[0015] Optionally, before measuring the capacitance values of the detection electrodes located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values, it further includes:
[0016] Collect the characteristic parameters of the resonator and the base of the target resonant gyroscope to obtain the resonator characteristic parameters and the base characteristic parameters; the resonator characteristic parameters include the inner and outer radii of the resonator spherical shell, the length of the support column, and the radius of the resonator; the base characteristic parameters include the dimensions of the base and the support holes, the relevant parameters of the flat electrode detection electrodes, and the specific details in actual manufacturing.
[0017] Input the resonator characteristic parameters and the base characteristic parameters into 3D modeling software to respectively establish 3D models of the resonator and the base of the target resonant gyroscope based on the resonator characteristic parameters and the base characteristic parameters, obtaining a 3D resonator model and a 3D base model.
[0018] Fit the 3D resonator model and the 3D base model to form an assembly, and import the assembly into a finite element simulation model to obtain the digital twin model.
[0019] Input multiple sets of preset assembly error value combinations into the finite element simulation model to calculate the measured capacitance corresponding to different assembly error value combinations.
[0020] Establish a mapping relationship between each assembly error value combination and the corresponding measured capacitance, and save the mapping relationship to a preset database.
[0021] Optionally, the current assembly error includes the average gap error between the lip of the resonator and the upper surface of the base, the tilt angle error of the axis of rotation between the resonator and the base, and the azimuth angle error of the axis of rotation between the resonator and the base.
[0022] Correspondingly, the identifying the assembly error between the resonator and the detection electrode based on the multiple target capacitance values and the pre-created mapping relationship to obtain the current assembly error includes:
[0023] Based on the multiple target capacitance values, calculate the gaps between each detection electrode and the lip of the resonator respectively to obtain a plurality of gap values, and calculate the average gap error between the lip of the resonator and the upper surface of the base based on the plurality of gap values and the preset gap design value.
[0024] Obtain the mapping relationship between different combinations of assembly error values and the corresponding measured capacitances from a preset database, and use an intelligent optimization algorithm to fit the tilt angle of the axis of rotation and the azimuth angle of the axis of rotation between the resonator and the base during the assembly process of the target resonant gyro based on the measured capacitances in the mapping relationship, so as to obtain the tilt angle error of the axis of rotation and the azimuth angle error of the axis of rotation.
[0025] Optionally, calculating the gaps between each of the detection electrodes and the lip of the resonator respectively based on the multiple target capacitance values to obtain multiple gap values, includes:
[0026] Sort the detection electrodes based on the magnitudes of the target capacitance values to obtain the sorted electrodes, and determine the maximum capacitance value among the multiple target capacitance values;
[0027] Mark each of the detection electrodes in the sorted electrodes starting from the maximum capacitance value to obtain the marked electrodes;
[0028] Calculate the gaps between the corresponding marked electrodes and the lip of the resonator based on the target capacitance values corresponding to each of the marked electrodes to obtain multiple gap values.
[0029] Optionally, calculating the average gap error between the lip of the resonator and the upper surface of the base based on the multiple gap values and a preset gap design value, includes:
[0030] Count the number of the multiple gap values to obtain the total number, and calculate the sum of the multiple gap values to obtain the sum value;
[0031] Calculate the ratio of the sum value to the total number, and calculate the difference between the ratio and the preset gap design value to obtain the average gap error between the lip of the resonator and the upper surface of the base.
[0032] Optionally, the step of jumping to measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain multiple target capacitance values until the new assembly error is within the preset error range, includes:
[0033] Jump to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain multiple target capacitance values, obtain a new assembly error, and determine whether the new assembly error is less than the current assembly error;
[0034] If the new assembly error is less than the current assembly error, then determine whether the new assembly error is within the preset error range;
[0035] If the new assembly error is within the preset error range, then terminate the measurement of the assembly error.
[0036] Second aspect, the present application discloses a resonant gyroscope assembly device based on digital twin, including:
[0037] A measurement module, configured to measure the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope, so as to obtain a plurality of target capacitance values;
[0038] An error calculation module, configured to input the plurality of target capacitance values into a pre-created digital twin model, so as to identify the assembly error between the resonator and the detection electrode based on the plurality of target capacitance values and the pre-created mapping relationship, and obtain the current assembly error; the digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the mounting base established based on the characteristic parameters of the resonator and the mounting base in actual assembly, and the mapping relationship is the mapping relationship between the assembly error obtained through the digital twin model and the measured capacitance; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance;
[0039] A judgment module, configured to judge whether the current assembly error is within a preset error range;
[0040] An adjustment module, configured to, if the current assembly error is not within the preset error range, adjust the assembly process of the target resonant gyroscope, and jump to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyroscope.
[0041] Third aspect, the present application discloses an electronic device, including a processor and a memory; wherein, when the processor executes the computer program stored in the memory, the above-mentioned resonant gyroscope assembly method based on digital twin is implemented.
[0042] Fourth aspect, the present application discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, the above-mentioned resonant gyroscope assembly method based on digital twin is implemented.
[0043] It can be seen that in this application, the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro are first measured to obtain a plurality of target capacitance values, and then the plurality of target capacitance values are input into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the plurality of target capacitance values and the pre-created mapping relationship, so as to obtain the current assembly error; wherein the digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the mounting base established based on the characteristic parameters of the resonator and the mounting base in actual assembly, and the mapping relationship is the mapping relationship between the assembly error and the measured capacitance obtained through the digital twin model; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance; then, it is judged whether the current assembly error is within a preset error range; if the current assembly error is not within the preset error range, the assembly process of the target resonant gyro is adjusted, and it jumps to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyro. This application is based on the capacitance values of each detection electrode located on the base, and uses the mapping relationship between the assembly error and the measured capacitance generated in advance based on the digital twin model to identify the assembly error between the base and the resonator during the current assembly process of the resonant gyro, and judges whether the error is within the preset error range. If so, it indicates that the assembly error between the resonator and the base in the resonant gyro meets the assembly conditions. By using the mapping relationship between the assembly error and the measured capacitance generated based on the digital twin model to identify the assembly error of the resonant gyro, the differences between different assembly components are considered, which can improve the identification accuracy and efficiency of the assembly error during the assembly process of the resonant gyro, and thus improve the assembly accuracy of the resonant gyro. Description of the Drawings
[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.
[0045] Figure 1 Flowchart of a method for assembling a resonant gyro based on digital twin disclosed in the present application;
[0046] Figure 2 Schematic diagram of a specific assembly of a resonant gyro disclosed in the present application;
[0047] Figure 3Schematic diagram of assembly error between a resonator and a base disclosed in this application;
[0048] Figure 4 Schematic diagram of assembly error between a resonator and a base disclosed in this application;
[0049] Figure 5 Flowchart of a specific digital - twin - based resonant gyro assembly method disclosed in this application;
[0050] Figure 6 Schematic diagram of the structure of a digital - twin - based resonant gyro assembly device disclosed in this application;
[0051] Figure 7 Structure diagram of an electronic device disclosed in this application. Detailed implementation manners
[0052] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.
[0053] The embodiments of this application disclose a digital - twin - based resonant gyro assembly method. Refer to Figure 1 As shown, this method includes:
[0054] Step S11: Measure the capacitance values of each detection electrode on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values.
[0055] In this embodiment, first, measure the capacitance values of each detection electrode on the base during the assembly process of the target resonant gyro to be assembled, such as a hemispherical resonator gyro (HRG), to obtain a plurality of target capacitance values. Among them, the capacitance value specifically refers to the capacitance value between the lip edge of the resonator and each detection electrode on the base during the assembly process of the resonant gyro. The base specifically refers to a cylinder with a radius greater than its height, and there is a support hole in the center for the support column of the resonator to fit in, and there is a small gap between its radius and the support column of the resonator. For example, refer to Figure 2 As shown, measure the capacitance values between the lip edge of the resonator and 8 evenly - distributed detection electrodes on the base respectively to obtain 8 corresponding capacitance measurement results.
[0056] Step S12: Input multiple said target capacitance values into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the multiple said target capacitance values and the pre-created mapping relationship, and obtain the current assembly error; the digital twin model includes 3D models and finite element models of the actually assembled resonator and the mounting base established based on the characteristic parameters of the resonator and the mounting base in actual assembly, and the mapping relationship is the mapping relationship between the assembly error obtained through the digital twin model and the measured capacitance; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance.
[0057] In this embodiment, after measuring the capacitance values of the respective detection electrodes located on the base during the assembly process of the target resonant gyroscope, further, multiple target capacitance values can be input into a pre-created digital twin model. It should be noted that this digital twin model includes 3D models and finite element models of the actually assembled resonator and the mounting base established based on the characteristic parameters of the resonator and the mounting base in actual assembly, and a mapping relationship between different assembly errors and the measured capacitance has also been pre-generated through this digital twin model; wherein the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes after being energized (i.e., the measured capacitance value of the detection electrode). When the digital twin model receives the above multiple target capacitance values, it will identify the assembly error between the resonator and the detection electrode based on the multiple target capacitance values and the pre-created mapping relationship, thereby obtaining the current assembly error.
[0058] It should be noted that, before measuring the capacitance values of the respective detection electrodes located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values, the following steps are specifically included: collecting the characteristic parameters of the resonator and the base of the target resonant gyroscope to obtain the resonator characteristic parameters and the base characteristic parameters; inputting the resonator characteristic parameters and the base characteristic parameters into 3D modeling software to respectively establish 3D models of the resonator and the base of the target resonant gyroscope based on the resonator characteristic parameters and the base characteristic parameters, obtaining a 3D resonator model and a 3D base model; fitting the 3D resonator model and the 3D base model to form an assembly, and importing the assembly into a finite element simulation model to obtain the digital twin model; inputting multiple sets of preset assembly error value combinations into the finite element simulation model to calculate the measured capacitances corresponding to different assembly error value combinations; establishing a mapping relationship between each assembly error value combination and the corresponding measured capacitance, and saving the mapping relationship to a preset database. In this embodiment, before the resonator installation work is carried out, a digital twin model corresponding to the actual assembly process of the resonant gyroscope can be established according to the relevant characteristics of the resonator and the base, so as to provide assembly guidance for the assembly of the resonator. Considering the influence of factors such as machining errors, material errors, assembly errors, and coating film layer parameters, there are differences in dimensions, surface shapes, geometric positions, and film layer quality between the actual assembly object and the ideal model. Therefore, it is difficult for the ideal digital twin model to accurately reflect the performance indicators of the actual physical object. Therefore, during the establishment of the digital twin model, these actual error factors need to be considered to establish a digital twin model that is nearly consistent with the actual assembly components, so as to simulate the performance of the actual assembly components in the real world in the digital world.
[0059] Among them, the resonator characteristic parameters specifically include the inner and outer radii of the resonator spherical shell, the length of the support column, and the radius of the resonator; the base characteristic parameters specifically include the dimensions of the base and the support holes and the relevant parameters of the flat electrode detection electrodes, as well as the specific detail information in actual manufacturing.
[0060] Specifically, the characteristic parameters of the resonator and the base in the resonator gyroscope to be assembled can be collected first to obtain the corresponding resonator characteristic parameters and base characteristic parameters. Then, the above resonator characteristic parameters are input into 3D modeling software to establish a 3D model of the resonator through the 3D modeling software. The 3D model of the resonator can be composed of a hemispherical shell and its central cylindrical support column. Its characteristic parameters can include parameters such as the inner and outer radii of the resonator shell and the length and radius of the support column. Specifically, a simple model can be established first, and then the details of the resonator can be added according to the actual situation, and then the error parameters introduced in the manufacturing process of the resonator are added, such as the actual inner and outer radii of the hemispherical resonator, the roundness of the hemispherical resonator, and the surface roughness parameters of the resonator after coating. Further, the above base characteristic parameters are input into 3D modeling software to establish a 3D model of the base based on the base characteristic parameters. The characteristic parameters of the base include, but are not limited to, the dimensions of the base and the support holes and the relevant parameters of the detection electrodes, as well as the specific detail information in actual manufacturing.
[0061] After obtaining the 3D resonator model and the 3D base model, the two 3D models can be fitted together to form an assembly. This step simulates the assembly process of the resonator. A fitted body without assembly errors can be established first, that is, the average gap between the lip edge of the resonator shell (the lip edge surface may be uneven) and the base is the pre-designed gap, and the center of the resonator support shaft coincides with the center of the base, and the support shaft is perpendicular to the upper surface of the base. Then, the corresponding assembly errors are introduced to obtain a digital twin model of the three-dimensional relationship of the resonator gyroscope in the current assembly state.
[0062] Further, the above assembly (including the 3D resonator model and the 3D base model) can be imported into a finite element simulation model to obtain a digital twin model. Then, multiple groups of preset assembly error value combinations are input into the finite element simulation model to calculate the measured capacitance corresponding to different assembly error value combinations by using the finite element model in the finite element simulation model. Finally, a mapping relationship between each assembly error value combination and the corresponding measured capacitance is established, and the mapping relationship between the error and the capacitance value is saved in a preset database. Among them, the finite element simulation model can be located in software such as COMSOL and ANSYS.
[0063] Specifically, the finite element model can be opened first, and then the three-dimensional model dimension can be selected. Since the static capacitance value of the lip-edge electrode is studied in this solution, the electromagnetic-related modules can be selected, and the steady-state electromagnetic field can be selected. Then, enter the finite element simulation page, and then import the assembly (including the 3D resonator model and the 3D base model) in the geometric modeling for the components, set the boundary relationship between the resonator spherical shell and the upper surface of the base, and then set the relevant parameters such as the materials of the resonator spherical shell, its inner surface, the lip-edge coating, the base, and the electrode on the upper surface of the base. Next, according to the actual measurement circuit, the corresponding electric potential is added to the resonator support column and the base electrode, and then the mesh is established according to the shapes of the inner surface of the resonator, the lip-edge, and the base, and the mesh of the lip-edge of the resonator is refined to improve the calculation accuracy of the subsequent error. Finally, the physical field is imported for calculation, and the parametric scanning function is used to set the preset assembly error as the scanned parameter, and then the electromagnetic field relationship between the detection electrode on the base and the resonator is calculated within the preset range to obtain the measurement capacitance formed by the detection electrode and the resonator, and the measurement capacitance and the corresponding assembly error are saved to the preset database. It should be noted that all 3D modeling parameters related to the resonator and the base can be designed as variable variables (including the assembly error) when establishing the 3D model, so as to facilitate the rapid establishment of the model during the assembly of different types of resonators.
[0064] Among them, the current assembly error specifically may include the average gap error between the lip-edge of the resonator and the upper surface of the base, the tilt angle error of the rotation axis between the resonator and the base, and the azimuth angle error of the rotation axis between the resonator and the base.
[0065] Correspondingly, the recognition of the assembly error between the resonator and the detection electrode based on the multiple target capacitance values and the pre-created mapping relationship to obtain the current assembly error specifically may include: calculating the gaps between each detection electrode and the lip-edge of the resonator based on the multiple target capacitance values respectively to obtain multiple gap values, and calculating the average gap error between the lip-edge of the resonator and the upper surface of the base based on the multiple gap values and the preset gap design value; obtaining the mapping relationship between different combinations of assembly error values and the corresponding measurement capacitance from the preset database, and using the intelligent optimization algorithm to fit the tilt angle of the rotation axis and the azimuth angle of the rotation axis between the resonator and the base during the assembly of the target resonant gyro based on the measurement capacitance in the mapping relationship to obtain the tilt angle error of the rotation axis and the azimuth angle error of the rotation axis. In this embodiment, the average gap error, the tilt angle error of the rotation axis, and the azimuth angle error of the rotation axis between the base and the resonator can be calculated respectively through the digital twin model. Specifically, the gaps between each detection electrode and the lip-edge of the resonator can be calculated based on the multiple target capacitance values respectively to obtain multiple gap values, and then based on the multiple gap values and the preset gap design value , calculate the average gap error between the lip edge of the resonator and the upper surface of the base. Then, obtain the mapping relationship between different combinations of assembly error values and the corresponding measured capacitance from the preset database. Next, use the intelligent optimization algorithm and based on the measured capacitance in the above mapping relationship, fit the tilt angle of the axis of rotation and the azimuth angle of the axis of rotation between the resonator and the base during the assembly process to obtain the tilt angle error of the axis of rotation and the azimuth angle error of the axis of rotation. Among them, the intelligent optimization algorithm includes but is not limited to algorithms such as the particle swarm algorithm, genetic algorithm, and stochastic parallel gradient descent method, and the preset gap design value represents the circumferential average gap between the end face of the lip edge of the resonator and the detection electrode, which is the design value of the lip edge gap of the vibratory gyro. It should be noted that this solution calculates the assembly error in two steps, that is, first calculates the average gap error, and then calculates the tilt angle error of the axis of rotation and the azimuth angle error of the axis of rotation. This calculation method has advantages compared with the method of directly calculating the assembly error: it can effectively reduce the calculation amount without losing accuracy, thereby improving the speed of single calculation.
[0066] See Figure 3 and Figure 4 As shown, the assembly error includes but is not limited to the tilt angle error of the resonator , the azimuth angle error of the tilt angle projection , the difference between the circumferential average gap of the lip edge and the gap design value , etc. Among them, the tilt angle error (i.e., the tilt angle error of the axis of rotation) represents the angle between the axis of rotation of the resonator and the axis of rotation of the detection electrode, that is, the tilt angle error during the assembly of the resonator; the azimuth angle error (i.e., the azimuth angle error of the axis of rotation) represents the angle between the projection of the axis of rotation of the resonator on the end face of the detection electrode and the axis , that is, the azimuth angle error of the tilt angle projection during the assembly of the resonator; the difference (i.e., the average gap error) represents the error between the circumferential average gap between the end face of the lip edge of the resonator and the detection electrode and the gap design value.
[0067] In a specific embodiment, calculating the gaps between each of the detection electrodes and the lip of the resonator based on the respective multiple target capacitance values to obtain multiple gap values may specifically include: sorting each of the detection electrodes based on the magnitude of the target capacitance value to obtain sorted electrodes, and determining the maximum capacitance value among the multiple target capacitance values; marking each of the detection electrodes in the sorted electrodes starting from the maximum capacitance value to obtain marked electrodes; calculating the gaps between the respective marked electrodes and the lip of the resonator based on the target capacitance values corresponding to the respective marked electrodes to obtain multiple gap values. In this embodiment, each of the detection electrodes may be sorted in descending order according to the target capacitance values corresponding to all the currently measured detection electrodes to obtain sorted electrodes; then, the maximum value among all the target capacitance values is determined to obtain the maximum capacitance value, and then the detection electrode corresponding to the maximum capacitance value is used as the first detection electrode (denoted as the No. 1 detection electrode), and each of the detection electrodes in the sorted electrodes is marked starting from this detection electrode (i.e., the No. 1 detection electrode) to obtain marked electrodes. Specifically, taking an eight-electrode hemispherical resonator gyroscope as an example, as shown in Figure 3 As shown, all the detection electrodes are sorted according to the magnitude of the capacitance value, and the sorted detection electrodes are numbered in the counterclockwise direction to obtain 8 marked detection electrodes, namely capacitor1, capacitor2, capacitor3, capacitor4, capacitor5, capacitor,6, capacitor7, capacitor8, where capacitor1 has the largest capacitance value; further, the target capacitance values corresponding to the respective marked electrodes are sequentially input into a pre-created digital twin model to calculate the gaps between the respective marked electrodes and the lip of the resonator based on the respective target capacitance values.
[0068] Specifically, calculating the average gap error between the lip edge of the resonator and the upper surface of the base based on the multiple gap values and the preset gap design value may specifically include: counting the number of the multiple gap values to obtain the total number, and calculating the sum of the multiple gap values to obtain the sum value; calculating the ratio of the sum value to the total number, and calculating the difference between the ratio and the preset gap design value to obtain the average gap error between the lip edge of the resonator and the upper surface of the base. In this embodiment, in order to reduce the calculation amount and speed up the single calculation speed, the average gap between the lip edge of the resonator and the base electrode plate can be calculated separately. For example, when it is an eight-electrode hemispherical resonator gyroscope, the capacitance value of any one of the multiple detection electrodes is replaced by a parallel capacitance, then the gap between the capacitor plates can be equivalent to the average gap of the detection electrode. Then, using the measured capacitance data stored in the digital twin model, the least squares method is used to fit the average gap di of each detection electrode, which are d1, d2, d3, d4, d5, d6, d7, and d8 respectively; then, using the formula =(d1 + d2 + d3 + d4 + d5 + d6 + d7 + d8) / 8 to calculate the difference between the circumferential average gap of the lip edge and the gap design value (i.e., the first assembly error). Further, the particle swarm algorithm can be used to fit and obtain the inclination error of the rotation axis of the resonator and the azimuth error of the inclination projection , so as to obtain a set of assembly errors .
[0069] Step S13: Determine whether the current assembly error is within the preset error range.
[0070] In this embodiment, after using the digital twin model to identify the assembly error between the resonator and the detection electrode and obtaining the current assembly error, it is determined whether the error value of the current assembly error is within the preset error range.
[0071] Step S14: If the current assembly error is not within the preset error range, adjust the assembly process of the target resonator gyroscope, and jump to the step of measuring the capacitance values of the respective detection electrodes located on the base during the assembly process of the target resonator gyroscope to obtain a plurality of target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonator gyroscope.
[0072] In this embodiment, if the current assembly error is not within the preset error range, the assembly process of the target resonator gyroscope is further adjusted, and it jumps to step S11 until the newly generated assembly error is within the preset error range, thereby completing the entire assembly process of the target resonator gyroscope.
[0073] For example, after obtaining the current assembly error and finding that it is not within the preset error range, the assembly process is adjusted, and steps S11 to S14 are repeated. After multiple adjustments, a new assembly error is obtained. If the new assembly error is less than the assembly error obtained before this adjustment and is within the preset error range, it is considered that the adjustment of the assembly error is completed.
[0074] Specifically, the step of jumping to measure the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values until the new assembly error is within the preset error range may include: jumping to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values, obtaining a new assembly error, and determining whether the new assembly error is less than the current assembly error; if the new assembly error is less than the current assembly error, determining whether the new assembly error is within the preset error range; if the new assembly error is within the preset error range, terminating the measurement of the assembly error. That is, measure the capacitance values again to obtain new capacitance values and input them into the digital twin model to calculate a new assembly error. If the new assembly error is less than the assembly error calculated last time, it indicates an effective adjustment. At this time, it can be determined whether the new assembly error is within the preset error range. If so, it indicates that the current assembly meets the assembly requirements, and the calculation of the current assembly error can be stopped. This solution reduces the amount of data required for error identification by performing optimization and adjustment in real time, thereby improving the speed of error identification. In addition, by calculating the assembly error during the assembly process of the resonator and the detection electrode and performing compensation adjustment based on this error in real time, the assembly accuracy of the resonant gyro can be improved. Moreover, compared with the traditional method of directly calculating the optimization parameters based on a mathematical model, the accuracy and reliability of this solution are higher. The parameters can be adjusted directly according to the resonator being assembled currently, making the digital twin model more suitable for the resonant gyro in the actual working environment than the mathematical model, thus improving the error identification accuracy.
[0075] It can be seen that in the embodiment of the present application, first, the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro are measured to obtain a plurality of target capacitance values. Then, the plurality of target capacitance values are input into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the plurality of target capacitance values and the pre-created mapping relationship, so as to obtain the current assembly error. The digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the installation base established based on the characteristic parameters of the resonator and the installation base in the actual assembly. The mapping relationship is the mapping relationship between the assembly error and the measured capacitance obtained through the digital twin model. The measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance. Then, it is judged whether the current assembly error is within the preset error range. If the current assembly error is not within the preset error range, the assembly process of the target resonant gyro is adjusted, and it jumps to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyro. The embodiment of the present application is based on the capacitance values of each detection electrode located on the base, and uses the mapping relationship between the assembly error and the measured capacitance generated in advance based on the digital twin model to identify the assembly error between the base and the resonator during the current assembly process of the resonant gyro, and judges whether the error is within the preset error range. If so, it indicates that the assembly error between the resonator and the base in the resonant gyro meets the assembly conditions. By using the mapping relationship between the assembly error and the measured capacitance generated based on the digital twin model to identify the assembly error of the resonant gyro, the differences between different assembly components are considered, which can improve the identification accuracy and efficiency of the assembly error during the assembly process of the resonant gyro, and thus improve the assembly accuracy of the resonant gyro.
[0076] The embodiment of the present application discloses a specific method for assembling a resonant gyro based on digital twin. Refer to Figure 5 as shown, this method includes:
[0077] Step S21: Measure the capacitance values of each detection electrode located on the upper surface of the base during the assembly process of the target resonant gyro multiple times to obtain a plurality of initial capacitance values corresponding to each detection electrode.
[0078] In this embodiment, in order to further improve the assembly accuracy of the resonant gyro, the capacitance values of each detection electrode located on the upper surface of the base during the assembly process of the target resonant gyro can be measured multiple times to obtain a plurality of initial capacitance values corresponding to each detection electrode.
[0079] Step S22: Calculate the average value of the multiple initial capacitance values corresponding to each of the detection electrodes respectively, to obtain the target capacitance value corresponding to each of the detection electrodes.
[0080] In this embodiment, calculate the average value of the multiple initial capacitance values corresponding to each detection electrode respectively, so as to obtain the target capacitance value corresponding to each detection electrode, that is, conduct multiple capacitance value tests and take the average value.
[0081] Step S23: Input the multiple target capacitance values into a pre-created digital twin model, to identify the assembly error between the resonator and the detection electrode based on the multiple target capacitance values and the pre-created mapping relationship, and obtain the current assembly error; the digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the mounting base established based on the characteristic parameters of the resonator and the mounting base in actual assembly, and the mapping relationship is the mapping relationship between the assembly error obtained through the digital twin model and the measured capacitance; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance.
[0082] Step S24: Determine whether the current assembly error is within a preset error range.
[0083] Step S25: If the current assembly error is not within the preset error range, adjust the assembly process of the target resonant gyroscope, and jump to the step of measuring the capacitance values of the detection electrodes on the base during the assembly process of the target resonant gyroscope to obtain multiple target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyroscope.
[0084] Among them, for the more specific processing procedures of the above steps S23 to S25, reference can be made to the corresponding content disclosed in the foregoing embodiments, and details will not be elaborated here.
[0085] It can be seen that in the embodiment of the present application, the capacitance values of each detection electrode located on the upper surface of the base during the assembly process of the target resonant gyro are measured multiple times to obtain multiple initial capacitance values corresponding to each detection electrode. Then, the average value of the multiple initial capacitance values corresponding to each detection electrode is calculated respectively to obtain the target capacitance value corresponding to each detection electrode. Next, the multiple target capacitance values are input into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the multiple target capacitance values and the pre-created mapping relationship, so as to obtain the current assembly error, and stop the assembly when the current assembly error is within the preset error range. By measuring the capacitance value multiple times and taking the average value, the embodiment of the present application can further improve the recognition accuracy and efficiency of the assembly error during the assembly process of the resonant gyro, and thus improve the assembly accuracy of the resonant gyro.
[0086] In addition, based on the traditional capacitance detection-based evaluation method, this solution combines the finite element simulation technology to establish a digital twin model that is almost consistent with the physical objects (such as assembly parts) in the actual assembly process to calculate the assembly error. It takes into account the differences between different assembly parts, has higher accuracy, and can be measured synchronously during the assembly process of the resonator, which is of great significance for improving the assembly accuracy of the resonator and the accuracy of the resonant gyro.
[0087] Correspondingly, the embodiment of the present application also discloses a resonant gyro assembly device based on digital twin, see Figure 6 As shown, the device includes:
[0088] A measurement module 11, configured to measure the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain multiple target capacitance values;
[0089] An error calculation module 12, configured to input the multiple target capacitance values into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the multiple target capacitance values and the pre-created mapping relationship, so as to obtain the current assembly error; the digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the installation base established based on the characteristic parameters of the resonator and the installation base in the actual assembly, and the mapping relationship is the mapping relationship between the assembly error obtained through the digital twin model and the measured capacitance; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance.
[0090] A judgment module 13, configured to judge whether the current assembly error is within the preset error range;
[0091] An adjustment module 14, configured to adjust the assembly process of the target resonant gyro if the current assembly error is not within the preset error range, and jump to the step of measuring the capacitance values of the detection electrodes located on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyro.
[0092] Among them, for the specific working processes of the above various modules, reference can be made to the corresponding content disclosed in the foregoing embodiments, and details will not be elaborated herein.
[0093] It can be seen that in the embodiment of the present application, first, the capacitance values of the detection electrodes located on the base during the assembly process of the target resonant gyro are measured to obtain a plurality of target capacitance values, and then the plurality of target capacitance values are input into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the plurality of target capacitance values and the pre-created mapping relationship, so as to obtain the current assembly error; wherein the digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the installation base established based on the characteristic parameters of the resonator and the installation base in actual assembly, and the mapping relationship is the mapping relationship between the assembly error obtained through the digital twin model and the measured capacitance; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance; then, it is determined whether the current assembly error is within the preset error range; if the current assembly error is not within the preset error range, the assembly process of the target resonant gyro is adjusted, and the step of measuring the capacitance values of the detection electrodes located on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values is jumped to, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyro. The embodiment of the present application is based on the capacitance values of the detection electrodes located on the base, and uses the mapping relationship between the assembly error and the measured capacitance generated in advance based on the digital twin model to identify the assembly error between the base and the resonator during the current assembly process of the resonant gyro, and determines whether the error is within the preset error range. If so, it indicates that the assembly error between the resonator and the base in the resonant gyro meets the assembly conditions. By using the mapping relationship between the assembly error and the measured capacitance generated based on the digital twin model to identify the assembly error of the resonant gyro, the differences between different assembly components are considered, which can improve the recognition accuracy and efficiency of the assembly error during the assembly process of the resonant gyro, and further improve the assembly accuracy of the resonant gyro.
[0094] In some specific embodiments, the measurement module 11 may specifically include:
[0095] A measurement unit for measuring the capacitance values of each detection electrode on the upper surface of the base during the assembly process of the target resonant gyro multiple times to obtain multiple initial capacitance values corresponding to each detection electrode;
[0096] A first calculation unit for calculating the average value of the multiple initial capacitance values corresponding to each detection electrode respectively to obtain the target capacitance value corresponding to each detection electrode.
[0097] In some specific embodiments, before the measurement module 11, it may further include:
[0098] A parameter acquisition unit for acquiring the characteristic parameters of the resonator and the base of the target resonant gyro to obtain the resonator characteristic parameters and the base characteristic parameters; the resonator characteristic parameters include the inner and outer radii of the resonator spherical shell, the length of the support column, and the radius of the resonator; the base characteristic parameters include the dimensions of the base and the support holes, the relevant parameters of the flat electrode detection electrodes, and the specific details in actual manufacturing;
[0099] A model creation unit for inputting the resonator characteristic parameters and the base characteristic parameters into 3D modeling software to respectively establish 3D models of the resonator and the base of the target resonant gyro based on the resonator characteristic parameters and the base characteristic parameters to obtain a 3D resonator model and a 3D base model;
[0100] A fitting unit for fitting the 3D resonator model and the 3D base model to form an assembly;
[0101] An import unit for importing the assembly into a finite element simulation model to obtain the digital twin model;
[0102] A second calculation unit for inputting multiple groups of preset assembly error value combinations into the finite element simulation model to calculate the measured capacitance corresponding to different assembly error value combinations;
[0103] A mapping relationship creation unit for establishing a mapping relationship between each assembly error value combination and the corresponding measured capacitance;
[0104] A storage unit for storing the mapping relationship in a preset database.
[0105] In some specific embodiments, the current assembly error includes the average gap error between the lip edge of the resonator and the upper surface of the base, the tilt angle error of the rotation axis between the resonator and the base, and the azimuth angle error of the rotation axis between the resonator and the base;
[0106] Correspondingly, the error calculation module 12 may specifically include:
[0107] A third calculation unit, configured to calculate the gap between each of the detection electrodes and the resonator lip edge respectively based on the multiple target capacitance values, obtain a plurality of gap values, and calculate the average gap error between the resonator lip edge and the upper surface of the base based on the plurality of gap values and a preset gap design value;
[0108] A mapping relationship acquisition unit, configured to acquire the mapping relationship between different combinations of assembly error values and corresponding measured capacitances from a preset database;
[0109] A fourth calculation unit, configured to use an intelligent optimization algorithm to fit the tilt angle and azimuth angle of the rotation axis between the resonator and the base during the assembly process of the target resonant gyro based on the measured capacitances in the mapping relationship, and obtain the tilt angle error and azimuth angle error of the rotation axis.
[0110] In some specific embodiments, the third calculation unit may specifically include:
[0111] A sorting unit, configured to sort each of the detection electrodes based on the magnitudes of the target capacitance values to obtain sorted electrodes;
[0112] A maximum capacitance value determination unit, configured to determine the maximum capacitance value among the multiple target capacitance values;
[0113] A marking unit, configured to mark each of the detection electrodes in the sorted electrodes starting from the maximum capacitance value to obtain marked electrodes;
[0114] A fifth calculation unit, configured to calculate the gap between each of the marked electrodes and the resonator lip edge based on the target capacitance values corresponding to the marked electrodes, and obtain a plurality of gap values.
[0115] In some specific embodiments, the third calculation unit may specifically include:
[0116] A statistics unit, configured to count the number of the plurality of gap values to obtain a total number;
[0117] A sum calculation unit, configured to calculate the sum of the plurality of gap values to obtain a sum value;
[0118] A sixth calculation unit, configured to calculate the ratio of the sum value to the total number, and calculate the difference between the ratio and the preset gap design value to obtain the average gap error between the resonator lip edge and the upper surface of the base.
[0119] In some specific embodiments, the adjustment module 14 may specifically include:
[0120] A jump unit, configured to jump to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain a plurality of target capacitance values, and obtain a new assembly error;
[0121] A first judgment unit, configured to judge whether the new assembly error is less than the current assembly error;
[0122] A second judgment unit, configured to judge whether the new assembly error is within the preset error range if the new assembly error is less than the current assembly error;
[0123] A termination calculation unit, configured to terminate the measurement of the assembly error if the new assembly error is within the preset error range.
[0124] Furthermore, an embodiment of the present application also discloses an electronic device. Figure 7 It is a structural diagram of an electronic device 20 shown according to an exemplary embodiment. The content in the figure should not be considered as any limitation to the scope of use of the present application.
[0125] Figure 7 It is a schematic structural diagram of an electronic device 20 provided by an embodiment of the present application. The electronic device 20 may specifically include: at least one processor 21, at least one memory 22, a power supply 23, a communication interface 24, an input / output interface 25, and a communication bus 26. Among them, the memory 22 is used to store a computer program, and the computer program is loaded and executed by the processor 21 to implement the relevant steps in the digital twin-based resonant gyroscope assembly method disclosed in any of the foregoing embodiments. In addition, the electronic device 20 in this embodiment may specifically be an electronic computer.
[0126] In this embodiment, the power supply 23 is used to provide working voltage for each hardware device on the electronic device 20; the communication interface 24 can create a data transmission channel between the electronic device 20 and external devices, and the communication protocol it follows is any communication protocol applicable to the technical solution of the present application, and no specific limitation is imposed on it here; the input / output interface 25 is used to obtain external input data or output data to the outside, and its specific interface type can be selected according to specific application needs, and no specific limitation is made here.
[0127] In addition, as a carrier for resource storage, the memory 22 may be a read-only memory, a random access memory, a magnetic disk, or an optical disc, etc. The resources stored thereon may include an operating system 221, a computer program 222, etc., and the storage method may be temporary storage or permanent storage.
[0128] Among them, the operating system 221 is used to manage and control each hardware device and computer program 222 on the electronic device 20, and it can be Windows Server, Netware, Unix, Linux, etc. In addition to the computer program that can be used to complete the digital twin-based resonant gyro assembly method executed by the electronic device 20 disclosed in any of the foregoing embodiments, the computer program 222 may further include computer programs that can be used to complete other specific tasks.
[0129] Furthermore, the present application also discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, it implements the digital twin-based resonant gyro assembly method disclosed above. For the specific steps of this method, reference can be made to the corresponding content disclosed in the foregoing embodiments, and details will not be repeated here.
[0130] Furthermore, the embodiments of the present application also disclose a computer program product, including a computer program / instructions, and when the computer program / instructions are executed by a processor, they implement the steps of the digital twin-based resonant gyro assembly method disclosed above.
[0131] In this specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and reference can be made to the description in the method part for related parts.
[0132] Those skilled in the art can further realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the components and steps of the examples have been generally described according to their functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.
[0133] The steps of the methods or algorithms described in combination with the embodiments disclosed herein can be directly implemented by hardware, software modules executed by a processor, or a combination of the two. The software modules can be placed in a random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium well-known in the technical field.
[0134] Finally, it should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.
[0135] The above has introduced in detail a resonant gyroscope assembly method, device, equipment and medium based on digital twin provided by this application. Specific examples are used in this text to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to this application.
Claims
1. A resonant gyroscope assembly method based on digital twin, characterized in that Including: Measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values; Inputting the plurality of target capacitance values into a pre-created digital twin model to identify the assembly error between the resonator and the detection electrode based on the plurality of target capacitance values and the pre-created mapping relationship, so as to obtain the current assembly error; the digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the mounting base established based on the characteristic parameters of the resonator and the mounting base in the actual assembly, and the mapping relationship is the mapping relationship between the assembly error obtained through the digital twin model and the measured capacitance; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance; Judging whether the current assembly error is within a preset error range; If the current assembly error is not within the preset error range, adjusting the assembly process of the target resonant gyroscope and jumping to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyroscope.
2. The method for assembling a resonant gyroscope based on digital twin according to claim 1, wherein The step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values includes: Measuring the capacitance values of each detection electrode located on the upper surface of the base during the assembly process of the target resonant gyroscope multiple times to obtain a plurality of initial capacitance values corresponding to each detection electrode; Calculating the average value of the plurality of initial capacitance values corresponding to each detection electrode respectively to obtain the target capacitance value corresponding to each detection electrode.
3. The assembly method of the resonant gyroscope based on digital twin according to claim 1, wherein Before the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyroscope to obtain a plurality of target capacitance values, it further includes: Collecting the characteristic parameters of the resonator and the base of the target resonant gyroscope to obtain the resonator characteristic parameters and the base characteristic parameters; the resonator characteristic parameters include the inner and outer radii of the resonator spherical shell, the length of the support column and the radius of the resonator; the base characteristic parameters include the dimensions of the base and the support holes and the relevant parameters of the flat electrode detection electrodes, as well as the specific detail information in the actual manufacturing; Inputting the resonator characteristic parameters and the base characteristic parameters into 3D modeling software to respectively establish 3D models of the resonator and the base of the target resonant gyroscope based on the resonator characteristic parameters and the base characteristic parameters, so as to obtain a 3D resonator model and a 3D base model; Chimerizing the 3D resonator model and the 3D base model to form an assembly, and importing the assembly into a finite element simulation model to obtain the digital twin model; Inputting multiple groups of preset assembly error value combinations into the finite element simulation model to calculate the measured capacitance corresponding to different assembly error value combinations; Establishing the mapping relationship between each assembly error value combination and the corresponding measured capacitance, and saving the mapping relationship to a preset database.
4. The assembly method of the resonant gyro based on digital twin according to claim 3, wherein, The current assembly error includes the average gap error between the lip edge of the resonator and the upper surface of the base, the tilt angle error of the rotation axis between the resonator and the base, and the azimuth angle error of the rotation axis between the resonator and the base; Correspondingly, the identification of the assembly error between the resonator and the detection electrode based on the multiple target capacitance values and the pre-created mapping relationship to obtain the current assembly error includes: Calculating the gaps between each detection electrode and the lip edge of the resonator based on the multiple target capacitance values respectively to obtain multiple gap values, and calculating the average gap error between the lip edge of the resonator and the upper surface of the base based on the multiple gap values and the preset gap design value; Obtaining the mapping relationship between different combinations of assembly error values and the corresponding measured capacitance from the preset database, and using the intelligent optimization algorithm to fit the tilt angle of the rotation axis and the azimuth angle of the rotation axis between the resonator and the base during the assembly process of the target resonant gyro based on the measured capacitance in the mapping relationship to obtain the tilt angle error of the rotation axis and the azimuth angle error of the rotation axis.
5. The assembly method of the resonant gyro based on digital twin according to claim 4, wherein, The calculating the gaps between each detection electrode and the lip edge of the resonator based on the multiple target capacitance values respectively to obtain multiple gap values includes: Sorting each detection electrode based on the magnitude of the target capacitance value to obtain the sorted electrodes, and determining the maximum capacitance value among the multiple target capacitance values; Marking each detection electrode in the sorted electrodes starting from the maximum capacitance value to obtain the marked electrodes; Calculating the gaps between the corresponding marked electrodes and the lip edge of the resonator based on the target capacitance values corresponding to each marked electrode to obtain multiple gap values.
6. The method for assembling a resonant gyroscope based on digital twin according to claim 5, wherein The calculating the average gap error between the lip edge of the resonator and the upper surface of the base based on the multiple gap values and the preset gap design value includes: Counting the number of the multiple gap values to obtain the total number, and calculating the sum of the multiple gap values to obtain the sum value; Calculating the ratio of the sum value to the total number, and calculating the difference between the ratio and the preset gap design value to obtain the average gap error between the lip edge of the resonator and the upper surface of the base.
7. The method for assembling a resonant gyro based on digital twin according to any one of claims 1 to 6, characterized in that, The step of jumping to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain multiple target capacitance values until the new assembly error is within the preset error range includes: Jumping to the step of measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain multiple target capacitance values, obtaining the new assembly error, and judging whether the new assembly error is less than the current assembly error; If the new assembly error is less than the current assembly error, then judging whether the new assembly error is within the preset error range; If the new assembly error is within the preset error range, then terminating the measurement of the assembly error.
8. A resonant gyroscope assembly device based on digital twin, characterized in that Including: A measurement module for measuring the capacitance values of each detection electrode located on the base during the assembly process of the target resonant gyro to obtain multiple target capacitance values; An error calculation module, configured to input multiple said target capacitance values into a pre-created digital twin model, so as to identify the assembly error between the resonator and the detection electrode based on the multiple said target capacitance values and the pre-created mapping relationship, and obtain the current assembly error; the digital twin model includes a 3D model and a finite element model of the actual assembly resonator and the mounting base established based on the characteristic parameters of the resonator and the mounting base in the actual assembly, and the mapping relationship is the mapping relationship between the assembly error and the measured capacitance obtained through the digital twin model; the measured capacitance is the capacitance value of the capacitor formed due to the capacitance effect between the coated end face of the resonator and different detection electrodes measured in advance. A judgment module, configured to judge whether the current assembly error is within a preset error range. An adjustment module, configured to, if the current assembly error is not within the preset error range, adjust the assembly process of the target resonant gyroscope, and jump to the step of measuring the capacitance values of the respective detection electrodes located on the base during the assembly process of the target resonant gyroscope to obtain multiple target capacitance values, until the new assembly error is within the preset error range, so as to complete the assembly of the target resonant gyroscope.
9. An electronic device, characterized in that, It includes a processor and a memory; wherein, when the processor executes the computer program stored in the memory, it implements the digital twin-based resonant gyroscope assembly method according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, For storing a computer program; wherein, when the computer program is executed by a processor, it implements the digital twin-based resonant gyroscope assembly method according to any one of claims 1 to 7.
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