Chip resistor ceramic substrate positioning processing method and system

Abstract

The invention relates to the technical field of chip resistor ceramic substrate processing, in particular to a chip resistor ceramic substrate positioning processing method and system.The chip resistor ceramic substrate positioning processing system comprises an illumination unit, an image acquisition unit and a conveying unit, the conveying unit conveys a chip resistor ceramic substrate, and the illumination unit emits light and irradiates one side face of the chip resistor ceramic substrate; a non-light-transmitting part is formed at the corresponding position of the back face of the metal part on the chip resistor ceramic substrate, a light-transmitting part is formed at the corresponding position of the back face of the non-metal part on the chip resistor ceramic substrate, and the image acquisition unit captures the boundary edge of the non-light-transmitting part and the light-transmitting part and carries out positioning processing. The boundary edge of the non-light-transmitting part and the light-transmitting part is captured through the image acquisition unit, and the position of each ceramic wafer on the ceramic substrate is distinguished, so that the ceramic wafers on the substrate are accurately and reliably positioned independently, and the subsequent segmentation processing process is ensured to be carried out accurately.

Description

Technical Field

[0001] The present invention relates to the technical field of chip resistor ceramic substrate processing, and in particular to a chip resistor ceramic substrate positioning processing method and system. Background Art

[0002] When producing chip resistor ceramic sheets, generally a ceramic substrate containing a large number of chip resistor ceramic sheets arranged in a regular pattern is first made, and then the ceramic substrate is separated and cut along the dividing line to obtain the required chip resistor ceramic sheets. The current ceramic substrate cutting process is generally completed by laser cutting. Traditional chip resistor ceramic sheets cannot be well pressed and loaded during the cutting process, resulting in low cutting accuracy during cutting.

[0003] The existing publication number CN113012882A discloses a positioning processing method for a chip resistor ceramic substrate, wherein an upper adjusting threaded rod is arranged to rotate internally on a main body support plate, an upper support rod and a lower support rod are arranged to slide on one side of the main body support plate relying on the upper adjusting threaded rod, a second rotating wheel is rotatably arranged on the end surface of the upper support rod away from the main body support plate, a connecting spring is arranged at the end surface of the lower support rod away from the main body support plate, a first rotating wheel is rotatably arranged at the outer end of the connecting spring, a fixed guide column is fixedly arranged on the surface of one end of the lower fixed plate away from the main body support plate, a limiting nut is arranged in a threaded manner on the surface of the fixed guide column, and a rotating mounting base plate is sleeved on the surface of the fixed guide column and located on the lower side of the limiting nut, thereby solving the problem that the pressing and feeding work cannot be performed well, resulting in low cutting accuracy during cutting.

[0004] However, the positioning of the above-mentioned cut ceramic sheets is achieved by controlling the position of the ceramic sheets, which has the problems of inaccurate and unreliable positioning. The ceramic sheets in the ceramic substrate cannot be positioned individually, so the processing process has defects. Summary of the invention

[0005] The purpose of the present invention is to provide a positioning processing method and system for a chip resistor ceramic substrate, which solves the problem that the positioning of the cut ceramic sheet is achieved by controlling the position of the ceramic sheet, which has the problems of inaccurate positioning and unreliable positioning, and it cannot position the ceramic sheet in the ceramic substrate individually, so the processing process has defects.

[0006] To achieve the above-mentioned object, the present invention provides a chip resistor ceramic substrate positioning processing system, comprising an illumination unit, an imaging unit and a conveying unit, wherein the illumination unit and the imaging unit are respectively arranged on two sides of the conveying unit;

[0007] The conveying unit is used to convey the chip resistor ceramic substrate;

[0008] The light unit is used to irradiate the patch resistor ceramic substrate with light, forming a light-blocking part and a light-passing part;

[0009] The image acquisition unit is used to capture the boundary edge between the light-blocking part and the light-passing part for positioning and processing.

[0010] Wherein, the conveying unit includes a bracket, a conveying belt, a power member and an auxiliary member. The bracket is located between the light unit and the image acquisition unit; the conveying belt is connected to the bracket through the power member; the auxiliary member is connected to the bracket.

[0011] Wherein, the power member includes a transmission wheel, a driving wheel and a connecting belt. The transmission wheel is located on one side of the bracket; the driving wheel is connected to the transmission wheel through the connecting belt.

[0012] Wherein, the power member further includes a rotating shaft and a rotating wheel. The number of the rotating shafts is two, and the two rotating shafts are respectively rotatably connected to the bracket. One of the rotating shafts is fixedly connected to the transmission wheel; the number of the rotating wheels is four, and two rotating wheels are respectively fixedly connected to each rotating shaft. The four rotating wheels are arranged in pairs respectively, and the two rotating wheels on the same side are connected through the conveying belt.

[0013] Wherein, the auxiliary member includes an adjusting lead screw and a pressing plate. The adjusting lead screw is rotatably connected to the bracket; the pressing plate is connected to the adjusting lead screw and is located above the conveying belt.

[0014] A method for positioning and processing a patch resistor ceramic substrate includes the following steps:

[0015] The light unit and the image acquisition unit are respectively installed oppositely on both sides of the conveying unit;

[0016] The patch resistor ceramic substrate is conveyed through the conveying unit and stops conveying when it reaches between the light unit and the image acquisition unit;

[0017] The light emitted by the light unit irradiates one side of the patch resistor ceramic substrate, and a light-blocking part is formed at the corresponding position on the back of the metal part on the patch resistor ceramic substrate, and a light-passing part is formed at the corresponding position on the back of the non-metal part on the patch resistor ceramic substrate;

[0018] The image acquisition unit captures the boundary edge between the light-blocking part and the light-passing part for positioning and processing.

[0019] A method and system for positioning and processing a patch resistor ceramic substrate according to the present invention. When the conveying unit conveys the patch resistor ceramic substrate to between the lighting unit and the image capturing unit, the conveying is stopped. At this time, the lighting unit emits light and irradiates one side of the patch resistor ceramic substrate. A light-blocking part is formed at the corresponding position on the back of the metal part on the patch resistor ceramic substrate, and a light-passing part is formed at the corresponding position on the back of the non-metal part on the patch resistor ceramic substrate. The image capturing unit captures the boundary edge between the light-blocking part and the light-passing part for positioning and processing. By capturing the boundary edge between the light-blocking part and the light-passing part through the image capturing unit, the positions of the individual ceramic chips on the ceramic substrate can be distinguished, so as to accurately and reliably position the ceramic chips on the substrate separately and ensure the precise progress of the subsequent cutting process. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art.

[0021] Figure 1 It is a schematic diagram of the overall structure of the patch resistor ceramic substrate positioning and processing system according to the first embodiment of the present invention.

[0022] Figure 2 It is a front view of the patch resistor ceramic substrate positioning and processing system according to the second embodiment of the present invention.

[0023] Figure 3 It is a step diagram of the patch resistor ceramic substrate positioning and processing method according to the third embodiment of the present invention.

[0024] In the figure: 101 - lighting unit, 102 - image capturing unit, 103 - bracket, 104 - conveyor belt, 105 - driving wheel, 106 - driving pulley, 107 - connecting belt, 108 - rotating shaft, 109 - rotating wheel, 201 - adjusting screw, 202 - pressing plate, 203 - connecting frame, 204 - connecting spring, 205 - roller shaft. Detailed Embodiments

[0025] The following will describe in detail the embodiments of the present invention. The examples of the embodiments are shown in the drawings. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as a limitation to the present invention.

[0026] The first embodiment of the present application is:

[0027] Please refer to Figure 1 , where Figure 1It is a schematic diagram of the overall structure of the positioning and processing system for the patch resistor ceramic substrate in the first embodiment of the present invention. The present invention provides a positioning and processing system for the patch resistor ceramic substrate, which includes a lighting unit 101, an image acquisition unit 102, and a conveying unit. The conveying unit includes a bracket 103, a conveying belt 104, a power member, and an auxiliary member. The power member includes a transmission wheel 105, a driving wheel 106, a connecting belt 107, a rotating shaft 108, and a rotating wheel 109. Through the foregoing solution, the problem that the positioning of the ceramic chip is achieved by controlling the position of the ceramic chip, resulting in inaccurate and unreliable positioning, and it cannot perform separate positioning on the ceramic chips within the ceramic substrate, so there are defects in the processing process, can be solved. It can be understood that the foregoing solution can be used for positioning and cutting of the patch resistor ceramic substrate, and can also be used to solve the problem of material conveying.

[0028] For this specific embodiment, the lighting unit 101 and the image acquisition unit 102 are respectively disposed opposite to each other on both sides of the conveying unit;

[0029] The conveying unit is used to convey the patch resistor ceramic substrate;

[0030] The lighting unit 101 is used to irradiate light on the patch resistor ceramic substrate to form a light-blocking part and a light-passing part;

[0031] The image acquisition unit 102 is used to capture the boundary edge between the light-blocking part and the light-passing part for positioning and processing.

[0032] The conveying component is used to convey the patch resistor ceramic substrate. The lighting unit 101 and the image acquisition unit 102 are respectively disposed on both sides of the patch resistor ceramic substrate and are opposite to each other. The light emitted by the lighting unit 101 irradiates one side surface of the patch resistor ceramic substrate, and a light-blocking part is formed at the corresponding position on the back surface of the metal part on the patch resistor ceramic substrate, and a light-passing part is formed at the corresponding position on the back surface of the non-metal part on the patch resistor ceramic substrate. The image acquisition unit 102 uses a CCD image acquisition device to capture the boundary edge between the light-blocking part and the light-passing part for positioning and processing. By capturing the boundary edge between the light-blocking part and the light-passing part, the positions of each ceramic chip on the ceramic substrate can be distinguished, so as to accurately and reliably perform separate positioning on the ceramic chips on the substrate and ensure the precise progress of the subsequent cutting process.

[0033] Among them, the bracket 103 is located between the lighting unit 101 and the image acquisition unit 102; the conveyor belt 104 is connected to the bracket 103 through the power member; the auxiliary member is connected to the bracket 103. The bracket 103 is installed on the workbench and is arranged in cooperation with the laser cutting machine for support, and has a hollow structure in the middle for the use of the image acquisition unit 102. The conveyor belt 104 rotates through the power member and is used to convey the ceramic substrates of chip resistors. Both sides of the whole-board ceramic substrates of chip resistors are placed on the conveyor belt 104, and the auxiliary member presses the ceramic substrates of chip resistors for conveying.

[0034] Secondly, the transmission wheel 105 is located on one side of the bracket 103; the driving wheel 106 is connected to the transmission wheel 105 through the connecting belt 107. The number of the rotating shafts 108 is two, and the two rotating shafts 108 are respectively rotatably connected to the bracket 103, and one of the rotating shafts 108 is fixedly connected to the transmission wheel 105; the number of the rotating wheels 109 is four, and two of the rotating wheels 109 are respectively fixedly connected to each of the rotating shafts 108. The four rotating wheels 109 are respectively arranged in pairs opposite to each other, and the two rotating wheels 109 on the same side are connected through the conveyor belt 104. The driving wheel 106 is driven to rotate by a servo motor installed on the workbench. Due to the transmission of the connecting belt 107, the transmission wheel 105 is driven to rotate. The transmission wheel 105 is fixedly connected to one of the rotating shafts 108, so as to drive one of the rotating shafts 108 to rotate. Two of the rotating wheels 109 are fixed on the rotating shaft 108, so the two rotating wheels 109 rotate accordingly. The two rotating shafts 108 are arranged opposite to each other and are respectively fixed with two rotating wheels 109. The four rotating wheels 109 are arranged opposite to each other, and the two rotating wheels 109 on the same side are connected through the conveyor belt 104, so as to drive the conveyor belt 104 to rotate, and the conveyor belt 104 conveys the ceramic substrates of chip resistors.

[0035] Using a positioning and processing system for a patch resistor ceramic substrate according to this embodiment, place both sides of the whole board of patch resistor ceramic substrates on the two conveying belts 104. At this time, the auxiliary member presses the patch resistor ceramic substrates to prevent them from running off track. Start the servo motor to drive the driving wheel 106 to rotate, and then the driven wheel 105 and the rotating shaft 108 rotate accordingly. The rotating wheel 109 rotates to drive the conveying belt 104 to rotate to achieve transportation. The patch resistor ceramic substrates are conveyed between the lighting unit 101 and the image acquisition unit 102. The lighting unit 101 emits light and irradiates one side of the patch resistor ceramic substrate. An area without light transmission is formed at the corresponding position on the back of the metal part on the patch resistor ceramic substrate, and an area with light transmission is formed at the corresponding position on the back of the non-metal part on the patch resistor ceramic substrate. The image acquisition unit 102 uses a CCD image acquisition device to capture the boundary edge between the area without light transmission and the area with light transmission for positioning and processing. By capturing the boundary edge between the area without light transmission and the area with light transmission, the positions of each ceramic chip on the ceramic substrate can be distinguished, so as to accurately and reliably position the ceramic chips on the substrate individually and ensure the precise progress of the subsequent cutting and processing process.

[0036] The second embodiment of this application is as follows:

[0037] Based on the first embodiment, please refer to Figure 2 , where Figure 2 is the front view of the positioning and processing system for a patch resistor ceramic substrate according to the second embodiment of the present invention. The auxiliary member in this embodiment includes an adjusting lead screw 201, a pressing plate 202, a connecting frame 203, a connecting spring 204, and a roller 205.

[0038] For this specific embodiment, the adjusting lead screw 201 is rotatably connected to the bracket 103; the pressing plate 202 is connected to the adjusting lead screw 201 and is located above the conveying belt 104. The adjusting lead screw 201 installs the pressing plate 202 above the bracket 103. The adjusting lead screw 201 adopts the principle of screw drive and is arranged in relative thread fit with the pressing plate 202. By rotating the adjusting lead screw 201, the pressing plate 202 is driven to move up and down to adjust the distance between the pressing plate 202 and the bracket 103, so that it is suitable for use with patch resistor ceramic substrates of various thicknesses.

[0039] Among them, the roller shaft 205 is located above the conveyor belt 104; the connecting frame 203 is rotatably connected to the roller shaft 205 and is located above the roller shaft 205; the connecting frame 203 and the pressing plate 202 are connected by a plurality of the connecting springs 204. A plurality of the roller shafts 205 are arranged below the pressing plate 202, each of the roller shafts 205 is rotatably connected through the connecting frame 203, and each of the connecting frames 203 is connected to the pressing plate 202 by a plurality of the connecting springs 204.

[0040] When using the chip resistor ceramic substrate positioning and processing system of this embodiment, place the chip resistor ceramic substrate on the conveyor belt 104. At this time, the roller shaft 205 presses on the top of the chip resistor ceramic substrate, rotates as the chip resistor ceramic substrate moves, reduces friction, and presses the chip resistor ceramic substrate to prevent it from running off, realizing pressing and feeding, and improving the cutting accuracy during subsequent cutting.

[0041] The third embodiment of this application is:

[0042] On the basis of the second embodiment, please refer to Figure 3 , where Figure 3 is the step diagram of the chip resistor ceramic substrate positioning and processing method of the third embodiment of the present invention. A chip resistor ceramic substrate positioning and processing method of this embodiment includes the following steps:

[0043] S301: Install the lighting unit 101 and the image acquisition unit 102 opposite to each other on both sides of the conveying unit respectively;

[0044] S302: The chip resistor ceramic substrate is conveyed through the conveying unit and stops conveying when it reaches between the lighting unit 101 and the image acquisition unit 102;

[0045] S303: The light emitted by the lighting unit 101 irradiates one side of the chip resistor ceramic substrate, and a light-blocking part is formed at the corresponding position on the back of the metal part on the chip resistor ceramic substrate, and a light-passing part is formed at the corresponding position on the back of the non-metal part on the chip resistor ceramic substrate;

[0046] S304: The image acquisition unit 102 captures the boundary edge between the light-blocking part and the light-passing part for positioning and processing.

[0047] Specifically, the illumination unit 101 and the image acquisition unit 102 are respectively arranged on both sides of the patch resistor ceramic substrate. The light emitted by the illumination unit 101 irradiates one side of the patch resistor ceramic substrate, and a light-blocking part is formed at the corresponding position on the back of the metal part on the patch resistor ceramic substrate, and a light-transmitting part is formed at the corresponding position on the back of the non-metal part on the patch resistor ceramic substrate. The image acquisition unit 102 captures the boundary between the light-blocking part and the light-transmitting part for positioning and processing. By capturing the boundary between the light-blocking part and the light-transmitting part through the image acquisition unit 102, the positions of the individual ceramic chips on the ceramic substrate can be distinguished, so as to accurately and reliably perform individual positioning on the ceramic chips on the substrate, ensuring the precise progress of the subsequent segmentation and processing process.

[0048] The above-disclosed are only one or more preferred embodiments of the present application, and the scope of rights of the present application cannot be limited thereby. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A positioning and processing system for a patch resistor ceramic substrate, characterized in that it includes a lighting unit, an image capturing unit and a conveying unit, and the lighting unit and the image capturing unit are respectively arranged opposite to each other on both sides of the conveying unit; the conveying unit is used for conveying the patch resistor ceramic substrate; the lighting unit is used for irradiating the patch resistor ceramic substrate with light to form a light-blocking part and a light-passing part; the image capturing unit is used for capturing the boundary edge between the light-blocking part and the light-passing part for positioning and processing.

2. The positioning and processing system for a patch resistor ceramic substrate according to claim 1, characterized in that the conveying unit includes a bracket, a conveying belt, a power member and an auxiliary member, and the bracket is located between the lighting unit and the image capturing unit; the conveying belt is connected to the bracket through the power member; the auxiliary member is connected to the bracket.

3. The positioning and processing system for a patch resistor ceramic substrate according to claim 2, characterized in that the power member includes a transmission wheel, a driving wheel and a connecting belt, and the transmission wheel is located on one side of the bracket; the driving wheel is connected to the transmission wheel through the connecting belt.

4. The positioning and processing system for a patch resistor ceramic substrate according to claim 3, characterized in that the power member further includes a rotating shaft and a rotating wheel. The number of the rotating shafts is two, and the two rotating shafts are respectively rotatably connected to the bracket, and one of the rotating shafts is fixedly connected to the transmission wheel; the number of the rotating wheels is four, and two rotating wheels are respectively fixedly connected to each rotating shaft. The four rotating wheels are respectively arranged in pairs opposite to each other, and the two rotating wheels on the same side are connected through the conveying belt.

5. The positioning and processing system for a patch resistor ceramic substrate according to claim 1, characterized in that the auxiliary member includes an adjusting lead screw and a pressing plate. The adjusting lead screw is rotatably connected to the bracket; the pressing plate is connected to the adjusting lead screw and is located above the conveying belt.

6. A positioning and processing method for a chip resistor ceramic substrate, applicable to the positioning and processing system for a chip resistor ceramic substrate as described in claim 1, characterized in that, It includes the following steps: The lighting unit and the image capturing unit are respectively oppositely installed on both sides of the conveying unit; The patch resistor ceramic substrate is conveyed through the conveying unit and stops conveying when it reaches between the lighting unit and the image capturing unit; The light emitted by the lighting unit irradiates one side of the patch resistor ceramic substrate, and a light-blocking part is formed at the corresponding position on the back of the metal part on the patch resistor ceramic substrate, and a light-passing part is formed at the corresponding position on the back of the non-metal part on the patch resistor ceramic substrate; The image capturing unit captures the boundary edge between the light-blocking part and the light-passing part for positioning and processing.

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