Method of processing substrate

Abstract

Disclosed is a method of processing a substrate, the method including: a substrate processing operation of processing the substrate with a processing member while moving an arm on which the processing member is mounted, the arm rotating relative to the substrate according to a processing scheme; and a verification operation of verifying the received initial scheme for the substrate processing operation prior to the substrate processing operation, in which the verification operation includes: an inspection operation of dividing a region on the substrate into a plurality of unit regions, and inspecting a processing time during which the unit regions are separated from the substrate; each of the plurality of unit areas is directly processed by the processing unit for a set time; and a determination operation of determining whether the processing time in each of the plurality of unit regions checked in the checking operation is appropriate.

Description

Technical Field

[0001] The present invention relates to a substrate processing method, and more particularly, to a substrate processing method for verifying a solution applied to a substrate processing apparatus. Background Art

[0002] To manufacture semiconductor devices, various processes such as photolithography, deposition, ashing, etching, and ion implantation are performed. Before and after these processes, a cleaning process is also performed to remove any particles remaining on the substrate.

[0003] The cleaning process can be roughly divided into dry cleaning and wet cleaning, and wet cleaning is currently used in most semiconductor processes because its process is relatively simple and cost-effective, and various chemical liquids are used to remove impurities.

[0004] The wet cleaning method can be classified into batch type and single-wafer type. The batch type is a method of removing contaminants by immersing multiple wafers in a cleaning bath containing a cleaning solution at once, but its disadvantage is that it is difficult to respond to the trend of increasing wafer size, and a large amount of cleaning solution is used because a new cleaning bath needs to be installed accordingly when the wafer becomes larger. In addition, when a wafer in the cleaning bath is damaged during the cleaning process, it affects all the wafers in the cleaning bath, which may cause a large number of wafers to have defects, so the application of the batch type is gradually decreasing.

[0005] The single-wafer type treats the wafer as a single piece and removes impurities by spraying a cleaning solution on the surface of the wafer rotating at high speed. The single-wafer type removes impurities by utilizing the pressure applied to the cleaning solution by the spraying device and the centrifugal force applied to the cleaning solution by the rotating substrate.

[0006] In the case of the single-wafer type, a solution is used to process the substrate. These solutions are created and modified based on people's experience. On the other hand, generally, when processing the substrate, the rotation of the substrate and the movement of the arm are performed simultaneously, so when the solution is written incorrectly, some areas may not be processed. The problem is that there is no standard to pre-determine whether the solution is written correctly. Summary of the Invention

[0007] The present invention is dedicated to providing a substrate processing method that can effectively process the substrate.

[0008] The present invention is also dedicated to providing a substrate processing method that evaluates the suitability of a solution used in a substrate processing apparatus before using the solution in the substrate processing apparatus.

[0009] The present invention is further dedicated to providing a substrate processing method that can improve the suitability of a solution used in a substrate processing apparatus.

[0010] The problems to be solved by the present invention are not limited to the above problems, and those skilled in the art will clearly understand the problems not mentioned through the following description.

[0011] An exemplary embodiment of the present invention provides a method for processing a substrate, the method including: a substrate processing operation of processing the substrate with a processing component while moving an arm on which the processing component is mounted relative to the substrate, the arm rotating relative to the substrate according to a processing scheme; and a verification operation of verifying an initial scheme received for the substrate processing operation before the substrate processing operation, wherein the verification operation includes: an inspection operation of dividing an area on the substrate into a plurality of unit areas and inspecting a processing time during which each of the plurality of unit areas is directly processed by the processing component for a set time; and a determination operation of determining whether the processing time in each of the plurality of unit areas inspected in the inspection operation is appropriate.

[0012] According to the exemplary embodiment, the set time may be the total time taken to process the substrate in the substrate processing operation.

[0013] According to the exemplary embodiment, the method may further include receiving the initial scheme, wherein the inspection operation may be performed by simulating using a plurality of input factors included in the initial scheme.

[0014] According to the exemplary embodiment, the determination operation may include determining that the initial scheme is appropriate when the processing times between the plurality of unit areas are within a set range, and performing the substrate processing operation by using the initial scheme as the processing scheme.

[0015] According to the exemplary embodiment, the determination operation may include: a scheme modification operation of determining that the initial scheme is inappropriate when the processing times between the plurality of unit areas are outside the set range and modifying the initial scheme to create a modified scheme; and a verification operation of verifying the modified scheme, and the substrate processing operation may include processing the substrate by using the modified scheme as the processing scheme.

[0016] According to the exemplary embodiment, the processing component may include a nozzle for discharging a processing liquid onto the substrate or a nozzle for spraying the liquid in a mist state onto the substrate.

[0017] According to the exemplary embodiment, the processing component may include a brush for cleaning the substrate by physical contact with the substrate.

[0018] According to the exemplary embodiment, the processing component may include an ultrasonic nozzle for applying ultrasonic waves to a liquid film formed on the substrate.

[0019] According to the exemplary embodiment, the processing component may include a light source for emitting light onto the substrate.

[0020] According to an exemplary embodiment, the processing component may include a heater for providing heat to the substrate.

[0021] According to an exemplary embodiment, when viewed from below, the processing component may have a circular, annular, elliptical, or polygonal shape.

[0022] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method including: receiving an initial plan, the initial plan including substrate speed data regarding the rotation speed of the substrate, process data regarding the substrate processing process, and data regarding a processing unit for processing the substrate; and performing verification of the initial plan, wherein performing verification of the initial plan includes: obtaining processing data, the processing data being data regarding the time for the processing unit to process the substrate through a plurality of unit areas on the substrate based on the initial plan; and determining the suitability of the initial plan based on the processing data.

[0023] According to an exemplary embodiment, the process data may include first acceleration time data and processing time data, the first acceleration time data being data related to the time taken to accelerate the rotation speed of the substrate from a first rotation speed to a second rotation speed, and the processing time data being data related to the time taken to process the substrate, and the data regarding the processing unit may include: target position data regarding the target position of the processing unit on the substrate; speed data regarding the set speed at which the processing unit moves to the target position; second acceleration time data, which is data regarding the time taken for the processing unit to accelerate to the set speed; second deceleration time data, which is data regarding the time taken for the processing unit to stop at the set speed; and waiting time data, which is data regarding the time the processing unit stays at the target position.

[0024] According to an exemplary embodiment, the obtaining of the processing data may include: converting the data included in the initial plan into time series data; dividing the time series data based on unit time; obtaining count data based on the divided time series data, the count data being data regarding the number of times the processing unit passes through a plurality of unit areas on the substrate; and obtaining the processing data based on the count data.

[0025] According to an exemplary embodiment, determining the suitability of the initial plan based on the processing data may include: based on the processing data, obtaining a plurality of unit areas in which the processing time is equal to or longer than a preset time; and determining the suitability of the initial plan based on whether the ratio of the plurality of unit areas in which the processing time is equal to or longer than the preset time is equal to or greater than a preset value.

[0026] According to an exemplary embodiment, the method may further include: receiving ejection amount data, which is data regarding the amount of processing liquid ejected by a processing unit based on the position of a substrate; and obtaining striking force data based on the processing data and the ejection amount data, where the striking force data is data regarding the amount of processing liquid ejected by the processing unit onto the substrate through a plurality of regions on the substrate.

[0027] According to an exemplary embodiment, determining the suitability of an initial scheme based on the processing data may include determining the suitability of the initial scheme based on the processing data and the striking force data.

[0028] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method including: receiving an initial scheme; a substrate processing operation of processing the substrate by a processing component while moving an arm on which the processing component is mounted relative to the substrate, the arm rotating relative to the substrate according to the processing scheme; and a verification operation of verifying the received initial scheme for the substrate processing operation before the substrate processing operation, where the verification operation includes: an inspection operation of dividing regions on the substrate into a plurality of unit regions and inspecting the processing time during which each of the plurality of unit regions is directly processed by the processing component for a set time; and a determination operation of determining whether the processing time in each of the plurality of unit regions inspected in the inspection operation is appropriate, the set time being the total time spent in processing the substrate in the substrate processing operation, the inspection operation being performed by simulation using a plurality of input factors included in the initial scheme, and the determination operation including determining that the initial scheme is appropriate when the processing times between the plurality of unit regions are within a set range, and determining that the initial scheme is inappropriate when the processing times between the plurality of unit regions are outside the set range.

[0029] According to an exemplary embodiment, the processing component may include: a brush for cleaning the substrate by physical contact with the substrate; a nozzle for discharging processing liquid onto the substrate; an ultrasonic nozzle for applying ultrasonic waves to a liquid film formed on the substrate; a light source for emitting light onto the substrate; and a heater for providing heat to the substrate; or a nozzle for ejecting liquid in a mist state onto the substrate, and when viewed from below, the processing component may have a circular, annular, elliptical, or polygonal shape.

[0030] According to an exemplary embodiment, the determination operation may further include: when determining that the initial scheme is inappropriate, modifying the initial scheme to create a modified scheme; and verifying the modified scheme, and the substrate processing operation may include processing the substrate by using the initial scheme or the modified scheme as the processing scheme.

[0031] According to an exemplary embodiment of the present invention, regardless of the position of the substrate, the nozzle will cover the substrate, thereby enabling uniform processing of the substrate.

[0032] According to an exemplary embodiment of the present invention, trial and error in scenario creation can be prevented by performing verification of an initial scenario.

[0033] The effects of the present invention are not limited to the foregoing effects, and those skilled in the art can clearly understand effects not mentioned from this specification and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a top view showing a substrate processing apparatus according to a first exemplary embodiment of the present invention.

[0035] Figure 2 is a cross-sectional view showing an exemplary embodiment of a liquid processing chamber according to a first exemplary embodiment of the present invention.

[0036] Figure 3 is a flowchart of a substrate processing method according to an exemplary embodiment of the present invention.

[0037] Figure 4 is a flowchart of a method for performing verification of an initial scenario according to an exemplary embodiment of the present invention.

[0038] Figure 5 is a flowchart of a method for performing an inspection on an initial scenario according to an exemplary embodiment of the present invention.

[0039] Figure 6 is a diagram showing an example of converting the rotational speed of a substrate included in an initial scenario into time series data according to an exemplary embodiment of the present invention.

[0040] Figure 7 is a flowchart of a method for obtaining data on a processing time according to an exemplary embodiment of the present invention.

[0041] Figure 8 is a diagram showing an example of the relative position of a nozzle according to the rotation of a substrate according to an exemplary embodiment of the present invention.

[0042] Figure 9 is a diagram showing an example of counting data according to an exemplary embodiment of the present invention.

[0043] Figure 10 is a diagram showing an example of processing data according to an exemplary embodiment of the present invention.

[0044] Figure 11 is a flowchart of a method for determining the suitability of an initial scenario according to an exemplary embodiment of the present invention.

[0045] Figure 12 is a diagram showing the effects of a substrate processing method according to an exemplary embodiment of the present invention.

[0046] Figure 13 is a cross-sectional view of a substrate processing apparatus according to a second exemplary embodiment of the present invention.

[0047] Figure 14 is a cross-sectional view of a substrate processing apparatus according to a third exemplary embodiment of the present invention.

[0048] Figure 15 is a cross-sectional view of a substrate processing apparatus according to a fourth exemplary embodiment of the present invention.

[0049] Figure 16 is a cross-sectional view of a substrate processing apparatus according to a fifth exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0050] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. The exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details are not necessarily required and that the exemplary embodiments may be embodied in many different forms and neither should be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies have not been described in detail.

[0051] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not limiting. As used herein, unless the context clearly indicates otherwise, the singular forms may also be intended to include the plural forms. The terms "comprises," "comprising," "includes," and "having" are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless specifically identified as an order of execution, the method steps, processes, and operations described herein should not be construed as necessarily requiring them to be performed in the particular order discussed or illustrated. It should also be understood that additional or alternative steps may be employed.

[0052] When an element or layer is referred to as being “on,” “engaged to,” “connected to,” or “coupled to” another element or layer, it can be directly “on,” “engaged to,” “connected to,” or “coupled to” the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to,” “directly connected to,” or “directly coupled to” another element or layer, intervening elements or layers may not be present. Other words used to describe the relationship between elements (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.) should be interpreted in a like manner. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0053] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another region, layer, or section. When used herein, such as “first,” “second,” and other numerical terms do not imply a sequence or order unless the context clearly indicates. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0054] To facilitate the description of the relationship of one element or feature to another element or feature as shown in the figures, spatial relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” and “upper,” etc. may be used herein. In addition to the orientation shown in the figures, the spatial relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “beneath” or “below” other elements or features will be oriented “above” the other elements or features. Thus, the exemplary term “below” may include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein are to be interpreted accordingly.

[0055] When the terms “same” or “equivalent” are used in the description of the exemplary embodiments, it should be understood that some imprecision may exist. Thus, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within manufacturing or operating tolerances (e.g., ±10%).

[0056] When the terms "about" or "substantially" are used in conjunction with a numerical value, it should be understood that the relevant numerical value includes manufacturing or operating tolerances near the stated value (e.g., ±10%). In addition, when the words "generally" and "substantially" are used in conjunction with a geometric shape, it should be understood that no precision of the geometric shape is required, but the shape ranges within the scope of the present disclosure.

[0057] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this exemplary embodiment belongs. It should also be understood that terms (including those defined in a common dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and will not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0058] Hereinafter, the present invention will be described based on the fact that the substrate W to be processed is a wafer. In addition, the present invention will be described based on the fact that a pattern PA is formed on the substrate W to be processed. In addition, the present invention will be described based on the fact that the substrate processing method is a method for manufacturing a semiconductor device.

[0059] Figure 1 is a top view showing a substrate processing apparatus 1 according to a first exemplary embodiment of the present invention.

[0060] Reference Figure 1 , the substrate processing apparatus 1 includes a transfer module 10, a processing module 20, and a controller 30. When viewed from above, the transfer module 10 and the processing module 20 are arranged in one direction. Hereinafter, when viewed from above, the direction in which the transfer module 10 and the processing module 20 are arranged is referred to as a first direction X, the direction perpendicular to the first direction X is referred to as a second direction Y, and the direction perpendicular to both the first direction X and the second direction Y is referred to as a third direction Z.

[0061] The transfer module 10 transfers the substrate W from the container C in which the substrate W is accommodated to the processing module 20, and accommodates the substrate W that has been completely processed in the processing module 20 in the container C. The longitudinal direction of the transfer module 10 is set in the second direction Y. The transfer module 10 includes a load port 12 and a transfer frame 14. Based on the transfer frame 14, the load port 12 is located on the side opposite to the processing module 20. The container C in which the substrate W is accommodated is placed on the load port 12. A plurality of load ports 12 may be provided, and the plurality of load ports 12 may be arranged along the second direction Y.

[0062] An airtight container can be used as the container C, such as a front-opening unified pod (FOUP). The container C can be placed on the loading port 12 by a transport component (not shown) (such as an overhead transfer device, an overhead conveyor, or an automated guided vehicle) or by an operator.

[0063] The transfer robot 120 is disposed on the transfer frame 14. A guide rail 124 whose longitudinal direction is set in the second direction Y is disposed on the transfer frame 14, and the transfer robot 120 can be set to be movable on the guide rail 124. The transfer robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 can be set to be movable in the front-rear direction, rotatable about the third direction Z, and movable in the third direction Z. A plurality of hands 122 are arranged to be spaced apart in the vertical direction, and the hands 122 can move back and forth independently of each other.

[0064] The processing module 20 includes a buffer unit 200, a transfer chamber 300, a liquid processing chamber 400, and a drying chamber 500. The buffer unit 200 provides a space in which the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 temporarily stay. The liquid processing chamber 400 performs a liquid processing process of processing the substrate W with a liquid by supplying the liquid to the substrate W. The drying chamber 500 can perform a drying process of removing the liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500.

[0065] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 can be set to be spaced apart from each other in the third direction Z. The buffers 220 can be substrate holders that support the lower side of the substrate W. The buffers 220 can be provided in the form of support shelves that support the lower side of the substrate W.

[0066] The front and rear of the buffer unit 200 are open. The front is the surface facing the transfer module 10, and the rear is the surface facing the transfer chamber 300. At least one of the transfer robot 120 and the transfer robot 320 can access the buffer unit 200.

[0067] The longitudinal direction of the transfer chamber 300 can be set in the first direction X. The buffer unit 200 can be disposed between the transfer module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 can be disposed on the side portions of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 can be sequentially arranged with respect to the second direction Y. The drying chamber 500 and the transfer chamber 300 can be sequentially arranged with respect to the second direction Y. The buffer unit 200 can be located at one end of the transfer chamber 300.

[0068] According to the example, the liquid processing chambers 400 are provided on both sides of the transfer chamber 300, and the drying chambers 500 are provided on both sides of the transfer chamber 300, and the liquid processing chambers 400 can be arranged closer to the buffer unit 200 than the drying chambers 500. At one side of the transfer chamber 300, the liquid processing chambers 400 can be arranged in an arrangement of A×B (each of A and B is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. In addition, at one side of the transfer chamber 300, the drying chambers 500 can be arranged in a quantity of C×D (each of C and D is a natural number of 1 or greater than 1) in the first direction 92 and the third direction 96. Different from the above, only the liquid processing chambers 400 can be provided at one side of the transfer chamber 300, and only the drying chambers 500 can be provided at the other side of the transfer chamber 300.

[0069] The transfer chamber 300 includes a transfer robot 320. A guide rail 324 whose longitudinal direction is arranged in the first direction X is provided in the transfer chamber 300, and the transfer robot 320 can be arranged to be movable on the guide rail 324. The indexing robot 320 includes a hand 322 on which a substrate W is placed, and the hand 322 can be arranged to be movable in the front-rear direction, rotatable about the third direction Z, and movable in the third direction Z. A plurality of hands 322 are arranged at intervals in the vertical direction, and the hands 322 can move back and forth independently of each other.

[0070] The controller 30 can control the substrate processing apparatus 1. The controller 30 can include a process controller formed of a microprocessor (computer) that executes the control of the substrate processing apparatus 1, a user interface formed of a keyboard in which an operator performs command input operations, etc. to manage the substrate processing apparatus 1, a display for visualizing and displaying the operation status of the substrate processing apparatus 1, etc., and a storage unit that stores a control program for executing a process performed in the substrate processing apparatus 1 under the control of the process controller or a program (i.e., a processing recipe) for executing a process in each component according to various data and processing conditions. In addition, the user interface and the storage unit can be connected to the process controller. The processing recipe can be stored in a storage medium in the storage unit, and the storage medium can be a hard disk, and can also be a portable disk, such as a CD-ROM or a DVD, or a semiconductor memory, such as a flash memory.

[0071] The controller 30 can control the configuration of the substrate processing apparatus 1 to perform the following substrate processing method. For example, the controller 30 can be provided with a recipe for controlling the liquid processing chambers 400 and the drying chambers 500, and determine the appropriateness of the provided recipe. When the controller 30 determines that the recipe is appropriate, the controller 30 can generate a control command based on the recipe to control the liquid processing chambers 400 and the drying chambers 500.

[0072] Figure 2 FIG. is a diagram schematically showing an exemplary embodiment of a liquid processing chamber.

[0073] Reference Figure 2 , according to an exemplary embodiment of the present invention, the liquid processing chamber 400 can process the substrate W by supplying a processing liquid to the substrate W. The processing liquid supplied to the substrate W can be a cleaning solution for cleaning the substrate W. The cleaning solution can be deionized water or an organic solvent. The organic solvent can be a solvent containing alcohol. The organic solvent can be isopropyl alcohol (IPA).

[0074] The liquid processing chamber 400 can include a housing 410, a support unit 420, a bowl 430, a lifting unit 440, a liquid supply unit 440, and a nozzle standby cup 460.

[0075] The housing 410 can provide a space in which the substrate W is processed and a space in which some structures of the liquid processing chamber 400 are arranged. The housing 410 can provide an upper space 411 and a lower space 412. The upper space 411 is a processing space in which the substrate W is processed, and the lower space 412 is located below the upper space 411.

[0076] An inlet opening 414 can be formed on one side of the housing 410 for introducing the substrate W into the upper space 411 and removing the substrate W from the upper space 411. The inlet opening 414 can be selectively opened and closed by a door DO, and the door DO can be a baffle. The door DO can be configured to move in the vertical direction. For example, the door DO can be configured to move in the vertical direction by a motor or a pneumatic / hydraulic cylinder, etc.

[0077] The support unit 420 can be configured to support and rotate the substrate W in the space provided by the housing 410. The support unit 420 can include a rotating plate 421, a rotating shaft 424, and a rotation driver 425.

[0078] When viewed from above, the rotating plate 421 can have a generally circular plate shape. The rotating plate 421 can be shaped with a wide top surface and a narrow bottom surface. In the rotating plate 421, chuck pins 422 and support pins 423 can be installed. A plurality of chuck pins 422 can be provided.

[0079] The chuck pin 422 can be configured to support the bottom surface and the side portions of the edges of the substrate W. When viewed from above, the chuck pin 422 can be configured to be movable in a direction closer to the center of the rotating plate 421 or in a direction away from the center of the rotating plate 421. The chuck pin 422 can be configured to be movable in a direction closer to the center of the rotating plate 421 or in a direction away from the center of the rotating plate 421 by a drive mechanism (such as a motor or a cylinder) provided within the rotating plate 421. When the chuck pin 422 moves in the direction closer to the center of the rotating plate 421 and is in the clamping position, the substrate W can be clamped to the rotating plate 421. Conversely, when the chuck pin 422 moves in the direction away from the center of the rotating plate 421 and is in the unclamping position, the substrate W can be unclamped from the rotating plate 421.

[0080] The support pins 423 can be configured to support the bottom surface of the substrate W. The support pins 423 can be provided in plurality and can be configured to support different points on the bottom surface of the substrate W, respectively. When viewed from above, the support pins 423 can be arranged to be spaced apart from each other in the circumferential direction.

[0081] The lower portion of the rotating plate 421 can be coupled to the rotating shaft 424. The rotating shaft 424 can be rotated clockwise or counterclockwise by receiving a driving force from a rotation driver 425, which can be a hollow motor.

[0082] The bowl 430 can provide a space in which the substrate W is processed. The bowl 430 can have a cup shape with a top opening. The bowl 430 can be used as a liquid receiving portion to collect the processing liquid dispersed from the substrate W when a liquid supply unit 450, which will be described later, supplies the processing liquid to the rotating substrate W.

[0083] The bowl 430 can include an outer bowl 431 and an inner bowl 432. The outer bowl 431 and the inner bowl 432 can include a bottom portion, a lateral portion extending upward from the bottom, and a top portion extending obliquely from the lateral portion in a direction closer to the rotating plate 421. The lateral portion can be coupled to a lifting unit 440, which will be described later. The inner bowl 432 can be a bowl provided inside the outer bowl 431.

[0084] The processing liquid can be collected between the outer bowl 431 and the inner bowl 432. The collected processing liquid can be discharged to the outside of the liquid processing chamber 400 via a pipeline connected to the bottom portion of the outer bowl 431.

[0085] The lifting unit 440 can be configured to change the relative height between the bowl 430 and the rotating plate 421. The lifting unit 440 can be configured to move the bowl 430 in the vertical direction, thereby changing the relative height between the bowl 430 and the rotating plate 421. The lifting unit 440 can include a fixed bracket 441, a lifting shaft 442, and a lifting driver 443. The lifting driver 443, which can be a motor or a pneumatic / hydraulic cylinder, can move the fixed bracket 441 connected to the lifting shaft 442 in the vertical direction. The fixed bracket 441 is coupled to the lateral portion of the outer bowl 431 and is capable of moving the outer bowl 431 and the inner bowl 432 in the vertical direction.

[0086] The liquid supply unit 450 can supply a processing liquid to the substrate W. The processing liquid can be a cleaning solution for cleaning the substrate W. The cleaning solution can be deionized water or an organic solvent. The organic solvent can be a solvent containing alcohol. Further, the organic solvent can be isopropyl alcohol (IPA). The liquid supply unit 450 can include a nozzle 451, an arm 452, a moving shaft 453, and a moving driver 454. In an exemplary embodiment, the nozzle 451 can atomize or discharge the processing liquid onto the substrate W. The nozzle 451 can generate microdroplets or a spray.

[0087] The nozzle 451 can be coupled to the arm 452. Here, the nozzle 451 can be a processing component, and when viewed from below, its cross-section can be one of circular, elliptical, hollow, or polygonal.

[0088] The arm 452 can be coupled to the moving shaft 453. The moving shaft 453 can be rotated by the moving driver 454, which can be an electric motor. The moving shaft 453 can be rotatable. Thus, the arm 452 can pivot about the rotation axis of the moving shaft 453.

[0089] By the rotation of the moving shaft 453, the nozzle 451 can change its position between the processing position and the standby position. The processing position can be the position where the nozzle 451 faces the center of the substrate W placed on the rotating plate 421.

[0090] In the above example, the liquid supply unit 450 is described and shown as being provided with a single liquid supply unit, but the liquid supply unit 450 can be provided with a plurality of liquid supply units. One of the liquid supply units 450 can be configured to supply deionized water, and another can be configured to supply isopropyl alcohol.

[0091] The nozzle standby cup 460 can provide a standby space for the nozzle 451 to standby. When the process is not in progress, the nozzle 451 can be located at the standby position, that is, on one side above the nozzle standby cup 460. The nozzle standby cup 460 can be used as a liquid receiving part to receive the pre-discharged processing liquid before the nozzle 451 starts processing on the substrate W. In addition, the nozzle standby cup 460 can be used as a liquid receiving part to receive the processing liquid collected at the end part of the nozzle 451 when the nozzle 451 is on standby.

[0092] Hereinafter, a substrate processing method according to an exemplary embodiment of the present invention will be described in detail.

[0093] Figure 3 is a flowchart of a substrate processing method according to an exemplary embodiment of the present invention.

[0094] Referring to Figure 3 , the controller can acquire an initial plan (S1000). The controller 30 can be provided with an initial plan acquired from an external source. For example, the controller 30 can receive an initial plan from a user. The initial plan can be formed as shown in Table 1 below.

[0095] [Table 1]

[0096]

[0097] Referring to Table 1, the initial plan can include substrate speed data, process data, and nozzle arm data for each operation. Each operation can be a corresponding operation for the substrate processing apparatus 1 to process the substrate W. For example, each operation can be a corresponding operation in which the liquid processing chamber 400 performs liquid processing on the substrate W. In Table 1, the initial plan is shown as including only two operations, but this is for example, and the present invention is not limited thereto. For example, the initial plan can include N operations. The substrate speed data can be data regarding the rotational speed of the substrate W.

[0098] The process data can be data regarding substrate processing. The process data can include acceleration time data and processing time data. The acceleration time data can be data regarding the time taken for the rotational speed of the substrate W to change compared to the rotational speed in the operation before the corresponding operation when the rotational speed of the substrate W changes in a certain operation, and the processing time data can be data regarding the time taken for the substrate processing apparatus 1 to perform processing on the substrate in the corresponding operation. The sum of the processing times in each operation can be the total processing time used by the substrate processing apparatus 1 to perform processing on the substrate.

[0099] The nozzle arm data may include position data, velocity data, acceleration time data, deceleration time data, and delay data. The position data may be data regarding the target position of the nozzle 451 in the corresponding operation. The velocity data may be data regarding the set velocity at which the nozzle 451 is set to move to the target position in the corresponding operation. The acceleration time data may be data regarding the time taken to accelerate the moving speed of the nozzle 415 to the set velocity in the corresponding operation. The deceleration time data may be data regarding the time taken for the nozzle 451 to decelerate from the set velocity to zero to stop at the target position in the corresponding operation. The delay data may be data regarding the time for which the nozzle 451 stands by at the target position.

[0100] In an exemplary embodiment, the controller 30 may also be provided with spraying amount data. The spraying amount data may be data regarding the amount of the processing liquid sprayed by the nozzle 451 based on the position of the substrate W.

[0101] The controller may perform verification of the initial scenario (S2000). A method of performing verification of the initial scenario by the controller 30 will be described in more detail below.

[0102] Figure 4 is a flowchart of a method of performing verification of an initial scenario according to an exemplary embodiment of the present invention.

[0103] Referring to Figure 4 , the controller may perform an inspection of the initial scenario (S2100). The controller 30 may perform an inspection of the initial scenario by performing a simulation of the initial scenario. More specifically, the controller 30 may perform an inspection of the initial scenario.

[0104] Figure 5 is a flowchart of a method of performing an inspection of an initial scenario according to an exemplary embodiment of the present invention. Figure 6 is a diagram showing an example of converting the rotational speed of a substrate included in an initial scenario into time series data according to an exemplary embodiment of the present invention.

[0105] Referring to Figure 5 , the controller may convert the data included in the initial scenario into time series data (S2110). The controller 30 may convert the substrate speed data and the nozzle arm data into time series data based on the process data included in the initial scenario.

[0106] The controller 30 may convert the substrate speed data and the nozzle arm data at each operation into one time series data respectively. Here, the time series data may be data during the total processing time taken for the substrate processing apparatus 1 to perform processing on the substrate W.

[0107] Referring to Figure 6, for example, the controller 30 can convert the substrate speed data of each operation in Table 1 into a time series data of the total processing time, as Figure 6 shown.

[0108] The controller can acquire the coordinates of the region on the substrate (S2120). Here, the region on the substrate W can be the region where the processing is performed by the substrate processing apparatus 1. The controller can divide the region on the substrate into a plurality of unit regions, and can acquire the coordinates of the plurality of unit regions. Here, the unit region can be in a grid shape. For example, the controller 30 can grid the region on the substrate and acquire the coordinates in the gridded region.

[0109] The controller can perform segmentation of the time series data based on the unit time execution (S2130). In operation S2110, the controller 30 can perform segmentation of the substrate speed data and the nozzle arm data that have been time series converted based on the unit time execution. The controller 30 can perform segmentation of the time series data at each unit time. The unit time can be preset, and it can be a time less than the total processing time. For example, the preset unit time can be td, and the time series data can be divided into N segments.

[0110] The controller can acquire the processing data based on the segmented time series data (S2140). A method for the controller 30 to acquire the processing data will be described in detail below.

[0111] Figure 7 is a flowchart of a method for obtaining data on the processing time according to an exemplary embodiment of the present invention. Figure 8 is a diagram showing an example of the relative position of the nozzle according to the rotation of the substrate according to an exemplary embodiment of the present invention. Figure 9 is a diagram showing an example of the count data according to an exemplary embodiment of the present invention. Figure 10 is a diagram showing an example of the processing data according to an exemplary embodiment of the present invention.

[0112] Referring to Figure 7 , the controller can acquire the coordinates converted within the unit time (S2141).

[0113] When the substrate W rotates, the coordinates acquired in operation S2120 can be converted. The controller 30 can acquire the converted coordinates based on the substrate speed data included in the segmented time series data.

[0114] The controller can obtain the position data of the nozzle per unit time (S2142). The controller 30 can obtain the position data of the nozzle 451 per unit time based on the segmented time series data and the coordinates obtained in operation S2141. Here, the position data of the nozzle 451 can be data on the relative position of the nozzle 451 according to the rotation of the substrate W. Refer to Figure 8 , for example, when the processing start time is t0 and the processing end time is t i , and for the segmented time series data, when the position of the nozzle 451 at t0 is P1, the controller 30 obtains P2 as the position data of the nozzle 451 at t i .

[0115] The controller can obtain the count data per unit time (S2143). The controller 30 can obtain the count data per unit time based on the position data of the nozzle obtained in operation S2142. The count data in the per-unit-time data can be data on the number of times the nozzle 451 passes through multiple unit areas on the substrate per unit time. Here, the multiple unit areas on the substrate can be coordinates on the substrate associated with the multiple unit areas on the substrate.

[0116] Based on the count data per unit time, the controller can obtain the processing data per unit time (S2144). The processing data per unit time can be data representing the time for the nozzle 451 to process the substrate for multiple unit areas on the substrate per unit time. The time for the nozzle 451 to process the substrate can be the time when the nozzle 451 overlaps with the substrate.

[0117] In an exemplary embodiment, when the injection amount data of the nozzle 451 is further provided to the controller 30 in S1000, the controller 30 can further obtain the hitting force data of the nozzle 415 per unit time based on the processing data per unit time and the injection amount data. The hitting force data per unit time can be data representing the amount of liquid injected by the nozzle 451 into each segmented area on the substrate per unit time.

[0118] The controller compares the total processing time with the processing end time of the segmented time series data (S2145). When the total processing time is the same as the processing end time of the segmented time series data (Yes in S2145), the controller 30 can obtain the count data in the total processing time (S2146). The count data in the total processing time can be data on the number of times the nozzle 451 passes through multiple unit areas during the total processing time.

[0119] The controller 30 can obtain the count data in the total processing time by summing the count data in multiple unit times. For example, the controller 30 can obtain the count data in the total processing time by summing the count data in N unit times.

[0120] Reference Figure 9 , for example, the count data in the total processing time can be data in which regions of the substrate are marked with different colors based on the number of times the substrate nozzle 451 passes through each of a plurality of unit regions, and can include cross-sectional data (D1).

[0121] The controller can acquire the processing data in the total processing time (S2147). Here, the processing data in the total processing time can be data regarding the time for the nozzle 451 to process a plurality of unit regions during the total processing time. The controller 30 can acquire the processing data in the total processing time by summing the processing data in a plurality of unit times. For example, the controller 30 can acquire the processing data in the total processing time by summing the processing data in N unit times.

[0122] Reference Figure 10 , for example, the second processing data can be data in which regions of the substrate are marked with different colors based on the time for the substrate nozzle 451 to process each of a plurality of unit regions, and can include cross-sectional data D2.

[0123] In an exemplary embodiment, in S2144, when the controller 30 has acquired the impact force data in a unit time, the controller 30 can further acquire the impact force data in the total processing time. The impact force data in the total processing time can be data regarding the amount of liquid ejected by the nozzle 451 into each of a plurality of unit regions during the total processing time. The controller 30 can acquire the impact force data in the total processing time by summing the impact force data from a plurality of unit times.

[0124] Refer again to Figure 7 , when the total processing time is the same as the processing end time of the segmented time series data (No in S2145), the controller 30 can return to S2141 to acquire the conversion coordinates in a unit time.

[0125] Refer again to Figure 4 , the controller can determine the appropriateness of the initial scheme (S2200). A method for the controller 30 to determine the appropriateness of the initial scheme will be described below.

[0126] Figure 11 is a flowchart of a method for determining the appropriateness of an initial scheme according to an exemplary embodiment of the present invention.

[0127] Reference Figure 11, the controller 30 can determine whether the initial scheme is appropriate based on the processed data (S2210). The controller 30 can determine whether the initial scheme is appropriate based on the processed data in the total processing time obtained in operation S2146. The controller 30 can extract, from multiple regions on the substrate, regions whose processing time is within a preset time range. When the number of the extracted regions is equal to or greater than a preset value, the controller 30 can determine that the initial scheme is appropriate.

[0128] When the initial scheme is determined to be appropriate (Yes in S2210), the controller 30 can terminate the determination of the appropriateness of the initial scheme.

[0129] When the initial scheme is determined to be inappropriate (No in S2210), the controller 30 can modify the initial scheme to create a modified scheme (S2220). The controller 30 can create a modified scheme by changing at least one of the multiple data included in the initial scheme.

[0130] In addition, the controller 30 can determine the appropriateness of the modified scheme via the above operations S2100 and S2200. When the modified scheme is inappropriate, the controller 30 can recreate the modified scheme and determine the appropriateness of the recreated modified scheme via the above operations S2100 and S2200.

[0131] Refer again to Figure 3 , the controller can instruct the substrate processing apparatus to perform processing on the substrate (S3000). The controller 30 can instruct the substrate processing apparatus to perform processing on the substrate W based on the initial scheme or the modified scheme. For example, the controller 30 can instruct the liquid processing chamber 400 to perform processing on the substrate W.

[0132] Figure 12 is a diagram showing the effects of the substrate processing method according to an exemplary embodiment of the present invention.

[0133] Figure 12 is a graph for comparing the nozzle processing time at each substrate position when following the existing substrate processing method and the nozzle processing time at each substrate position when following the substrate processing method according to an exemplary embodiment of the present invention. Here, the case of following the substrate processing method according to an exemplary embodiment of the present invention can be a case where the optimal scheme (e.g., the modified scheme) is obtained by performing verification of the scheme using the above method.

[0134] Refer to Figure 12, it can be seen that in the existing substrate processing method, the processing time of the nozzle is not constant for each substrate position because the processing time of the nozzle decreases towards the periphery of the substrate. However, in the substrate processing method according to an exemplary embodiment of the present invention, the processing time of the nozzle is constant for each substrate position compared to the existing substrate processing method.

[0135] Figure 13 is a cross-sectional view of a substrate processing apparatus according to a second exemplary embodiment of the present invention.

[0136] Reference Figure 13 , a substrate processing apparatus 2 according to another exemplary embodiment of the present invention may include a cleaning chamber 1000 and a controller 2000. The cleaning chamber 1000 may physically clean the substrate W. The cleaning chamber 1000 may include a housing 410, a support unit 420, a bowl 430, a lifting unit 440, and a cleaning unit 1100. The cleaning unit 1100 may clean the substrate W. The cleaning unit 1100 may include a brush 1110, an arm 1120, a moving shaft 1130, and a moving driver 1140. The brush 1110 may be a processing component and may be coupled to the arm 1120. When viewed from below, the cross-section of the brush 1111 may be one of circular, elliptical, hollow, or polygonal. The arm 1120, the moving shaft 1130, and the moving driver 1140 may be the same as Figure 2 the arm 452, the moving shaft 453, and the moving driver 454. In addition, the configuration of the controller 2000 may be the same as Figure 2 the controller 30. In this case, the initial scheme in Table 1 may further include information about the moving speed of the brush and the contact area between the brush and the substrate.

[0137] The controller 2000 may control the substrate processing apparatus 2 in the manner described in Figures 2 to 12 . That is, the controller 2000 may control the substrate processing apparatus 2 such that the brush 1111 cleans the substrate W regardless of the position of the substrate W.

[0138] Figure 14 is a cross-sectional view of a substrate processing apparatus according to a third exemplary embodiment of the present invention.

[0139] Reference Figure 14 , a substrate processing apparatus 3 according to yet another exemplary embodiment of the present invention may include an ultrasonic chamber 3000 and a controller 4000. The ultrasonic chamber 3000 may include a housing 410, a support unit 420, a bowl 430, a lifting unit 440, an ultrasonic supply unit 3100, and a nozzle standby cup 460.

[0140] The ultrasonic unit 3100 can apply ultrasonic waves to the substrate W. Here, a liquid film can be formed on the substrate W. The ultrasonic unit 3100 can include an ultrasonic nozzle 3110, an arm 3120, a moving shaft 3130, and a moving driver 3140. The ultrasonic nozzle 3110 can be a processing component and can be coupled to the arm 3120. When viewed from below, the cross-section of the ultrasonic nozzle 3110 can be one of circular, elliptical, hollow, or polygonal. The arm 3120, the moving shaft 3130, and the moving driver 3140 can be the same as Figure 2 the arm 452, the moving shaft 453, and the moving driver 454 of Figure 2 In addition, the configuration of the controller 4000 can be the same as that of the controller 30 of

[0141] The controller 4000 can control the substrate processing apparatus 3 in the manner described in Figures 2 to 12 That is, the controller 4000 can control the substrate processing apparatus 3 such that the ultrasonic nozzle 3110 of the substrate processing apparatus 3 can provide ultrasonic waves to the substrate W regardless of the position of the substrate W.

[0142] Figure 15 is a cross-sectional view of a substrate processing apparatus according to a fourth exemplary embodiment of the present invention.

[0143] A substrate processing apparatus 4 according to another exemplary embodiment of the present invention can include a heating chamber 5000 and a controller 8000. The heating chamber 5000 can include a housing 410, a support unit 420, a bowl 430, a lifting unit 440, and a heating unit 5100.

[0144] The heating unit 5100 can provide heat to the substrate W to heat the substrate W. The heating unit 5100 can include a heater 5110, an arm 5120, a moving shaft 5130, and a moving driver 5140. The heater 5110 can be a processing component and can be coupled to the arm 3120. When viewed from below, the cross-section of the heater 5110 can be one of circular, elliptical, hollow, or polygonal. The arm 5120, the moving shaft 5130, and the moving driver 5140 can be the same as Figure 2 the arm 452, the moving shaft 453, and the moving driver 454 of Figure 2 In addition, the configuration of the controller 6000 can be the same as that of the controller 30 of

[0145] The controller 6000 can control in the manner described in Figures 2 to 12Control the substrate processing apparatus 3 in the manner described in []. In other words, the controller 6000 may control the substrate processing apparatus 3 such that the heater 5110 of the substrate processing apparatus 3 can heat the substrate W regardless of the position of the substrate W.

[0146] Figure 16 is a cross-sectional view of a substrate processing apparatus according to a fifth exemplary embodiment of the present invention.

[0147] Refer to Figure 16 , a substrate processing apparatus 5 according to another exemplary embodiment of the present invention may include a liquid processing chamber 7000 and a controller 8000. The liquid processing chamber 7000 may include a housing 610, a support unit 620, a bowl 630, a lifting unit 640, a liquid supply unit 650, a nozzle standby cup 660, and a lamp unit 7100.

[0148] The lamp unit 7100 may increase the temperature of the substrate surface (photoresist) during the substrate surface treatment process and emit light onto the substrate to react with the ozone treatment fluid and activate OH radicals. The lamp unit 7100 may include a light source 7110, an arm 7120, a moving shaft 5130, and a moving driver 7140. The light source 7110 may be a processing component and may be coupled to the arm 7120. When viewed from below, the cross-section of the lamp 110 may be one of a circle, an ellipse, a hollow shape, or a polygon. The arm 7120, the moving shaft 7130, and the moving driver 7140 may be the same as Figure 2 the arm 452, the moving shaft 453, and the moving driver 454 of []. In addition, the configuration of the controller 8000 may be the same as Figure 2 the controller 50 of []. In this case, the initial scheme may further include information about the intensity of the light emitted by the light source.

[0149] The controller 8000 may control the substrate processing apparatus 5 in the manner described in Figures 2 to 12 . In other words, the controller 8000 may control the substrate processing apparatus 5 such that the light source 7110 of the substrate processing apparatus 5 can irradiate the substrate W regardless of the position of the substrate W.

[0150] The foregoing detailed description illustrates the present invention. In addition, the above is an illustrative description of the preferred exemplary embodiments of the present invention, and the present invention is intended for various other combinations, modifications, and environments. That is, within the scope of the concept of the present invention disclosed herein (which scope is equivalent to the written disclosure) and / or within the scope of the skill or knowledge in the art, changes or modifications are possible. The foregoing exemplary embodiments describe the best state for implementing the technical spirit of the present invention, and various changes required for the specific application fields and uses of the present invention are possible. Therefore, the foregoing detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the appended claims should be construed to also include other exemplary embodiments.

Claims

1. A method for processing a substrate, the method comprising: a substrate processing operation in which an arm having a processing component mounted thereon is moved over the substrate while processing the substrate with the processing component being rotated relative to the substrate according to a processing recipe; as well as a verification operation, verifying the received initial plan for the substrate processing operation before the substrate processing operation, The verification operation includes: an inspection operation of dividing an area on the substrate into a plurality of unit areas and inspecting a processing time during which each of the plurality of unit areas is directly processed by the processing component for a set time; as well as A determination operation is performed to determine whether the processing time in each of the plurality of unit areas inspected in the inspection operation is appropriate.

2. The method of claim 1, wherein the set time is a total time spent processing the substrate in the substrate processing operation.

3. The method according to claim 1, further comprising: receiving the initial plan, The checking operation is performed by performing a simulation using a plurality of input factors included in the initial scenario.

4. The method according to claim 1, wherein the determining operation comprises: When the processing time between the plurality of unit areas is within a set range, it is determined that the initial scheme is appropriate, and the substrate processing operation is performed by using the initial scheme as the processing scheme.

5. The method according to claim 1, wherein the determining operation comprises: a scheme modification operation, when the processing time between the plurality of unit areas is outside the set range, determining that the initial scheme is inappropriate, and modifying the initial scheme to create a modified scheme; as well as Verify the operation, verify the modification scheme, and The substrate processing operation includes processing the substrate by using the modification recipe as the processing recipe.

6. The method according to claim 1, wherein the processing part comprises a nozzle for discharging a processing liquid onto the substrate or a nozzle for spraying a liquid onto the substrate in a mist state, and The initialization plan includes information about the amount of treatment liquid discharged from the nozzle.

7. The method of claim 1, wherein the processing member comprises a brush for cleaning the substrate by physical contact with the substrate, and The initial solution includes information about the moving speed of the brush, the contact area between the brush and the substrate.

8. The method according to claim 1, wherein the processing unit comprises an ultrasonic nozzle for applying ultrasonic waves to the liquid film formed on the substrate, and The initial plan includes information on an operation time of the ultrasonic nozzle or an application amount of ultrasonic waves of the ultrasonic nozzle.

9. The method of claim 1, wherein the processing component comprises a light source for emitting light onto the substrate, and The initial scenario comprises information about the intensity of the light emitted by the light source.

10. The method of claim 1, wherein the processing component comprises a heater for providing heat to the substrate, and The initialization scheme includes information about the temperature of heat provided by the heater to the substrate.

11. The method of claim 1, wherein the processing member has a circular, annular, elliptical or polygonal shape when viewed from below.

12. A method for processing a substrate, the method comprising: receiving an initial plan, the initial plan comprising substrate speed data regarding a rotation speed of the substrate, process data regarding a treatment process of the substrate, and data regarding a treatment unit for treating the substrate; as well as performing verification of said initial scheme, The verification of performing the initial solution includes: acquiring processing data, the processing data being data on a time for the processing unit to process the substrate through a plurality of unit areas on the substrate based on the initial scheme; as well as The appropriateness of the initial solution is determined based on the processed data.

13. The method according to claim 12, wherein the process data comprises first acceleration time data and processing time data, the first acceleration time data being data related to time taken to accelerate the rotation speed of the substrate from a first rotation speed to a second rotation speed, and the processing time data being data related to time taken to process the substrate, and The data about the processing unit includes: target location data regarding a target location on the substrate of the processing unit; speed data regarding a set speed at which the processing unit moves to the target position; second acceleration time data, which is data on the time taken for the processing unit to accelerate to the set speed; second deceleration time data, which is data on the time taken for the processing unit to stop at the set speed; as well as Waiting time data, which is data about the time the processing unit stays at the target location.

14. The method according to claim 12, wherein obtaining the processing data comprises: converting the data contained in the initial scheme into time series data; Segmenting the time series data based on unit time; Based on the segmented time series data, obtaining count data, the count data being data of the number of times the processing unit passes through a plurality of unit regions on the substrate; as well as The processing data is obtained based on the count data.

15. The method of claim 12, wherein determining the appropriateness of the initial solution based on the processed data comprises: Based on the processing data, obtaining a plurality of unit areas in which the processing time is equal to or longer than a preset time among the plurality of unit areas; as well as The appropriateness of the initial scheme is determined based on whether a ratio of the plurality of unit areas in which the processing time is equal to or longer than the preset time is equal to or greater than a preset value.

16. The method according to claim 12, further comprising: receiving ejection amount data, the ejection amount data being data on an amount of a processing liquid ejected by the processing unit based on a position of the substrate; as well as Hitting force data, which is data on the amount by which the processing unit ejects the processing liquid onto the substrate through a plurality of regions on the substrate, is obtained based on the processing data and the ejection amount data.

17. The method of claim 16, wherein determining the appropriateness of the initial solution based on the processing data comprises determining the appropriateness of the initial solution based on the processing data and the impact force data.

18. A method for processing a substrate, the method comprising: Receive initial proposal; a substrate processing operation in which an arm having a processing component mounted thereon is moved over the substrate while processing the substrate with the processing component being rotated relative to the substrate according to a processing recipe; as well as a verification operation, verifying the received initial plan for the substrate processing operation before the substrate processing operation, The verification operation includes: checking operation, dividing the area on the substrate into a plurality of unit areas, and checking a processing time, for which each of the plurality of unit areas is directly processed by the processing component for a set time; as well as a determining operation of determining whether the processing time in each of the plurality of unit areas inspected in the inspecting operation is appropriate, The settling time is the total time spent processing the substrate in the substrate processing operation, performing the checking operation by simulation using a plurality of input factors included in the initial scenario, and The determining operation includes determining that the initial solution is appropriate when the processing time between the plurality of unit areas is within a set range, and determining that the initial solution is inappropriate when the processing time between the plurality of unit areas is outside the set range.

19. The method of claim 18, wherein the processing component comprises: a brush for cleaning the substrate by physical contact with the substrate; a nozzle for discharging a processing liquid onto the substrate; an ultrasonic nozzle for applying ultrasonic waves to a liquid film formed on the substrate; a light source for emitting light onto the substrate; and a heater for providing heat to the substrate; or a nozzle for spraying liquid onto the substrate in a mist state, and When viewed from below, the processing member has a circular, annular, elliptical or polygonal shape.

20. The method of claim 18, wherein the determining operation further comprises: When it is determined that the initial solution is not suitable, modifying the initial solution to create a modified solution; as well as Verify the modification, and The substrate processing operation includes processing the substrate by using the initial protocol or the modified protocol as the processing protocol.

Images