Novel IC chip packaging structure

Abstract

The invention discloses a novel IC chip packaging structure, and belongs to the technical field of semiconductor packaging, the novel IC chip packaging structure comprises a wafer, conductive blocks, pins, wires, heat conduction blocks, a substrate, pressing blocks and limiting blocks, the wafer is placed on the upper surface of the substrate, rectangular grooves are formed in the upper surfaces of the left side and the right side of the substrate, and the heat conduction blocks are installed in the substrate; the upper surface of one end of the heat conduction block is in contact with the bottom surface of the wafer, the conductive blocks are installed in the substrate, the conductive blocks are connected with the wafer through wires, the limiting blocks are arranged in pairs and installed above the substrate, the limiting blocks are pressed above the conductive blocks, the pressing blocks are arranged in pairs and arranged above the substrate, one end of each pressing block is inserted into the corresponding limiting block, and the other end of each pressing block is inserted into the corresponding conductive block. A plurality of insertion holes are formed between the bottom of the pressing block and the rectangular groove, and one ends of the pins are inserted into the insertion holes. The problems that in the prior art, due to the fact that a packaging structure is poor in heat dissipation and poor in pin connection effect, working efficiency is affected, and maintenance cost is high are solved. And the heat dissipation effect and the assembly efficiency are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and particularly to a novel IC chip packaging structure. Background Art

[0002] With the rapid development of information technology, the requirements for the integration density and performance of integrated circuit (IC) chips are increasing day by day.

[0003] Traditional two-dimensional IC chip packaging structures are difficult to meet the requirements of current high-density and high-performance electronic systems. Three-dimensional (3D) integration technology realizes higher integration density and more compact packaging volume by stacking multiple IC chips vertically. However, existing three-dimensional integrated IC chip packaging structures still face many challenges in aspects such as signal transmission, heat dissipation, and manufacturing complexity. Moreover, for the packaging structures in the prior art, the connection method of pins mostly adopts glue connection. This glue adhesion method has two disadvantages. First, during the use of the IC packaging structure, certain heat will be released, which will cause the glue to melt, and long-term use is likely to cause the problem of pin de-bonding and dropping. The second problem is that for the glued pins, it is very difficult to remove the pins for replacement. This leads to the situation that if one pin is damaged, the IC chip cannot operate normally, and the pins are not easy to replace, and remanufacturing the packaging structure will increase the time cost and material cost.

[0004] Therefore, how to provide a novel IC chip packaging structure to solve the defects of existing IC packaging structures is a technical problem that those skilled in the art urgently need to solve. Summary of the Invention

[0005] For this reason, the present invention provides a novel IC chip packaging structure to solve the problems of poor heat dissipation of the packaging structure and poor pin connection effect in the prior art, which lead to low work efficiency and high maintenance cost.

[0006] To achieve the above object, the present invention provides the following technical solutions: The present invention discloses a novel IC chip packaging structure, including: A substrate, on the upper surface of which a wafer is placed, and rectangular grooves are opened on the upper surfaces of the left and right sides of the substrate; A plurality of heat-conducting blocks, installed in the substrate, and the upper surface of one end of the heat-conducting block is in contact with the bottom surface of the wafer; A plurality of conductive blocks, installed in the substrate, and the conductive blocks are connected to the wafer by wires; Limit blocks, arranged in pairs, installed above the substrate, and the limit blocks press on the conductive blocks; The briquettes are arranged in pairs and are disposed above the substrate. One end of each briquette is inserted into the limiting block, a part of each briquette presses above the conductive block, and a plurality of jacks are formed between the bottom of each briquette and the rectangular groove. A plurality of pins, one end of each pin is inserted into the jacks.

[0007] In a possible implementation manner, plastic encapsulation shells are connected to the upper and lower ends of the outer side of the briquette, and an epoxy resin layer is arranged between the plastic encapsulation shell and the substrate.

[0008] In a possible implementation manner, a plurality of L-shaped grooves are formed in the substrate, heat conduction blocks are installed in the L-shaped grooves, a rectangular hole is formed in the upper surface of the substrate, the rectangular hole is communicated with the rectangular groove, a conductive block is installed in the rectangular hole, a plurality of limiting top blocks are arranged in the rectangular groove, and a plurality of T-shaped blocks are installed on the upper surface of the substrate.

[0009] In a possible implementation manner, a plurality of installation grooves are formed in the outer surface of the limiting block, one end of the briquette is inserted into the installation groove, and a limiting block is arranged on the upper surface of the installation groove.

[0010] In a possible implementation manner, the briquette includes: A block body, a plurality of insertion blocks are installed on one end surface of the block body, an arc groove is formed on the upper surface of the insertion block, and the insertion block is inserted into the installation groove; An extension block, which is installed on the other end surface of the block body, the extension block is arranged on the opposite side of the insertion block, and grooves are formed on the upper and lower surfaces of the extension block; A plurality of connection grooves are formed in the bottom surface of the block body, and limiting members are installed in the connection grooves.

[0011] In a possible implementation manner, the limiting member includes: A connecting rod, which is installed on the top surface of the connection groove, and a disc is installed at the bottom of the connecting rod; A limiting sphere, which is a solid structure, a displacement groove is formed in the limiting sphere, a limiting groove is formed at the top of the limiting sphere, the limiting groove is communicated with the displacement groove, and the disc is in transmission connection in the displacement groove.

[0012] In a possible implementation manner, an upper limiting hole is formed in the top surface of one end of the pin, and a plurality of lower limiting holes are formed in the bottom surface of one end of the pin, and the upper limiting hole is arranged above the lower limiting holes.

[0013] In a possible implementation manner, a T-shaped groove is further formed in the block body.

[0014] In a possible implementation manner, the heat conduction block is made of a metal material.

[0015] In the present invention, a heat-conducting block is installed on a substrate, and then heat transfer is carried out by using the contact between the heat-conducting block and the wafer. The heat-conducting block is used to achieve rapid heat dissipation of the wafer, preventing the wafer temperature from being too high and affecting its working efficiency. Moreover, by using the thermal expansion deformation of the heat-conducting block, the heat-conducting block can be tightly connected to the substrate, preventing the heat-conducting block from falling off and affecting the heat-conducting effect. Not only that, by using the insertion holes formed between the pressing block and the rectangular groove, and then using the insertion holes to achieve the plug-in connection between the substrate and the pins, not only can the same connection effect as that of gluing be generated, but also the replacement of the pins is made more convenient, and without the action of external force, the pins will not easily fall off. The setting of the limiting block can not only be used to determine the installation position of the pressing block, but also limit the pressing block, preventing the pressing block from falling off before plastic encapsulation. Description of the Drawings

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can be obtained according to the provided drawings.

[0017] The structures, proportions, sizes, etc. shown in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have technical essential significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0018] Figure 1 Is a three-dimensional view of the novel IC chip packaging structure provided by the present invention; Figure 2 Is a cross-sectional view of the epoxy resin layer provided by the present invention; Figure 3 Is a three-dimensional view of the substrate provided by the present invention; Figure 4 Is a three-dimensional view of the limiting block provided by the present invention; Figure 5 Is a cross-sectional view of the pressing block provided by the present invention; Figure 6 Is a cross-sectional view of the limiting member provided by the present invention; Figure 7 Is a cross-sectional view of the pin provided by the present invention; Figure 8 Is a cross-sectional view of the T-shaped groove provided by the present invention; In the figure: 1 is a wafer; 2 is a conductive block; 3 is a pin; 31 is a lower limit hole; 32 is an upper limit hole; 4 is a wire; 5 is a heat conducting block; 6 is a substrate; 61 is a limit top block; 62 is a rectangular hole; 63 is an L-shaped groove; 64 is a T-shaped block; 7 is a pressing block; 71 is a block body; 72 is a groove; 73 is an extension block; 74 is a connecting groove; 75 is a limiting member; 751 is a limiting sphere; 752 is a displacement groove; 753 is a disc; 754 is a connecting rod; 76 is an inserting block; 77 is a T-shaped groove; 8 is a limiting block; 81 is a mounting groove; 82 is a restricting block; 9 is an epoxy resin layer; 10 is a plastic encapsulation shell. Specific embodiments

[0019] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] Please refer to Figures 1 - 8 , and now a novel IC chip packaging structure disclosed by the present invention will be described. As Figure 1 , it includes a wafer 1, a conductive block 2, pins 3, wires 4, heat conducting blocks 5, a substrate 6, pressing blocks 7 and limiting blocks 8. The wafer 1 is placed on the upper surface of the substrate 6. Rectangular grooves are formed on the upper surfaces of the left and right sides of the substrate 6. A plurality of heat conducting blocks 5 are installed in the substrate 6. The upper surface of one end of the heat conducting block 5 is in contact with the bottom surface of the wafer 1. A plurality of conductive blocks 2 are installed in the substrate 6. The conductive blocks 2 and the wafer 1 are connected by wires 4. The limiting blocks 8 are arranged in pairs and installed above the substrate 6. The limiting blocks 8 press on the upper part of the conductive blocks 2. The pressing blocks 7 are arranged in pairs and are arranged above the substrate 6. One end of the pressing block 7 is inserted into the limiting block 8. A part of the pressing block 7 presses on the upper part of the conductive blocks 2. A plurality of jacks are formed between the bottom of the pressing block 7 and the rectangular groove. One end of a plurality of pins 3 is inserted into the jacks.

[0021] When the present invention is in use, the wafer 1 is installed on the substrate 6. After the wafer 1 is installed, a jack is formed between the bottom of the wafer 1 and one end of the L-shaped groove 63. The heat-conducting block 5 is of an L-shaped structure. The end of the long L-shaped rod is inserted into the jack, and the entire heat-conducting block 5 is stuck in the L-shaped groove 63. Then, a number of conductive blocks 2 are snap-fitted into the rectangular holes 62. After installation, the limiting block 8 is fixed above the substrate 6. After being fixed, the pressing block 7 can be slidably installed from the left and right sides by guiding the T-shaped block 64 on the substrate 6. Then, the insertion block 76 at the inner end of the pressing block 7 is inserted into the installation groove 81 of the limiting block 8. The T-shaped block 64 and the limiting block 82 are used to limit the pressing block 7 in the horizontal and vertical directions. After the pressing block 7 is installed, the end of the pin 3 with the upper limiting hole 32 and the lower limiting hole 31 is inserted into the jack formed by the pressing block 7 and the rectangular groove. During the insertion process, the end of the pin 3 will push the limiting sphere 751 to move upward along the connecting rod 754. Because there are two limits, namely the limiting member 75 and the limiting top block 61, after the limiting sphere 751 is displaced, only one limit takes effect, which facilitates the installation of the pin 3. When the limiting top block 61 abuts against the lower limiting hole 31 completely, the limiting sphere 751 will be aligned with the upper limiting hole 32. In this way, under the influence of the gravity of the limiting sphere 751 itself, it moves downward. After displacement, the bottom surface of the limiting sphere 751 will abut against the upper limiting hole 32. In this way, without applying an outward pulling force to the pin 3, the limiting sphere 751 and the limiting top block 61 can achieve the limiting effect on the pin 3. This not only facilitates the disassembly and installation of the pin, but also enables the replacement of the pin 3 more conveniently, with a better effect than glue connection. After the pins are installed, the plastic package shell 10 is connected. The plastic package shell 10 is divided into upper and lower parts. The two ends of the left and right side plates are respectively aligned with the grooves 72 of the insertion blocks 76 for installation. In this way, because the width of the plastic package shell 10 is fixed, if the two pressing blocks 7 are not symmetrically arranged and one of the pressing blocks 7 is offset a little, the width between the grooves 72 will increase and be greater than the width of the plastic package shell 10, which can quickly judge whether the pressing blocks 7 are installed in place, facilitating timely adjustment of the positions of each component before plastic encapsulation. At the same time, by using the above method, the plastic package shell 10 can be quickly positioned in the middle position during installation, improving the installation efficiency of the plastic package shell 10. When the plastic package shell 10 is installed on the pressing block 7, since the plastic package shell 10 has fixed length, width and height, after the plastic package shell 10 is installed, the plastic package shell 10 will limit the position of the pressing block 7 to prevent the pressing block 7 from being displaced during the plastic encapsulation process. After the plastic package shell 10 is installed, the hollow position between the inside of the plastic package shell 10 and the substrate 6 is subjected to a plastic encapsulation operation. After the plastic encapsulation is completed, further limit each unit and generate an epoxy resin layer 9. Before encapsulation with glue, the wafer 1 and the conductive block 2 are electrically connected by the wire 4. Both the conductive block 2 and the pin 3 are made of metal materials, and the electrical signal is transmitted through the conductivity of the metal.

[0022] Based on the previous embodiment, as Figure 2 , at the upper and lower ends on the outside of the briquette 7, a plastic package shell 10 is connected. An epoxy resin layer 9 is provided between the plastic package shell 10 and the substrate 6. After the plastic packaging is completed, the plastic package shell 10 will be removed. By utilizing the good physical properties of the epoxy resin layer 9, the entire packaging structure can be made resistant to high temperatures and collisions, giving the packaging structure a good service life. However, although the epoxy resin layer 9 has high-temperature resistance, its thermal conductivity is poor. Therefore, for the expansion solution of this packaging structure, the plastic package shell 10 is not provided with two pairs of identical structures up and down. The upper structure remains unchanged, while for the lower structure, its height is not the same as that of the upper part. Instead, the bottom surface is closely attached to the substrate 6, so that there is no gap between the bottom surface of the substrate and the bottom surface of the plastic package shell 10. In this way, after the encapsulation glue is completed and the plastic package shell 10 is removed, the bottom surface of the substrate 6 is completely exposed to the air, and the other end of the heat conduction block 5 is aligned with the bottom surface of the substrate 6. In this way, in the case where the epoxy resin layer 9 does not cover the bottom surface of the substrate 6, the heat conduction effect of the heat conduction block 5 can be utilized to achieve good heat dissipation when the wafer is working.

[0023] In a specific embodiment, as Figure 3 , several L-shaped grooves 63 are formed in the substrate 6. The heat conduction block 5 is installed in the L-shaped grooves 63. A rectangular hole 62 is formed on the upper surface of the substrate 6. The rectangular hole 62 is communicated with a rectangular groove. A conductive block 2 is installed in the rectangular hole 62. Several limiting top blocks 61 are arranged in the rectangular groove. Several T-shaped blocks 64 are installed on the upper surface of the substrate 6. For the packaging structure without the epoxy resin layer 9, the heat conduction block 5 can also be used to dissipate the heat at the connection position between the wafer 1 and the substrate 6. For the setting of the L-shaped grooves 63, it has a good limiting effect on the heat conduction block 5 itself. Since the heat conduction block 5 generally adopts a metal structure, when using the contact heat transfer with the wafer 1, while satisfying the transfer of the heat of the wafer 1, the heat conduction block 5 can also generate a certain degree of deformation due to its own thermal expansion effect after receiving heat, so that the heat conduction block 5 can be better stuck in the L-shaped grooves 63. Moreover, after the heat conduction block 5 is better restricted in the L-shaped grooves 63, it can be ensured that it does not fall off, thereby realizing continuous heat conduction for the wafer 1. The rectangular hole 62 is used to install the conductive block 2, and the width of the rectangular groove is smaller than that of the rectangular hole 62, so that the limiting of the conductive block 2 can be better realized. The setting of the limiting top blocks 61 can limit the position of the pin 3. For the T-shaped blocks 64, in addition to guiding the installation direction of the briquette 7, they can also limit the movement of the briquette 7 in the vertical direction.

[0024] In a specific embodiment, as Figure 4, a number of mounting grooves 81 are formed on the outer surface of the limit block 8. One end of the pressing block 7 is inserted into the mounting groove 81, and a limiting block 82 is arranged on the upper surface of the mounting groove 81. The mounting groove 81 is provided to guide the connection of the insertion block 76, and the limiting block 82 is provided to cooperate with the arc groove, which can limit the movement of the pressing block 7 in the horizontal direction. At the same time, by the extrusion of the mounting groove 81 and the conductive block 2 on the insertion block 76, the position of the pressing block 7 can be better limited to prevent its displacement in the horizontal direction.

[0025] In a specific embodiment, such as Figure 5 , the pressing block 7 includes a block body 71, a groove 72, an extension block 73, a connection groove 74, a limiting member 75 and an insertion block 76. A number of insertion blocks 76 are installed on one end surface of the block body 71. An arc groove is formed on the upper surface of the insertion block 76. The insertion block 76 is inserted into the mounting groove 81. The extension block 73 is installed on the other end surface of the block body 71. The extension block 73 is arranged on the opposite side of the insertion block 76. Grooves 72 are formed on the upper and lower surfaces of the extension block 73. A number of connection grooves 74 are formed on the bottom surface of the block body 71, and a limiting member 75 is installed in the connection groove 74. The groove 72 on the extension block 73 can guide the installation of the plastic package housing 10 and can determine the installation position of the plastic package housing 10. The connection groove 74 is provided to displace the limiting member 75, and the insertion block 76 is provided to guide the installation and limitation of the pressing block 7.

[0026] On the basis of the previous embodiment, such as Figure 6 , the limiting member 75 includes a limiting sphere 751, a displacement groove 752, a disc 753 and a connecting rod 754. The connecting rod 754 is installed on the top surface of the connection groove 74. The disc 753 is installed at the bottom of the connecting rod 754. The limiting sphere 751 is a solid structure. A displacement groove 752 is formed in the limiting sphere 751. A limiting groove is formed at the top of the limiting sphere 751. The limiting groove is communicated with the displacement groove 752. The disc 753 is drivingly connected in the displacement groove 752. The limiting sphere 751 itself is a solid structure and has a certain gravity. During the installation process of the guiding pin 3, under the action of the thrust, the limiting sphere 751 will be driven to move upward along the connecting rod 754. When the guiding pin 3 is installed in place, the limiting sphere 751 will face the upper limiting hole 32, and under the drive of gravity, the limiting sphere 751 will enter the upper limiting hole 32. The limiting sphere 751 cooperates with the limiting top block 61 to realize the limitation of the guiding pin 3. At the same time, by inserting the guiding pin 3 into the jack, a fixing effect similar to that of gluing is generated. However, compared with gluing, not only the gluing step is omitted, but also the problem of the guiding pin 3 falling off or the inconvenient disassembly of the guiding pin 3 can be avoided. The width of the limiting groove is smaller than that of the displacement groove 752. In this way, the disc 753 with the same diameter as the displacement groove 752 cannot enter the limiting groove, thereby realizing the limitation of the transmission of the limiting sphere 751.

[0027] In a specific embodiment, such as Figure 7 , a upper limit hole 32 is formed on the top surface of one end of the pin 3, and a plurality of lower limit holes 31 are formed on the bottom surface of one end of the pin 3. The upper limit hole 32 is arranged above the lower limit holes 31. The arrangement of the upper limit hole 32 and the lower limit holes 31 is to facilitate the positioning of the pin 3.

[0028] On the basis of the previous embodiment, such as Figure 8 , a T-shaped groove 77 is also formed in the block 71. The T-shaped groove 77 is used to cooperate with the T-shaped block 64. By using the T-shaped pattern, the vertical positioning of the pressing block 7 can be effectively realized.

[0029] In a specific embodiment, the heat conducting block 5 is made of a metal material. By utilizing the good heat conductivity and thermal expansion effect of the metal material, the heat conducting block 5 can better dissipate heat from the wafer 1, preventing problems that may affect its performance caused by the overheating of the wafer 1.

[0030] Although the present invention has been described in detail with general descriptions and specific embodiments above, on the basis of the present invention, some modifications or improvements can be made, which are obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection required by the present invention.

Claims

1. A novel IC chip packaging structure, characterized in that, Comprising: A substrate (6) with a wafer (1) placed on its upper surface, and rectangular grooves are formed on the upper surfaces of the left and right sides of the substrate (6); A plurality of heat-conducting blocks (5) installed in the substrate (6), with the upper surface of one end of the heat-conducting block (5) in contact with the bottom surface of the wafer (1); A plurality of conductive blocks (2) installed in the substrate (6), and the conductive blocks (2) are connected to the wafer (1) by wires (4); Limit blocks (8) arranged in pairs and installed above the substrate (6), with the limit blocks (8) pressing on the conductive blocks (2); Pressing blocks (7) arranged in pairs and provided above the substrate (6), one end of the pressing block (7) is inserted into the limit block (8), a part of the pressing block (7) presses on the conductive block (2), and a plurality of jacks are formed between the bottom of the pressing block (7) and the rectangular groove; A plurality of pins (3) with one end inserted into the jacks; 2. The novel IC chip packaging structure according to claim 1, wherein, The upper and lower ends of the outer side of the pressing block (7) are connected with a plastic package shell (10), and an epoxy resin layer (9) is arranged between the plastic package shell (10) and the substrate (6); 3. The novel IC chip packaging structure according to claim 1, characterized in that, A plurality of L-shaped grooves (63) are formed in the substrate (6), the heat-conducting blocks (5) are installed in the L-shaped grooves (63), a rectangular hole (62) is formed on the upper surface of the substrate (6), the rectangular hole (62) is communicated with the rectangular groove, the conductive block (2) is installed in the rectangular hole (62), a plurality of limit top blocks (61) are arranged in the rectangular groove, and a plurality of T-shaped blocks (64) are installed on the upper surface of the substrate (6); 4. The novel IC chip packaging structure according to claim 1, wherein, A plurality of installation grooves (81) are formed on the outer surface of the limit block (8), one end of the pressing block (7) is inserted into the installation groove (81), and a limiting block (82) is arranged on the upper surface of the installation groove (81); 5. The novel IC chip packaging structure according to claim 4, characterized in that, The pressing block (7) includes: A block body (71) with a plurality of insertion blocks (76) installed on one end surface, an arc groove is formed on the upper surface of the insertion block (76), and the insertion block (76) is inserted into the installation groove (81); An extension block (73) installed on the other end surface of the block body (71), the extension block (73) is arranged on the opposite side of the insertion block (76), and grooves (72) are formed on the upper and lower surfaces of the extension block (73); A plurality of connection grooves (74) are formed on the bottom surface of the block body (71), and a limiting member (75) is installed in the connection grooves (74); 6. The novel IC chip packaging structure according to claim 5, wherein, The limiting member (75) includes: A connecting rod (754) installed on the top surface of the connection groove (74), and a disc (753) is installed at the bottom of the connecting rod (754); A limiting sphere (751) which is a solid structure, a displacement groove (752) is formed in the limiting sphere (751), a limiting groove is formed at the top of the limiting sphere (751), the limiting groove is communicated with the displacement groove (752), and the disc (753) is in transmission connection in the displacement groove (752).

7. The novel IC chip packaging structure according to claim 1, characterized in that, An upper limit hole (32) is formed in the top surface of one end of the pin (3), and a plurality of lower limit holes (31) are formed in the bottom surface of one end of the pin (3), and the upper limit hole (32) is arranged above the lower limit hole (31).

8. The novel IC chip packaging structure according to claim 5, wherein, A T-shaped groove (77) is also formed in the block body (71).

9. The novel IC chip packaging structure according to claim 1, wherein, The heat conducting block (5) is made of a metal material.

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