Bonding method for electronic components and method for mass transfer of electronic components

Abstract

The invention discloses a method for bonding electronic components, which comprises the following steps of: providing a first substrate which is provided with a first upper surface and a first lower surface which are opposite to each other, and the first upper surface of the first substrate is provided with a plurality of electronic components which are arranged in a row or a row at intervals; a second substrate is provided, the second substrate is arranged below the first substrate, the second substrate is provided with a second upper surface and a second lower surface which are opposite to each other, and the first upper surface faces the second upper surface; and providing a laser device, and emitting linear laser on the first substrate to irradiate the plurality of electronic components which are positioned on the first upper surface of the first substrate and are arranged in a row or a row, the plurality of electronic components are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate.

Description

Technical Field

[0001] The present invention relates to a method for bonding electronic components and a method for transferring a large number of electronic components. Background Art

[0002] Light-emitting diodes have the advantages of active light emission, high brightness, energy saving, etc., and thus have been widely used in technical fields such as lighting, displays, projectors, etc. Moreover, micro light-emitting diode displays (Micro LED displays) have gradually become a new generation of display technology. However, a high-density (FHD: Full High Density) display has approximately 2 million pixels in 1920 rows by 1080 columns, and each pixel needs to be further divided into three sub-pixels of red, green, and blue. Therefore, a high-density light-emitting diode display (FHD LED Display) has a total of approximately 6 million LED dies. To cut and paste 6 million dies onto the substrate of the display panel, the key technology lies in how to accurately transfer a large number of micro light-emitting diodes to the substrate of the display panel and fix and bond them.

[0003] The conventional method for bonding electronic components mainly uses the reflow soldering method, in which the electronic components are soldered to a target substrate after the solder paste is heated and reflowed. However, the disadvantages of the reflow soldering method are that during the reflow process, there will be problems such as uneven heating causing the electronic components to drift, too much solder paste causing short circuits of the electronic components, too little solder paste causing open soldering, or too low reflow temperature causing cold soldering.

[0004] In addition, the conventional methods for transferring a large number of electronic components mainly include electrostatic transfer, magnetic transfer, micro-transfer printing, and fluid assembly. However, for these several methods of transferring a large number of electronic components, their transfer rates and yields still need to be further improved.

[0005] In view of this, a novel method for bonding electronic components and a method for transferring a large number of electronic components are eagerly awaited in the industry. Summary of the Invention

[0006] The present invention discloses a method for bonding electronic components, which is characterized by including the following steps: providing a first substrate having opposite first upper and first lower surfaces, wherein a plurality of electronic components are provided on the first upper surface of the first substrate, and the plurality of electronic components are spaced apart from each other and arranged in a row or a column; providing a second substrate and disposing the second substrate below the first substrate, the second substrate having opposite second upper and second lower surfaces, and the first upper surface facing the second upper surface; and providing a laser device that can emit a linear laser on the first substrate and cause the linear laser to irradiate the plurality of electronic components arranged in a row or a column on the first upper surface of the first substrate, and cause the plurality of electronic components to be peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate.

[0007] The foregoing method for bonding electronic components, wherein the plurality of electronic components are selected from a group consisting of one or more of a light-emitting diode, a laser diode, and a semiconductor component.

[0008] The foregoing method for bonding electronic components, wherein the semiconductor component is selected from a group consisting of a processor, a memory integrated circuit, a micro-component integrated circuit, a logic integrated circuit, and an analog integrated circuit.

[0009] The foregoing method for bonding electronic components, wherein the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

[0010] The foregoing method for bonding electronic components, wherein the laser device has a laser divergence angle θ, and the length of the linear laser can be controlled by adjusting the angle of the laser divergence angle θ.

[0011] The foregoing method for bonding electronic components, wherein the angle of the laser divergence angle θ is greater than or equal to one degree.

[0012] The foregoing method for bonding electronic components, wherein the laser device includes a laser light source and an optical component, and the laser emitted by the laser light source is converted into a linear laser by the optical component.

[0013] The foregoing method for bonding electronic components, wherein the optical component is a diffractive optical component and / or a refractive optical component and / or a reflective optical component.

[0014] The present invention discloses another bonding method for electronic components, which is characterized by including the following steps: providing a first substrate having opposite first upper and lower surfaces, wherein the first upper surface of the first substrate has a plurality of electronic components, and the plurality of electronic components are respectively arranged along a first direction and a second direction to form a first electronic component array formed by arranging M rows of electronic components multiplied by N columns of electronic components, where both M and N are natural numbers greater than 1; providing a second substrate and disposing the second substrate below the first substrate, the second substrate having opposite second upper and lower surfaces, and the first upper surface facing the second upper surface; and providing a laser device that can emit a linear laser on the first substrate and cause the linear laser to sequentially irradiate the plurality of electronic components in the P-th row or the Q-th column of the first electronic component array, and cause the plurality of electronic components in the P-th row or the Q-th column to be peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate. After all the plurality of electronic components in the first electronic component array are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate, a second electronic component array formed by arranging M rows of electronic components multiplied by N columns of electronic components can be formed on the second upper surface of the second substrate, where both P and Q are natural numbers, and 1 ≤ P ≤ M, 1 ≤ Q ≤ N.

[0015] The aforementioned another method for massive transfer of electronic components, wherein the plurality of electronic components are selected from a group consisting of one or more of light-emitting diodes, laser diodes, and semiconductor components.

[0016] The aforementioned another method for massive transfer of electronic components, wherein the semiconductor component is selected from a group consisting of a processor, a memory integrated circuit, a micro-component integrated circuit, a logic integrated circuit, and an analog integrated circuit.

[0017] The aforementioned another method for massive transfer of electronic components, wherein the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

[0018] The aforementioned another method for massive transfer of electronic components, wherein the laser device has a laser divergence angle θ, and the length of the linear laser can be controlled by adjusting the angle size of the laser divergence angle θ.

[0019] The aforementioned another method for massive transfer of electronic components, wherein the angle of the laser divergence angle θ is greater than or equal to one degree.

[0020] The aforesaid another method for transferring a large number of electronic components, wherein the laser device includes a laser light source and an optical component, and the laser emitted by the laser light source is converted into a linear laser by the optical component.

[0021] The aforesaid method for transferring a large number of electronic components, wherein the optical component is a diffractive optical component, and / or a refractive optical component, and / or a reflective optical component. Description of the Drawings

[0022] Figures 1A to 1D It is a method for bonding electronic components illustrated according to an embodiment of the present invention.

[0023] Figures 2A to 2F It is a method for transferring a large number of electronic components illustrated according to another embodiment of the present invention.

[0024] Among them, a brief description of the symbols in the drawings is as follows:

[0025] 10, 100 First substrate

[0026] 10A, 100A First upper surface

[0027] 10B, 100B First lower surface

[0028] 12, 120 Electronic component

[0029] 20, 200 Second substrate

[0030] 20A, 200A Second upper surface

[0031] 20B, 200B Second lower surface

[0032] 30, 300 Laser device

[0033] 31, 310 Laser light source

[0034] 32, 320 Optical component

[0035] 150 First electronic component matrix

[0036] 250 Second electronic component matrix

[0037] θ Laser divergence angle Detailed Description of the Invention

[0038] To make the description of the disclosure of the present invention more detailed and complete, the following provides an illustrative description of the embodiments and specific examples of the present invention; however, this is not the only form for implementing or applying the specific examples of the present invention. The various embodiments disclosed below can be combined or substituted with each other under beneficial circumstances, or other embodiments can be added to one embodiment without further record or explanation.

[0039] In the following description, many specific details will be described in detail to enable the reader to fully understand the following embodiments. However, the embodiments of the present invention can be practiced without such specific details. In other cases, to simplify the drawings, well-known structures and devices are only schematically shown in the figures.

[0040] Embodiment

[0041] Embodiment 1

[0042] First, please refer to Figure 1A . As Figure 1A shown, a first substrate 10 is provided. The first substrate 10 has opposite first upper surface 10A and first lower surface 10B. Among them, the first upper surface 10A of the first substrate 10 has a plurality of electronic components 12, and the plurality of electronic components 12 are spaced apart from each other and arranged in a column or a row. The plurality of electronic components 12 are selected from, for example but not limited to, a group composed of one or more light-emitting diodes, laser diodes, and semiconductor components, and the semiconductor components are selected from, for example but not limited to, a group composed of one processor, memory integrated circuit, micro-component integrated circuit, logic integrated circuit, and analog integrated circuit.

[0043] Second, please refer to Figure 1B . As Figure 1B shown, a second substrate 20 is provided, and the second substrate 20 is disposed below the first substrate 10. The second substrate 20 has opposite second upper surface 20A and second lower surface 20B, and the first upper surface 10A faces the second upper surface 20A. The second substrate 20 is, for example but not limited to, a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

[0044] Next, please refer to Figure 1C and Figure 1D . As Figure 1CAs shown, a laser device 30 is provided. The laser device 30 can emit a linear laser 35 onto the first substrate 10, and cause the linear laser 35 to irradiate the plurality of electronic components 12 arranged in a column or a row on the first upper surface 10A of the first substrate 10, and cause the plurality of electronic components 12 to be peeled off from the first upper surface 10A of the first substrate 10, and be bonded to the second upper surface 20A of the second substrate 20 as Figure 1D shown. The laser device 30 includes a laser light source 31 and an optical component 32, and the laser emitted by the laser light source 31 is converted into a linear laser 35 by the optical component 32. The optical component 32 is, for example but not limited to, a diffractive optical component, and / or a refractive optical component, and / or a reflective optical component. In addition, the aforementioned laser device 30 has a laser divergence angle θ, and the length of the linear laser 35 can be controlled by adjusting the angle size of the laser divergence angle θ. Among them, the angle of the laser divergence angle θ is, for example but not limited to, greater than or equal to one degree.

[0045] Embodiment 2

[0046] First, please refer to Figure 2A . As Figure 2A shown, a first substrate 100 is provided. The first substrate 100 has opposite first upper surface 100A and first lower surface 100B. Among them, the first upper surface 100A has a plurality of electronic components 120, and the plurality of electronic components 120 are respectively arranged along a first direction and a second direction, forming a first electronic component array 150 formed by arranging M rows of electronic components multiplied by N columns of electronic components, where both M and N are natural numbers greater than 1. The plurality of electronic components 120 are selected from, for example but not limited to, a group composed of one or more of light-emitting diodes, laser diodes, and semiconductor components, and the semiconductor components are selected from, for example but not limited to, a group composed of a processor, a memory integrated circuit, a micro-component integrated circuit, a logic integrated circuit, and an analog integrated circuit.

[0047] As Figure 2A shown, the first electronic component array 150 of Embodiment 2 is formed by arranging 8 rows of a plurality of electronic components 120 arranged along the X-axis direction and 5 columns of a plurality of electronic components 120 arranged along the Y-axis direction, that is, M = 8, N = 5, the first direction is the X-axis direction, and the second direction is the Y-axis direction. However, according to other embodiments of the present invention, M and N can also be other natural numbers greater than 1 respectively, and the first and second directions can also be changed to other set directions as needed.

[0048] Secondly, please refer to Figure 2B . As Figure 2BAs shown, a second substrate 200 is provided and disposed under the first substrate 100. The second substrate 200 has opposite second upper surface 200A and second lower surface 200B, and the first upper surface 100A faces the second upper surface 200A. The second substrate 200 is, for example but not limited to, a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

[0049] Next, please refer to Figures 2C to 2E . As Figures 2C to 2E shown, a laser device 300 is provided. The laser device 300 can emit a linear laser 350 onto the first substrate 100, and cause the linear laser 350 to sequentially irradiate the plurality of electronic components in the P-th row or the Q-th column of the first electronic component array 150, and cause the plurality of electronic components in the P-th row or the plurality of electronic components 120 in the Q-th column to be peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, where P and Q are natural numbers, and 1 ≤ P ≤ M, 1 ≤ Q ≤ N. The laser device 300 includes a laser light source 310 and an optical component 320, and the laser emitted by the laser light source 310 is converted into a linear laser 350 by the optical component 320. The optical component 320 is, for example but not limited to, a diffractive optical component, and / or a refractive optical component, and / or a reflective optical component. The aforementioned laser device 300 has a laser divergence angle θ, and the length of the linear laser 350 can be controlled by adjusting the angle of the laser divergence angle θ. Among them, the angle of the laser divergence angle θ is, for example but not limited to, greater than or equal to one degree.

[0050] As Figures 2C to 2EAs shown, in the second embodiment, the linear laser 350 irradiates the multiple electronic components 120 in the first row, the second row, …, the eighth row of the first electronic component array 150 in sequence along the X-axis direction, and the multiple electronic components 120 in the first row, the second row, …, the eighth row are sequentially peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, that is, P = 1, 2, …, 8. However, according to other embodiments of the present invention, the linear laser 350 may also be selected to irradiate the multiple electronic components 120 in the first column, the second column, …, the fifth column of the first electronic component array 150 in sequence along the Y-axis direction, and the multiple electronic components 120 in the first column, the second column, …, the fifth column are sequentially peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, that is, Q = 1, 2, …, 5.

[0051] Finally, please refer to Figure 2F . As Figure 2F shown, when all the multiple electronic components 120 in the first electronic component array 150 are peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, a second electronic component array 250 formed by arranging 8 rows of electronic components multiplied by 5 columns of electronic components can be formed on the second upper surface 200A of the second substrate 200 as shown in Figure 2F .

[0052] Although the present invention has been disclosed as above with embodiments, it is not intended to limit the present invention. Any person skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims.

Claims

1. A method for joining electronic components, characterized in that The following steps are involved: Providing a first substrate, the first substrate having a first upper surface and a first lower surface opposite to each other, wherein the first upper surface of the first substrate has a plurality of electronic components, the plurality of electronic components are spaced from each other and arranged in a row or a line; Providing a second substrate and disposing the second substrate below the first substrate, wherein the second substrate has a second upper surface and a second lower surface opposite to each other, and the first upper surface faces the second upper surface; and A laser device is provided, which can emit a linear laser on the first substrate, and make the linear laser irradiate the multiple electronic components located on the first upper surface of the first substrate and arranged in a row or a column, so that the multiple electronic components are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate. 2 . The method for bonding electronic components as claimed in claim 1 , wherein the plurality of electronic components are selected from one or more of the group consisting of light emitting diodes, laser diodes and semiconductor components.

3. The method for bonding electronic components as claimed in claim 2, wherein the semiconductor component is selected from a group consisting of a processor, a memory integrated circuit, a micro-component integrated circuit, a logic integrated circuit and an analog integrated circuit. 4 . The method for bonding electronic components as claimed in claim 1 , wherein the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board. 5 . The electronic component bonding method as claimed in claim 1 , wherein the laser device has a laser divergence angle θ, and the length of the linear laser can be controlled by adjusting the angle of the laser divergence angle θ.

6. The method for bonding electronic components according to claim 5, wherein: The laser divergence angle θ is greater than or equal to one degree. 7 . The electronic component bonding method according to claim 1 , wherein the laser device comprises a laser light source and an optical component, and the laser light emitted by the laser light source is converted into a linear laser light by the optical component.

8. The method for bonding electronic components according to claim 7, wherein the optical component is a diffractive optical component, and / or a refractive optical component, and / or a reflective optical component.

9. A method for mass transfer of electronic components, characterized in that The following steps are involved: A first substrate is provided, wherein the first substrate has a first upper surface and a first lower surface opposite to each other, wherein the first upper surface of the first substrate has a plurality of electronic components, and the plurality of electronic components are arranged along a first direction and a second direction respectively, forming a first electronic component array formed by arranging M rows of electronic components by N columns of electronic components, wherein M and N are both natural numbers greater than 1; Providing a second substrate and disposing the second substrate below the first substrate, wherein the second substrate has a second upper surface and a second lower surface opposite to each other, and the first upper surface faces the second upper surface; and A laser device is provided, which can emit a linear laser on the first substrate, and make the linear laser sequentially irradiate the multiple electronic components in the Pth row or the Qth column in the first electronic component array, so that the multiple electronic components in the Pth row or the Qth column are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate. When all the multiple electronic components in the first electronic component array are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate, a second electronic component array formed by arranging M rows of electronic components by N columns of electronic components can be formed on the second upper surface of the second substrate, wherein P and Q are natural numbers, and 1≦P≦M, 1≦Q≦N.

10. The method for mass transferring electronic components as claimed in claim 9, wherein the plurality of electronic components are selected from one or more of the group consisting of light emitting diodes, laser diodes and semiconductor components.

11. The method for mass transferring electronic components as claimed in claim 10, wherein the semiconductor components are selected from a group consisting of a processor, a memory integrated circuit, a micro-component integrated circuit, a logic integrated circuit and an analog integrated circuit. 12 . The method for mass transferring electronic components as claimed in claim 9 , wherein the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

13. The method for mass transfer of electronic components as claimed in claim 9, wherein the laser device has a laser divergence angle θ, and the length of the linear laser can be controlled by adjusting the angle of the laser divergence angle θ.

14. The method for mass transfer of electronic components as claimed in claim 13, wherein: The laser divergence angle θ is greater than or equal to one degree.

15. The method for mass transfer of electronic components according to any one of claims 9 to 14, wherein the laser device comprises a laser light source and an optical component, and the laser light emitted by the laser light source is converted into a linear laser light by the optical component.

16. The method for mass transfer of electronic components as claimed in claim 15, wherein the optical component is a diffractive optical component, and / or a refractive optical component, and / or a reflective optical component.

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