Display panel and display terminal
By setting a thermally conductive layer in the display panel to disperse the heat of the light emitting unit, the problem of heat accumulation in the micro semiconductor light emitting diode affecting the lifespan is solved, and a display effect with higher resolution and brightness is achieved.
Patent Information
- Application Number
- CN202510339175.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2025-07-01
AI Technical Summary
As the spacing between micro semiconductor light emitting diodes decreases, heat accumulation affects the life of the display panel.
A thermally conductive layer is provided between the light emitting layer and the color conversion layer, and the heat of the light emitting unit is dispersed through the thermally conductive layer to avoid heat concentration.
Effective heat dissipation, extend the life of the light emitting unit and color conversion part, and improve the overall performance of the display panel.
Smart Images

Figure CN120239396A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technologies, and particularly to a display panel and a display terminal. Background Art
[0002] With the development and maturity of display technologies, consumers have put forward higher requirements for the lifespan, resolution, and brightness of display panels. Micro semiconductor light-emitting diodes perform excellently in terms of brightness and lifespan, and can basically meet the requirements of products such as AR / VR.
[0003] However, with the further improvement of resolution, the spacing between micro semiconductor light-emitting diodes decreases. During operation, the heat generated by the micro semiconductor light-emitting diodes accumulates, which will affect the lifespan of the display panel.
[0004] Therefore, it is urgent to solve the above technical problems. Summary of the Invention
[0005] Embodiments of the present application provide a display panel and a display terminal, which improve the technical problem that as the resolution is further improved, the spacing between micro semiconductor light-emitting diodes decreases, and during operation, the heat generated by the micro semiconductor light-emitting diodes cannot be dissipated, which will affect the lifespan of the display panel.
[0006] To achieve the above object, according to the first aspect of the present application, a display panel is provided, including:
[0007] A substrate;
[0008] A light-emitting layer disposed on one side of the substrate, the light-emitting layer including a plurality of light-emitting units with the same light-emitting color;
[0009] A heat-conducting layer disposed on the side of the light-emitting layer facing away from the substrate;
[0010] A color conversion layer disposed on the side of the heat-conducting layer facing away from the substrate, the color conversion layer including a plurality of color conversion parts, one color conversion part corresponding to one light-emitting unit. The color conversion layer includes a barrier layer, the barrier layer is provided with a plurality of grooves, the color conversion parts are disposed in the grooves, the heat conductivity of the barrier layer is greater than that of the color conversion parts, and the barrier layer is in contact with the heat-conducting layer.
[0011] Optionally, the heat-conducting layer includes a first sub-part disposed opposite to the light-emitting unit and a second sub-part disposed between two adjacent first sub-parts;
[0012] Wherein, the light transmittance of the first sub-part is greater than that of the second sub-part.
[0013] Optionally, the thermal conductivity of the second sub-portion is greater than the thermal conductivity of the first sub-portion, and the retaining wall layer is disposed in contact with the second sub-portion.
[0014] Optionally, the display panel includes a dielectric layer, the dielectric layer is disposed between the light-emitting layer and the heat-conducting layer, and the dielectric layer is disposed in contact with both the light-emitting layer and the heat-conducting layer;
[0015] Wherein, the refractive index of the medium layer is smaller than the refractive index of the heat conducting layer.
[0016] Optionally, the light-emitting layer includes a filling portion disposed between two adjacent light-emitting units, and the filling portion is made of the same material as that of the dielectric layer.
[0017] Optionally, the color conversion layer further includes a protective layer disposed in the groove, the protective layer is located between the color conversion portion and the barrier layer, and the protective layer is located between the color conversion portion and the heat conductive layer.
[0018] Optionally, the display panel includes a reflective layer disposed on a side of the color conversion layer away from the substrate, and the color conversion portion includes a first conversion portion, a second conversion portion and a transparent portion;
[0019] The reflective layer is provided with an opening corresponding to the transparent portion, and the reflective layer is used to reflect light having the same color as the light emitting unit and transmit light having the same color as the first conversion portion and the second conversion portion.
[0020] Optionally, the reflective layer includes a first sublayer and a second sublayer that are alternately stacked, and the refractive index of the first sublayer is greater than the refractive index of the second sublayer.
[0021] Optionally, thermal conductivity of the protective layer corresponding to the first conversion portion and the second conversion portion is smaller than thermal conductivity of the protective layer corresponding to the transparent portion.
[0022] According to a second aspect of the present application, a display terminal is provided, comprising the above-mentioned display panel.
[0023] In the display panel of the embodiment of the present application, the color conversion part corresponds to the light-emitting unit. By setting a thermal conductive layer between the light-emitting layer and the color conversion layer, the heat of the light-emitting unit can be dispersed along the thermal conductive layer to avoid heat concentration and affect the life of the light-emitting unit or the color conversion part.
[0024] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.
[0026] To more fully understand the present application and its beneficial effects, the following will be described in conjunction with the accompanying drawings, where the same reference numerals in the following description represent the same parts.
[0027] Figure 1 is a top view structural schematic diagram of a display panel provided in an exemplary embodiment of the present disclosure;
[0028] Figure 2 is Figure 1 a cross-sectional structural schematic diagram at C-C in
[0029] Figure 3 is Figure 1 another cross-sectional structural schematic diagram at C-C in
[0030] Figures 4A to 4G is a process flow diagram of a display panel provided in an exemplary embodiment of the present disclosure;
[0031] Figure 5 is a structural schematic diagram of a display terminal provided in an exemplary embodiment of the present disclosure.
[0032] Explanation of reference numerals:
[0033] display panel 1, display area AA, non-display area NA, sub-pixel 11;
[0034] substrate 10;
[0035] light-emitting layer 20, light-emitting unit 21, filling part 22, epitaxial layer 20A;
[0036] thermal conduction layer 30, first sub-part 31, second sub-part 32;
[0037] color conversion layer 40, color conversion part 41, first conversion part 411, second conversion part 412, transparent part 413, barrier layer 42, protective layer 43;
[0038] dielectric layer 50;
[0039] reflective layer 60, first sub-layer 61, second sub-layer 62;
[0040] display terminal 2, terminal body 3. Detailed implementation manners
[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the protection scope of the present application.
[0042] To achieve the above object, according to the first aspect of the present application, as Figure 1 and Figure 2 shown, a display panel 1 is provided, which includes a substrate 10, a light-emitting layer 20, a heat-conducting layer 30, and a color conversion layer 40. The light-emitting layer 20 is disposed on one side of the substrate 10, and the light-emitting layer 20 includes a plurality of light-emitting units 21 with the same light-emitting color; the heat-conducting layer 30 is disposed on the side of the light-emitting layer 20 away from the substrate 10; the color conversion layer 40 is disposed on the side of the heat-conducting layer 30 away from the substrate 10, and the color conversion layer 40 includes a plurality of color conversion portions 41, and one color conversion portion 41 corresponds to one light-emitting unit 21.
[0043] The display panel 1 is a Mini-Led panel, a Micro-LED panel, etc. The resolution of the Micro-LED panel can be greater than 3000PPI, and the brightness can be greater than 5000nits, which can meet the display requirements of wearable consumer electronic products such as AR / VR.
[0044] As Figure 1 shown, the display panel 1 includes a display area AA and a non-display area NA disposed outside the display area AA. The display area AA may be provided with a plurality of sub-pixels 11, and the sub-pixels 11 may include red sub-pixels, green sub-pixels, and blue sub-pixels, so as to achieve color display. The non-display area NA may be provided with a driving circuit, such as a gate driving circuit, etc., and the driving circuit may provide driving signals for the sub-pixels 11.
[0045] The material of the substrate 10 may be a rigid substrate or a flexible substrate. The material of the rigid substrate may be a glass substrate, a quartz substrate, or a silicon wafer. The material of the flexible substrate may be one of colorless polyimide (PI), polycarbonate (PC), polynorbornene (PNB), and polyethylene terephthalate (PET), etc. A driving circuit may be provided on the substrate 10, and the driving circuit is used to control the light-emitting or non-light-emitting of the light-emitting unit 21.
[0046] As Figure 2As shown, the light-emitting layer 20 includes a plurality of light-emitting units 21 with the same light-emitting color, and one light-emitting unit 21 corresponds to one sub-pixel 11. The surface of the light-emitting unit 21 facing away from the substrate 10 is the light-emitting surface, and the light emitted by the light-emitting unit 21 exits from the light-emitting surface. The light-emitting color of the light-emitting unit 21 can be one of the three primary colors of light, and the three primary colors of light refer to red light, green light, and blue light. For example, the light-emitting color of all the light-emitting units 21 is red, or the light-emitting color of all the light-emitting units 21 is green, or the light-emitting color of all the light-emitting units 21 is blue.
[0047] In some embodiments, the light-emitting color of the light-emitting unit 21 can be a mixed color of two of the three primary colors of light.
[0048] In some embodiments, the light-emitting color of all the light-emitting units 21 can be white.
[0049] In some embodiments, the light-emitting unit 21 is a Mini-Led chip, a Micro-LED chip, etc. The size of the Mini-Led chip is usually between 50μm and 200μm. The size of the Micro-LED chip is usually less than 50μm. The small size of the light-emitting unit 21 can achieve a higher resolution.
[0050] By configuring the light-emitting layer 20 as light-emitting units 21 with the same light-emitting color, a monochromatic LED epitaxial wafer can be directly bonded to the substrate 10, and then the monochromatic LED epitaxial wafer can be patterned to form a plurality of independent light-emitting units 21. Compared with the solution of transferring a plurality of light-emitting units 21 with different colors to the substrate 10 by using a mass transfer process, the manufacturing process of the display panel 1 of the present application is simpler.
[0051] As Figure 2 shown, the color conversion layer 40 is used to convert the light of the monochromatic light-emitting unit 21 into colored light to achieve full-color display of the display panel 1.
[0052] In some embodiments, the material of the color conversion layer 40 includes quantum dot (Quantum Dot, QD) material. When a quantum dot is excited by external energy (light, electricity), it will emit light of a specific frequency, and the frequency of the emitted light will change with the change of the size of this quantum dot. Therefore, by adjusting the size of the quantum dot, the color of the light it emits can be controlled.
[0053] In some embodiments, the quantum dot material can include at least one of CdSe (cadmium selenide), CdS (cadmium sulfide), ZnSe (zinc selenide), ZnS (zinc sulfide), InP (indium phosphide), CdTe (cadmium telluride), ZnTe (zinc telluride), and AgInGaS (silver indium gallium sulfur) to form a core-shell structure or an alloy structure.
[0054] AsFigure 2 As shown, the color conversion unit 41 is used to adjust the light emission color of the light emitting unit 21 to full-color light. Specifically, a part of the color conversion unit 41 is used to adjust the light emission color of the light emitting unit 21 to red, another part of the color conversion unit 41 is used to adjust the light emission color of the light emitting unit 21 to green, and the remaining color conversion unit 41 is used to adjust the light emission color of the light emitting unit 21 to blue.
[0055] It should be noted that when the light emission color of the light emitting unit 21 is one of the primary colors of light, a part of the color conversion unit 41 can be set as a transparent material, so as not to change the light emission color of the light emitting unit 21; the other part of the color conversion is used to adjust the light emission colors of the remaining light emitting units 21 to the other two colors among the primary colors respectively.
[0056] Specifically, when the light emission color of the light emitting unit 21 is blue, a part of the color conversion unit 41 can be a transparent material, and the light emitted from the transparent material is still blue. The other part of the color conversion unit 41 is used to adjust the blue light to red light, and the remaining color conversion unit 41 is used to adjust the blue light to green light, so as to achieve full-color display.
[0057] As Figure 2 As shown, the heat conduction layer 30 is disposed between the light emitting layer 20 and the color conversion layer 40. When the light emitting unit 21 emits light, heat will be generated, and the accumulation of heat will affect the service lives of the light emitting unit 21 and the color conversion unit 41. By disposing the heat conduction layer 30 between the light emitting layer 20 and the color conversion layer 40, the heat conduction layer 30 can disperse the heat generated by the light emitting unit 21, avoid the accumulation of heat, and thus avoid the service lives of the light emitting unit 21 and the color conversion unit 41 being affected by heat.
[0058] In order to avoid the heat conduction layer 30 blocking the light emitted by the light emitting unit 21, the material of the heat conduction layer 30 is a transparent material.
[0059] In some embodiments, the material of the heat conduction layer 30 can be an organic material or an inorganic material. Organic materials include polyimide, transparent heat-conducting silica gel, etc., and inorganic materials include graphite, diamond, aluminum nitride, silicon carbide, etc. The material of the heat conduction layer 30 can also be a phase change material.
[0060] It should be noted that in order to avoid the heat conduction layer 30 blocking the light of the light emitting unit 21, the area of the heat conduction layer 30 directly opposite to the light emitting unit 21 is a light-transmitting material, and the area not directly opposite to the light emitting unit 21 can be a light-transmitting material or a non-light-transmitting material.
[0061] In some embodiments, the thickness of the heat conduction layer 30 can be 500 Å to 5000 Å. For example, the thickness of the heat conduction layer 30 can be 500 Å, 1000 Å, 1500 Å, 2000 Å, 2500 Å, 3000 Å, 3500 Å, 4000 Å, 4500 Å, 5000 Å, etc.
[0062] Optionally, as Figure 2 shown, the color conversion layer 40 includes a barrier layer 42. The barrier layer 42 is provided with a plurality of grooves, and the color conversion portions 41 are disposed in the grooves. The thermal conductivity of the barrier layer 42 is greater than that of the color conversion portion 41, and the barrier layer 42 is in contact with the thermal conductive layer 30.
[0063] The material of the barrier layer 42 may be a non-transmissive material, such as a metal material, etc. The metal material includes aluminum, silver, aluminum nitride, etc. The material of the barrier layer 42 being a non-transmissive material can avoid light crosstalk between two adjacent color conversion portions 41. The metal material is easy to pattern and can form grooves with smaller sizes. At the same time, the metal material has good thermal conductivity, which is convenient for heat dissipation.
[0064] The barrier layer 42 can be formed by physical vapor deposition (PVD). The grooves can be formed by a patterning process. The patterning process includes steps such as coating photoresist, exposure and development, etching, and removing photoresist.
[0065] In some embodiments, the thickness of the barrier layer 42 is greater than or equal to 1 micron. The grooves completely penetrate the barrier layer 42, which means that the depth of the grooves is equal to the thickness of the barrier layer 42.
[0066] As Figure 2 shown, one groove is correspondingly disposed with one light-emitting unit 21, and the color conversion portion 41 is disposed in the groove. In order to avoid the barrier layer 42 blocking the outgoing light of the light-emitting unit 21, the size of the groove can be larger than that of the light-emitting unit 21. That is to say, the area of the positive projection of the side wall of the groove on the light-emitting layer 20 is larger than the area of the light-emitting unit 21. The light emitted from the light-emitting unit 21 can be incident on the color conversion portion 41 in the groove, and then exit from the surface of the color conversion portion 41 facing away from the substrate 10.
[0067] In this embodiment, by setting the thermal conductivity of the barrier layer 42 to be greater than that of the color conversion portion 41 and the barrier layer 42 is in contact with the thermal conductive layer 30, the heat of the thermal conductive layer 30 can be transferred to the barrier layer 42, increasing the heat dissipation area and achieving uniform temperature.
[0068] In some embodiments, the size of the groove is less than 5 microns. The size of the groove refers to the size of the outer shape of the groove on the plane where the display surface is located. It should be noted that grooves with smaller sizes can be formed by using a patterning process on the metal film layer. The grooves can assist in patterning the color conversion layer 40 to form color conversion portions 41 with the same size as the grooves. Through the above settings, the problem that the material of the color conversion portion 41 is difficult to miniaturize can be overcome, thereby manufacturing a display panel 1 with a higher resolution (above 5000 PPI).
[0069] Specifically, the color conversion layer 40 is formed on the barrier layer 42. A part of the color conversion layer 40 is formed in the groove, and another part of the color conversion layer 40 is formed outside the groove. The material of the color conversion layer 40 in the groove is retained through the exposure and development process, and the material of the color conversion layer 40 in other areas is removed, thereby forming the color conversion part 41.
[0070] Optionally, Figure 3 shows Figure 1 Another schematic cross-sectional structure diagram at C-C in Figure 3 The display panel 1 in Figure 2 is different from the display panel 1 in Figure 3 in that the heat conduction layer 30. As
[0071] shown, the heat conduction layer 30 includes a first sub-part 31 disposed opposite to the light-emitting unit 21 and a second sub-part 32 disposed between two adjacent first sub-parts 31; wherein, the light transmittance of the first sub-part 31 is greater than that of the second sub-part 32.
[0072] In some other embodiments, the light transmittance of the first sub-part 31 may be equal to that of the second sub-part 32, that is, the first sub-part 31 and the second sub-part 32 may be made of the same material, thereby simplifying the manufacturing process of the display panel 1.
[0073] Optionally, as Figure 3 shown, the heat conductivity of the second sub-part 32 is greater than that of the first sub-part 31, and the barrier layer 42 is in contact with the second sub-part 32.
[0074] Since the first sub - part 31 is located between the light - emitting unit 21 and the color conversion unit 41, in order to reduce the risk of heat transfer from the light - emitting unit 21 to the color conversion unit 41 through the first sub - part 31, the thermal conductivity of the first sub - part 31 can be set to be less than that of the second sub - part 32. That is, the first sub - part 31 is less likely to conduct heat compared to the second sub - part 32, thereby reducing the heat conducted along the first sub - part 31 to the color conversion unit 41. At the same time, since the second sub - part 32 is more likely to conduct heat, the heat of the light - emitting unit 21 and / or the first sub - part 31 can be transferred to the barrier layer 42, thereby increasing the heat - dissipation area, achieving uniform temperature, and avoiding excessive local temperature.
[0075] In some embodiments, the material of the first sub - part can be a light - transmissive material such as polyimide, transparent thermally conductive silica gel, etc. Among them, the thermal conductivity of polyimide is about 0.1 watt per meter kelvin (W / (m·K)) to 0.3 watt per meter kelvin (W / (m·K)). The thermal conductivity of transparent thermally conductive silica gel is about between 1.0 watt per meter kelvin (W / (m·K)) and 11.0 watt per meter kelvin (W / (m·K)).
[0076] The material of the second sub - part can be a non - light - transmissive material such as a metal material, such as aluminum, silver, gold, copper, etc. The thermal conductivity of aluminum is 228 watt per meter kelvin (W / (m·K)), the thermal conductivity of silver is about 359 watt per meter kelvin (W / (m·K)), the thermal conductivity of gold is 317 watt per meter kelvin (W / (m·K)), and the thermal conductivity of copper is 401 W / (m·K).
[0077] By making the first sub - part a light - transmissive material and the material of the second sub - part a non - light - transmissive material, the light transmittance of the first sub - part 31 can be made greater than that of the second sub - part 32. At the same time, by making the thermal conductivity of the second sub - part 32 greater than that of the first sub - part 31, the heat of the light - emitting unit 21 can be more easily conducted to the second sub - part 32, avoiding excessive temperatures of the first sub - part 31 and the color conversion unit 41.
[0078] Optionally, as Figure 2 and Figure 3 shown, the display panel 1 includes a dielectric layer 50. The dielectric layer 50 is disposed between the light - emitting layer 20 and the thermal - conductive layer 30, and the dielectric layer 50 is in contact with both the light - emitting layer 20 and the thermal - conductive layer 30; wherein, the refractive index of the dielectric layer 50 is less than that of the thermal - conductive layer 30.
[0079] Light is refracted at the interface between the dielectric layer 50 and the thermal - conductive layer 30, and the refraction angle is less than the incident angle, thereby converging the light of the light - emitting unit 21, enabling the light to converge to the color conversion unit 41, reducing the light loss incident on the barrier layer 42, and thus improving the utilization rate of the light emitted by the light - emitting unit 21.
[0080] In some embodiments, the thickness of the dielectric layer 50 may be greater than or equal to 1000 angstroms, but is not limited thereto.
[0081] In some embodiments, the material of the dielectric layer 50 may be an inorganic insulating material, such as silicon nitride, silicon oxide, silicon oxynitride, etc.
[0082] Optionally, as Figure 2 and Figure 3 shown, the light-emitting layer 20 includes a filling portion 22 disposed between two adjacent light-emitting units 21, and the filling portion 22 has the same material as the dielectric layer 50.
[0083] After patterning the light-emitting layer 20 to form a plurality of independent light-emitting units 21, a trench is formed between two identical light-emitting units 21. To prevent the trench from affecting the formation of the color conversion layer 40, the trench can be filled with an inorganic insulating material, that is, a filling portion 22 is formed in the trench. By making the material of the filling portion 22 the same as that of the dielectric layer 50, the filling portion 22 and the dielectric layer 50 can be formed of the same material, thereby simplifying the manufacturing process of the display panel 1.
[0084] Optionally, as Figure 2 and Figure 3 shown, the color conversion layer 40 further includes a protective layer 43 disposed in the groove, the protective layer 43 is located between the color conversion portion 41 and the barrier layer 42, and the protective layer 43 is located between the color conversion portion 41 and the heat conducting layer 30.
[0085] The protective layer 43 can cover the side wall and the bottom of the groove to prevent the color conversion portion 41 from directly contacting the barrier layer 42. The protective layer 43 can protect the barrier layer 42 from being corroded by the material of the color conversion portion 41.
[0086] In some embodiments, the material of the protective layer 43 may be silicon oxide, aluminum oxide, etc.
[0087] In some embodiments, the thickness of the protective layer 43 is greater than or equal to 500 angstroms, but is not limited thereto.
[0088] The protective layer 43 can be formed by processes such as Physical Vapor Deposition (PVD), Atomic Layer Deposition (ALD), etc., but is not limited thereto.
[0089] Optionally, as Figure 2 and Figure 3As shown, the display panel 1 includes a reflective layer 60 disposed on a side of the color conversion layer 40 facing away from the substrate 10. The color conversion section 41 includes a first conversion section 411, a second conversion section 412, and a transparent section 413. Among them, the reflective layer 60 is provided with an opening corresponding to the transparent section 413. The reflective layer 60 is configured to reflect light having the same color as that of the light-emitting unit 21 and transmit light having the same color as that of the first conversion section 411 and the second conversion section 412.
[0090] The reflective layer 60 may be a Distributed Bragg Reflector (DBR). The Distributed Bragg Reflector can achieve a high reflectivity for specific wavelength light and a high transmittance for specific wavelength light.
[0091] As Figure 2 and Figure 3 shown, the reflective layer 60 is provided with a plurality of openings, and one opening corresponds to one transparent section 413. The light emitted from the transparent section 413 can exit through the opening without passing through the reflective layer 60.
[0092] In some embodiments, the light-emitting color of the light-emitting unit 21 may be blue. The first conversion section 411 may be configured to convert the color of the light emitted by the light-emitting unit 21 into red light. The second conversion section 412 may be configured to convert the color of the light emitted by the light-emitting unit 21 into green light. The color of the light emitted from the transparent section 413 remains unchanged and is still blue. The reflective layer 60 is configured to reflect light having the same color as that of the light-emitting unit 21 and transmit the light whose color has been converted by the first conversion section 411 and the second conversion section 412. That is to say, the red light emitted from the first conversion section 411 can pass through the reflective layer 60, the green light emitted from the second conversion section 412 can pass through the reflective layer 60, the blue light emitted from the first conversion section 411 and the second conversion section 412 will be reflected by the reflective layer 60, and the reflected blue light will be incident on the first conversion section 411 and the second conversion section 412 again and be respectively converted into red light and green light. Through the above arrangement, the blue light leaking from the first conversion section 411 and the second conversion section 412 can be reduced, the blue light can be reflected and reused, and the utilization rate of the blue light can be improved, thereby improving the brightness of the display panel 1.
[0093] It should be noted that when the light-emitting color of the light-emitting unit 21 is other colors, the principle of the action of the reflective layer 60 is similar, and will not be repeated here.
[0094] Optionally, as Figure 2 and Figure 3 shown, the reflective layer 60 includes a first sub-layer 61 and a second sub-layer 62 that are alternately stacked. The refractive index of the first sub-layer 61 is greater than that of the second sub-layer 62.
[0095] The first sub-layer 61 is a high refractive index material, and the second sub-layer 62 is a low refractive index material. The first sub-layer 61 and the second sub-layer 62 are alternately stacked.
[0096] In some embodiments, the combinations of high refractive index materials and low refractive index materials include but are not limited to: TiO2 / Al2O3, TiO2 / SiO2, Ta2O5 / Al2O3, or HfO2 / SiO2. In the above combinations, TiO2, Ta2O5, and HfO2 are high refractive index materials, and Al2O3 and SiO2 are low refractive index materials.
[0097] Optionally, as Figure 2 and Figure 3 shown, the thermal conductivities of the protective layers 43 corresponding to the first conversion part 411 and the second conversion part 412 are both less than the thermal conductivity of the protective layer 43 corresponding to the transparent part 413.
[0098] Since the first conversion part 411 and the second conversion part 412 are quantum dot materials, the heat resistance of the first conversion part 411 and the second conversion part 412 is worse than that of the transparent part 413. Therefore, in order to reduce the influence of the heat of the light-emitting unit 21 on the first conversion part 411 and the second conversion part 412, the thermal conductivity of the material of the protective layer 43 corresponding to the first conversion part 411 and the second conversion part 412 can be set to be lower than the thermal conductivity of the material of the protective layer 43 corresponding to the transparent part 413, so that the heat is not easily conducted to the first conversion part 411 and the second conversion part 412, and the overall lifespan of the color conversion layer 40 is improved.
[0099] Optionally, the materials of the first conversion part 411 and the second conversion part 412 are respectively one of a red quantum dot material and a green quantum dot material. Since the heat resistance of the red quantum dot material is better than that of the green quantum dot material, the thermal conductivity of the protective layer 43 corresponding to the green quantum dot material can be made less than the thermal conductivity of the protective layer 43 corresponding to the red quantum dot material, so that the heat of the light-emitting unit 21 is not easily conducted to the green quantum dot material, thereby improving the overall lifespan of the color conversion layer 40.
[0100] Next, in conjunction with Figures 4A to 4G , the process flow diagram of a display panel 1 provided in the exemplary embodiments of the present disclosure will be described.
[0101] As Figure 4A shown, a substrate 10 is provided, and an LED epitaxial layer 20A is formed on the substrate 10.
[0102] In some embodiments, the substrate 10 may be a silicon-based driving backplane. The silicon-based driving backplane technology is relatively mature, with good process stability, high yield, and can achieve higher pixel density and lower power consumption.
[0103] Before forming the LED epitaxial layer 20A on the substrate 10, a bonding metal layer can be deposited on the surface of the substrate 10, a transparent conductive layer and a bonding metal layer can be deposited on the LED epitaxial layer 20A, and the bonding metal layer on the LED epitaxial layer 20A is bonded to the bonding metal layer on the substrate 10 by means of full-surface bonding.
[0104] The steps after forming the LED epitaxial layer 20A on the substrate 10 further include removing the substrate of the LED epitaxial layer 20A to expose the surface of the LED epitaxial layer 20A facing away from the substrate 10.
[0105] As Figure 4B shown, the LED epitaxial layer 20A is patterned to form a plurality of independent light-emitting units 21, a material is deposited on the light-emitting units 21 and polished to form a filling portion 22 and a dielectric layer 50.
[0106] The dielectric layer 50 can protect the light-emitting units 21.
[0107] In some embodiments, the thickness of the dielectric layer 50 is greater than or equal to 1000 angstroms.
[0108] As Figure 4C shown, a heat-conducting layer 30 is formed on the dielectric layer 50. A metal film is formed on the heat-conducting layer 30, a plurality of grooves are formed in the metal layer, and a protective layer 43 is formed in the grooves.
[0109] One groove corresponds to one light-emitting unit 21, and the size of the groove is greater than or equal to the size of the light-emitting unit 21. By making grooves in the metal film, the surface of the metal film can reflect light, avoiding light crosstalk between sub-pixels 11 of different colors and effectively improving the display brightness.
[0110] As Figure 4D shown, a material of the first color conversion layer 40 is formed on the dielectric layer 50, the first color conversion layer 40 is patterned by exposure and development, a part of the material of the first color conversion layer 40 in the grooves is retained to form a first conversion portion 411, and the material of the first color conversion layer 40 in other regions is removed.
[0111] It should be noted that by filling the material of the first color conversion layer 40 in the grooves, the patterning difficulty of the material of the first color conversion layer 40 can be effectively reduced, and an undercut structure can be avoided when the material of the first color conversion layer 40 is patterned. The undercut structure will cause the first conversion portion 411 to be unable to stand and be retained. By forming the first conversion portion 411 in the grooves, the performance of the display panel 1 can be improved and the manufacturing yield can be increased.
[0112] As Figure 4EAs shown, the material for forming the second color conversion layer 40 is formed on the dielectric layer 50. The second color conversion layer 40 is patterned by exposure and development, and a part of the material of the second color conversion layer 40 in the grooves is retained to form the second conversion part 412, and the material of the second color conversion layer 40 in other areas is removed.
[0113] Similarly, filling the material of the second color conversion layer 40 in the grooves can effectively reduce the patterning difficulty of the material of the second color conversion layer 40.
[0114] As Figure 4F shown, a transparent material is formed on the dielectric layer 50. The transparent material is patterned by exposure and development, and the transparent material in the grooves is retained to form the transparent part 413, and the transparent material in other areas is removed.
[0115] Similarly, filling the transparent material in the grooves can effectively reduce the patterning difficulty of the transparent material.
[0116] In the above embodiments, by filling the color conversion part 41 in the grooves, the size of the sub-pixels 11 can be effectively reduced, and the production of the display panel 1 with a high resolution (above 5000 PPI) can be realized.
[0117] As Figure 4G shown, a reflective layer 60 is formed on the color conversion layer 40, and an opening is formed on the reflective layer 60, and the opening is arranged corresponding to the transparent part 413.
[0118] Among them, the reflective layer 60 includes a first sub-layer 61 and a second sub-layer 62 which are alternately arranged, and the refractive index of the first sub-layer 61 is greater than that of the second sub-layer 62. The reflective layer 60 can transmit the light whose color is converted by the first conversion part 411 and the second conversion part 412 and reflect the light whose color is the same as the light emitted by the light-emitting unit 21.
[0119] According to the second aspect of the present application, as Figure 5 shown, a display terminal 2 is provided, which includes the above-mentioned display panel 1.
[0120] In this embodiment, as Figure 5 shown, the display terminal 2 includes a display panel 1 and a terminal body 3, and the display panel 1 and the terminal body 3 are combined into one body.
[0121] In this embodiment, the display terminal 2 can be: any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
[0122] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.
[0123] In the above embodiments, the descriptions of the respective embodiments have their own focuses. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.
[0124] Among the embodiments, implementation manners and related technical features of the present application, they can be combined and replaced with each other without conflict.
[0125] The above are only the preferred embodiments of the present application and do not impose any form of limitation on the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.
Claims
1. A display panel, characterized in that: include: substrate; A light-emitting layer is disposed on one side of the substrate, and the light-emitting layer includes a plurality of light-emitting units with the same light-emitting color; A heat-conducting layer is disposed on a side of the light-emitting layer away from the substrate; A color conversion layer is arranged on the side of the thermal conductive layer away from the substrate, the color conversion layer includes a plurality of color conversion parts, one of the color conversion parts corresponds to one of the light-emitting units, the color conversion layer includes a retaining wall layer, the retaining wall layer is provided with a plurality of grooves, the color conversion part is arranged in the grooves, the thermal conductivity of the retaining wall layer is greater than the thermal conductivity of the color conversion part, and the retaining wall layer is arranged in contact with the thermal conductive layer.
2. The display panel according to claim 1, characterized in that: The heat-conducting layer comprises a first sub-portion arranged in alignment with the light-emitting unit and a second sub-portion arranged between two adjacent first sub-portions; The light transmittance of the first sub-section is greater than the light transmittance of the second sub-section.
3. The display panel according to claim 2, characterized in that: The thermal conductivity of the second sub-portion is greater than that of the first sub-portion, and the retaining wall layer is disposed in contact with the second sub-portion.
4. The display panel according to claim 1, characterized in that: The display panel comprises a dielectric layer, wherein the dielectric layer is disposed between the light-emitting layer and the heat-conducting layer, and the dielectric layer is disposed in contact with both the light-emitting layer and the heat-conducting layer; Wherein, the refractive index of the medium layer is smaller than the refractive index of the heat conducting layer.
5. The display panel according to claim 4, characterized in that: The light-emitting layer includes a filling portion disposed between two adjacent light-emitting units, and the filling portion is made of the same material as that of the dielectric layer.
6. The display panel according to any one of claims 1 to 5, characterized in that: The display panel comprises a reflective layer disposed on a side of the color conversion layer away from the substrate, and the color conversion portion comprises a first conversion portion, a second conversion portion and a transparent portion; The reflective layer is provided with an opening corresponding to the transparent portion, and the reflective layer is used to reflect light having the same color as the light emitting unit and transmit light having the same color as the first conversion portion and the second conversion portion.
7. The display panel according to claim 6, characterized in that: The reflective layer includes a first sublayer and a second sublayer alternately stacked, and the refractive index of the first sublayer is greater than the refractive index of the second sublayer.
8. The display panel according to claim 6, characterized in that: The color conversion layer further includes a protection layer disposed in the groove, the protection layer is located between the color conversion portion and the barrier layer, and the protection layer is located between the color conversion portion and the heat conduction layer.
9. The display panel according to claim 8, characterized in that: The thermal conductivity of the protective layer corresponding to the first conversion portion and the second conversion portion is smaller than the thermal conductivity of the protective layer corresponding to the transparent portion.
10. A display terminal, characterized in that: A display panel comprising any one of claims 1 to 9.