Welding device for integrated circuit chip production

Abstract

The invention discloses a welding device for integrated circuit chip production, and particularly relates to the technical field of welding, the welding device comprises an operation table, the left side of the upper end of the operation table is rotatably connected with a cleaning mechanism, the middle of the upper end of the operation table is fixedly connected with a welding mechanism, and the front side of the upper end of the operation table is fixedly connected with a moving mechanism; the right side of the upper end of the operation table is fixedly connected with a cleaning mechanism. According to the welding device for integrated circuit chip production, the angle of the substrate and the angle of the chip are automatically adjusted in the welding process through cooperation of a round sliding block and an arc-shaped groove, the continuity and stability of the whole welding process are guaranteed, through cooperation between a second rack and a seventh gear and other structures, a cotton brush at the lower end of a hard pipe rotates, and the welding efficiency is improved. And meanwhile, the cotton brush releases the plate washing water to clean the welding position, the plate washing water above the base plate can be wiped away through the soft wiping plate in the reset process of the base plate, and the welding yield is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of welding, and particularly relates to a welding device for integrated circuit chip production. Background Art

[0002] Integrated circuit chips, abbreviated as IC chips, are indispensable core components in modern electronic devices. The welding of integrated circuit chips to substrates is an important link in semiconductor manufacturing, which ensures a stable connection between the chips and the substrates, thereby realizing the distribution and transmission of power and signals.

[0003] Chinese Patent Publication No. CN116117262B discloses a welding device for integrated circuit chip production, including a base, a double-belt conveying assembly, and a back-mounting assembly. The double-belt conveying assembly is arranged on the base, and the back-mounting assembly is arranged on the base. The back-mounting assembly includes a lifting and flipping unit, an outstretched clamping unit, a middle support unit, and a coating and pressing unit. The lifting and flipping units are symmetrically arranged on the base, the outstretched clamping unit is arranged in the lifting and flipping unit, the middle support unit is arranged at the center of the base, and the coating and pressing unit is located above the middle support unit. This invention specifically provides a welding device for integrated circuit chip production that includes a back-mounting assembly and can automatically perform back filling of solder paste and mounting on a production line.

[0004] However, during the operation of the above device, the effect of cleaning the substrate before and after welding cannot be achieved. Summary of the Invention

[0005] The main object of the present invention is to provide a welding device for integrated circuit chip production, which can effectively solve the problem that the substrate cannot be cleaned before and after welding.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A welding device for integrated circuit chip production includes an operating table and a guide rail. The guide rail is fixedly connected to the middle of the upper end of the operating table. A fixing mechanism is slidably connected to the left side of the upper end of the operating table. A cleaning mechanism is rotatably connected to the left side of the upper end of the operating table. A welding mechanism is fixedly connected to the middle of the upper end of the operating table. A moving mechanism is fixedly connected to the front side of the upper end of the operating table. A rotating mechanism is rotatably connected to the upper end of the operating table behind the moving mechanism. A cleaning mechanism is fixedly connected to the right side of the upper end of the operating table.

[0008] Preferably, the fixing mechanism includes a fixing seat slidably connected to the outer surface of the guide rail, a rectangular plate is fixedly connected to the left side of the front end of the fixing seat, a rack is fixedly connected to the front end of the rectangular plate, a hydraulic cylinder is fixedly connected to the middle of the right end of the rectangular plate, a gear is rotatably connected to the upper end of the fixing seat, a negative pressure pump is fixedly connected to the front side of the upper end of the gear, a fixing plate is fixedly connected to the middle of the upper end of the gear, a plurality of suction cups are fixedly connected to the upper end of the fixing plate, and the plurality of suction cups are fixedly connected to the output end of the negative pressure pump together, an L-shaped rod is fixedly connected to the right side of the rear end of the fixing seat, and a rack is fixedly connected to the right side of the rear end of the L-shaped rod.

[0009] Preferably, the moving mechanism includes gear four meshing with the front end of the rectangular plate, the inner surface of the gear four is fixedly connected to roller two, the upper part of the outer surface of the roller two is meshing and transmission connected with a round rod, the rear end of the round rod is fixedly connected to a threaded rod, the outer surface of the threaded rod is provided with a ring, the lower part of the outer surface of the ring is fixedly connected to a telescopic rod, the lower end of the telescopic rod is fixedly connected to an L-shaped sliding rod, the lower end of the L-shaped sliding rod is rotatably connected to suction cup two, and the middle part of the front side of the upper end of the operating table is fixedly connected to a vertical plate.

[0010] Preferably, a guide groove is provided at the left end of the vertical plate, and the outer surface of the horizontal portion of the L-shaped slide bar is in close contact with the inner surface of the guide groove.

[0011] Preferably, the welding mechanism includes a hydraulic cylinder 2 fixedly connected to the upper end of the operating table, the output end of the hydraulic cylinder 2 is fixedly connected to a push plate, the middle part of the lower end of the push plate is fixedly connected to an automatic soldering head, the right end of the push plate is fixedly connected to an L-shaped plate, and the rear side of the lower end of the push plate is fixedly connected to a round roller.

[0012] Preferably, a pressing block is fixedly connected to the right side of the lower end of the L-shaped plate, and three circular sliding blocks are arranged in an annular array at the lower part of the outer surface of the circular roller.

[0013] Preferably, the cleaning mechanism comprises a second gear meshing with the rear end of the second rack, a first roller is fixedly connected to the upper end of the second gear, and a plurality of soft wiping plates are provided in an annular array on the outer surface of the first roller.

[0014] Preferably, the cleaning mechanism includes a second fixing plate fixedly connected to the upper end of the operating table. On the right side of the second fixing plate, a storage tank is fixedly connected to the upper end of the operating table. On the upper right side of the second fixing plate, a water bag is arranged. On the front side of the outer surface of the water bag, a second hose is arranged. On the upper end of the second fixing plate, a number of sixth gears are rotatably connected. The number of sixth gears mesh with each other. On the inner surface of the number of sixth gears, a rigid tube is fixedly connected. On the left side of the second fixing plate, a seventh gear is rotatably connected to the upper end of the operating table. On the inner surface of the seventh gear, a third roller is arranged. On the upper part of the outer surface of the third roller, a fifth gear is fixedly connected. On the outer surface of the sixth gear near the third roller, it meshes with the outer surface of the fifth gear. The outer surface of the seventh gear can mesh with the rear end of the second rack.

[0015] Preferably, two clamping plates are fixedly connected to the upper right side of the second fixing plate. On the side where the two clamping plates approach each other, they are jointly fixedly connected to the middle part of the outer surface of the water bag. The output end of the storage tank is fixedly connected to a first hose. On the rear side of the outer surface of the water bag, a second one-way valve is fixedly connected. The inner surface of the second one-way valve is fixedly connected to the first hose. On the front side of the outer surface of the water bag, a first one-way valve is fixedly connected. The inner surface of the first one-way valve is fixedly connected to the end of the second hose away from the rigid tube. The upper ends of the number of rigid tubes are jointly rotatably connected to the output end of the second hose. The lower ends of the number of rigid tubes are all fixedly connected with cotton brushes. On the inner surface of the seventh gear, a third one-way rotating shaft is fixedly connected. The inner surface of the third one-way rotating shaft is fixedly connected to the lower part of the outer surface of the third roller.

[0016] Preferably, the rotating mechanism includes a cylinder rotatably connected to the upper end of the operating table. In the middle and upper part of the outer surface of the cylinder, a second one-way rotating shaft is fixedly connected. On the outer surface of the second one-way rotating shaft, a third gear is fixedly connected. On the upper end of the cylinder, three guide plates are fixedly connected in an annular array. On the inner surface of the cylinder, a number of arc-shaped grooves are arranged in an annular array. On the side where the three guide plates approach each other, they are respectively slidably connected to the outer surfaces of the adapted round sliders.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. Through the coordinated operation of the fixing mechanism and the guide rail, the present invention can quickly and smoothly transfer the substrate accurately to directly below the welding mechanism. At the same time, the moving mechanism synchronously sends the chip to the corresponding position, greatly shortening the docking preparation time between the chip and the substrate. At the same time, during the welding process, the welding mechanism cooperates with the rotating mechanism and the fixing mechanism to automatically adjust the angles of the chip and the substrate, ensuring that all four sides of the chip can be accurately welded, effectively avoiding problems such as virtual soldering and missed soldering caused by angle deviation, guaranteeing the high precision of the welding quality. At the same time, the fixing mechanism cooperates with the cleaning mechanism and the cleaning mechanism respectively to clean the welding position of the substrate and the upper end of the substrate, further ensuring the welding quality.

[0019] 2. The present invention moves the substrate through the fixed seat and cooperates with structures such as the gear four. While the substrate for welding is being prepared, the chip is moved above the substrate. At the same time, the circular slider and the arc-shaped groove can be used to automatically adjust the angles of the substrate and the chip during the welding process, which helps to achieve seamless connection between welding and angle adjustment, ensuring the continuity and stability of the entire welding process. Meanwhile, a number of suction cups one and suction cups two respectively fix the substrate and the chip, avoiding position deviation during the welding process and also preventing damage to the chip and the substrate.

[0020] 3. The present invention makes the soft scrubbing plate rotate through the cooperation of the second rack and the second gear to wipe and clean the upper end of the substrate, avoiding impurities from affecting the welding and fixing effect when the chip is welded to the substrate. After the welding of the chip and the substrate is completed, through the cooperation between the second rack and structures such as the seventh gear, the cotton brush at the lower end of the hard tube rotates, and at the same time, the cotton brush releases the washing board water to clean the welding position, avoiding the residue of the soldering flux during the welding process. It can also wipe the washing board water above the substrate clean through the soft scrubbing plate during the process of the fixed seat driving the substrate to reset, improving the qualified rate of welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 is a schematic diagram of the overall structure of the present invention from another perspective;

[0023] Figure 3 is a schematic diagram of the fixing mechanism structure of the present invention;

[0024] Figure 4 is a schematic diagram of the moving mechanism structure of the present invention;

[0025] Figure 5 is a schematic diagram of the cleaning mechanism structure of the present invention;

[0026] Figure 6 is a schematic diagram of the welding mechanism structure of the present invention;

[0027] Figure 7 is a schematic diagram of the cleaning mechanism structure of the present invention;

[0028] Figure 8 is a schematic diagram of another perspective structure of the cleaning mechanism of the present invention;

[0029] Figure 9 is a schematic diagram of the rotating mechanism structure of the present invention;

[0030] Figure 10 is a schematic cross-sectional structure diagram of the rotating mechanism of the present invention.

[0031] In the figure: 1. Operating table; 11. Guide rail; 2. Fixing mechanism; 21. First hydraulic cylinder; 22. Fixing seat; 23. Rectangular plate; 24. First gear; 25. Negative pressure pump; 26. First fixing plate; 27. First suction cup; 28. First rack; 29. L-shaped rod; 291. Second rack; 3. Cleaning mechanism; 31. Second gear; 32. First roller; 33. Soft scrubbing plate; 4. Welding mechanism; 41. Second hydraulic cylinder; 42. Pushing plate; 43. L-shaped plate; 431. Pressing block; 44. Round roller; 441. Round slider; 45. Automatic soldering head; 5. Rotating mechanism; 51. Third gear; 52. Second one-way rotating shaft; 53. Cylinder; 531. Arc-shaped groove; 54. Guide plate; 6. Moving mechanism; 61. Fourth gear; 62. Second suction cup; 63. Second roller; 64. Round rod; 65. Threaded rod; 66. Ring; 67. Telescopic rod; 68. L-shaped sliding rod; 69. Vertical plate; 691. Guide groove; 7. Cleaning mechanism; 71. Second fixing plate; 711. Clamping plate; 72. Storage tank; 721. First hose; 73. Water bag; 731. First one-way valve; 732. Second one-way valve; 74. Second hose; 75. Fifth gear; 76. Sixth gear; 77. Rigid pipe; 771. Cotton brush; 78. Seventh gear; 781. Third one-way rotating shaft; 79. Third roller. Specific implementation mode

[0032] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation modes.

[0033] Example 1, as Figure 1 and Figure 2 shown, a welding device for integrated circuit chip production includes an operating table 1 and a guide rail 11. The guide rail 11 is fixedly connected to the middle of the upper end of the operating table 1. The left side of the upper end of the operating table 1 is slidably connected with a fixing mechanism 2. The left side of the upper end of the operating table 1 is rotatably connected with a cleaning mechanism 3. The middle of the upper end of the operating table 1 is fixedly connected with a welding mechanism 4. The front side of the upper end of the operating table 1 is fixedly connected with a moving mechanism 6. The upper end of the operating table 1 behind the moving mechanism 6 is rotatably connected with a rotating mechanism 5. The right side of the upper end of the operating table 1 is fixedly connected with a cleaning mechanism 7.

[0034] When it is necessary to weld the chip of the integrated circuit to the substrate, first, the substrate is adsorbed and fixed by the cooperation of the fixing mechanism 2, and then the substrate is driven by the fixing mechanism 2 and the guide rail 11 to move to the right below the welding mechanism 4. At the same time, during the process of the fixing mechanism 2 moving the substrate, it cooperates with the moving mechanism 6, and the moving mechanism 6 can move the adsorbed chip to the right below the welding mechanism 4. Then, the structure in the welding mechanism 4 is activated to weld the chip to the substrate;

[0035] Similarly, during the process of the fixing mechanism 2 moving the substrate in preparation for welding, the cleaning mechanism 3 is cooperated to clean the upper end of the substrate.

[0036] During the welding process, the fixing mechanism 2 is fixed by the cooperation of the welding mechanism 4 and the rotating mechanism 5, and the angles of the chip and the substrate are automatically adjusted simultaneously, so that the four sides of the chip and the substrate are welded and fixed. After the welding is completed, the fixing mechanism 2 drives the welded chip and substrate to continue to move to the right. The fixing mechanism 2 cooperates with the cleaning mechanism 7 to clean the welded place with washing water for the board to avoid the residue of the soldering flux during the welding process.

[0037] During the operation of this embodiment, through the coordinated operation of the fixing mechanism 2 and the guide rail 11, the substrate can be accurately transferred to directly below the welding mechanism 4 quickly and smoothly. At the same time, the moving mechanism 6 synchronously sends the chip to the corresponding position, greatly shortening the docking preparation time of the chip and the substrate. During the welding process, the welding mechanism 4 cooperates with the rotating mechanism 5 and the fixing mechanism 2 to automatically adjust the angles of the chip and the substrate, ensuring that all four sides of the chip can be accurately welded, effectively avoiding the problems of false soldering and missed soldering caused by angle deviation, guaranteeing the high precision of the welding quality. At the same time, the fixing mechanism 2 cooperates with the cleaning mechanism 7 and the cleaning mechanism 3 respectively to clean the welding position of the substrate and the upper end of the substrate, further ensuring the welding quality.

[0038] Embodiment 2, on the basis of Embodiment 1, to achieve the effect of automatically adjusting the angle between the substrate and the chip during the welding process.

[0039] Refer to Figure 3 , the fixing mechanism 2 includes a fixing seat 22 slidably connected to the outer surface of the guide rail 11. The left side of the front end of the fixing seat 22 is fixedly connected with a rectangular plate 23. The front end of the rectangular plate 23 is fixedly connected with a first rack 28. The middle of the right end of the rectangular plate 23 is fixedly connected with a first hydraulic cylinder 21. The upper end of the fixing seat 22 is rotatably connected with a first gear 24. The front side of the upper end of the first gear 24 is fixedly connected with a negative pressure pump 25. The middle of the upper end of the first gear 24 is fixedly connected with a first fixing plate 26. The upper end of the first fixing plate 26 is fixedly connected with a plurality of first suction cups 27. The plurality of first suction cups 27 are jointly fixedly connected to the output end of the negative pressure pump 25. The right side of the rear end of the fixing seat 22 is fixedly connected with an L-shaped rod 29. The right side of the rear end of the L-shaped rod 29 is fixedly connected with a second rack 291.

[0040] The above-mentioned negative pressure pump 25 is a conventional design in the prior art. During the working process of the activated negative pressure pump 25, with the cooperation of the pipeline at the output end, a plurality of first suction cups 27 and the substrate, the gas between the plurality of first suction cups 27 and the substrate can be pumped out to form a certain vacuum environment, so that the plurality of first suction cups 27 can firmly fix the substrate without damaging the substrate.

[0041] After a number of suction cups - 27 cooperate with the negative pressure pump 25 to fix the substrate on the upper end of the fixed plate - 26, the hydraulic cylinder - 21 is activated. Immediately, the output end of the hydraulic cylinder - 21 drives the rectangular plate 23 to move to the right. During the process of the rectangular plate 23 moving to the right, it will drive the rack - 28, the L - shaped rod 29, and the fixed seat 22 to move in the same direction. At the same time, the guide rail 11 cooperates with the fixed seat 22 to prevent the fixed seat 22 from shifting during the movement until the output end of the hydraulic cylinder - 21 drives the fixed seat 22 and the substrate adsorbed by a number of suction cups - 27 to move directly below the welding mechanism 4.

[0042] Refer to Figure 4 , the moving mechanism 6 includes a gear four 61 meshing with the front end of the rectangular plate 23. The inner surface of the gear four 61 is fixedly connected with a roller two 63. The upper part of the outer surface of the roller two 63 is meshed and driven with a round rod 64. The rear end of the round rod 64 is fixedly connected with a threaded rod 65. The outer surface of the threaded rod 65 is provided with a ring 66. The lower part of the outer surface of the ring 66 is fixedly connected with a telescopic rod 67. The lower end of the telescopic rod 67 is fixedly connected with an L - shaped slide bar 68. The left side of the lower end of the L - shaped slide bar 68 is rotatably connected with a suction cup two 62. The upper front middle part of the operating table 1 is fixedly connected with a vertical plate 69.

[0043] In the above, the outer surface of the roller two 63 and the outer surface of the round rod 64 are meshed and driven by a bevel gear set in the prior art. When the roller two 63 is driven to rotate, the round rod 64 is simultaneously driven to rotate;

[0044] At the same time, a groove matching the outer surface of the threaded rod 65 is opened on the inner surface of the above - mentioned ring 66. When the threaded rod 65 is driven to rotate by the round rod 64, the ring 66 will move forward or backward along the axis of the threaded rod 65.

[0045] Similarly, before welding, the chip to be welded is gently pressed against the lower end of the suction cup two 62, and part of the air between the suction cup two 62 and the chip is discharged. At this time, the suction cup two 62 can adsorb and fix the chip. At the same time, the size of the suction cup two 62 in the attached drawings of this solution can be designed according to the size of the chip in the actual production process to ensure that the diameter of the suction cup two 62 is smaller than the chip to be welded.

[0046] Furthermore, during the process of the output end of the hydraulic cylinder - 21 driving the substrate to move to the right, at this time, the front right side of the rack - 28 starts to mesh with the outer surface of the gear four 61. As the rack - 28 is driven to move to the right by the rectangular plate 23, the gear four 61 is driven to rotate continuously.

[0047] Furthermore, during the rotation of the gear four 61, it will drive the roller two 63 to rotate continuously. Then, the round rod 64 and the threaded rod 65 rotate simultaneously. Immediately, the ring 66 will drive the telescopic rod 67, the L - shaped slide bar 68, and the suction cup two 62 to move backward above the substrate.

[0048] Refer to Figure 4, a guiding groove 691 is formed at the left end of the vertical plate 69, and the outer surface of the horizontal part of the L-shaped sliding rod 68 is in close contact with the inner surface of the guiding groove 691.

[0049] When the circular ring 66 drives the telescopic rod 67, the L-shaped sliding rod 68 and the suction cup two 62 to move backward, at this time, the outer surface of the horizontal part of the L-shaped sliding rod 68 moves backward along the inner surface of the guiding groove 691. When the L-shaped sliding rod 68 is driven to move to the rear side in the inner surface of the guiding groove 691, when the L-shaped sliding rod 68 continues to move backward, it will slide downward along the inner surface of the guiding groove 691, and then the telescopic rod 67 is stretched. At this time, the suction cup two 62 and the adsorbed and fixed chip gradually approach the upper end of the substrate.

[0050] When the output end of the hydraulic cylinder one 21 drives the fixed seat 22 to move to the right below the welding mechanism 4, at this time, the circular ring 66 moves to the rear side of the outer surface of the threaded rod 65, and at the same time, the L-shaped sliding rod 68 is located at the lower part of the rear side of the inner surface of the guiding groove 691. At this time, the upper end of the chip adsorbed by the suction cup two 62 contacts the upper end of the substrate adsorbed by a plurality of suction cups one 27. At this time, the rack one 28 is no longer engaged with the outer surface of the gear four 61.

[0051] Refer to Figure 6 , the welding mechanism 4 includes a hydraulic cylinder two 41 fixedly connected to the upper end of the operating table 1. The output end of the hydraulic cylinder two 41 is fixedly connected with a push plate 42. The middle part of the lower end of the push plate 42 is fixedly connected with an automatic soldering head 45. The right end of the push plate 42 is fixedly connected with an L-shaped plate 43. The rear side of the lower end of the push plate 42 is fixedly connected with a round roller 44.

[0052] The above-mentioned automatic soldering head 45 is a conventional design in the prior art. During its working process, it can set a certain length for automatic welding, and at the same time, it can accurately apply solder to the solder joints, avoiding the situation of short circuit caused by too much solder or insecure welding caused by too little solder. The specific working principle and composition of this solution will not be elaborated in detail.

[0053] Further, after the upper end of the chip adsorbed by the suction cup two 62 contacts the upper end of the substrate adsorbed by a plurality of suction cups one 27, at this time, the hydraulic cylinder two 41 is activated. Then, the output end of the hydraulic cylinder two 41 pushes the push plate 42 downward. During the process of the push plate 42 being pushed downward, it will drive the automatic soldering head 45, the round roller 44 and the L-shaped plate 43 to move downward at the same time. When the automatic soldering head 45 descends to be close to the chip and the substrate, the automatic soldering head 45 is activated to prepare for welding one side of the chip and the substrate.

[0054] Refer to Figure 6 , a pressing block 431 is fixedly connected to the right side of the lower end of the L-shaped plate 43, and three round sliders 441 are annularly arranged on the lower part of the outer surface of the round roller 44.

[0055] During the process of the push plate 42 driving the round roller 44 and the L-shaped plate 43 to descend, the round slider 441 and the pressing block 431 will be driven to move downward simultaneously.

[0056] Refer to Figure 9 and Figure 10 As shown in FIGS. and, the rotating mechanism 5 includes a cylinder 53 rotatably connected to the upper end of the operating table 1. The middle upper part of the outer surface of the cylinder 53 is fixedly connected with a one-way rotating shaft two 52. The outer surface of the one-way rotating shaft two 52 is fixedly connected with a gear three 51. Three guide plates 54 are fixedly connected to the upper end of the cylinder 53 in an annular array. A plurality of arc-shaped grooves 531 are formed in the inner surface of the cylinder 53 in an annular array. The mutually close sides of the three guide plates 54 are respectively slidably connected to the outer surfaces of the adapted round sliders 441.

[0057] When the output end of the hydraulic cylinder one 21 drives the fixed seat 22 to move rightward until the upper end of the chip adsorbed by the suction cup two 62 contacts the upper end of the substrate adsorbed by the plurality of suction cups one 27, at this time, the outer surface of the gear one 24 starts to mesh with the outer surface of the gear three 51.

[0058] Furthermore, after the round roller 44 drives the three round sliders 441 to descend a certain distance, then the three round sliders 441 continue to descend. The three round sliders 441 respectively slide downward along the adapted guide plates 54 and enter the inner surfaces of the adapted arc-shaped grooves 531. Subsequently, through the arrangement of the arc-shaped grooves 531, during the process of the round roller 44 driving the round slider 441 to move downward, the cylinder 53 is driven to rotate. At this time, through the arrangement of the one-way rotating shaft two 52, during the process of the round slider 441 descending and driving the cylinder 53 to rotate, the gear three 51 will not be driven to rotate by the cylinder 53, and at this time, the gear one 24 remains stationary.

[0059] When the automatic soldering head 45 finishes soldering one side of the chip and the substrate, at this time, the output end of the hydraulic cylinder two 41 drives the push plate 42 and the automatic soldering head 45 to rise a certain distance. Immediately, the round roller 44 drives the three round sliders 441 to move upward. Through the cooperation of the inner surfaces of the three arc-shaped grooves 531, the cylinder 53 is driven to rotate. At this time, through the cooperation of the one-way rotating shaft two 52, during the process of the three round sliders 441 moving upward, the gear three 51 is driven to rotate half a turn. Immediately, through the cooperation of the outer surfaces of the gear three 51 and the gear one 24, and at the same time, due to the different radius ratios of the gear three 51 and the gear one 24, when the gear three 51 rotates half a turn, the gear one 24 is driven to rotate a quarter of a turn, that is, it realizes that the chip and the substrate are driven by the plurality of suction cups one 27 and the gear one 24 to rotate 90 degrees, and at this time, the suction cup two 62 is driven by the chip to rotate 90 degrees.

[0060] The one-way rotating shaft two 52 mentioned above is a conventional design in the prior art. Through the cooperative setting of the one-way rotating shaft two 52, when the circular slider 441 descends to drive the cylinder 53 to rotate, the third gear 51 does not rotate. When the circular slider 441 is driven to rise, the cylinder 53, the one-way rotating shaft two 52, and the third gear 51 rotate simultaneously. The specific working principle of the one-way rotating shaft two 52 will not be elaborated in detail in this solution.

[0061] After the chip and the substrate are rotated 90 degrees, the output end of the second hydraulic cylinder 41 pushes the automatic soldering head 45 downward to continue soldering the chip and the substrate. Repeat the above operations until all four sides of the chip are soldered and fixed to the substrate.

[0062] After the soldering of the chip and the substrate is completed, the adsorption lock between the second suction cup 62 and the chip is released. Subsequently, the output end of the first hydraulic cylinder 21 continues to drive the fixed seat 22 to move rightward along the operating table 1 to prepare for cleaning the soldering position.

[0063] Therefore, in this solution, by moving the substrate with the fixed seat 22 and cooperating with structures such as the fourth gear 61, the chip can be moved above the substrate while moving the substrate to prepare for soldering. At the same time, through the cooperation of the circular slider 441 and the arc-shaped groove 531, the angles of the substrate and the chip can be automatically adjusted during the soldering process, which helps to achieve seamless connection between soldering and angle adjustment, ensuring the continuity and stability of the entire soldering process. At the same time, a number of the first suction cups 27 and the second suction cups 62 respectively fix the substrate and the chip, avoiding position deviation during the soldering process and also preventing damage to the chip and the substrate.

[0064] Embodiment 3. On the basis of Embodiments 1 and 2, this embodiment is to achieve the effect of cleaning the substrate before and after soldering.

[0065] Refer to Figure 5 , the cleaning mechanism 3 includes a second gear 31 meshing with the rear end of the second rack 291. The upper end of the second gear 31 is fixedly connected with a first rotating roller 32. A number of soft wiping plates 33 are annularly arranged on the outer surface of the first rotating roller 32.

[0066] When the output end of the first hydraulic cylinder 21 drives the fixed seat 22 and the substrate adsorbed by a number of the first suction cups 27 to prepare for soldering, the fixed seat 22 will drive the L-shaped rod 29 and the second rack 291 to move rightward simultaneously. At this time, the second rack 291 cooperates with the outer surface of the second gear 31. During the process of the second rack 291 being driven to move rightward by the L-shaped rod 29, the second gear 31 rotates continuously. Then, the first rotating roller 32 is driven to rotate by the second gear 31. Further, a number of soft wiping plates 33 are driven to rotate by the first rotating roller 32. At this time, a number of soft wiping plates 33 wipe and clean the upper end of the substrate to avoid the influence of dust, etc. on the soldering and fixing between the chip and the substrate.

[0067] Refer to Figure 7 and Figure 8, the cleaning mechanism 7 includes a second fixing plate 71 fixedly connected to the upper end of the operating table 1. On the upper end of the operating table 1 to the right of the second fixing plate 71, a storage tank 72 is fixedly connected. On the upper right side of the second fixing plate 71, a water bag 73 is arranged. On the front side of the outer surface of the water bag 73, a second hose 74 is arranged. On the upper end of the second fixing plate 71, a number of sixth gears 76 are rotatably connected. The number of sixth gears 76 mesh with each other. On the inner surface of the number of sixth gears 76, a rigid tube 77 is fixedly connected. On the upper end of the operating table 1 to the left of the second fixing plate 71, a seventh gear 78 is rotatably connected. On the inner surface of the seventh gear 78, a third roller 79 is arranged. On the upper part of the outer surface of the third roller 79, a fifth gear 75 is fixedly connected. The outer surface of the sixth gear 76 close to the third roller 79 meshes with the outer surface of the fifth gear 75. The outer surface of the seventh gear 78 can mesh with the rear end of the second rack 291.

[0068] An inlet is arranged at the upper end of the storage tank 72 mentioned above. Before welding, the inner surface of the storage tank 72 is filled with circuit board cleaning fluid.

[0069] During the welding process, since the push plate 42 continuously drives the automatic soldering head 45 to move up and down, and at the same time the push plate 42 will drive the L-shaped plate 43 to move in the same direction. When the L-shaped plate 43 is driven to move downward, the pressing block 431 will squeeze the water bag 73. Immediately, the circuit board cleaning fluid inside the water bag 73 enters the inner surfaces of a number of rigid tubes 77 through the second hose 74 respectively;

[0070] Furthermore, when the pressing block 431 is driven by the L-shaped plate 43 to move upward and the extrusion of the water bag 73 is released, at this time the circuit board cleaning fluid inside the storage tank 72 is adsorbed into the inner surface of the water bag 73. During the process of the L-shaped plate 43 driving the pressing block 431 to move up and down reciprocally, the circuit board cleaning fluid inside the storage tank 72 is squeezed into the inner surfaces of a number of rigid tubes 77 multiple times.

[0071] Specifically, after the welding of the chip and the substrate is completed, a number of first suction cups 27 adsorb the substrate and are driven by the fixing seat 22 to continue moving to the right. At this time, the second rack 291 starts to mesh with the outer surface of the seventh gear 78. During the process of the second rack 291 continuing to move to the right, in cooperation with the continuous rotation of the seventh gear 78, the third roller 79 will be driven to rotate, and then the fifth gear 75 will be continuously rotated;

[0072] At the same time, due to the meshing of the fifth gear 75 with the sixth gear 76 close to the third roller 79, and the meshing of the number of sixth gears 76 with each other, during the rotation of the fifth gear 75, the number of sixth gears 76 rotates continuously, and then the adapted rigid tubes 77 will be driven to rotate continuously.

[0073] Refer to Figure 7 and Figure 8, on the upper right side of the upper end of the second fixing plate 71, two clamping plates 711 are fixedly connected. The middle part of the outer surface of the water bag 73 is fixedly connected to the side of the two clamping plates 711 close to each other. The output end of the storage tank 72 is fixedly connected to a first hose 721. The rear side of the outer surface of the water bag 73 is fixedly connected to a second one-way valve 732. The inner surface of the second one-way valve 732 is fixedly connected to the first hose 721. The front side of the outer surface of the water bag 73 is fixedly connected to a first one-way valve 731. The inner surface of the first one-way valve 731 is fixedly connected to one end of the second hose 74 away from the rigid tube 77. The upper ends of a number of rigid tubes 77 are jointly rotatably connected to the output end of the second hose 74. The lower ends of a number of rigid tubes 77 are all fixedly connected with cotton brushes 771. The inner surface of the seventh gear 78 is fixedly connected with a third one-way rotating shaft 781. The inner surface of the third one-way rotating shaft 781 is fixedly connected to the lower part of the outer surface of the third roller 79.

[0074] The above-mentioned cotton brush 771 is made of a material with a certain hardness and water absorption. When the washing solution inside the storage tank 72 enters the inner surface of the rigid tube 77 through the second hose 74, a number of cotton brushes 771 cooperate to absorb the washing solution. When the substrate and the chip pass by a number of cotton brushes 771, a number of cotton brushes 771 can release the washing solution while rotating to clean the welding position, and clean the flux at the welding position.

[0075] Furthermore, when the water bag 73 is squeezed by the pressing block 431, the two clamping plates 711 fix the two sides of the water bag 73. Through the setting of the first one-way valve 731, the washing solution inside the water bag 73 enters the inner surface of a number of rigid tubes 77 through the inner surface of the second hose 74. When the pressing block 431 releases the extrusion of the water bag 73, at this time, through the setting of the second one-way valve 732, the washing solution inside the storage tank 72 enters the inner surface of the water bag 73 through the first hose 721 and the second one-way valve 732. Furthermore, when the pressing block 431 is driven to move up and down, the washing solution inside the storage tank 72 enters the inner surface of a number of rigid tubes 77 through the cooperation of the first one-way valve 731 and the second one-way valve 732.

[0076] Furthermore, when a number of first suction cups 27 drive the substrate and the chip to move to the lower left side of the second fixing plate 71, at this time, through the cooperation of the second rack 291 and the seventh gear 78, the seventh gear 78 rotates and the third one-way rotating shaft 781 rotates in cooperation with the third roller 79 at the same time. Furthermore, a number of sixth gears 76 will rotate in cooperation with the fifth gear 75 at the same time. At the same time, a number of sixth gears 76 will cooperate with a number of rigid tubes 77 to drive the cotton brushes 771 to rotate continuously, and use the washing solution to rotate and clean the welding part of the substrate and the chip, avoiding the residue of the flux during the welding process.

[0077] After the cleaning is completed, the output end of the first hydraulic cylinder 21 can be used to push the rectangular plate 23 to drive the fixed seat 22 to move to the left. At this time, the second rack 291 and the seventh gear 78 continue to mesh. Through the setting of the third one-way rotating shaft 781, at this time, the seventh gear 78 rotates while the third one-way rotating shaft 781 and the third roller 79 do not rotate.

[0078] The one-way rotating shaft three 781 in the above is a conventional design in the prior art. By cooperating the one-way rotating shaft three 781 with the gear seven 78, when the rack two 291 moves to the right and drives the gear seven 78 to rotate, at this time, the rotating roller three 79 rotates through the cooperation of the one-way rotating shaft three 781. When the rack two 291 moves to the left and drives the gear seven 78 to rotate, at this time, the rotating roller three 79 does not rotate.

[0079] Then, the output end of the hydraulic cylinder one 21 can push the fixed seat 22 to the left to drive the substrate to move to the left. When it moves to the point where the rack one 28 starts to mesh with the gear four 61, at this time, when the rack one 28 continues to move to the left, it will drive the gear four 61 to rotate in the reverse direction. Then, through the cooperation of the rotating roller two 63 and the threaded rod 65, during the process of the rack one 28 and the fixed seat 22 moving to the left, the ring 66 drives the L-shaped slide rod 68 and the suction cup two 62 to move forward. Then, the next chip to be welded can be adsorbed and fixed to the lower end of the suction cup two 62.

[0080] Furthermore, during the process of the fixed seat 22 being continuously pushed to the left, when the rack two 291 starts to mesh with the outer surface of the gear two 31, at this time, several soft scrubbing plates 33 rotate to wipe clean the washing water remaining above the substrate, avoiding problems such as instability or short circuit in the next welding.

[0081] Then, through the cooperation of the negative pressure pump 25, the fixing plate one 26 and several suction cups one 27, the locking between the several suction cups one 27 and the substrate is released. Then, the position of the substrate can be adjusted to perform welding at another position of the substrate and the chip.

[0082] Repeat the above operations until the required chips are welded to the substrate. Then, the substrate and the chips can be removed for the next operation.

[0083] Therefore, in this solution, through the cooperation of the rack two 291 and the gear two 31, the soft scrubbing plates 33 rotate to wipe and clean the upper end of the substrate, avoiding impurities from affecting the welding and fixing effect when the chip is welded to the substrate. After the welding of the chip and the substrate is completed, through the cooperation between the rack two 291 and the gear seven 78 and other structures, the cotton brush 771 at the lower end of the hard pipe 77 rotates, and at the same time, the cotton brush 771 releases washing water to clean the welding position, avoiding the residue of the soldering flux during the welding process. It can also wipe clean the washing water above the substrate through the soft scrubbing plates 33 during the process of the fixed seat 22 driving the substrate to reset, improving the yield rate of welding.

[0084] It should be particularly noted that the specific installation methods, circuit connection methods, and control methods of the hydraulic cylinder one 21 and the hydraulic cylinder two 41 adopted in the present invention are all conventional designs, and the present invention will not elaborate in detail.

[0085] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A soldering device for integrated circuit chip production, comprising an operating table (1) and a guide rail (11), characterized in that: The guide rail (11) is fixedly connected to the middle of the upper end of the operating table (1). A fixing mechanism (2) is slidably connected to the left side of the upper end of the operating table (1). A cleaning mechanism (3) is rotatably connected to the left side of the upper end of the operating table (1). A welding mechanism (4) is fixedly connected to the middle of the upper end of the operating table (1). A moving mechanism (6) is fixedly connected to the front side of the upper end of the operating table (1). A rotating mechanism (5) is rotatably connected to the upper end of the operating table (1) behind the moving mechanism (6). A cleaning mechanism (7) is fixedly connected to the right side of the upper end of the operating table (1).

2. The soldering device for manufacturing an integrated circuit chip according to claim 1, wherein: The fixing mechanism (2) includes a fixing seat (22) slidably connected to the outer surface of the guide rail (11). A rectangular plate (23) is fixedly connected to the left front of the fixing seat (22). A first rack (28) is fixedly connected to the front end of the rectangular plate (23). A first hydraulic cylinder (21) is fixedly connected to the middle of the right end of the rectangular plate (23). A first gear (24) is rotatably connected to the upper end of the fixing seat (22). A negative pressure pump (25) is fixedly connected to the front side of the upper end of the first gear (24). A first fixing plate (26) is fixedly connected to the middle of the upper end of the first gear (24). A number of first suction cups (27) are fixedly connected to the upper end of the first fixing plate (26). The number of first suction cups (27) are jointly fixedly connected to the output end of the negative pressure pump (25). An L-shaped rod (29) is fixedly connected to the right rear of the fixing seat (22). A second rack (291) is fixedly connected to the right rear of the L-shaped rod (29).

3. The soldering device for manufacturing an integrated circuit chip according to claim 2, characterized in that: The moving mechanism (6) includes a fourth gear (61) meshing with the front end of the rectangular plate (23). A second roller (63) is fixedly connected to the inner surface of the fourth gear (61). A round rod (64) is meshingly driven and connected to the upper part of the outer surface of the second roller (63). A threaded rod (65) is fixedly connected to the rear end of the round rod (64). A ring (66) is arranged on the outer surface of the threaded rod (65). A telescopic rod (67) is fixedly connected to the lower part of the outer surface of the ring (66). An L-shaped sliding rod (68) is fixedly connected to the lower end of the telescopic rod (67). A second suction cup (62) is rotatably connected to the left side of the lower end of the L-shaped sliding rod (68). A vertical plate (69) is fixedly connected to the middle of the front side of the upper end of the operating table (1).

4. A soldering device for manufacturing an integrated circuit chip according to claim 3, characterized in that: A guiding groove (691) is formed at the left end of the vertical plate (69). The outer surface of the horizontal part of the L-shaped sliding rod (68) is in close contact with the inner surface of the guiding groove (691).

5. A soldering device for manufacturing an integrated circuit chip according to claim 1, wherein: The welding mechanism (4) includes a second hydraulic cylinder (41) fixedly connected to the upper end of the operating table (1). The output end of the second hydraulic cylinder (41) is fixedly connected to a pushing plate (42). An automatic soldering head (45) is fixedly connected to the middle of the lower end of the pushing plate (42). An L-shaped plate (43) is fixedly connected to the right end of the pushing plate (42). A round roller (44) is fixedly connected to the rear side of the lower end of the pushing plate (42).

6. The soldering device for integrated circuit chip production according to claim 5, characterized in that: A pressing block (431) is fixedly connected to the right side of the lower end of the L-shaped plate (43). Three round sliding blocks (441) are annularly arranged on the lower part of the outer surface of the round roller (44).

7. The soldering device for integrated circuit chip production according to claim 2, characterized in that: The cleaning mechanism (3) includes a second gear (31) meshing with the rear end of the second rack (291). A first roller (32) is fixedly connected to the upper end of the second gear (31). A plurality of soft wiping plates (33) are annularly arranged on the outer surface of the first roller (32).

8. A soldering device for manufacturing an integrated circuit chip according to claim 7, characterized in that: The cleaning mechanism (7) includes a second fixing plate (71) fixedly connected to the upper end of the operating table (1). A storage tank (72) is fixedly connected to the upper end of the operating table (1) on the right side of the second fixing plate (71). A water bag (73) is arranged on the upper right side of the second fixing plate (71). A second hose (74) is arranged on the front side of the outer surface of the water bag (73). A plurality of sixth gears (76) are rotatably connected to the upper end of the second fixing plate (71). The plurality of sixth gears (76) are meshed with each other. A rigid tube (77) is fixedly connected to the inner surface of the plurality of sixth gears (76). A seventh gear (78) is rotatably connected to the upper end of the operating table (1) on the left side of the second fixing plate (71). A third roller (79) is arranged on the inner surface of the seventh gear (78). A fifth gear (75) is fixedly connected to the upper part of the outer surface of the third roller (79). The outer surface of the sixth gear (76) near the third roller (79) is meshed with the outer surface of the fifth gear (75). The outer surface of the seventh gear (78) can be meshed with the rear end of the second rack (291).

9. The soldering device for integrated circuit chip production according to claim 8, wherein: Two clamping plates (711) are fixedly connected to the upper right side of the second fixing plate (71). The middle part of the outer surface of the water bag (73) is fixedly connected to the side where the two clamping plates (711) are close to each other. The output end of the storage tank (72) is fixedly connected to a first hose (721). A second one-way valve (732) is fixedly connected to the rear side of the outer surface of the water bag (73). The inner surface of the second one-way valve (732) is fixedly connected to the first hose (721). A first one-way valve (731) is fixedly connected to the front side of the outer surface of the water bag (73). The inner surface of the first one-way valve (731) is fixedly connected to the end of the second hose (74) far from the rigid tube (77). The upper ends of the plurality of rigid tubes (77) are jointly rotatably connected to the output end of the second hose (74). Cotton brushes (771) are fixedly connected to the lower ends of the plurality of rigid tubes (77). A third one-way rotating shaft (781) is fixedly connected to the inner surface of the seventh gear (78). The inner surface of the third one-way rotating shaft (781) is fixedly connected to the lower part of the outer surface of the third roller (79).

10. A soldering device for integrated circuit chip production according to claim 6, characterized in that: The rotating mechanism (5) includes a cylinder (53) rotatably connected to the upper end of the operating table (1). A second one-way rotating shaft (52) is fixedly connected to the middle upper part of the outer surface of the cylinder (53). A third gear (51) is fixedly connected to the outer surface of the second one-way rotating shaft (52). Three guide plates (54) are fixedly connected to the upper end of the cylinder (53) in an annular array. A plurality of arc-shaped grooves (531) are formed in the inner surface of the cylinder (53) in an annular array. The mutually close sides of the three guide plates (54) are respectively slidably connected to the outer surfaces of the adapted circular sliders (441).

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