Wafer cutting apparatus and method with positioning correction function

Abstract

The application discloses a wafer cutting device and method with positioning correction function, which comprises a box body, a control panel, a clamping mechanism, a carrying mechanism, a cutting mechanism and a material frame. The clamping mechanism comprises a base, a contraction mechanism and a correction disc. The carrying mechanism comprises a horizontal movement module and a servo cylinder. The cutting mechanism comprises a three-axis displacement module, an intermittent mechanism and a rotary motor. The control panel, the base, the horizontal movement module, the three-axis displacement module and the material frame are fixedly connected with the box body. The contraction mechanism and the correction disc are fixedly connected with the base. The contraction mechanism comprises a first motor. The intermittent mechanism comprises a servo motor. The first motor, the horizontal movement module, the servo cylinder, the three-axis displacement module, the servo motor and the rotary motor are connected with the control panel through electric signals. The application relates to the technical field of wafer cutting machines. The wafer is clamped after automatic loading and positioning correction, and is cut multiple times at intervals, so that the deviation caused by cutting stress is reduced, and the production precision and efficiency are improved.

Description

Technical Field

[0001] This invention relates to the field of wafer cutting machine technology, specifically a wafer cutting device and method with positioning and correction functions. Background Technology

[0002] In today's era of rapid development in microelectronics technology, the complexity of integrated circuits is increasing exponentially, with system-on-a-chip (SoC) becoming the mainstream trend, where numerous electronic system functions are highly integrated into a single chip. This transformation has led to increasingly dense circuit structures on wafers, requiring precise dicing into individual chips, which places stringent demands on the accuracy and efficiency of wafer dicing. Simultaneously, as chip sizes continue to shrink and circuit layouts become more compact, the tolerance margin for dicing processes is drastically reduced. Any minute dicing deviation can damage the chip's circuitry, thereby affecting its performance and functionality. Therefore, the development of more advanced dicing technologies is urgently needed.

[0003] In modern semiconductor manufacturing processes, the widespread application of automated cutting technology is crucial for improving wafer cutting efficiency. Ensuring precise positioning and cutting accuracy is paramount; during wafer loading, accurate positioning correction and stable clamping are essential steps. It is required to ensure accurate wafer positioning and clamping while avoiding any form of damage to the wafer edges. Damage to the wafer edges can easily lead to clamping and positioning errors, which will further severely interfere with cutting accuracy in subsequent cutting processes. From the perspective of materials mechanics and process principles, during wafer cutting, when the cutting tool directly cuts the wafer, a momentary stress concentration occurs at the cutting line. This stress concentration causes the material on both sides of the wafer cutting line to shift outwards. At a microscopic level, this shift alters the originally planned cutting path, thus causing cutting errors. At a macroscopic level, the occurrence of cutting errors directly leads to a decrease in wafer yield, increases production costs, and reduces production efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer dicing apparatus and method with positioning and correction functions to solve the problems in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A wafer dicing device and method with positioning and correction function includes a housing, a control panel, a clamping mechanism, a conveying mechanism, a dicing mechanism, and a material frame. The clamping mechanism includes a base, a retraction mechanism, and a correction disc. The conveying mechanism includes a traverse module and a servo cylinder. The dicing mechanism includes a three-axis displacement module, an intermittent mechanism, and a rotary motor. The control panel, base, traverse module, three-axis displacement module, and material frame are all fixedly connected to the housing. The retraction mechanism and the correction disc are both fixedly connected to the base. The retraction mechanism includes a first motor, and the intermittent mechanism includes a servo motor. The first motor, traverse module, servo cylinder, three-axis displacement module, servo motor, and rotary motor are all electrically connected to the control panel.

[0006] This invention relates to automated laser cutting of wafers. A traverse module and a servo cylinder work together to adsorb and transfer the wafers in the feed frame to the clamping mechanism. The wafers are positioned, corrected, and clamped by a shrinking mechanism and a correction disk. After clamping, a three-axis displacement module drives the laser cutter to move within a three-axis space above the wafer. Intermittent laser cutting of the wafer is completed by an intermittent mechanism. When cutting a wafer, if the wafer is cut directly, stress will be generated along the cutting line, causing the wafer to shift outward on both sides of the cutting line, resulting in cutting errors and a decrease in wafer yield. Through intermittent cutting, the wafers on the cutting line are cut off at intervals after each intermittent cut. At this time, the connected parts on the cutting line keep the wafer from shifting due to stress. Through multiple intermittent cuts, the proportion of the connected parts to the total area of ​​the wafer becomes smaller during the last intermittent cut. Cutting off the connected parts of the wafer at this time can effectively reduce the shift of the wafer caused by cutting stress.

[0007] Furthermore, the clamping mechanism also includes a slide table, a compression spring, and an adsorption plate. A slide rail is provided on the base platform, and the slide table is slidably connected to the slide rail. The compression spring is fixedly connected to both the slide table and the slide rail. The adsorption plate is rotatably connected to the slide table. The shrinking mechanism also includes an annular platform, and the correction plate includes a bracket. Both the annular platform and the bracket are fixedly connected to the base platform.

[0008] The transport mechanism moves the wafer along the transverse module and places it on the adsorption plate and the correction plate. The adsorption plate is vacuumed intermittently to adsorb the wafer. When the shrinking mechanism pushes the wafer ring stage, the wafer is intermittently adsorbed by the adsorption plate. When the adsorption plate adsorbs the wafer, the slide table slides along the slide rail to compress the spring. When the adsorption plate does not adsorb the wafer, the slide table returns to its original position along the slide rail under the action of the compression spring. At the same time, the shrinking mechanism works with the correction plate to complete the positioning, correction and clamping of the wafer.

[0009] Furthermore, the shrinking mechanism also includes a rack, a pinion, an internal gear ring, an assembly frame, and a positioning plate. The ring-shaped platform is provided with a straight groove and an inner ring groove. There are two sets of straight grooves, racks, pinions, assembly frames, and positioning plates. The angle between the straight groove and the slide rail is 45 degrees. The first motor is fixedly connected to the ring-shaped platform. One set of pinions is fixedly connected to the output end of the first motor. The pinions mesh with the rack and the internal gear ring. The pinions are rotatably connected to the inner ring groove. The internal gear ring is slidably connected to the inner ring groove. The rack is slidably connected to the straight groove. The assembly frame is fixedly connected to the rack and the positioning plate. The positioning plate is provided with a straight edge and a first arc edge. The angle between the straight edge and the slide rail is 90 degrees. The first arc edge is adjacent to the straight edge.

[0010] The transport mechanism places the wafer on the positioning plate, the adsorption plate, and the correction plate. The first motor outputs a fixed-axis torque to a set of gears. The torque is transmitted through the meshing of the gears with the rack and the internal gear ring. The rack slides along the straight groove toward the center of the ring platform, and the two positioning plates close toward the center of the ring platform. When the adsorption plate adsorbs the wafer, the slide slides along the slide rail to compress the spring. The wafer slides along the first arc edge until the straight edge matches the pre-cut edge of the wafer. At the same time, the adsorption plate rotates on the slide. When the adsorption plate does not adsorb the wafer, the wafer is pushed toward the correction plate by the positioning plate. By intermittently adsorbing the wafer by the adsorption plate, the wafer is continuously fine-tuned to rotate until it matches the pre-cut edge and the straight edge, thus completing the positioning and correction of the wafer.

[0011] Furthermore, the correction disc also includes a semi-circular disc and a semi-cylinder. The semi-circular disc is provided with a semi-circular groove and a second arc edge. Several sets of semi-circular grooves and semi-cylinders are provided. Several sets of semi-circular grooves and semi-cylinders are evenly distributed along the curve of the second arc edge. The semi-cylinder is rotatably connected to the semi-circular groove. The semi-cylinder is provided with edge pillars. Several sets of edge pillars are provided. The edge pillars are located on the side of the semi-cylinder near the adsorption disc.

[0012] The straight edge of the positioning disk contacts the cutting edge of the wafer, pushing the wafer to contact the semi-cylinder on the semi-circular disk. When the adsorption disk does not adsorb the wafer and the straight edge matches the pre-cut edge of the wafer, the positioning correction of the wafer is completed. The semi-cylinder rotates with the wafer correction and clamps the wafer through the edge pillars of several sets of semi-cylinders evenly distributed along the second arc curve.

[0013] Furthermore, the conveying mechanism also includes a sliding plate and an adsorption mechanism. The sliding plate is slidably connected to the transverse module, and the adsorption mechanism also includes a slide bar frame and a disc body. The sliding plate is provided with a through hole, the slide bar frame is slidably connected to the through hole, and the disc body is fixedly connected to the slide bar frame and the output end of the servo cylinder.

[0014] The servo cylinder output pushes the disk body, the slide bar slides in the through hole, the disk body moves downward to contact and adsorb the wafer through the adsorption mechanism. After adsorption is completed, the servo cylinder output drives the disk body to reset, and the slide plate moves laterally along the transverse module to complete the adsorption and transportation of the wafer.

[0015] Furthermore, the adsorption mechanism also includes a vacuum nozzle and a vacuum pump. The vacuum nozzle is fixedly connected to the disc body, and there are four sets of vacuum nozzles. The four sets of vacuum nozzles are evenly distributed along the circumference of the disc body. The vacuum pump is fixedly connected to the slide plate, and the vacuum nozzle and the vacuum pump are connected through a hose.

[0016] The disk moves downwards and contacts the wafer's perimeter through four sets of vacuum nozzles evenly distributed along the disk's circumference. The vacuum pump draws a vacuum through a hose, and the vacuum nozzles adsorb the non-crystal parts around the wafer, completing the vacuum adsorption of the wafer.

[0017] Furthermore, the cutting mechanism also includes a square plate, a laser positioner, and a water sprayer. The three-axis displacement module is fixedly connected to the rotary motor, and the output end of the rotary motor is fixedly connected to the square plate. The square plate is provided with assembly holes, which are fixedly connected to the laser positioner. The intermittent mechanism also includes a side plate, and both the water sprayer and the side plate are fixedly connected to the square plate.

[0018] The three-axis displacement module moves the square plate above the wafer. The laser positioner identifies the identification points on the wafer. The three-axis displacement module drives the laser cutter to complete the displacement and cutting of the wafer. At the same time, the water sprayer cools the laser cutting points to prevent the high temperature of the laser from damaging the wafer. After the longitudinal cutting is completed, the rotary motor rotates the square plate, and the three-axis displacement module drives the square plate to perform transverse cutting of the wafer.

[0019] Furthermore, the intermittent mechanism also includes a laser cutter, a rotating rod, a reflective prism, and a turntable. The laser cutter and the servo motor are fixedly connected to the side plate, the output end of the servo motor is fixedly connected to the turntable, the rotating rod and the turntable are rotatably connected to the side plate, the rotating rod is provided with a sliding groove, the turntable is provided with a protruding post, the sliding groove contacts the protruding post, and the reflective prism is fixedly connected to the rotating rod.

[0020] When the three-axis displacement module drives the laser cutter to move and cut the wafer, the servo motor outputs fixed-axis torque to the turntable. The torque is transmitted to the turntable through the contact between the protrusion on the turntable and the slide groove on the rotating rod, causing the rotating rod to swing back and forth, driving the reflective prism to intermittently block the laser of the laser cutter.

[0021] Furthermore, the cutting method includes the following steps:

[0022] 1) The output end of the servo cylinder pushes the wafer in the adsorption frame and transports it to the shrinking mechanism through the transverse module: The output end of the servo cylinder pushes the disk, which contacts the adsorption wafer through the vacuum nozzle, and moves the wafer along the transverse module through the slide plate to adsorb and transport the wafer.

[0023] 2) Shrinkage mechanism and correction plate complete wafer positioning and correction clamping: The wafer is placed on the adsorption plate and the correction plate. The adsorption plate is evacuated intermittently. When the adsorption plate adsorbs the wafer, the slide table slides and compresses the spring. When the adsorption plate does not adsorb the wafer, the slide table resets under the action of the compression spring. The first motor outputs torque, the rack slides along the straight groove towards the center of the ring table, and the two positioning plates close. When the adsorption plate adsorbs the wafer, the slide table slides along the slide rail and compresses the spring. The wafer slides along the first arc edge until the straight edge matches the pre-cut edge of the wafer. At the same time, it drives the adsorption plate to rotate on the slide table. When the adsorption plate does not adsorb the wafer, the wafer is pushed towards the correction plate by the positioning plate. By intermittently adsorbing the wafer by the adsorption plate, the wafer is continuously fine-tuned to rotate until it matches the pre-cut edge and the straight edge of the wafer, thus completing the positioning and correction of the wafer.

[0024] 3) Laser cutting is completed by three-axis displacement on the wafer using a three-axis displacement module: The three-axis displacement module moves the square plate above the wafer, the laser positioner identifies the identification point on the wafer, the three-axis displacement module drives the laser cutter to complete the displacement cutting of the wafer, and the water sprayer cools the laser cutting point to prevent the high temperature of the laser from damaging the wafer. After the longitudinal cutting is completed, the rotary motor rotates the square plate, and the three-axis displacement module drives the square plate to perform transverse cutting of the wafer.

[0025] 4) During cutting, the intermittent mechanism adjusts the laser interval to complete the intermittent cutting: When the three-axis displacement module drives the laser cutter to move and cut the wafer, the servo motor outputs fixed-axis torque to the turntable. The torque is transmitted to the turntable through the contact between the convex post on the turntable and the slide groove on the rotating rod, causing the rotating rod to swing back and forth, driving the reflective prism to intermittently block the laser of the laser cutter.

[0026] Compared with the prior art, the beneficial effects of this invention are as follows: This invention designs a clamping mechanism. The wafer is placed on an adsorption plate and a correction plate. The adsorption plate is evacuated intermittently. When the adsorption plate adsorbs the wafer, the slide table slides and compresses the spring. When the adsorption plate does not adsorb the wafer, the slide table resets under the action of the compression spring. The first motor outputs torque, and the rack slides along the straight groove towards the center of the annular platform. The two positioning plates close together. When the adsorption plate adsorbs the wafer, the slide table slides along the slide rail and compresses the spring. The wafer slides along the first arc edge until the straight edge matches the pre-cut edge of the wafer. At the same time, it drives the adsorption plate to rotate on the slide table. When the adsorption plate does not adsorb the wafer, the wafer is pushed towards the correction plate by the positioning plate. Through the intermittent adsorption of the wafer by the adsorption plate, the wafer is continuously fine-tuned to rotate until it matches the pre-cut edge and the straight edge of the wafer, thus completing the positioning correction of the wafer. The high-frequency fine-tuning of the wafer reduces the hard collision damage to the wafer edge caused by direct correction, avoiding the cutting error caused by positioning deviation due to wafer damage. This invention designs an intermittent mechanism with a three-axis displacement module. When a laser cutter moves and cuts a wafer, a servo motor outputs a fixed-axis torque to the turntable. This torque is transmitted to the turntable via a protrusion on the turntable contacting a groove on a rotating rod, causing the rod to oscillate back and forth, intermittently blocking the laser beam from the cutter. If the wafer is cut directly, stress will be generated along the cutting line, causing the wafer to shift outwards on both sides of the cutting line, resulting in cutting errors and a decrease in wafer yield. Intermittent cutting, where wafers are cut at intervals after each interval, prevents the connected portions on the cutting line from shifting due to stress. Through multiple intermittent cuts, the proportion of the connected portion to the total wafer area decreases during the final intermittent cut. Cutting the connected portions at this point effectively reduces wafer shift caused by cutting stress. This invention automates wafer loading, positioning, correction, and clamping, performing multiple intermittent cuts to effectively reduce wafer shift caused by cutting stress, improving wafer cutting accuracy and production efficiency. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the clamping mechanism of the present invention;

[0029] Figure 3 This is a schematic diagram of the shrinkage mechanism structure of the present invention;

[0030] Figure 4 for Figure 2 A magnified view of part A;

[0031] Figure 5 This is a schematic diagram of the handling mechanism structure of the present invention;

[0032] Figure 6This is a schematic diagram of the adsorption mechanism of the present invention;

[0033] Figure 7 This is a schematic diagram of the cutting mechanism structure of the present invention;

[0034] Figure 8 This is a schematic diagram of the intermittent mechanism structure of the present invention.

[0035] In the diagram: 1. Housing; 2. Control panel; 3. Clamping mechanism; 31. Base; 311. Slide rail; 32. Slide table; 33. Compression spring; 34. Adsorption plate; 35. Retraction mechanism; 351. Ring-shaped platform; 3511. Straight groove; 3512. Inner ring groove; 352. Rack; 353. Gear column; 354. First motor; 355. Internal gear ring; 356. Assembly frame; 357. Positioning plate; 3571. Straight edge; 3572. First arc edge; 36. Correction plate; 361. Bracket; 362. Semicircular plate; 3621. Semicircular groove; 3622. Second arc edge; 363. Semicircular cylinder; 3631. Edge 4. Edge post; 4. Handling mechanism; 41. Lateral movement module; 42. Slide plate; 421. Through hole; 43. Servo cylinder; 44. Adsorption mechanism; 441. Slide rod frame; 442. Disc body; 443. Vacuum nozzle; 444. Vacuum pump; 5. Cutting mechanism; 51. Three-axis displacement module; 52. Square plate; 521. Assembly hole; 53. Laser positioner; 54. Water sprayer; 55. Intermittent mechanism; 551. Side plate; 552. Laser cutter; 553. Rotary rod; 5531. Slide groove; 554. Reflecting prism; 555. Turntable; 5551. Protruding post; 556. Servo motor; 56. Rotary motor; 6. Material frame. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] like Figure 1 , Figure 2 , Figure 5 , Figure 7As shown, the present invention provides a technical solution for a wafer dicing device and method with positioning and correction function, including a housing 1, a control panel 2, a clamping mechanism 3, a conveying mechanism 4, a dicing mechanism 5, and a material frame 6. The clamping mechanism 3 includes a base 31, a retraction mechanism 35, and a correction plate 36. The conveying mechanism 4 includes a transverse module 41 and a servo cylinder 43. The dicing mechanism 5 includes a three-axis displacement module 51, an intermittent mechanism 55, and a rotary motor 56. The control panel 2, base 31, transverse module 41, three-axis displacement module 51, and material frame 6 are all fixedly connected to the housing 1. The retraction mechanism 35 and the correction plate 36 are both fixedly connected to the base 31. The retraction mechanism 35 includes a first motor 354, and the intermittent mechanism 55 includes a servo motor 556. The first motor 354, transverse module 41, servo cylinder 43, three-axis displacement module 51, servo motor 556, and rotary motor 56 are all electrically connected to the control panel 2.

[0038] This invention is used for automated laser cutting of wafers. The transverse module 41 and the servo cylinder 43 work together to adsorb and transfer the wafer in the material frame 6 to the clamping mechanism 3. The positioning and correction clamping of the wafer is completed by the shrinking mechanism 35 and the correction disk 36. After clamping, the three-axis displacement module 51 drives the laser cutter 552 to move in the three-axis space above the wafer. The intermittent laser cutting of the wafer is completed by the intermittent mechanism 55. When cutting the wafer, if the wafer is cut directly, stress will be generated along the cutting line, causing the wafer to shift outward on both sides of the cutting line, which will cause cutting errors and reduce the wafer yield. Through intermittent cutting, the wafer on the cutting line is cut off at intervals after one intermittent cut. At this time, the connected part on the cutting line keeps the wafer from shifting due to stress. Through multiple intermittent cuts, the proportion of the connected part to the total area of ​​the wafer becomes smaller during the last intermittent cut. Cutting off the connected part of the wafer at this time can effectively reduce the shift of the wafer caused by cutting stress.

[0039] like Figure 2 , Figure 3 As shown, the clamping mechanism 3 also includes a slide table 32, a compression spring 33, and an adsorption plate 34. A slide rail 311 is provided on the base 31. The slide table 32 is slidably connected to the slide rail 311. The compression spring 33 is fixedly connected to both the slide table 32 and the slide rail 311. The adsorption plate 34 is rotatably connected to the slide table 32. The shrinking mechanism 35 also includes an annular platform 351. The correction plate 36 includes a bracket 361. The annular platform 351 and the bracket 361 are both fixedly connected to the base 31.

[0040] The transport mechanism 4 transports the wafer along the transverse module 41 and places the wafer on the adsorption plate 34 and the correction plate 36. The adsorption plate 34 is vacuumed intermittently to adsorb the wafer. When the shrinking mechanism 35 pushes the wafer ring stage 351, the wafer is intermittently adsorbed by the adsorption plate 34. When the adsorption plate 34 adsorbs the wafer, the slide table 32 slides along the slide rail 311 to compress the spring 33. When the adsorption plate 34 does not adsorb the wafer, the slide table 32 returns to its original position along the slide rail 311 under the action of the compression spring 33. At the same time, the shrinking mechanism 35 cooperates with the correction plate 36 to complete the positioning, correction and clamping of the wafer.

[0041] like Figure 2 , Figure 3 As shown, the retraction mechanism 35 also includes a rack 352, a toothed column 353, an internal toothed ring 355, an assembly frame 356, and a positioning plate 357. The annular platform 351 is provided with a straight groove 3511 and an inner ring groove 3512. The straight groove 3511, rack 352, toothed column 353, assembly frame 356, and positioning plate 357 are each provided in two sets. The angle between the straight groove 3511 and the slide rail 311 is 45 degrees. The first motor 354 is fixedly connected to the annular platform 351, and one set of toothed columns 353 is fixed to the output end of the first motor 354. The toothed column 353 is connected to the toothed rack 352 and the inner toothed ring 355, and the toothed column 353 is rotatably connected to the inner ring groove 3512. The inner toothed ring 355 is slidably connected to the inner ring groove 3512. The rack 352 is slidably connected to the straight groove 3511. The assembly frame 356 is fixedly connected to the rack 352 and the positioning plate 357. The positioning plate 357 is provided with a straight edge 3571 and a first arc edge 3572. The angle between the straight edge 3571 and the slide rail 311 is 90 degrees. The first arc edge 3572 is adjacent to the straight edge 3571.

[0042] The conveying mechanism 4 places the wafer on the positioning disk 357, the adsorption disk 34, and the correction disk 36. The first motor 354 outputs a fixed-axis torque to a set of toothed columns 353. The torque is transmitted through the meshing of the toothed columns 353 with the rack 352 and the internal toothed ring 355. The rack 352 slides along the straight groove 3511 toward the center of the ring stage 351. The two positioning disks 357 close toward the center of the ring stage 351. When the adsorption disk 34 adsorbs the wafer, the slide table 32 slides along the groove 357. The sliding compression spring 33 is compressed by the sliding rail 311, and the wafer slides along the first arc edge 3572 until the straight edge 3571 matches the pre-cut edge of the wafer. At the same time, the adsorption disk 34 is driven to rotate on the slide table 32. When the adsorption disk 34 does not adsorb the wafer, the wafer is pushed towards the correction disk 36 by the positioning disk 357. By intermittently adsorbing the wafer by the adsorption disk 34, the wafer is continuously finely adjusted to rotate until it matches the pre-cut edge and the straight edge 3571, thus completing the positioning and correction of the wafer.

[0043] like Figure 4As shown, the correction disk 36 also includes a semi-circular disk 362 and a semi-cylinder 363. The semi-circular disk 362 is provided with a semi-circular groove 3621 and a second arc edge 3622. The semi-circular groove 3621 and the semi-cylinder 363 are provided in several groups. The several groups of semi-circular grooves 3621 and semi-cylinders 363 are evenly distributed along the curve of the second arc edge 3622. The semi-cylinder 363 is rotatably connected to the semi-circular groove 3621. The semi-cylinder 363 is provided with an edge post 3631. The edge post 3631 is provided in several groups and is located on the side of the semi-cylinder 363 near the adsorption disk 34.

[0044] The straight edge 3571 of the positioning disk 357 contacts the cutting edge of the wafer, pushing the wafer to contact the semi-cylinder 363 on the semi-circular disk 362. When the adsorption disk 34 does not adsorb the wafer, the straight edge 3571 matches the pre-cut edge of the wafer, and the positioning correction of the wafer is completed, the semi-cylinder 363 rotates with the wafer correction, and the wafer is clamped by the edge pillars 3631 of several sets of semi-cylinders 363 evenly distributed along the curve of the second arc edge 3622.

[0045] like Figure 5 , Figure 6 As shown, the conveying mechanism 4 also includes a slide plate 42 and an adsorption mechanism 44. The slide plate 42 is slidably connected to the transverse module 41. The adsorption mechanism 44 also includes a slide bar frame 441 and a disc body 442. The slide plate 42 is provided with a through hole 421. The slide bar frame 441 is slidably connected to the through hole 421. The disc body 442 is fixedly connected to the slide bar frame 441 and the output end of the servo cylinder 43.

[0046] The output end of the servo cylinder 43 pushes the disk 442, and the slide bar 441 slides in the through hole 421. The disk 442 moves downward to contact and adsorb the wafer through the adsorption mechanism 44. After adsorption is completed, the output end of the servo cylinder 43 drives the disk 442 to reset. The disk 442 moves laterally along the transverse module 41 through the slide plate 42 to complete the adsorption and transportation of the wafer.

[0047] like Figure 6 As shown, the adsorption mechanism 44 also includes a vacuum nozzle 443 and a vacuum pump 444. The vacuum nozzle 443 is fixedly connected to the disc body 442. There are four sets of vacuum nozzles 443, which are evenly distributed around the circumference of the disc body 442. The vacuum pump 444 is fixedly connected to the slide plate 42. The vacuum nozzle 443 and the vacuum pump 444 are connected by a hose.

[0048] The disk 442 moves downward and contacts the wafer periphery through four sets of vacuum nozzles 443 evenly distributed around the circumference of the disk 442. The vacuum pump 444 draws a vacuum through a hose, and the vacuum nozzles 443 adsorb the non-crystal parts around the wafer, thus completing the vacuum adsorption of the wafer.

[0049] like Figure 7 , Figure 8As shown, the cutting mechanism 5 also includes a square plate 52, a laser positioner 53, and a water sprayer 54. The three-axis displacement module 51 is fixedly connected to the rotary motor 56. The output end of the rotary motor 56 is fixedly connected to the square plate 52. The square plate 52 is provided with an assembly hole 521, which is fixedly connected to the laser positioner 53. The intermittent mechanism 55 also includes a side plate 551. The water sprayer 54 and the side plate 551 are both fixedly connected to the square plate 52.

[0050] The three-axis displacement module 51 moves the square plate 52 above the wafer. The laser positioner 53 identifies the identification points on the wafer. The three-axis displacement module 51 drives the laser cutter 552 to complete the displacement cutting of the wafer. At the same time, the water sprayer 54 cools down the laser cutting points to prevent the high temperature of the laser from damaging the wafer. After the longitudinal cutting is completed, the rotary motor 56 rotates the square plate 52, and the three-axis displacement module 51 drives the square plate 52 to perform transverse cutting of the wafer.

[0051] like Figure 8 As shown, the intermittent mechanism 55 also includes a laser cutter 552, a rotating rod 553, a reflective prism 554, and a turntable 555. The laser cutter 552 and the servo motor 556 are both fixedly connected to the side plate 551. The output end of the servo motor 556 is fixedly connected to the turntable 555. The rotating rod 553 and the turntable 555 are both rotatably connected to the side plate 551. The rotating rod 553 is provided with a sliding groove 5531, and the turntable 555 is provided with a protruding post 5551. The sliding groove 5531 contacts the protruding post 5551. The reflective prism 554 is fixedly connected to the rotating rod 553.

[0052] When the three-axis displacement module 51 drives the laser cutter 552 to perform wafer displacement cutting, the servo motor 556 outputs fixed-axis torque to the turntable 555. The torque is transmitted to the turntable 553 through the contact between the protrusion 5551 on the turntable 555 and the slide groove 5531 on the rotating rod 553, causing the rotating rod 553 to swing back and forth, driving the reflective prism 554 to intermittently block the laser of the laser cutter 552.

[0053] like Figure 1 , Figure 2 , Figure 5 , Figure 7 As shown, the cutting method includes the following steps:

[0054] 1) The output end of the servo cylinder 43 pushes the wafer in the adsorption frame 6 and transports it to the shrinking mechanism 35 through the transverse module 41: The output end of the servo cylinder 43 pushes the disk 442, which contacts the adsorption wafer through the vacuum nozzle 443, and moves laterally along the transverse module 41 through the slide plate 42 to adsorb and transport the wafer.

[0055] 2) Shrinking mechanism 35 and correction disk 36 complete wafer positioning, correction, and clamping: The wafer is placed on the adsorption disk 34 and correction disk 36. The adsorption disk 34 is evacuated intermittently. When the adsorption disk 34 adsorbs the wafer, the slide table 32 slides and compresses the compression spring 33. When the adsorption disk 34 does not adsorb the wafer, the slide table 32 resets under the action of the compression spring 33. The first motor 354 outputs torque, and the rack 352 slides along the straight groove 3511 towards the center of the annular table 351. The two positioning disks 357 close, and the adsorption disk 35... 4. When adsorbing the wafer, the slide table 32 slides along the slide rail 311 to compress the spring 33, and the wafer slides along the first arc edge 3572 until the straight edge 3571 matches the pre-cut edge of the wafer. At the same time, the adsorption disk 34 is driven to rotate on the slide table 32. When the adsorption disk 34 does not adsorb the wafer, the wafer is pushed to the correction disk 36 by the positioning disk 357. By intermittently adsorbing the wafer by the adsorption disk 34, the wafer is continuously finely adjusted to rotate until it matches the pre-cut edge and the straight edge 3571, thus completing the positioning and correction of the wafer.

[0056] 3) Laser cutting is completed by three-axis displacement on the wafer through the three-axis displacement module 51: The three-axis displacement module 51 drives the square plate 52 to move above the wafer, the laser positioner 53 identifies the identification point on the wafer, the three-axis displacement module 51 drives the laser cutter 552 to complete the displacement cutting of the wafer, the water sprayer 54 cools down the laser cutting point to avoid the high temperature of the laser damaging the wafer. After the longitudinal cutting is completed, the rotary motor 56 rotates the square plate 52, and the three-axis displacement module 51 drives the square plate 52 to perform transverse cutting of the wafer.

[0057] 4) During cutting, the intermittent mechanism 55 adjusts the laser interval to complete the intermittent cutting: When the three-axis displacement module 51 drives the laser cutter 552 to perform wafer displacement cutting, the servo motor 556 outputs fixed-axis torque to the turntable 555. The torque is transmitted to the turntable 553 through the contact between the protrusion 5551 on the turntable 555 and the slide groove 5531 on the rotating rod 553, causing the rotating rod 553 to swing back and forth, driving the reflective prism 554 to intermittently block the laser of the laser cutter 552.

[0058] Working principle of the invention: This invention is used for automated laser cutting of wafers. The transverse module 41 and the servo cylinder 43 work together to adsorb and transfer the wafers in the material frame 6 to the clamping mechanism 3. The wafers are placed on the adsorption plate 34 and the correction plate 36. The adsorption plate 34 is evacuated intermittently. When the adsorption plate 34 adsorbs the wafers, the slide table 32 slides and compresses the compression spring 33. When the adsorption plate 34 does not adsorb the wafers, the slide table 32 resets under the action of the compression spring 33. The first motor 354 outputs torque, and the rack 352 moves along the straight groove 3511 towards the annular stage. Sliding along the center direction of 351, the two positioning disks 357 close together. When the adsorption disk 34 adsorbs the wafer, the slide table 32 slides along the slide rail 311 to compress the spring 33, and the wafer slides along the first arc edge 3572 until the straight edge 3571 matches the pre-cut edge of the wafer. At the same time, it drives the adsorption disk 34 to rotate on the slide table 32. When the adsorption disk 34 does not adsorb the wafer, the wafer is pushed towards the correction disk 36 by the positioning disk 357. By intermittently adsorbing the wafer by the adsorption disk 34, the wafer is continuously fine-tuned to rotate until it matches the pre-cut edge and the straight edge 357. 1. After the wafer is positioned and corrected, the three-axis displacement module 51 moves the laser cutter 552 within the three-axis space above the wafer. The servo motor 556 outputs a fixed-axis torque to the turntable 555. The torque is transmitted to the turntable 553 through the contact between the protrusion 5551 on the turntable 555 and the slide groove 5531 on the rotating rod 553. This causes the rotating rod 553 to swing back and forth, intermittently blocking the laser beam from the laser cutter 552 via the reflecting prism 554. When cutting the wafer, if the laser beam is directly applied... Direct wafer dicing generates stress along the dicing line, causing the wafer to shift outwards on both sides of the dicing line, resulting in dicing errors and a decrease in wafer yield. Intermittent dicing, on the other hand, cuts the wafers along the dicing line at intervals after each interval cut. This prevents the connected parts of the wafer from shifting due to stress. Through multiple intermittent cuts, the proportion of the connected parts to the total wafer area decreases during the final intermittent cut. Cutting the connected parts at this point effectively reduces the shift of the wafer caused by dicing stress.

[0059] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer dicing device with positioning and correction function, characterized in that: The cutting device includes a box (1), a control panel (2), a clamping mechanism (3), a carrying mechanism (4), a cutting mechanism (5) and a material frame (6), the clamping mechanism (3) includes a bottom table (31), a contraction mechanism (35) and a correction disc (36), the carrying mechanism (4) includes a horizontal movement module (41) and a servo cylinder (43), the cutting mechanism (5) includes a three-axis displacement module (51), an intermittent mechanism (55) and a rotary motor (56), the control panel (2), the bottom table (31), the horizontal movement module (41), the three-axis displacement module (51) and the material frame (6) are fixedly connected with the box (1), the contraction mechanism (35) and the correction disc (36) are fixedly connected with the bottom table (31), the contraction mechanism (35) includes a first motor (354), the intermittent mechanism (55) includes a servo motor (556), the first motor (354), the horizontal movement module (41), the servo cylinder (43), the three-axis displacement module (51), the servo motor (556) and the rotary motor (56) are connected with the control panel (2) through electric signals; The clamping mechanism (3) further includes a sliding table (32), a compression spring (33) and a suction disc (34), the bottom table (31) is provided with a sliding rail (311), the sliding table (32) is slidably connected with the sliding rail (311), the compression spring (33) is fixedly connected with the sliding table (32) and the sliding rail (311), the suction disc (34) is rotatably connected with the sliding table (32), the contraction mechanism (35) further includes a ring-shaped table (351), the correction disc (36) includes a support (361), and the ring-shaped table (351) and the support (361) are fixedly connected with the bottom table (31). The shrink mechanism (35) further includes a rack (352), a pin (353), an inner tooth ring (355), an assembly frame (356) and a positioning disc (357), the ring table (351) is provided with a linear groove (3511) and an inner ring groove (3512), the linear groove (3511), the rack (352), the pin (353), the assembly frame (356) and the positioning disc (357) are all provided with two groups, the included angle between the linear groove (3511) and the slide rail (311) is forty-five degrees, the first motor (354) is fixedly connected with the ring table (351), one group of the pin (353) is fixedly connected with the output end of the first motor (354), the pin (353) is in surface engagement with the rack (352) and the inner tooth ring (355), the pin (353) is rotatably connected with the inner ring groove (3512), the inner tooth ring (355) is slidably connected with the inner ring groove (3512), the rack (352) is slidably connected with the linear groove (3511), the assembly frame (356) is fixedly connected with the rack (352) and the positioning disc (357), the positioning disc (357) is provided with a straight edge (3571) and a first arc edge (3572), the included angle between the straight edge (3571) and the slide rail (311) is ninety degrees, and the first arc edge (3572) is adjacent to the straight edge (3571); The correction disc (36) further includes a semicircular disc (362) and a semicircular column (363), the semicircular disc (362) is provided with a semicircular groove (3621) and a second arc edge (3622), the semicircular groove (3621) and the semicircular column (363) are all provided with a plurality of groups, the plurality of groups of the semicircular groove (3621) and the semicircular column (363) are evenly distributed along the second arc edge (3622), the semicircular column (363) is rotatably connected with the semicircular groove (3621), the semicircular column (363) is provided with an edge column (3631), the edge column (3631) is provided with a plurality of groups, and the edge column (3631) is arranged on the semicircular column (363) close to the adsorption disc (34) side; The cutting mechanism (5) further includes a square plate (52), a laser positioner (53) and a water sprayer (54), the three-axis displacement module (51) is fixedly connected with the rotary motor (56), the output end of the rotary motor (56) is fixedly connected with the square plate (52), the square plate (52) is provided with an assembly hole (521), the assembly hole (521) is fixedly connected with the laser positioner (53), and the intermittent mechanism (55) further includes a side plate (551), the water sprayer (54) and the side plate (551) are fixedly connected with the square plate (52).

2. The wafer cutting apparatus having a positioning correction function according to claim 1, characterized by: The conveying mechanism (4) further comprises a sliding plate (42) and a suction mechanism (44), the sliding plate (42) is in sliding connection with the transverse movement module (41), the suction mechanism (44) further comprises a sliding rod frame (441) and a disc body (442), the sliding plate (42) is provided with a through hole (421), the sliding rod frame (441) is in sliding connection with the through hole (421), and the disc body (442) is in fixed connection with the sliding rod frame (441) and the output end of the servo air cylinder (43).

3. The wafer cutting apparatus having a positioning correction function according to claim 2, characterized in that: The suction mechanism (44) further comprises a vacuum nozzle (443) and a vacuum pump (444), the vacuum nozzle (443) is in fixed connection with the disc body (442), the vacuum nozzle (443) is provided with four groups, the four groups of vacuum nozzles (443) are uniformly distributed along the circumference of the disc body (442), the vacuum pump (444) is in fixed connection with the sliding plate (42), and the vacuum nozzle (443) is connected with the vacuum pump (444) through a hose.

4. The wafer cutting apparatus having a positioning correction function according to claim 1, characterized in that: The intermittent mechanism (55) further comprises a laser cutter (552), a rotating rod (553), a reflecting prism (554) and a rotating disc (555), the laser cutter (552) and the servo motor (556) are in fixed connection with the side plate (551), the output end of the servo motor (556) is in fixed connection with the rotating disc (555), the rotating rod (553) and the rotating disc (555) are in rotary connection with the side plate (551), the rotating rod (553) is provided with a sliding groove (5531), the rotating disc (555) is provided with a convex column (5551), the sliding groove (5531) is in contact with the convex column (5551), and the reflecting prism (554) is in fixed connection with the rotating rod (553).

5. The cutting method of the wafer cutting apparatus having a positioning correction function according to claim 1, characterized by: The cutting method comprises the following steps: 1) The output end of the servo air cylinder (43) pushes the wafer in the suction material frame (6), and transports the wafer to the contraction mechanism (35) through the transverse movement module (41); 2) The contraction mechanism (35) and the correction disc (36) complete the positioning, correction and clamping of the wafer; 3) The three-axis displacement module (51) is used for three-axis displacement on the wafer to complete laser cutting; 4) During cutting, the intermittent mechanism (55) adjusts the laser interval to complete interval cutting.

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