A circuit board welding device with automatic calibration function

Abstract

The application discloses a circuit mainboard welding device with an automatic calibration function and relates to the technical field of circuit mainboard welding. The device comprises a welding device main body and a controller. The welding device main body comprises a welding table. A clamping assembly is arranged on the welding table. The clamping assembly can clamp and limit a circuit mainboard. A detection assembly is installed at the bottom of the clamping assembly. The detection assembly can detect a spot welding position. A cooling assembly is installed on the side of the clamping assembly. The cooling assembly can cool the detection assembly. A driving bin is installed above the welding table. A welding assembly is arranged on the driving bin. The welding assembly cooperates with the clamping assembly. Therefore, the device can accurately detect finished products or defective products when in use. Meanwhile, the device can improve defective products in cooperation with the detection assembly, reduces the output of defective products, and effectively improves the finished product output rate when the device welds circuit mainboards.

Description

Technical Field

[0001] This invention relates to the field of circuit board soldering technology, specifically a circuit board soldering device with automatic calibration function. Background Technology

[0002] High-end equipment is mostly equipped with control systems composed of integrated circuits. Each integrated circuit board is made up of hundreds of electronic components soldered together. Currently, the main methods for soldering integrated circuit boards are wave soldering and reflow soldering. However, both wave soldering and reflow soldering require the entire circuit board to be placed in a high-temperature furnace for processing, which greatly damages the low-temperature sensitive electronic components in the circuit board. This makes it difficult to meet the soldering requirements of modern high-precision integrated circuit boards. However, specialized circuit board soldering equipment cannot accurately detect the size of the solder joints when soldering the motherboard. If the solder joints are too large or too small, the circuit board will not function properly. Subsequent repair of defective products will be more complicated, and repairs are mostly done manually, which will increase the workload. Summary of the Invention

[0003] The purpose of this invention is to provide a circuit board soldering device with automatic calibration function to solve the problems mentioned in the prior art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a circuit board soldering device with automatic calibration function, comprising a soldering equipment body and a controller. The soldering equipment body includes a soldering table, on which a clamping component is provided. The clamping component can clamp and limit the circuit board. A detection component is installed at the bottom of the clamping component, which can detect the spot welding position. A cooling component is installed on the side of the clamping component, which can cool the detection component. A drive chamber is installed above the soldering table, and a soldering component is provided on the drive chamber. The soldering component and the clamping component cooperate with each other.

[0005] Furthermore, the clamping assembly includes a limiting frame and a slider. The limiting frame has multiple sets of cooling holes on its inner side, and two sets of limiting grooves are respectively opened on the inner side of the limiting frame. The slider cooperates with the limiting grooves. A pressure block is provided at the deepest part of the limiting groove. Two sets of clamping plates and multiple sets of limiting springs are provided on the side of the slider away from the groove. A baffle is slidably installed between the two sets of clamping plates. The multiple sets of clamping assemblies are respectively installed on both sides of the circuit board. The clamping assembly can clamp circuit boards of different sizes.

[0006] Furthermore, the detection component includes a mounting housing, inside which multiple sets of sensing wires are installed. The sensing wires are equidistantly installed inside the mounting housing. Multiple sets of tension sensors are installed on the bottom surface inside the mounting housing. One end of each sensing wire is connected to the top surface inside the mounting housing, and the other end of each sensing wire is connected to a tension sensor. The multiple sets of sensing wires cooperate with the multiple sets of tension sensors, and the multiple sets of tension sensors are connected to a controller.

[0007] Furthermore, during the welding process, the heat received at the welding position is conducted to the detection component.

[0008] When the tension sensor experiences a tension force lower than the threshold, it indicates that the welding at the current welding position is insufficient.

[0009] When the tension sensor experiences a tension exceeding the threshold, it indicates that the current welding position is over-welded.

[0010] Furthermore, different styles of circuit boards are equipped with corresponding detection components, and the sensing wire is a memory metal wire;

[0011] When the sensing wire is heated, it will contract, pulling the tension sensor at the other end.

[0012] Furthermore, the cooling component includes two sets of mounting brackets, which are respectively installed in the limiting frame. A cooling plate is installed between the two sets of mounting brackets. The output surface of the cooling plate faces the cooling hole. The output surface of the cooling plate is provided with multiple sets of serrated grooves. The serrated grooves are equally spaced on the output surface of the cooling plate. The connection between the cooling component and the controller is blocked by a pressure block.

[0013] After the pressure block is pressed down by the slider, the controller will stop supplying power to the cooling component.

[0014] When the slider is not pressing down on the block, the controller will supply power to the cooling component.

[0015] Furthermore, a drive slot is provided on the side of the drive compartment, and a main spindle cylinder, a driven spindle cylinder and a lifting cylinder are provided inside the drive compartment. The driven spindle cylinder is mounted on the main spindle cylinder and can move on the main spindle cylinder. The lifting cylinder is mounted on the driven spindle cylinder and is perpendicular to the main spindle cylinder in the horizontal direction. The welding assembly is installed at the output end of the lifting cylinder.

[0016] Furthermore, the welding assembly includes a welding gun, the fixed surface of which is connected to a lifting cylinder, the welding gun being able to move up and down on the lifting cylinder, and multiple sets of position sensors being installed on the side of the welding gun.

[0017] Furthermore, the output direction of the multiple sets of position sensors is located at the same point as the output end of the welding gun, and the controller can adjust the drive chamber according to the position sensors.

[0018] Furthermore, the controller is installed on the side of the welding station, and the controller is equipped with a control panel, which is connected to the controller.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. When in use, this device can accurately detect finished or defective products. In conjunction with the detection components, it can improve defective products, reduce the output of defective products, and thus effectively improve the finished product yield when the device is soldering circuit boards.

[0021] 2. When in use, the clamping component can clamp the circuit board, confining it within the soldering area. This, in conjunction with the drive chamber and soldering component, completes the soldering of the circuit board. Furthermore, because baffles and limit springs are provided between the limiting plates, the clamping component can accommodate circuit boards of various sizes, enabling the device to perform soldering work on circuit boards of different sizes.

[0022] 3. The detection component of this device can detect the circuit board during use, preventing solder joints from being too large or too small during soldering. In actual use, because the detection component is installed between the clamping components, it is located at the bottom of the circuit board during normal operation. When the soldering components are soldering the circuit board at high temperatures, the high temperature generated during soldering is also conducted to the detection component. When one part of the detection component is heated, the sensing wire will contract. After the sensing wire contracts, the other end of the sensing wire will pull the tension sensor, which will then receive a value. The controller of the device will compare this value with a threshold value to determine whether the soldering position is correct and whether the soldering effect is good.

[0023] 4. The cooling component of this device can cool the detection component during use. Through the cooling component, the sensing wire inside the detection component can be restored to its state before detection. After the cooling component is powered on, the current is conducted to the cooling plate. The discharge direction of the cooling plate, when the current breaks down the air, generates ion wind. The serrated grooves set on the cooling plate are to increase the discharge surface area of ​​the cooling plate, so that the cooling plate can generate greater wind force during use, thereby achieving a better cooling effect. After cooling the detection component, the sensing wire inside the detection component can be restored to its state before detection, so that it can be used for subsequent use. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall isometric structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the welding station of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of the clamping component and the detection component of the present invention;

[0027] Figure 4 This is a cross-sectional structural diagram of the detection component of the present invention;

[0028] Figure 5 This is a cross-sectional view of the drive compartment of the present invention;

[0029] Figure 6 For the present invention Figure 1 An enlarged view of point "A" in the diagram;

[0030] Figure 7 For the present invention Figure 1 An enlarged view of section "B" in the middle;

[0031] Figure 8 For the present invention Figure 3 An enlarged view of point "C" in the middle.

[0032] In the diagram: 1. Main body of welding equipment; 11. Welding table; 2. Clamping assembly; 21. Limiting frame; 22. Slider; 23. Limiting groove; 24. Pressure block; 25. Clamping plate; 26. Limiting spring; 3. Detection assembly; 31. Mounting shell; 32. Induction wire; 33. Tension sensor; 4. Cooling assembly; 41. Mounting bracket; 42. Cooling plate; 5. Drive chamber; 51. Drive groove; 52. Main spindle cylinder; 53. Driven spindle cylinder; 54. Lifting cylinder; 6. Welding assembly; 61. Welding gun; 62. Position sensor; 7. Controller; 71. Control panel. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example: Figures 1-8As shown, the present invention provides a circuit board soldering device with automatic calibration function, including a soldering equipment body 1 and a controller 7. The soldering equipment body 1 includes a soldering table 11, on which a clamping component 2 is provided. The clamping component 2 can clamp and limit the circuit board. A detection component 3 is installed at the bottom of the clamping component 2. The detection component 3 can detect the spot welding position. A cooling component 4 is installed on the side of the clamping component 2. The cooling component 4 can cool the detection component 3. A drive chamber 5 is installed above the soldering table 11. A soldering component 6 is provided on the drive chamber 5. The soldering component 6 cooperates with the clamping component 2.

[0035] When using this device, the circuit board must first be placed into the clamping assembly 2. Then, the device is started via the controller 7. When the circuit board with the clamping plate 25 is placed into the limiting frame 21, the pressure block 24 located in the limiting groove 23 is squeezed by the clamping plate 25, causing the pressure block 24 to disconnect the power supply to the cooling assembly 4, thus stopping the cooling assembly 4 from operating during welding. Afterwards, the controller 7 controls the drive chamber 5, enabling it to drive the welding assembly 6 to weld the circuit board. During the welding process, the detection assembly 3 at the bottom of the clamping assembly 2 continuously monitors and detects the circuit board, providing real-time monitoring of the welding status and the welding process. In the process, the solder joints are checked for being too large or too small to prevent them from being too large. After the device completes the soldering of the circuit board, the operator can remove the circuit board. When the circuit board is removed, the pressure block 24 will no longer be under pressure. At this time, the pressure block 24 will not block the controller 7 from supplying power to the cooling component 4. Then the cooling component 4 will start to operate. When the cooling component 4 is in use, it can cool down the detection component 3, so that the sensing wire 32 inside the detection component 3 can return to its original state. This will not affect the normal use of the detection component 3 in subsequent use. Thus, when the device is in use, it can accurately solder the circuit board, so that the final circuit board product can reach the best state and reduce the output of defective products.

[0036] like Figures 1-3 and Figures 6-7 As shown, in this embodiment, specifically, the clamping component 2 includes a limiting frame 21 and a slider 22. The limiting frame 21 has multiple sets of cooling holes on its inner side and two sets of limiting grooves 23 are respectively opened on its inner side. The slider 22 cooperates with the limiting grooves 23. A pressure block 24 is provided at the deepest part of the limiting grooves 23. Two sets of clamping plates 25 and multiple sets of limiting springs 26 are provided on the side of the slider 22 away from the groove. A baffle is slidably installed between the two sets of clamping plates 25. Multiple sets of clamping components 2 are respectively installed on both sides of the circuit board. The clamping component 2 can clamp circuit boards of different sizes.

[0037] When in use, the clamping component 2 of this device can clamp the circuit board, confining it within the welding area. This, in conjunction with the drive chamber 5 and the welding component 6, completes the welding of the circuit board. In actual use, the operator first needs to place the clamping plate 25 on both sides of the circuit board, allowing the circuit board to slide into the limiting frame 21. When a set of sliders 22 moves to the deepest part of the limiting groove 23, the sliders 22 will press the pressure block 24, causing the pressure block 24 to be recessed. When the pressure block 24 is pressed, the controller 7 will stop supplying power to the cooling component 4 to prevent the cooling component 4 from affecting the welding effect during welding. At the same time, because baffles and limiting springs 26 are provided between the limiting plates, the clamping component 2 can adapt to circuit boards of various sizes, thus enabling the device to perform welding work on circuit boards of more different sizes.

[0038] like Figures 1-2 and Figure 4 As shown, in this embodiment, specifically, the detection component 3 includes a mounting shell 31, inside which multiple sets of sensing wires 32 are installed. The sensing wires 32 are equidistantly installed inside the mounting shell 31. Multiple sets of tension sensors 33 are installed on the bottom surface inside the mounting shell 31. One end of each sensing wire 32 is connected to the top surface inside the mounting shell 31, and the other end of each sensing wire 32 is connected to the tension sensor 33. The multiple sets of sensing wires 32 are respectively matched with the multiple sets of tension sensors 33, and the multiple sets of tension sensors 33 are respectively connected to the controller 7.

[0039] When in use, the detection component 3 of this device can detect the circuit board to prevent solder joints from being too large or too small during soldering. In actual use, because the detection component 3 is installed between the clamping components 2, it is located at the bottom of the circuit board during normal operation. When the soldering component 6 is soldering the circuit board, the high temperature generated during soldering will also be conducted to the detection component 3. When one part of the detection component 3 is heated, the sensing wire 32 will contract due to the heat. After the sensing wire 32 contracts, the other end of the sensing wire 32 will pull the tension sensor 33. At this time, the tension sensor 33 will obtain a value. The controller 7 of the device will compare this value with a threshold to determine whether the soldering position is correct and whether the soldering effect is good.

[0040] like Figure 4 As shown in this embodiment, specifically, when the welding component 6 is welding, the heat received at the welding position will be conducted to the detection component 3;

[0041] When the tension sensor 33 experiences a tension force lower than the threshold, it indicates that the welding at the current welding position is insufficient.

[0042] When the tension sensor 33 experiences a tension exceeding the threshold, it indicates that the current welding position is over-welded.

[0043] The high temperature generated during welding is also conducted to the detection component 3. When one part of the detection component 3 is heated, the sensing wire 32 will shrink. When the sensing wire 32 shrinks, the other end of the sensing wire 32 will pull the tension sensor 33. At this time, the tension sensor 33 will get a value. The controller 7 of the device will compare this value with the threshold to determine whether the welding position is correct and whether the welding effect is good.

[0044] like Figure 4 As shown in this embodiment, specifically, different styles of circuit boards are configured with corresponding detection components 3, and the sensing wire 32 is a memory metal wire;

[0045] When the sensing wire 32 is heated, the sensing wire 32 will contract, pulling the tension sensor 33 at the other end;

[0046] Because the soldering positions of different circuit boards are not all the same, it is necessary to replace the appropriate detection component 3 according to the different circuit boards so that the detection component 3 can always play a role. Since the sensing wire 32 is a memory metal wire, it can quickly contract when heated, thus pulling the tension sensor 33.

[0047] like Figure 3 and Figure 7 As shown, in this embodiment, specifically, the cooling component 4 includes two sets of mounting brackets 41, which are respectively installed in the limiting frame 21. A heat-reducing plate 42 is installed between the two sets of mounting brackets 41. The output surface of the heat-reducing plate 42 faces the cooling hole. The output surface of the heat-reducing plate 42 is provided with multiple sets of sawtooth grooves. The sawtooth grooves are equally spaced on the output surface of the heat-reducing plate 42. The connection between the cooling component 4 and the controller 7 is blocked by a pressure block 24.

[0048] After the pressure block 24 is pressed down by the slider 22, the controller 7 will stop supplying power to the cooling component 4.

[0049] When the slider 22 is not pressing down the block 24: the controller 7 will supply power to the cooling component 4;

[0050] The cooling component 4 of this device can cool the detection component 3 during use, restoring the sensing wire 32 inside the detection component 3 to its pre-detection state. Specifically, when the main circuit board is moved into the limiting groove 23 by the slider 22, the slider 22 presses down on the pressure block 24 inside the limiting groove 23. When the pressure block 24 is pressed down, the controller 7 disconnects the power supply to the cooling component 4, causing it to stop operating. After the main circuit board is soldered, it is removed, and the pressure block 24 is restored. At this point, the connection between the controller 7 and the cooling component 4 is closed. The system will then recover, and the controller 7 will distribute the current to the cooling component 4, enabling the cooling component 4 to work. After the cooling component 4 is powered on, the current is conducted to the heat dissipation plate 42. The discharge direction of the heat dissipation plate 42 will generate ion wind when the current breaks down the air. The serrated grooves on the heat dissipation plate 42 are designed to increase the discharge surface area of ​​the heat dissipation plate 42, so that the heat dissipation plate 42 can generate greater wind force during use, thereby achieving a better cooling effect. After cooling the detection component 3, the sensing wire 32 inside the detection component 3 can be restored to its state before detection, so that it can be used for subsequent use.

[0051] like Figure 5 As shown in this embodiment, specifically, the drive compartment 5 has a drive groove 51 on its side. The drive compartment 5 is equipped with a main spindle cylinder 52, a driven spindle cylinder 53 and a lifting cylinder 54. The driven spindle cylinder 53 is mounted on the main spindle cylinder 52 and can move on the main spindle cylinder 52. The lifting cylinder 54 is mounted on the driven spindle cylinder 53 and is perpendicular to the main spindle cylinder 52 in the horizontal direction. The welding assembly 6 is mounted on the output end of the lifting cylinder 54.

[0052] When in use, the drive chamber 5 of the device can adjust the position of the welding component 6 through internal components. Specifically, the main shaft cylinder 52 of the device can drive the driven shaft cylinder 53 to reciprocate in one direction, which can bring the welding component 6 closer to or away from the drive chamber 5. The driven shaft cylinder 53 can drive the lifting cylinder 54 to move horizontally on it, so that the welding component 6 can move horizontally between the drive slots 51, so that the welding component 6 can reach the optimal welding position. The lifting cylinder 54 can drive the welding component 6 to rise or fall on it, so that the welding component 6 can complete more precise welding.

[0053] like Figure 1 and Figure 5 As shown, in this embodiment, the welding assembly 6 specifically includes a welding gun 61. The fixed surface of the welding gun 61 is connected to the lifting cylinder 54. The welding gun 61 can move up and down on the lifting cylinder 54. Multiple sets of position sensors 62 are respectively installed on the side of the welding gun 61.

[0054] The welding component 6 of the device mainly consists of a welding gun 61 and a position sensor 62. It can assist in detecting whether the position is accurate when welding the circuit board. When welding the circuit board, it can be automatically corrected in conjunction with the detection component 3 to ensure that there is no welding position error.

[0055] like Figure 5 As shown, in this embodiment, specifically, the output direction of multiple sets of position sensors 62 is located at the same location as the output end of the welding gun 61, and the controller 7 can adjust the drive chamber 5 according to the position sensors 62;

[0056] Because the output direction of the position sensor 62 can be accurately pre-aimed at the welding position, it can work with the controller 7 to assist in adjusting the position of the welding component 6. In specific use, when the position of the welding component 6 is not as required by the program, the position sensor 62 will send a signal to the controller 7 so that the controller 7 can calibrate and adjust the position of the welding component 6.

[0057] like Figure 2 As shown in this embodiment, specifically, the controller 7 is installed on the side of the welding table 11, and the controller 7 is provided with a control panel 71, which is connected to the controller 7.

[0058] When in use, the device can control each component of the equipment through the controller 7. The controller 7 is equipped with a control panel 71. When using the device, the operator can control the controller 7 through the control panel 71, thereby indirectly controlling the equipment.

[0059] Working Principle: When using this device, the circuit board is first placed into the clamping assembly 2. Then, the device is started via the controller 7. When the circuit board with the clamping plate 25 is placed into the limiting frame 21, the pressure block 24 located in the limiting groove 23 is squeezed by the clamping plate 25, causing the pressure block 24 to disconnect the power supply to the cooling assembly 4, thus stopping the cooling assembly 4 from operating during welding. Afterwards, the controller 7 controls the drive chamber 5, enabling it to drive the welding assembly 6 to weld the circuit board. During welding, the detection assembly 3 at the bottom of the clamping assembly 2 continuously monitors and detects the circuit board, providing real-time monitoring of the welding status and detecting the welding process. During the process, it is important to check whether the solder joints are too large or too small to prevent them from becoming too large. After the device completes the soldering of the circuit board, the operator can remove the circuit board. When the circuit board is removed, the pressure block 24 will no longer be under pressure, and at this time, the pressure block 24 will not block the controller 7 from supplying power to the cooling component 4. Then, the cooling component 4 will start to operate. When the cooling component 4 is in use, it can cool down the detection component 3, so that the sensing wire 32 inside the detection component 3 can return to its original state. This ensures that the detection component 3 will not affect normal use in subsequent applications. In addition, when the device is in use, it can accurately solder the circuit board, so that the final circuit board product can reach the best state and reduce the production of defective products.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A circuit board soldering device with automatic calibration function, comprising a soldering equipment body (1) and a controller (7), characterized in that: The main body (1) of the welding equipment includes a welding table (11), a clamping component (2) is provided on the welding table (11), the clamping component (2) can clamp and limit the circuit board, a detection component (3) is installed at the bottom of the clamping component (2), the detection component (3) can detect the spot welding position, a cooling component (4) is installed on the side of the clamping component (2), the cooling component (4) can cool the detection component (3), a drive chamber (5) is installed above the welding table (11), a welding component (6) is provided on the drive chamber (5), and the welding component (6) cooperates with the clamping component (2). The detection component (3) includes a mounting shell (31), inside which are installed multiple sets of sensing wires (32). The sensing wires (32) are equidistantly installed inside the mounting shell (31). Multiple sets of tension sensors (33) are installed on the bottom surface inside the mounting shell (31). One end of the sensing wire (32) is connected to the top surface inside the mounting shell (31), and the other end of the sensing wire (32) is connected to the tension sensor (33). The multiple sets of sensing wires (32) are respectively matched with the multiple sets of tension sensors (33), and the multiple sets of tension sensors (33) are respectively connected to the controller (7). When the welding assembly (6) is welding, the heat received at the welding position will be conducted to the detection assembly (3); When the tension sensor (33) experiences a tension force lower than the threshold, it indicates that the welding at the current welding position is insufficient. When the tension sensor (33) experiences a tension exceeding the threshold, it indicates that the current welding position is over-welded. Different styles of circuit boards are equipped with corresponding detection components (3), and the sensing wire (32) is a memory metal wire; When the sensing wire (32) is heated, the sensing wire (32) will contract and pull the tension sensor (33) at the other end.

2. The circuit board soldering device with automatic calibration function according to claim 1, characterized in that: The clamping assembly (2) includes a limiting frame (21) and a slider (22). The limiting frame (21) has multiple cooling holes on its inner side. The limiting frame (21) has two limiting grooves (23) on its inner side. The slider (22) cooperates with the limiting grooves (23). A pressure block (24) is provided at the deepest part of the limiting grooves (23). The slider (22) has two clamping plates (25) and multiple limiting springs (26) on the side away from the groove. A baffle is slidably installed between the two clamping plates (25). Multiple clamping assemblies (2) are installed on both sides of the circuit board. The clamping assembly (2) can clamp circuit boards of different sizes.

3. The circuit board soldering device with automatic calibration function according to claim 2, characterized in that: The cooling component (4) includes two sets of mounting brackets (41), which are respectively installed in the limiting frame (21). A cooling plate (42) is installed between the two sets of mounting brackets (41). The output surface of the cooling plate (42) faces the cooling hole. The output surface of the cooling plate (42) is provided with multiple sets of sawtooth grooves. The sawtooth grooves are equally spaced on the output surface of the cooling plate (42). The connection between the cooling component (4) and the controller (7) is blocked by a pressure block (24). After the pressure block (24) is pressed down by the slider (22): the controller (7) will stop supplying power to the cooling component (4); When the slider (22) is not pressing down on the block (24): the controller (7) will supply power to the cooling component (4).

4. The circuit board soldering device with automatic calibration function according to claim 3, characterized in that: The drive chamber (5) has a drive groove (51) on its side. The drive chamber (5) is equipped with a main spindle cylinder (52), a driven spindle cylinder (53) and a lifting cylinder (54). The driven spindle cylinder (53) is mounted on the main spindle cylinder (52) and can move on the main spindle cylinder (52). The lifting cylinder (54) is mounted on the driven spindle cylinder (53) and is perpendicular to the main spindle cylinder (52) in the horizontal direction. The welding assembly (6) is mounted on the output end of the lifting cylinder (54).

5. A circuit board soldering device with automatic calibration function according to claim 4, characterized in that: The welding assembly (6) includes a welding gun (61), the fixed surface of which is connected to a lifting cylinder (54), the welding gun (61) can move up and down on the lifting cylinder (54), and multiple sets of position sensors (62) are installed on the side of the welding gun (61).

6. The circuit board soldering device with automatic calibration function according to claim 5, characterized in that: The output direction of the multiple sets of position sensors (62) is located at the same point as the output end of the welding gun (61), and the controller (7) can adjust the drive chamber (5) according to the position sensors (62).

7. A circuit board soldering device with automatic calibration function according to claim 6, characterized in that: The controller (7) is installed on the side of the welding station (11), and the controller (7) is provided with a control panel (71), which is connected to the controller (7).

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