Wafer thinning and polishing equipment

Abstract

The present application provides a wafer thinning and polishing device, which belongs to the field of semiconductor processing technology, including: a grinding disc, which is movable up and down; a circular suction cup, which is arranged directly below the grinding disc, and a strip groove is radially opened on the top of the circular suction cup and runs through its circumference; a lifting plate, which is movable up and down, and is spaced apart at the outward end of the strip groove, and a first U-shaped plate is provided on the top of the lifting plate; a temporary storage frame, which includes a first vertical frame and a pair of arc-shaped baffles that match the shape of the wafer circumference, and a plurality of pairs of support bars are arranged in a vertical array in the first vertical frame, and the first vertical frame is arranged in the first U-shaped plate; a first pushing mechanism, which is arranged on the side of the first U-shaped plate away from the circular suction cup, and the telescopic end of the first pushing mechanism is connected to one end of the strip suction cup through a push block, and the strip suction cup is arranged toward the strip groove. The device can realize automatic loading and unloading of wafers in wafer thinning production, thereby improving production efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor processing, and in particular relates to a wafer thinning and polishing device. Background Art

[0002] The semiconductor chip production process requires processes such as wafer thinning, wafer scribing, core bonding, wire bonding, and plastic encapsulation. Wafer thinning involves polishing the back of the wafer to reduce the subsequent overall packaging thickness to meet the needs of microelectronic products such as wearable devices and mobile terminals. Existing wafer thinning and polishing equipment typically consists of a suction cup and a grinding wheel. During polishing, the wafer is fixed above the suction cup, and then the grinding wheel above the suction cup polishes the back of the wafer. This requires manual labor to remove the wafer from the wafer storage frame and place it on the suction cup. After polishing, the wafer is removed and returned to the wafer storage frame. The wafer storage frame also needs to be transferred, which is quite labor-intensive. Some large-scale production lines often use multiple robots to load and unload wafers for thinning and polishing, as well as transfer wafer storage frames, to automate the wafer thinning and polishing process. However, the introduction of multiple robots increases production equipment costs and has high maintenance costs. Therefore, it is necessary to design a wafer thinning and polishing equipment to realize automatic loading and unloading of wafer thinning and polishing, and balance production efficiency and cost. Summary of the Invention

[0003] In order to solve the above-mentioned defects of the prior art, the present application provides a wafer thinning and polishing equipment, which can realize automatic loading and unloading of wafers in wafer thinning production, thereby improving production efficiency.

[0004] In order to achieve the above object, the present invention adopts the following technologies:

[0005] A wafer thinning and polishing device, comprising:

[0006] A grinding disc, the top of which is connected to an output shaft of a first motor, and the top of the first motor is connected to a telescopic end of a first lifting mechanism;

[0007] A circular suction cup is arranged directly below the grinding disc, and a first strip groove is radially opened on the top of the circular suction cup and runs through the circumference thereof;

[0008] A lifting plate is arranged to move up and down and is spaced apart at the outward end of the first strip groove. A first U-shaped plate is provided on the top of the lifting plate. The first U-shaped plate includes a first transverse section and two first vertical sections. The first transverse section and the first strip groove are arranged perpendicular to each other. The two first vertical sections are arranged on a side of the first transverse section away from the first strip groove, and the two first vertical sections are symmetrical relative to the first strip groove.

[0009] The temporary storage frame includes a first vertical frame and a pair of arc-shaped baffles that match the shape of the circumference of the wafer. The arc-shaped baffles are symmetrically arranged at one end of the first vertical frame. A plurality of pairs of support bars are arranged in an array along the vertical direction in the first vertical frame. The ends of the support bars close to the arc-shaped baffles are each provided with an extension section that matches the curvature of the arc-shaped baffle. The first vertical frame is arranged in the first U-shaped plate. The width of the first vertical frame matches the distance between the two first vertical sections.

[0010] The first pushing mechanism is arranged on a side of the first U-shaped plate away from the circular suction cup. The telescopic end of the first pushing mechanism is extended and retracted in a direction parallel to the first strip groove, and the telescopic end of the first pushing mechanism is connected to one end of the strip suction cup through a pushing block. The top height of the pushing block is higher than the top height of the strip suction cup. The height of the top of the strip suction cup matches the top height of the circular suction cup and the height of the top of the bottom support bar. The strip suction cup is arranged toward the first strip groove. When the telescopic end of the first pushing mechanism is fully pushed out, the strip suction cup completely enters the first strip groove. When the telescopic end of the first pushing mechanism is fully retracted, the strip suction cup is outside the temporary storage frame.

[0011] Furthermore, an arc-shaped limiting plate is provided on a side of the first U-shaped plate away from the circular suction cup. When the temporary storage frame is in the first U-shaped plate, the arc-shaped limiting plate abuts against the arc-shaped baffle.

[0012] Furthermore, a plurality of guide rods are vertically provided on the lifting plate, the guide rods are fixed in a second vertical frame, a receiving groove is provided at the top of the second vertical frame for accommodating the first U-shaped plate and the arc-shaped limit plate, the lifting plate is threadedly connected to a first screw rod, the first screw rod is vertically rotatably connected to the second vertical frame, and the top of the first screw rod is connected to the output shaft of a second motor.

[0013] Furthermore, the arc-shaped limiting plate is fixed to the two walls of the accommodating groove, and the first U-shaped plate is fixedly connected to the top surface of the lifting plate.

[0014] Furthermore, the bottom of the circular suction cup is connected to the telescopic end of a second lifting mechanism that is vertically arranged upward.

[0015] Furthermore, a first conveying mechanism is provided below the first pushing mechanism, and the conveying direction of the first conveying mechanism is parallel to the length direction of the first strip groove. A pair of second pushing mechanisms parallel to the first pushing mechanism are provided below the circular suction cup, and the telescopic ends of the second pushing mechanisms are vertically connected to vertical push plates. When the temporary storage frame is lowered to the maximum limit, the two vertical push plates are respectively directed toward the two side walls of the first vertical frame away from one end of the arc-shaped baffle, and the bottom height of the temporary storage frame matches the top height of the first conveying mechanism.

[0016] Furthermore, a second conveying mechanism parallel to the first conveying mechanism is provided on one side of the first conveying mechanism for conveying a temporary storage frame. An alignment plate is vertically provided at one end of the second conveying mechanism, and the inward side of the alignment plate is aligned with the inner side of the first transverse section. A straight line mechanism is horizontally provided above the second conveying mechanism, and the movable end of the straight line mechanism is vertically connected to one end of a rectangular block on the side away from the outer side of the second conveying mechanism. The moving direction of the movable end of the straight line mechanism is perpendicular to the conveying direction of the second conveying mechanism. A second U-shaped plate is provided on the top of the first vertical frame, and the second U-shaped plate includes a second transverse section and a pair of second vertical sections vertically arranged at the bottom of the second transverse section. The second vertical section is connected to the top of the first vertical frame, and the second vertical section is parallel to the alignment plate. The height of the rectangular block matches the second U-shaped plate on the temporary storage frame placed on the second conveying mechanism, and the size of the rectangular block matches the internal size of the second U-shaped plate. When the side of the first vertical frame of the temporary storage frame placed on the second conveying mechanism away from the arc baffle abuts against the alignment plate, the second U-shaped plate is aligned with the rectangular block. When the lifting plate rises to its maximum limit, the top height of the first U-shaped plate is higher than the top height of the second conveying mechanism.

[0017] Furthermore, baffles are provided on both sides of the second conveying mechanism, the distance between the two baffles matches the width of the first vertical frame, and a baffle on the inner side of the second conveying mechanism is provided with a notch near the top of one end of the alignment plate, and the height of the bottom of the notch matches the height of the top of the second conveyor belt.

[0018] The beneficial effects of the present invention are:

[0019] 1. The use of this equipment can realize automatic loading and unloading of wafers during the wafer thinning production process, which can reduce labor and improve production efficiency;

[0020] 2. The second conveying mechanism and the linear mechanism cooperate to transfer the temporary storage frame and the wafers to be thinned to the first U-shaped plate, realizing automatic loading of the temporary storage frame. The temporary storage frame is driven down by the lifting plate, and the first conveying mechanism and the second pushing mechanism cooperate to transfer the temporary storage frame and the wafers that have been thinned, realizing automatic unloading of the temporary storage frame.

[0021] 3. The rectangular block used to transfer the temporary storage frame can automatically rise and fall in the second strip groove, avoiding the first U-shaped plate on the top of the temporary storage frame. There is no need to close the second conveying mechanism when transferring the temporary storage frame on the second conveying mechanism, which can improve the continuity of conveying the temporary storage frame and further improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a three-dimensional diagram of the overall structure of the device according to the embodiment of the present application.

[0023] Figure 2 This is a three-dimensional diagram of the overall structure when the temporary storage frame is placed in the first U-shaped plate of the device of the embodiment of the present application.

[0024] Figure 3 This is a three-dimensional diagram of the overall structure of the device according to an embodiment of the present application from another perspective.

[0025] Figure 4 This is a three-dimensional diagram of the structure of the temporary storage frame in the device of the embodiment of the present application.

[0026] Figure 5 This is a three-dimensional diagram of the partial structure of the device according to the embodiment of the present application.

[0027] Figure 6 This is a rear view of the device according to an embodiment of the present application.

[0028] Figure 7 This is a three-dimensional diagram of the result when the lifting plate of the device of the embodiment of the present application is lowered to the lowest point.

[0029] Figure 8 for Figure 7 Enlarged view of part A in the middle.

[0030] Figure 9 This is a structural stereogram of the linear mechanism of the device according to the embodiment of the present application driving the temporary storage frame to move into the first U-shaped plate.

[0031] Figure 10 This is a structural stereogram of the first linear mechanism of the device according to the embodiment of the present application driving the temporary storage frame to move.

[0032] Figure 11 This is a three-dimensional diagram of the connection structure of the guide strip and the guide plate in the device of the embodiment of the present application.

[0033] Figure 12 for Figure 10 Enlarged view of part B in the middle.

[0034] Figure 13 This is a three-dimensional diagram of the partial structure of the linear mechanism in the device of the embodiment of the present application.

[0035] Figure numerals: grinding disc 1, circular suction cup 2, lifting plate 3, first U-shaped plate 4, temporary storage frame 5, first pushing mechanism 6, arc-shaped limiting plate 7, second lifting mechanism 8, first conveying mechanism 9, second pushing mechanism 10, second conveying mechanism 11, linear mechanism 12, first motor 101, first lifting mechanism 102, support frame 103, first strip groove 201, second vertical frame 301, guide rod 302, first screw rod 303, second motor 304, accommodating groove 3011, first horizontal section 401, first vertical section 402, first vertical frame 501, arc-shaped baffle 502, support bar 503, second U-shaped plate 504 , second horizontal section-5041, second vertical section-5042, push block-601, strip suction cup-602, vertical push plate-1001, alignment plate-1101, baffle-1102, notch-1103, movable block-1201, rectangular block-1202, second screw rod-1203, guide rail-1204, support plate-1205, second strip groove-1206, guide bar-13, inclined surface-1301, rotating shaft-1302, guide plate-14, torsion spring-1401, through groove-1207, horizontal plate-1208, slider-1209, spring-1210, connecting piece-1211, vertical plate-1212, guide column-1213, third motor-1214. DETAILED DESCRIPTION

[0036] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0037] The present application provides a wafer thinning and polishing device, such as Figures 1-9 As shown, it includes a grinding disc 1, a circular suction cup 2, a lifting plate 3, a temporary storage frame 5, a first pushing mechanism 6, etc.

[0038] Specifically, the top of the grinding disc 1 is connected to the output shaft of a first motor 101, the top of the first motor 101 is connected to the telescopic end of a first lifting mechanism 102, the first lifting mechanism 102 is fixed to the top of a support frame 103, and the telescopic end of the first lifting mechanism 102 passes through the top of the support frame 103 and is connected to the first motor 101; the circular suction cup 2 is arranged directly below the grinding disc 1, and is used to adsorb and fix the wafer to be thinned and polished. The top of the circular suction cup 2 is radially provided with a first strip groove 201 running through its circumference; the lifting plate 3 is arranged to move up and down, and the lifting plate 3 is arranged at intervals in the first strip groove 201 facing outward. At one end of the lifting plate 3, a first U-shaped plate 4 is provided on the top of the lifting plate 3, and the first U-shaped plate 4 includes a first transverse section 401 and two first vertical sections 402. The first transverse section 401 and the first strip groove 201 are arranged perpendicular to each other, and the two first vertical sections 402 are arranged on the side of the first transverse section 401 away from the first strip groove 201, and the two first vertical sections 402 are symmetrical with respect to the first strip groove 201; the temporary storage frame 5 includes a first vertical frame 501 and a pair of arc-shaped baffles 502 matching the shape of the circumferential side of the wafer, and the arc-shaped baffles 502 are symmetrically arranged at one end of the first vertical frame 501. The vertical array is provided with multiple pairs of support bars 503 for supporting wafers. The end of the support bar 503 close to the arc baffle 502 is provided with an extension section that matches the curvature of the arc baffle 502, which is used to increase the contact area with the wafer placed above it. The first vertical frame 501 is provided in the first U-shaped plate 4. The width of the first vertical frame 501 matches the distance between the two first vertical sections 402; the first pushing mechanism 6 is provided on the side of the first U-shaped plate 4 away from the circular suction cup 2. The telescopic direction of the telescopic end of the first pushing mechanism 6 is parallel to the first strip groove 201, and the telescopic end of the first pushing mechanism 6 is connected to the first strip groove 201 through a pushing block 60. 1 is connected to one end of a strip suction cup 602. The top height of the pushing block 601 is higher than the top height of the strip suction cup 602, and is used to push the wafers in the temporary storage frame 5. The strip suction cup 602 is arranged toward the first strip groove 201. When the lifting plate 3 rises to the highest point, the height of the top of the strip suction cup 602 matches the height of the top of the circular suction cup 2 and the height of the top of the bottom support bar 503. When the telescopic end of the first pushing mechanism 6 is fully pushed out, the strip suction cup 602 completely enters the first strip groove 201. When the telescopic end of the first pushing mechanism 6 is fully retracted, the strip suction cup 602 is outside the temporary storage frame 5.

[0039] In actual use, the lifting plate 3 is raised to the highest point, and the temporary storage frame 5 with multiple wafers is placed in the first U-shaped plate 4, and the first vertical frame 501 is abutted against the first horizontal section 401 of the first U-shaped plate 4. At this time, the height of the bottom of the wafer on the support bar 503 at the bottom of the temporary storage frame 5 will match the height of the top of the strip suction cup 602. At this time, the telescopic end of the first pushing mechanism 6 is controlled to be pushed out. When the pushing block 601 abuts the wafer at the bottom, the strip suction cup 602 is controlled to open and absorb the wafer Specifically, distance sensors can be set on both sides of the push block 601 to determine whether the push block 601 is in contact with the wafer. As the first pushing mechanism 6 drives the strip suction cup 602 to continue to move forward, the strip suction cup 602 will completely enter the first strip groove 201 on the circular suction cup 2, and the wafer will reach directly above the circular suction cup 2. At this time, the circular suction cup 2 is controlled to adsorb the wafer, and then the first lifting mechanism 102 is controlled to drive the grinding disc 1 to descend to contact the wafer, and the first motor 101 is turned on to start grinding. After completing the thinning and grinding, control the first lifting mechanism 102 to drive the grinding disc 1 to rise, then close the circular suction cup 2, and control the telescopic end of the first pushing mechanism 6 to retract so that the polished wafer can return to the top of the bottom support bar 503, completing the automatic unloading of the wafer, and then control the lifting plate 3 to move downward by a first preset distance, so that the next wafer from the bottom to the top drops to match the top height of the bar suction cup 602, and repeat the above steps to achieve thinning and grinding of multiple wafers in the temporary storage frame 5, and make the wafers that have been thinned and polished automatically return to the temporary storage frame 5 to achieve automatic unloading.

[0040] Specifically, the upper portion of one end of the push block 601 close to the strip suction cup 602 is in an arc shape that matches the shape of the circumference of the wafer. When the push block 601 abuts the wafer, it can increase its contact area with the circumference of the wafer and improve stability during the pushing process.

[0041] Preferably, see Figure 1 A curved stopper plate 7 is provided on the side of the first U-shaped plate 4 away from the circular suction cup 2. When the temporary storage frame 5 is inside the first U-shaped plate 4, the curved stopper plate 7 abuts against the curved baffle 502. Because the curved stopper plate 7 and the first U-shaped plate abut against the temporary storage frame 5 at the same time, the temporary storage frame 5 is prevented from moving horizontally, thereby preventing the vibration generated during the polishing process from causing the temporary storage frame 5 to move horizontally.

[0042] For details, see Figure 5The lifting plate 3 is vertically provided with a plurality of guide rods 302, which are fixed in a second vertical frame 301. A receiving groove 3011 is provided at the top of the second vertical frame 301 for receiving the first U-shaped plate 4 and the arc-shaped limit plate 7. The lifting plate 3 is threadedly connected to a first screw rod 303, which is vertically rotatably connected to the second vertical frame 301. The top of the first screw rod 303 is connected to the output shaft of a second motor 304. When the lifting plate 3 needs to be raised or lowered, the second motor 304 is controlled to drive the first screw rod 303 to rotate, so that the lifting plate 3 can move up and down along the guide rod 302. For more details, refer to Figure 5 The arc-shaped limiting plate 7 is fixed in the receiving groove 3011, and the first U-shaped plate 4 is fixedly connected to the lifting plate 3. When the lifting plate 3 descends, the first U-shaped plate 4 will follow the lifting plate 3 and descend synchronously. The bottom of the first vertical frame 501 of the temporary storage frame 5 in the first U-shaped plate 4 will always abut against the first U-shaped plate 4, and the arc-shaped limiting plate 7 will reach the height of the arc-shaped baffle 502, thereby achieving the staggered fixing of the arc-shaped plate and the first U-shaped plate to the temporary storage frame 5, further improving the stability of the temporary storage frame 5 during movement.

[0043] Preferably, see Figure 3 、 Figure 6 The bottom of the circular suction cup 2 is connected to the telescopic end of a second lifting mechanism 8. Before the first pushing mechanism 6 pushes the wafer out of the temporary storage frame 5 via the strip suction cup 602, the telescopic end of the second lifting mechanism 8 can be controlled to drive the circular suction cup 2 down to below the strip suction cup 602. After the first pushing mechanism 6 transfers the wafer to the top of the circular suction cup 2 via the strip suction cup 602, the second lifting mechanism 8 is controlled to drive the circular suction cup 2 up to contact the wafer, and then the circular suction cup 2 is controlled to absorb the wafer. This method prevents the wafer from being rubbed by the circular suction cup 2 during the process of being fully pushed to the top of the circular suction cup 2, thereby reducing wafer wear.

[0044] Preferably, see Figure 6 、 Figure 7 A first conveying mechanism 9 is provided below the first pushing mechanism 6. The conveying direction of the first conveying mechanism 9 is parallel to the length direction of the first strip groove 201. A pair of second pushing mechanisms 10 parallel to the first pushing mechanism 6 is provided below the circular suction cup 2. The telescopic ends of the second pushing mechanisms 10 are vertically connected to vertical push plates 1001. When the temporary storage frame 5 drops to the maximum limit, the two vertical push plates 1001 respectively face one end of the two side walls of the first vertical frame 501 away from the arc-shaped baffle 502, and the bottom height of the temporary storage frame 5 matches the top height of the first conveying mechanism 9. At this time, the telescopic end of the second pushing mechanism 10 is controlled to be pushed out, and the temporary storage frame 5 that has dropped to the lowest point and the wafers that have completed thinning and polishing in the temporary storage frame 5 can be pushed to the top of the first conveying mechanism 9 through a pair of vertical push plates 1001, and the unloading and conveying of the temporary storage frame 5 is completed by the first conveying mechanism 9.

[0045] Preferably, see Figure 4 、 Figure 7-Figure 9 A second conveying mechanism 11 is provided on one side of the first conveying mechanism 9 and is parallel to the first conveying mechanism 9 for conveying the temporary storage frame 5. An alignment plate 1101 is provided vertically at one end of the second conveying mechanism 11. The inner side of the alignment plate 1101 is aligned with the inner side of the first transverse section 401. A straight mechanism 12 is provided horizontally above the second conveying mechanism 11. The movable end of the straight mechanism 12 is away from the outer side of the second conveying mechanism 11 and is vertically connected to one end of a rectangular block 1202. The moving direction of the movable end of the straight mechanism 12 is perpendicular to the conveying direction of the second conveying mechanism 11. A second U-shaped plate 504 is provided on the top of the first vertical frame 501. The second U-shaped plate 504 includes a second transverse section 5041 and a second transverse section 5041 provided vertically. A pair of second vertical sections 5042 at the bottom of 5041, the second vertical section 5042 is connected to the top of the first vertical frame 501, and the second vertical section 5042 is parallel to the alignment plate 1101, the rectangular block 1202 matches the height of the second U-shaped plate 504 on the temporary storage frame 5 placed on the second conveying mechanism 11, and the size of the rectangular block 1202 matches the internal size of the second U-shaped plate 504. When the side of the first vertical frame 501 of the temporary storage frame 5 placed on the second conveying mechanism 11 away from the arc baffle 502 abuts against the alignment plate 1101, the second U-shaped plate 504 is aligned with the rectangular block 1202. When the lifting plate 3 rises to the maximum limit, the top height of the first U-shaped plate 4 is higher than the top height of the second conveying mechanism 11. When the temporary storage frame 5 needs to be placed in the first U-shaped plate 4, the conveying mechanism is controlled to drive the temporary storage frame 5 conveyed above it to move toward the alignment plate 1101. When the temporary storage frame 5 close to the alignment plate 1101 abuts the alignment plate 1101, the movable end of the linear mechanism 12 is controlled to drive the rectangular block 1202 to move toward the first U-shaped plate 4. During the movement, because the second U-shaped plate 504 on the top of the temporary storage frame 5 abutting the alignment plate 1101 is aligned with the rectangular block 1202, the rectangular block 1202 will enter the second U-shaped plate 504, the movable end of the linear mechanism 12 will abut the second U-shaped plate 504, and push The second U-shaped plate 504 and the temporary storage frame 5 move toward the first U-shaped plate 4. When the temporary storage frame 5 moves to the top of the second U-shaped plate 504, the lifting plate 3 is controlled to move upward to the maximum limit. At this time, the temporary storage frame 5 will enter the second U-shaped plate 504. Then the linear mechanism 12 is controlled to drive the rectangular block 1202 to move toward the second conveying mechanism 11. Because the temporary storage frame 5 is blocked by the vertical section of the second U-shaped plate 504 and will not move with the rectangular block 1202, the rectangular block 1202 can be separated from the second U-shaped plate 504, causing the temporary storage frame 5 to drop to the top of the lifting plate 3, completing the loading of the temporary storage frame 5.

[0046] For details, see Figure 7, baffles 1102 are provided on both sides of the second conveying mechanism 11, and the distance between the two baffles 1102 matches the width of the first vertical frame 501, which is used to prevent the temporary storage box 5 from tilting during the movement on the second conveying mechanism 11. A baffle 1102 on the inner side of the second conveying mechanism 11 is provided with a notch 1103 at the top of one end near the alignment plate 1101, and the height of the bottom of the notch 1103 matches the height of the top of the second conveyor belt, which is used to avoid blocking the temporary storage box 5 from moving toward the first U-shaped plate 4.

[0047] For details, see Figure 10 、 Figure 12 The linear mechanism includes a movable block 1201, a guide rail 1204, and a second screw rod 1203. The guide rail 1204 is mounted above the second conveying mechanism 11 and the first U-shaped plate 4 through a pair of support plates 1205. The length direction of the guide rail 1204 is parallel to the width direction of the second conveying mechanism 11. A sliding groove is provided at the bottom of the guide rail 1204 along the length direction. The second screw rod 1203 is rotatably arranged between the pair of support plates 1205. The movable block 1201 is the movable end of the linear mechanism and is slidably arranged in the sliding groove. The second screw rod 1203 is threadedly connected to the movable block 1201. One end of the second screw rod 1203 is connected to the output shaft of a third motor 1214. When it is necessary to control the movable end of the linear mechanism to drive the rectangular block 1202 to move, the third motor 1214 is controlled to drive the second screw rod 1203 to rotate, thereby driving the movable block 1201 and the rectangular block 1202 to move along the sliding groove, thereby driving the temporary storage frame 5 to transfer.

[0048] When transferring the temporary storage frame 5 from the second conveying mechanism 11 to the first U-shaped plate 4 in the above manner, it is necessary to control the second conveying mechanism 11 to adjust the conveyance of the temporary storage frame 5 to prevent the first U-shaped plate 4 on the top of the subsequent temporary storage frame 5 from blocking the rectangular block 1202. It is necessary to wait until the linear mechanism drives the rectangular block 1202 to reset before continuing to control the second conveying mechanism 11 to convey the temporary storage frame 5 to the positioning plate 1101, which will affect the continuity of the second conveying mechanism 11 in conveying the temporary storage frame 5 and affect production efficiency.

[0049] In one embodiment, see Figure 10-13, both sides of the guide rail 1204 are provided with a second strip groove 1206 along the length direction, and a guide bar 13 parallel to the second strip groove 1206 is provided in the second strip groove 1206. The guide bar 13 is arranged just above the second conveying mechanism 11, and the end of the guide bar 13 away from the first U-shaped plate 4 is an inclined surface 1301 with the bottom inclined toward the U-shaped plate. One end of the guide bar 13 with the inclined surface 1301 is rotatably connected to a guide plate 14 through a rotating shaft 1302. The rotating shaft 1302 is perpendicular to the side of the guide rail 1204. A torsion spring 1401 is provided outside the rotating shaft 1302. The two ends of the torsion spring 1401 are respectively connected to the guide plate 14 and the guide bar 13. When the guide plate 14 rotates upward to abut against the first When the top of the two strip grooves 1206 is at the top, the top of the guide plate 14 is tilted in the direction away from the first U-shaped plate 4, and the torsion spring 1401 is in a natural state; the movable block 1201 is provided with a through groove 1207 running through both ends thereof, and a horizontal plate 1208 is connected to the through groove 1207 in a vertical sliding direction, and a slider 1209 is connected to the bottom of the horizontal plate 1208. The slider 1209 passes through the bottom of the movable block 1201 and is connected to the rectangular block 1202. Connecting pieces 1211 are provided at both ends of the movable block 1201, and the bottom of the connecting piece 1211 is connected to a spring 1210. The bottom of the spring 1210 is connected to the two ends of the top of the horizontal plate 1208 respectively. Each of the vertical plates 1212 is provided with a guide column 1213 connected to the top of the inner side of the vertical plate 1212. The two guide columns 1213 are respectively located in the two second strip grooves 1206. The distance between the guide bar 13 and the bottom of the second strip groove 1206 matches the diameter of the guide column 1213. The distance between the guide bar 13 and the top of the second strip groove 1206 is greater than the diameter of the guide column 1213. When the guide column 1213 is below the guide bar 13, the rectangular block 1202 is aligned with the second U-shaped plate 504 on the temporary storage frame 5 abutting the alignment plate 1101 above the second conveying mechanism 11, and the spring 1210 is in a stretched state, so that the horizontal plate 1208 and the slider 1209 are There is a tendency to move upward. When the guide column 1213 abuts the top of the wall of the second strip groove 1206, the spring 1210 is in a natural state, and the bottom height of the rectangular block 1202 is higher than the top height of the second U-shaped plate 504 of the temporary storage frame 5 above the second conveying mechanism 11. Specifically, when the guide column 1213 abuts the bottom of the second strip groove 1206, the pulling force of the spring 1210 on the cross plate 1208 is less than the gravity of the temporary storage frame 5 on which the wafers are placed, so that the temporary storage frame 5 is hung on the rectangular block 1202, and in the process of moving toward the first U-shaped plate 4, the guide column 1213 always abuts the bottom of the second strip groove 1206 and keeps the bottom height of the temporary storage frame 5 unchanged.

[0050] When the temporary storage frame 5 is moved to the first U-shaped plate 4, the movable block 1201 is controlled to drive the rectangular block 1202 to move toward the first U-shaped plate 4. At this time, the guide column 1213 is below the guide bar 13, and the rectangular block 1202 can penetrate into the second U-shaped plate 504 at the top of the temporary storage frame 5 and push the temporary storage frame 5 to leave the second conveying mechanism 11. When the temporary storage frame 5 leaves the second conveying mechanism 11, because the gravity of the temporary storage frame 5 can overcome the pulling force of the spring 1210 on the cross plate 1208, the guide column 1213 will not rise and will still move in the horizontal direction. When the temporary storage frame 5 reaches the top of the first U-shaped plate 4, the lifting plate 3 that has dropped to the bottom is controlled to rise to the highest point. At this time, the temporary storage frame 5 will be in the second U-shaped plate 504, and the movable block 1201 can be controlled to retract to leave the temporary storage frame. 5, the cross plate 1208 will be pulled by the spring 1210 to move upward to abut the top of the second strip groove 1206, and continue to control the movable block 1201 to move toward the second conveying mechanism 11, the guide post 1213 will push the guide plate 14 to rotate downward, and then reach the side of the guide plate 14 away from the first U-shaped plate 4, and the guide plate 14 will rotate upward to reset under the drive of the torsion spring 1401, abutting the top of the second strip groove 1206, and then make the movable block 1201 continue to move toward the second U-shaped plate 504. Because the guide plate 14 cannot continue to rotate upward, the guide post 1213 can only move to the lower right along the guide plate 14 and the inclined surface 1301 to the bottom of the guide bar 13, and again align the rectangular block 1202 with the second U-shaped plate 504 on the top of the next temporary storage frame 5 to be transferred, and transfer the next temporary storage frame 5. In this way, it is not necessary to close the second conveying mechanism 11 when transferring the temporary storage frame 5 on the second conveying mechanism 11, which can improve the continuity of conveying the temporary storage frame 5 and further improve production efficiency.

[0051] The above description is only a preferred embodiment of the present invention and is not intended to be the only one or to limit the present invention. It should be understood by those skilled in the art that various changes or equivalent substitutions made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.

Claims

1. A wafer thinning and polishing device, characterized in that: include: A grinding disc (1), the top of which is connected to an output shaft of a first motor (101), and the top of the first motor (101) is connected to a telescopic end of a first lifting mechanism (102) arranged vertically downward; A circular suction cup (2) is provided directly below the grinding disc (1), and a first strip-shaped groove (201) is radially provided on the top of the circular suction cup (2) and runs through the circumference thereof; A lifting plate (3) is arranged to move vertically and is spaced apart at an outward end of the first strip groove (201); a first U-shaped plate (4) is provided on the top of the lifting plate (3); the first U-shaped plate (4) includes a first transverse section (401) and two first vertical sections (402); the first transverse section (401) and the first strip groove (201) are arranged perpendicular to each other; the two first vertical sections (402) are arranged on a side of the first transverse section (401) away from the first strip groove (201); and the two first vertical sections (402) are symmetrical relative to the first strip groove (201); The temporary storage frame (5) comprises a first vertical frame (501) and a pair of arc-shaped baffles (502) symmetrically arranged at one end of the first vertical frame (501); a plurality of pairs of support bars (503) are arranged in an array along the vertical direction in the first vertical frame (501); and an end of the support bar (503) close to the arc-shaped baffle (502) is provided with an extension section that matches the curvature of the arc-shaped baffle (502); when the first vertical frame (501) is arranged in the first U-shaped plate (4), the width of the first vertical frame (501) matches the distance between the two first vertical sections (402); The first pushing mechanism (6) is provided on a side of the first U-shaped plate (4) away from the circular suction cup (2), the telescopic end of which is in a telescopic direction parallel to the first strip groove (201), and the telescopic end is connected to one end of a strip suction cup (602) via a pushing block (601), the top height of the pushing block (601) is higher than the top height of the strip suction cup (602), and the strip suction cup (602) is arranged toward the first strip groove (201), and when the lifting plate (3) rises to the highest point, the top height of the strip suction cup (602) matches the top height of the circular suction cup (2) and the top height of the bottommost support bar (503); A first conveying mechanism (9) is provided below the first pushing mechanism (6), and the conveying direction of the first conveying mechanism (9) is parallel to the length direction of the first strip groove (201). A pair of second pushing mechanisms (10) parallel to the first pushing mechanism (6) are provided below the circular suction cup (2). The telescopic ends of the second pushing mechanisms (10) are vertically connected to vertical push plates (1001). When the temporary storage frame (5) is lowered to the maximum limit, the two vertical push plates (1001) are respectively directed toward one end of the two side walls of the first vertical frame (501) away from the arc baffle (502), and the bottom height of the temporary storage frame (5) matches the top height of the first conveying mechanism (9); A second conveying mechanism (11) is provided on one side of the first conveying mechanism (9) and is parallel thereto, for conveying the temporary storage frame (5). A positioning plate (1101) is provided vertically at one end of the second conveying mechanism (11). The inward side of the positioning plate (1101) is aligned with the inner side of the first transverse section (401). A straight mechanism (12) is provided horizontally above the second conveying mechanism (11). The movable end of the straight mechanism (12) is vertically connected to one end of a rectangular block (1202) on the side away from the outer side of the second conveying mechanism (11). The moving direction of the movable end of the straight mechanism (12) is perpendicular to the conveying direction of the second conveying mechanism (11). A second U-shaped plate (504) is provided on the top of the first vertical frame (501). The second U-shaped plate (504) includes a second transverse section (5041) and a second U-shaped plate (504) vertically provided on the second transverse section (5041). ) a pair of second vertical sections (5042) at the bottom, the second vertical section (5042) is connected to the top of the first vertical frame (501), and the second vertical section (5042) is parallel to the alignment plate (1101), the rectangular block (1202) matches the height of the second U-shaped plate (504) on the temporary storage frame (5) placed on the second conveying mechanism (11), and the size of the rectangular block (1202) matches the inner size of the second U-shaped plate (504), when the first vertical frame (501) of the temporary storage frame (5) placed on the second conveying mechanism (11) abuts against the alignment plate (1101), the second U-shaped plate (504) is aligned with the rectangular block (1202), and when the lifting plate (3) rises to the maximum limit, the top height of the first U-shaped plate (4) is higher than the top height of the second conveying mechanism (11); Baffles (1102) are provided on both sides of the second conveying mechanism (11), the distance between the two baffles (1102) matches the width of the first vertical frame (501), and a baffle (1102) located on the inner side of the second conveying mechanism (11) is provided with a notch (1103) at the top near one end of the alignment plate (1101), and the height of the bottom of the notch (1103) matches the height of the top of the second conveyor belt; The linear mechanism comprises a movable block (1201), a guide rail (1204), and a second screw rod (1203). The guide rail (1204) is mounted above the second conveying mechanism (11) via a pair of support plates (1205). The length direction of the guide rail (1204) is parallel to the width direction of the second conveying mechanism (11). A slide groove is provided at the bottom of the guide rail (1204) along the length direction. The second screw rod (1203) is rotatably arranged between the pair of support plates (1205). The movable block (1201) is slidably arranged in the slide groove. The second screw rod (1203) is threadedly connected to the movable block (1201). One end of the second screw rod (1203) is connected to the output shaft of a third motor (1214). Both sides of the guide rail (1204) are provided with second strip grooves (1206) along the length direction, and the second strip grooves (1206) are provided with guide bars (13) parallel thereto, and the guide bars (13) are provided just above the second conveying mechanism (11), and the end of the guide bar (13) away from the first U-shaped plate (4) is an inclined surface (1301) with the bottom inclined toward the first U-shaped plate (4), and one end of the guide bar (13) is rotatably connected to a guide plate (14) through a rotating shaft (1302), and the rotating shaft (1302) is perpendicular to the side of the guide rail (1204), and a torsion spring (14) is provided outside the rotating shaft (1302). 01), the two ends of the torsion spring (1401) are respectively connected to the guide plate (14) and the guide bar (13), when the guide plate (14) rotates upward to abut the top of the second strip groove (1206), the top of the guide plate (14) tilts in a direction away from the first U-shaped plate (4), and the torsion spring (1401) is in a natural state; a through groove (1207) is provided on the movable block (1201) and passes through the two ends thereof, a horizontal plate (1208) is slidably connected in the through groove (1207), a slider (1209) is connected to the bottom of the horizontal plate (1208), and the slider (1209) passes through the bottom of the movable block (1201) and the rectangular The movable block (1201) is connected to the movable block (1202), and connecting pieces (1211) are provided at both ends of the movable block (1201). The bottom of the connecting piece (1211) is connected to the two ends of the top of the horizontal plate (1208) through the spring (1210). Both ends of the horizontal plate (1208) are connected to the guide column (1213) through the vertical plate (1212). The two guide columns (1213) are respectively located in the two second strip grooves (1206). The distance between the guide bar (13) and the bottom of the second strip groove (1206) matches the diameter of the guide column (1213), and the distance between the guide bar (13) and the top of the second strip groove (1206) is greater than Regarding the diameter of the guide column (1213), when the guide column (1213) is located below the guide bar (13), the rectangular block (1202) is aligned with the second U-shaped plate (504) on the temporary storage frame (5) abutting the alignment plate (1101) above the second conveying mechanism (11), and the spring (1210) is in a stretched state; when the guide column (1213) abuts the top of the wall of the second strip groove (1206), the spring (1210) is in a natural state, and the bottom height of the rectangular block (1202) is higher than the top height of the second U-shaped plate (504) of the temporary storage frame (5) above the second conveying mechanism (11).

2. The wafer thinning and polishing equipment according to claim 1, characterized in that: An arc-shaped limiting plate (7) is provided on a side of the first U-shaped plate (4) away from the circular suction cup (2); when the temporary storage frame (5) is in the first U-shaped plate (4), the arc-shaped limiting plate (7) abuts against the arc-shaped baffle (502).

3. The wafer thinning and polishing equipment according to claim 2, characterized in that: A plurality of guide rods (302) are vertically provided on the lifting plate (3), the guide rods (302) are fixed in a second vertical frame (301), a receiving groove (3011) is provided on the top of the second vertical frame (301) for receiving the first U-shaped plate (4) and the arc-shaped limiting plate (7), the lifting plate (3) is threadedly connected to a first screw rod (303), the first screw rod (303) is vertically rotatably connected in the second vertical frame (301), and the top of the first screw rod (303) is connected to the output shaft of a second motor (304).

4. The wafer thinning and polishing equipment according to claim 3, characterized in that: The arc-shaped limiting plate (7) is fixed to the two walls of the accommodating groove (3011), and the first U-shaped plate (4) is fixedly connected to the top surface of the lifting plate (3).

5. The wafer thinning and polishing equipment according to claim 1, characterized in that: The bottom of the circular suction cup (2) is connected to the telescopic end of a second lifting mechanism (8) arranged vertically upward.

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