Aluminum profile electroplating control method, equipment and system

Abstract

The present application relates to the field of electroplating control technology, and specifically to a method, device, and system for controlling the electroplating of aluminum profiles. The method comprises: obtaining a hyperspectral image of the electroplating solution during the electroplating process of the aluminum profile; obtaining the distribution balance of the electroplating ions in each pixel in the hyperspectral image; dividing the hyperspectral image into regions to be analyzed, and obtaining the balance loss of the electroplating ions in each region to be analyzed, based on which the convection retardation influence of the electroplating ions in the electroplating pool is obtained, and combined with the actual stirring speed of the stirrer in the electroplating pool, the expected stirring speed of the stirrer in the electroplating pool at the current acquisition time is obtained, and according to the expected stirring speed and actual stirring speed of the stirrer, the stirring speed of the stirrer in the electroplating pool is regulated by a PID controller. The present application improves the electroplating quality of the metal layer on the surface of the aluminum profile.

Description

Technical Field

[0001] The present application relates to the field of electroplating control technology, and specifically to an aluminum profile electroplating control method, equipment and system. Background Art

[0002] During actual application, the surface of aluminum profiles is prone to corrosion and wear, which seriously affects the appearance and service life of the aluminum profiles. Therefore, the existing method generally adopts electroplating technology to electroplate a protective metal layer on the surface of the aluminum profile, thereby improving the corrosion resistance and service life of the aluminum profile, and at the same time improving the aesthetics of the aluminum profile. However, during the electroplating process of the aluminum profile, the distribution of the electroplating ions will greatly affect the uniformity of the metal layer on the surface of the aluminum profile, easily causing rough defects on the metal layer on the surface of the aluminum profile, which will affect the wear resistance of the metal layer on the surface of the aluminum profile. It is often necessary to control the electroplating process to improve the uniformity of the metal layer on the surface of the aluminum profile.

[0003] Chinese invention patent CN202210487980.7 proposes a method for detecting the concentration of an electroplating solution based on spectral analysis and scattering correction. By collecting hyperspectral images of the electroplating solution, the concentration of the components of the electroplating solution is quickly detected online. However, the patent does not provide how to analyze the convective mixing phenomenon of the electroplating ions in the electroplating solution based on the hyperspectral images of the electroplating solution, nor does it provide how to accurately control and adjust the stirring rate of the electroplating solution based on the online concentration detection results.

[0004] In the current electroplating control of aluminum profiles, the existing technology often only considers the uniformity characteristics of the electroplating ions in the electroplating solution to control and adjust the stirring rate of the agitator. However, since the resistance effect of the convective mixing of the electroplating ions in the electroplating solution will vary to a certain extent, it is impossible to fully consider the impact of this resistance effect on the stirring rate adjustment, making it impossible to accurately improve the uniformity of the electroplating ions in the electroplating pool, which is likely to affect the wear resistance of the metal layer on the surface of the aluminum profile. Summary of the Invention

[0005] In order to solve the above technical problems, the purpose of this application is to provide an aluminum profile electroplating control method, equipment and system. The technical solutions adopted are as follows:

[0006] In a first aspect, an embodiment of the present application provides a method for controlling electroplating of an aluminum profile, comprising the following steps:

[0007] Acquire hyperspectral images of the electroplating solution at each acquisition moment during the electroplating process of aluminum profiles;

[0008] Based on the average level of similarity between the spectral reflectance of each pixel in the hyperspectral image and other pixels in the neighborhood, as well as the difference in the similarity between the spectral reflectance of each pixel and other pixels in the neighborhood, the distribution balance of the electroplating ions at each pixel position is obtained;

[0009] The hyperspectral image is divided into regions to be analyzed. According to the distribution balance of the electroplated ions at each pixel position in the region to be analyzed, the distribution balance is divided into a low-balance set and a high-balance set. Based on the difference in the distribution balance between the two sets and the proportion of the distribution balance in the low-balance set, the balance loss of the electroplated ions in each region to be analyzed is obtained.

[0010] Based on the average level and change in the balance loss of the electroplated ions in all analyzed areas in the hyperspectral images at each acquisition time, the convection retardation influence of the electroplated ions in the electroplating bath at each acquisition time is obtained. Based on the deviation of the convection retardation influence of the electroplated ions at the current acquisition time and the previous acquisition time, combined with the actual stirring speed of the stirrer in the electroplating bath at the previous acquisition time, the expected stirring speed of the stirrer in the electroplating bath at the current acquisition time is obtained.

[0011] The stirring speed of the stirrer in the electroplating tank is regulated by a PID controller according to the expected stirring speed and the actual stirring speed of the stirrer.

[0012] Preferably, the calculation method of the distribution balance of the electroplating ions at each pixel position is:

[0013] ;

[0014] Where, is the distribution balance of electroplating ions at the i-th pixel position, is the exponential normalization function, is the number of pixels in the neighborhood sliding window of the ith pixel, and the neighborhood window of preset size with the ith pixel as the center is recorded as the neighborhood sliding window of the ith pixel. is the mean of the cosine similarity between the reflectivity vector of the i-th pixel and the reflectivity vectors of each pixel in its neighborhood sliding window, and are the cosine similarities between the reflectivity vector of the i-th pixel and the reflectivity vectors of the j-th and j-1-th pixels in its neighborhood sliding window, respectively. To avoid constants with denominators equal to 0.

[0015] Preferably, the acquisition of the reflectivity vector further comprises: arranging all spectral reflectivities of each pixel in the hyperspectral image in order of wavelength from small to large to form a reflectivity vector of each pixel in the hyperspectral image.

[0016] Preferably, the method for obtaining the low balance set and the high balance set is:

[0017] For each area to be analyzed, the corresponding distribution balance degrees of all pixels in the area to be analyzed are threshold segmented, and the set consisting of the distribution balance degrees within the area to be analyzed that are less than the segmentation threshold is regarded as the low balance set of the area to be analyzed, otherwise, it is regarded as the high balance set of the area to be analyzed.

[0018] Preferably, the calculation method of the balance loss degree of the electroplated ions in each area to be analyzed is:

[0019] ;

[0020] Where, is the balance loss degree of the electroplated ions in the sth area to be analyzed, is the number of elements in the low-balance set of the sth region to be analyzed, is the total number of elements in the low-balance set and high-balance set of the sth region to be analyzed, and are the means of the elements in the low-balance set and the high-balance set of the sth region to be analyzed, respectively.

[0021] Preferably, the calculation method of the convection retardation influence of the electroplating ions in the electroplating pool at each collection moment is:

[0022] ;

[0023] Where, is the convection retardation influence of the plating ions in the plating cell at the tth sampling moment, is the mean value of the balance loss corresponding to all the areas to be analyzed in the hyperspectral image at the t-th acquisition moment, is the element mean of the first-order difference vector of the balance loss vector of the hyperspectral image at the t-th acquisition moment, is the exponential normalization function.

[0024] Preferably, obtaining the balance loss vector of the hyperspectral image at each acquisition moment further includes: arranging the balance loss degrees corresponding to all areas to be analyzed in the hyperspectral image at each acquisition moment in order from small to large to form the balance loss vector of the hyperspectral image at each acquisition moment.

[0025] Preferably, the method for calculating the expected stirring speed of the stirrer in the electroplating pool at the current collection moment is:

[0026] ;

[0027] Where, is the expected stirring speed of the stirrer in the electroplating tank at the current acquisition moment, is the actual stirring speed of the stirrer in the electroplating pool at the previous collection moment, is the convection blockage influence corresponding to the current collection moment, It is the convection block influence degree corresponding to the previous collection time of the current collection time.

[0028] In the second aspect, an embodiment of the present application also provides an aluminum profile electroplating control device, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor implements the steps of any one of the above-mentioned aluminum profile electroplating control methods when executing the computer program.

[0029] In a third aspect, an embodiment of the present application further provides an aluminum profile electroplating control system, wherein a computer program is stored in the device, and when the computer program is executed by a processor, any one of the aluminum profile electroplating control methods described above is implemented.

[0030] As can be seen from the above, the aluminum profile electroplating control method, device and system provided by this application have at least the following beneficial effects:

[0031] The present application measures the distribution balance of electroplating ions in local areas through hyperspectral images of the electroplating solution, thereby accurately reflecting the equilibrium state of electroplating ion distribution in different local areas of the electroplating bath. This facilitates the subsequent accurate control and adjustment of the stirring rate of the agitator, thereby effectively improving the electroplating uniformity of the aluminum profile.

[0032] The present application evenly divides a hyperspectral image of the electroplating solution into multiple areas to be analyzed, and accurately measures the loss characteristics of the electroplating ion distribution balance in the area to be analyzed by the change in the distribution balance of the electroplating ions in the area to be analyzed, so as to more accurately analyze the resistance effect of the electroplating ion convective mixing in the subsequent process. In addition, the resistance effect of the electroplating ion convective mixing is used to improve the accuracy of controlling the stirring speed of the stirrer.

[0033] The present application accurately measures the influence of resistance on the convective mixing of electroplating ions in the electroplating pool through the loss characteristics of the distribution balance of electroplating ions in different areas to be analyzed, and accurately controls and adjusts the stirring speed of the agitator in the electroplating pool according to the changes in the influence of resistance on the convective mixing of electroplating ions, thereby improving the uniformity of the diffusion of electroplating ions in the electroplating pool and avoiding the phenomenon of accelerated oxidation of electroplating ions due to excessive stirring rate, thereby improving the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions and advantages of the embodiments of the present application or the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 This is a flowchart of the steps of an aluminum profile electroplating control method provided in this application. DETAILED DESCRIPTION

[0036] To further illustrate the technical means and effects employed by this application to achieve the intended invention objectives, the following, in conjunction with the accompanying drawings and preferred embodiments, describes in detail an aluminum profile electroplating control method, device, and system proposed in this application, including its specific implementation, structure, features, and effects. In the following description, references to different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics of one or more embodiments may be combined in any suitable manner.

[0037] Unless otherwise specified and limited, terms such as "comprises", "includes" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the article or device comprising the element. In addition, the term "and\or" used herein includes any and all combinations of one or more related listed items. All technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs.

[0038] The following describes in detail a specific solution of an aluminum profile electroplating control method, equipment and system provided by the present application with reference to the accompanying drawings.

[0039] See also Figure 1 , which shows a flowchart of a method for controlling aluminum profile electroplating provided by one embodiment of the present application, comprising the following steps:

[0040] Step 1: Obtain hyperspectral images of the plating solution at each acquisition moment during the aluminum profile electroplating process.

[0041] The purpose of this embodiment is to fully consider the resistance effect of the convective mixing of the electroplating ions to accurately control and adjust the stirring rate of the agitator, avoid the stirring rate being too low affecting the uniformity of the electroplating ions in the electroplating pool, and prevent the stirring rate from being too fast and accelerating the oxidation of the electroplating ions, thereby improving the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0042] Therefore, before electroplating aluminum profiles, the surface of the aluminum profiles must be cleaned to remove impurities on the surface of the aluminum profiles to reduce the generation of impurities during electroplating. Then, the cleaned aluminum profiles are placed in the electroplating tank, and the electroplating equipment and stirring equipment are turned on to electroplate the aluminum profiles.

[0043] During the electroplating process of aluminum profiles, a hyperspectral camera is used to collect hyperspectral images of the electroplating solution in real time. The image collection interval is 10s, and hyperspectral images of the aluminum profiles at each collection moment in the electroplating process are obtained.

[0044] Step 2: Based on the average level of similarity between the spectral reflectance of each pixel in the hyperspectral image and other pixels in the neighborhood, as well as the difference in the similarity between the spectral reflectance of each pixel and other pixels in the neighborhood, the distribution balance of the electroplating ions at each pixel position is obtained.

[0045] During the electroplating process on aluminum profiles, the plating ions in the plating bath are continuously consumed. If the agitator's stirring rate is not appropriate during this process, the plating ions in the plating bath will exhibit a complex distribution, affecting the uniformity of the plating ion distribution. Therefore, it is necessary to more accurately control and adjust the agitator's stirring rate to effectively improve the uniformity of the plating ion distribution.

[0046] Furthermore, the vector composed of all spectral reflectances in each pixel in the hyperspectral image in the order of wavelength from small to large is recorded as the reflectance vector of each pixel in the hyperspectral image.

[0047] At the same time, in order to accurately analyze the distribution state of electroplating ions in the local area of ​​different pixels in the hyperspectral image, so that the stirring rate of the stirrer can be controlled and adjusted more accurately in the future, with each pixel in the hyperspectral image as the center, preferably, a 9×9 neighborhood window is set in this embodiment, which is recorded as the neighborhood sliding window of each pixel. The change of the pixel reflectance characteristics in the neighborhood sliding window can reflect the distribution state of electroplating ions in the local area of ​​the electroplating pool. The implementer can adapt the window size according to the actual situation.

[0048] Therefore, the similarity between the reflectivity vector of the i-th pixel in the hyperspectral image and the reflectivity vector of the j-th pixel in its neighborhood sliding window is calculated. The similarity can be measured by the Jaccard similarity coefficient or the cosine similarity. In this embodiment, the cosine similarity is used to measure the similarity. The greater the similarity, the more similar the reflectivity vectors are. If the change in the similarity between the i-th pixel in the hyperspectral image and all the pixels in its neighborhood sliding window is smaller, and the average level of the similarity is higher, the equilibrium state of the electroplating ion distribution in the local area of ​​the pixel is better. At this time, the lower the difficulty of controlling and adjusting the stirring rate on the agitator, the more conducive it is to maintaining the uniformity of the distribution of the electroplating ions and improving the electroplating effect of the aluminum profile.

[0049] Through the above analysis, the distribution balance of electroplating ions at each pixel position in the hyperspectral image is calculated:

[0050] ;

[0051] Where, is the distribution balance of electroplating ions at the i-th pixel position, is the exponential normalization function, is the number of pixels in the neighborhood sliding window of the i-th pixel, is the mean of the cosine similarity between the reflectivity vector of the i-th pixel and the reflectivity vectors of each pixel in its neighborhood sliding window, and are the cosine similarities between the reflectivity vector of the i-th pixel and the reflectivity vectors of the j-th and j-1-th pixels in its neighborhood sliding window, respectively. To avoid a constant with a denominator of 0, its value is set within the range of (0.001, 0.005), which has a negligible impact on the calculation result. In this embodiment, the value is 0.002.

[0052] The distribution balance reflects the equilibrium state of the electroplating ion distribution in the local area of ​​the electroplating pool during the electroplating process of aluminum profiles. If the equilibrium state of the electroplating ion distribution in the local area of ​​the electroplating pool is better, it means that the control and adjustment difficulty of the stirring rate on the agitator is lower, which is conducive to the subsequent accurate control and adjustment of the stirring rate of the agitator, thereby effectively improving the electroplating uniformity of the aluminum profiles.

[0053] Step 3: Divide the hyperspectral image into areas to be analyzed. According to the distribution balance of the electroplated ions at each pixel position in the area to be analyzed, the distribution balance is divided into a low-balance set and a high-balance set. Based on the difference in the distribution balance between the two sets and the proportion of the distribution balance in the low-balance set, the balance loss degree of the electroplated ions in each area to be analyzed is obtained.

[0054] During the electroplating process of aluminum profiles, if the distribution balance remains high and changes steadily when expanding from a local area of ​​the hyperspectral image to a larger area, this indicates that the plating ions within the large area of ​​the electroplating cell can maintain a relatively good distribution state. At this time, the stirring rate of the agitator in the electroplating cell is more appropriate and the difficulty of controlling and adjusting the stirring rate is lower. However, if the distribution balance of the plating ions changes significantly when expanding from a local area of ​​the hyperspectral image to a larger area, this indicates that the distribution balance of the plating ions in the electroplating cell has been lost, and it is more necessary to accurately control and adjust the stirring rate in a timely manner to ensure the uniformity of the plating ions during the electroplating process.

[0055] Furthermore, in this embodiment, the hyperspectral image is preferably evenly divided into M areas to be analyzed. The distribution balance corresponding to all pixels in the area to be analyzed can reflect the distribution balance changes of electroplating ions between different positions in the area to be analyzed. In this embodiment, the value of M is 20, and the implementer can adaptively select the value according to actual conditions.

[0056] In order to reflect the loss characteristics of the distribution balance of electroplating ions in a larger area to be analyzed in the hyperspectral image, for each area to be analyzed, in this embodiment, the corresponding distribution balance degree of all pixels in the area to be analyzed is input into the Otsu threshold algorithm, and the Otsu threshold algorithm is used to obtain the segmentation threshold of the area to be analyzed. The Otsu threshold algorithm is a well-known technology and will not be described in detail.

[0057] Furthermore, for each area to be analyzed, the set consisting of the distribution balance degrees less than the segmentation threshold in the area to be analyzed is recorded as the low balance set of the area to be analyzed, and the set consisting of the distribution balance degrees greater than or equal to the segmentation threshold in the area to be analyzed is recorded as the high balance set corresponding to the area to be analyzed. The low balance set and the high balance set of the area to be analyzed respectively represent the two distributions of the distribution balance degrees corresponding to all pixels in the area to be analyzed. The greater the proportion of the elements in the low balance set to the entire data set in the area to be analyzed, the lower the distribution balance degree in the area to be analyzed is. At the same time, the greater the difference in elements between the low balance set and the high balance set, the more obvious the abnormal change in the distribution balance degree in the area to be analyzed is. The two combined reflect the loss characteristics of the distribution balance of the electroplating ions in the area to be analyzed. At this time, the stirring rate on the stirrer is not suitable for the current aluminum profile electroplating process, and the stirring rate needs to be accurately controlled and adjusted to improve the electroplating effect of the aluminum profile.

[0058] Through the above analysis, the balance loss degree of the electroplating ions in each area to be analyzed in the hyperspectral image is calculated:

[0059] ;

[0060] Where, is the balance loss degree of the electroplated ions in the sth area to be analyzed, is the number of elements in the low-balance set of the sth region to be analyzed, is the total number of elements in the low-balance set and high-balance set of the sth region to be analyzed, and are the means of the elements in the low-balance set and the high-balance set of the sth region to be analyzed, respectively.

[0061] The balance loss degree reflects the loss characteristics of the balance of the electroplating ion distribution when extending from the local area of ​​the hyperspectral image to a larger area. If the loss characteristics of the balance of the electroplating ion distribution are greater, it means that the stirring rate on the agitator at the current moment is less suitable for the current aluminum profile electroplating process, and it is more necessary to accurately control and adjust the stirring rate in a timely manner to ensure the uniformity of the electroplating ions during the electroplating process.

[0062] Step 4: Based on the average level of balance loss of the electroplated ions in all areas to be analyzed in the hyperspectral images at each acquisition moment and the change in balance loss, the convection retardation influence of the electroplated ions in the electroplating pool at each acquisition moment is obtained. Based on the deviation of the convection retardation influence of the electroplated ions between the current acquisition moment and the previous acquisition moment, combined with the actual stirring speed of the stirrer in the electroplating pool at the previous acquisition moment, the expected stirring speed of the stirrer in the electroplating pool at the current acquisition moment is obtained.

[0063] If the difference between the balance loss characteristics in different areas to be analyzed in the hyperspectral image is greater, and the average level of the balance loss characteristics in different areas to be analyzed in the hyperspectral image is higher, it can be explained that the resistance to the convection of the electroplating ions in the electroplating pool is greater. At this time, the stirring rate should be controlled and adjusted in time to improve the convection effect of the electroplating ions in the electroplating pool and ensure the uniformity of the distribution of the electroplating ions.

[0064] Furthermore, during the electroplating process of aluminum profiles, the balance loss degrees corresponding to all areas to be analyzed in the hyperspectral image at each acquisition moment are vectored in ascending order, which is recorded as the balance loss vector of the hyperspectral image at each acquisition moment. The balance loss vector reflects the loss change of the balance of the electroplating ion distribution in the electroplating pool at each acquisition moment.

[0065] Through the above analysis, the convection retardation influence of the electroplating ions in the electroplating pool at each sampling moment is calculated:

[0066] ;

[0067] Where, is the convection retardation influence of the plating ions in the plating cell at the tth sampling moment, is the mean value of the balance loss corresponding to all the areas to be analyzed in the hyperspectral image at the t-th acquisition moment, is the element mean of the first-order difference vector of the balance loss vector of the hyperspectral image at the t-th acquisition moment, is an exponential normalization function. The specific normalization calculation process of exponential normalization is a well-known technology and will not be repeated in this embodiment.

[0068] The convection retardation influence reflects the degree to which the convection mixing of the electroplating ions in the electroplating pool is affected by the resistance during the electroplating process. If the influence of the resistance on the convection mixing of the electroplating ions continues to deepen, it indicates that the convection mixing effect of the electroplating ions in the electroplating pool is poor. At this time, the stirring speed of the agitator should be increased to improve the convection mixing effect of the electroplating ions. On the contrary, if the influence of the resistance on the convection mixing of the electroplating ions continues to weaken, it indicates that the convection mixing effect of the electroplating ions in the electroplating pool is better. In order to prevent the stirring rate from being too fast and accelerating the oxidation of the electroplating ions, the stirring speed of the agitator should be reduced to improve the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0069] Therefore, the stirring speed of the stirrer in the electroplating pool is collected in real time through the speed sensor. The expected stirring speed of the stirrer in the electroplating pool at the current collection time is calculated based on the change in the convection resistance during the electroplating process:

[0070] ;

[0071] Where, is the expected stirring speed of the stirrer in the electroplating tank at the current acquisition moment, is the actual stirring speed of the stirrer in the electroplating pool at the previous collection moment, is the convection blockage influence corresponding to the current collection moment, It is the convection block influence degree corresponding to the previous collection time of the current collection time.

[0072] If the influence of resistance on the convection mixing of electroplating ions in the electroplating pool is more severe at the current collection moment than at the previous collection moment, the stirring speed of the agitator is adjusted upward according to the degree to which the influence of resistance on the convection mixing is deepened, so as to improve the effect of convection mixing of electroplating ions; conversely, the stirring speed of the agitator is adjusted downward according to the degree to which the influence of resistance on the convection mixing is weakened, so as to improve the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0073] Step 5: According to the desired stirring speed and actual stirring speed of the stirrer, the stirring speed of the stirrer in the electroplating tank is regulated by using a PID controller.

[0074] Furthermore, in order to accurately control and adjust the stirring speed of the agitator in the electroplating pool, the expected stirring speed and the actual stirring speed of the agitator in the electroplating pool at the current acquisition moment are input into the PID controller, and the PID controller calculates the error between the expected stirring speed and the actual stirring speed. The PID controller outputs a control signal according to the size of the error. The control signal is transmitted to the agitator to control the actual stirring speed in the agitator to approach the expected stirring speed, thereby improving the convection mixing effect of the electroplating ions in the electroplating pool and avoiding adverse effects on the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0075] Based on the same inventive concept as the above method, an embodiment of the present application also provides an aluminum profile electroplating control device, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, the steps of any one of the above-mentioned aluminum profile electroplating control methods are implemented.

[0076] At the same time, an embodiment of the present application also provides an aluminum profile electroplating control system, in which a computer program is stored. When the computer program is executed by a processor, any one of the above-mentioned aluminum profile electroplating control methods is implemented.

[0077] It should be understood that the order in which the embodiments of the present application are presented is for illustrative purposes only and does not necessarily represent the superiority or inferiority of the embodiments. Furthermore, the foregoing descriptions of specific embodiments of this specification are provided. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order or sequential sequence shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0078] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0079] The above content is only an implementation method of the present application and is not intended to limit the scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the scope of protection of the present application.

Claims

1. A method for controlling aluminum profile electroplating, characterized in that: The following steps are involved: Acquire hyperspectral images of the electroplating solution at each acquisition moment during the electroplating process of aluminum profiles; Based on the average level of similarity between the spectral reflectance of each pixel in the hyperspectral image and other pixels in the neighborhood, as well as the difference in the similarity between the spectral reflectance of each pixel and other pixels in the neighborhood, the distribution balance of the electroplating ions at each pixel position is obtained; The hyperspectral image is divided into regions to be analyzed. According to the distribution balance of the electroplated ions at each pixel position in the region to be analyzed, the distribution balance is divided into a low-balance set and a high-balance set. Based on the difference in the distribution balance between the two sets and the proportion of the distribution balance in the low-balance set, the balance loss of the electroplated ions in each region to be analyzed is obtained. The convection retardation effect of the electroplating ions in the electroplating bath at each acquisition time is obtained based on the average level and change in the balance loss of the electroplating ions in all areas to be analyzed in the hyperspectral images at each acquisition time. The expected stirring speed of the agitator in the electroplating bath at the current acquisition time is obtained based on the deviation of the convection retardation effect of the electroplating ions at the current acquisition time from the previous acquisition time, combined with the actual stirring speed of the agitator in the electroplating bath at the previous acquisition time. The stirring speed of the stirrer in the electroplating tank is regulated by a PID controller according to the desired stirring speed and the actual stirring speed of the stirrer; The calculation method of the distribution balance of the electroplating ions at each pixel position is: ； Where, is the distribution balance of electroplating ions at the i-th pixel position, is the exponential normalization function, is the number of pixels in the neighborhood sliding window of the ith pixel, and the neighborhood window of preset size with the ith pixel as the center is recorded as the neighborhood sliding window of the ith pixel. is the mean of the cosine similarity between the reflectivity vector of the i-th pixel and the reflectivity vectors of each pixel in its neighborhood sliding window, and are the cosine similarities between the reflectivity vector of the i-th pixel and the reflectivity vectors of the j-th and j-1-th pixels in its neighborhood sliding window, respectively. To avoid constants with denominators equal to 0; The calculation method of the convection retardation influence of the electroplating ions in the electroplating pool at each collection moment is: ； Where, is the convection retardation influence of the plating ions in the plating cell at the tth sampling moment, is the mean value of the balance loss corresponding to all the areas to be analyzed in the hyperspectral image at the t-th acquisition moment, is the element mean of the first-order difference vector of the balance loss vector of the hyperspectral image at the t-th acquisition moment, is the exponential normalization function.

2. The aluminum profile electroplating control method according to claim 1, characterized in that: The acquisition of the reflectivity vector further includes: arranging all spectral reflectivities of each pixel in the hyperspectral image in order of wavelength from small to large to form a reflectivity vector of each pixel in the hyperspectral image.

3. The aluminum profile electroplating control method according to claim 1, characterized in that: The method for obtaining the low balance set and the high balance set is: For each area to be analyzed, the corresponding distribution balance degrees of all pixels in the area to be analyzed are threshold segmented, and the set consisting of the distribution balance degrees within the area to be analyzed that are less than the segmentation threshold is regarded as the low balance set of the area to be analyzed, otherwise, it is regarded as the high balance set of the area to be analyzed.

4. The aluminum profile electroplating control method according to claim 1, characterized in that: The calculation method of the balance loss of electroplating ions in each area to be analyzed is: ； Where, is the balance loss degree of the electroplated ions in the sth area to be analyzed, is the number of elements in the low-balance set of the sth region to be analyzed, is the total number of elements in the low-balance set and high-balance set of the sth region to be analyzed, and are the means of the elements in the low-balance set and the high-balance set of the sth region to be analyzed, respectively.

5. The aluminum profile electroplating control method according to claim 1, characterized in that: Acquiring the balance loss vector of the hyperspectral image at each acquisition moment further includes: arranging the balance loss degrees corresponding to all the areas to be analyzed in the hyperspectral image at each acquisition moment in ascending order to form the balance loss vector of the hyperspectral image at each acquisition moment.

6. The aluminum profile electroplating control method according to claim 1, characterized in that: The calculation method of the expected stirring speed of the stirrer in the electroplating pool at the current acquisition moment is: ； Where, is the expected stirring speed of the stirrer in the electroplating tank at the current acquisition moment, is the actual stirring speed of the stirrer in the electroplating pool at the previous collection moment, is the convection blockage influence corresponding to the current collection moment, It is the convection block influence degree corresponding to the previous collection time of the current collection time.

7. An aluminum profile electroplating control device, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the computer program, the steps of the aluminum profile electroplating control method as described in any one of claims 1 to 6 are implemented.

8. An aluminum profile electroplating control system, wherein a computer program is stored in the system, characterized in that: When the computer program is executed by a processor, an aluminum profile electroplating control method as described in any one of claims 1 to 6 is implemented.

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