Heat dissipation module and server
By using the design of layered cavity structure and partition communication holes in the heat dissipation module, the heat conduction path is optimized, and the problem of difficult heat dissipation of the processor is solved, which achieves efficient heat dissipation, reduces temperature and extends service life, and meets energy efficiency requirements.
Patent Information
- Application Number
- CN202510368861.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2025-07-04
AI Technical Summary
In the prior art, with the increase in processor power consumption, heat cannot be effectively dissipated, resulting in a rise in equipment temperature, affecting performance and possibly damaging the equipment. At the same time, the energy efficiency requirements of the data center are improved, and the PUE value becomes an important indicator. How to improve the heat dissipation effect while reducing resource consumption has become an urgent problem.
A heat dissipation module is designed, including a heat dissipation plate, connector and heat dissipation fin assembly. The heat dissipation plate is filled with heat exchange media, and the heat conduction path is optimized through the layered cavity structure and the partition connecting holes. The state changes of the heat exchange media are used to absorb and transfer heat, increase the heat dissipation area, avoid local hot spots and improve flow uniformity.
It improves heat dissipation efficiency, reduces the temperature of heating elements, extends service life, ensures the operating stability and performance of the server, reduces refrigeration costs, and meets energy efficiency requirements.
Smart Images
Figure CN120255671A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation module and a server. Background Art
[0002] Relevant technologies point out that with the development of new infrastructure such as cloud computing and big data, the requirements for data computing speed are getting higher and higher, and the computing speed and computing volume of processors are also getting larger and larger. For example, the computing speed and computing volume of CPUs and other key components (such as memory) are constantly increasing, resulting in their power consumption also soaring, and temperature standards are constantly decreasing. In particular, the power consumption of CPUs is increasing by 80% every year.
[0003] As power consumption increases, the heat generated by electronic devices also increases accordingly. If the heat generated cannot be effectively dissipated, the temperature of the equipment will rise, which will affect its performance and even damage the equipment. At the same time, with the increasing global awareness of environmental protection and the improvement of energy efficiency requirements, the PUE (Power Usage Effectiveness) value of data centers has become one of the important indicators for measuring their energy efficiency. Reducing PUE means reducing energy consumption while providing the same computing power. Summary of the invention
[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a heat dissipation module that can improve heat dissipation efficiency, effectively reduce the operating temperature of the heating element, extend the service life of the heating element, and ensure the operating stability and performance of the server.
[0005] The present application also provides a server with a heat dissipation module.
[0006] According to the heat dissipation module of the first aspect of the present application, the heat dissipation module is connected to the heating element, and the heat dissipation module includes: a heat dissipation plate, a cavity is provided in the heat dissipation plate, and the cavity is filled with a heat exchange medium; a connecting piece, the connecting piece is arranged between the heat dissipation plate and the heating element, and the connecting piece is used to connect the heat dissipation plate and the heating element; a heat sink assembly, the heat sink assembly is arranged on the side of the heat dissipation plate away from the heating element.
[0007] According to the heat dissipation module of the embodiment of the present application, a heat conduction path is optimized by providing a heat dissipation plate and filling a heat exchange medium in the heat dissipation plate. The heat exchange medium effectively absorbs and transfers heat by changing its state when heated, thereby reducing the refrigeration cost. The heat sink assembly is in contact with the heat dissipation plate, thereby increasing the heat dissipation area, which not only improves the heat dissipation efficiency, but also effectively reduces the operating temperature of the heating element, prolongs the service life of the heating element, and ensures the operating stability and performance of the server.
[0008] In some feasible embodiments of the present application, the cavity includes a first cavity, a second cavity and a third cavity, the first cavity, the second cavity and the third cavity are arranged sequentially in the thickness direction of the heat sink, and the first cavity and the second cavity and the second cavity and the third cavity are connected, and the third cavity is used to store heat exchange medium.
[0009] In the above technical solution, the heat can be gradually absorbed and dispersed through the layered design, reducing the formation of local hot spots, improving the overall heat dissipation effect, and accelerating the heat dissipation speed. The first cavity, the second cavity, and the third cavity are arranged in sequence in the thickness direction of the heat sink to form a multi-level cavity structure. The first cavity is located on the side farthest from the heating element, the third cavity is located on the side close to the heating element, and the second cavity is located between the first cavity and the third cavity. The third cavity stores the heat exchange medium, which can quickly absorb the heat generated by the heating element to ensure that the heat can be quickly absorbed and conducted; the second cavity, as an intermediate transition layer, can further evenly distribute the heat transmitted from the third cavity, and start the initial heat exchange process, promote the flow of the heat exchange medium, and improve the heat exchange efficiency; the first cavity is located on the side farthest from the heating element. When the heat exchange medium that absorbs the heat moves to the first cavity, it exchanges heat with the heat sink assembly in the first cavity, and the heat is transferred from the heat exchange medium in the first cavity to the heat sink assembly. After the heat is transferred, the heat exchange medium in the first cavity moves back to the third cavity again, waiting for the next heat exchange.
[0010] In some feasible embodiments of the present application, a partition is provided between the second cavity and the third cavity, and a connecting hole is formed on the partition and penetrates the partition in the thickness direction of the partition.
[0011] In the above technical solution, the partition is located between the second cavity and the third cavity, which enhances the overall structural strength of the heat sink, and can also control the flow path and speed of heat and heat exchange medium to achieve fine heat management. The partition is arranged so that the second cavity and the third cavity maintain independence while achieving connection through the connecting hole. The connecting hole is formed on the partition and penetrates the partition in the thickness direction of the partition to connect the second cavity and the third cavity. In this way, it helps to maintain the pressure balance between the second cavity and the third cavity, prevent the heat sink from deforming due to excessive internal pressure caused by excessive pressure in the third cavity due to temperature increase, and promote sufficient mixing of heat exchange medium between different chambers, improve heat exchange efficiency, enhance heat dissipation effect, and avoid the formation of local hot spots.
[0012] In some feasible embodiments of the present application, the communicating holes include a plurality of communicating holes, and the plurality of communicating holes are evenly spaced and arranged.
[0013] In the above technical solution, by arranging multiple communication holes at intervals, the heat exchange medium can flow more uniformly between the second chamber and the third chamber, which helps to avoid the phenomenon of overcooling or overheating in some areas due to the over-concentration of the heat exchange medium flow, thereby improving the overall heat exchange efficiency. Moreover, the multiple communication holes arranged at intervals help to reduce the pressure loss when the medium passes through the partition. If all the communication holes are concentrated in one place, it may cause too high local pressure and affect the normal flow of the medium, while the interval arrangement helps to disperse the pressure and improve the structural strength of the heat dissipation plate.
[0014] In some feasible embodiments of the present application, the area of the communication holes within the projection area of the heating element facing the heat dissipation plate is larger than the area of the communication holes outside the projection area of the heating element facing the heat dissipation plate.
[0015] In the above technical solution, the communication flow area between the second chamber and the third chamber within the projection area of the heating element facing the heat dissipation plate is larger, the passing speed of the heat exchange medium is faster, the heat transfer is better, and the heat dissipation efficiency is higher.
[0016] In some feasible embodiments of the present application, the heat dissipation plate is a copper material piece or an aluminum material piece.
[0017] In the above technical solution, the copper material piece has a high thermal conductivity and can conduct heat very effectively. Therefore, forming the heat dissipation plate into a copper material piece can better transfer the heat of the heating element to the heat sink assembly, thereby better dissipating heat and improving the heat dissipation efficiency; the aluminum material piece has a relatively high thermal conductivity, and the aluminum material piece has a low density, light weight, and low cost. Therefore, forming the heat dissipation plate into an aluminum material piece can ensure the heat dissipation effect of the heating element, while avoiding high production costs and reducing the production cost of the heat dissipation module.
[0018] In some feasible embodiments of the present application, a lubricating layer is coated on the peripheral wall of the cavity.
[0019] In the above technical solution, when the heat exchange medium flows in the cavity, the heat exchange medium generates friction with the peripheral wall of the cavity, which not only increases the energy loss, but also affects the flow speed and distribution uniformity of the heat exchange medium. By coating a coating material with low surface energy and high lubricity on the peripheral wall of the cavity, the friction can be significantly reduced, so that the heat exchange medium can flow more smoothly; moreover, different types of heat exchange media may corrode the heat dissipation plate. Coating a lubricating layer on the inner peripheral wall of the cavity can effectively isolate the direct contact between the heat exchange medium and the metal surface, playing an anti-corrosion role and extending the service life of the heat dissipation module; the lubricating layer can help guide the heat exchange medium to flow along a predetermined path, avoiding the occurrence of eddy currents or stagnant areas, ensuring that the flow direction of the heat exchange medium is from the third chamber to the second chamber, thereby improving the heat exchange efficiency and ensuring the heat exchange effect.
[0020] In some feasible embodiments of the present application, the lubricating layer is polytetrafluoroethylene.
[0021] In the above technical solution, polytetrafluoroethylene has an extremely low friction coefficient, excellent chemical stability, good thermal stability and excellent electrical insulation, which can not only effectively reduce friction loss, but also provide excellent anti-corrosion protection.
[0022] In some feasible embodiments of the present application, the heat exchange medium is a superconducting material, and / or the connecting piece is a thermally conductive adhesive.
[0023] In some feasible embodiments of the present application, the heat sink assembly includes a plurality of heat sink units, and the plurality of heat sink units are arranged at intervals.
[0024] In the above technical solution, a certain distance is maintained between the heat sink monomers that are arranged at intervals, which not only helps air circulation, but also prevents heat from being directly transferred between adjacent heat sinks, avoids the formation of thermal bridge effect, and ensures that the entire heat dissipation module dissipates heat evenly. Specifically, more air can flow through the surface of each heat sink monomer between the heat sink monomers that are arranged at intervals, thereby enhancing the effect of natural convection or forced convection, helping to take away heat faster, improving heat dissipation efficiency, maximizing the heat dissipation area, and achieving the maximum heat dissipation area within a limited space, thereby dissipating heat more effectively.
[0025] In some feasible embodiments of the present application, the heat dissipation plate includes a first plate and a second plate, the first plate is connected to the heating element through the connecting member, and the second plate is connected to both ends of the first plate.
[0026] In the above technical solution, the first plate is directly connected to the heating element, and the heat generated by the heating element during operation is transferred to the first plate through the connecting piece. The second plate is connected to both ends of the first plate. The provision of the second plate increases the heat dissipation area, so that the heat dissipation module can carry more heat sink monomers, thereby further increasing the heat dissipation area, improving the heat exchange efficiency, and enhancing the overall heat dissipation capacity.
[0027] In some feasible embodiments of the present application, the second plate is arranged higher than the first plate, and the first plate and the second plate define an avoidance zone.
[0028] In the above technical solution, by setting up the avoidance zone, additional space is provided for other electronic components, wires or other parts around the heating element that need to avoid high temperature areas, thereby avoiding assembly interference between the heat dissipation module and other components.
[0029] The server according to the second aspect of the present application includes: a box body; a heating element disposed inside the box body; the heat dissipation module according to the first aspect of the present application, the heat dissipation module being disposed on the heating element; a cooling fan disposed on the box body to drive the air inside the box body to flow towards the outside of the box body.
[0030] For the server of the present application, by providing the heat dissipation module according to the first aspect of the present application, therefore, it has the same technical effects, that is, without changing the structure of the server, by providing a heat dissipation plate and filling a heat exchange medium inside the heat dissipation plate, the heat conduction path is optimized, and the state change of the heat exchange medium when heated is used to effectively absorb and transfer heat, reducing the cooling cost. The heat sink assembly is in contact with the heat dissipation plate, increasing the heat dissipation area, not only improving the heat dissipation efficiency, but also effectively reducing the working temperature of the heating element, extending the service life of the heating element, and ensuring the operation stability and performance of the server.
[0031] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings
[0032] Figure 1 is a schematic diagram of the heat dissipation module according to an embodiment of the present application;
[0033] Figure 2 is Figure 1 a partial enlarged schematic diagram of the cavity shown in
[0034] Figure 3 is Figure 2 a schematic diagram of the partition shown in
[0035] Reference Signs:
[0036] 100, heat dissipation module; 1, heat dissipation plate; 11, first plate; 12, second plate; 13, cavity; 131, first cavity; 132, second cavity; 133, third cavity; 134, lubricating layer; 14, partition; 141, communication hole; 15, avoidance area; 2, connecting member; 3, heat sink monomer; 200, heating element. Detailed Embodiments
[0037] Hereinafter, embodiments of the technical solutions of the present application will be described in detail with reference to the drawings. The following embodiments are only used to illustrate the technical solutions of the present application more clearly, and therefore are only examples and cannot be used to limit the protection scope of the present application.
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above description of the drawings are intended to cover non-exclusive inclusion.
[0039] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order, or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "a plurality" is more than two, unless otherwise specifically defined.
[0040] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0041] In the description of the embodiments of this application, the term "and / or" is merely a description of the association relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.
[0042] In the description of the embodiments of this application, the term "a plurality" refers to more than two (including two).
[0043] In the description of the embodiments of this application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of this application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of this application.
[0044] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "coupling", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0045] In the related art, it is pointed out that with the development of new infrastructure such as cloud computing and big data, the requirement for data computing speed is getting higher and higher, and the computing speed and computing volume of the processor are also getting larger and larger. For example, the computing speed and computing volume of the CPU and other key components (such as memory) are continuously increasing, resulting in a continuous soar in their power consumption and a continuous decrease in the temperature standard. In particular, the power consumption of the CPU increases by 80% annually.
[0046] With the increase in power consumption, the heat generated by electronic devices also increases accordingly. If the generated heat cannot be effectively dissipated, it will cause the temperature of the device to rise, which will further affect its performance and even damage the device. At the same time, with the enhancement of global environmental protection awareness and the improvement of energy efficiency requirements, the PUE (Power Usage Effectiveness) value of the data center has become one of the important indicators to measure its energy efficiency. Reducing the PUE means reducing energy consumption while providing the same computing power. Therefore, how to improve the heat dissipation effect while reducing resource consumption has become an urgent issue to be solved.
[0047] Based on the above considerations, in order to improve the heat dissipation effect while reducing the consumption of cooling resources, the applicant has designed a heat dissipation module through in-depth research. The following refers to Figures 1-3 Describe the heat dissipation module according to the first aspect embodiment of the present application.
[0048] As Figures 1-3 shown, Figure 1 is a schematic diagram of the heat dissipation module according to the embodiment of the present application; Figure 2 is Figure 1 a partial enlarged schematic diagram of the cavity shown in Figure 3 is Figure 2 a schematic diagram of the partition shown in . It should be noted that the heating elements described in the present application include but are not limited to chips, GPUs, etc.
[0049] The heat dissipation module 100 according to the first aspect embodiment of the present application includes: a heat dissipation plate 1, a connecting member 2, and a heat sink assembly.
[0050] Specifically, the heat dissipation module 100 is connected to the heat generating element 200. A cavity 13 is provided inside the heat dissipation plate 1, and a heat exchange medium is filled in the cavity 13. The connecting member 2 is disposed between the heat dissipation plate 1 and the heat generating element 200, and the connecting member 2 is used to connect the heat dissipation plate 1 and the heat generating element 200. The heat sink assembly is disposed on the side of the heat dissipation plate 1 away from the heat generating element 200. Thus, by setting the heat dissipation module 100 to be connected to the heat generating element 200, effective heat dissipation of the heat generating element 200 is achieved, ensuring the stability and performance of the server operation.
[0051] It can be understood that a cavity 13 is provided inside the heat dissipation plate 1, and a heat exchange medium is filled in the cavity 13. The heat exchange medium can be a liquid, a solid, a gas, etc., such as a phase change material, a liquid coolant, a superconducting material, etc. Heat is effectively absorbed and transferred through the state change (such as evaporation and condensation) of the heat exchange medium when heated. The connecting member 2 is located between the heat dissipation plate 1 and the heat generating element 200 to ensure effective contact between the heat dissipation plate 1 and the heat generating element 200 for heat conduction. In particular, the heat dissipation plate 1 and the heat generating element 200 are closely attached to conduct heat most effectively. The connecting member 2 is preferably made of a material with a high thermal conductivity coefficient. The heat sink assembly is installed on the side of the heat dissipation plate 1 away from the heat generating element 200, and the heat sink assembly is in contact with the heat dissipation plate 1, thus increasing the heat dissipation area, that is, the sum of the areas of the heat dissipation plate 1 and the heat sink assembly exposed to the air, thereby improving the heat exchange efficiency and reducing the temperature of the heat generating element 200.
[0052] For example, the heat exchange medium is a liquid and the heat exchange medium is a superconducting material. Superconducting materials with relatively high critical temperatures, good chemical stability, and good mechanical properties are preferably used, such as bismuth-based (Bi-Sr-Ca-Cu-O), yttrium-based (Y-Ba-Cu-O), etc. These materials can enter the superconducting state at relatively high temperatures. When the heat is dissipated, the superconducting material returns to its original state to prepare for the next heat dissipation, thereby reducing the refrigeration cost and system complexity.
[0053] The heat dissipation path is described below: Heat is transferred from the heat source (such as the heat generating element 200) to the heat dissipation plate 1 through the connecting member 2 with a high thermal conductivity coefficient. The heat exchange medium filled in the internal cavity 13 of the heat dissipation plate 1 changes its form (such as vaporization, from liquid to gas) after absorbing the heat transferred to the heat dissipation plate 1. The vaporized heat exchange medium moves upward, transfers the heat to the heat sink assembly. The heat sink assembly is exposed to the air and transfers the heat to the air to cool the heat generating element 200. The vaporized heat exchange medium liquefies after transferring the heat to the heat sink assembly and flows back to the lower part of the cavity 13 to wait for the next heat absorption and vaporization.
[0054] In short, when the heating element 200 operates to generate heat, the heat is first quickly transferred to the heat dissipation plate 1 through the connecting member 2, and then the heat is evenly distributed and transferred by means of the heat exchange medium filled inside; finally, the heat is diffused into the surrounding environment through the heat sink assembly, thereby realizing the heat dissipation of the heating element 200.
[0055] For the heat dissipation module 100 according to the embodiment of the present application, by providing the heat dissipation plate 1 and filling the heat exchange medium inside the heat dissipation plate 1, the heat conduction path is optimized. The state change of the heat exchange medium when heated is used to effectively absorb and transfer heat, reducing the refrigeration cost. The heat sink assembly is in contact with the heat dissipation plate 1, increasing the heat dissipation area, not only improving the heat dissipation efficiency, but also effectively reducing the operating temperature of the heating element 200, prolonging the service life of the heating element 200, and ensuring the operation stability and operation performance of the server.
[0056] In any embodiment of the present application, the cavity 13 includes a first cavity 131, a second cavity 132 and a third cavity 133. The first cavity 131, the second cavity 132 and the third cavity 133 are arranged in sequence in the thickness direction of the heat dissipation plate 1, and the first cavity 131 communicates with the second cavity 132 and the second cavity 132 communicates with the third cavity 133. The third cavity 133 is used to store the heat exchange medium. Thus, through the hierarchical design, the heat can be gradually absorbed and dispersed, reducing the formation of local hot spots, improving the overall heat dissipation effect and accelerating the heat dissipation speed.
[0057] It can be understood that the first cavity 131, the second cavity 132 and the third cavity 133 are arranged in sequence in the thickness direction of the heat dissipation plate 1 to form a multi-layer cavity 13 structure. The first cavity 131 is located on the side farthest from the heating element 200, the third cavity 133 is located on the side close to the heating element 200, and the second cavity 132 is located between the first cavity 131 and the third cavity 133. The third cavity 133 stores the heat exchange medium, which can quickly absorb the heat generated by the heating element 200 to ensure that the heat can be quickly absorbed and conducted; the second cavity 132 serves as an intermediate transition layer, which can further evenly distribute the heat transmitted from the third cavity 133 and start the preliminary heat exchange process, promoting the flow of the heat exchange medium and improving the heat exchange efficiency; the first cavity 131 is located on the side farthest from the heating element 200. When the heat exchange medium that has absorbed heat moves to the first cavity 131, heat exchange occurs between the heat exchange medium in the first cavity 131 and the heat sink assembly. The heat is transferred from the heat exchange medium in the first cavity 131 to the heat sink assembly. After the heat transfer, the heat exchange medium in the first cavity 131 moves back to the third cavity 133 again, waiting for the next heat exchange.
[0058] Furthermore, the first cavity 131 and the second cavity 132, as well as the second cavity 132 and the third cavity 133 are all connected, and the heat exchange medium can flow freely between the various cavities, which helps to evenly distribute heat, reduce the generation of local hot spots, and ensure the effective circulation of the heat exchange medium in the heat sink 1, thereby improving the overall heat dissipation efficiency, enhancing the heat dissipation effect, and reducing the heat dissipation cost.
[0059] Reference Figure 2 As shown, the second cavity 132 is located at the lower side of the first cavity 131, and the third cavity 133 is located at the lower side of the second cavity 132. When the heating element 200 is working, the heat generated is first transferred to the third cavity 133 through the connector 2. The heat exchange medium in the third cavity 133 changes its form (such as vaporization, from liquid to gas) after absorbing the heat transferred to the heat sink 1. The vaporized heat exchange medium moves upward to the second cavity 132, and then the vaporized heat exchange medium moves from the second cavity 132 to the first cavity 131. Then the vaporized heat exchange medium transfers the heat to the heat sink assembly. The heat sink assembly is exposed to the air and transfers the heat to the air to cool the heating element 200. After transferring the heat to the heat sink assembly, the vaporized heat exchange medium liquefies and flows back to the third cavity 133 to wait for the next heat absorption and vaporization.
[0060] In any embodiment of the present application, a partition plate 14 is disposed between the second cavity 132 and the third cavity 133 , and a connecting hole 141 is formed on the partition plate 14 and penetrates the partition plate 14 in the thickness direction of the partition plate 14 . Figure 2 As shown, it can be understood that the partition 14 is located between the second cavity 132 and the third cavity 133, which enhances the overall structural strength of the heat sink 1, and can also control the flow path and speed of heat and heat exchange medium to achieve fine heat management. The partition 14 is arranged so that the second cavity 132 and the third cavity 133 maintain independence while achieving communication through the connecting hole 141. The connecting hole 141 is formed on the partition 14 and penetrates the partition 14 in the thickness direction of the partition 14 to connect the second cavity 132 with the third cavity 133. In this way, it is helpful to maintain the pressure balance between the second cavity 132 and the third cavity 133, prevent the heat sink 1 from being deformed due to excessive internal pressure caused by excessive pressure of the third cavity 133 due to temperature rise, and promote sufficient mixing of heat exchange medium between different chambers, improve heat exchange efficiency, enhance heat dissipation effect, and avoid the formation of local hot spots.
[0061] In some embodiments, the partition 14 includes a fixed plate and a movable plate. The movable plate can move relative to the fixed plate to adjust the size of the communication hole 141. It can be understood that a first through hole is formed in the fixed plate, and a second through hole is formed in the movable plate. The first through hole and the second through hole are arranged correspondingly, and the first through hole communicates with the second through hole to form the communication hole 141. When the temperature of the heating element 200 is relatively low, the size of the communication hole 141 surrounded by the first through hole and the second through hole is relatively small. When the temperature of the heating element 200 is relatively high, the size of the communication hole 141 surrounded by the first through hole and the second through hole is relatively large, so as to better transfer heat and improve the heat dissipation effect.
[0062] In short, the size of the communication hole 141 is defined by the relative positions of the fixed plate and the movable plate.
[0063] Further, a temperature sensor is provided in the cavity 13 of the heat dissipation plate 1. The temperature sensor is used to measure the temperature in the cavity 13 of the heat dissipation plate 1. If the temperature reaches the threshold value, the movable plate is moved relative to the fixed plate to increase the size of the communication hole 141, so as to improve the heat dissipation efficiency and optimize the heat dissipation effect.
[0064] Moreover, a driving member can be arranged to be electrically connected to the temperature sensor and connected to the movable plate, so as to drive the movable plate to move according to the temperature in the cavity 13, thereby adjusting the size of the communication hole 141.
[0065] In any embodiment of the present application, there are multiple communication holes 141. The multiple communication holes 141 are arranged at intervals, so as to ensure that heat can be transferred and dissipated evenly and efficiently. Refer to Figure 2 As shown, it can be understood that by arranging the multiple communication holes 141 at intervals, the heat exchange medium can flow more evenly between the second cavity 132 and the third cavity 133, which helps to avoid the phenomenon of overcooling or overheating in some areas due to the overly concentrated flow of the heat exchange medium, thereby improving the overall heat exchange efficiency. Moreover, the multiple communication holes 141 arranged at intervals help to reduce the pressure loss when the medium passes through the partition 14. If all the communication holes 141 are concentrated in one place, it may cause too high local pressure and affect the normal flow of the medium, while the interval arrangement helps to disperse the pressure and improve the structural strength of the heat dissipation plate 1.
[0066] In some embodiments, the multiple communication holes 141 can be evenly spaced. It can be understood that the density of the communication holes 141 in the projection area of the heating element 200 facing the heat dissipation plate 1 is equal to the density of the communication holes 141 outside the projection area of the heating element 200 facing the heat dissipation plate 1. In this way, the flow rate of the heat exchange medium passing through the communication holes 141 in any area is ensured to be consistent, thus ensuring the heat transfer effect and helping to avoid the phenomenon of overcooling or overheating in some areas due to the overly concentrated flow of the heat exchange medium.
[0067] In some other embodiments, the plurality of communication holes 141 may also be arranged at uneven intervals. It can be understood that the density of the communication holes 141 within the projection area of the heating element 200 facing the heat dissipation plate 1 is greater than that of the communication holes 141 outside the projection area of the heating element 200 facing the heat dissipation plate 1. In this way, the communication flow area between the second cavity 132 and the third cavity 133 within the projection area of the heating element 200 facing the heat dissipation plate 1 is larger, the passing speed of the heat exchange medium is faster, the heat transfer is better, and the heat dissipation efficiency is higher; or, the size of the communication holes 141 within the projection area of the heating element 200 facing the heat dissipation plate 1 is larger than that of the communication holes 141 outside the projection area of the heating element 200 facing the heat dissipation plate 1. In this way, the communication flow area between the second cavity 132 and the third cavity 133 within the projection area of the heating element 200 facing the heat dissipation plate 1 is larger, the passing speed of the heat exchange medium is faster, the heat transfer is better, and the heat dissipation efficiency is higher.
[0068] In some embodiments of the present application, the heat dissipation plate 1 is a copper material part or an aluminum material part. It can be understood that the copper material part has a high thermal conductivity, about 400 W / m·K (watts per meter kelvin). Copper can conduct heat very effectively. Therefore, forming the heat dissipation plate 1 as a copper material part can better transfer the heat of the heating element 200 to the heat sink assembly, thereby better dissipating heat and improving the heat dissipation efficiency; the aluminum material part has a relatively high thermal conductivity, and the aluminum material part has a low density, light weight, and low cost. Therefore, forming the heat dissipation plate 1 as an aluminum material part can ensure the heat dissipation effect of the heating element 200, while avoiding a relatively high production cost and reducing the production cost of the heat dissipation module 100.
[0069] In any embodiment of the present application, as Figure 2 shown, a lubricating layer 134 is coated on the peripheral wall of the cavity 13. Thereby, frictional losses can be reduced, corrosion can be prevented, and the fluidity of the heat exchange medium within the cavity 13 can be improved, thereby enhancing the heat dissipation effect of the heat dissipation plate 1 and improving the heat dissipation performance of the heat dissipation module 100.
[0070] It can be understood that when the heat exchange medium flows in the cavity 13, friction is generated between the heat exchange medium and the peripheral wall of the cavity 13, which not only increases energy loss, but also affects the flow velocity and distribution uniformity of the heat exchange medium. By coating a coating material with low surface energy and high lubricity on the peripheral wall of the cavity 13, friction can be significantly reduced, enabling the heat exchange medium to flow more smoothly; moreover, different types of heat exchange media may corrode the heat dissipation plate 1. Coating the lubricating layer 134 on the inner peripheral wall of the cavity 13 can effectively isolate the direct contact between the heat exchange medium and the metal surface, playing an anti-corrosion role and extending the service life of the heat dissipation module 100; the lubricating layer 134 can help guide the heat exchange medium to flow along a predetermined path, avoiding the occurrence of vortices or stagnant areas, ensuring that the flow direction of the heat exchange medium is from the third cavity 133 towards the second cavity 132, thereby improving the heat exchange efficiency and ensuring the heat exchange effect.
[0071] Since polytetrafluoroethylene (PTFE) has an extremely low coefficient of friction, excellent chemical stability, good thermal stability, and excellent electrical insulation, the lubricating layer 134 is made of polytetrafluoroethylene. In this way, not only can friction loss be effectively reduced, but also excellent anti-corrosion protection is provided.
[0072] In some embodiments of the present application, the heat exchange medium is a superconducting material, and the heat exchange medium is a liquid, namely a superconducting liquid. Superconducting materials with relatively high critical temperatures, good chemical stability, and mechanical properties are preferably selected, such as bismuth-based (Bi-Sr-Ca-Cu-O), yttrium-based (Y-Ba-Cu-O), etc. These materials can enter the superconducting state at relatively high temperatures. When heat is dissipated, the superconducting material returns to its original state to prepare for the next heat dissipation, thereby reducing the refrigeration cost and system complexity.
[0073] In other embodiments, the superconducting liquid is selected to have a high specific heat capacity, low boiling point, and good chemical stability. In addition, the superconducting liquid can also be an organic compound or an inorganic salt aqueous solution.
[0074] The method of filling the heat exchange medium into the cavity 13 is described here: First, evacuate the cavity 13 to remove air and impurities, and then slowly inject the superconducting liquid into the cavity 13 until the predetermined filling amount is reached. After filling, seal the cavity 13 to ensure that the superconducting liquid in the cavity 13 cannot leak.
[0075] In some embodiments of the present application, the connecting member 2 is a thermal conductive adhesive. Setting a thermal conductive adhesive between the heating element 200 and the heat dissipation plate 1 can enhance the heat transfer efficiency from the heat source (such as CPU, GPU, etc.) to the heat dissipation plate 1 and reduce the thermal resistance.
[0076] In some embodiments of the present application, the heat sink assembly includes a plurality of heat sink units 3, as Figure 1 shown, the plurality of heat sink units 3 are arranged at intervals. Thus, the plurality of heat sink units 3 arranged at intervals contribute to maximizing the heat dissipation area, thereby improving the heat exchange efficiency. It can be understood that a certain distance is maintained between the heat sink units 3 arranged at intervals, which not only helps air circulation but also prevents direct heat transfer between adjacent heat sinks, avoiding the formation of a heat bridge effect and ensuring uniform heat dissipation of the entire heat dissipation module 100. Specifically, more air can flow through the surface of each heat sink unit 3 between the heat sink units 3 arranged at intervals, enhancing the effect of natural convection or forced convection, helping to carry away heat faster, improving the heat dissipation efficiency, maximizing the heat dissipation area, achieving the maximum heat dissipation area within a limited space, and thus dissipating heat more effectively.
[0077] In some embodiments of the present application, as Figure 1 shown, the heat dissipation plate 1 includes a first plate 11 and a second plate 12. The first plate 11 is connected to the heat generating element 200 through a connecting member 2, and the second plate 12 is connected to both ends of the first plate 11. It can be understood that the first plate 11 is directly connected to the heat generating element 200, and the heat generated during the operation of the heat generating element 200 is transferred to the first plate 11 through the connecting member 2. The second plate 12 is connected to both ends of the first plate 11, and the setting of the second plate 12 increases the heat dissipation area, enabling the heat dissipation module 100 to carry more heat sink units 3, thereby further increasing the heat dissipation area, improving the heat exchange efficiency, and enhancing the overall heat dissipation capacity.
[0078] In some embodiments of the present application, as Figure 1 shown, the second plate 12 is arranged higher than the first plate 11, and the first plate 11 and the second plate 12 define an avoidance area 15. It can be understood that the avoidance area 15 provides additional space for other electronic components, wires, or other components that need to avoid the high-temperature area around the heat generating element 200, avoiding assembly interference between the heat dissipation module 100 and other components.
[0079] Furthermore, the second plate 12 is arranged higher than the electronic components around the heat generating element 200, and the distance between the second plate 12 and the electronic components around the heat generating element 200 is at least 5 mm.
[0080] Next, the heat dissipation module 100 according to a specific embodiment of the present application will be described with reference to Figures 1-3 It should be noted that in the present application, the heat generating element 200 includes, but is not limited to, chips, GPUs, etc.
[0081] Referring to Figure 1 shown, the heat dissipation module 100 includes: a heat dissipation plate 1, a connecting member 2, and a heat sink assembly. In this embodiment, the heat generating element 200 is taken as an example of a chip for illustration.
[0082] Specifically, the heat dissipation module 100 is connected to the chip. A cavity 13 is formed in the heat dissipation plate 1, and a superconducting liquid is filled in the cavity 13. The connecting member 2 is disposed between the heat dissipation plate 1 and the chip, and the connecting member 2 is used to connect the heat dissipation plate 1 and the chip. The heat sink assembly is disposed on the side of the heat dissipation plate 1 facing away from the chip. The cavity 13 includes a first cavity 131, a second cavity 132, and a third cavity 133. The second cavity 132 is located below the first cavity 131, and the third cavity 133 is located below the second cavity 132. When the heat generated by the chip during operation is first transferred to the third cavity 133 through the connecting member 2, the superconducting liquid in the third cavity 133 changes its form (such as vaporization, from liquid to gas) after absorbing the heat transferred to the heat dissipation plate 1. The vaporized superconducting liquid moves upward to the second cavity 132, and then the vaporized superconducting liquid moves from the second cavity 132 to the first cavity 131. Then, the vaporized superconducting liquid transfers the heat to the heat sink assembly. The heat sink assembly is exposed to the air and transfers the heat to the air to cool the chip. The vaporized superconducting liquid liquefies after transferring the heat to the heat sink assembly and flows back to the third cavity 133 to wait for the next heat absorption and vaporization.
[0083] A partition 14 is provided between the second cavity 132 and the third cavity 133. A communication hole 141 penetrating the partition 14 in the thickness direction of the partition 14 is formed on the partition 14. The communication holes 141 include a plurality of them, and the plurality of communication holes 141 are arranged at intervals. A polytetrafluoroethylene layer is formed on the peripheral wall of the cavity 13. The plurality of heat sink monomers 3 arranged at intervals help to maximize the heat dissipation area. The heat dissipation plate 1 includes a first plate 11 and a second plate 12. The first plate 11 is connected to the chip through the connecting member 2. The second plate 12 is connected to both ends of the first plate 11. The second plate 12 is arranged higher than the first plate 11. The first plate 11 and the second plate 12 define an avoidance area 15, and the avoidance area 15 provides additional space for other electronic components, wires, or other components that need to avoid the high-temperature area around the chip, avoiding assembly interference between the heat dissipation module 100 and other components.
[0084] The server according to the second aspect embodiment of the present application includes: a box body, a chip, a cooling fan, and the heat dissipation module 100 according to the first aspect embodiment of the present application. Specifically, the chip is disposed in the box body, the heat dissipation module 100 is disposed on the chip, and the cooling fan is disposed on the box body to drive the air in the box body to flow toward the outside of the box body.
[0085] The server according to the embodiment of the present application, by providing the heat dissipation module 100 of the first aspect of the present application, thus has the same technical effects, that is, without changing the structure of the server, by providing the heat dissipation plate 1 and filling a heat exchange medium in the heat dissipation plate 1, the heat conduction path is optimized, and the state change of the heat exchange medium when heated is used to effectively absorb and transfer heat, reducing the refrigeration cost. The heat sink assembly is in contact with the heat dissipation plate 1, increasing the heat dissipation area, not only improving the heat dissipation efficiency, but also effectively reducing the working temperature of the chip, extending the service life of the chip, and ensuring the operation stability and performance of the server.
[0086] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.
Claims
1. A heat dissipation module (100), characterized in that, The heat dissipation module (100) is connected to the heating element (200), and the heat dissipation module (100) comprises: A heat sink (1), wherein a cavity (13) is provided in the heat sink (1), and the cavity (13) is filled with a heat exchange medium; A connecting member (2), the connecting member (2) being arranged between the heat dissipation plate (1) and the heating element (200), the connecting member (2) being used to connect the heat dissipation plate (1) and the heating element (200); A heat sink assembly is arranged on a side of the heat sink (1) facing away from the heating element (200).
2. The heat dissipation module (100) according to claim 1, wherein, The cavity (13) comprises a first cavity (131), a second cavity (132) and a third cavity (133); the first cavity (131), the second cavity (132) and the third cavity (133) are arranged in sequence in the thickness direction of the heat dissipation plate (1); the first cavity (131) and the second cavity (132) as well as the second cavity (132) and the third cavity (133) are all connected; the third cavity (133) is used for storing a heat exchange medium.
3. The heat dissipation module (100) according to claim 2, characterized in that, A partition plate (14) is provided between the second chamber (132) and the third chamber (133), and a connecting hole (141) is formed on the partition plate (14) and penetrates the partition plate (14) in the thickness direction of the partition plate (14).
4. The heat dissipation module (100) according to claim 3, characterized in that, The communicating holes (141) include a plurality of communicating holes (141), and the plurality of communicating holes (141) are arranged at intervals.
5. The heat dissipation module (100) according to claim 4, characterized in that, The area of the connecting hole (141) within the projection area of the heating element (200) toward the heat dissipation plate (1) is larger than the area of the connecting hole (141) outside the projection area of the heating element (200) toward the heat dissipation plate (1).
6. The heat dissipation module (100) according to claim 1, characterized in that, The heat sink (1) is made of copper or aluminum, and / or The peripheral wall of the cavity (13) is coated with a lubricating layer (134), and / or, The lubricating layer (134) is polytetrafluoroethylene, and / or The heat exchange medium is a superconducting material, and / or, The connecting piece (2) is heat-conducting glue.
7. The heat dissipation module (100) according to any one of claims 1-6, characterized in that, The heat sink assembly comprises a plurality of heat sink units (3), and the plurality of heat sink units (3) are arranged at intervals.
8. The heat dissipation module (100) according to any one of claims 1-6, characterized in that, The heat dissipation plate (1) comprises a first plate (11) and a second plate (12); the first plate (11) is connected to the heating element (200) via the connecting piece (2); and the second plate (12) is connected to both ends of the first plate (11).
9. The heat dissipation module (100) according to claim 8, wherein, The second plate (12) is arranged higher than the first plate (11), and the first plate (11) and the second plate (12) define an avoidance area (15).
10. A server, characterized in that, include: Box; A heating element (200), the heating element (200) being arranged in the box; The heat dissipation module (100) according to any one of claims 1 to 9, wherein the heat dissipation module (100) is arranged on the heating element (200); A heat dissipation fan is arranged on the box body to drive the air in the box body to flow toward the outside of the box body.