Integrated circuit solid device packaging structure and packaging method thereof

Abstract

The invention discloses an integrated circuit solid device packaging structure and a packaging method thereof, and relates to the technical field of integrated circuit solid devices, the integrated circuit solid device packaging structure comprises a packaging table, a processing table, a positioning mechanism, an integrated circuit assembly, a packaging mechanism and a cooling mechanism, the processing table is installed in the middle of the packaging table, the positioning mechanism is installed at one corner of the processing table, and the cooling mechanism is installed at the other corner of the processing table. The integrated circuit assembly is arranged at the top of the processing table, the packaging mechanism is used for packaging parts of the integrated circuit assembly, the cooling mechanism is arranged on one side of the processing table, and the cooling mechanism is used for cooling solid devices of the integrated circuit assembly. By means of the arrangement mode that the machining table, the positioning mechanism and the integrated circuit assembly are matched, circuit mainboards of different sizes are adapted, it is ensured that the integrated circuit assembly is firm during packaging, displacement in the packaging process is avoided, the integrated circuit assembly can be stably pressed down during packaging through the packaging mechanism, and the packaging efficiency is improved. And the packaging yield of the solid device of the circuit mainboard is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit solid devices, and particularly relates to an integrated circuit solid device packaging structure and a packaging method thereof. Background Art

[0002] With the rapid development of semiconductor technology, integrated circuit (IC) packaging technology plays a crucial role in modern electronic manufacturing. Solid devices such as chips, silicon interposers, and packaging substrates on semiconductor integrated circuits need to undergo precise positioning, welding, cooling, and cleaning during the packaging process to ensure the electrical performance, mechanical stability, and long-term reliability of the devices.

[0003] However, there are still many challenges in traditional packaging processes. Circuit boards of different sizes need to be precisely positioned during packaging, but the traditional fixing methods are inconvenient to adjust, easily leading to packaging offsets and affecting the yield. Moreover, during the packaging welding process of solid devices, due to the lack of an effective pressing mechanism, the chip or substrate may shift during fixation, resulting in loose or virtual soldering of solder balls, affecting the stability of the integrated circuit solid device packaging and leading to a low yield. Summary of the Invention

[0004] The purpose of the present invention is to provide an integrated circuit solid device packaging structure and a packaging method thereof to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions: An integrated circuit solid device packaging structure, comprising: A packaging table; A processing table, which is installed in the middle of the packaging table; A positioning mechanism, which is installed at a corner of the processing table; An integrated circuit component, which is arranged on the top of the processing table, and the positioning mechanism is used for clamping and fixing the solid device on the integrated circuit component; A packaging mechanism, which is used for packaging the components of the integrated circuit component; A cooling mechanism, which is arranged on one side of the processing table, and the cooling mechanism is used for cooling the solid device of the integrated circuit component.

[0006] Preferably, the integrated circuit component includes: A circuit board, which is arranged on the processing table; A substrate structure, which is arranged on the top of the circuit board; A chip, which is arranged on the top of the substrate structure; Protective frame, the protective frame is arranged on the outer wall of the circuit main board, the protective frame includes a first protective strip, an insertion column and a second protective strip, the insertion column is fixed at the end of the first protective strip, the insertion column is inserted and clamped with the end of the second protective strip, and the first protective strip and the second protective strip are clamped on the side of the circuit main board.

[0007] Preferably, the substrate structure includes: Carrying groove, the carrying groove is opened on the top of the circuit main board; Protective pad, the protective pad is fixed on the inner wall of the carrying groove; Encapsulation substrate, the encapsulation substrate is arranged above the protective pad; Solder balls, a plurality of the solder balls are welded equidistantly between the encapsulation substrate and the carrying groove; Sealing solder block, the sealing solder block is fixed along the periphery of the encapsulation substrate on the inner wall side of the carrying groove; Silicon interposer, the silicon interposer is connected between the encapsulation substrate and the chip through bumps.

[0008] Preferably, the processing table includes: Fixed seat, the fixed seat is installed in the middle of the encapsulation table; Fixed groove, the fixed groove is opened on the top of the fixed seat, and the positioning mechanism is arranged on one side of the fixed groove; Limit frame, the limit frame is fixed on one side of the top of the fixed seat; Connection groove, the connection groove is opened on one side of the fixed seat; Tooth blocks, a plurality of the tooth blocks are fixed equidistantly on one side of the inner wall of the connection groove.

[0009] Preferably, the positioning mechanism includes: L-shaped frame, the L-shaped frame slides in the inner cavity of the fixed groove; Sliding ruler, the sliding ruler is fixed on the top of the L-shaped frame, and the sliding ruler is slidably connected with the inner cavity of the limit frame; T-shaped hole, the T-shaped hole is opened in the middle of the sliding ruler; Card slots, a plurality of the card slots are respectively opened equidistantly on both sides of the top of the T-shaped hole; Limit component, the limit component slides and penetrates in the inner cavity of the T-shaped hole.

[0010] Preferably, the limit component includes: Limit block, the limit block is slidably inserted and connected with the inner cavity of the connection groove; Limit teeth, the limit teeth are fixed on one side of the limit block; First compression spring, the first compression spring is fixed on the top of the limit block; A pull rod, the pull rod is sleeved in the inner cavity of the first compression spring, the top of the first compression spring is attached to the inner wall of the T-shaped hole through a collar, and the pull rod is slidably inserted and connected to the inner cavity of the T-shaped hole; A pull block, the pull block is fixed to the top of the pull rod; A clamping strip, the clamping strip is fixed to both sides of the pull block, and the clamping strip is movably clamped in the inner cavity of the adjacent clamping groove.

[0011] Preferably, the encapsulation mechanism includes: An electric telescopic rod, the electric telescopic rod is fixed to the top of the encapsulation table; A rotating assembly, the rotating assembly is installed at the bottom telescopic end of the electric telescopic rod; A triangular block, the triangular block is fixed to the bottom of the rotating assembly; A pressing assembly, the pressing assembly is installed at one corner of the triangular block; An encapsulation machine and a rotating cleaning disc, the encapsulation machine and the rotating cleaning disc are respectively installed at the other two corners of the triangular block.

[0012] Preferably, the rotating assembly includes a protective shell and a servo motor, the servo motor is fixed in the inner cavity of the protective shell, the servo motor is connected to the triangular block through a rotating shaft, and the top of the protective shell is fixedly connected to the bottom of the electric telescopic rod; The pressing assembly includes a positioning rod, a second compression spring and a pressing head. A plurality of the positioning rods are slidably inserted at one corner of the triangular block, the second compression spring is sleeved on the outer wall of the positioning rod, the pressing head is fixed to the bottoms of the plurality of positioning rods, and the second compression spring is fixed between the pressing head and the triangular block.

[0013] Preferably, the cooling mechanism includes: A blower, both the top and the bottom of the blower are fixedly connected with connecting blocks; A sliding groove, the sliding groove is opened on one side of the inner wall of the encapsulation table, the blower is slidably connected to the inner cavity of the sliding groove, and the connecting block is slidably inserted and connected to the inner wall of the sliding groove; A stainless steel corrugated expansion pipe, the stainless steel corrugated expansion pipe is threadedly installed at the air outlet end of the blower, and one end of the stainless steel corrugated expansion pipe is provided with an air outlet head.

[0014] The present invention also provides a method for encapsulating an integrated circuit solid device, including the following specific use steps: Step 1: A protective frame is sleeved on the outer wall of the circuit main board, and the circuit main board is set at one corner of the fixed slot, and the pull block is pulled to separate the clamping strip and the limiting tooth from the inner cavity and the tooth block of the clamping slot respectively, so that the slide ruler can be moved, and the inner corner of the L-shaped frame is tightly fitted with one corner of the circuit main board, and the pull block is released. Under the elastic force of the first compression spring, the clamping strip and the limiting tooth are respectively clamped with the inner cavity and the tooth block of the clamping slot, so that the position of the L-shaped frame is stable, so that the circuit main board can be stably in the inner cavity of the fixed slot for packaging of solid devices; Step 2: The packaging mechanism can connect the packaging substrate to the circuit main board through the solder balls and the sealing solder blocks, and flip the silicon adapter board and the chip on the packaging substrate in sequence, and press the chip and the silicon adapter board through the press-fit assembly on the packaging mechanism; Step 3: The solder block after welding can be quickly cooled by the cooling mechanism, and the solid devices on the integrated circuit mainboard can be cleaned of impurities by the rotating cleaning disk on the packaging mechanism.

[0015] Technical effects and advantages of the present invention: (1) The present invention utilizes a setting method in which a processing table, a positioning mechanism and an integrated circuit component are matched, adopts a limit component structure, and quickly adjusts the position of the slider through a pull block to adapt to circuit boards of different sizes. The anti-slip rubber inner wall further improves the stability of the clamping, ensures that the integrated circuit component is secure during packaging, and avoids displacement during the packaging process. In addition, through the packaging mechanism, the integrated circuit component can be stably pressed down during packaging, thereby improving the packaging yield rate of solid devices on the circuit board; (2) The present invention utilizes integrated circuit components to protect the corners of the circuit board through a detachable U-shaped protective frame, thereby reducing the risk of collision during transportation or packaging. The protective pad and the sealing solder block in the substrate structure provide dual protection, thereby enhancing the mechanical impact resistance of the packaging interface and further improving the stability of the packaging substrate on the circuit board. (3) The present invention utilizes a packaging mechanism to integrate the functions of pressing, packaging and cleaning on a rotating triangular block, and realizes vertical movement and angle switching through an electric telescopic rod and a servo motor, thereby improving packaging efficiency. The elastic pressure head of the press-fitting component applies force evenly to avoid damage to the chip or substrate due to pressure, while ensuring the welding fit.

[0016] (4) The present invention adopts a configuration in which the packaging mechanism and the cooling mechanism are coordinated. The sliding fan cooperates with the stainless steel corrugated expansion tube to directly carry out directional air cooling on the solder joints, accelerate solder solidification, and reduce the influence of thermal stress. The rotating cleaning disk on the packaging mechanism automatically cleans the debris after packaging, thereby reducing manual intervention and improving the cleanliness of the finished product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the overall front sectional structure of the present invention.

[0019] Figure 3 This is a schematic diagram of the overall structure at the processing table of the present invention.

[0020] Figure 4 For the present invention Figure 3 A partial enlarged structural schematic diagram at location A in the present invention.

[0021] Figure 5 This is a schematic diagram of the overall structure at the triangular block of the present invention.

[0022] Figure 6 This is a schematic diagram of the side sectional structure at the sliding ruler of the present invention.

[0023] Figure 7 This is a schematic diagram of the side sectional structure at the limiting teeth of the present invention.

[0024] Figure 8 This is a schematic diagram of the front sectional structure at the substrate of the present invention.

[0025] Figure 9 This is a schematic diagram of the partial front sectional structure at the protective frame of the present invention.

[0026] In the figure: 1, encapsulation table; 2, processing table; 21, fixed seat; 22, fixed groove; 23, limiting frame; 24, connection groove; 25, tooth block; 3, positioning mechanism; 31, L-shaped frame; 32, sliding ruler; 33, T-shaped hole; 34, card slot; 35, limiting component; 351, limiting block; 352, limiting teeth; 353, first compression spring; 354, pull rod; 355, pull block; 356, card strip; 4, integrated circuit component; 41, circuit main board; 42, substrate structure; 421, bearing groove; 422, protective pad; 423, encapsulation substrate; 424, solder ball; 425, sealing solder block; 426, silicon adapter board; 43, chip; 44, protective frame; 441, first protective strip; 442, inserting column; 443, second protective strip; 5, encapsulation mechanism; 51, electric telescopic rod; 52, rotating component; 53, triangular block; 54, pressing component; 541, positioning rod; 542, second compression spring; 543, pressing head; 55, encapsulation machine; 56, rotating cleaning disk; 6, cooling mechanism; 61, blower; 62, sliding groove; 63, stainless steel corrugated expansion pipe. Detailed implementation manners

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The present invention provides Figures 1-9 The illustrated integrated circuit solid device packaging structure comprises a packaging table 1, a processing table 2, a positioning mechanism 3, an integrated circuit component 4, a packaging mechanism 5 and a cooling mechanism 6. The processing table 2 is installed in the middle of the packaging table 1, the positioning mechanism 3 is installed at a corner of the processing table 2, the integrated circuit component 4 is arranged on the top of the processing table 2, the positioning mechanism 3 is used for clamping and fixing the solid device on the integrated circuit component 4, the packaging mechanism 5 is used for packaging the parts of the integrated circuit component 4, and the cooling mechanism 6 is arranged on one side of the processing table 2. The cooling mechanism 6 is used for cooling the solid device of the integrated circuit component 4, so that the solid device on the semiconductor integrated circuit can cool down the soldered device when packaging, thereby ensuring the packaging stability.

[0029] Among them, the processing table 2 includes a fixed seat 21, a fixed groove 22, a limit frame 23, a connecting groove 24 and a tooth block 25. The fixed seat 21 is installed in the middle of the packaging table 1, the fixed groove 22 is opened at the top of the fixed seat 21, the fixed groove 22 is used to support the integrated circuit board, the limit frame 23 is fixed to one side of the top of the fixed seat 21, the connecting groove 24 is opened on one side of the fixed seat 21, and multiple tooth blocks 25 are equidistantly fixed on one side of the inner wall of the connecting groove 24.

[0030] The positioning mechanism 3 is arranged on one side of the fixing groove 22. The positioning mechanism 3 is used to fix the position of the semiconductor integrated circuit component 4 when it is packaged and to facilitate the disassembly and assembly of the semiconductor integrated circuit component 4 in the inner cavity of the fixing groove 22. The positioning mechanism 3 includes an L-shaped frame 31, a slide 32, a T-shaped hole 33, a card slot 34 and a limit assembly 35. The L-shaped frame 31 slides in the inner cavity of the fixing groove 22. The inner wall of the L-shaped frame 31 is made of non-slip rubber material, which is convenient for improving the card connection stability of the L-shaped frame 31 on the corners of the circuit component. The slide 32 is fixed to the top of the L-shaped frame 31. The slide 32 is slidably connected to the inner cavity of the limit frame 23. The T-shaped hole 33 is opened in the middle of the slide 32. A plurality of card slots 34 are equidistantly opened on both sides of the top of the T-shaped hole 33. The limit assembly 35 slides and is inserted into the inner cavity of the T-shaped hole 33. The limit assembly 35 is used to adjust the position of the slide 32 on one side of the fixing seat 21.

[0031] Specifically, the limit component 35 includes a limit block 351, a limit tooth 352, a first compression spring 353, a pull rod 354, a pull block 355 and a clamping strip 356. The limit block 351 is slidably inserted into the inner cavity of the connection groove 24. The limit tooth 352 is fixed to one side of the limit block 351. The limit tooth 352 is engaged and clamped with multiple adjacent tooth blocks 25. The first compression spring 353 is fixed to the top of the limit block 351. The pull rod 354 is sleeved in the inner cavity of the first compression spring 353. The top of the first compression spring 353 is attached to the inner wall of the T-shaped hole 33 through a collar. The pull rod 354 is slidably inserted into the inner cavity of the T-shaped hole 33. The pull block 355 is fixed to the top of the pull rod 354. The clamping strips 356 are fixed to both sides of the pull block 355. The clamping strips 356 are movably clamped in the inner cavity of the adjacent card slots 34. By pulling the pull block 355, it is convenient for the limit block 351 to be pulled out of the inner cavity of the connection groove 24, so that the limit tooth 352 is away from the tooth block 25, and the clamping strip 356 slides out of the inner cavity of the necklace card slot 34, which is convenient for adjusting the position of the sliding ruler 32, making the position adjustment of the L-shaped frame 31 convenient and applicable to the packaging and clamping positioning of integrated circuit main boards 41 of different sizes.

[0032] In addition, the integrated circuit component 4 includes a circuit main board 41, a substrate structure 42, a chip 43 and a protective frame 44. The circuit main board 41 is arranged on the processing table 2. The substrate structure 42 is arranged on the top of the circuit main board 41. The chip 43 is arranged on the top of the substrate structure 42. The protective frame 44 is arranged on the outer wall of the circuit main board 41. The protective frame 44 includes a first protective strip 441, an insertion column 442 and a second protective strip 443. The insertion column 442 is fixed to the end of the first protective strip 441. The insertion column 442 is inserted and clamped with the end of the second protective strip 443. The first protective strip 441 and the second protective strip 443 are clamped to the side of the circuit main board 41. The first protective strip 441 and the second protective strip 443 are both arranged in a U-shaped structure, which is convenient for the first protective strip 441 and the second protective strip 443 to protect the periphery of the outer wall of the circuit main board 41 and reduce the phenomenon of bump damage to the circuit main board 41.

[0033] At the same time, the substrate structure 42 includes a bearing groove 421, a protective pad 422, a packaging substrate 423, solder balls 424, a sealing solder block 425 and a silicon interposer 426. The bearing groove 421 is opened on the top of the circuit main board 41. The protective pad 422 is fixed to the inner wall of the bearing groove 421. The protective pad 422 is composed of bottom filling glue. The packaging substrate 423 is arranged above the protective pad 422. Multiple solder balls 424 are welded equidistantly between the packaging substrate 423 and the bearing groove 421. The sealing solder block 425 is fixed to the inner wall side of the bearing groove 421 along the periphery of the packaging substrate 423. The silicon interposer 426 is connected between the packaging substrate 423 and the chip 43 through bumps, which is convenient for ensuring the packaging stability of the integrated circuit solid device.

[0034] Further, the encapsulation mechanism 5 includes an electric telescopic rod 51, a rotating assembly 52, a triangular block 53, a pressing assembly 54, an encapsulation machine 55, and a rotating cleaning disk 56. The electric telescopic rod 51 is fixed to the top of the encapsulation table 1. The rotating assembly 52 is installed at the bottom telescopic end of the electric telescopic rod 51. The triangular block 53 is fixed to the bottom of the rotating assembly 52. The rotating assembly 52 includes a protective shell and a servo motor. The servo motor is fixed inside the protective shell. The servo motor is connected to the triangular block 53 through a rotating shaft. The top of the protective shell is fixedly connected to the bottom of the electric telescopic rod 51. The electric telescopic rod 51 and the servo motor are respectively electrically connected to an external power supply through an external switch. Driven by the electric telescopic rod 51, the triangular block 53 can move vertically on the top of the encapsulation table 1. And driven by the servo motor, it is convenient for the triangular block 53 to rotate, so that the pressing assembly 54, the encapsulation machine 55, and the rotating cleaning disk 56 at the upper corners of the triangular block 53 can be respectively opposite to the position directly above the processing table 2, so that it can press and fix, encapsulate the integrated circuit assembly 4, and clean the surface of the integrated circuit solid device. The pressing assembly 54 is installed at one corner of the triangular block 53. The encapsulation machine 55 and the rotating cleaning disk 56 are respectively installed at the other two corners of the triangular block 53. The encapsulation machine 55 can perform soldering encapsulation on the solid device. And the rotating cleaning disk 56 is a cleaning disk structure with a rotating motor, which is convenient for cleaning the surface of the solid device and reducing the interference of debris solder blocks; The pressing assembly 54 includes a positioning rod 541, a second compression spring 542, and a pressing head 543. A plurality of positioning rods 541 are slidably inserted through one corner of the triangular block 53. The second compression spring 542 is sleeved on the outer wall of the positioning rod 541. The pressing head 543 is fixed to the bottom of the plurality of positioning rods 541. The second compression spring 542 is fixed between the pressing head 543 and the triangular block 53. Through the rotation of the electric telescopic rod 51 and the servo motor, the pressing assembly 54 can move above the encapsulation fixed device. Through the elasticity of the second compression spring 542, it is convenient for the pressing head 543 to squeeze the top of the fixed device, ensuring the stability of the encapsulation of the integrated circuit solid device.

[0035] Furthermore, the cooling mechanism 6 includes a blower 61, a sliding groove 62, and a stainless steel corrugated telescopic pipe 63. Connecting blocks are fixedly connected to both the top and bottom of the blower 61. The sliding groove 62 is opened on one side of the inner wall of the encapsulation table 1. The blower 61 is slidably connected to the inner cavity of the sliding groove 62. The connecting blocks are slidably inserted through the inner wall of the sliding groove 62. The stainless steel corrugated telescopic pipe 63 is threadedly installed at the air outlet end of the blower 61. One end of the stainless steel corrugated telescopic pipe 63 is provided with an air outlet head. By screwing the stainless steel corrugated telescopic pipe 63, it is convenient for the disassembly and assembly between the blower 61 and the stainless steel corrugated telescopic pipe 63. And the blower 61 is electrically connected to an external power supply through an external switch, facilitating the air outlet head to perform encapsulation cooling on the solid device encapsulated on the processing table 2.

[0036] Usage method of the present invention: A protective frame 44 is sleeved on the outer wall of the circuit main board 41, and the circuit main board 41 is set at a corner of the fixing groove 22. The pull block 355 is pulled to separate the clamping strip 356 and the limiting tooth 352 from the inner cavity of the clamping groove 34 and the tooth block 25 respectively, so that the slide rule 32 can be moved, and the inner corner of the L-shaped frame 31 is tightly fitted with a corner of the circuit main board 41. The pull block 355 is released. Under the elastic force of the first compression spring 353, the clamping strip 356 and the limiting tooth 352 are clamped with the inner cavity of the clamping groove 34 and the tooth block 25 respectively, so that the position of the L-shaped frame 31 is stable, so that the circuit main board 41 can be stably in the inner cavity of the fixing groove 22 to package solid devices; Through the packaging mechanism 5, the packaging machine 55 can connect the packaging substrate 423 with the circuit main board 41 through the solder balls 424 and the sealing solder blocks 425, and sequentially flip-mount the silicon adapter plate 426 and the chip 43 on the packaging substrate 423, and press the chip 43 and the silicon adapter plate 426 through the press-fit assembly 54 on the packaging mechanism 5; The solder block after soldering can be quickly cooled by the cooling mechanism 6 , and the solid devices on the integrated circuit mainboard 41 can be cleaned of impurities by the rotating cleaning disk 56 on the packaging mechanism 5 .

[0037] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit solid device packaging structure, characterized in that, Comprising: Encapsulation table (1); Processing table (2), the processing table (2) is installed in the middle of the encapsulation table (1); Positioning mechanism (3), the positioning mechanism (3) is installed at a corner of the processing table (2); Integrated circuit component (4), the integrated circuit component (4) is arranged on the top of the processing table (2), and the positioning mechanism (3) is used for clamping and fixing the solid devices on the integrated circuit component (4); Encapsulation mechanism (5), the encapsulation mechanism (5) is used for encapsulating the components of the integrated circuit component (4); Cooling mechanism (6), the cooling mechanism (6) is arranged on one side of the processing table (2), and the cooling mechanism (6) is used for cooling the solid devices of the integrated circuit component (4).

2. An integrated circuit solid device package structure according to claim 1, wherein, The integrated circuit component (4) includes: Circuit main board (41), the circuit main board (41) is arranged on the processing table (2); Substrate structure (42), the substrate structure (42) is arranged on the top of the circuit main board (41); Chip (43), the chip (43) is arranged on the top of the substrate structure (42); Protection frame (44), the protection frame (44) is arranged on the outer wall of the circuit main board (41), the protection frame (44) includes a first protection strip (441), an insertion post (442) and a second protection strip (443), the insertion post (442) is fixed at the end of the first protection strip (441), the insertion post (442) is inserted and clamped with the end of the second protection strip (443), and the first protection strip (441) and the second protection strip (443) are clamped on the side of the circuit main board (41).

3. An integrated circuit solid device packaging structure according to claim 2, characterized in that, The substrate structure (42) includes: Carrying groove (421), the carrying groove (421) is opened on the top of the circuit main board (41); Protection pad (422), the protection pad (422) is fixed on the inner wall of the carrying groove (421); Encapsulation substrate (423), the encapsulation substrate (423) is arranged above the protection pad (422); Solder balls (424), a plurality of the solder balls (424) are welded equidistantly between the encapsulation substrate (423) and the carrying groove (421); Sealing solder block (425), the sealing solder block (425) is fixed along the periphery of the encapsulation substrate (423) on the inner wall side of the carrying groove (421); Silicon interposer (426), the silicon interposer (426) is connected between the encapsulation substrate (423) and the chip (43) through bumps.

4. An integrated circuit solid device package structure according to claim 2, characterized in that, The processing table (2) includes: Fixed seat (21), the fixed seat (21) is installed in the middle of the encapsulation table (1); Fixed groove (22), the fixed groove (22) is opened on the top of the fixed seat (21), and the positioning mechanism (3) is arranged on one side of the fixed groove (22); Limit frame (23), the limit frame (23) is fixed on one side of the top of the fixed seat (21); Connection groove (24), the connection groove (24) is opened on one side of the fixed seat (21); Tooth blocks (25), a plurality of the tooth blocks (25) are fixed equidistantly on one side of the inner wall of the connection groove (24).

5. An integrated circuit solid device packaging structure according to claim 4, characterized in that, The positioning mechanism (3) includes: L-shaped frame (31), the L-shaped frame (31) slides in the inner cavity of the fixed groove (22); Slide rule (32), the slide rule (32) is fixed to the top of the L-shaped frame (31), and the slide rule (32) is slidably connected to the inner cavity of the limit frame (23); T-shaped hole (33), the T-shaped hole (33) is opened in the middle of the slide rule (32); Card slots (34), a plurality of the card slots (34) are respectively equidistantly opened on both sides of the top of the T-shaped hole (33); Limit component (35), the limit component (35) slidably penetrates through the inner cavity of the T-shaped hole (33).

6. An integrated circuit solid device package structure according to claim 5, characterized in that, The limit component (35) includes: Limit block (351), the limit block (351) slidably penetrates through the inner cavity of the connection groove (24); Limit teeth (352), the limit teeth (352) are fixed to one side of the limit block (351); First compression spring (353), the first compression spring (353) is fixed to the top of the limit block (351); Pull rod (354), the pull rod (354) is sleeved in the inner cavity of the first compression spring (353), the top of the first compression spring (353) is attached to the inner wall of the T-shaped hole (33) through a collar, and the pull rod (354) slidably penetrates through the inner cavity of the T-shaped hole (33); Pull block (355), the pull block (355) is fixed to the top of the pull rod (354); Card strips (356), the card strips (356) are fixed to both sides of the pull block (355), and the card strips (356) are movably clamped in the inner cavity of the adjacent card slots (34).

7. An integrated circuit solid device packaging structure according to claim 2, wherein, The encapsulation mechanism (5) includes: Electric telescopic rod (51), the electric telescopic rod (51) is fixed to the top of the encapsulation table (1); Rotation component (52), the rotation component (52) is installed at the bottom telescopic end of the electric telescopic rod (51); Triangular block (53), the triangular block (53) is fixed to the bottom of the rotation component (52); Pressing component (54), the pressing component (54) is installed at one corner of the triangular block (53); Encapsulation machine (55) and rotating cleaning disk (56), the encapsulation machine (55) and the rotating cleaning disk (56) are respectively installed at the other two corners of the triangular block (53).

8. An integrated circuit solid device packaging structure according to claim 7, characterized in that, The rotation component (52) includes a protective shell and a servo motor, the servo motor is fixed in the inner cavity of the protective shell, the servo motor is connected to the triangular block (53) through a rotating shaft, and the top of the protective shell is fixedly connected to the bottom of the electric telescopic rod (51); The pressing component (54) includes positioning rods (541), a second compression spring (542) and a pressing head (543), a plurality of the positioning rods (541) slidably penetrate through one corner of the triangular block (53), the second compression spring (542) is sleeved on the outer wall of the positioning rods (541), the pressing head (543) is fixed to the bottom of the plurality of positioning rods (541), and the second compression spring (542) is fixed between the pressing head (543) and the triangular block (53).

9. An integrated circuit solid device package structure according to claim 1, wherein, The cooling mechanism (6) includes: Fan (61), both the top and bottom of the fan (61) are fixedly connected with connecting blocks; A slide groove (62), the slide groove (62) being opened on one side of the inner wall of the packaging platform (1), the fan (61) being slidably connected to the inner cavity of the slide groove (62), and the connection block being slidably interlaced with the inner wall of the slide groove (62); A stainless steel corrugated expansion tube (63), wherein the stainless steel corrugated expansion tube (63) is threadedly mounted on an air outlet end of the fan (61), and an air outlet head is mounted on one end of the stainless steel corrugated expansion tube (63).

10. A packaging method for an integrated circuit solid device according to claim 6, characterized in that, The specific usage steps are as follows: Step 1: a protective frame (44) is sleeved on the outer wall of the circuit main board (41), and the circuit main board (41) is arranged at a corner of the fixed groove (22), and the pull block (355) is pulled to disengage the clamping strip (356) and the limiting tooth (352) from the inner cavity of the clamping groove (34) and the tooth block (25) respectively, so that the slide ruler (32) can be moved, and the inner corner of the L-shaped frame (31) is tightly fitted with a corner of the circuit main board (41), and the pull block (355) is released. Under the elastic force of the first compression spring (353), the clamping strip (356) and the limiting tooth (352) are respectively clamped with the inner cavity of the clamping groove (34) and the tooth block (25), so that the position of the L-shaped frame (31) is stable, so that the circuit main board (41) can be stably placed in the inner cavity of the fixed groove (22) for packaging solid devices; Step 2: Through the packaging mechanism (5), the packaging machine (55) can connect the packaging substrate (423) to the circuit main board (41) through the solder balls (424) and the sealing solder blocks (425), and sequentially flip-mount the silicon adapter plate (426) and the chip (43) on the packaging substrate (423), and press the chip (43) and the silicon adapter plate (426) through the pressing assembly (54) on the packaging mechanism (5); Step 3: The solder block after soldering can be quickly cooled by the cooling mechanism (6), and the solid components on the integrated circuit mainboard (41) can be cleaned of impurities by the rotating cleaning disk (56) on the packaging mechanism (5).

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