Clamping device for semiconductor processing of communication equipment

Abstract

The invention discloses a clamping device for communication equipment semiconductor processing, and relates to the technical field of packaging substrate processing. The packaging substrate machining device comprises a machining table, two supporting seats are fixedly connected to the top face of the machining table, a circular shaft is rotationally connected between the two supporting seats, a shell is fixedly connected to the surface of the circular shaft, and a clamping mechanism used for limiting a packaging substrate is arranged on the surface of the shell. A rotation adjusting mechanism used for controlling the circular shaft to rotate is arranged on the front face of the machining table, a dust collecting mechanism used for absorbing chips of the packaging substrate is further arranged on the surface of the machining table, the rotation adjusting mechanism comprises a motor, and the motor is fixedly installed on the front face of the machining table. During use, the effect that blind hole machining is conveniently conducted on the front face and the back face of the packaging substrate is achieved, the packaging substrate can be turned over rapidly, operation is very convenient and fast, the machining efficiency of blind holes in the surface of the packaging substrate is effectively improved, and practicability is good.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging substrate processing, and particularly relates to a clamping device for semiconductor processing of communication equipment. Background Art

[0002] In the field of semiconductor processing of communication equipment, as a key component connecting the chip and the external circuit, the manufacturing process of the packaging substrate has an important impact on the performance and reliability of communication equipment. With the rapid development of 5G, Internet of Things, and high-speed communication technologies, the design and manufacturing requirements of packaging substrates are getting higher and higher. Especially with the wide application of high-density interconnect (HDI) technology, blind hole processing has become one of the key processes in packaging substrate manufacturing.

[0003] During the processing, it is usually necessary to perform blind hole processing on both the front and back sides of the substrate respectively. In the prior art, after one side is processed, it is necessary to release the clamping, manually flip the substrate, and then re-clamp and fix it. This operation not only takes time, but also easily causes the substrate to shift in position, affecting the processing accuracy. In addition, the frequent operations of releasing and re-fixing the clamping reduce the efficiency of blind hole processing and are difficult to meet the requirements of large-scale production.

[0004] Therefore, a clamping device for semiconductor processing of communication equipment is proposed. Summary of the Invention

[0005] The purpose of the present invention is: to solve the problems mentioned in the above background art, the present invention provides a clamping device for semiconductor processing of communication equipment.

[0006] The present invention specifically adopts the following technical solutions to achieve the above purpose:

[0007] A clamping device for semiconductor processing of communication equipment, including a processing table, a support seat is fixedly connected to the top surface of the processing table, the number of the support seats is two, a circular shaft is rotatably connected between the two support seats, a housing is fixedly connected to the surface of the circular shaft, a clamping mechanism for limiting the packaging substrate is arranged on the surface of the housing, a rotation adjustment mechanism for controlling the rotation of the circular shaft is arranged on the front surface of the processing table, and a dust collection mechanism for absorbing debris of the packaging substrate is also arranged on the surface of the processing table.

[0008] Further, the rotation adjustment mechanism includes a motor, and the motor is fixedly installed on the front surface of the processing table. The output end of the motor is fixedly connected to a rotating shaft, a driving pulley is fixedly connected to the front end of the rotating shaft, a driven pulley is fixedly connected to the front end of the circular shaft, and a transmission belt is engaged on the surfaces of the driving pulley and the driven pulley.

[0009] Further, the clamping mechanism includes an electric push rod, and the electric push rod is fixedly installed on the surface of the housing. The end of the telescopic end of the electric push rod is fixedly connected with a connecting plate. A through groove is formed through the surface of the housing, and the connecting plate extends out from the inside of the through groove. The end of the connecting plate is fixedly connected with a movable clamping plate.

[0010] Further, an anti-slip pad is fixedly connected to the bottom of the movable clamping plate, and a buffer pad is fixedly connected to the top surface of the processing table. Both the anti-slip pad and the buffer pad are made of rubber.

[0011] Further, the dust collection mechanism includes a vacuum cleaner, and the vacuum cleaner is fixedly installed at the bottom of the inner wall of the processing table. The air suction end of the vacuum cleaner is fixedly connected with a suction pipe. The end of the suction pipe is fixedly connected with an air diffuser, and the air diffuser is fixedly installed on the surface of the processing table. A filter screen is fixedly connected to the side of the air diffuser close to the processing table. A diversion hole is formed through the top surface of the processing table, and a partition plate is fixedly connected to the inner wall of the processing table.

[0012] Further, handles are fixedly connected to both the left side and the right side of the processing table. Movable wheels are arranged at the four corners of the bottom surface of the processing table. A first movable door and a second movable door are hingedly installed on the back surface of the processing table.

[0013] The beneficial effects of the present invention are as follows:

[0014] 1. By rotating the adjustment mechanism (4) to control the rotation of the round shaft (3), the housing (5) and the clamping mechanism (6) are driven to realize the 180-degree automatic flipping of the encapsulated substrate, without the need for manual release of clamping and re-fixing. This design significantly reduces the operation time, is particularly suitable for large-scale production requirements, and effectively improves the overall efficiency of blind hole processing. The front and back sides of the encapsulated substrate can be quickly switched, avoiding the cumbersome operation of traditional manual flipping and further improving the automation level of the production line.

[0015] 2. The clamping mechanism (6) uses an electric push rod (601) to drive the movable clamping plate (603), which can quickly and accurately clamp and release the encapsulated substrate. The operation is simple and the degree of automation is high. The operator only needs to perform simple control to complete clamping and flipping, reducing the operation difficulty and manual intervention. The operation process is simplified, suitable for use in a variety of processing environments, and further improves the versatility and usability of the equipment.

[0016] 3. Through the design of the anti-slip pad (604) and the buffer pad (12), it is ensured that the encapsulated substrate remains stable during clamping and flipping, avoiding position deviation, and improving the accuracy and consistency of blind hole processing. The anti-slip pad (604) is made of rubber, increasing the friction with the surface of the encapsulated substrate to ensure more stable clamping.

[0017] 4. The rotation adjustment mechanism (4) adopts belt drive (405), which runs smoothly, ensures the position accuracy of the encapsulation substrate during the flipping process, and avoids processing errors caused by improper flipping.

[0018] 5. The dust collection mechanism (7) is designed with a vacuum cleaner (701) and an air diffuser (703), which can effectively absorb the debris generated during the processing and keep the processing environment clean. The design of the filter net (704) and the diversion holes (706) further improves the dust collection efficiency and prevents the debris from interfering with the processing process. The first movable door (8) and the second movable door (9) are provided on the back, which facilitates the cleaning and maintenance of the dust collection mechanism (7), prolongs the service life of the equipment, and ensures the long-term stable operation of the equipment.

[0019] 6. The bottom of the device is provided with moving wheels (11), and the side is provided with a handle (10), which facilitates the movement and positioning of the equipment and meets the requirements of different working environments. The design of the moving wheels (11) and the handle (10) enables the equipment to be easily moved to different working areas, improving the flexibility and applicability of the equipment. Description of the Drawings

[0020] Figure 1 is a schematic three-dimensional structure diagram of the present invention;

[0021] Figure 2 is a side view of the structure of the rotation adjustment mechanism of the present invention;

[0022] Figure 3 is a side sectional view of the structure of the clamping mechanism of the present invention;

[0023] Figure 4 is a rear view of the structure of the present invention;

[0024] Figure 5 is of the present invention Figure 4 structural sectional view.

[0025] Reference Numerals: 1, processing table; 2, support seat; 3, round shaft; 4, rotation adjustment mechanism; 401, motor; 402, rotating shaft; 403, driving pulley; 404, driven pulley; 405, transmission belt; 5, housing; 6, clamping mechanism; 601, electric push rod; 602, connecting plate; 603, movable clamping plate; 604, anti-slip pad; 605, through groove; 7, dust collection mechanism; 701, vacuum cleaner; 702, suction pipe; 703, air diffuser; 704, filter net; 705, partition board; 706, diversion hole; 8, first movable door; 9, second movable door; 10, handle; 11, moving wheel; 12, buffer pad. Detailed Embodiments

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0028] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0029] The electrical components appearing in this text are all electrically connected to an external main controller and 220V mains power, and the main controller can be a conventional known device such as a computer for control.

[0030] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "inside", "outside", "above", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention.

[0031] Such as Figure 1 、 Figure 4 、 Figure 5As shown in the figure, a clamping device for semiconductor processing of communication equipment includes a processing table 1. A support base 2 is fixedly connected to the top surface of the processing table 1. The number of support bases 2 is two. A circular shaft 3 is rotatably connected between the two support bases 2. A housing 5 is fixedly connected to the surface of the circular shaft 3. A clamping mechanism 6 for limiting the encapsulation substrate is arranged on the surface of the housing 5. A rotation adjustment mechanism 4 for controlling the rotation of the circular shaft 3 is arranged on the front surface of the processing table 1. A dust collection mechanism 7 for absorbing debris of the encapsulation substrate is also arranged on the surface of the processing table 1. More specifically, by clamping the encapsulation substrate into the interiors of the two housings 5 and clamping and limiting the encapsulation substrate through the clamping mechanism 6, blind holes can be processed on the surface of the encapsulation substrate. When one side is processed, the circular shaft 3 is controlled to rotate through the rotation adjustment mechanism 4, driving the housing 5 and the clamping mechanism 6 to flip by 180 degrees, making the unprocessed surface of the encapsulation substrate face upward, and then the blind holes can be processed on this surface. The debris generated during processing can be centrally processed through the dust collection mechanism 7.

[0032] As Figure 2 shown, the rotation adjustment mechanism 4 includes a motor 401, and the motor 401 is fixedly installed on the front surface of the processing table 1. The output end of the motor 401 is fixedly connected to a rotating shaft 402. The front end of the rotating shaft 402 is fixedly connected to a driving pulley 403. The front end of the circular shaft 3 is fixedly connected to a driven pulley 404. A transmission belt 405 is engaged on the surfaces of the driving pulley 403 and the driven pulley 404. It should be noted that by running the motor 401, the rotating shaft 402 is driven to rotate, thereby driving the driving pulley 403 to rotate. Under the driving action of the transmission belt 405, the driven pulley 404 is driven to rotate, and then the circular shaft 3 and the housing 5 are driven to rotate, so that the housing 5 and the encapsulation substrate can be flipped, thus facilitating the drilling of the other side of the encapsulation substrate.

[0033] As Figure 3 shown, the clamping mechanism 6 includes an electric push rod 601, and the electric push rod 601 is fixedly installed on the surface of the housing 5. The end of the telescopic end of the electric push rod 601 is fixedly connected to a connecting plate 602. A through groove 605 is formed through the surface of the housing 5, and the connecting plate 602 extends out from the interior of the through groove 605. The end of the connecting plate 602 is fixedly connected to a movable clamping plate 603. More specifically, the encapsulation substrate is clamped into the interiors of the two housings 5. The telescopic end of the electric push rod 601 is driven to extend out, driving the connecting plate 602 to descend, thereby driving the movable clamping plate 603 to descend, and cooperating with the inner wall of the housing 5, the encapsulation substrate is clamped and limited.

[0034] As Figure 1 and Figure 3As shown in the figure, a non-slip pad 604 is fixedly connected to the bottom of the movable clamping plate 603, and a buffer pad 12 is fixedly connected to the top surface of the processing table 1. Both the non-slip pad 604 and the buffer pad 12 are made of rubber. It should be noted that by setting the rubber non-slip pad 604, the friction with the surface of the packaging substrate is increased, making the clamping of the packaging substrate tighter and more stable. By setting the rubber buffer pad 12, the process of the housing 5 contacting the processing table 1 is buffered to avoid collision between the housing 5 and the processing table 1.

[0035] As Figure 5 shown, the dust collection mechanism 7 includes a vacuum cleaner 701, and the vacuum cleaner 701 is fixedly installed at the bottom of the inner wall of the processing table 1. The air suction end of the vacuum cleaner 701 is fixedly connected to a suction pipe 702, and the end of the suction pipe 702 is fixedly connected to an air diffuser 703. The air diffuser 703 is fixedly installed on the surface of the processing table 1. A filter screen 704 is fixedly connected to the side of the air diffuser 703 close to the processing table 1. A diversion hole 706 is formed through the top surface of the processing table 1, and a partition plate 705 is fixedly connected to the inner wall of the processing table 1. More specifically, by generating suction force through the vacuum cleaner 701, the debris of the packaging substrate generated by drilling on the surface of the processing table 1 is absorbed. The debris enters the interior of the vacuum cleaner 701 through the air diffuser 703 and the suction pipe 702 to complete collection. By setting the filter screen 704, impurities of too large specifications are prevented from entering the interior of the vacuum cleaner 701. The debris generated by drilling can also reach the surface of the partition plate 705 through the diversion hole 706 for collection.

[0036] As Figure 5 shown, handles 10 are fixedly connected to both the left side and the right side of the processing table 1. Movable wheels 11 are provided at the four corners of the bottom surface of the processing table 1. The first movable door 8 and the second movable door 9 are hingedly installed on the back surface of the processing table 1. It should be noted that by setting the handles 10 and the movable wheels 11, it is convenient to push the device, making the movement of the device more convenient. By opening the first movable door 8 and the second movable door 9, the debris on the surface of the partition plate 705 can be cleaned, and the vacuum cleaner 701 can be maintained and cleaned.

[0037] In summary: By clamping the packaging substrate into the interiors of the two housings 5 and clamping and limiting the packaging substrate through the clamping mechanism 6, blind holes can be processed on the surface of the packaging substrate. When one side is processed, by rotating the adjustment mechanism 4 to control the rotation of the round shaft 3, the housing 5 and the clamping mechanism 6 are driven to flip by 180 degrees, making the unprocessed surface of the packaging substrate face upward, and then the blind holes can be processed on this surface. The debris generated by the processing can be centrally processed through the dust collection mechanism 7. In use, the effect of facilitating the blind hole processing of both sides of the packaging substrate is achieved. It can quickly flip the packaging substrate, is very convenient to operate, effectively improves the blind hole processing efficiency on the surface of the packaging substrate, and has good practicability.

[0038] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, various changes and improvements will occur to the present invention, and all these changes and improvements fall within the scope of the present invention claimed. The scope of protection required by the present invention is defined by the appended claims and their equivalents.

Claims

1. A clamping device for semiconductor processing of communication devices, characterized in that, It includes a processing table (1), on the top surface of the processing table (1) is fixedly connected with a support base (2), the number of the support bases (2) is two, a circular shaft (3) is rotatably connected between the two support bases (2), the surface of the circular shaft (3) is fixedly connected with a housing (5), on the surface of the housing (5) is provided a clamping mechanism (6) for limiting the encapsulated substrate, on the front surface of the processing table (1) is provided a rotation adjustment mechanism (4) for controlling the rotation of the circular shaft (3), and on the surface of the processing table (1) is also provided a dust collection mechanism (7) for absorbing the debris of the encapsulated substrate.

2. The clamping device for semiconductor processing of a communication device according to claim 1, characterized in that, The rotation adjustment mechanism (4) includes a motor (401), and the motor (401) is fixedly installed on the front surface of the processing table (1). The output end of the motor (401) is fixedly connected with a rotating shaft (402), the front end of the rotating shaft (402) is fixedly connected with a driving pulley (403), the front end of the circular shaft (3) is fixedly connected with a driven pulley (404), and a transmission belt (405) is engaged on the surfaces of the driving pulley (403) and the driven pulley (404).

3. The clamping device for semiconductor processing of a communication device according to claim 2, wherein, The clamping mechanism (6) includes an electric push rod (601), and the electric push rod (601) is fixedly installed on the surface of the housing (5). The telescopic end of the electric push rod (601) is fixedly connected with a connecting plate (602). A through groove (605) is formed through the surface of the housing (5), and the connecting plate (602) extends out from the inside of the through groove (605). The end of the connecting plate (602) is fixedly connected with a movable clamping plate (603).

4. A clamping device for semiconductor processing of communication devices according to claim 3, characterized in that, A non-slip pad (604) is fixedly connected to the bottom of the movable clamping plate (603). A buffer pad (12) is fixedly connected to the top surface of the processing table (1), and both the non-slip pad (604) and the buffer pad (12) are made of rubber.

5. A clamping device for semiconductor processing of communication equipment according to claim 1, characterized in that, The dust collection mechanism (7) includes a vacuum cleaner (701), and the vacuum cleaner (701) is fixedly installed at the bottom of the inner wall of the processing table (1). The air suction end of the vacuum cleaner (701) is fixedly connected with a suction pipe (702). The end of the suction pipe (702) is fixedly connected with a wind expansion hood (703), and the wind expansion hood (703) is fixedly installed on the surface of the processing table (1). A filter screen (704) is fixedly connected to the side of the wind expansion hood (703) close to the processing table (1). A diversion hole (706) is formed through the top surface of the processing table (1), and a partition plate (705) is fixedly connected to the inner wall of the processing table (1).

6. The clamping device for semiconductor processing of a communication device according to claim 5, wherein, Handles (10) are fixedly connected to both the left side and the right side of the processing table (1). Movable wheels (11) are provided at the four corners of the bottom surface of the processing table (1). A first movable door (8) and a second movable door (9) are hingedly installed on the back surface of the processing table (1).

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