Packaging structure and forming method thereof

Abstract

The invention discloses a packaging structure and a forming method thereof. The packaging structure comprises a lead frame; the IC module is located on the lead frame, the IC module comprises a component module, the component module comprises a circuit carrier plate and a plurality of electronic components located on the circuit carrier plate, the electronic components are electrically connected with the circuit carrier plate, and the component module is electrically connected with the lead frame. The plurality of electronic components have a plurality of functions, so that the packaging structure has a system-level function, the integration level and functionality of the packaging structure are improved, the application field of the packaging structure is wider, the plurality of electronic components are arranged on the circuit carrier plate, the process difficulty of arranging conductive circuits for the electronic components is reduced, and meanwhile, the cost is reduced. Compared with a scheme of fixing the component module on the substrate, the embodiment of the invention fixes the component module on the lead frame, and the reliability of the lead frame is higher than that of the substrate, so that the reliability of the packaging structure is improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor manufacturing, and particularly to a packaging structure and a method for forming the same. Background Art

[0002] With the development trend of very large scale integrated circuits, the requirements for the packaging technology of integrated circuits are constantly increasing. For example, for the frame packaging technology, the frame is the skeleton of the molded package, which plays a supporting role for the packaged device on the one hand, and also provides electrical and thermal channels from the chip to the circuit board on the other hand.

[0003] Existing packaging technologies include Dual In-line Package (DIP) packaging, Small Outline Transistor (SOT) packaging, Quad Flat Package (QFP), and Small Out-Line Package (SOP), etc. Traditional frame packaging technologies such as DIP, SOT, QFP, and SOP are widely used in consumer electronics, automotive, medical and other fields due to their low cost, high reliability and other characteristics, and still occupy a large market share.

[0004] Currently, the performance of the packaging structure still needs to be improved. Summary of the Invention

[0005] The problem solved by the embodiments of the present invention is to provide a packaging structure and a method for forming the same to improve the integration and reliability of the packaging structure.

[0006] To solve the above problems, an embodiment of the present invention provides a packaging structure, including: a lead frame; an IC module located on the lead frame, the IC module including a component module, the component module including a circuit carrier board and a plurality of electronic components located on the circuit carrier board, the electronic components being electrically connected to the circuit carrier board, and the component module being electrically connected to the lead frame.

[0007] Correspondingly, an embodiment of the present invention further provides a method for forming a packaging structure, including: providing a component module, the component module including a circuit carrier board and a plurality of electronic components located on the circuit carrier board, the electronic components being electrically connected to the circuit carrier board; providing a lead frame; performing an assembly operation of the IC module, including: disposing the component module on the lead frame, and electrically connecting the component module to the lead frame.

[0008] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0009] In the packaging structure provided by the embodiment of the present invention, an IC module is arranged on a lead frame. The IC module includes a component module, and the component module includes a circuit carrier board and a plurality of electronic components located on the circuit carrier board. The electronic components are electrically connected to the circuit carrier board, and the component module is electrically connected to the lead frame. Compared with the traditional lead frame packaging structure, in the embodiment of the present invention, the component module is fixed on the lead frame, and the component module has a plurality of electronic components, and the plurality of electronic components have multiple functions, so that the packaging structure has system-level functions, thereby improving the integration and functionality of the packaging structure, making the application fields of the packaging structure wider. Moreover, compared with the solution of arranging electronic components on a chip, arranging a plurality of electronic components on a circuit carrier board reduces the process difficulty of arranging conductive lines in the circuit carrier board and reduces the process cost.

[0010] In the method for forming the packaging structure provided by the embodiment of the present invention, a component module is provided. The component module includes a circuit carrier board and a plurality of electronic components located on the circuit carrier board. The electronic components are electrically connected to the circuit carrier board. A lead frame is provided, and an assembly operation of the IC module is performed, including: arranging the component module on the lead frame, and the component module is electrically connected to the lead frame. Compared with the traditional lead frame packaging structure, in the embodiment of the present invention, the component module is arranged on the lead frame, and the component module has a plurality of electronic components, and the plurality of electronic components have multiple functions, so that the packaging structure has system-level functions, thereby improving the integration and functionality of the packaging structure, making the application fields of the packaging structure wider. Moreover, compared with the solution of arranging electronic components on a chip, arranging a plurality of electronic components on a circuit carrier board reduces the process difficulty of arranging conductive lines in the circuit carrier board and reduces the process cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram of the first embodiment of the packaging structure of the present invention;

[0012] Figure 2 is a schematic structural diagram of the second embodiment of the packaging structure of the present invention;

[0013] Figures 3 to 15 are schematic structural diagrams corresponding to the steps in the first embodiment of the method for forming the packaging structure of the present invention;

[0014] Figures 16 to 17 shows a schematic structural diagram of the steps corresponding to the second embodiment of the packaging method of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] As can be seen from the background art, currently, the performance of the packaging structure still needs to be improved.

[0016] Specifically, although frame packages such as DIP, SOT, QFP, and SOP have the advantages of low cost and high reliability, due to the low integration of the frame package structure, only a single-function chip can be mounted on the lead frame, resulting in a relatively single function and poor integration of the frame package structure.

[0017] To solve the above technical problems, an embodiment of the present invention provides a package structure, including: a lead frame; an IC module located on the lead frame, the IC module includes a component module, the component module includes a circuit carrier board and a plurality of electronic components located on the circuit carrier board, the electronic components are electrically connected to the circuit carrier board, and the component module is electrically connected to the lead frame.

[0018] Compared with the traditional lead frame package structure, in the embodiment of the present invention, a component module is provided on the lead frame. The component module has a plurality of electronic components, and the plurality of electronic components have multiple functions, so that the package structure has system-level functions, thereby improving the integration and functionality of the package structure, making the application field of the package structure wider. Moreover, compared with the solution of setting electronic components on a chip, setting a plurality of electronic components on the circuit carrier board reduces the process difficulty of arranging conductive lines in the circuit carrier board and reduces the process cost.

[0019] In order to make the above objects, features, and advantages of the embodiments of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be given with reference to the accompanying drawings.

[0020] Figure 1 It is a schematic structural diagram of the first embodiment of the package structure of the present invention.

[0021] The package structure includes: a lead frame 212; an IC module (not labeled) located on the lead frame 212. The IC module includes a component module 260. The component module 260 includes a circuit carrier board 200 and a plurality of electronic components 202 located on the circuit carrier board 200. The electronic components 202 are electrically connected to the circuit carrier board 200, and the component module 260 is electrically connected to the lead frame 212.

[0022] Compared with the traditional lead frame package structure, in the embodiment of the present invention, the component module 260 is fixed on the lead frame 212. The component module 260 has a plurality of electronic components, and the plurality of electronic components have multiple functions, so that the package structure has system-level functions, thereby improving the integration and functionality of the package structure, making the application field of the package structure wider. Moreover, compared with the solution of setting the electronic components 202 on a chip, setting a plurality of electronic components 202 on the circuit carrier board 200 reduces the process difficulty of arranging conductive lines in the circuit carrier board 200 and reduces the process cost.

[0023] The component module 260 has a plurality of electronic components 202, and the plurality of electronic components 202 have multiple functions, so that the packaging structure has system-level functions, thereby improving the integration and functionality of the packaging structure.

[0024] Specifically, the electronic component 202 includes one or more of a chip, a passive component, an integrated passive device (IPD), a filter, a crystal oscillator, an antenna, and a sensor. As an example, the electronic component 202 includes a chip. Specifically, the electronic component 202 can be mounted on the circuit carrier 200 or flip-chip welded to the circuit carrier 200. It should be noted that the number of component modules 260 is one or more. When the number of component modules 260 is multiple, it is beneficial to further improve the integration and functionality of the packaging structure.

[0025] The circuit carrier 200 provides a process platform for arranging a plurality of electronic components 202 to support the electronic components 202. At the same time, the circuit carrier 200 has conductive lines, and the conductive lines are used to supply power to the electronic components 202 or transmit electrical signals, so as to realize the packaging and circuit integration of the electronic components 202. Moreover, by using the circuit carrier 200 to provide conductive lines for the electronic components 202, the process difficulty of arranging conductive lines for the electronic components 202 is reduced, and the process cost is reduced.

[0026] Specifically, the circuit carrier 200 may include a dielectric material of homogeneous or heterogeneous layers, and metal lines. In this embodiment, the circuit carrier 200 includes a PCB (Printed Circuit Board) or a substrate with circuits.

[0027] In this embodiment, the packaging structure further includes: a first encapsulation layer 206, covering the electronic components 202 and the circuit carrier 200.

[0028] The first encapsulation layer 206 protects the electronic components 202 and the circuit carrier 200, prevents the electronic components 202 from being short-circuited with each other, and can also reduce the probability of damage and contamination of the electronic components 202. At the same time, the electronic components 202 and the circuit carrier 200 encapsulated by the first encapsulation layer 206 are beneficial to installation and transportation; in addition, it is convenient to detect the component module 260 before fixing the component module 260 to the lead frame 212, so as to timely screen out the component modules 260 with unqualified quality, and thus ensure that the component modules 260 in the packaging structure have a high yield.

[0029] In this embodiment, the material of the first encapsulation layer 206 includes encapsulant. Specifically, the material of the encapsulant includes epoxy resin, which has the advantages of low shrinkage rate, good adhesion, good corrosion resistance, excellent electrical properties and low cost. It should be noted that the material of the encapsulant may also include one or more of a hardener, a catalyst, and a filler.

[0030] It should be noted that in the method for forming the encapsulation structure, the first encapsulation layer 206 needs to be cured and baked to make the cross-linking reaction of the molecular chains in the first encapsulation layer 206 more sufficient, so that it has more stable physical and chemical properties and releases the internal stress in the first encapsulation layer 206.

[0031] In other embodiments, the first encapsulation layer may also be omitted in the encapsulation structure.

[0032] In this embodiment, the IC module further includes: a first conductive bump 282.

[0033] The first conductive bump 282 is electrically connected to the component module 260. The first conductive bump 282 is used to fix the component module 260 on the lead frame 212, improve the bonding strength between the component module 260 and the lead frame 212. At the same time, the first conductive bump 282 is also used to electrically connect the component module 260 and the lead frame 212 to each other.

[0034] Specifically, the component module 260 includes a first conductive bump 282. The first conductive bump 282 is located on the surface of the circuit carrier 200 facing away from the electronic component 202 and is electrically connected to the circuit carrier 200.

[0035] Specifically, the first conductive bump 282 is a solder ball. As an example, the material of the first conductive bump 282 includes one or more of gold, lead-tin, silver-tin, gold-tin, and copper-tin.

[0036] The lead frame 212 provides a process platform for fixing the IC module. At the same time, the reliability of the lead frame 212 is relatively high. In the method for forming the encapsulation structure, a second encapsulation layer covering the lead frame 212 will be formed. The bonding strength between the second encapsulation layer and the lead frame 212 is high, and the airtightness of the encapsulation structure is better.

[0037] As an example, the lead frame 212 is a metal lead frame 212. In this embodiment, the material of the lead frame 212 includes copper or iron-nickel alloy. Specifically, copper or iron-nickel alloy has good electrical conductivity and high thermal conductivity, has a low coefficient of thermal expansion, and at the same time, has good corrosion resistance and oxidation resistance.

[0038] The lead frame 212 includes pins 216 and a base 218 in contact with the pins 216. A first groove (not labeled) is provided in the base 218.

[0039] The pins 216 are used to electrically connect the package structure to an external circuit structure, and the base 218 is used to provide a process platform for arranging the IC module.

[0040] A first groove is provided in the base 218, so that the space in the first groove and the space above the first groove can both be utilized, thereby maximizing the space utilization rate of the area above the first groove, and further enabling more electronic components 202 to be arranged in the component module 260, and further enhancing the functional diversification of the package structure.

[0041] As an example, in the method for forming the package structure, another circuit module (for example, a main chip) can be arranged in the first groove.

[0042] In this embodiment, the lead frame 212 includes pins 216 and a base 218 in contact with the pins 216. A second groove (not labeled) is provided in the pins 216. The second groove is located at the side of the base 218. For example, the second groove is located on both sides or around the base 218. Specifically, the second groove is located at the side of the first groove.

[0043] The second groove provides a space position for placing the first conductive bump 282.

[0044] Correspondingly, the first conductive bump 282 is located between the IC module and the lead frame 212, and the first conductive bump 282 is located in the second groove, so as to realize the electrical connection between the module above the first groove in the IC module and the lead frame 212, and perform positioning and fixing through the second groove.

[0045] In one embodiment, the first conductive bump 282 is located between the component module 260 and the lead frame 212. The component module 260 is arranged on the lead frame 212, and the first conductive bump 282 is located in the second groove. The component module 260 is fixed to the lead frame 212 through the first conductive bump 282 and is electrically connected to the lead frame 212.

[0046] The component module 260 is electrically connected to the lead frame 212, so that the component module 260 can be electrically connected to an external circuit structure through the lead frame 212.

[0047] By providing a second groove in the lead frame 212 for positioning the first conductive bump 282, the risk of displacement or detachment between the lead frame 212 and the component module 260 is reduced. At the same time, this enables the contact surface between the first conductive bump 282 located in the second groove and the lead frame 212 to include the side surface and the bottom surface, which increases the contact area between the first conductive bump 282 and the lead frame 212, thereby enhancing the bonding strength between the first conductive bump 282 and the lead frame 212, further reducing the risk of displacement or detachment between the lead frame 212 and the component module 260, and increasing the contact area also improves the electrical connection performance between the first conductive bump 282 and the lead frame 212, thus enhancing the reliability of the packaging structure.

[0048] The second groove has a bottom surface and an inner wall in a closed loop shape, and the first conductive bump 282 contacts one or both of the bottom surface and the inner wall. As an example, the first conductive bump 282 contacts both the bottom surface and the inner wall of the second groove.

[0049] It should be noted that in the method for forming the packaging structure, after the first conductive bump 282 is positioned in the second groove, the material of the first conductive bump 282 is usually subjected to a reflow process to make the material of the first conductive bump 282 in a molten state to contact the surface of the second groove. Therefore, the contact surface between the reflowed first conductive bump 282 and the second groove includes the bottom surface and the side surface, thereby further enhancing the bonding force between the first conductive bump 282 and the lead frame 212.

[0050] It should also be noted that in the method for forming the packaging structure, the second groove is formed during the mechanical stamping of the frame process, and the distance between the second grooves is determined according to the distance between the first conductive bumps 282 in the component module 260, so that the first conductive bumps 282 can be accurately aligned with the second grooves and the first conductive bumps 282 are placed in the second grooves.

[0051] In addition, the lead frame 212 is a lead frame 212 after the lead cutting process, and the portions at both ends of the lead frame 212 (specifically, the pins 216) are in an L-shaped configuration. Correspondingly, during the process of electrically connecting the packaging structure to an external circuit structure, it is convenient to weld the L-shaped lead frame 212 to the external circuit structure, reducing the difficulty of welding.

[0052] In this embodiment, the IC module further includes: a circuit module 232, located in the first groove, and the circuit module 232 is electrically connected to the lead frame 212. Specifically, the circuit module 232 is mounted in the first groove.

[0053] By arranging the circuit module 232 in the first groove, the circuit module 232 can further increase the functions of the packaging structure. Alternatively, conductive lines are arranged in the circuit module 232, which can further improve the interconnection density of the electronic components 202 in the component module 260, thereby improving the integration degree of the packaging structure.

[0054] As an example, the circuit module 232 includes a chip or an interposer. Specifically, the chip is a chip with a specific function, and conductive lines are arranged in the interposer.

[0055] In this embodiment, the circuit module 232 is a chip. For example, the chip can be the main chip of the packaging structure.

[0056] As an example, a redistribution layer (not shown in the figure) is formed on the surface of the circuit module 232, and the redistribution layer is electrically connected to the internal circuit of the circuit module 232.

[0057] The redistribution layer is used to electrically connect the circuit module 232 to the lead frame 212, so as to re-layout the external terminals (for example, input / output pins) of the circuit module 232, and arrange the external terminals in a new area with a more relaxed pitch occupancy, which is convenient to meet the pitch requirements of different conductive bumps in the packaging structure.

[0058] As an example, the material of the redistribution layer includes one or more of copper, aluminum, tungsten, nickel, and gold.

[0059] Correspondingly, the component module 260 is located on the lead frame 212, and the component module 260 is located above the circuit module 232. The circuit carrier 200 is electrically connected to the lead frame 212.

[0060] Specifically, the circuit carrier 200 faces the lead frame 212, which is convenient for the circuit carrier 200 to be electrically connected to the lead frame 212.

[0061] By arranging the component module 260 on the lead frame 212 and making the component module 260 located above the circuit module 232, the space in the area above the lead frame 212 can be utilized without increasing the occupied area of the packaging structure, and the component module 260 can be arranged in the space in the area above the lead frame 212. Thus, while diversifying the functions of the packaging structure, the integration degree of the packaging structure can be further improved.

[0062] In this embodiment, the packaging structure includes: leads 230, which are electrically connected to the lead frame 212 and the circuit module 232.

[0063] The lead 230 is used to realize the electrical connection between the lead frame 212 and the circuit module 232, so that the component module 260 can be electrically connected to the circuit module 232 through the lead frame 212. Specifically, one end of the lead 230 is electrically connected to the circuit module 232, and the other end of the lead 230 is electrically connected to the pin 216 of the lead frame 212, so that the circuit module 232 can be electrically connected to the external circuit structure through the pin 216.

[0064] As an example, the lead 230 is electrically connected to the redistribution layer of the circuit module 232.

[0065] As an example, the material of the lead 230 includes one or more of copper, gold, and aluminum.

[0066] The circuit module 232 is electrically connected to the lead frame 212 through the lead 230, thereby reducing the impact on the circuit layout of the circuit carrier 200.

[0067] In other embodiments, the circuit module can also be electrically connected to the lead frame through the circuit carrier. Specifically, the packaging structure further includes: a second conductive bump (not shown in the figure), located between the component module and the circuit module. The circuit module is electrically connected to the circuit carrier through the second conductive bump, so that the circuit module is electrically connected to the lead frame via the circuit carrier. Specifically, the second conductive bump is disposed on the surface of the circuit carrier facing away from the electronic component, and the second conductive bump is electrically connected to the circuit carrier.

[0068] It should be noted that in the method for forming the packaging structure, the second conductive bump and the first conductive bump are formed in the same step. Correspondingly, the second conductive bump is in contact with and electrically connected to the circuit module. In other embodiments, the second conductive bump can also be formed on the circuit module.

[0069] In this embodiment, the packaging structure further includes: a second encapsulation layer 290, covering the lead frame 212 and the IC module.

[0070] The second encapsulation layer 290 covers the lead frame 212 and the component module 260, so that the bonding strength between the second encapsulation layer 290 and the lead frame 212 is high, the airtightness of the packaging structure is better, which plays a role in protecting the electronic component 202 and the circuit carrier 200 and preventing the electronic components 202 from short-circuiting each other. At the same time, it also reduces the probability of the packaging structure being contaminated.

[0071] In this embodiment, the second encapsulation layer 290 covers the lead frame 212 and the IC module. In other words, the second encapsulation layers 290 above and below the lead frame 212 are of an integral structure, which not only simplifies the steps of forming the second encapsulation layer 290, but also further improves the sealing performance of the second encapsulation layer 290.

[0072] In this embodiment, the material of the second encapsulation layer 290 includes encapsulant. Specifically, the material of the encapsulant includes epoxy resin, which has the advantages of low shrinkage rate, good adhesion, good corrosion resistance, excellent electrical properties, and low cost. It should be noted that the material of the encapsulant may also include one or more of hardeners, catalysts, and fillers.

[0073] In this embodiment, the second encapsulation layer 290 covers the first encapsulation layer 206.

[0074] It should be noted that the lead frame 212 of this embodiment has a first groove and a second groove. The second groove provides a spatial position for the electrical connection between the first conductive bump 282 and the lead frame 212. The first groove is provided in the base 218, and the first groove provides a spatial position for the circuit module 232, so that the space utilization rate of the area above the first groove (i.e., the area above the circuit module 232) is maximized. Furthermore, more electronic components 202 can be arranged in the component module 260, further enhancing the functional diversification of the packaging structure.

[0075] In some other embodiments, the first groove may not be provided in the base. Correspondingly, no circuit module is formed on the base. That is to say, in the step of providing the lead frame, the second groove is provided in the pin, and the second groove is located on the side of the base. In other embodiments, the second groove may not be provided in the pin, and the first conductive bump is connected to the top surface of the pin.

[0076] Figure 2 It is a schematic structural diagram of the second embodiment of the packaging structure of the present invention.

[0077] The similarities between this embodiment and the first embodiment will not be elaborated here. The differences between this embodiment and the first embodiment are as follows: Refer to Figure 2 , the component module 306 is located in the first groove 314.

[0078] In this embodiment, the circuit carrier 300 faces away from the bottom of the first groove 314.

[0079] Positioning the circuit carrier 300 away from the bottom of the first groove 314 facilitates the electrical connection between the circuit carrier 300 and the circuit module 328 placed above the component module 306, so that the circuit module 328 is electrically connected to the component module 306 through the circuit carrier 300.

[0080] It should be noted that the component module 306 is located in the first groove 314, so that the space utilization rate of the area above the first groove 314 (i.e., the area above the component module 306) is maximized. Correspondingly, the operable space for arranging the circuit module 328 above the lead frame 312 is increased, and the operation difficulty is reduced.

[0081] It should also be noted that the first encapsulation layer covers the electronic components and the circuit carrier board 300, that is, the first encapsulation layer covers the component module 306. The component module 306 is located in the first groove 314. The first encapsulation layer can play an electrical isolation role for the electronic components and the lead frame, reducing the risk of short circuit between the electronic components in the component module 306 and the lead frame. Therefore, as an example, the component module 306 can be mounted on the lead frame to make full use of the space in the first groove.

[0082] In this embodiment, the IC module further includes: a circuit module 328, which is located on the lead frame 312 and above the component module 306. The circuit module 328 is electrically connected to the component module 306 and the lead frame 312.

[0083] The circuit module 328 can further increase the functions of the packaging structure, or conductive lines are arranged in the circuit module 328, which can further improve the interconnection density of the electronic components in the component module 306, thereby improving the integration degree of the packaging structure.

[0084] It should be noted that, as an example, along the thickness direction of the circuit module 328, the component module 306 is located on the same side of the circuit module 328, and the component modules 306 are all located in the first groove 314. In other embodiments, according to actual requirements, some of the component modules can also be located in the first groove, and the remaining component modules are located on the surface of the circuit module 328 facing away from the first groove.

[0085] As an example, the circuit module 328 includes a chip or an interposer. Specifically, the chip is a chip with a certain specific function, and conductive lines are arranged in the interposer. For example, the circuit module 328 is a chip, and the chip can be the main chip of the packaging structure. Another example is that the circuit module 328 is an interposer, so that the component module 306 is electrically connected to the lead frame 312 through the interposer, or, according to needs, another component module 306 is arranged on the interposer.

[0086] As an example, a redistribution layer (not shown in the figure) is formed on the surface of the circuit module 328, and the redistribution layer is electrically connected to the internal circuit of the circuit module 328.

[0087] The redistribution layer is used to electrically connect the circuit module 328 to the lead frame 312 and to electrically connect the circuit module 328 to the component module 306, so as to re-layout the external terminals (for example, input / output pins) of the circuit module 328 and arrange the external terminals to a new area with a more relaxed pitch occupancy, which is convenient for meeting the pitch requirements of different conductive bumps in the packaging structure.

[0088] As an example, the material of the rewiring layer includes one or more of copper, aluminum, tungsten, nickel, and gold.

[0089] In this embodiment, the device module further includes: a second conductive bump 316, which is located on the surface of the circuit carrier 300 facing away from the electronic component and is electrically connected to the circuit carrier 300.

[0090] Specifically, the second conductive bump 316 is electrically connected to the rewiring layer in the circuit module 328, so that the component module 306 can be electrically connected to the circuit module 328 through the rewiring layer.

[0091] Continuing to refer to Figure 2 , in this embodiment, the packaging structure further includes: a first conductive bump 350, which is located on the circuit module 328 and is electrically connected to the circuit module 328, and the first conductive bump 350 is located in the second groove to be connected to the lead frame 312.

[0092] The first conductive bump 350 is used to place the circuit module 328 on the lead frame 312, reducing the risk of the circuit module 328 and the lead frame 312 separating from each other. At the same time, the first conductive bump 350 is also used to electrically connect the circuit module 328 and the lead frame 312, so that the circuit module 328 can be electrically connected to an external circuit structure, and further enabling the component module 306 to be electrically connected to the external circuit structure through the circuit module 328.

[0093] Specifically, the first conductive bump 350 is electrically connected to the rewiring layer in the circuit module 328, so that the lead frame 312 can be electrically connected to the circuit module 328.

[0094] As an example, the material of the first conductive bump 350 includes one or more of gold, lead tin, silver tin, gold tin, and copper tin.

[0095] For the function of the second groove, reference can be made to the relevant description in the first embodiment, and details will not be elaborated here.

[0096] Correspondingly, an embodiment of the present invention further provides a method for forming a packaging structure. Among them, Figures 3 to 15 is the structural schematic diagram corresponding to each step in the first embodiment of the method for forming the packaging structure of the present invention.

[0097] Refer to Figures 3 to 9 , provide a component module 160, the component module 160 includes a circuit carrier 100 and a plurality of electronic components 102 located on the circuit carrier 100, and the electronic components 102 are electrically connected to the circuit carrier 100.

[0098] The component module 160 is used to be subsequently disposed on the lead frame. The reliability of the lead frame is higher than that of the substrate, so that the overall reliability of the component module 160 disposed on the lead frame is greatly improved, thereby improving the reliability of the packaging structure.

[0099] The component module 160 has a plurality of electronic components 102, and the plurality of electronic components 102 have multiple functions, so that the packaging structure has the characteristic of diversified functions, thereby improving the integration degree of the packaging structure.

[0100] Specifically, the electronic component 102 includes one or more of a chip, a passive component, an integrated passive device (IPD), a filter, a crystal oscillator, an antenna, and a sensor. As an example, the electronic component 102 includes a chip. Specifically, the electronic component 102 can be mounted on the circuit carrier 100 or flip-chip welded to the circuit carrier 100.

[0101] The circuit carrier 100 provides a process platform for disposing a plurality of electronic components 102 to support the electronic components 102. At the same time, the circuit carrier 100 has conductive lines, and the conductive lines are used to supply power to the electronic components 102 or transmit electrical signals, thereby realizing the packaging and circuit integration of the electronic components 102. Moreover, disposing the plurality of electronic components 102 on the circuit carrier 100 reduces the process difficulty of arranging conductive lines on the circuit carrier and reduces the process cost.

[0102] It should be noted that the number of the component modules 160 can be one or more. In the case of providing a plurality of component modules 160, fixing the plurality of component modules 160 to the frame is beneficial to further improving the integration degree and functionality of the packaging structure.

[0103] Combined with reference Figures 3 to 9 , the steps of providing the component module 160 are described in detail.

[0104] Reference Figure 3 , the steps of providing the component module 160 include: providing a circuit carrier 100, and the circuit carrier 100 has a plurality of module areas 100A.

[0105] The circuit carrier 100 provides a process platform for disposing a plurality of electronic components 102 to support the electronic components 102. At the same time, the circuit carrier 100 has conductive lines, and the conductive lines are used to supply power to the electronic components 102 or transmit electrical signals, thereby realizing the packaging and circuit integration of the electronic components 102.

[0106] Specifically, the circuit carrier board 100 may include dielectric materials of homogeneous or heterogeneous layers, as well as metal lines. In this embodiment, the circuit carrier board 100 includes a PCB (Printed Circuit Board) or a substrate with circuits.

[0107] The module area 100A is used to define an area for subsequently arranging a plurality of electronic components 102, which is conducive to subsequent dividing the circuit carrier board 100 to form single-component modules.

[0108] With reference to Figure 4 and Figure 5 , a plurality of electronic components 102 are respectively arranged on the circuit carrier board 100 in each module area 100A to form module blocks (not labeled).

[0109] Specifically, the module blocks are used to provide a process basis for subsequently separating multiple sub-modules. At the same time, before the subsequent dividing process to form sub-modules, a plurality of electronic components 102 are respectively arranged on the circuit carrier board 100 in each module area 100A, which is conducive to subsequent large-area production and preparation of component modules 160, improving the process efficiency.

[0110] In this embodiment, the process of arranging a plurality of electronic components 102 on the circuit carrier board 100 in the module area 100A includes one or more of surface mounting process, flip-chip process, and wire bonding process. For example, with reference to Figure 4 , for a specific electronic component 102, it is fixed to the circuit carrier board 100 through the flip-chip process to simultaneously realize the electrical connection between the electronic component 102 and the circuit carrier board 100. Or, with reference to Figure 5 , for a specific electronic component 102, through the wire bonding process, connection lines 103 are formed on the circuit carrier board 100 in each module area 100A. One end of the connection line 103 is connected to the circuit carrier board 100, and the other end of the connection line 103 is connected to the specific electronic component 102, enabling the electronic component 102 to be electrically connected to the circuit carrier board 100 through the connection line 103.

[0111] With reference to Figure 6 , the steps of forming the module blocks further include: forming a first encapsulation layer 106 covering the electronic component 102 and the circuit carrier board 100.

[0112] The first encapsulation layer 106 functions to protect the electronic component 102 and the circuit carrier board 100, prevent the electronic components 102 from being short-circuited with each other, and also reduce the probability of damage and contamination of the electronic component 102. At the same time, the electronic component 102 and the circuit carrier board 100 encapsulated by the first encapsulation layer 106 are conducive to installation and transportation.

[0113] It should also be noted that before the component module 160 is disposed on the lead frame, a first encapsulation layer 106 covering the electronic component 102 and the circuit carrier 100 is formed. After the module block is subsequently divided to form the component module 160, reliability tests can be individually performed on each component module 160 to promptly screen out the component modules 160 with unqualified quality. Correspondingly, the component modules 160 with a high yield rate are subsequently disposed on the lead frame, thereby improving the product yield rate of the packaging structure.

[0114] In this embodiment, the material of the first encapsulation layer 106 includes encapsulant. For the description of the material of the first encapsulation layer 106, reference can be made to the description in the foregoing embodiment, which will not be elaborated herein.

[0115] Specifically, after the first encapsulation layer 106 is formed and before the subsequent division process, it further includes: curing and baking the first encapsulation layer 106 so that the molecular chain cross-reaction in the first encapsulation layer 106 is more sufficient, so as to make it have more stable physical and chemical properties and release the internal stress in the first encapsulation layer 106.

[0116] In other embodiments, after the module block is formed, it is also possible not to form the first encapsulation layer covering the electronic component and the circuit carrier, but to perform a division process on the module block.

[0117] Reference Figure 7 , after the module block is formed and before the subsequent division process, it further includes: forming a first conductive bump 182 on the surface of the circuit carrier 100 facing away from the electronic component 102, and the first conductive bump 182 is electrically connected to the circuit carriers 100 of a plurality of module regions 100A respectively.

[0118] The first conductive bump 182 is used to lead out the electrical property of the circuit carrier 100.

[0119] Specifically, the first conductive bump 182 is used to realize disposing the component module 160 on the lead frame, reducing the risk of the component module 160 being separated from the lead frame. At the same time, the first conductive bump 182 is also used to realize the electrical connection between the component module 160 and the lead frame.

[0120] In this embodiment, the process of forming the first conductive bump 182 on the surface of the circuit carrier 100 facing away from the electronic component 102 includes a ball mounting process.

[0121] Specifically, by means of the ball mounting process, the first conductive bump 182 can be formed at a specified position on the surface of the circuit carrier 100 facing away from the electronic component 102, which is conducive to the first conductive bump 182 being able to fit with the subsequently formed second groove. At the same time, the first conductive bump 182 formed by the ball mounting process has characteristics such as high connection reliability, and can reduce the risk of the first conductive bump 182 falling off from the component module 160. In other embodiments, the process of forming the first conductive bump on the surface of the circuit carrier facing away from the electronic component can also be an electroplating process.

[0122] As an example, the material of the first conductive bump 182 includes one or more of gold, lead tin, silver tin, gold tin, and copper tin.

[0123] Reference Figures 8 to 9 , at the junction of adjacent module areas 100A, the module block is divided to separate single sub-modules as the component module 160.

[0124] By dividing the module block, multiple component modules 160 are separated, which is conducive to subsequently individually arranging each component module 160 on the lead frame. As an example, the process of dividing the module block includes one or both of physical cutting and laser cutting.

[0125] Correspondingly, in the step of providing the component module 160, a first conductive bump 182 is formed on the surface of the circuit carrier 100 facing away from the electronic component 102, and the first conductive bump 182 is electrically connected to the circuit carrier 100.

[0126] Reference Figures 10 to 11 , a lead frame 112 is provided.

[0127] The lead frame 112 provides a process platform for the subsequent assembly operation of forming the IC module. At the same time, the reliability of the lead frame 112 is relatively high. After the subsequent formation of the second encapsulation layer, the bonding strength between the second encapsulation layer and the lead frame 112 is high, and the airtightness of the packaging structure is better.

[0128] As an example, the lead frame 112 is a metal lead frame 112. In this embodiment, the material of the lead frame 112 includes copper or iron-nickel alloy. Specifically, copper or iron-nickel alloy has good electrical conductivity, high thermal conductivity, a low coefficient of thermal expansion, and at the same time, has good corrosion resistance and oxidation resistance.

[0129] In this embodiment, the steps of forming the lead frame 112 include: providing an initial lead frame 110; stamping the initial lead frame 110 to form the lead frame 112. Specifically, the forming process of the lead frame 112 includes a mechanical stamping frame process or a chemical etching frame process. As an example, in the step of providing the lead frame 112, the process of forming the lead frame 112 includes a mechanical stamping frame process.

[0130] In this embodiment, in the step of providing the lead frame 112, the lead frame 112 includes pins 116 and a base 118 in contact with the pins 116, and the base 118 has a first groove 114.

[0131] The pins 116 are used to realize the electrical connection between the packaging structure and the external circuit structure, and the base 118 is used to provide a process platform for fixing the component module 160.

[0132] It should be noted that the first groove 114 in the base 118 is used to provide a spatial position for setting the circuit module subsequently.

[0133] It should also be noted that since the base 118 has the first groove 114, the space in the first groove 114 and the space above the first groove 114 can both be utilized, so that the space utilization rate of the area above the first groove 114 is maximized, and further, more electronic components 102 can be arranged in the component module 160, further enhancing the functional diversification of the packaging structure.

[0134] As an example, another circuit module (for example, a main chip) can be arranged in the first groove.

[0135] In this embodiment, in the step of providing the lead frame 112, the lead frame 112 includes pins 116 and a base 118 in contact with the pins 116, and the pins 116 have a second groove 113, and the second groove 113 is located on the side of the base 118. For example, the second groove 113 is located on both sides or around the base 118.

[0136] Specifically, the second groove 113 is located on the side of the first groove 114.

[0137] It should be noted that during the subsequent assembly operation of the IC module, the second groove 113 provides a spatial position for the first conductive bump 182.

[0138] It should be noted that during the subsequent assembly operation of the IC module, each IC module is set on the lead frame 112. Correspondingly, by providing the second groove 113, it is convenient to fix any module in the IC module above the first groove 114 of the lead frame through the first conductive bump 182, and make the first conductive bump 182 located in the second groove 113, so as to realize the electrical connection between the module above the first groove 114 in the IC module and the lead frame 112, and perform positioning and fixing through the second groove 113.

[0139] Specifically, by providing the second groove 113 in the lead frame 112 for positioning the first conductive bump 182, during the subsequent assembly operation of the IC module, the risk of displacement or detachment between the lead frame 112 and the component module 160 is reduced. At the same time, the contact surface between the first conductive bump 182 located in the second groove 113 and the lead frame 112 includes the side surface and the bottom surface, which increases the contact area between the first conductive bump 182 and the lead frame 112, thereby improving the bonding strength between the first conductive bump 182 and the lead frame 112, further reducing the risk of displacement or detachment between the lead frame 112 and the component module 160, and increasing the contact area also improves the electrical connection performance between the first conductive bump 182 and the lead frame 112, thus improving the reliability of the packaging structure.

[0140] The second groove 113 has a bottom surface and an inner wall in a closed ring shape, which is convenient for the first conductive bump 182 to contact one or both of the bottom surface and the inner wall.

[0141] The second groove 113 is formed during the mechanical stamping frame process. The distance between the second grooves 113 is determined according to the distance between the first conductive bumps 182 in the component module 160. Thus, during the subsequent assembly operation of the IC module, the first conductive bump 182 can be accurately aligned with the second groove 113, and the first conductive bump 182 is placed in the second groove 113.

[0142] Reference Figures 12 to 13 , perform the assembly operation of the IC module (not labeled), including: setting the component module 160 on the lead frame 112, and the component module 160 is electrically connected to the lead frame 112.

[0143] The component module 160 is used to form the IC module.

[0144] Specifically, the component module 160 is fixed on the lead frame 112. The component module 160 has a plurality of electronic components 102, and the plurality of electronic components 102 have multiple functions, so that the packaging structure has the characteristic of diversified functions, thereby improving the integration degree of the packaging structure. The component module 160 is electrically connected to the lead frame 112, so that the component module 160 can be electrically connected to an external circuit structure through the lead frame 112.

[0145] Reference Figure 12 , before the component module 160 is disposed on the lead frame 112, the assembly operation of the IC module further includes: disposing a circuit module 132 in the first groove 114, and the circuit module 132 is electrically connected to the lead frame 112.

[0146] The circuit module 132 is also used to form the IC module.

[0147] Specifically, by disposing the circuit module 132 in the first groove 114, the circuit module 132 can further increase the functions of the packaging structure, or conductive lines are arranged in the circuit module 132, which can further improve the interconnection density of the electronic components 102 in the component module 160, thereby improving the integration degree of the packaging structure.

[0148] As an example, the circuit module 132 includes a chip or an interposer. Specifically, the chip is a chip with a certain specific function, and conductive lines are arranged in the interposer. In this embodiment, the circuit module 132 is a chip. For example, the chip can be the main chip of the packaging structure.

[0149] As an example, a redistribution layer (not shown in the figure) is formed on the surface of the circuit module 132, and the redistribution layer is electrically connected to the internal circuit of the circuit module 132.

[0150] The redistribution layer is used to electrically connect the circuit module 132 to the lead frame 112, so as to re-layout the external terminals (for example, input / output pins) of the circuit module 132 and arrange the external terminals to a new area with a more relaxed pitch occupancy, which is convenient to meet the pitch requirements of different conductive bumps in the packaging structure.

[0151] As an example, the material of the redistribution layer includes one or more of copper, aluminum, tungsten, nickel, and gold.

[0152] In this embodiment, the process of disposing the circuit module 132 in the first groove 114 includes a pick-and-place process or a flip-chip process.

[0153] Continue to refer to Figure 12, after the circuit module 132 is disposed in the first groove 114, before the component module 160 is subsequently disposed on the lead frame 112, the assembly operation of the IC module further includes: forming leads 130 that electrically connect the lead frame 112 and the circuit module 132 through a wire bonding process.

[0154] It should be noted that the leads 130 are used to achieve the electrical connection between the lead frame 112 and the circuit module 132, so that the component module 160 can be electrically connected to the circuit module 132 through the lead frame 112.

[0155] It should also be noted that one end of the lead 130 is electrically connected to the circuit module 132, and the other end of the lead 130 is electrically connected to the pin 116 of the lead frame 112, so that the circuit module 132 can be electrically connected to an external circuit structure through the pin 116.

[0156] As an example, the lead 130 is electrically connected to the redistribution layer of the circuit module 132.

[0157] As an example, the material of the lead 130 includes one or more of copper, gold, and aluminum.

[0158] The circuit module 132 is electrically connected to the lead frame 112 through the lead 130, thereby reducing the impact on the circuit layout of the circuit board 100.

[0159] In other embodiments, it may also be: in the step of disposing the component module on the lead frame, the circuit board and the circuit module are electrically connected through a second conductive bump, and the second conductive bump is located between the circuit board and the circuit module, so that the circuit module is electrically connected to the lead frame through the circuit board. Specifically, the second conductive bump is disposed on the surface of the circuit board facing away from the electronic component, and the second conductive bump is electrically connected to the circuit board.

[0160] It should be noted that the second conductive bump and the first conductive bump are formed in the same step. Correspondingly, in the subsequent process of disposing the first conductive bump in the second groove, the second conductive bump contacts and is electrically connected to the circuit module. In some other embodiments, the second conductive bump may also be formed on the circuit module. In other embodiments, the second conductive bump and the first conductive bump may also be formed separately in different steps.

[0161] Reference Figure 13 , after the circuit module 132 is disposed in the first groove 114, the component module 160 is disposed on the lead frame 112, and the component module 160 is located above the circuit module 132, and the circuit board 100 is electrically connected to the lead frame 112.

[0162] By disposing the component module 160 on the lead frame 112 and positioning the component module 160 above the circuit module 132, it is possible to utilize the space in the area above the lead frame 112 without increasing the occupied area of the package structure, and to dispose the component module 160 in the space in the area above the lead frame 112. Thus, while diversifying the functions of the package structure, the integration degree of the package structure can be further improved.

[0163] Specifically, in the step of disposing the component module 160 on the lead frame 112, the circuit carrier 100 is oriented towards the lead frame 112 to facilitate electrical connection between the circuit carrier 100 and the lead frame 112.

[0164] In this embodiment, the step of disposing the component module 160 on the lead frame 112 includes: disposing the circuit carrier 100 on the lead frame 112 and positioning the first conductive bump 182 in the second groove 113 to connect with the lead frame 112. As an example, the process of disposing the component module 160 on the lead frame 112 includes a mounting process.

[0165] The first conductive bump 182 is disposed in the second groove 113, which increases the bonding strength between the first conductive bump 182 and the lead frame 112, reduces the risk of displacement or detachment between the lead frame 112 and the component module 160, and also improves the electrical connection reliability between the first conductive bump 182 and the lead frame 112, thereby improving the reliability of the package structure.

[0166] It should be noted that during the process of positioning the first conductive bump 182 in the second groove 113, the material of the first conductive bump 182 needs to be subjected to a reflow process to make the material of the first conductive bump 182 in a molten state to contact the surface of the second groove 113. Thus, the contact surface between the reflowed first conductive bump 182 and the second groove 113 includes the bottom surface and the side surface, which can further improve the bonding force between the first conductive bump 182 and the lead frame 112.

[0167] As an example, the IC module includes a stacked component module 160 and a circuit module 132.

[0168] It should be noted that the lead frame 112 introduced in this embodiment has a first groove 114 and a second groove 113. The second groove 113 in the pin 116 provides a spatial position for the first conductive bump 182 to be electrically connected to the lead frame 112. The base 118 of the lead frame 112 has a first groove 114, and the first groove 114 provides a spatial position for the circuit module 132, so that the space utilization rate of the area above the first groove 114 (i.e., the area above the circuit module 132) can be maximized. Furthermore, more electronic components 102 can be arranged in the component module 160, further enhancing the functional diversification of the packaging structure.

[0169] In some other embodiments, the base may not be provided with the first groove. Correspondingly, no circuit module is formed on the base. That is to say, in the step of providing the lead frame, the pin has a second groove, and the second groove is located on both sides of the base. In other embodiments, the pin may not have a second groove, and the first conductive bump is connected to the top surface of the pin.

[0170] Reference Figure 14 , after the assembly operation of the IC module, the method for forming the packaging structure further includes: forming a second encapsulation layer 190 covering the lead frame 112 and the IC module.

[0171] The second encapsulation layer 190 covers the lead frame 112 and the component module 160, so that the bonding strength between the second encapsulation layer 190 and the lead frame 112 is high, the airtightness of the packaging structure is better, which plays a role in protecting the electronic components 102 and the circuit carrier 100, preventing the electronic components 102 from being short-circuited with each other, and dissipating heat from the electronic components 102. At the same time, it also reduces the probability of the packaging structure being contaminated.

[0172] In this embodiment, the material of the second encapsulation layer 190 includes encapsulation material. For the description of the material of the second encapsulation layer 190, reference can be made to the description in the foregoing embodiments, and details are not repeated here.

[0173] It should be noted that part of the pins 116 of the lead frame 112 are exposed by the second encapsulation layer 190, which is beneficial for subsequent lead cutting treatment of the exposed pins 116.

[0174] Reference Figure 15 , after the second encapsulation layer 190 is formed, the method for forming the packaging structure further includes: performing lead cutting treatment on the lead frame 112.

[0175] After the second encapsulation layer 190 is formed, a part of the lead frame 112 is exposed by the second encapsulation layer 190. By trimming the exposed lead frame 112, the exposed lead frame 112 (specifically, the pin 116) is formed into an L-shaped configuration. Correspondingly, during the process of electrically connecting the encapsulation structure to an external circuit structure, it is convenient to solder the L-shaped lead frame 112 to the external circuit structure, reducing the difficulty of soldering.

[0176] It should be noted that the part of the lead frame 112 exposed by the second encapsulation layer 190 is the pin 116. Correspondingly, trimming the lead frame 112 means trimming the pin 116.

[0177] Figures 16 to 17 The structural schematic diagram showing the steps corresponding to the second embodiment of the encapsulation method of the present invention is shown.

[0178] The similarities between this embodiment and the first embodiment will not be elaborated here. The differences between this embodiment and the first embodiment are as follows: Referring to Figure 16 , in the step of disposing the component module 406 on the lead frame 412, the component module 406 is disposed in the first groove 414.

[0179] In this embodiment, in the step of disposing the component module 406 on the lead frame 412, the circuit carrier board 400 faces away from the bottom of the first groove.

[0180] Specifically, facing the circuit carrier board 400 away from the bottom of the first groove 414 enables the subsequent formed circuit modules to be electrically connected through the conductive lines in the circuit carrier board 400, so that the circuit modules are electrically connected to the component module 406 through the circuit carrier board 400.

[0181] It should be noted that the component module 406 is disposed in the first groove 414, so that the space utilization rate of the area above the first groove 414 (i.e., the area above the component module 406) is maximized. Correspondingly, during the subsequent process of disposing the circuit modules above the component module 406, the operable space for disposing the circuit modules above the lead frame 412 is increased, reducing the operation difficulty.

[0182] It should also be noted that the first encapsulation layer covers the electronic components and the circuit carrier board 400, that is, the first encapsulation layer covers the component module 406. During the process of disposing the component module 406 in the first groove 414, even if the component module 406 is mounted on the lead frame, the risk of short circuit between the electronic components in the component module 406 and the lead frame can be reduced.

[0183] In this embodiment, second conductive bumps 416 are provided on the surface of the circuit carrier 400 facing away from the electronic components. The circuit module 428 is electrically connected to the component module 406 through the second conductive bumps 416.

[0184] Reference Figure 17 , the assembly operation of the IC module further includes: after the component module 406 is disposed on the lead frame 412, the circuit module 428 is disposed on the lead frame 412. The circuit module 428 is located above the component module 406, and the circuit module 428 is electrically connected to the component module 406 and the lead frame 412.

[0185] The circuit module 428 can further increase the functions of the package structure, or conductive lines are arranged in the circuit module 428, which can further improve the interconnection density of the electronic components in the component module 406, thereby improving the integration degree of the package structure.

[0186] As an example, the circuit module 428 includes a chip or an interposer. Specifically, the chip is a chip with a certain specific function, and conductive lines are arranged in the interposer. For example, the circuit module 428 is a chip, and the chip can be the main chip of the package structure. Another example is that the circuit module 428 is an interposer, so that the component module 406 is electrically connected to the lead frame 412 through the interposer, or, as required, another component module 406 is disposed on the interposer.

[0187] As an example, a redistribution layer (not shown in the figure) is formed on the surface of the circuit module 428, and the redistribution layer is electrically connected to the internal circuit of the circuit module 428.

[0188] For the description of the redistribution layer, reference can be made to the relevant records in the foregoing embodiments, and details are not described herein again.

[0189] In this embodiment, in the step of disposing the circuit module 428 on the lead frame 412, the circuit module 428 is electrically connected to the component module 406 through the second conductive bumps 416.

[0190] Specifically, the second conductive bumps 416 are electrically connected to the redistribution layer in the circuit module 428.

[0191] As an example, in the step of disposing the circuit module 428 on the lead frame 412, first conductive bumps 450 are formed on the circuit module 428.

[0192] The first conductive bump 450 is used to fix the circuit module 428 to the lead frame 412, reducing the risk of the circuit module 428 and the lead frame 412 detaching from each other. At the same time, the first conductive bump 450 is also used to electrically connect the circuit module 428 and the lead frame 412, so that the circuit module 428 can be electrically connected to an external circuit structure, and further enabling the component module 406 to be electrically connected to the external circuit structure through the circuit module 428.

[0193] In this embodiment, the process of forming the first conductive bump 450 on the circuit module 428 includes a ball mounting process. Specifically, by forming the first conductive bump 450 through the ball mounting process, the first conductive bump 450 can be formed at a specified position on the circuit module 428, which is conducive to the first conductive bump 450 fitting with a second groove (not labeled). At the same time, the first conductive bump 450 formed through the ball mounting process has characteristics such as high connection reliability, and can reduce the risk of the first conductive bump 450 detaching from the circuit module 428.

[0194] In this embodiment, in the step of setting the circuit module 428 on the lead frame 412, the first conductive bump 450 is disposed in the second groove. As an example, the material of the first conductive bump 450 includes one or more of gold, lead tin, silver tin, gold tin, and copper tin.

[0195] In this embodiment, in the step of setting the circuit module 428 on the lead frame 412, the first conductive bump 450 is located in the second groove to be electrically connected to the lead frame 412.

[0196] For the function of the second groove, reference can be made to the relevant description in the first embodiment, and details are not described herein again.

[0197] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. An encapsulation structure, characterized in that, Comprising: A lead frame; An IC module located on the lead frame, the IC module comprising a component module, the component module comprising a circuit carrier board and a plurality of electronic components located on the circuit carrier board, the electronic components being electrically connected to the circuit carrier board, and the component module being electrically connected to the lead frame.

2. The encapsulation structure according to claim 1, wherein The packaging structure further comprises: a first plastic encapsulation layer covering the electronic components and the circuit carrier board.

3. The encapsulation structure according to claim 1, characterized in that, The lead frame comprises pins and a base in contact with the pins, and the pins have second grooves located at the side of the base; The component module further comprises: a first conductive bump located on the surface of the circuit carrier board facing away from the electronic components and electrically connecting the circuit carrier board; The first conductive bump is located in the second groove, and the component module is fixed to the lead frame through the first conductive bump and is electrically connected to the lead frame.

4. The encapsulation structure according to any one of claims 1 to 3, characterized in that The lead frame comprises pins and a base in contact with the pins, and the base has a first groove; The IC module further comprises: a circuit module located in the first groove, the circuit module being electrically connected to the lead frame; The component module is located on the lead frame and the component module is located above the circuit module, and the circuit carrier board is electrically connected to the lead frame.

5. The encapsulation structure according to claim 4, wherein The circuit module comprises a chip or an adapter board.

6. The encapsulation structure according to claim 4, wherein The packaging structure comprises: leads electrically connecting the lead frame and the circuit module; Alternatively, the packaging structure further comprises: a second conductive bump located between the component module and the circuit module, the circuit module being electrically connected to the circuit carrier board through the second conductive bump, so that the circuit module is electrically connected to the lead frame via the circuit carrier board.

7. The encapsulation structure according to claim 1, wherein The lead frame comprises pins and a base in contact with the pins, and the base has a first groove; The component module is located in the first groove; The IC module further comprises: a circuit module located on the lead frame and above the component module, the circuit module being electrically connected to the component module and the lead frame.

8. The encapsulation structure according to claim 7, wherein The bottom of the circuit carrier board faces away from the first groove, and the component module further comprises: a second conductive bump located on the surface of the circuit carrier board facing away from the electronic components and electrically connecting the circuit carrier board; The circuit module is electrically connected to the component module through the second conductive bump.

9. The encapsulation structure according to claim 7, wherein The pins have second grooves located at the side of the first groove; The packaging structure further comprises: a first conductive bump located on the circuit module and electrically connecting the circuit module, and the first conductive bump is located in the second groove to be connected to the lead frame.

10. The encapsulation structure according to any one of claims 7 to 9, characterized in that The circuit module comprises a chip or an adapter board.

11. The encapsulation structure according to claim 1, wherein The packaging structure further comprises: a second plastic encapsulation layer covering the lead frame and the IC module.

12. A method for forming a packaging structure, characterized in that, Including Providing a component module, the component module comprising a circuit carrier board and a plurality of electronic components located on the circuit carrier board, the electronic components being electrically connected to the circuit carrier board; Providing a lead frame; Perform the assembly operation of the IC module, including: disposing the component module on the lead frame, and electrically connecting the component module to the lead frame.

13. The method for forming the encapsulation structure according to claim 12, wherein The steps of providing the component module include: providing a circuit carrier board, the circuit carrier board having a plurality of module areas; Dispose a plurality of electronic components on the circuit carrier board in each of the module areas to form a module block; Perform a splitting process on the module block at the junction of adjacent module areas to separate single sub-modules as the component modules.

14. The method for forming the encapsulation structure according to claim 13, wherein, The steps of forming the module block further include: forming a first encapsulation layer covering the electronic components and the circuit carrier board.

15. The method for forming the encapsulation structure according to claim 13 or 14, wherein After forming the module block and before performing the splitting process, it further includes: forming first conductive bumps on the surface of the circuit carrier board facing away from the electronic components, and the first conductive bumps are electrically connected to the circuit carrier board in a plurality of module areas.

16. The method for forming the encapsulation structure according to claim 12, wherein, In the steps of providing the component module, first conductive bumps are formed on the surface of the circuit carrier board facing away from the electronic components, and the first conductive bumps are electrically connected to the circuit carrier board; In the steps of providing the lead frame, the lead frame includes pins and a base in contact with the pins, and the pins have second grooves located on the side of the base; The steps of disposing the component module on the lead frame include: disposing the circuit carrier board on the lead frame and making the first conductive bumps located in the second grooves to be connected to the lead frame.

17. The method for forming the encapsulation structure according to claim 12 or 16, wherein In the steps of providing the lead frame, the lead frame includes pins and a base in contact with the pins, and the base has a first groove; Before disposing the component module on the lead frame, the assembly operation of the IC module further includes: disposing a circuit module in the first groove, and the circuit module is electrically connected to the lead frame; After disposing the circuit module in the first groove, dispose the component module on the lead frame, and make the component module located above the circuit module, and the circuit carrier board is electrically connected to the lead frame.

18. The method for forming the encapsulation structure according to claim 17, wherein The circuit module includes a chip or an adapter board.

19. The method for forming the encapsulation structure according to claim 17, wherein, After disposing the circuit module in the first groove and before disposing the component module on the lead frame, the assembly operation of the IC module further includes: forming leads electrically connecting the lead frame and the circuit module through a wire bonding process; Or, In the steps of disposing the component module on the lead frame, electrically connect the circuit carrier board and the circuit module through second conductive bumps, so that the circuit module is electrically connected to the lead frame via the circuit carrier board.

20. The method for forming the encapsulation structure according to claim 12, wherein, In the steps of providing the lead frame, the lead frame includes pins and a base in contact with the pins, and the base has a first groove; In the steps of disposing the component module on the lead frame, dispose the component module in the first groove; The assembly operation of the IC module further includes: after the component module is disposed on the lead frame, a circuit module is disposed on the lead frame, the circuit module is located above the component module, and the circuit module is electrically connected to the component module and the lead frame.

21. The method for forming the encapsulation structure according to claim 20, wherein, In the step of providing the component module, second conductive bumps are formed on the surface of the circuit carrier facing away from the electronic component. In the step of disposing the component module on the lead frame, the circuit carrier is oriented away from the bottom of the first groove. In the step of disposing the circuit module on the lead frame, the circuit module is electrically connected to the component module through the second conductive bumps.

22. The method for forming the encapsulation structure according to claim 20, wherein, In the step of providing the lead frame, the pins have second grooves, and the second grooves are located on the side of the first groove. First conductive bumps are formed on the circuit module. In the step of disposing the circuit module on the lead frame, the first conductive bumps are located in the second grooves to be connected to the lead frame.

23. The method for forming the encapsulation structure according to any one of claims 20 to 22, characterized in that The circuit module includes a chip or an adapter board.

24. The method for forming the encapsulation structure according to claim 12, wherein After the assembly operation of the IC module is performed, the method for forming the package structure further includes: forming a second encapsulation layer covering the lead frame and the IC module.

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