Air cooling module of immersed electronic device and test equipment provided with air cooling module

Abstract

The invention provides an air cooling module of an immersed electronic device and test equipment with the air cooling module. The specific electronic device needs to use an immersed cooling system in a normal operation state. The immersed electronic device comprises a boiling assisting piece arranged on a heating source of a circuit board. The air cooling module comprises a gas supply source and a fluid flow guide part, cooling gas is guided into the fluid flow guide part through the gas supply source and is sprayed by aligning with the boiling assisting part, heat can be effectively taken away, and the immersed electronic device can be tested in the air environment. The test equipment is further integrated with a shell, the immersed electronic device is arranged in the shell, and the air cooling module is arranged, so that more comprehensive performance test can be carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and in particular to an air cooling module of an immersion electronic device capable of providing gas cooling for a specific electronic device and a test device equipped with the air cooling module. The specific electronic device requires an immersion cooling system under normal operating conditions. Background Art

[0002] The current two-phase immersion cooling system faces many challenges during the production test phase. Especially in the early stages of product development, when the electronic device needs to be tested in the liquid cooling tank in principle, due to the lack of stability of the electronic device itself, it is often necessary to frequently move the electronic device in and out of the liquid cooling tank to debug and troubleshoot the electronic device, which virtually prolongs the production test time.

[0003] In addition, electronic devices that usually use immersion cooling systems cannot be powered on and tested directly in an air environment, which further prolongs the product development and verification cycle. The main reason is that when electronic devices are moved from a liquid cooling tank to an air environment, the thermal conductivity of air is much lower than that of liquid, resulting in a significant decrease in the heat dissipation performance of the device. If proper cooling measures are not taken, the device may be damaged due to overheating.

[0004] Therefore, in the prior art, when it is necessary to test an electronic device in an air environment, the boiler in the system is usually replaced with a traditional heat sink to ensure that the device can operate normally under air cooling conditions. However, this replacement process is not only time-consuming and labor-intensive, but also further prolongs the product development cycle, and frequent disassembly and assembly operations may also damage the components, thereby increasing costs. Summary of the invention

[0005] In view of the above, the present invention provides an air cooling module for an immersion electronic device and a testing device equipped with the air cooling module, which can completely solve the above problems.

[0006] An embodiment of the present invention provides an air cooling module for an immersion electronic device, wherein the immersion electronic device may include a circuit board and a boiling aid, wherein the boiling aid is disposed on a heat source of the circuit board. The air cooling module includes a gas supply source and a fluid guide, wherein the fluid guide is fluidically connected to the gas supply source. In response to the gas supply source supplying cooling gas to the fluid guide, the fluid guide sprays cooling gas toward the boiling aid.

[0007] An embodiment of the present invention provides a test device for an immersion electronic device, the immersion electronic device including a circuit board and a boiling aid, and the boiling aid being disposed on a heat source of the circuit board. The test device includes a housing, a gas supply source, and a fluid guide member; the housing at least partially covers the immersion electronic device; the fluid guide member is fluidly connected to the gas supply source and fixed to the housing. Wherein, in response to the gas supply source supplying cooling gas to the fluid guide member, the fluid guide member sprays the cooling gas toward the boiling aid.

[0008] An embodiment of the present invention provides a test device for an immersion electronic device, which includes an immersion electronic device, a housing, a gas supply source, and a fluid guide member; the immersion electronic device includes a circuit board and a boiling aid, and the boiling aid is disposed on a heat source of the circuit board. The housing at least partially covers the immersion electronic device; the fluid guide member is fluidly connected to the gas supply source and fixed to the housing. Wherein, in response to the gas supply source supplying cooling gas to the fluid guide member, the fluid guide member sprays the cooling gas toward the boiling aid.

[0009] In summary, according to some embodiments of the air-cooling module of the immersion electronic device and the test device equipped with the air-cooling module, the immersion electronic device can be tested in an air environment without modification, significantly shortening the production test time and improving the system reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 The figure shows a schematic diagram of an embodiment of the test device for the immersion electronic device of the present invention;

[0011] Figure 2 The figure shows Figure 1 a partial cross-sectional view of, which shows the circuit board, the boiling aid, and the fluid guide member;

[0012] Figure 3 The figure shows a time, temperature, and power relationship diagram of an embodiment of the test device for the immersion electronic device of the present invention;

[0013] Figure 4 The figure shows a schematic diagram of an embodiment of the test device for the immersion electronic device of the present invention;

[0014] Figure 5 The figure shows a schematic diagram of an embodiment of the test device for the immersion electronic device of the present invention;

[0015] Figure 6 The figure shows a schematic diagram of an embodiment of the test device for the immersion electronic device of the present invention;

[0016] Figure 7A The figure shows a perspective view of an embodiment of the test device for the immersion electronic device of the present invention;

[0017] Figure 7B The figure shows a cross-sectional view of an embodiment of a test device for an immersion electronic device of the present invention;

[0018] Figure 8 The figure shows a perspective view of the housing of an embodiment of a test device for an immersion electronic device of the present invention.

[0019] Description of reference numerals:

[0020] 1. Immersion electronic device;

[0021] 2. Gas supply source;

[0022] 3. Fluid guide;

[0023] 4. Phase change medium supply unit;

[0024] 5, 75, 85. Housing;

[0025] 6. Ventilation unit;

[0026] 7. Condensation recovery unit;

[0027] 11. Circuit board;

[0028] 12. Boiling aid;

[0029] 21. Airflow generating device;

[0030] 31. Vortex tube;

[0031] 32. Nozzle;

[0032] 33. Gas pipeline;

[0033] 41. Fluid container;

[0034] 42. Regulating valve;

[0035] 43. Three-way joint;

[0036] 51. Main end face;

[0037] 52. Side end face;

[0038] 53. Top plate;

[0039] 54. Fixing bracket;

[0040] 61. Ventilation opening;

[0041] 111. Wafer;

[0042] 311. Fluid inlet;

[0043] 312. High-temperature gas outlet;

[0044] 313. Low-temperature gas outlet;

[0045] 321. Opening;

[0046] CA. Air-cooling module;

[0047] D1. Specific distance;

[0048] G. Gap;

[0049] h1. Height of the first air-containing space;

[0050] h2. Height of the second air-containing space;

[0051] Ha. Heating area;

[0052] S1. First air-containing space;

[0053] S2. Second air-containing space. Detailed implementation manners

[0054] The following presents various embodiments for detailed description. The embodiments are only used as examples for illustration and will not limit the scope of protection of the present invention. In addition, some elements are omitted in the drawings of the embodiments to clearly show the technical features of the present invention. Furthermore, the same reference numerals will be used to represent the same or similar elements in all the drawings, and the drawings of the present invention are only for schematic illustration, not necessarily drawn to scale, and not all details may be presented in the drawings.

[0055] Please refer to Figure 1 and Figure 2 , Figure 1 a schematic diagram of an embodiment of the test equipment for the immersion electronic device 1 of the present invention, Figure 2 Figure 1 a partial cross-sectional view of which shows the circuit board 11, the boiling assisting member 12 and the fluid guiding member 3. As shown in the embodiment of Figure 2 , the immersion electronic device 1 includes a circuit board 11 and a boiling assisting member 12, and the boiling assisting member 12 is disposed on the heat source of the circuit board 11, and the heat source is usually a wafer 111 or other high-power electronic devices, such as a CPU, a GPU, a TPU, an FPGA, an ASIC, an XPU, an NPU, a DPU, an ASIC or other semiconductor integrated circuits with high thermal design power.

[0056] The boiling aid 12 is a heat exchanger used in an immersion cooling system, and its main function is to quickly transfer the heat generated by the heat source to the coolant. For example, in some immersion cooling systems, when the wafer 111 operates, the heat generated by the wafer 111 is conducted to the boiling aid 12, and the coolant vaporizes on the surface of the boiling aid 12 to form bubbles, similar to the bubbles generated when water boils. These bubbles continuously generate and burst, quickly taking away the heat on the boiling aid 12 and the wafer 111.

[0057] In some embodiments, the boiling aid 12 can be a metal plate with a porous structure, which is directly attached to the wafer 111. In other embodiments, the boiling aid 12 can further include a thermal interface, such as a copper heat conducting plate or a heat pipe; the thermal interface can be disposed between the boiling aid 12 and the wafer 111 to provide excellent heat conduction and temperature equalization effects.

[0058] In Figure 1 In the illustrated embodiment, the test equipment of the immersion electronic device 1 mainly includes a housing 5 and an air cooling module CA, and the air cooling module CA can include a gas supply source 2 and a fluid guide 3. The housing 5 at least partially covers the immersion electronic device 1; in some embodiments, the housing 5 can be a cover, which is directly placed on the circuit board 11.

[0059] Furthermore, the gas supply source 2 can be a pneumatic source uniformly supplied within the factory area, or a high-pressure steel cylinder or an air compressor. In addition, the gas provided by the gas supply source 2 can be air, or other gases, such as inert gases or cryogenic gases. Also, the temperature of the gas can be arbitrarily selected, preferably lower than or equal to room temperature. In some embodiments, the gas supply source 2 can also be configured with a cryogenic generation device to lower the gas temperature; the cryogenic generation device can include, but is not limited to, a gas cooling device composed of a compressor, a condenser, and an evaporator, an evaporative cooler, a heat exchanger with a cooling circuit, an adsorption cooler, or a heat exchanger using a semiconductor cooling chip, etc.

[0060] In addition, the fluid deflector 3 is fluidly connected to the gas supply source 2 and fixed to the housing 5. In some embodiments, the fluid deflector 3 may include a gas pipe 33 and a nozzle 32. One end of the gas pipe 33 communicates with the gas supply source 2, and the other end is configured with the nozzle 32. The opening 321 of the nozzle 32 faces the boiling assisting member 12. Among them, in addition to accelerating the fluid, the nozzle 32 can also cool the flowing fluid in some embodiments. For example, a de Laval nozzle, a convergent-divergent nozzle, a coaxial nozzle, a variable geometry nozzle, or a multiphase flow nozzle is used.

[0061] In addition, in Figure 1 In the illustrated embodiment, a ventilation unit 6 is disposed on one side of the housing 5 and is adapted to ventilate the interior of the housing 5 to further improve the heat dissipation efficiency. In some embodiments, the ventilation unit 6 may be an exhaust fan disposed on one side wall of the housing 5, and a ventilation opening 61 may be formed in the other side wall of the housing 5 corresponding to the ventilation unit 6. When the ventilation unit 6 operates, external air can enter the housing 5 through the ventilation opening 61, and at the same time, the high-temperature air inside the housing 5 is discharged by the ventilation unit 6, thereby effectively reducing the temperature inside the housing 5.

[0062] Please continue to refer to Figure 1 and Figure 2 When the gas supply source 2 supplies the cooling gas to the fluid deflector 3, the cooling gas flows through the gas pipe 33 and is ejected toward the boiling assisting member 12 through the nozzle 32, thereby cooling the boiling assisting member 12 and the wafer 111. In addition, in some embodiments, in order to improve the heat dissipation efficiency of the boiling assisting member 12, the surface area of the boiling assisting member 12 is usually increased and can completely cover the wafer 111.

[0063] In some embodiments, when the gas supply source 2 supplies the cooling gas to the fluid deflector 3, the nozzle 32 sprays the cooling gas toward the heating area Ha of the boiling assisting member 12, and the heating area Ha corresponds to the upper surface of the wafer 111. Further explanation, because the heat conduction path of the heating area Ha is shorter and the thermal resistance is smaller, it is usually the area with a higher temperature on the boiling assisting member 12. Therefore, the nozzle 32 directly sprays the cooling gas toward the heating area Ha corresponding to the wafer 111, which can provide a better heat dissipation effect.

[0064] However, the present invention is not limited thereto; in other embodiments, when it is necessary to cool a large-area wafer 111 and the cooling gas jet cannot completely cover the wafer 111, only the hot spots on the wafer 111 with a higher thermal design power (TDP) can be cooled. The hot spots are the high-heat regions on the wafer 111. That is to say, in some embodiments, the nozzle 32 of the fluid guide member 3 can be aligned with a specific heat-generating region Ha of the boiling assisting member 12 corresponding to the hot spot, and the specific heat-generating region Ha can be jet-cooled to obtain better heat dissipation efficiency. In addition, in other embodiments, for example, when multiple wafers 111 share a boiling assisting member 12, or there are multiple hot spots on a large wafer 111, multiple fluid guide members 3 can also be configured to simultaneously jet-cool multiple heat-generating regions Ha on the boiling assisting member 12.

[0065] Please refer to Figures 1 to 3 , Figure 3 The time, temperature, and power relationship diagram of an embodiment of the test equipment of the immersion electronic device 1 of the present invention is shown. The experimental results show that in the experiment using a server motherboard as an example, when the wafer 111 (CPU) operates continuously at a high power of about 275W on average for more than one hour, the air-cooling module CA can maintain the temperature of the wafer 111 within 100°C. Moreover, in this experiment, air is used as the cooling gas, the gas flow supplied by the gas supply source 2 is between about 15 CFM and 30 CFM, its temperature is between about 20°C and 25°C, and the outlet cross-sectional area of the nozzle 32 is about 50 mm 2 .

[0066] It can be seen therefrom that some embodiments of the present invention can indeed effectively dissipate heat from the immersion electronic device 1. Without using an immersion cooling system and without modifying the immersion electronic device 1 (for example, replacing the boiling assisting member 12 with heat dissipation fins), the immersion electronic device 1 can directly perform product testing in the air.

[0067] Please refer to Figure 4 , which is a schematic diagram of an embodiment of the test equipment of the immersion electronic device 1 of the present invention. In some embodiments, the air-cooling module CA may further include a phase change medium supply unit 4, which is fluidly connected to the fluid guide member 3. The phase change medium supply unit 4 is adapted to supply a phase change medium to the fluid guide member 3, so that the cooling gas is doped with the phase change medium. In some embodiments, the phase change medium supply unit 4 may include a fluid container 41 and a regulating valve 42. The fluid container 41 is used to accommodate the phase change medium and is fluidly connected to the fluid guide member 3; and the regulating valve 42 is disposed between the fluid container 41 and the fluid guide member 3.

[0068] Further elaboration is as follows. In some embodiments, the fluid container 41 can be connected to the gas pipeline 33 through a tee joint 43, and the regulating valve 42 can be disposed between the fluid container 41 and the gas pipeline 33. The regulating valve 42 can be an electromagnetic valve, which is adapted to open or close the supply of the phase change medium. In other embodiments, the regulating valve 42 can be an electronically controlled proportional valve, which can further adjust the flow rate of the phase change medium supplied to the fluid deflector 3.

[0069] In some embodiments, the phase change medium can be a low-boiling-point liquid, such as but not limited to an electronic engineering liquid, whose boiling point can be between 0°C and 90°C, and the evaporation rate can be above 10 ml / min. In other embodiments, the phase change medium can also be liquid nitrogen or other liquids with low boiling points, small specific heat capacities, weak intermolecular forces, and high volatility characteristics, such as ethanol, isopropyl alcohol, acetone, and ammonia.

[0070] When the phase change medium evaporates from the fluid container 41, the gaseous phase change medium will mix with the gas (such as air) supplied by the gas supply source 2 to form a cooling gas. During this process, when the liquid phase change medium evaporates into a gas, due to the change in latent heat, it will absorb heat from the surrounding gas, thereby reducing the temperature of the cooling gas. Furthermore, when the cooling gas flows through the nozzle 32 of the fluid deflector 3, the cooling gas is further accelerated and cooled. Then, when the cooling gas is sprayed from the nozzle 32 onto the boiling assisting member 12, the phase change medium will absorb a large amount of heat from the boiling assisting member 12.

[0071] In addition, in Figure 4 the illustrated embodiment, a condensation recovery unit 7 is disposed on one side of the ventilation unit 6 for condensing the phase change medium into a liquid state and recovering it. This not only reduces costs but also reduces the harm of the phase change medium to the environment or the human body. In some embodiments, the condensation recovery unit 7 can include a low-temperature circuit, such as a heat exchanger or pipeline through which a refrigerant flows. When the gaseous phase change medium flows through the low-temperature circuit of the ventilation unit 6, it will condense into a liquid state for convenient recovery. The condensation recovery unit 7 can be disposed on one side of the ventilation unit 6, not limited to the air inlet side or the air outlet side of the ventilation unit 6, nor limited to the inside or outside of the housing 5. In other embodiments, it can also be disposed on one side of the boiling assisting member 12; in some embodiments, the condensation recovery unit 7 is disposed on the downstream side of the flow direction of the cooling gas.

[0072] According to the specific experimental results of mixing a phase change medium and air as a cooling gas, it is shown that, compared with simply using room temperature air as the cooling gas, the temperature on the surface of the boiling assistant 12 can be further reduced by about 15°C to 18°C. The relevant experimental parameters include: the gas supplied by the gas supply source 2 is air, its flow rate is between about 15 CFM and 30 CFM, and its temperature is between about 20°C and 25°C; and the outlet cross-sectional area of the nozzle 32 is about 50 mm 2 ; the phase change medium uses 3M TM Novec TM electronic engineering fluid, and its evaporation rate is about 20 ml / min. Thus, it can be seen that in the embodiment of mixing a phase change medium and air as a cooling gas, the heat dissipation effect of the immersion electronic device 1 is more significant.

[0073] Please refer to Figure 5 , which is a schematic diagram of an embodiment of the test equipment of the immersion electronic device 1 of the present invention. In the Figure 5 shown embodiment, the fluid guide 3 may further include a vortex tube 31, which may be arranged at the end of the gas pipeline 33. The vortex tube 31 includes a fluid inlet 311, a high-temperature gas outlet 312, and a low-temperature gas outlet 313; wherein, the fluid inlet 311 is fluidly connected to the gas supply source 2 through the gas pipeline 33, and the low-temperature gas outlet 313 faces the boiling assistant 12. Accordingly, the low-temperature gas discharged from the low-temperature gas outlet 313 of the vortex tube 31 can effectively dissipate the heat of the immersion electronic device 1.

[0074] Furthermore, the working principle of the vortex tube 31 is based on the vortex effect. When the compressed air supplied by the gas supply source 2 enters the fluid inlet 311 of the vortex tube 31, the compressed air will rotate rapidly and be divided into two parts due to the conservation of angular momentum. Among them, a part of the air rotates along the periphery inside the vortex tube 31 and moves towards the high-temperature gas outlet 312 and gets heated; the other part of the air moves in the opposite direction along the center and gets cooled, and finally sprays out from the low-temperature gas outlet 313.

[0075] In some embodiments, when the gas supply source 2 supplies 6 to 8 bar of compressed air to the vortex tube 31, the low-temperature gas outlet 313 can generate a cold air jet with a temperature of -40°C to 10°C. It is worth mentioning that the vortex tube 31 has no moving parts, so its reliability is relatively high, almost no maintenance is required, no coolant is used, it has a small volume and low cost, does not consume consumables or use electricity, and there is no risk of spark or explosion. Just supply the compressed air to the fluid inlet 311 of the vortex tube 31, and the low-temperature gas outlet 313 can immediately generate a cold air jet.

[0076] Please refer to Figure 6 , which is a schematic diagram of an embodiment of the test equipment of the immersion electronic device 1 of the present invention. InFigure 6 In the illustrated embodiment, the gas supply source 2 may be an air flow generating device 21, including but not limited to an air compressor, a blower, a high-speed fan, or other devices capable of generating an air flow. In some embodiments, the air flow generating device 21 may be a high-speed fan gun and may be directly disposed on the housing 5; and the air flow outlet of the air flow generating device 21 may be attached to the fluid deflector 3, and then cooling gas may be ejected toward the boiling assisting member 12. Similarly, in the present embodiment, a nozzle 32 may also be disposed at one end of the fluid deflector 3 facing the boiling assisting member 12 to increase the gas flow rate and decrease the gas temperature.

[0077] Please refer to Figure 7A and Figure 7B , Figure 7A FIG. shows a perspective view of an embodiment of a test apparatus for an immersion electronic device 1 of the present invention. Figure 7B FIG. shows a cross-sectional view of an embodiment of a test apparatus for an immersion electronic device 1 of the present invention. In Figure 7A and Figure 7B In the illustrated embodiment, the housing 75 includes a main end face 51 and two side end faces 52, and the two side end faces 52 are respectively connected to two corresponding sides of the main end face 51. In some embodiments, the main end face 51 may be configured in a stepped shape, thus forming a plurality of air-containing spaces of different sizes. Among them, the housing 75 and the circuit board 11 of the immersion electronic device 1 jointly define a first air-containing space S1 and a second air-containing space S2, and the second air-containing space S2 is larger than the first air-containing space S1, and the air exchange unit 6 is disposed adjacent to the second air-containing space S2.

[0078] Furthermore, in some embodiments, the air exchange unit 6 may adopt an exhaust fan and may be disposed on the downstream side of the exhaust, and the exhausted gas refers to the cooling air flowing through the boiling assisting member 12. However, from the perspective of the size of the air-containing space, it should gradually increase from the upstream side to the downstream side, that is to say, the air-containing space close to the air exchange unit 6 should be larger so as to accommodate the gas discharged from the upstream side and thus avoid the occurrence of thermal crosstalk phenomenon. In order to achieve the change of the air-containing space, in some embodiments, the height h2 of the second air-containing space S2 may be greater than the height h1 of the first air-containing space S1, so the second air-containing space S2 has a larger space than the first air-containing space S1.

[0079] Please refer to Figure 8 , which shows a perspective view of a housing 85 of an embodiment of a test apparatus for an immersion electronic device 1 of the present invention. Figure 8The illustrated embodiment employs another type of housing 85, which includes a plurality of top plates 53 and a fixing frame 54. The plurality of top plates 53 are disposed on the fixing frame 54 and are spaced apart from each other by a specific distance D1, and the fluid guide member 3 is fixed to the plurality of top plates 53.

[0080] Further elaboration, the top plates 53 are arranged equidistantly on the fixing frame 54. The top plate 53 at the end of the fixing frame 54 is used to fix the ventilation unit 6, and the other top plates 53 are used to fix the fluid guide member 3. Moreover, the plurality of top plates 53 are spaced apart from each other by a specific distance D1, that is, there is a gap G left for the hot air to be discharged. In addition, the ventilation unit 6 can be an exhaust device or a blowing device. When it is an exhaust device, the hot air between the top plate 53 and the circuit board 11 of the immersion electronic device 1 (please see Figures 1 to 6 ) can be extracted; when it is a blowing device, the external room temperature gas can be blown into the space between the top plate 53 and the circuit board 11 of the immersion electronic device 1 (please see Figures 1 to 6 ), and then the hot air can be forcibly discharged from the gap G between the plurality of top plates 53.

[0081] Specifically, some embodiments of the present invention provide an air-cooling module CA and a test device dedicated to a two-phase immersion cooling system to solve the test challenges faced by the current two-phase immersion cooling system in the production stage, improve production efficiency, and shorten the product development and verification cycle. In some embodiments of the present invention, by designing a test device that can operate effectively in an air environment, the immersion electronic device 1 does not need to frequently enter and exit the liquid cooling tank for testing, thereby reducing the time for debugging and troubleshooting. At the same time, the problem of insufficient heat dissipation caused by the low thermal conductivity of air can be avoided, ensuring the normal operation of the immersion electronic device 1 in the atmospheric environment, and eliminating the process of disassembling and assembling the boiling aid 12 and the heat sink, reducing the risk of component damage and reduced system sealing. These improvements not only improve the efficiency of production testing, but also reduce the difficulty of troubleshooting, shorten the product development cycle, and thus improve the overall production efficiency.

[0082] Although the present invention has been disclosed as above with embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field to which the present invention pertains, without departing from the spirit and scope of the present invention, may make some modifications and refinements. Therefore, the protection scope of the present invention shall be determined by the scope defined in the patent application.

Claims

1. An air-cooling module for an immersion electronic device, characterized in that, The immersion electronic device includes a circuit board and a boiling assisting member, and the boiling assisting member is disposed on a heat source of the circuit board; The air cooling module includes: A gas supply source; and A fluid guide member fluidly connected to the gas supply source; Wherein, in response to the gas supply source supplying a cooling gas to the fluid guide member, the fluid guide member sprays the cooling gas toward the boiling assisting member.

2. The air-cooled module according to claim 1, wherein It further includes a phase change medium supply unit fluidly connected to the fluid guide member; the phase change medium supply unit is adapted to supply a phase change medium to the fluid guide member; wherein, the cooling gas is doped with the phase change medium.

3. The air-cooled module according to claim 2, wherein The phase change medium supply unit includes a fluid container and a regulating valve, the fluid container is used for containing the phase change medium and is fluidly connected to the fluid guide member; the regulating valve is disposed between the fluid container and the fluid guide member.

4. The air-cooled module according to claim 2, wherein The phase change medium is an electronic engineering liquid, its boiling point is between 0°C and 90°C, and its evaporation rate is above 10 ml / min.

5. The air-cooled module according to claim 1, characterized in that The fluid guide member includes a vortex tube, the vortex tube includes a fluid inlet, a high-temperature gas outlet and a low-temperature gas outlet; the fluid inlet is fluidly connected to the gas supply source, and the low-temperature gas outlet faces the boiling assisting member.

6. The air-cooled module according to claim 1, wherein The gas supply source includes an air flow generating device.

7. The air-cooled module according to claim 1, characterized in that The fluid guide member includes a nozzle, and an opening of the nozzle faces the boiling assisting member.

8. The air-cooled module according to claim 7, characterized in that, The heat source of the circuit board includes a chip; in response to the gas supply source supplying the cooling gas to the fluid guide member, the nozzle sprays the cooling gas toward a heating area of the boiling assisting member, and the heating area corresponds to the upper surface of the chip.

9. A test device for an immersion electronic device, characterized in that, The immersion electronic device includes a circuit board and a boiling assisting member, and the boiling assisting member is disposed on a heat source of the circuit board; the test equipment includes: A housing at least partially covering the immersion electronic device; A gas supply source; and A fluid guide member fluidly connected to the gas supply source and fixed to the housing; Wherein, in response to the gas supply source supplying a cooling gas to the fluid guide member, the fluid guide member sprays the cooling gas toward the boiling assisting member.

10. The testing device according to claim 9, characterized in that, It further includes a ventilation unit disposed in the housing and adapted to ventilate the interior of the housing.

11. The test device according to claim 10, wherein, The housing includes a main end face and two side end faces, the two side end faces are respectively connected to two corresponding sides of the main end face; the main end face is configured in a stepped shape, the housing and the circuit board of the immersion electronic device define a first air-containing space and a second air-containing space, the second air-containing space is larger than the first air-containing space, and the ventilation unit is disposed adjacent to the second air-containing space.

12. The testing device according to claim 11, characterized in that, The height of the second air-containing space is greater than the height of the first air-containing space.

13. The test device according to claim 9, wherein It further includes a phase change medium supply unit fluidly connected to the fluid guide member; the phase change medium supply unit is adapted to supply a phase change medium to the fluid guide member; wherein, the cooling gas is doped with the phase change medium.

14. The test device according to claim 13, characterized in that, It further includes a ventilation unit and a condensation recovery unit; the ventilation unit is disposed in the housing and adapted to ventilate the interior of the housing; the condensation recovery unit is disposed in the housing and adjacent to the ventilation unit, and the condensation recovery unit is adapted to condense the phase change medium into a liquid state.

15. The testing device according to claim 9, wherein The housing includes a plurality of top plates and a fixing frame. The plurality of top plates are disposed on the fixing frame and spaced apart from each other by a specific distance. The fluid deflector is fixed to one of the plurality of top plates.

16. The test device according to claim 9, characterized in that, The fluid deflector includes a vortex tube. The vortex tube includes a fluid inlet, a hot gas outlet, and a cold gas outlet. The fluid inlet is fluidly connected to the gas supply source, and the cold gas outlet faces the boiling assisting member.

17. The test device according to claim 9, characterized in that, The gas supply source includes a gas flow generating device adapted to supply the cooling gas to the fluid deflector.

18. The test device according to claim 9, characterized in that, The fluid deflector includes a nozzle. The heat source of the circuit board includes a wafer. In response to the gas supply source supplying the cooling gas to the fluid deflector, the nozzle sprays the cooling gas toward a heating area of the boiling assisting member, and the heating area corresponds to the upper surface of the wafer.

19. A test device for an immersion electronic device, characterized in that, Comprising: An immersion electronic device, including a circuit board and a boiling assisting member, the boiling assisting member being disposed on a heat source of the circuit board; A housing that at least partially covers the immersion electronic device; A gas supply source; and A fluid deflector fluidly connected to the gas supply source and fixed to the housing; wherein, in response to the gas supply source supplying a cooling gas to the fluid deflector, the fluid deflector sprays the cooling gas toward the boiling assisting member.

20. The testing device according to claim 19, characterized in that, Further comprising a phase change medium supply unit fluidly connected to the fluid deflector. The phase change medium supply unit is adapted to supply a phase change medium to the fluid deflector. Wherein, the cooling gas is doped with the phase change medium.

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