Boundary polishing device for silicon-based micro display processing

Abstract

The invention relates to the technical field of silicon-based micro-display processing, and discloses a boundary polishing device for silicon-based micro-display processing, which comprises a processing table, a through groove is formed in the top surface of the processing table, and a silicon-based micro-display body is arranged on the top surface of the processing table. Through the grinding mechanism, a second motor in a grinding part is utilized, the second motor drives a second lead screw, the second lead screw drives a T-shaped threaded block, the T-shaped threaded block drives a first air cylinder and a grinding machine body to integrally move to the boundary of the silicon-based micro-display body, the first air cylinder is started to descend to a proper position, and therefore the grinding machine body is utilized for grinding; the first motor drives the first lead screw, the first lead screw drives the first threaded block and the L-shaped plate, so that the L-shaped plate drives the grinding part to move integrally, the edge of the silicon-based micro-display body is ground while moving, the silicon-based micro-display body can be accurately moved to the position needing to be ground, errors are reduced, manual intervention is reduced, continuous operation can be achieved, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon-based microdisplay processing, and specifically relates to a boundary grinding device for silicon-based microdisplay processing. Background Art

[0002] With the development of technology, silicon-based microdisplays are increasingly widely used in fields such as augmented reality (AR) and virtual reality (VR). These displays have characteristics such as small volume, high resolution, and strong brightness, and have extremely high requirements for processing accuracy and surface quality. The boundary quality of silicon-based microdisplays directly affects their overall performance and appearance. Therefore, boundary grinding is a key link in the processing process. Compared with the prior art; currently, some grinding devices perform poorly in terms of position movement accuracy and simply cannot accurately move to the position that needs to be ground, which directly leads to a significant increase in processing errors, seriously affecting the processing quality and thus reducing work efficiency.

[0003] Therefore, a boundary grinding device for silicon-based microdisplay processing is proposed. Summary of the Invention

[0004] The purpose of the present invention is to provide a boundary grinding device for silicon-based microdisplay processing, which solves the technical problem of being unable to accurately move to the position that needs to be ground and achieves the purpose of precise grinding.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A boundary grinding device for silicon-based microdisplay processing, including a processing table, a through groove is provided on the top surface of the processing table, a silicon-based microdisplay body is provided on the top surface of the processing table, a grinding mechanism, a clamping mechanism, and a protection mechanism are provided on the top surface of the processing table, and a dust suction mechanism is provided on the rear side surface of the processing table; The grinding mechanism includes a moving part and a grinding part; The grinding part is located on the top surface of the moving part; The clamping mechanism includes a clamping part and a rotating part; The rotating part is located below the clamping part; The dust suction mechanism includes a dust suction part and a collection part; The collection part is located on the bottom surface of the dust suction part; The protection mechanism includes a driving part and a protection part; The protection part is located on the front side surface of the driving part.

[0006] Preferably, the moving part includes a U-shaped fixing plate I, which is located on the rear side of the processing table and fixedly connected to the processing table. A motor I is arranged on the inner side of the U-shaped fixing plate I and fixedly connected to the U-shaped fixing plate I. A lead screw I is arranged on the output end face of the motor I and fixedly connected to the motor I. The lead screw I penetrates and extends to the inner side of the through groove and is in threaded connection with the inner wall of the processing table. The front end face of the lead screw I is rotationally connected to the inner side of the through groove through a bearing block I. A threaded block I is sleeved on the surface of the lead screw I and is in threaded connection with the lead screw I. An L-shaped plate is arranged on the top surface of the threaded block I and fixedly connected to the threaded block I. A placement groove is formed on the top surface of the L-shaped plate.

[0007] Preferably, the grinding part includes a U-shaped fixing plate II, which is fixedly connected to the left side surface of the L-shaped plate. A motor II is arranged on the inner side of the U-shaped fixing plate II and fixedly connected to the U-shaped fixing plate II. A lead screw II is arranged on the output end face of the motor II and fixedly connected to the motor II. The lead screw II penetrates and extends to the inner side of the placement groove and is in threaded connection with the inner wall of the L-shaped plate. The right end face of the lead screw II is rotationally connected to the inner side of the placement groove through a bearing block II. A T-shaped threaded block is sleeved on the surface of the lead screw II and is in threaded connection with the lead screw II. A cylinder I is arranged on the bottom surface of the T-shaped threaded block and fixedly connected to the T-shaped threaded block. A grinding machine body is arranged on the output end face of the cylinder I and fixedly connected to the cylinder I. Through the moving part and the grinding part in the grinding mechanism, an accurate grinding effect can be achieved.

[0008] Preferably, the clamping part includes a support plate, which is fixedly connected to the processing table. A cylinder II penetrates through the inner wall of the support plate. A bottom plate is arranged on the output end face of the cylinder II and fixedly connected to the cylinder II. A clamping plate is arranged on the bottom surface of the bottom plate and is rotationally connected to the bottom plate. A silica gel pad is arranged on the bottom surface of the clamping plate, and the upper silica gel pad is fixedly connected to the clamping plate.

[0009] Preferably, the rotating part includes a turntable, the top surface of which is fixedly connected to the lower silica gel pad. A rotating rod is arranged on the bottom end face of the turntable and fixedly connected to the turntable. The rotating rod penetrates and extends below the processing table, and the surface of the rotating rod is rotationally connected to the inner wall of the processing table through a bearing block III. A motor III is arranged on the bottom end face of the rotating rod and fixedly connected to the rotating rod. A fixing plate is arranged on the outer side of the motor III and fixedly connected to the processing table. Through the clamping part and the rotating part in the clamping mechanism, a clamping and rotating effect can be achieved.

[0010] Preferably, the dust suction part includes a dust suction hood, a branch pipe is connected to the rear end face of the dust suction hood, a blower is connected to the bottom end face of the branch pipe, an L-shaped support frame is arranged on the front side face of the blower, the L-shaped support frame is movably connected to the blower, and the L-shaped support frame is fixedly connected to the processing table.

[0011] Preferably, the collection part includes a connecting pipe, the connecting pipe is communicated with the blower, a dust inlet box is connected to the bottom end face of the connecting pipe, a collection box is arranged on the inner side face of the dust inlet box, and the collection box is slidably connected to the dust inlet box. Through the dust suction part and the collection part in the dust suction mechanism, the dust suction effect is achieved.

[0012] Preferably, the driving part includes a protective cover, the protective cover is fixedly connected to the processing table, a branch pipe is arranged on the inner wall of the protective cover, installation grooves are formed in the front side faces of the protective cover, a portal plate is arranged on the top face of the protective cover, the portal plate is fixedly connected to the protective cover, and a fourth motor is arranged on the inner side face of the portal plate, and the fourth motor is fixedly connected to the portal plate.

[0013] Preferably, the protection part includes a third lead screw, the third lead screw is fixedly connected to the output end face of the fourth motor, the third lead screw penetrates through and extends to the inner side face of the installation groove, the third lead screw is in threaded connection with the inner wall of the protective cover, the bottom end face of the third lead screw is rotationally connected to the top face of the processing table through a fourth bearing seat, a second threaded block is sleeved on the surface of the third lead screw, the second threaded block is in threaded connection with the third lead screw, a visual door and window is arranged on the front side face of the second threaded block, and the visual door and window is fixedly connected to the second threaded block. Through the driving part and the protection part in the protection mechanism, the protection effect is achieved.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: for this boundary grinding device for silicon-based microdisplay processing, (1) Through the grinding mechanism, by using the second motor in the grinding part, the second motor drives the second lead screw, the second lead screw drives the T-shaped threaded block, so that the T-shaped threaded block drives the whole of the first cylinder and the grinding machine body to move to the boundary of the silicon-based microdisplay body, and then the first cylinder is started to descend to a proper position, and then the grinding machine body is used for grinding. During grinding, the first motor is started, the first motor drives the first lead screw, the first lead screw drives the first threaded block and the L-shaped plate, so that the L-shaped plate drives the whole grinding part to move, and thus the edge of the silicon-based microdisplay body is ground while moving, which can accurately move to the position to be ground, reduce errors, reduce manual intervention, and can perform continuous operation, thereby improving production efficiency; (2) Through the clamping mechanism, the turntable in the rotating part is used to place the silicon-based micro display body on the turntable, and the cylinder 2 is started. The cylinder 2 drives the bottom plate and the clamping plate to descend, so that the clamping plate fixes the silicon-based micro display body, so as to grind one side of the edge. After grinding, the motor 3 is started, and the motor 3 drives the rotating rod, and the rotating rod drives the turntable, and the silicon-based micro display body and the clamping plate to rotate accordingly, so as to convert the other side edge, thereby realizing the flip grinding of the edge of the silicon-based micro display body, thereby improving production efficiency; (3) Through the dust suction mechanism, the fan in the dust suction unit is used. The fan is started to suck the polishing area through the branch pipe and the dust hood. After suction, the dust enters the dust inlet box through the dust hood, branch pipe, fan, and connecting pipe and falls into the collection box for collection, thereby preventing the dust from affecting the silicon-based microdisplay body and the environment; (4) Through the protection mechanism, the motor 4 in the driving part is used to start the motor 4, the motor 4 drives the screw rod 3, the screw rod 3 drives the thread block 2, and the thread block 2 drives the visual door and window to rise and fall, thereby providing protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front perspective schematic diagram of the structure of the present invention; Figure 2 It is a three-dimensional schematic diagram of the structure of the present invention; Figure 3 It is a three-dimensional schematic diagram of the grinding structure of the present invention; Figure 4 It is a three-dimensional schematic diagram of the clamping structure of the present invention; Figure 5 It is a three-dimensional schematic diagram of the dust collection structure of the present invention; Figure 6 It is a three-dimensional schematic diagram of the protective structure of the present invention.

[0016] In the figure: 1 processing table, 2 silicon-based micro display body, 3 grinding mechanism, 31 moving part, 32 grinding part, 311 U-type fixed plate 1, 312 motor 1, 313 screw rod 1, 314 thread block 1, 315 L-type plate, 321 U-type fixed plate 2, 322 motor 2, 323 screw rod 2, 324 T-type thread block, 325 cylinder 1, 326 grinding machine body, 4 clamping mechanism, 41 clamping part, 42 rotating part, 411 support plate, 412 cylinder 2, 413 bottom plate, 414 clamp Holding plate, 415 silicone pad, 421 turntable, 422 rotating rod, 423 motor three, 424 fixed plate, 5 dust suction mechanism, 51 dust suction unit, 52 collecting unit, 511 dust hood, 512 branch pipe, 513 fan, 514 L-type support frame, 521 connecting pipe, 522 dust inlet box, 523 collecting box, 6 protection mechanism, 61 driving unit, 62 protection unit, 611 protection hood, 612 door plate, 613 motor four, 621 screw rod three, 622 thread block two, 623 visible doors and windows. Detailed implementation manners

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0018] Based on the existing problem that it is impossible to accurately move to the position that needs to be polished, please refer to Figures 1 - 3 , the present invention provides a technical solution: a boundary polishing device for silicon-based microdisplay processing, including a processing table 1, a through groove is opened on the top surface of the processing table 1, a silicon-based microdisplay body 2 is arranged on the top surface of the processing table 1, a polishing mechanism 3, a clamping mechanism 4 and a protection mechanism 6 are arranged on the top surface of the processing table 1, and a dust suction mechanism 5 is arranged on the rear side surface of the processing table 1; The polishing mechanism 3 includes a moving part 31 and a polishing part 32; The polishing part 32 is located on the top surface of the moving part 31; The clamping mechanism 4 includes a clamping part 41 and a rotating part 42; The rotating part 42 is located below the clamping part 41; The dust suction mechanism 5 includes a dust suction part 51 and a collection part 52; The collection part 52 is located on the bottom surface of the dust suction part 51; The protection mechanism 6 includes a driving part 61 and a protection part 62; The protection part 62 is located on the front side surface of the driving part 61.

[0019] The moving part 31 includes a U-shaped fixing plate one 311, the U-shaped fixing plate one 311 is located on the rear side surface of the processing table 1, the U-shaped fixing plate one 311 is fixedly connected to the processing table 1, a motor one 312 is arranged on the inner side surface of the U-shaped fixing plate one 311, the motor one 312 is fixedly connected to the U-shaped fixing plate one 311, a lead screw one 313 is arranged on the output end surface of the motor one 312, the lead screw one 313 is fixedly connected to the motor one 312, the lead screw one 313 penetrates and extends to the inner side surface of the through groove, the lead screw one 313 is threadedly connected to the inner wall of the processing table 1, the front end surface of the lead screw one 313 is rotationally connected to the inner side surface of the through groove through a bearing seat one, a threaded block one 314 is sleeved on the surface of the lead screw one 314, the threaded block one 314 is threadedly connected to the lead screw one 313, an L-shaped plate 315 is arranged on the top surface of the threaded block one 314, the L-shaped plate 315 is fixedly connected to the threaded block one 314, and a placement groove is opened on the top surface of the L-shaped plate 315.

[0020] The grinding part 32 includes a U-shaped fixing plate II 321. The U-shaped fixing plate II 321 is fixedly connected to the left side surface of the L-shaped plate 315. An electric motor II 322 is arranged on the inner side surface of the U-shaped fixing plate II 321, and the electric motor II 322 is fixedly connected to the U-shaped fixing plate II 321. A lead screw II 323 is arranged on the output end surface of the electric motor II 322, and the lead screw II 323 is fixedly connected to the electric motor II 322. The lead screw II 323 penetrates and extends to the inner side surface of the placement groove, and the lead screw II 323 is in threaded connection with the inner wall of the L-shaped plate 315. The right end surface of the lead screw II 323 is rotationally connected to the inner side surface of the placement groove through a bearing block II. A T-shaped threaded block 324 is sleeved on the surface of the lead screw II 323, and the T-shaped threaded block 324 is in threaded connection with the lead screw II 323. A cylinder I 325 is arranged on the bottom surface of the T-shaped threaded block 324, and the cylinder I 325 is fixedly connected to the T-shaped threaded block 324. A grinding machine body 326 is arranged on the output end surface of the cylinder I 325, and the grinding machine body 326 is fixedly connected to the cylinder I 325.

[0021] Further, in this embodiment, through the grinding mechanism 3, by using the electric motor II 322 in the grinding part 32, when the electric motor II 322 is started, it drives the lead screw II 323 to rotate. The lead screw II 323 drives the T-shaped threaded block 324 to move along the linear guide through threaded cooperation. The T-shaped threaded block 324 synchronously drives the cylinder I 325 and the grinding machine body 326 as a whole to move to the boundary of the silicon-based microdisplay body 2. Then the cylinder I 325 is started to push the grinding machine body 326 to descend to a preset height, and the grinding machine body 326 works to preliminarily grind the boundary of the silicon-based microdisplay body 2. At the same time, the electric motor I 312 is started to drive the lead screw I 313 to rotate. The lead screw I 313 drives the threaded block I 314 to move along the linear guide through threaded transmission. The threaded block I 314 synchronously drives the grinding part 32 as a whole to move horizontally. The grinding machine body 326 continuously grinds the boundary during the movement. Further, in this embodiment, through the grinding mechanism 3, by using the electric motor II 322 in the grinding part 32, the electric motor II 322 drives the lead screw II 323, and the lead screw II 323 drives the T-shaped threaded block 324, so that the T-shaped threaded block 324 drives the cylinder I 325 and the grinding machine body 326 as a whole to move to the boundary of the silicon-based microdisplay body 2. Then the cylinder I 325 is started to descend to a suitable position, and the grinding machine body 326 is used for grinding. During the grinding, the electric motor I 312 is started. The electric motor I 312 drives the lead screw I 313, and the lead screw I 313 drives the threaded block I 314 and the L-shaped plate 315, so that the L-shaped plate 315 drives the grinding part 32 as a whole to move, and thus the edge of the silicon-based microdisplay body 2 is ground while moving, which can accurately move to the position to be ground, reduce errors, reduce manual intervention, and can operate continuously to improve production efficiency. Embodiment

[0022] Please refer to Figure 1 、 Figure 2 、 Figure 4, and on the basis of the first embodiment, it is further obtained that the clamping part 41 includes a support plate 411, the support plate 411 is fixedly connected to the processing table 1, a cylinder two 412 is arranged through the inner wall of the support plate 411, a bottom plate 413 is arranged on the output end surface of the cylinder two 412, the bottom plate 413 is fixedly connected to the cylinder two 412, a clamping plate 414 is arranged on the bottom surface of the bottom plate 413, the clamping plate 414 is rotatably connected to the bottom plate 413, a silica gel pad 415 is arranged on the bottom surface of the clamping plate 414, and the upper silica gel pad 415 is fixedly connected to the clamping plate 414.

[0023] The rotating part 42 includes a turntable 421, the top surface of the turntable 421 is fixedly connected to the lower silica gel pad 415, a rotating rod 422 is arranged on the bottom end surface of the turntable 421, the rotating rod 422 is fixedly connected to the turntable 421, the rotating rod 422 extends through and reaches below the processing table 1, the surface of the rotating rod 422 is rotatably connected to the inner wall of the processing table 1 through a bearing seat three, a motor three 423 is arranged on the bottom end surface of the rotating rod 422, the motor three 423 is fixedly connected to the rotating rod 422, and a fixing plate 424 is arranged on the outer side surface of the motor three 423, and the fixing plate 424 is fixedly connected to the processing table 1.

[0024] Furthermore, in this embodiment, through the clamping mechanism 4, by using the turntable 421 in the rotating part 42, the silicon-based microdisplay body 2 is placed on the turntable 421, the cylinder two 412 is started, the cylinder two 412 pushes the bottom plate 413 and the clamping plate 414 to move downward, the clamping plate 414 contacts and presses the silicon-based microdisplay body 2 to complete preliminary fixation, the single-side edge of the fixed silicon-based microdisplay body 2 is polished. After polishing, the motor three 423 is started, the motor three 423 drives the rotating rod 422 to rotate, the rotating rod 422 drives the turntable 421 and the silicon-based microdisplay body 2 to rotate synchronously, and the clamping plate 414 rotates synchronously with the turntable 421 to keep the workpiece in a fixed state, and then the other side edge of the flipped silicon-based microdisplay body 2 is polished; Furthermore, in this embodiment, through the clamping mechanism 4, by using the turntable 421 in the rotating part 42, the silicon-based microdisplay body 2 is placed on the turntable 421, the cylinder two 412 is started, the cylinder two 412 drives the bottom plate 413 and the clamping plate 414 to descend, so that the clamping plate 414 fixes the silicon-based microdisplay body 2, and then one side edge is polished. After polishing, the motor three 423 is started, the motor three 423 drives the rotating rod 422, the rotating rod 422 drives the turntable 421, and the silicon-based microdisplay body 2 and the clamping plate 414 rotate correspondingly, so as to switch to the other side edge, thereby realizing the edge flipping and polishing of the silicon-based microdisplay body 2 and improving the production efficiency; Embodiment

[0025] Please refer to Figure 1 , Figure 2 , Figure 5, and on the basis of Embodiment 1 and Embodiment 2, it is further obtained that: the dust suction part 51 includes a dust suction cover 511, a branch pipe 512 is connected to the rear end face of the dust suction cover 511, a fan 513 is connected to the bottom end face of the branch pipe 512, an L-shaped support frame 514 is arranged on the front side face of the fan 513, the L-shaped support frame 514 is movably connected to the fan 513, and the L-shaped support frame 514 is fixedly connected to the processing table 1.

[0026] The collection part 52 includes a connecting pipe 521, the connecting pipe 521 is communicated with the fan 513, a dust inlet box 522 is connected to the bottom end face of the connecting pipe 521, a collection box 523 is arranged on the inner side face of the dust inlet box 522, and the collection box 523 is slidably connected to the dust inlet box 522.

[0027] Furthermore, in this embodiment, through the dust suction mechanism 5, by using the fan 513 in the dust suction part 51, the fan 513 forms a local negative pressure area through the branch pipe 512 and the dust suction cover 511. The dust in the polishing area enters the branch pipe 512 through the dust suction cover 511 along with the air flow. The dust sequentially passes through the branch pipe 512, the fan 513, and the connecting pipe 521 and enters the connecting pipe 521 along with the air flow. Finally, the dust settles due to gravity in the dust inlet box 522. Furthermore, in this embodiment, through the dust suction mechanism 5, by using the fan 513 in the dust suction part 51, the fan 513 starts to suck the polishing area through the branch pipe 512 and the dust suction cover 511. After suction, it enters the dust inlet box 522 through the dust suction cover 511, the branch pipe 512, the fan 513, and the connecting pipe 521 and falls into the collection box 523 for collection, thereby avoiding the impact of dust on the silicon-based microdisplay body 2 and the environment. Embodiment

[0028] Please refer to Figure 1 , Figure 2 , Figure 6 , and on the basis of Embodiment 1, Embodiment 2, and Embodiment 3, it is further obtained that: the driving part 61 includes a protective cover 611, the protective cover 611 is fixedly connected to the processing table 1, a branch pipe 512 is arranged on the inner wall of the protective cover 611, installation grooves are formed on the front side faces of the protective cover 611, a portal plate 612 is arranged on the top face of the protective cover 611, the portal plate 612 is fixedly connected to the protective cover 611, and a fourth motor 613 is arranged on the inner side face of the portal plate 612, and the fourth motor 613 is fixedly connected to the portal plate 612.

[0029] The protective part 62 includes a third lead screw 621. The third lead screw 621 is fixedly connected to the output end face of the fourth motor 613. The third lead screw 621 penetrates and extends to the inner side of the installation groove. The third lead screw 621 is threadedly connected to the inner wall of the protective cover 611. The bottom end face of the third lead screw 621 is rotationally connected to the top surface of the processing table 1 through a fourth bearing block. Threaded blocks two 622 are sleeved on the surface of the third lead screw 621. The threaded blocks two 622 are threadedly connected to the third lead screw 621. A visible window 623 is arranged on the front side of the threaded block two 622. The visible window 623 is fixedly connected to the threaded block two 622.

[0030] Furthermore, in this embodiment, through the protection mechanism 6, by using the fourth motor 613 in the driving part 61, the fourth motor 613 is started. The fourth motor 613 drives the third lead screw 621 to rotate synchronously. The rotation of the third lead screw 621 drives the threaded block two 622 to move linearly along the guide rail through thread engagement. The threaded block two 622 drives the visible window 623 to rise synchronously until the upper limit is fully opened. When the fourth motor 613 rotates in reverse, the third lead screw 621 drives the threaded block two 622 to move downward. The threaded block two 622 drives the visible window 623 to descend synchronously until the lower limit is fully closed. Furthermore, in this embodiment, through the protection mechanism 6, by using the fourth motor 613 in the driving part 61, the fourth motor 613 is started. The fourth motor 613 drives the third lead screw 621. The third lead screw 621 drives the threaded block two 622. The threaded block two 622 drives the visible window 623 to rise and fall, thereby providing protection.

[0031] During use, through the protection mechanism 6, the fourth motor 613 in the driving part 61 is used to start the fourth motor 613. The fourth motor 613 drives the third lead screw 621 to rotate synchronously. The rotation of the third lead screw 621 drives the second threaded block 622 to move linearly along the guide rail through screw thread cooperation. The second threaded block 622 drives the visible door and window 623 to rise synchronously until the upper limit position is fully opened. After opening, through the clamping mechanism 4, the silicon-based microdisplay body 2 is placed on the turntable 421 by using the turntable 421 in the rotating part 42. The second cylinder 412 is started, and the second cylinder 412 pushes the bottom plate 413 and the clamping plate 414 to move downward. The clamping plate 414 contacts and presses the silicon-based microdisplay body 2 to complete the preliminary fixation. Then, the fourth motor 613 rotates reversely, and the third lead screw 621 drives the second threaded block 622 to move downward. The second threaded block 622 drives the visible door and window 623 to descend synchronously until the lower limit position is fully closed. After closing, through the grinding mechanism 3, the second motor 322 in the grinding part 32 is used to start the second motor 322 to drive the second lead screw 323 to rotate. The second lead screw 323 drives the T-shaped threaded block 324 to move along the linear guide rail through screw thread cooperation. The T-shaped threaded block 324 synchronously drives the first cylinder 325 and the grinding machine body 326 to move integrally to the boundary of the silicon-based microdisplay body 2. Then, the first cylinder 325 is started to push the grinding machine body 326 to descend to a preset height. The grinding machine body 326 works to perform preliminary grinding on the boundary of the silicon-based microdisplay body 2. At the same time, the first motor 312 is started to drive the first lead screw 313 to rotate. The first lead screw 313 drives the first threaded block 314 to move along the linear guide rail through screw thread cooperation. The first threaded block 314 synchronously drives the whole grinding part 32 to move horizontally. The grinding machine body 326 continuously grinds the boundary during the movement. At the same time, through the dust suction mechanism 5, the fan 513 in the dust suction part 51 is used. The fan 513 forms a local negative pressure area through the branch pipe 512 and the dust suction hood 511. The dust in the grinding area enters the branch pipe 512 through the dust suction hood 511 along with the air flow. The dust passes through the branch pipe 512, the fan 513, and the connecting pipe 521 in sequence and enters the connecting pipe 521. Finally, the dust settles due to gravity in the dust inlet box 522. After one side is ground, the second lead screw 323 is driven to rotate in the reverse direction, so that the rotation of the second lead screw 323 drives the T-shaped threaded block 324, the first cylinder 325, and the grinding machine body 326 to reset integrally. Then, the third motor 423 is started, and the third motor 423 drives the rotating rod 422 to rotate. The rotating rod 422 drives the turntable 421 and the silicon-based microdisplay body 2 to rotate synchronously. The clamping plate 414 rotates synchronously with the turntable 421 to keep the workpiece in a fixed state. Then, the other side edge of the flipped silicon-based microdisplay body 2 is ground.

[0032] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to the embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A boundary grinding device for silicon-based microdisplay processing, comprising a processing table (1), characterized in that: A through groove is formed in the top surface of the processing table (1). A silicon-based microdisplay body (2) is arranged on the top surface of the processing table (1). A grinding mechanism (3), a clamping mechanism (4), and a protection mechanism (6) are arranged on the top surface of the processing table (1). A dust suction mechanism (5) is arranged on the rear side surface of the processing table (1). The grinding mechanism (3) includes a moving part (31) and a grinding part (32). The grinding part (32) is located on the top surface of the moving part (31). The clamping mechanism (4) includes a clamping part (41) and a rotating part (42). The rotating part (42) is located below the clamping part (41). The dust suction mechanism (5) includes a dust suction part (51) and a collection part (52). The collection part (52) is located on the bottom surface of the dust suction part (51). The protection mechanism (6) includes a driving part (61) and a protection part (62). The protection part (62) is located on the front side surface of the driving part (61).

2. The boundary grinding device for processing a silicon-based microdisplay according to claim 1, characterized in that: The moving part (31) includes a U-shaped fixing plate one (311). The U-shaped fixing plate one (311) is located on the rear side surface of the processing table (1). The U-shaped fixing plate one (311) is fixedly connected to the processing table (1). A motor one (312) is arranged on the inner side surface of the U-shaped fixing plate one (311). The motor one (312) is fixedly connected to the U-shaped fixing plate one (311). A lead screw one (313) is arranged on the output end surface of the motor one (312). The lead screw one (313) is fixedly connected to the motor one (312). The lead screw one (313) penetrates and extends to the inner side surface of the through groove. The lead screw one (313) is in threaded connection with the inner wall of the processing table (1). The front end surface of the lead screw one (313) is rotationally connected to the inner side surface of the through groove through a bearing seat one. A threaded block one (314) is sleeved on the surface of the lead screw one (313). The threaded block one (314) is in threaded connection with the lead screw one (313). An L-shaped plate (315) is arranged on the top surface of the threaded block one (314). The L-shaped plate (315) is fixedly connected to the threaded block one (314). A placement groove is formed in the top surface of the L-shaped plate (315).

3. The boundary grinding device for silicon-based microdisplay processing according to claim 2, wherein: The grinding part (32) includes a U-shaped fixing plate II (321). The U-shaped fixing plate II (321) is fixedly connected to the left side surface of the L-shaped plate (315). An electric motor II (322) is arranged on the inner side surface of the U-shaped fixing plate II (321), and the electric motor II (322) is fixedly connected to the U-shaped fixing plate II (321). A lead screw II (323) is arranged on the output end surface of the electric motor II (322), and the lead screw II (323) is fixedly connected to the electric motor II (322). The lead screw II (323) penetrates and extends to the inner side surface of the placement groove, and the lead screw II (323) is in threaded connection with the inner wall of the L-shaped plate (315). The right end surface of the lead screw II (323) is rotationally connected to the inner side surface of the placement groove through a bearing seat II. A T-shaped threaded block (324) is sleeved on the surface of the lead screw II (323), and the T-shaped threaded block (324) is in threaded connection with the lead screw II (323). A cylinder I (325) is arranged on the bottom surface of the T-shaped threaded block (324), and the cylinder I (325) is fixedly connected to the T-shaped threaded block (324). A grinding machine body (326) is arranged on the output end surface of the cylinder I (325), and the grinding machine body (326) is fixedly connected to the cylinder I (325).

4. A boundary grinding device for processing a silicon-based microdisplay according to claim 1, characterized in that: The clamping part (41) includes a support plate (411). The support plate (411) is fixedly connected to the processing table (1). A cylinder II (412) penetrates through the inner wall of the support plate (411). A bottom plate (413) is arranged on the output end surface of the cylinder II (412), and the bottom plate (413) is fixedly connected to the cylinder II (412). A clamping plate (414) is arranged on the bottom surface of the bottom plate (413), and the clamping plate (414) is rotationally connected to the bottom plate (413). A silica gel pad (415) is arranged on the bottom surface of the clamping plate (414), and the upper silica gel pad (415) is fixedly connected to the clamping plate (414).

5. A boundary grinding device for processing a silicon-based microdisplay according to claim 4, characterized in that: The rotating part (42) includes a turntable (421). The top surface of the turntable (421) is fixedly connected to the lower silica gel pad (415). A rotating rod (422) is arranged on the bottom end surface of the turntable (421), and the rotating rod (422) is fixedly connected to the turntable (421). The rotating rod (422) penetrates and extends below the processing table (1), and the surface of the rotating rod (422) is rotationally connected to the inner wall of the processing table (1) through a bearing seat III. A motor III (423) is arranged on the bottom end surface of the rotating rod (422), and the motor III (423) is fixedly connected to the rotating rod (422). A fixing plate (424) is arranged on the outer side surface of the motor III (423), and the fixing plate (424) is fixedly connected to the processing table (1).

6. The edge grinding device for processing a silicon-based microdisplay according to claim 1, wherein: The dust suction part (51) includes a dust suction hood (511). A branch pipe (512) is communicated with the rear end surface of the dust suction hood (511). A blower (513) is communicated with the bottom end surface of the branch pipe (512). An L-shaped support frame (514) is arranged on the front side surface of the blower (513), and the L-shaped support frame (514) is movably connected to the blower (513). The L-shaped support frame (514) is fixedly connected to the processing table (1).

7. A boundary grinding device for processing a silicon-based microdisplay according to claim 6, characterized in that: The collection part (52) includes a connecting pipe (521), the connecting pipe (521) is communicated with the fan (513), a dust inlet box (522) is communicated and arranged at the bottom end surface of the connecting pipe (521), a collection box (523) is arranged on the inner side surface of the dust inlet box (522), and the collection box (523) is slidably connected with the dust inlet box (522).

8. A boundary grinding device for silicon-based microdisplay processing according to claim 1, characterized in that: The driving part (61) includes a protective cover (611), the protective cover (611) is fixedly connected with the processing table (1), a branch pipe (512) is arranged on the inner wall of the protective cover (611), mounting grooves are formed in the front side surfaces of the protective cover (611), a portal plate (612) is arranged on the top surface of the protective cover (611), the portal plate (612) is fixedly connected with the protective cover (611), a fourth motor (613) is arranged on the inner side surface of the portal plate (612), and the fourth motor (613) is fixedly connected with the portal plate (612).

9. A boundary grinding device for processing a silicon-based microdisplay according to claim 8, characterized in that: The protection part (62) includes a third lead screw (621), the third lead screw (621) is fixedly connected with the output end surface of the fourth motor (613), the third lead screw (621) penetrates and extends to the inner side surface of the mounting groove, the third lead screw (621) is in threaded connection with the inner wall of the protective cover (611), the bottom end surface of the third lead screw (621) is rotationally connected with the top surface of the processing table (1) through a fourth bearing seat, a second threaded block (622) is sleeved on the surface of the third lead screw (621), the second threaded block (622) is in threaded connection with the third lead screw (621), a visual door and window (623) is arranged on the front side surface of the second threaded block (622), and the visual door and window (623) is fixedly connected with the second threaded block (622).

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