Bearing tool for superconducting material deposition and deposition equipment

Abstract

The invention relates to the field of quantum chip processing, and discloses a bearing tool for superconducting material deposition and deposition equipment, the bearing tool comprises a multi-layer tray structure for supporting a substrate to be deposited and a supporting framework for supporting and connecting each tray structure; wherein all the layers of tray structures are parallel to one another, and each tray structure is of a hollow structure used for supporting the edge part of a substrate to be deposited in a contact mode; the supporting framework comprises at least three supporting stand columns which are arranged in parallel, and the supporting stand columns are perpendicular to the tray structures. According to the bearing tool provided by the invention, deposition and filling of the low-temperature superconducting materials in the through holes can be synchronously carried out on a plurality of substrates, and through hole filling and deposition can be simultaneously carried out on the front surface and the back surface of each substrate, so that the efficiency of depositing and filling the low-temperature superconducting materials in the through holes in the substrates is improved to a great extent.

Description

Technical Field

[0001] The present invention relates to the field of quantum chip processing, and in particular to a carrier tool for superconducting material deposition and a deposition device. Background Art

[0002] With the development of cryogenic superconducting path quantum computers and the gradual increase in the number of qubits, the traditional two-dimensional wiring structure has become increasingly difficult to meet the qubit layout requirements. The superconducting connection technology combining flip-chip bonding and through-silicon via (TSV) technology is one of the reliable paths for future cryogenic superconducting quantum chips to achieve a three-dimensional architecture. TSV refers to the processing of micro-vias on a silicon wafer, filling the vias with cryogenic superconducting materials, and realizing the superconducting signal path between quantum chips through TSV. TSV saves the space occupied by external superconducting materials, enables the closest connection and three-dimensional structure between quantum chips, reduces the interconnection length between quantum chips, improves the conduction efficiency of signals between chips, and thus improves the operating speed of quantum computers.

[0003] However, in the process of filling cryogenic superconducting materials into the vias on the substrate, due to the different ratios of the TSV aperture to depth involved, it is sometimes difficult to achieve good uniform coverage of the superconducting materials in the vias. Atomic layer deposition can achieve a thin film deposition technology with controllable atomic thickness, which has the characteristics of surface self-limiting saturation, three-dimensional conformal, large-area uniformity, and low-temperature growth, and is especially applied to the filling of high aspect ratio structures. However, the working efficiency of filling cryogenic superconducting materials into the vias on the substrate using atomic deposition technology still needs to be improved. Summary of the Invention

[0004] The purpose of the present invention is to provide a carrier tool for superconducting material deposition and a deposition device, which can improve the working efficiency of depositing and filling cryogenic superconducting materials into the vias on the substrate to a certain extent.

[0005] To solve the above technical problems, the present invention provides a carrier tool for superconducting material deposition, including:

[0006] A multi-layer tray structure for supporting the substrate to be deposited and a support structure for supporting and connecting each of the tray structures;

[0007] Wherein, each layer of the tray structure is parallel to each other, and each tray structure is a hollow structure for contact-supporting the edge portion of the substrate to be deposited; the support structure includes at least three mutually parallel support columns, and each of the support columns and each of the tray structures are perpendicular to each other.

[0008] In an optional embodiment of the present application, each of the tray structures is an annular tray with a notch.

[0009] In an alternative embodiment of the present application, the tray structure is an annular tray; the number of the support columns is three;

[0010] Wherein, two of the support columns are respectively located at both ends of the first diameter of the annular tray, one of the support columns and the notch are respectively located at both ends of the second diameter of the annular tray, and the first diameter and the second diameter are perpendicular to each other.

[0011] In an alternative embodiment of the present application, the inner ring surface of the tray structure is a stepped surface, and a plurality of spherical protrusions for supporting the substrate to be deposited are arranged on the stepped surface.

[0012] In an alternative embodiment of the present application, the distance between adjacent two tray structures is adjustable along the length direction of the support column.

[0013] In an alternative embodiment of the present application, a main slideway extending along the length direction of the support column is arranged on the support column, branch slideways perpendicular to the main slideway and arranged parallel to each other in sequence along the length direction of the main slideway, and hooks with sliders are provided;

[0014] Wherein, the slider can slide in the main slideway and the branch slideways; each of the hooks is used for hooking the tray structure.

[0015] In an alternative embodiment of the present application, a plurality of air-permeable through holes are arranged on each of the support columns in sequence along the length direction of the support column.

[0016] In an alternative embodiment of the present application, each support column includes a plurality of column segments; the column segments are detachably spliced and connected in sequence.

[0017] A deposition device for superconducting material deposition includes a carrier tool for superconducting material deposition as described in any one of the above; and a deposition chamber for accommodating the carrier tool; an air outlet channel and at least one air inlet channel are arranged on the deposition chamber.

[0018] A carrier tool for superconducting material deposition and a deposition device for superconducting material deposition provided by the present invention, the carrier tool for superconducting material deposition includes: a multi-layer tray structure for supporting the substrate to be deposited and a support structure for supporting and connecting each tray structure; wherein, each layer of tray structure is parallel to each other, and each tray structure is a hollow structure for contacting and supporting the edge part of the substrate to be deposited; the support structure includes at least three support columns arranged parallel to each other, and each support column and each tray structure are perpendicular to each other.

[0019] In the carrier tool provided by the present application, a plurality of support columns are used to connect and support a plurality of mutually parallel tray structures. Each tray structure can carry a substrate to be deposited. Thus, in the process of filling a low-temperature superconducting material into the through-holes on the substrate by using atomic deposition technology, the carrier tool can carry multiple substrates at one time, and further realize the simultaneous deposition and filling of the low-temperature superconducting material into the through-holes on multiple substrates; and each tray structure is a hollow structure, so that the substrates carried on each tray can be filled and deposited on the front and back sides of the through-holes at the same time, greatly improving the efficiency of depositing and filling the low-temperature superconducting material into the through-holes on the substrate. Brief Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 Schematic structural diagram of a carrier tool for superconducting material deposition provided by an embodiment of the present application;

[0022] Figure 2 Partial structural diagram of a support column provided by an embodiment of the present application;

[0023] Figure 3 Schematic structural diagram of a hook provided by an embodiment of the present application;

[0024] Figure 4 Schematic cross-sectional view of a tray structure provided by an embodiment of the present application. Detailed Description of the Embodiments

[0025] Atomic deposition technology is commonly used in the field of semiconductor processing. It mainly sprays a gas flow with specific particles onto the surface of a semiconductor wafer in a closed chamber, so that it reacts with the material on the surface of the semiconductor wafer and then forms a specific particle layer on the surface of the semiconductor wafer. However, in the currently conventional equipment for realizing atomic deposition technology, each time only a single semiconductor wafer can be processed for particle layer deposition, which to a certain extent results in relatively low atomic deposition processing efficiency.

[0026] Therefore, a carrier tool and a deposition device for superconducting material deposition are provided in the present application, which can improve the working efficiency of superconducting material deposition to a certain extent.

[0027] To enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0028] As Figures 1 to 4 shown, Figure 1 is a schematic structural diagram of a carrier tool for superconducting material deposition provided by an embodiment of the present application; Figure 2 is a partial structural diagram of a support column provided by an embodiment of the present application; Figure 3 is a schematic structural diagram of a hook provided by an embodiment of the present application; Figure 4 is a schematic cross-sectional view of a tray structure provided by an embodiment of the present application.

[0029] In a specific embodiment of the present application, the carrier tool may include:

[0030] a multi-layer tray structure 10 for supporting a substrate to be deposited and a support framework for supporting and connecting each tray structure 10;

[0031] Among them, each layer of tray structure 10 is parallel to each other, and each tray structure 10 is a hollow structure for contact support of the edge part of the substrate to be deposited; the support framework includes at least three support columns 20 arranged in parallel with each other, and each support column 20 and each tray structure 10 are arranged perpendicular to each other.

[0032] As Figure 1 shown, the carrier tool in this embodiment includes a plurality of support columns 20, and a plurality of tray structures 10 arranged in parallel with each other in sequence are provided between the support columns 20. Each tray structure 10 is used to carry a substrate to be deposited; thus, each tray structure 10 of the carrier tool can carry a plurality of substrates to be deposited at the same time. During the process of depositing a low-temperature superconducting material on the substrate to be deposited, a plurality of substrates to be deposited can be deposited and processed synchronously; for example, the number of each tray structure 10 can be 10 to 15. Then, during the deposition and processing, 10 to 15 substrates to be deposited can be deposited and processed at one time, thereby greatly improving the deposition work efficiency of depositing and filling a low-temperature superconducting material in the through holes on the substrate.

[0033] On this basis, each tray structure 10 can specifically adopt a hollow structure, and each tray structure 10 only contacts and supports the edge part of the substrate to be deposited; that is to say, each tray structure 10 does not block the surfaces of the front and back of the substrate to be deposited it carries, and only contacts the edge part of the substrate to be deposited; during the deposition process of the substrate to be deposited, both its front and back surfaces can be in full contact with the gas flow carrying the low-temperature superconducting material in the environment, realizing the simultaneous deposition on both the front and back surfaces of the substrate to be deposited, thereby also accelerating the deposition efficiency of the substrate to be deposited to a certain extent.

[0034] Of course, in practical applications, each tray structure 10 can also be several support platforms distributed in a ring shape. Each support platform is respectively connected to the support columns, and the support platforms are not connected to each other, and it can also realize the contact support for the edge part of the substrate to be deposited without blocking the front and back surfaces of the substrate to be deposited, thus ensuring the simultaneous deposition of the low-temperature superconducting material on both surfaces of the substrate to be deposited.

[0035] In Figure 1 In the illustrated embodiment, the tray structure 10 is a circular ring structure. In practical applications, each tray structure 10 can be other circular ring structures. Specifically, the shape of the hollow hole in the middle should be the same as the shape and structure of the substrate to be deposited.

[0036] Such as Figure 1 and Figure 4 As shown, in an alternative embodiment of the present application, a step surface 11 can be formed on the inner ring wall of each tray structure 10 to support and carry the edge part of the lower surface of the substrate to be deposited, and the substrate to be deposited is restricted within the inner ring of the tray structure 10.

[0037] On this basis, in order to avoid the interference of the tray structure 10 on the gas flow on the lower surface of the substrate to be deposited, several partial spherical protrusions 12 can also be provided on the step surface 11; as Figure 4 shown, the partial spherical protrusion 12 can be a hemispherical protrusion; thus, through the supporting action of each partial spherical protrusion 12 on the substrate to be deposited, the lower surface of the substrate to be deposited is relatively suspended from the step surface 11, and further, the gas flow on the surface of the edge part of the substrate to be deposited can flow more smoothly, thereby ensuring the deposition effect of the low-temperature superconducting material deposited in the through holes on the substrate to be deposited.

[0038] In addition, in order to further improve the convenience of placing and taking the substrates to be deposited on each tray structure 10, in another alternative embodiment of the present application, the tray structure 10 in the carrying tool can be further set as an annular tray with a notch, so that the fixture for clamping the substrate to be deposited can place and take the substrate to be deposited through this notch part.

[0039] Moreover, in order to facilitate the removal of each substrate to be deposited from the tray structure 10 and ensure that each support column 20 can stably support each tray structure 10, as Figure 1 shown, in another alternative embodiment of the present application, the tray structure 10 can be an annular tray; the number of support columns 20 is three;

[0040] Among them, two support columns 20 are respectively located at both ends of the first diameter of the annular tray, and one support column 20 and the notch are respectively located at both ends of the second diameter of the annular tray, and the first diameter and the second diameter are perpendicular to each other.

[0041] Thus, the substrate to be deposited can be taken or placed on the tray structure 10 through the position between two support columns 20 located on the same diameter of the annular tray.

[0042] Based on the above discussion, the tray structures 10 are arranged parallel to each other, and the support columns 20 are also arranged parallel to each other. The distance between adjacent two tray structures 10 can be about 5 mm. However, further considering that in the actual processing process, due to different actual application requirements, the area size and through-hole depth of the substrate to be deposited may vary, correspondingly, the distance between adjacent two substrates to be deposited is required to be different during the deposition process. Therefore, in another alternative embodiment of the present application, the distance between adjacent two tray structures 10 is adjustable along the length direction of the support column 20.

[0043] It can be understood that to achieve the adjustable distance between adjacent two tray structures 10, it can be that the length of each support column 20 is adjustable in its height direction, or the tray structure 10 and the support column 20 are movably connected, so that the connection position points of each tray structure 10 on the support column 20 are adjustable.

[0044] As Figures 2 to 4 shown, in an alternative embodiment of the present application, a main slideway 21 extending along the length direction of the support column 20 is provided on the support column 20, branch slideways 22 perpendicular to the main slideway 21 and arranged parallel to each other in sequence along the length direction of the main slideway 21, and hooks 14 with sliders 15;

[0045] Among them, the slider 15 can slide in the main slideway 21 and the branch slideways 22; each hook 14 is used to hook the tray structure 10.

[0046] In Figure 2In the illustrated embodiment, a main slideway 21 and a branch slideway 22 that intersect to form a tree structure are provided on the support column 20, and a slider 15 on the hook 14 of the hook tray structure 10 can slide in the main slideway 21 and the branch slideway 22. Obviously, when the slider 15 of the hook 14 slides along the main slideway 21, the tray structure 10 connected thereto can move along the length direction of the support column 20 accordingly, that is, the distance adjustment between two adjacent tray structures 10 can be realized. When the slider 15 of the hook 14 slides and snaps into the branch slideway 22, obviously, at this time, the slider 15 of the hook 14 cannot slide along the length direction of the support column 20, and similarly restricts the movement of each tray structure 10 along the length direction of the support column 20, so as to maintain the fixed position of each tray structure 10 unchanged.

[0047] As Figure 4 shown, a hook hole 13 can be correspondingly provided on each hook 14 of the tray structure 10, so that the hook 14 can stably hook the tray structure 10. In practical applications, each hook 14 and the tray structure 10 can be fixedly connected. Thus, when it is necessary to move the height of each tray structure 10 on the support column 20, the tray structure 10 can be rotated first so that the tray structure 10 drives the sliders 15 on each hook 14 to slide from the branch slideway 22 into the main slideway 21, and then the tray structure 10 is pushed along the length direction of the support column 20, thereby driving the slider 15 to slide in the main slideway 21. Until each tray structure 10 slides to the required position, then rotate the tray structure 10 and slide the slider 15 into the branch slideway 22 at the corresponding height again.

[0048] Of course, in practical applications, a detachable connection method can also be adopted between the tray structure 10 and the hook 14, that is to say, the hook 14 is only hooked in the hook hole 13 of the tray structure 10, and the tray structure 10 can be taken off the hook 14 at any time. However, for the convenience of adjusting the length direction of each hook 14 supporting the same tray structure 10 along the support column 20, the hooks 14 located in the same plane and used to support the same tray structure 10 can also be fixedly connected by an arc-shaped connecting piece, so that each hook 14 supporting the same tray structure 10 can move synchronously along the length direction of the support column 20.

[0049] In addition, in order to avoid the interference of each support column 20 on the air flow on the surface of the substrate to be deposited carried by each tray structure 10, thereby affecting the deposition effect, ventilation through holes 23 are further arranged on each support column 20 in sequence along the length direction of the support column 20.

[0050] As Figure 2As shown, since the support column 20 is provided with ventilation through-holes 23, it can be understood that the ventilation through-holes 23 should be hole structures that penetrate the support column 20 along the length direction perpendicular to the support column 20. Thus, the airflow flowing through the support column 20 can flow through the ventilation through-holes 23, thereby minimizing the obstruction of the support column 20 to the airflow during the deposition process, and further ensuring the deposition filling effect of the through-holes on the substrate to be deposited.

[0051] In the Figure 2 shown support column 20, the ventilation through-holes 23 are further extended along the radial direction of the annular tray structure 10 on the basis of the length direction perpendicular to the support column 20. In practical applications, ventilation through-holes 23 can also be further arranged on the support column 20 along the length direction perpendicular to the support column 20 and perpendicular to the radial direction of the annular tray structure 10 to further reduce the obstruction of the support column 20 to the airflow.

[0052] In addition, in another alternative embodiment of the present application, each support column 20 may further include a plurality of column segments, and the column segments are detachably spliced and connected in sequence.

[0053] Thus, in practical applications, if only a small number of substrates to be deposited need to be processed by deposition, for each support column 20, a smaller number of column segments can be used for splicing, and even each support column 20 can only include one column segment. When the number of tray structures 10 that one column segment can connect is small, one more column segment can be added to each support column 20, thereby realizing flexible adjustment of the length of each support column 20.

[0054] The connection between adjacent column segments at both ends can be connected by a snap-fastener method or a bolt method. In short, the stability of the connection between adjacent two column segments is ensured.

[0055] In summary, in the carrying tool provided by the present application, a plurality of support columns are used to connect and support a plurality of mutually parallel tray structures, and each tray structure can carry a substrate to be deposited. Thus, during the process of filling a low-temperature superconducting material into the through-holes on the substrate by using atomic deposition technology, each tray structure can jointly carry multiple substrates, realizing synchronous deposition and filling of a low-temperature superconducting material for multiple substrates at one time. Moreover, each tray structure is a hollow structure, enabling the substrates carried on each tray to be filled and deposited with through-holes on both the front and back sides, thereby greatly improving the efficiency of depositing and filling a low-temperature superconducting material into the through-holes on the substrate.

[0056] Based on any of the above embodiments, the present application further provides a deposition device for superconducting material deposition, including a carrying tool for superconducting material deposition as described in any one of the above; and a deposition chamber for accommodating the carrying tool; an air outlet channel and at least one air inlet channel are provided on the deposition chamber.

[0057] When filling the through holes on the substrate to be deposited with a low-temperature superconducting material, multiple substrates to be deposited can be arranged on the respective tray structures of the carrying tool, and then an air flow containing the low-temperature superconducting material is introduced into the deposition chamber through the respective air inlet channels, so that each substrate to be deposited carried by the carrying tool can be fully contacted with the air flow, and the deposition of the low-temperature superconducting material in the through holes of the substrate to be deposited is achieved.

[0058] In the deposition device of this embodiment, a carrying tool is built in, and this carrying tool can carry multiple substrates to be deposited at one time, thereby enabling synchronous deposition processing of multiple substrates to be deposited, greatly improving the working efficiency of depositing and filling the low-temperature superconducting material in the through holes of the substrate to be deposited; and the tray structure for carrying the substrate to be deposited on the carrying tool is a hollow structure, so that the substrates to be deposited carried by each tray structure can deposit the low-temperature superconducting material on both the front and back surfaces at the same time, thereby further accelerating the deposition efficiency and thus enhancing the working efficiency of the entire deposition device.

[0059] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes the inherent elements thereof. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element. In addition, parts of the above technical solutions provided in the embodiments of the present application that are consistent with the corresponding technical solutions in the prior art in terms of implementation principles are not described in detail to avoid excessive elaboration.

[0060] Specific examples are used in this article to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A carrier tool for superconducting material deposition, characterized in that, Comprising: A multi-layer tray structure for supporting a substrate to be deposited and a support framework for supporting and connecting each of the tray structures; Wherein, each layer of the tray structures are parallel to each other, and each tray structure is a hollow structure that contacts and supports the edge portion of the substrate to be deposited; the support framework includes at least three support columns arranged parallel to each other, and each of the support columns and each of the tray structures are perpendicular to each other.

2. The carrier tool for superconducting material deposition according to claim 1, characterized in that, Each of the tray structures is an annular tray with a notch.

3. The carrier tool for superconducting material deposition according to claim 2, characterized in that, The tray structure is an annular tray; the number of the support columns is three; Wherein, two of the support columns are respectively located at both ends of the first diameter of the annular tray, one of the support columns and the notch are respectively located at both ends of the second diameter of the annular tray, and the first diameter and the second diameter are perpendicular to each other.

4. The carrier tool for superconducting material deposition according to claim 2, wherein, The inner ring surface of the tray structure is a stepped surface, and a plurality of partial spherical protrusions for supporting the substrate to be deposited are arranged on the stepped surface.

5. The carrier tool for superconducting material deposition according to claim 1, wherein The distance between adjacent two of the tray structures is adjustable along the length direction of the support column.

6. The carrier tool for superconducting material deposition according to claim 5, characterized in that, The support column is provided with a main slideway extending along the length direction of the support column, branch slideways perpendicular to the main slideway and arranged parallel to each other in sequence along the length direction of the main slideway, and hooks with sliders; Wherein, the slider can slide in the main slideway and the branch slideways; each of the hooks is used for hooking the tray structure.

7. The carrier tool for superconducting material deposition according to claim 1, characterized in that, A plurality of air permeation through holes are arranged in sequence along the length direction of each of the support columns.

8. The carrier tool for superconducting material deposition according to claim 1, characterized in that, Each of the support columns includes a plurality of column segments; the column segments are detachably spliced and connected in sequence.

9. A deposition device for depositing superconducting materials, characterized in that, Comprising a loading tool for superconducting material deposition according to any one of claims 1 to 8; and a deposition cavity for accommodating the loading tool; an air outlet channel and at least one air inlet channel are provided on the deposition cavity.

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