Method and system for controlling wafer UV (ultraviolet) erasing equipment

Abstract

The invention relates to the technical field of wafer data erasing, and discloses a control method and system for wafer UV erasing equipment, and the control method comprises the steps: obtaining the configuration information of a corresponding to-be-erased wafer; sending an environment configuration instruction to the UV machine, wherein the environment configuration instruction is used for indicating the UV machine to execute configuration operation; when it is judged that the received UV light intensity information and temperature information are consistent with the corresponding information in the configuration information, a preset duration instruction is sent to a timing device; and when a timing completion signal sent by the timing device is received, a shutdown instruction is sent to the UV machine. By automatically acquiring and configuring environmental parameters required by wafer UV erasing, accurate adjustment of UV light intensity and temperature is realized, and the stability of the erasing environment is ensured; in addition, the UV machine can be automatically controlled to start and stop according to the set time, and the automation degree and efficiency of erasing operation are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer data erasure, and particularly to a control method and system for a wafer UV erasure device. Background Art

[0002] In the chip testing industry, it is often necessary to test wafers containing non-volatile memories. After the test is completed, a UV erasure device is required to erase the data written during the test. Currently, there are many problems in the wafer UV erasure process: on the one hand, the timing of some devices in the prior art is not accurate and reliable enough.

[0003] For example, in the patent with the application number CN202210874604.3, if the host computer has an abnormality or crashes, it may cause the inability to accurately control the UV machine to stop working, making it difficult to accurately control the wafer UV irradiation time and affecting the erasure effect; on the other hand, although the patent with the application number CN201922077337.3 can monitor the UV intensity, it does not fully consider the influence of environmental factors on the erasure effect, and the handling in abnormal situations such as power failure and restart is not perfect enough to ensure that the wafer can obtain a sufficient and stable erasure environment and time. These problems need to be solved urgently to improve the quality and efficiency of wafer UV erasure.

[0004] Therefore, it is necessary to improve the prior art.

[0005] The above information is given as background information only to assist in understanding the present disclosure, and does not determine or admit whether any of the above content can be used as the prior art relative to the present disclosure. Summary of the Invention

[0006] The present invention provides a control method and system for a wafer UV erasure device to solve the problems existing in the prior art.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A control method for a wafer UV erasure device, the wafer UV erasure device including a host computer, a UV machine, a timing device, an ultraviolet illuminance meter, and a temperature sensor;

[0009] The control method includes:

[0010] Obtaining configuration information corresponding to the wafer to be erased, the configuration information including UV light intensity information, temperature information, and preset duration information;

[0011] Sending an environment configuration instruction to the UV machine, the environment configuration instruction being used to instruct the UV machine to perform the following operations: adjusting the UV light intensity by adjusting the power of the UV lamp, adjusting the temperature by adjusting the power of the heating device, and using the ultraviolet illuminance meter and the temperature sensor to feedback the environmental parameters in real time;

[0012] Receive the UV light intensity information monitored by the ultraviolet illuminometer and the temperature information monitored by the temperature sensor;

[0013] When it is determined that the received UV light intensity information and temperature information are consistent with the corresponding information in the configuration information, send a preset duration command to the timing device;

[0014] When receiving the timing completion signal sent by the timing device, send a shutdown command to the UV machine.

[0015] Optionally, the control method of the wafer UV erasing device further includes:

[0016] Continuously save the real-time timing status through the storage unit;

[0017] When a power failure and restart occur, read the stored timing status and continue timing;

[0018] When the preset duration is reached, send a timing completion signal to the host computer.

[0019] Optionally, the control method of the wafer UV erasing device further includes:

[0020] When detecting an abnormal power failure and restart of the device, obtain the current monitoring data of the ultraviolet illuminometer and the temperature sensor;

[0021] Calculate the error value between the current monitoring data and the configuration information;

[0022] When the error value exceeds the preset threshold, send an environment reset command to the UV machine;

[0023] After confirming the completion of the environment reset, send a continuation timing command to the timing device.

[0024] Optionally, the control method of the wafer UV erasing device further includes:

[0025] Record the environmental configuration response time of the UV machine;

[0026] When the response time exceeds the preset configuration time, generate and send a device anomaly warning signal.

[0027] Optionally, during the process of the UV machine performing wafer erasing work, the host computer records the current environmental information of the erasing environment at preset intervals, and the current environmental information includes temperature information and the current information of the UV lamp, and generates an erasing environment report according to the current environmental information.

[0028] Optionally, during the process of the UV machine performing wafer erasing work, the host computer obtains the current environmental information of the erasing environment, and the current environmental information includes temperature information and the current information of the UV lamp;

[0029] When the error value between the current environmental information and the environmental configuration information in the configuration information is outside another preset range, the host computer issues a warning message.

[0030] Optionally, when the host computer sends the preset duration instruction to the timing device and makes the timing device start timing, the host computer performs timing according to the duration information in the configuration information;

[0031] When the timing of the host computer reaches the preset duration, a stop instruction is sent to the UV machine to make the UV machine stop the erasing work.

[0032] The present invention also provides a control system for a wafer UV erasing device, which is used to implement the control method of the wafer UV erasing device as described in any one of the above, including:

[0033] A host computer, a UV machine, a timing device, an ultraviolet illuminance meter, and a temperature sensor, wherein:

[0034] The host computer is communicatively connected to the UV machine, the timing device, the ultraviolet illuminance meter, and the temperature sensor;

[0035] The host computer includes:

[0036] A configuration acquisition module, configured to acquire the configuration information of the wafer to be erased, and the configuration information includes UV light intensity information, temperature information, and preset duration information;

[0037] An instruction sending module, configured to send an environmental configuration instruction to the UV machine according to the configuration information;

[0038] A data receiving module, configured to receive the UV light intensity monitoring data fed back by the ultraviolet illuminance meter and the temperature monitoring data fed back by the temperature sensor;

[0039] A determination module, configured to compare the error value between the monitoring data and the configuration information, and trigger a timing instruction when the error value meets the preset range;

[0040] A timing control module, configured to send a preset duration instruction to the timing device;

[0041] A stop control module, configured to send a stop instruction to the UV machine when receiving the timing completion signal of the timing device.

[0042] Optionally, the timing control module is further configured to:

[0043] Start timing after receiving the preset duration instruction sent by the host computer;

[0044] Continuously save the real-time timing status through the storage unit;

[0045] When a power failure and restart occur, read the stored timing status and continue timing;

[0046] When the preset duration is reached, send a timing completion signal to the host computer.

[0047] Optionally, the determination module is further configured to:

[0048] When detecting an abnormal power failure and restart of the device, obtain the current monitoring data of the ultraviolet illuminance meter and the temperature sensor;

[0049] Calculate the error value between the current monitoring data and the configuration information;

[0050] When the error value exceeds the preset threshold, send an environment reset instruction to the UV machine;

[0051] After confirming the completion of the environment reset, send a time continuation instruction to the timing device.

[0052] The present invention has the following beneficial effects:

[0053] By automatically obtaining and configuring the environmental parameters required for wafer UV erasure, the present invention realizes precise adjustment of UV light intensity and temperature, ensuring a stable erasure environment; in addition, it can also automatically control the start and stop of the UV machine according to the set time, improving the automation degree and efficiency of the erasure operation.

[0054] The present invention has other characteristics and advantages, which will be obvious from the accompanying drawings incorporated herein and the subsequent detailed implementation manners, or will be detailedly described in the accompanying drawings incorporated herein and the subsequent detailed implementation manners. These accompanying drawings and detailed implementation manners are jointly used to explain the specific principles of the present invention. Description of the Drawings

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0056] Figure 1 is a flowchart of a control method for a wafer UV erasure device provided in Embodiment 1 of the present invention;

[0057] Figure 2 is a task graph at each node of a control method for a wafer UV erasure device provided in Embodiment 1 of the present invention;

[0058] Figure 3 is a structural block diagram of a control device for a wafer UV erasure device provided in Embodiment 1 of the present invention;

[0059] Figure 4 It is the wiring diagram of each sensing component inside the light box of the control device of a wafer UV erasing device provided in the first embodiment of the present invention.

[0060] Reference numerals: 10, host computer; 20, UV machine; 30, timing device; 40, ultraviolet illuminance meter; 50, temperature sensor. Detailed implementation manners

[0061] To describe in detail the possible application scenarios, technical principles, specific implementable solutions, achievable purposes and effects, etc. of the present application, the following will be described in detail with reference to the specific examples listed and in conjunction with the accompanying drawings. The examples described herein are only used to more clearly illustrate the technical solutions of the present application, so they are only examples and cannot be used to limit the protection scope of the present application.

[0062] Referring to "embodiment" herein means that the specific features, structures or characteristics described in connection with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various positions in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0063] Unless otherwise defined, the meanings of the technical terms used herein are the same as those commonly understood by those skilled in the technical field to which the present application belongs; the use of the relevant terms herein is only for describing specific embodiments and is not intended to limit the present application.

[0064] In the description of the present application, the phrase "and / or" is an expression used to describe the logical relationship between objects, indicating that there can be three relationships, for example, A and / or B, which means: there is A, there is B, and there is both A and B at the same time. In addition, the character " / " herein generally represents an "or" logical relationship between the associated objects before and after.

[0065] In the present application, terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, primary-secondary or order relationship, etc. between these entities or operations.

[0066] In the absence of further limitations, in this application, the use of expressions such as "including", "comprising", "having" or other similar expressions in a statement is intended to cover non-exclusive inclusion. These expressions do not exclude the possibility that there may be additional elements in the process, method or product that includes the said elements. Thus, in a process, method or product that includes a series of elements, it may include not only those defined elements, but also other elements not explicitly listed, or elements inherent in such a process, method or product.

[0067] Similar to the understanding in the "Examination Guidelines", in this application, expressions such as "greater than", "less than", "exceeding" are understood not to include the number itself; expressions such as "above", "below", "within" are understood to include the number itself. In addition, in the description of the embodiments of this application, the meaning of "a plurality of" is two or more (including two). Similar expressions related to "many", such as "multiple groups", "multiple times", etc., are understood in this way unless otherwise specifically defined.

[0068] In the description of the embodiments of this application, the spatially related expressions used, such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "perpendicular", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiment or the drawings. This is only for the convenience of describing the specific embodiments of this application or for the reader's understanding, rather than indicating or implying that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it should not be construed as a limitation to the embodiments of this application.

[0069] Unless otherwise clearly specified or limited, in the description of the embodiments of this application, the terms such as "installed", "connected", "joined", "fixed", "set" should be understood in a broad sense. For example, the said "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art to which this application pertains, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.

[0070] Embodiment 1

[0071] Please refer to Figure 1, the present invention provides a control method for a wafer UV erasing device, which is implemented based on the control system of the wafer UV erasing device. The control system includes a host computer 10, a UV machine 20, a timing device 30, an ultraviolet illuminance meter 40, and a temperature sensor 50. The control method includes:

[0072] S1. Obtain the configuration information corresponding to the wafer to be erased. The configuration information includes UV light intensity information, temperature information, and preset duration information.

[0073] In this step, by scanning the process card, the host computer 10 reads the configuration information corresponding to the wafer to be erased from the ERP database.

[0074] In some embodiments, the host computer 10 is communicatively connected to the ERP database through a network to ensure the stability and real-time nature of data transmission. Before performing the wafer erasing operation, the operator needs to scan the process card on the scanning device. The scanning device transmits the process card information to the host computer 10. The host computer 10 retrieves and obtains the configuration information corresponding to the wafer to be erased from the ERP database according to this information. The configuration information includes UV light intensity information, temperature information, and preset duration information.

[0075] It can be understood that the ERP database stores rich product data. Through the association between scanning the process card and the database, accurate acquisition of the configuration information is achieved, avoiding errors that may occur in manual input.

[0076] Specifically, these configuration information are preset according to the characteristics and erasing requirements of different wafers, providing an accurate parameter basis for subsequent erasing work.

[0077] S2. The host computer 10 sends an environment configuration instruction to the UV machine 20, and the UV machine 20 configures the erasing environment according to the instruction.

[0078] Specifically, the environment configuration instruction is used to instruct the UV machine 20 to perform the following operations: adjust the UV light intensity by adjusting the power of the UV lamp, adjust the temperature by adjusting the power of the heating device, and use the ultraviolet illuminance meter 40 and the temperature sensor 50 to feedback the environment parameters in real time;

[0079] Receive the UV light intensity information monitored by the ultraviolet illuminance meter 40 and the temperature information monitored by the temperature sensor 50;

[0080] When it is determined that the received UV light intensity information and temperature information are consistent with the corresponding information in the configuration information, send a preset duration instruction to the timing device 30; receive the UV light intensity information monitored by the ultraviolet illuminance meter 40 and the temperature information monitored by the temperature sensor 50.

[0081] Among them, the host computer 10 sends environment configuration instructions to the UV machine 20 through wired or wireless communication. After the UV machine 20 receives the instructions, the internal environment adjustment module starts to work. Specifically, according to the instructions, the environment adjustment module adjusts the power of the UV lamp by adjusting the driving circuit of the UV lamp, thereby adjusting the UV light intensity; at the same time, by adjusting the control circuit of the heating device, the power of the heating device is changed, and then the temperature is adjusted. During this process, the ultraviolet illuminance meter 40 and the temperature sensor 50 collect environmental parameters in real time and upload the data to the host computer 10 through the feedback module.

[0082] In some embodiments, the method further includes:

[0083] Presetting an environment configuration response time.

[0084] Starting from sending the environment configuration instruction, the host computer 10 starts the internal timing module to record the environment configuration response time of the UV machine 20.

[0085] When the environment configuration response time of the UV machine 20 exceeds the preset configuration time, the host computer 10 drives the audible and visual alarm device through the alarm output interface or issues a device abnormality warning signal in the form of a pop-up window on the display screen to remind the operator to check and process in time.

[0086] Specifically, the timing module performs timing based on the clock pulse counting principle, and the alarm output realizes signal transmission based on the control circuit and communication method.

[0087] S3. When it is determined that the received environmental parameters are consistent with the configuration information, the host computer 10 sends a preset duration instruction to the timing device 30.

[0088] In this step, the data receiving module of the host computer 10 continuously receives the UV light intensity information monitored by the ultraviolet illuminance meter 40 and the temperature information monitored by the temperature sensor 50, and the determination module compares these monitored data with the configuration information obtained from the ERP database.

[0089] When the host computer 10 determines that the received UV light intensity information and temperature information are consistent with the corresponding information in the configuration information, the timing control module sends a preset duration instruction to the timing device 30 through the communication line.

[0090] Among them, the determination process is based on a preset data comparison algorithm to ensure the accuracy and consistency of the environmental parameters.

[0091] S4. The timing device 30 performs timing according to the preset duration instruction, and after completing the timing, sends a signal to the host computer 10, and the host computer 10 controls the UV machine 20 to stop.

[0092] After the timing device 30 receives a preset duration instruction, the timing module starts the timing function and performs timing at preset time intervals. Meanwhile, the real-time timing status is continuously saved through the storage unit, and the storage unit adopts a storage technology that does not lose data after power failure, such as EEPROM.

[0093] When a power failure and restart occur, the power-off continuation module reads the stored timing status, and the timing module continues timing. When the preset duration is reached, the timing module generates a timing completion signal and sends it to the host computer 10 through the communication line.

[0094] After receiving the timing completion signal, the shutdown control module of the host computer 10 sends a shutdown instruction to the UV machine 20. After receiving the instruction, the UV machine 20 cuts off the power supply of the UV lamp and the heating device and stops the erasing work.

[0095] It can be understood that this timing and control mechanism ensures the continuity and accuracy of timing and avoids affecting the normal progress of the erasing work due to power failure or other abnormal situations.

[0096] In some embodiments, the method further includes:

[0097] When it is detected that the device has an abnormal power failure and restart, the host computer 10 quickly obtains the current monitoring data of the ultraviolet illuminometer 40 and the temperature sensor 50.

[0098] The host computer 10 uses the data processing module to calculate the error value between the current monitoring data and the configuration information according to a preset error calculation algorithm.

[0099] When the error value exceeds the preset threshold, the host computer 10 receives an environment reset instruction from the system and then forwards the instruction to the UV machine 20 through the communication line.

[0100] The environment adjustment module of the UV machine 20 readjusts the power of the UV lamp and the power of the heating device according to the environment reset instruction to make it return to the initial configuration state. The host computer 10 confirms the completion of the environment reset by monitoring the feedback signal of the UV machine 20 or obtaining the environmental parameters again. After the confirmation is completed, the host computer 10 sends a continuation instruction to the timing device 30, and the timing device 30 continues timing according to the continuation instruction.

[0101] Specifically, the error calculation and judgment are based on mathematical algorithms, and the communication and control are based on communication protocols and electrical control principles.

[0102] Since a power failure may cause changes in the erasing environment, this mechanism can restore the environment in a timely manner to ensure the smooth progress of the erasing work.

[0103] In some embodiments, the method further includes:

[0104] Set a timing task module in the host computer 10 to trigger a data acquisition action at a preset time interval, such as every minute.

[0105] The host computer 10 obtains the temperature information monitored by the temperature sensor 50 and the UV lamp current information fed back by the UV lamp current monitoring device through the data acquisition interface. The host computer 10 uses the data analysis and report generation module to organize and analyze the currently collected environmental information, generate an erasure environment report according to the preset report template, and store the report in the local storage device or upload it to the server.

[0106] Specifically, the timing task is based on the timing task scheduling mechanism of the operating system, and the data processing and report generation are based on data processing algorithms and template filling techniques.

[0107] The operator can query the erasure environment report to understand the environmental changes during the erasure process, which is convenient for analyzing and optimizing the erasure process.

[0108] In some embodiments, the control method of this wafer UV erasure device further includes:

[0109] The host computer 10 obtains the temperature information monitored by the temperature sensor 50 and the UV lamp current information fed back by the UV lamp current monitoring device in real time through the data acquisition interface.

[0110] The host computer 10 uses the data processing module to calculate the error value between the current environmental information and the environmental configuration information in the configuration information according to the preset error calculation and judgment algorithm, and determines whether the error value is outside the preset range.

[0111] When the error value between the first environmental information and the environmental configuration information in the configuration information is outside the preset range, the host computer 10 issues a warning message through the alarm output interface, which can be informed to the operator by means of a pop-up window on the display screen, text message notification, etc.

[0112] Specifically, data acquisition is based on a communication protocol, error calculation and judgment are based on mathematical algorithms, and alarm output is achieved through a control circuit and corresponding communication methods.

[0113] This real-time monitoring and warning mechanism can timely detect environmental abnormalities and ensure the quality of wafer erasure.

[0114] In some embodiments, this method further includes:

[0115] When the host computer 10 sends a preset duration instruction to the timing device 30 and makes the timing device 30 start timing, the host computer 10 starts its own internal timing module and times according to the duration information in the configuration information.

[0116] When the upper computer 10 counts up to the preset duration, it sends a stop instruction to the UV machine 20. After receiving the instruction, the UV machine 20 stops the erasing work.

[0117] Specifically, the upper computer 10 is configured with a timing function, realizing dual control over the erasing working time of the UV machine 20, avoiding the situation that the UV machine 20 cannot stop working due to an abnormality in either the timing device 30 or the upper computer 10, and improving the reliability of the system.

[0118] The present invention obtains configuration information by scanning the process card, accurately controls the erasing environment and the timing process, realizes the automation and intelligence of wafer UV erasing, effectively improves the erasing efficiency and quality, and reduces the influence of human factors.

[0119] Please refer to Figure 3 The present invention also provides a control system for a wafer UV erasing device to implement the above control method, including an upper computer 10, a UV machine 20, a timing device 30, an ultraviolet illuminance meter 40, and a temperature sensor 50.

[0120] The upper computer 10 is connected to the UV machine 20, the timing device 30, the ultraviolet illuminance meter 40, and the temperature sensor 50 through a wired or wireless communication method to establish a stable data transmission channel.

[0121] The upper computer 10 includes:

[0122] A configuration acquisition module, which obtains process card information through a scanning device interface, and then obtains the configuration information of the wafer to be erased from the ERP database through a network communication interface.

[0123] An instruction sending module, which generates an environment configuration instruction according to the configuration information according to the communication protocol and sends it to the UV machine 20 through a communication line.

[0124] A data receiving module, which receives the UV light intensity monitoring data fed back by the ultraviolet illuminance meter 40 and the temperature monitoring data fed back by the temperature sensor 50 through a communication line.

[0125] A determination module, which uses a data processing algorithm to compare the error values between the monitoring data and the configuration information, and triggers a timing instruction when the error value meets the preset range.

[0126] A timing control module, which sends a preset duration instruction to the timing device 30 according to the communication protocol.

[0127] A stop control module, which sends a stop instruction to the UV machine 20 when receiving the timing completion signal from the timing device 30.

[0128] Further, the UV machine 20 includes:

[0129] The environmental adjustment module adjusts the power of the UV lamp and the power of the heating device according to the environmental configuration instruction through the drive circuit.

[0130] The feedback module uploads the real-time monitoring data of the ultraviolet illuminometer 40 and the temperature sensor 50 to the host computer 10 through the data transmission line.

[0131] The timing device 30 includes:

[0132] The timing module starts timing according to the preset duration instruction and generates a timing completion signal when the preset duration is reached.

[0133] The power-off continuation module reads the stored timing progress through the storage circuit and continues timing after power-off restart.

[0134] The modules of the control system of the present invention work together to achieve comprehensive and precise control of the wafer UV erasing equipment, improve production efficiency and product quality, and have high practical value and innovation.

[0135] In the embodiment of the present application, the host computer 10 is communicatively connected to the UV machine 20, the timing device 30, the ultraviolet illuminometer 40 and the temperature sensor 50.

[0136] Please refer to Figure 4 , there are various key sensors inside the lamp box of the wafer UV erasing equipment, and they work together to achieve precise detection and monitoring of the entire UV process of the Wafer inside the lamp box. Specifically, the detailed introduction of these sensors is as follows:

[0137] The grating sensor (judging the presence of the sensor): used to detect whether there is a Wafer in the lamp box. Through the emission and reflection of light beams, the optical signal is converted into an electrical signal and transmitted to the control system, so as to display the placement of the wafer in the lamp box on the software.

[0138] The temperature sensor 50: real-time monitors the temperature inside the lamp box and converts the temperature information into an electrical signal and transmits it to the host computer. The host computer compares it with the preset temperature range accordingly, and alarms and may adjust the power of the heating device when abnormal to ensure that the temperature is appropriate.

[0139] The ultraviolet illuminance detector 40: real-time detects the ultraviolet intensity in the lamp box, converts the detected value into an electrical signal and transmits it to the control system. The UV software compares it with the preset illuminance parameter accordingly, and alarms and stops the machine when abnormal to ensure that the ultraviolet illuminance meets the erasing requirements.

[0140] It can be understood that the foregoing sensors are connected to other parts of the equipment through the wiring method shown in the attached drawings to form a complete monitoring system, which provides strong support for the stable operation of the wafer UV erasing equipment and the high-quality wafer erasing effect.

[0141] Based on the foregoing embodiments of the present invention, in actual operation, the process of wafer UV erasure is as follows:

[0142] 1) Automatic parameter setting: According to the requirements of different product models, the corresponding UV parameters for each model are pre-established in the ERP database. When the operator scans the process card on the UV software, the process card number is associated with the corresponding batch information in the ERP database. The UV software automatically reads the UV parameters of the batch of products and sets the current UV operation file. The file content includes UV model, UV batch number, UV wafer number, OcrDevice, UV planned duration, and the light box number corresponding to each wafer. For example, when producing a certain model of chip, the optimal UV parameters of the wafers of this model have been entered into the ERP database. After the operator scans the corresponding process card, the UV software quickly obtains the parameters and completes the setting of the operation file, effectively avoiding human parameter setting errors, ensuring automated data loading, and reducing the risk of abnormal UV erasure of products.

[0143] 2) Robot wafer picking: After the operation starts, the fiber optic amplifier installed on the robot scans the Wafers in the susceptor to obtain their position and quantity information, and checks it against the quantity information in the UV file. If it is found that the position of the Wafer is incorrect or the quantity is inconsistent, the system will immediately alarm and prompt. Subsequently, the upper / lower robots alternately pick wafers from the susceptor according to the requirements of the UV file. For example, in an operation with 30 wafers in a batch, after the robot scans and confirms that the quantity and position of the wafers in the susceptor are correct, it efficiently picks the wafers in sequence, avoiding quality abnormalities such as wafer scratching and cracking that may be caused by manual wafer picking, and at the same time improving the wafer picking efficiency. In the past, only one wafer could be picked and placed manually at a time, but now two robots can pick and place two wafers alternately at a time.

[0144] 3) OCR device identification: The robot places the Wafer at the identification position of the AlignerOCR device, and the CCD identifies the engraved number information on the Wafer according to the OCR parameters set by the Device. If the Wafer batch number identified by the CCD is inconsistent with the batch number in the entered UV file, or the Wafer wafer number identified is not matched with the slot number in the susceptor, the system will alarm and stop the machine. For example, when the identified Wafer batch number is "XYZ123" and the batch number in the UV file is "ABC123", the system immediately alarms to prevent wrong batches from being used for UV; if the identified Wafer wafer number is "8" but the susceptor slot is "10", the machine will also alarm and stop, avoiding the problem of mismatch between the wafer number and the slot.

[0145] 4) Placing wafers into the light boxes: There are a total of 13 UV light boxes, and each light box stores only one Wafer. The manipulator places them in sequence. For example, if wafers numbered 1 to 13 in a batch need to undergo UV operation, wafer No. 1 is placed in light box No. 1, wafer No. 2 is placed in light box No. 2, and so on. Each light box is equipped with a micro photoelectric sensor. When a Wafer is placed in the light box, the optical signal is converted into an electrical signal, and whether there is a Wafer in the light box is displayed on the software. The software not only shows which wafer in the boat is placed in each light box but also records the wafer number information in the light box in real time in the background. Even if the software is restarted suddenly due to an anomaly, the original placed wafer number can still be obtained. For example, during the UV operation, the status of the wafers in each light box can be viewed through the software at any time. If some light boxes have anomalies, it does not affect the normal operation of other light boxes, reducing the downtime and improving production efficiency.

[0146] 5) Monitoring the time to reach the standard illuminance value: Each layer of light boxes is equipped with an ultraviolet illuminance detector to detect the ultraviolet illuminance value in the light box in real time. The UV software collects the RS485 signal output by the detector to obtain the current illuminance value data and compares it with the ultraviolet illuminance control parameters set in the background. If it is lower than the control parameters, an alarm is issued and the machine stops. At the same time, the UV software sets the time to reach the standard ultraviolet illuminance value in the background. If the specified illuminance value is not reached within the specified time, an alarm is also issued and the machine stops. For example, for a certain batch of wafer UV erasure, the required ultraviolet illuminance value is 500 lux within 10 minutes. If the software detects that the illuminance value still does not reach the standard after 10 minutes, an alarm is immediately issued and the machine stops to prevent incomplete wafer erasure due to non-compliance with the illuminance value, and it can clearly indicate which specific light box has illuminance anomalies for easy troubleshooting.

[0147] 6) Product protection during UV: The UV software displays the internal status of the light box in real time, including the maximum illuminance value, the current illuminance value, the current temperature value, the mercury lamp working status, and the irradiation time. When the illuminance value obtained by the UV software is lower than the set warning value, a prompt is given in the bottom information bar; when it is lower than the set deactivation value, an alarm is issued for that light box and it is deactivated. The temperature control probe of each light box transmits the temperature value to the UV software through the RS485 signal. If the temperature value is greater than the set temperature detection value, the light box is alarmed and deactivated. Each light box also displays the remaining UV time of the current Wafer. When the countdown reaches 0, all mercury lamps in the light box are automatically turned off. The status of 10 mercury lamps can be viewed on the UV software. A green light indicates normal, and a red light indicates an anomaly, facilitating maintenance personnel to replace abnormal mercury lamps in a timely manner. For example, during the UV operation, the operator can clearly understand the parameters in each light box through the software. If the temperature of a certain light box rises abnormally, the system issues an alarm in time and deactivates that light box to ensure that the product undergoes UV erasure in a suitable environment.

[0148] 7) Real-time Log information recording: Transmit signals such as illuminance values and temperature values inside the light box to the industrial control computer through RS485 communication. Develop a signal conversion tool to convert these signals into digital signals, and then capture the values in the digital signals through code, automatically record them in txt, Word, Excel, and save them on the local disk. At the same time, develop a tool to regularly upload the Log on the local disk to the server. For example, after a batch of wafers' UV operation is completed, the information of each link in the entire UV process of this batch of products can be traced by querying the Log record on the server, including parameter changes of each light box, UV time of each wafer, etc., which is convenient for accurate querying and analysis.

[0149] 8) Automatic wafer ejection after UV completion: When the UV timing ends, the manipulator automatically takes out the Wafers from all the light boxes in sequence and returns them to the original position in the wafer boat slot. After all the Wafers complete UV and are returned to the wafer boat, the Loadport automatically ejects the wafer boat. Under normal circumstances, a software pop-up window prompts "UV completed", and the operator can take the wafer boat from the Loadport; in case of an abnormality, a pop-up window reports an error. For example, after a batch of wafers all complete UV erasure, the manipulator quickly returns the wafers to the wafer boat, and the Loadport automatically ejects, eliminating the problems such as wafer contamination, damage, and misplacement in the slot that may be caused by manual operation, and saving time costs.

[0150] 9) ERP passing control in case of abnormality: After UV completion, if there is an abnormality, such as a light box being deactivated due to an unqualified illuminance value of a certain light box, the corresponding UV data is recorded in the log. When the operator performs ERP passing in case of an abnormality, ERP compares the relevant information in the log, such as the actual UV duration of the corresponding wafer number. If it does not meet the passing requirements, a pop-up window will give an alarm prompt. For example, if a Wafer of a certain wafer number does not complete the specified UV duration, the ERP system prevents it from passing through, preventing wafers that have not completed UV from flowing into the next station and ensuring product quality.

[0151] 10) Robot mechanism motion control: The Robot mechanism includes the telescopic shaft T, rotating shaft θ, and lifting shaft Z of the upper / lower manipulator. Through the movement of these shafts, the manipulator reaches the correct position to complete corresponding actions. During installation and commissioning, adjust the positions of the T / θ / Z axes through the operation handle or the movement buttons in the software to make the Robot reach the specified positions, such as the position of the fiber optic amplifier Mapping Wafer, the position where the manipulator picks and places the Wafer, etc. At this time, display and save the position parameter information in the software. During the UV process, the software issues motion instructions, and the Robot automatically moves to the specified position according to the position parameters recorded in the software. For example, in actual operation, the Robot moves precisely according to the preset parameters, avoiding damage to the Wafer caused by the uncertainty of manual picking and placing, and can adjust the parameters according to actual needs to improve the accuracy and safety of movement.

[0152] Finally, it should be noted that although the above embodiments have been described in the text and drawings of the specification of this application, the patent protection scope of this application cannot be limited thereby. Any technical solutions resulting from equivalent structure or equivalent process substitution or modification made by using the content recorded in the text and drawings of the specification of this application based on the essential concept of this application, as well as those directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, etc., are all included within the patent protection scope of this application.

Claims

1. A control method for a wafer UV erasing device, characterized in that, The wafer UV erasing device includes a host computer, a UV machine, a timing device, an ultraviolet illuminance meter, and a temperature sensor; The control method includes: Obtaining configuration information corresponding to the wafer to be erased, where the configuration information includes UV light intensity information, temperature information, and preset duration information; Sending an environment configuration instruction to the UV machine, where the environment configuration instruction is used to instruct the UV machine to perform the following operations: adjusting the UV light intensity by adjusting the power of the UV lamp, adjusting the temperature by adjusting the power of the heating device, and using the ultraviolet illuminance meter and the temperature sensor to feedback the environmental parameters in real time; receiving the UV light intensity information monitored by the ultraviolet illuminance meter and the temperature information monitored by the temperature sensor; When it is determined that the received UV light intensity information and temperature information are consistent with the corresponding information in the configuration information, sending a preset duration instruction to the timing device; When receiving the timing completion signal sent by the timing device, sending a shutdown instruction to the UV machine.

2. The control method of the wafer UV erasing device according to claim 1, characterized in that, It further includes: Starting timing after receiving the preset duration instruction sent by the host computer; Continuously saving the real-time timing status through the storage unit; When a power failure and restart occur, reading the stored timing status and continuing the timing; When the preset duration is reached, sending a timing completion signal to the host computer.

3. The control method of the wafer UV erasing device according to claim 1, characterized in that, It further includes: When detecting an abnormal power failure and restart of the device, obtaining the current monitoring data of the ultraviolet illuminance meter and the temperature sensor; Calculating the error value between the current monitoring data and the configuration information; When the error value exceeds the preset threshold, sending an environment reset instruction to the UV machine; After confirming that the environment reset is completed, sending a time continuation instruction to the timing device.

4. The control method of the wafer UV erasing device according to claim 1, characterized in that Recording the environment configuration response time of the UV machine; When the response time exceeds the preset configuration time, generating and sending out a device abnormal warning signal.

5. The control method of the wafer UV erasing device according to claim 1, characterized in that, During the wafer erasing process of the UV machine, the host computer records the current environment information of the erasing environment at every preset time interval, where the current environment information includes temperature information and the current information of the UV lamp, and generates an erasing environment report according to the current environment information.

6. The control method of the wafer UV erasing device according to claim 1, characterized in that, During the wafer erasing process of the UV machine, the host computer obtains the current environment information of the erasing environment, where the current environment information includes temperature information and the current information of the UV lamp; When the error value between the current environment information and the environment configuration information in the configuration information is outside another preset range, the host computer sends out a warning message.

7. The control method of the wafer UV erasing device according to claim 1, characterized in that When the host computer sends the preset duration instruction to the timing device and makes the timing device start timing, the host computer performs timing according to the duration information in the configuration information; When the host computer's timing reaches the preset duration, sending a shutdown instruction to the UV machine to make the UV machine stop the erasing work.

8. A control system for a wafer UV erasing device, characterized in that, For implementing the control method of the wafer UV erasing device according to any one of claims 1 to 7, it includes: A host computer, a UV machine, a timing device, an ultraviolet illuminance meter, and a temperature sensor, where: The host computer is communicatively connected to the UV machine, the timing device, the ultraviolet illuminance meter, and the temperature sensor; The host computer includes: A configuration acquisition module, configured to acquire the configuration information of the wafer to be erased, where the configuration information includes UV light intensity information, temperature information, and preset duration information; An instruction sending module, configured to send an environment configuration instruction to the UV machine according to the configuration information; A data receiving module, configured to receive the UV light intensity monitoring data fed back by the ultraviolet illuminometer and the temperature monitoring data fed back by the temperature sensor; A determination module, configured to compare the error value between the monitoring data and the configuration information, and trigger a timing instruction when the error value meets the preset range; A timing control module, configured to send a preset duration instruction to the timing device; A shutdown control module, configured to send a shutdown instruction to the UV machine when receiving the timing completion signal from the timing device.

9. The control system of a wafer UV erasing device according to claim 8, characterized in that, The timing control module is further configured to: Start timing after receiving the preset duration instruction sent by the host computer; Continuously save the real-time timing status through the storage unit; When a power failure and restart occur, read the stored timing status and continue timing; When the preset duration is reached, send a timing completion signal to the host computer.

10. The control system of a wafer UV erasing device according to claim 8, characterized in that, The determination module is further configured to: When detecting an abnormal power failure and restart of the device, acquire the current monitoring data of the ultraviolet illuminometer and the temperature sensor; Calculate the error value between the current monitoring data and the configuration information; When the error value exceeds the preset threshold, send an environment reset instruction to the UV machine; After confirming the completion of the environment reset, send a continuation timing instruction to the timing device.

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