Method for operating semiconductor manufacturing apparatus

Abstract

The invention relates to a method for operating a semiconductor manufacturing apparatus, which enables an operator to easily determine the cause of an abnormality of the apparatus and quickly recover the apparatus from the abnormality. The method comprises: a step of acquiring one or more pieces of state information related to one or more processing units in a semiconductor manufacturing apparatus; a step of determining whether or not a predetermined operation step of the semiconductor manufacturing apparatus can be performed on the basis of the one or more pieces of state information; when it is determined that the predetermined operation step cannot be implemented, the following steps are executed: a step for controlling so that the predetermined operation step is not implemented; a step in which the one or more pieces of state information are divided into information corresponding to an abnormal state and information corresponding to a normal state, and the information is displayed; and a step of causing the mobile terminal to display an AR or MR screen for guiding to a position of a processing unit corresponding to the specified state information among the one or more processing units in response to a user input specifying the state information corresponding to the abnormal state.

Description

Technical Field

[0001] The present invention relates to an operation method of a semiconductor manufacturing apparatus. Background Art

[0002] In order to make a semiconductor manufacturing apparatus operate properly, interlock control is widely used (for example, refer to Patent Document 1). Interlock control is a method of controlling such that when a certain operation is to be performed by the apparatus, the operation is not executed if specified conditions are not satisfied. The conditions for interlock control vary depending on each type of operation. When an operation is not executed by interlock control, an operator of the apparatus confirms, through a display screen or the like, which condition does not hold and thus the target operation is not executed.

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2012-222099

[0004] In the above situation, it is desired that an operator can easily identify the cause of an apparatus abnormality and quickly recover the apparatus from the abnormality. Summary of the Invention

[0005] [Aspect 1] According to Aspect 1, there is provided a method, which is an operation method for recovering a semiconductor manufacturing apparatus from an abnormal state, including: a step of acquiring one or more state information related to one or more processing units in the semiconductor manufacturing apparatus; a step of determining whether a specified operation process of the semiconductor manufacturing apparatus can be implemented based on the one or more state information, and determining that the specified operation process cannot be implemented when at least one of the one or more state information indicates an abnormal state; when it is determined that the specified operation process cannot be implemented, performing the following steps: a step of controlling not to implement the specified operation process; a step of displaying the one or more state information by classifying them into information corresponding to an abnormal state and information corresponding to a normal state; and a step of, in response to a user input designating the state information corresponding to the abnormal state, causing a mobile terminal to display an AR or MR screen for guiding to the position of the processing unit corresponding to the designated state information among the one or more processing units.

[0006] [Aspect 2] According to Aspect 2, based on the method of Aspect 1, it further includes: a step of causing the AR or MR screen on the mobile terminal to display an execution button for instructing the implementation of the specified operation process.

[0007] [Aspect 3] According to Aspect 3, based on the method of Aspect 2, the execution button is displayed in response to the abnormal state of the processed unit guided to the position being released.

[0008] [Method 4] According to Method 4, based on the method of Method 2, while the abnormal state of the above-mentioned position-guided processing unit continues, the above-mentioned execution button is displayed as invalid, and in response to the abnormal state of the above-mentioned position-guided processing unit being resolved, the above-mentioned execution button is displayed as valid.

[0009] [Method 5] According to method 5, based on the method of any one of methods 2 to 4, the one or more pieces of status information are obtained from sensors provided in the one or more processing units.

[0010] [Method 6] According to Method 6, based on the method of Method 5, it also includes: a step of accepting user input indicating the implementation of the above-mentioned specified action process of the above-mentioned semiconductor manufacturing device at the operating terminal of the above-mentioned semiconductor manufacturing device, and in the above-mentioned acquisition step, the above-mentioned one or more status information are acquired from the above-mentioned sensor of the processing unit corresponding to the above-mentioned indicated action process.

[0011] [Method 7] According to method 7, based on the method of method 6, the one or more status information is displayed on the operating terminal, and the user input specifying the status information corresponding to the abnormal state is accepted on the operating terminal.

[0012] [Method 8] According to method 8, based on the method of method 7, the above-mentioned operating terminal is connected to the above-mentioned mobile terminal in a communicative manner.

[0013] [Method 9] According to method 9, based on the method of method 8, it also includes: a step of sending an indication that the execution button displayed on the mobile terminal has been operated from the mobile terminal to the operating terminal.

[0014] [Method 10] According to method 10, based on the method of method 9, it also includes: in response to the above-mentioned indication that the execution button has been operated, the above-mentioned operation process is controlled to implement the above-mentioned prescribed action process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a perspective view showing the overall structure of a plating device according to one embodiment of the present invention.

[0016] Figure 2 It is a plan view showing the overall structure of a plating device according to one embodiment of the present invention.

[0017] Figure 3 This is a configuration diagram of an exemplary system for controlling the operation of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0018] Figure 4AIt is a schematic diagram showing an exemplary specific configuration of a processing unit.

[0019] Figure 4B It is a schematic diagram showing an exemplary specific configuration of a processing unit.

[0020] Figure 5 It is a flowchart showing the operation of a system including a semiconductor manufacturing apparatus according to an embodiment of the present invention.

[0021] Figure 6 It is an example of a display screen for status information.

[0022] Figure 7 It is an example of an AR navigation screen displayed on a portable information terminal. Detailed Description of the Invention

[0023] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and redundant descriptions are omitted.

[0024] Figure 1 It is a perspective view showing the overall configuration of a plating apparatus 1000 according to an embodiment of the present invention. Figure 2 It is a top view showing the overall configuration of a plating apparatus 1000 according to an embodiment of the present invention. The plating apparatus 1000 is an example of a semiconductor manufacturing apparatus. Hereinafter, embodiments of the present invention will be described with reference to the plating apparatus 1000, but the apparatuses and methods disclosed in this specification can be applied to any semiconductor manufacturing apparatus other than the plating apparatus. For example, semiconductor manufacturing apparatuses include, in addition to plating apparatuses, grinding apparatuses (e.g., CMP (Chemical Mechanical Polishing) apparatuses, etc.) for grinding a substrate (semiconductor substrate, glass substrate, etc.) or a film formed on the substrate, film forming apparatuses (e.g., CVD (Chemical Vapor Deposition) apparatuses, evaporation apparatuses, etc.) for forming a film on the substrate, exposure apparatuses for transferring a fine pattern onto a film on the substrate, etching apparatuses for performing fine processing on the substrate or a film on the substrate by etching, ion implantation apparatuses for implanting ions into the substrate or a film on the substrate, cutting apparatuses for cutting the substrate and dicing it into chips, and various inspection apparatuses (or measurement apparatuses) for inspecting the final semiconductor product or intermediate products (including substrates), etc., any apparatuses involved in the manufacture of semiconductor products.

[0025] As Figure 1 、 2As shown, the plating apparatus 1000 includes a loading port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-dipping module 300, a plating module 400, a cleaning module 500, a spin dryer 600, a transfer device 700, and a control module 800.

[0026] The loading port 100 is a module for loading a substrate stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 or unloading the substrate from the plating apparatus 1000 to the cassette. In the present embodiment, four loading ports 100 are arranged and configured in the horizontal direction, but the number and configuration of the loading ports 100 are arbitrary. The transfer robot 110 is a robot for transferring the substrate, and is configured to transfer the substrate between the loading port 100, the aligner 120, and the transfer device 700. When transferring the substrate between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrate via a temporary stage (not shown).

[0027] The aligner 120 is a module for aligning the positioning plane, notch, etc. of the substrate in a specified direction. In the present embodiment, two aligners 120 are arranged and configured in the horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wetting module 200 replaces the air inside the pattern formed on the substrate surface with a treatment liquid by wetting the surface to be plated of the substrate before the plating treatment with a treatment liquid such as pure water or degassed water. The pre-wetting module 200 is configured to perform a pre-wetting treatment, which facilitates the supply of the plating liquid into the pattern by replacing the treatment liquid inside the pattern with the plating liquid during plating. In the present embodiment, two pre-wetting modules 200 are arranged and configured in the vertical direction, but the number and configuration of the pre-wetting modules 200 are arbitrary.

[0028] The pre-dipping module 300 is configured to perform a pre-dipping treatment, which, for example, etches and removes a resistive oxide film on the surface of a seed layer formed on the surface to be plated of the substrate before the plating treatment with a treatment liquid such as sulfuric acid or hydrochloric acid to clean or activate the plating substrate surface. In the present embodiment, two pre-dipping modules 300 are arranged and configured in the vertical direction, but the number and configuration of the pre-dipping modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In the present embodiment, there are two groups of 12 plating modules 400 arranged and configured in three in the vertical direction and four in the horizontal direction, and a total of 24 plating modules 400 are provided, but the number and configuration of the plating modules 400 are arbitrary.

[0029] The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove plating solutions and the like remaining on the substrate after the plating process. In the present embodiment, two cleaning modules 500 are arranged in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for drying the substrate by rotating it at high speed after the cleaning process. In the present embodiment, two spin dryers are arranged in the vertical direction, but the number and arrangement of the spin dryers are arbitrary. The conveying device 700 is a device for conveying the substrate between a plurality of modules in the plating apparatus 1000. The control module 800 is configured to control the plurality of modules of the plating apparatus 1000 and can be constituted by, for example, a general computer or a dedicated computer having an input / output interface with the operator.

[0030] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, the substrate stored in the cassette is carried into the loading port 100. Next, the transfer robot 110 takes out the substrate from the cassette at the loading port 100 and conveys the substrate to the aligner 120. The aligner 120 aligns the positioning plane, notch, etc. of the substrate in a specified direction. The transfer robot 110 transfers the substrate whose direction has been aligned by the aligner 120 to the conveying device 700.

[0031] The conveying device 700 conveys the substrate received from the transfer robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting process on the substrate. The conveying device 700 conveys the substrate that has been subjected to the pre-wetting process to the pre-dipping module 300. The pre-dipping module 300 performs a pre-dipping process on the substrate. The conveying device 700 conveys the substrate that has been subjected to the pre-dipping process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0032] The conveying device 700 conveys the substrate that has been subjected to the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The conveying device 700 conveys the substrate that has been subjected to the cleaning process to the spin dryer 600. The spin dryer 600 performs a drying process on the substrate. The conveying device 700 transfers the substrate that has been subjected to the drying process to the transfer robot 110. The transfer robot 110 conveys the substrate received from the conveying device 700 to the cassette at the loading port 100. Finally, the cassette containing the substrate is taken out from the loading port 100.

[0033] In addition, Figure 1 , Figure 2 the configuration of the plating apparatus 1000 described in Figure 1 , Figure 2 is merely an example, and the structure of the plating apparatus 1000 is not limited to the

[0034] Figure 3FIG. 0 is a configuration diagram of an exemplary system 10 for controlling the operation of a semiconductor manufacturing apparatus (e.g., a plating apparatus) 1000 according to an embodiment of the present invention. The system 10 includes a semiconductor manufacturing apparatus 1000, an operation computer 20, a device controller 30, and a portable information terminal 40. In the system 10, the semiconductor manufacturing apparatus 1000, the operation computer 20, the device controller 30, and the portable information terminal 40 are communicably connected to each other via a communication path such as a local area network (LAN).

[0035] The operation computer 20 is a computer for an operator of the system 10 to operate the semiconductor manufacturing apparatus 1000. For example, the operation computer 20 is installed in an operation room away from the installation site of the semiconductor manufacturing apparatus 1000, and the operator can operate the semiconductor manufacturing apparatus 1000 using the operation computer 20 from the operation room. The operation computer 20 can be implemented by a general-purpose computer having a processor and a memory, and is configured to perform a prescribed operation by the processor reading and executing a prescribed program stored in the memory. Specifically, the operation computer 20 receives an operation instruction for the semiconductor manufacturing apparatus 1000 from the operator of the system 10 (e.g., receives data input via a user interface), and supplies the operation instruction to the device controller 30. In addition, the operation computer 20 receives status information related to the operation status of each part of the semiconductor manufacturing apparatus 1000 from the device controller 30, and notifies it to the operator (e.g., displays it on the screen of a display).

[0036] The device controller 30 is a computer configured to control the operation of the semiconductor manufacturing apparatus 1000. The device controller 30 can be any computer having a processor and a memory. For example, as the device controller 30, a PLC (Programmable Logic Controller) can be preferably used, but the device controller 30 can also be other types of computers. The device controller 30 converts the operation instruction for the semiconductor manufacturing apparatus 1000 sent from the operation computer 20 into a command in a form understandable by the semiconductor manufacturing apparatus 1000 (each part thereof), and supplies the converted command to the semiconductor manufacturing apparatus 1000, thereby controlling the semiconductor manufacturing apparatus 1000. In addition, the device controller 30 collects status information related to the operation status of each part of the semiconductor manufacturing apparatus 1000 and provides it to the operation computer 20. In addition, Figure 1 and Figure 2 the control module 800 shown can correspond to Figure 3 the device controller 30 in

[0037] The portable information terminal 40 is an auxiliary computer terminal for an operator of the system 10 to operate the semiconductor manufacturing apparatus 1000. The portable information terminal 40 can be, for example, any type of information terminal that an operator can carry and use, such as a tablet terminal, a notebook computer, a smart phone, etc. The portable information terminal 40, for example, has a function of communicating with the operation computer 20 via a wireless LAN, and is configured to exchange data required for the operator to operate the semiconductor manufacturing apparatus 1000 at a location outside the setting place of the operation computer 20 (for example, near the semiconductor manufacturing apparatus 1000).

[0038] As Figure 3 shown, the semiconductor manufacturing apparatus 1000 includes one or more processing units 1002. For example, when the semiconductor manufacturing apparatus 1000 is the plating apparatus described in Figure 1 and Figure 2 , each processing unit 1002 in Figure 3 can be any one of the loading port 100, the transfer robot 110, the aligner 120, the pre-wetting module 200, the pre-dipping module 300, the plating module 400, the cleaning module 500, the spin dryer 600, and the transfer device 700 shown in Figure 1 and Figure 2 . Alternatively, each processing unit 1002 may also represent a lower-level element that constitutes the above-described respective parts (100, 110, 120, 200, 300, 400, 500, 600, 700) (for example, any one of the multiple elements that constitute the plating module 400). In addition, when the semiconductor manufacturing apparatus 1000 is a device other than the plating apparatus, Figure 3 each processing unit 1002 can of course correspond to any-level element that constitutes the semiconductor manufacturing apparatus corresponding to the type of the semiconductor manufacturing apparatus.

[0039] Figure 4A and 4B are schematic diagrams showing an exemplary specific configuration of a certain processing unit 1002 for better understanding the following description. In Figure 4A and 4BIn this case, the processing unit 1002 includes a moving body 1004, structures 1006A to 1006D, and sensors 1008A to 1008D. The moving body 1004 can be, for example, a substrate to be processed in the processing unit 1002, or an aggregate of a substrate and a substrate holder holding the substrate. The moving body 1004 can be moved between a first position LOC1 and a second position LOC2 by a conveyance mechanism (not shown). For example, the first position LOC1 can be a position where the substrate is processed (e.g., plating process) in the processing unit 1002, and the second position LOC2 can be a standby position before moving an unprocessed substrate to the first position LOC1 or after moving a processed substrate from the first position LOC1. The structures 1006A to 1006D can be, for example, lids of plating tanks that are opened during use, jigs for fixing substrates in the tanks, etc. The structures 1006A to 1006D can be moved between an interference position and a retracted position by a conveyance mechanism (not shown). The interference position is a position where the movement of the moving body 1004 between the first position LOC1 and the second position LOC2 is obstructed due to the structures 1006A to 1006D being in this location. The retracted position is a position that does not obstruct the movement of the moving body 1004 between the first position LOC1 and the second position LOC2. For example, in Figure 4A the configuration example, the structures 1006A and 1006B are in the retracted position, and the structures 1006C and 1006D are in the interference position. Also, in Figure 4B the configuration example, all the structures 1006A to 1006D are in the retracted position. The sensors 1008A to 1008D are sensors that detect whether the corresponding structures 1006A to 1006D are in the interference position or the retracted position, respectively.

[0040] Figure 5 is a flowchart showing the operation of the system 10 including the semiconductor manufacturing apparatus 1000 according to an embodiment of the present invention. The system 10 cooperates with an operation computer 20, a device controller 30, and a portable information terminal 40 to execute Figure 5 the processing of each step of the flowchart, thereby performing interlock control in the case where the semiconductor manufacturing apparatus 1000 is in an abnormal state, and operating in a manner that enables appropriate recovery from the abnormal state.

[0041] In step 502, the operation computer 20 receives an operation instruction for the semiconductor manufacturing apparatus 1000 from an operator of the system 10. For example, an operator of the system 10 can input a desired operation instruction for the semiconductor manufacturing apparatus 1000 via the user interface of the operation computer 20. The operation instruction can, for example, cause the moving body 1004 in the processing unit 1002 of the semiconductor manufacturing apparatus 1000 to move from the first position LOC1 to the second position LOC2 (refer to Figure 4Aand 4B )。An operation instruction is sent from the operation computer 20 to the apparatus controller 30.

[0042] Next, in step 504, the apparatus controller 30 acquires the state information of the semiconductor manufacturing apparatus 1000. Specifically, the apparatus controller 30 acquires one or more state information items respectively from one or more processing units 1002 of the semiconductor manufacturing apparatus 1000. For example, the one or more state information items may be the operation states of the processing units 1002 detected by sensors 1008A to 1008D (see Figure 4A and 4B ). For example, in the Figure 4A configuration example, the apparatus controller 30 acquires state information (e.g., "ON") indicating that the structures 1006A and 1006B are in the retracted positions from sensors 1008A and 1008B respectively, and acquires state information (e.g., "OFF") indicating that the structures 1006C and 1006D are in the interfering positions from sensors 1008C and 1008D respectively.

[0043] Next, in step 506, the apparatus controller 30 determines whether the operation process of the semiconductor manufacturing apparatus 1000 corresponding to the operation instruction from the operator in step 502 can be performed based on the state information acquired in step 504. For example, continuing the above example, the apparatus controller 30 determines whether the operation process of moving the moving body 1004 of the processing unit 1002 from the first position LOC1 to the second position LOC2 can be performed based on the state information (e.g., the state information obtained from sensors 1008A to 1008D).

[0044] More specifically, for example, when the structures 1006A to 1006D in the processing unit 1002 are configured as Figure 4A , the structures 1006C and 1006D are in a state (abnormal state) where they will contact the moving body 1004 that has moved from the first position LOC1. State information "OFF" corresponding to such an abnormal state is acquired from sensors 1008C and 1008D. To prevent damage to the moving body 1004 (e.g., a substrate) and the structures 1006C and 1006D, the apparatus controller 30 determines not to perform the operation process of moving the moving body 1004 from the first position LOC1 to the second position LOC2. When at least one state information item is "OFF", the apparatus controller 30 may determine not to perform the operation process of moving the moving body 1004 from the first position LOC1 to the second position LOC2.

[0045] On the other hand, when the structures 1006A to 1006D of the processing unit 1002 are as Figure 4BIn the case of such a configuration, there is no contact between the moving body 1004 that has moved from the first position LOC1 and each of the structures 1006A to 1006D (normal state). In this case, the state information "ON" corresponding to the normal state is obtained from all the sensors 1008A to 1008D, and the device controller 30 determines that the operation process of moving the moving body 1004 from the first position LOC1 to the second position LOC2 can be implemented.

[0046] In the case where it is determined in the above step 506 that the operation process of the semiconductor manufacturing apparatus 1000 can be implemented, the process proceeds to step 508. In step 508, the device controller 30 sends a command instructing the implementation of this operation process (for example, the movement of the moving body 1004 from the first position LOC1 to the second position LOC2) to the semiconductor manufacturing apparatus 1000. Thereby, the semiconductor manufacturing apparatus 1000 executes the operation instructed by the operator in step 502.

[0047] When it is determined in the above step 506 that the operation process of the semiconductor manufacturing apparatus 1000 is not implemented (not executable), the process proceeds to step 510. In step 510, the device controller 30 controls the semiconductor manufacturing apparatus 1000 so as not to implement this operation process (for example, the movement of the moving body 1004 from the first position LOC1 to the second position LOC2). Specifically, a command instructing the implementation of this operation process is not sent to the semiconductor manufacturing apparatus 1000. Thereby, the operation instructed by the operator in step 502 is not executed in the semiconductor manufacturing apparatus 1000. In this way, through the processing of steps 506 to 510, the interlock control of executing the operation process of the semiconductor manufacturing apparatus 1000 only when specified conditions are satisfied (for example, the state information from all the sensors 1008A to 1008D is "ON") is achieved.

[0048] Subsequent to the above step 510 (that is, in the case where the operation process of the semiconductor manufacturing apparatus 1000 is not implemented), in step 512, the device controller 30 sends the state information of the semiconductor manufacturing apparatus 1000 obtained in step 504 to the operation computer 20, and the operation computer 20 receives this state information and notifies the operator. Specifically, the operation computer 20 classifies one or more pieces of state information obtained from the device controller 30 into information corresponding to an abnormal state and information corresponding to a normal state and displays them on the screen of the display.

[0049] Figure 6 is an example of a display screen of the state information. In Figure 6In the example, the display screen includes a list 602 of all sensors (such as sensors 1008A to 1008D) of the processing unit 1002 where an abnormality has occurred, and an identification display 604 indicating whether the status information from each sensor is abnormal or normal. The identification display 604 can, for example, use a circle of a first color or brightness to represent an abnormal state, and a circle of a second color or brightness different from the first color or brightness to represent a normal state. In Figure 6 the example, it is shown that the status information from sensors 1008C and 1008D is in an abnormal state, and the status information from sensors 1008A and 1008B is in a normal state. By observing such a display screen on the monitor of the operation computer 20, the operator of the system 10 can easily grasp which processing unit 1002 in the semiconductor manufacturing apparatus 1000 has what kind of abnormality.

[0050] In Figure 6 the example, the display screen further includes a "navigation display" button 606 corresponding to each sensor in the list. The "navigation display" button 606 is a button for using the portable information terminal 40 to display and guide the position of the operator of the system 10 to the abnormality occurrence site of the semiconductor manufacturing apparatus 1000. The display screen may further include a "help" button 608, which is used to display instructions (such as operation manuals) related to the sensor that has reported an abnormal state and / or the structure (such as structures 1006A to 1006D) corresponding to the sensor on the monitor of the operation computer 20.

[0051] In step 514 following step 512, the operation computer 20 determines whether a user input specifying the status information corresponding to the abnormal state has been made. This determination can be based on whether the "navigation display" button 606 on the display screen of the operation computer 20 has been pressed. For example, in Figure 6 the case where any one of the identification displays 604 in the display screen example shows an abnormal state, the operator of the system 10 needs to move to the abnormality occurrence site of the semiconductor manufacturing apparatus 1000 to confirm the actual condition of the apparatus, or perform adjustment or repair of the abnormal site. In this case, the operator presses the "navigation display" button 606 corresponding to the abnormal state on the display screen.

[0052] If the above user input is performed (e.g., the operation of the "Navigation Display" button 606), then in step 516, the computer 20 operates to send the identification information of the processing unit 1002 (and / or the sensors and structures related to the abnormal state within the processing unit 1002) related to the state information of the abnormal state specified by the user input to the portable information terminal 40. Based on the identification information, the portable information terminal 40 displays a navigation screen for guiding the operator to the position of the processing unit 1002 corresponding to the abnormal occurrence site of the semiconductor manufacturing apparatus 1000 (or the position of the sensors or structures within the processing unit 1002) on the display of the portable information terminal 40. The navigation screen can be, for example, an AR (Augmented Reality) screen or an MR (Mixed Reality) screen.

[0053] Figure 7 is an example of an AR navigation screen displayed on the portable information terminal 40. As Figure 7 shown, the AR navigation screen includes a background image 702 and a guidance display 704. The background image 702 is a live image captured by the camera mounted on the portable information terminal 40. The guidance display 704 shows, for example, the direction of the abnormal occurrence site of the semiconductor manufacturing apparatus 1000 as the position guidance destination through an arrow image. The portable information terminal 40 can detect the current position of the portable information terminal 40 and the direction in which the portable information terminal 40 is facing using known existing technologies, and can use them to calculate the relative position and relative direction between the portable information terminal 40 and the abnormal occurrence site of the semiconductor manufacturing apparatus 1000, and update and display the guidance display 704 at any time according to the calculation results. The operator of the system 10 can quickly determine the abnormal occurrence site of the semiconductor manufacturing apparatus 1000 by observing the guidance display 704 on the background image 702 of the real world.

[0054] The AR navigation screen further includes an "Execute" button 706 and a "Reset" button 708. The "Execute" button 706 is a button for executing the operation process of the semiconductor manufacturing apparatus 1000 that was not executed due to the interlock control in step 510 through an operation from the portable information terminal 40. The "Reset" button 708 is a button for resetting (e.g., restarting) the entire semiconductor manufacturing apparatus 1000 or the processing unit 1002 where an abnormality has occurred. The AR navigation screen may also further include a "Help" button 710 similar to the "Help" button 608 on the display screen of Figure 6 and may be able to display an instruction manual or the like corresponding to the abnormal part (sensor, etc.) on the AR navigation screen.

[0055] If an operator of the system 10 arrives at the site where an abnormality has occurred in the semiconductor manufacturing apparatus 1000 (identifies the site where the abnormality has occurred) with reference to the navigation screen of the portable information terminal 40, the operator confirms the details of the abnormality and performs adjustments and repairs on the equipment related to the abnormality (such as sensors 1008A to 1008D and structures 1006A to 1006D).

[0056] In step 518, the operation computer 20 acquires the latest status information of the semiconductor manufacturing apparatus 1000 via the apparatus controller 30 and determines whether all the status information displayed as an abnormal state in the status information display screen (refer to Figure 6 ) has been corrected to a normal state (for example, by adjustment and repair operations performed by the operator). For example, in the above Figure 4A and Figure 6 example, the status information from sensors 1008C and 1008D has become an abnormal state. The operation computer 20 determines whether the status information from sensors 1008C and 1008D has both changed from an abnormal state to a normal state. When the status information from sensor 1008C and the status information from sensor 1008D have both changed from an abnormal state to a normal state, and the status information from all sensors 1008A to 1008D has become normal, it means that the operation process of moving the moving body 1004 from the first position LOC1 to the second position LOC2 can be implemented.

[0057] When it is confirmed in step 518 that all the status information is in a normal state, the operation computer 20 can notify this fact to the portable information terminal 40, and the portable information terminal 40 can also respond to this notification to display the "Execute" button 706 on the AR navigation screen (that is, the "Execute" button 706 is not displayed on the AR navigation screen before receiving this notification, and the "Execute" button 706 starts to be displayed on the AR navigation screen after receiving this notification). Alternatively, before receiving this notification, the "Execute" button 706 can be displayed in a disabled state on the AR navigation screen, and the disabled "Execute" button 706 can be enabled in response to this notification. Thus, it is possible to avoid erroneously implementing the operation process of the semiconductor manufacturing apparatus 1000 due to the operation of the "Execute" button 706 of the portable information terminal 40 although the abnormal state has not been eliminated.

[0058] In addition, the system 10 may also include a plurality of portable information terminals 40, and a plurality of operators may each hold a portable information terminal 40 to perform operations. In this case, restrictions may be imposed so that the "execute" button 706 can be pressed only from one of the plurality of portable information terminals 40. For example, an "operable" button may be displayed in addition to the "execute" button 706 on the AR navigation screen of each portable information terminal 40 (the "execute" button 706 cannot be pressed at this moment), and if the "operable" button is pressed in any portable information terminal 40, the "execute" button 706 can be pressed only in the portable information terminal 40 (the "execute" button 706 in the other portable information terminals 40 remains in an unpressable state).

[0059] If it is determined in step 518 that all status information is in a normal state, the process proceeds to step 520, and the portable information terminal 40 determines whether the "Execute" button 706 on the AR navigation screen has been pressed. If the "Execute" button 706 is pressed, the portable information terminal 40 notifies the operating computer 20 of the subject matter. Next, in step 522, the operating computer 20 responds to the notification and instructs the device controller 30 to implement the action process of the semiconductor manufacturing device 1000 that has not been implemented due to the interlocking control (for example, the movement of the movable body 1004 from the first position LOC1 to the second position LOC2). Thus, the action process is executed in the semiconductor manufacturing device 1000. In this way, after the abnormal state is resolved, the action process of the semiconductor manufacturing device 1000 can be started by an operation from the portable information terminal 40 (for example, without returning to the setting location of the operating computer 20).

[0060] Above, the embodiments of the present invention are described based on several examples, but the embodiments of the invention described above are intended to facilitate the understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from its main purpose, and the present invention certainly also includes its equivalents. In addition, within the scope of at least a part of the above-mentioned problem that can be solved or within the scope of at least a part of the effect, any combination or omission of the various constituent elements described in the scope of the present application and the specification can be performed.

[0061] Description of Reference Numerals

[0062] 100…Loading port; 110…Conveyor robot; 120…Aligner; 200…Pre-wetting module; 300…Pre-impregnation module; 400…Plating module; 500…Cleaning module; 600…Spin dryer; 700…Conveying device; 800…Control module; 10…System; 20…Operation computer; 30…Device controller; 40…Portable information terminal; 1000…Plating device; 1002…Processing unit; 1004…Moving body; 1006…Structure; 1008…Sensor.

Claims

1. A method, which is an operation method for recovering a semiconductor manufacturing apparatus from an abnormal state, is characterized in that Comprising: Steps of obtaining one or more status information related to one or more processing units in the semiconductor manufacturing apparatus; Steps of determining whether a specified operation process of the semiconductor manufacturing apparatus can be implemented based on the one or more status information, and determining that the specified operation process cannot be implemented when at least one of the one or more status information indicates an abnormal state; When it is determined that the specified operation process cannot be implemented, performing the following steps: Steps of controlling not to implement the specified operation process; Steps of classifying the one or more status information into information corresponding to an abnormal state and information corresponding to a normal state for display; And Steps of causing a mobile terminal to display an AR or MR screen for guiding the position of the processing unit corresponding to the specified status information among the one or more processing units in response to a user input designating the status information corresponding to the abnormal state.

2. The method according to claim 1, characterized in that Further comprising: Steps of causing the AR or MR screen on the mobile terminal to display an execution button for indicating the implementation of the specified operation process.

3. The method according to claim 2, wherein The execution button is displayed in response to the abnormal state of the processed unit guided by the position being released.

4. The method according to claim 2, wherein During the period when the abnormal state of the processed unit guided by the position persists, the execution button is displayed in an invalidated manner, and the execution button is displayed in a validated manner in response to the abnormal state of the processed unit guided by the position being released.

5. The method according to any one of claims 2 to 4, wherein The one or more status information are obtained from sensors provided in the one or more processing units.

6. The method according to claim 5, wherein Further comprising: Steps of receiving, at an operation terminal of the semiconductor manufacturing apparatus, a user input instructing the implementation of the specified operation process of the semiconductor manufacturing apparatus, In the step of performing the obtaining, the one or more status information are obtained from the sensors of the processing unit corresponding to the instructed operation process.

7. The method according to claim 6, wherein The one or more status information are displayed at the operation terminal, The user input designating the status information corresponding to the abnormal state is received at the operation terminal.

8. The method according to claim 7, wherein The operation terminal is communicably connected to the mobile terminal.

9. The method according to claim 8, wherein Further comprising: Steps of sending an indication that the execution button displayed on the mobile terminal has been operated from the mobile terminal to the operation terminal.

10. The method according to claim 9, wherein Further comprising: Steps of controlling to implement the specified operation process in response to the operation terminal receiving the indication that the execution button has been operated.

Images