A semiconductor automatic packaging machine with integrated intelligent positioning function

Abstract

The application discloses a semiconductor automatic packaging machine with integrated intelligent positioning function, which comprises an openable and closable shell, a conveying belt arranged longitudinally in the shell, a tray for placing a substrate continuously conveyed on the conveying belt, a transverse servo guide rail erected above the conveying belt, a longitudinal servo guide rail slidingly arranged on the transverse servo guide rail, a suction nozzle arranged in the longitudinal servo guide rail, three-dimensional positioning realized through the cooperative movement of the transverse servo guide rail and the longitudinal servo guide rail, a plurality of flying feeder linearly arranged along one side of the conveying belt and used for supplying different specifications of chips, and an alignment assembly comprising supports symmetrically arranged on both sides of the conveying belt, each of the supports being provided with a side plate slidingly connected through a slide rod on one side of the support towards the center of the conveying belt. Compared with the prior art, the application introduces a layered support structure, which can compensate for pressure and stabilize the interlayer gap in real time during the welding process.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to an automated semiconductor packaging machine with integrated intelligent positioning function. Background Technology

[0002] As semiconductor devices rapidly evolve towards higher performance, miniaturization, and higher integration, 3D packaging technology, with its significant space utilization advantage, has become a key path to overcome the bottlenecks of traditional planar packaging. 3D packaging vertically stacks multiple chips or chip layers, utilizing through-silicon vias (TSVs) and bumps to achieve interlayer electrical signal transmission, which can significantly shorten interconnect length, reduce signal delay, and improve system energy efficiency.

[0003] The core of 3D packaging lies in the precise stacking and interconnection of multi-layer chips. Its process typically includes chip pick-up, inter-layer alignment, temporary fixation, and reflow soldering. Traditional packaging equipment often uses multi-axis robotic arms to complete chip picking, placement, and stacking. However, its positioning accuracy is limited by the robotic arm's repeatability and the accumulation of kinematic errors. Especially in multi-layer stacking, the robotic arm's layer-by-layer positioning error amplifies exponentially, leading to a higher inter-layer misalignment rate. Furthermore, the robotic arm lacks real-time feedback and dynamic compensation mechanisms. When the chip experiences slight displacement due to thermal expansion or mechanical stress, the system cannot actively correct the positional deviation, ultimately affecting the packaging yield.

[0004] During reflow soldering, the weight and soldering pressure of the upper-layer chip are transferred to the lower-layer chip through microbumps, causing excessive solder collapse. This collapse not only creates a risk of short circuits between adjacent bumps but also leads to interface cracks due to stress concentration, reducing product lifespan. Existing technologies attempt to mitigate this problem by lowering the soldering temperature or using high-hardness solder, but this sacrifices solder strength or increases process complexity.

[0005] Therefore, it is necessary to provide an automated semiconductor packaging machine with integrated intelligent positioning function to solve the problems mentioned in the background art. Summary of the Invention

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor automated packaging machine with integrated intelligent positioning function, comprising:

[0007] An openable and closable housing, wherein a longitudinally arranged conveyor belt is provided inside the housing, and a tray for placing a substrate is continuously conveyed on the conveyor belt.

[0008] A transverse servo guide rail is mounted above the conveyor belt;

[0009] The longitudinal servo guide rail is slidably mounted on the transverse servo guide rail;

[0010] A suction nozzle is arranged in the longitudinal servo guide, and three-dimensional positioning is achieved through the coordinated movement of the transverse servo guide and the longitudinal servo guide.

[0011] A plurality of flying feeders are linearly arranged along one side of the conveying belt to supply chips of different specifications.

[0012] A positioning assembly includes supports symmetrically arranged on both sides of the conveying belt, and each support is provided with a side plate slidably connected through a slide rod on one side facing the center of the conveying belt.

[0013] Further, as a preferred, one side of the suction nozzle is fixed with a welding device slidably connected to the longitudinal servo guide.

[0014] Further, as a preferred, the ends of the slide rods away from the side plates are each hinged with a connecting rod, a slide rail parallel to the running direction of the conveying belt is fixed between the two supports, a sliding block is slidably arranged in the slide rail, and the two connecting rods are each hinged to the sliding block.

[0015] The end of the slide rail is fixed with an electric push rod, and the telescopic shaft of the electric push rod is fixed to the sliding block.

[0016] Further, as a preferred, a plurality of vertically arranged quartz pieces are horizontally arranged in each side plate, and a front and back of the side plate away from the center of the conveying belt is each slidably arranged with an insertion block embedded in the quartz pieces.

[0017] Further, as a preferred, an end plate perpendicular to the running direction of the conveying belt is fixed in the insertion block.

[0018] A pull rod is hinged in the insertion block, and the two pull rods in the same side plate are each hinged to one end of a rotating rod, the center of the rotating rod is fixed with a spline shaft, and the spline shaft is rotatably arranged in the corresponding support.

[0019] Further, as a preferred, the spline shaft is connected with a gear through a ball spline sleeve, the gear is rotatably arranged in the corresponding support, and a driving motor for driving the gear is also arranged in the support.

[0020] Further, as a preferred, a plurality of vertical insertion pieces are inserted into the end plate, and the insertion pieces are movably connected with the end plate.

[0021] Further, as a preferred, a through tooth groove is formed in each insertion piece, and a tooth shaft is commonly inserted into the tooth grooves of each insertion piece in the same end plate, and the tooth shaft is rotatably connected with the end plate with a certain looseness.

[0022] Further, as a preferred, the quartz pieces are slidably connected with the side plate in the transverse direction.

[0023] The insert block is stacked with multiple laminates, and each quartz sheet is inserted into the gap of the laminates;

[0024] The outer slide groove and the inner slide groove are respectively arranged in the laminates, and the outer slide groove and the inner slide groove are connected through the arc-shaped slide groove;

[0025] The sliding sheet is fixed in the quartz sheet, and the sliding sheet is arranged in the outer slide groove or the inner slide groove or the arc-shaped slide groove.

[0026] Further, as preferred, the positions of the arc-shaped slide grooves of each laminate in the same insert block are different;

[0027] When the two insert blocks in the same side plate move from the farthest point to each other, the positions of the arc-shaped slide grooves of different laminates make the quartz sheets sequentially extend out of the side plate from bottom to top

[0028] Compared with the prior art, the beneficial effects of the present application are:

[0029] In the present application, the symmetrical alignment assembly drives two connecting rods through the electric push rod, ensures that the two side plates always keep mirror-symmetrical movement, positions the chip left and right, effectively eliminates the center deviation phenomenon when the chip is stacked, and controls the front and rear positioning of the insert sheet through the driving motor.

[0030] In the present application, the layered gradual entry type quartz sheet support is adopted, the slide grooves of the laminates are designed, the quartz sheets sequentially extend out from bottom to top according to the stacking order, can be accurately inserted into the gap of the chip, and form a physical support barrier during reflow soldering. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a whole structure schematic diagram of a semiconductor automatic packaging machine with integrated intelligent positioning function;

[0032] Figure 2 It is a structure schematic diagram in the conveying belt;

[0033] Figure 3 It is a top view structure schematic diagram of the alignment assembly;

[0034] Figure 4 It is a whole structure schematic diagram of the alignment assembly;

[0035] Figure 5 It is a structure schematic diagram of the side plate;

[0036] Figure 6 It is a structure schematic diagram of the sliding sheet in the insert block at the outer slide groove;

[0037] Figure 7 It is a structure schematic diagram of the sliding sheet in the insert block at the inner slide groove;

[0038] In the figure: 1, the shell; 2, the conveyor belt; 3, the transverse servo guide rail; 4, the longitudinal servo guide rail; 5, the suction nozzle; 6, the flying probe feeder; 7, the welding device; 8, the alignment assembly; 81, the bracket; 82, the side plate; 821, the quartz piece; 822, the rotating rod; 823, the pull rod; 824, the spline shaft; 825, the gear; 83, the sliding rod; 84, the connecting rod; 85, the sliding rail; 851, the sliding block; 86, the electric push rod; 87, the end plate; 871, the insert piece; 872, the gear slot; 873, the gear shaft; 88, the insert block; 881, the laminated sheet; 882, the outer sliding groove; 883, the inner sliding groove; 884, the arc-shaped sliding groove; 885, the sliding piece; 89, the driving motor; 9, the tray. DETAILED DESCRIPTION

[0039] Referring to Figures 1-7 In an embodiment of the present application, a semiconductor automatic packaging machine with integrated intelligent positioning function comprises:

[0040] The shell 1 is openable and closable, and the shell 1 is provided with a conveyor belt 2 arranged longitudinally inside the shell 1, and the conveyor belt 2 continuously conveys a tray 9 for placing a substrate;

[0041] The transverse servo guide rail 3 is erected above the conveyor belt 2;

[0042] The longitudinal servo guide rail 4 is slidingly arranged on the transverse servo guide rail 3;

[0043] The suction nozzle 5 is arranged in the longitudinal servo guide rail 4, and three-dimensional positioning is achieved through the coordinated movement of the transverse servo guide rail 3 and the longitudinal servo guide rail 4;

[0044] A plurality of flying probe feeders 6 are linearly arranged along one side of the conveyor belt 2, and are used to supply chips of different specifications;

[0045] The alignment assembly 8 comprises brackets 81 symmetrically arranged on both sides of the conveyor belt 2, and each bracket 81 is provided with a side plate 82 slidingly connected by a sliding rod 83 on the side facing the center of the conveyor belt 2.

[0046] That is, the suction nozzle 5 can be driven by the transverse servo guide rail 3 and the longitudinal servo guide rail 4 to sequentially take the chips in the different flying probe feeders 6 and stack them on the substrate on the tray 9 passing through the center of the alignment assembly 8, thereby achieving 3D packaging of the chips, and the chips on the substrate can be aligned left and right by moving the side plates 82 on both sides to the center, thereby playing a positioning role.

[0047] In this embodiment, the suction nozzle 5 is fixed on one side and slidingly connected to the welding device 7 in the longitudinal servo guide rail 4.

[0048] The welding mode of the welding device 7 can be hot air reflow soldering or infrared reflow soldering. After the chips are stacked on the substrate and aligned, the welding device 7 is aligned with the position where the substrate is located, and the chips can be welded and packaged.

[0049] In the embodiment, the two sliding rods 83 are hinged with connecting rods 84 at one end away from the side plates 82, the two supports 81 are fixed with sliding rails 85 parallel to the running direction of the conveying belt 2, the sliding rails 85 are slidably provided with sliding blocks 851, and the two connecting rods 84 are hinged into the sliding blocks 851.

[0050] The sliding rails 85 are fixed with electric push rods 86 at the ends, and the telescopic shafts of the electric push rods 86 are fixed into the sliding blocks 851.

[0051] That is, the electric push rods 86 can drive the sliding blocks 851 to slide, so that the two connecting rods 84 synchronously drive the two sliding rods 83 to slide, and the two side plates 82 are close to or away from each other, and the positions are always symmetrical.

[0052] In the embodiment, a plurality of vertical quartz pieces 821 are horizontally arranged in each side plate 82, and front and back of one side of the side plate 82 away from the center of the conveying belt 2 are slidably provided with plug blocks 88 embedded in the quartz pieces 821.

[0053] The quartz pieces 821 are inserted into the gaps between each layer of chips to support each layer of chips. When the welding device 7 heats the chips to melt the bumps at the welding points, the welding points can be prevented from collapsing, and the bump spacing between the upper and lower layers of chips remains unchanged.

[0054] In the embodiment, the plug blocks 88 are fixed with end plates 87 perpendicular to the running direction of the conveying belt 2.

[0055] The plug blocks 88 are hinged with pull rods 823, and the two pull rods 823 in the same side plate 82 are respectively hinged to the two ends of a rotating rod 822, the center of the rotating rod 822 is fixed with a spline shaft 824, and the spline shaft 824 is rotatably arranged in the corresponding support 81.

[0056] In the embodiment, the spline shaft 824 is connected with a gear 825 through a ball spline sleeve, the gear 825 is rotatably arranged in the corresponding support 81, and the support 81 is also provided with a driving motor 89 for driving the gear 825.

[0057] The spline shaft 824 can slide in the gear 825 through the ball spline sleeve with the movement of the side plate 82, and the gear 825 can drive the spline shaft 824 to rotate through the driving motor 89 to adjust the inclination angle of the rotating rod 822, so that the pull rod 823 pulls the two plug blocks 88 close to or away from each other, and the end plate 87 can align the front and back of the chips.

[0058] In this embodiment, a plurality of vertical inserts 871 are inserted into the end plate 87, and the inserts 871 are movably connected to the end plate 87.

[0059] In this embodiment, a through tooth groove 872 is formed in each of the inserts 871, and a tooth shaft 873 is commonly inserted into the tooth groove 872 of each of the inserts 871 in the same end plate 87, and the tooth shaft 873 is rotatably connected to the end plate 87.

[0060] By adjusting the number of rotation of the tooth shaft 873, the front and back positions of each of the inserts 871 in the end plate 87 can be quickly adjusted, so that when the inserts 88 are close to each other to the closest point, the inserts 871 are just attached to the front end or the rear end of the chip.

[0061] In this embodiment, the quartz sheet 821 is transversely slidably connected to the side plate 82.

[0062] A plurality of laminates 881 are fixedly stacked in the insert block 88, and each of the quartz sheets 821 is inserted into the gap of the laminate 881.

[0063] An outer sliding groove 882 and an inner sliding groove 883 are respectively formed in the laminate 881, and the outer sliding groove 882 and the inner sliding groove 883 are transitioned by an arc-shaped sliding groove 884.

[0064] A sliding sheet 885 is fixed in the quartz sheet 821, and the sliding sheet 885 is slidably arranged in the outer sliding groove 882 or the inner sliding groove 883 or the arc-shaped sliding groove 884.

[0065] That is, when the insert block 88 slides forward and backward, the sliding sheet 885 will switch in the outer sliding groove 882 and the inner sliding groove 883, so that the quartz sheet 821 extends out of the side plate 82 or shrinks into the side plate 82.

[0066] In this embodiment, the arc-shaped sliding groove 884 of each of the laminates 881 in the same insert block 88 is different in front and back positions.

[0067] When the two insert blocks 88 in the same side plate 82 are close to each other from the most distant point, the positions of the arc-shaped sliding grooves 884 of the different laminates 881 make the quartz sheets 821 extend out of the side plate 82 in turn from bottom to top.

[0068] That is, during the process of the two insert blocks 88 approaching each other, the lowest quartz sheet 821 first extends out of the side plate 82, and when the suction nozzle 5 puts down the chip of the upper layer, the side edge of the chip is pressed on the quartz sheet 821 of the layer, and the two insert blocks 88 continue to approach to make the quartz sheet 821 of the upper layer extend out of the side plate 82, and then the suction nozzle 5 continues to put down the chip of the upper layer, so as to ensure that the chips and the quartz sheets 821 are stacked in turn.

[0069] In a specific implementation, the suction nozzle 5 moves to the target flying feeder 6 above the suction chip, and then moves to the designated coordinates above the substrate to release the chip to the surface of the substrate.

[0070] The electric push rod 86 pushes the sliding block 851, and the two side sliding rods 83 are connected through the connecting rod 84, so that the side plate 82 pushes the chip to the central symmetric position.

[0071] After the first layer of chips is placed, the driving motor 89 is started, the gear 825 drives the spline shaft 824 to rotate, the rotating rod 822 tilts and pulls the pull rod 823, so that the two insertion blocks 88 are close to each other, and the bottom quartz sheet 821 first extends out of the side plate 82 and is inserted into the gap between the chip and the substrate.

[0072] After each layer of chips is completed, the two insertion blocks 88 continue to approach, and the quartz sheets 821 are sequentially extended from bottom to top to support the newly stacked chips.

[0073] After the two insertion blocks 88 approach to the uppermost quartz sheet 821, the insertion block 871 precisely fits the front and rear edges of the chip.

[0074] The suction nozzle 5 carrying the welding device 7 moves above the substrate to heat the chip welding point to a molten state, and the quartz sheet 821 supports the gap between the chip layers to prevent the welding point from collapsing and ensure the stability of the bump spacing.

[0075] After welding is completed, the two insertion blocks 88 move to the farthest point, and all the quartz sheets 821 are completely withdrawn into the side plate 82, and the side plate 82 is away from the side of the chip.

[0076] The conveyor belt 2 is started to transport the completed packaged substrate to the end, take out the tray 9 and transfer to the next process.

[0077] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical solution and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A semiconductor automated packaging machine with integrated intelligent positioning function, characterized in that, include: An openable and closable housing (1) is provided inside the housing (1) with a longitudinally arranged conveyor belt (2) continuously conveying a tray (9) for placing a substrate. A transverse servo guide rail (3) is mounted above the conveyor belt (2); The longitudinal servo rail (4) is slidably mounted on the transverse servo rail (3); The suction nozzle (5) is set in the longitudinal servo rail (4) and achieves three-dimensional positioning through the coordinated movement of the transverse servo rail (3) and the longitudinal servo rail (4); Multiple feeders (6) are arranged linearly along one side of the conveyor belt (2) for supplying chips of different specifications; The alignment assembly (8) includes brackets (81) symmetrically arranged on both sides of the conveyor belt (2), and each bracket (81) has a side plate (82) slidably connected to the center of the conveyor belt (2) by a slide bar (83). Each of the side plates (82) has multiple vertically arranged quartz plates (821) horizontally penetrating through it. The side plate (82) away from the center of the conveyor belt (2) has inserts (88) that are slidably embedded in the quartz plates (821) on its front and back sides respectively. The quartz plate (821) and the side plate (82) are slidably connected laterally; Multiple stacked plates (881) are fixedly stacked inside the insert block (88), and each quartz plate (821) is inserted into the gap between the stacked plates (881); The stacked pieces (881) are provided with an outer sliding groove (882) and an inner sliding groove (883), and the outer sliding groove (882) and the inner sliding groove (883) are connected by an arc-shaped sliding groove (884); A sliding piece (885) is fixed in the quartz plate (821), and the sliding piece (885) is slidably disposed in the outer sliding groove (882), the inner sliding groove (883), or the arc-shaped sliding groove (884); The arc-shaped groove (884) of each stacked piece (881) in the same insert (88) has different front and rear positions; Furthermore, when two inserts (88) in the same side plate (82) approach each other from the farthest point, the position of the arc-shaped groove (884) of the different stacked pieces (881) causes the quartz pieces (821) to extend out of the side plate (82) from bottom to top.

2. The semiconductor automatic packaging machine with integrated intelligent positioning function according to claim 1, characterized in that, A welding device (7) is fixed to one side of the suction nozzle (5) and slidably connected to the longitudinal servo guide rail (4).

3. A semiconductor automatic packaging machine with integrated intelligent positioning function according to claim 1, characterized in that, The ends of the slide rods (83) on both sides away from the side plate (82) are all hinged with connecting rods (84). A slide rail (85) parallel to the running direction of the conveyor belt (2) is fixed between the two supports (81). A slider (851) is slidably arranged in the slide rail (85). Both connecting rods (84) are hinged to the slider (851). An electric push rod (86) is fixed to the end of the slide rail (85), and the telescopic shaft of the electric push rod (86) is fixed to the slider (851).

4. A semiconductor automatic packaging machine with integrated intelligent positioning function according to claim 1, characterized in that, An end plate (87) perpendicular to the running direction of the conveyor belt (2) is fixed in the insert (88); A pull rod (823) is hinged in the insert (88). Two pull rods (823) in the same side plate (82) are respectively hinged to the two ends of a rotating rod (822). A spline shaft (824) is fixed at the center of the rotating rod (822). The spline shaft (824) is rotatably set in the bracket (81) on the corresponding side.

5. A semiconductor automatic packaging machine with integrated intelligent positioning function according to claim 4, characterized in that, The spline shaft (824) is connected to a gear (825) via a ball spline sleeve. The gear (825) is rotatably mounted in a corresponding bracket (81). The bracket (81) is also equipped with a drive motor (89) for driving the gear (825).

6. A semiconductor automatic packaging machine with integrated intelligent positioning function according to claim 5, characterized in that, Multiple vertical inserts (871) are inserted into the end plate (87), and the inserts (871) are movably connected to the end plate (87).

7. A semiconductor automatic packaging machine with integrated intelligent positioning function according to claim 6, characterized in that, Each insert (871) has a through toothed groove (872), and a toothed shaft (873) runs through the toothed groove (872) of each insert (871) in the same end plate (87). The toothed shaft (873) can be loosely or tightly rotatably connected to the end plate (87).

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