Liquid cooling direct contact type heat dissipation mechanism based on Sic silicon carbide power filter

Abstract

The invention provides a liquid cooling direct contact type heat dissipation mechanism based on a Sic silicon carbide power filter. The liquid cooling direct contact type heat dissipation mechanism comprises a heat dissipation substrate, a cooling liquid circulation system and heat dissipation fins. The heat dissipation substrate is in contact with a heating device of the Sic silicon carbide power filter, the heat dissipation substrate is connected with the heating device through an elastic buffer connecting assembly, the cooling liquid circulation system comprises a cooling liquid pump, a cooling liquid box and a connecting pipeline, and the heat dissipation fins are connected with the heat dissipation substrate in an embedded mode. Through the liquid cooling direct contact type design, the cooling liquid is in direct contact with the heating device, the thermal resistance is greatly reduced, and the heat dissipation efficiency is improved. Compared with a traditional heat dissipation mode, heat generated by the Sic silicon carbide power filter can be dissipated more quickly and effectively, and it is ensured that the device works stably at a low temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of power equipment, and particularly to a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter. Background Art

[0002] In the process of the rapid development of modern power systems towards high power, high efficiency, and high reliability, Sic silicon carbide devices are increasingly widely used in the field of power filters due to their excellent characteristics. With the continuous advancement of the construction of smart grids, the power system has increasingly stringent requirements for power quality. Sic silicon carbide power filters can effectively suppress harmonics and compensate reactive power, playing a key role in ensuring the stable operation of the power grid and improving power quality. For example, in the scenario of distributed energy access to the power grid, Sic silicon carbide power filters can eliminate harmonic interference generated by distributed power sources such as photovoltaic and wind power, ensuring the smooth integration of electric energy into the grid.

[0003] However, although Sic silicon carbide devices have excellent performance, they generate a large amount of heat during operation. This is mainly due to their operation under high power density conditions, with a large current density, and significant energy losses accompany the electron migration process inside the device. When the device temperature is too high, the carrier mobility will decrease, resulting in an increase in the on-resistance, which further increases the power loss of the device, forming a vicious cycle. Being in a high-temperature environment for a long time will also accelerate the aging of the internal materials of the device, reduce its reliability, shorten its service life, and even cause thermal breakdown of the device in severe cases, resulting in the failure of the entire power filter system.

[0004] In the industrial production field, such as the steel and chemical industries, the operation of a large number of power electronic devices places extremely high requirements on the heat dissipation performance of power filters. The production environments in these industries are often relatively harsh, with adverse factors such as high temperature, high humidity, and strong electromagnetic interference, further exacerbating the heat dissipation problem of Sic silicon carbide power filters. The traditional air-cooled heat dissipation method mainly relies on air convection to take away heat. Due to the low specific heat capacity and thermal conductivity of air, the heat dissipation efficiency is difficult to meet the growing heat dissipation requirements of Sic silicon carbide devices. Especially in high-power density application scenarios, the air-cooled method cannot dissipate heat in a timely and effective manner, resulting in a high device temperature. Although the ordinary liquid-cooled heat dissipation method has some improvements, the thermal resistance between the coolant and the heat-generating device limits the further improvement of the heat dissipation effect. During the circulation of the coolant, the process of heat transfer from the heat-generating device to the coolant is relatively slow, making it difficult to achieve fast and efficient heat dissipation. Therefore, it is necessary to design a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter. Summary of the Invention

[0005] The present invention provides a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter to solve the problems of low heat dissipation efficiency and poor heat dissipation effect of the existing heat dissipation methods, achieving good heat dissipation effect and being able to improve the performance and reliability of the Sic silicon carbide power filter.

[0006] The present invention provides a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter, including a heat dissipation substrate, a coolant circulation system, and heat dissipation fins;

[0007] The heat dissipation substrate is in contact with the heating devices of the Sic silicon carbide power filter, and the heat dissipation substrate and the heating devices are connected by an elastic buffer connection component;

[0008] The coolant circulation system includes a coolant pump, a coolant tank, and a connecting pipe;

[0009] The heat dissipation fins are connected to the heat dissipation substrate in an inlaid manner.

[0010] Preferably, for a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter provided by the present application, an S-shaped channel is provided in the heat dissipation substrate, the connecting pipe is installed in the S-shaped channel, and the liquid inlet end and the liquid outlet end of the connecting pipe are respectively communicated with the coolant tank. The coolant pump is installed outside the coolant tank, and the coolant pump is respectively connected to the coolant tank and the connecting pipe.

[0011] Preferably, for a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter provided by the present application, the coolant tank is divided into upper and lower layers. The upper layer is a coolant storage area, and the lower layer is a sediment filtration area. A filter partition is installed between the upper layer and the lower layer. Tiny filter holes are distributed on the filter partition. A liquid injection pipe is also installed at the upper end of the coolant tank, and the liquid injection pipe is communicated with the coolant storage area.

[0012] Preferably, for a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter provided by the present application, a plurality of grooves are formed on the upper surface of the heat dissipation substrate, and the bottom of the heat dissipation fins is clamped into the grooves.

[0013] Preferably, for a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter provided by the present application, the elastic buffer connection component is made of a silicone rubber material with high elasticity and high thermal conductivity, and a micro metal spring structure is embedded inside.

[0014] Preferably, a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter provided by the present application, wherein a detachable magnetic connection component is further provided between the heat dissipation substrate and the heat-generating device, and the magnetic connection component includes a first magnetic connection patch and a second magnetic connection patch. The first magnetic connection patch is installed on the lower surface of the heat dissipation substrate, and the first magnetic connection patch is installed on the upper surface of the heat-generating device.

[0015] Preferably, a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter provided by the present application, wherein the heat dissipation substrate is made of a high thermal conductivity metal material.

[0016] Preferably, a method for using a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter includes the following steps:

[0017] A. When the Sic silicon carbide power filter is working, a large amount of heat is generated by the heat-generating device, and the heat is transferred to the heat dissipation substrate through direct contact.

[0018] B. The coolant pump is started to pump the coolant out of the coolant tank and send it into the coolant inlet of the heat dissipation substrate through the connecting pipe. The coolant flows in the coolant channel of the heat dissipation substrate, absorbs the heat transferred from the heat dissipation substrate, and the temperature rises.

[0019] C. The coolant with the increased temperature flows out of the coolant outlet of the heat dissipation substrate and returns to the coolant tank through the connecting pipe. In the coolant tank, the coolant exchanges heat with the outside through the cooling coil, and the temperature decreases. At the same time, the coolant passes through the filter partition to remove impurities and is then sent into the heat dissipation substrate by the coolant pump again to form a cycle.

[0020] D. During the heat dissipation process, the heat dissipation fins dissipate the heat transferred from the heat dissipation substrate to the surrounding air through natural convection and radiation.

[0021] Beneficial effects:

[0022] (1) Through the liquid-cooled direct-contact design of the present invention, the coolant directly contacts the heat-generating device, greatly reducing the thermal resistance and improving the heat dissipation efficiency. Compared with the traditional heat dissipation method, it can more quickly and effectively dissipate the heat generated by the Sic silicon carbide power filter, ensuring the stable operation of the device at a lower temperature.

[0023] (2) In the present invention, an elastic buffer connection component and a magnetic connection component are provided between the heat dissipation substrate and the heat-generating device, effectively solving the connection problem caused by the thermal expansion difference between the heat dissipation substrate and the heat-generating device, ensuring that the two always maintain a tight and stable connection under various working conditions, improving the reliability and stability of the heat dissipation system, and reducing the risk of heat dissipation performance degradation caused by loose connection.

[0024] (3) In the present invention, the integrated pipeline forming design of the coolant circulation system and the layered structure of the coolant tank significantly improve the sealing performance of the system and reduce the possibility of coolant leakage. At the same time, the layered coolant tank structure improves the purification efficiency of the coolant, reduces the damage of impurities to system components, further enhances the reliability of the entire coolant circulation system, and extends the service life of the system.

[0025] The above description is only an overview of the technical solutions of the embodiments of the present invention. In order to be able to understand the technical means of the embodiments of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the embodiments of the present invention more obvious and understandable, the following specifically illustrates the specific embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a schematic structural diagram of the present invention;

[0028] Figure 2 It is an installation schematic diagram of the coolant circulation system of the present invention;

[0029] Figure 3 It is a front view of the coolant tank of the present invention;

[0030] Figure 4 It is a top view of the heat dissipation substrate of the present invention;

[0031] Description of the reference numerals: heat dissipation substrate 1, heat dissipation fins 2, heating device 3, coolant pump 4, coolant tank 5, connecting pipe 6, coolant storage area 7, sedimentation and filtration area 8, filter partition 9, liquid injection pipe 10, groove 11, elastic buffer connection assembly 12, metal spring structure 13, first magnetic connection patch 14, second magnetic connection patch 15. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the scope of protection of the present invention.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this invention; the terms "comprising" and "having" and any variations thereof in the specification, claims and drawings of this invention are intended to cover non-exclusive inclusion.

[0034] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this invention. The phrase "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] All orientation terms appearing in the following description are the directions shown in the figures and do not limit the specific structure of this invention. For example, in the description of this invention, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to this invention.

[0036] In addition, the terms "first", "second", etc. in the specification, claims or above-mentioned drawings of this invention are used to distinguish different objects and not to describe a specific order, and may explicitly or implicitly include one or more of such features.

[0037] In the description of this invention, it should be noted that, unless otherwise clearly specified and defined, the terms "installed", "connected" and "coupled" should be understood in a broad sense. For example, the "connection" or "coupling" of mechanical structures can refer to a physical connection. For example, a physical connection can be a fixed connection, such as a fixed connection through a fixing member, such as a screw, bolt or other fixing member; a physical connection can also be a detachable connection, such as a snap connection or a snap-fit connection; a physical connection can also be an integral connection, such as a welded, bonded or integrally formed connection. For those of ordinary skill in the art, the specific meanings of the above terms in this invention can be understood according to specific circumstances.

[0038] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0039] Please refer to Figures 1 - 4 , the present invention discloses a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter, which includes a heat dissipation substrate 1, a coolant circulation system, and heat dissipation fins 2. The heat dissipation substrate 1 is made of a high thermal conductivity metal material;

[0040] The heat dissipation substrate 1 is in contact with the heat-generating device 3 of the Sic silicon carbide power filter, and the heat dissipation substrate 1 and the heat-generating device 3 are connected by an elastic buffer connection assembly 12;

[0041] The coolant circulation system includes a coolant pump 4, a coolant tank 5, and a connecting pipe 6;

[0042] The heat dissipation fins 2 and the heat dissipation substrate 1 are connected in an inlaid manner.

[0043] Among them, an S-shaped channel is provided in the heat dissipation substrate 1. The connecting pipe 6 is installed in the S-shaped channel, and the liquid inlet end and the liquid outlet end of the connecting pipe 6 are respectively communicated with the coolant tank 5. The coolant pump 4 is installed outside the coolant tank 5, and the coolant pump 4 is respectively connected to the coolant tank 5 and the connecting pipe 6; the coolant pump is used to provide power to make the coolant circulate in the heat dissipation substrate. The coolant tank is used to store the coolant and cool and filter the coolant. The connecting pipe connects the coolant pump, the coolant tank, and the heat dissipation substrate into a closed circulation loop. In the coolant circulation system, a temperature sensor and a flow sensor are also provided to monitor the temperature and flow rate of the coolant and adjust the rotation speed of the coolant pump through a control system to ensure the stability of the heat dissipation effect.

[0044] The coolant tank 5 is divided into upper and lower layers. The upper layer is the coolant storage area 7, and the lower layer is the sedimentation and filtration area 8. During the circulation of the coolant, the impurities and heavier particles carried will settle to the lower sedimentation and filtration area under the action of gravity. A filter partition 9 is installed between the upper and lower layers. Tiny filter holes are distributed on the filter partition 9. A liquid injection pipe 10 is also installed at the upper end of the coolant tank 5, and the liquid injection pipe 10 is communicated with the coolant storage area 7. Only the preliminarily filtered coolant is allowed to pass through and enter the upper storage area to continue participating in the circulation. This layered structure can effectively improve the purification efficiency of the coolant, reduce the damage of impurities to the system, extend the service life of the coolant, and at the same time simplify the working process of the coolant regeneration and purification device and reduce the maintenance cost. In the present invention, the integrated pipeline forming design of the coolant circulation system and the layered structure of the coolant tank significantly improve the sealing performance of the system and reduce the possibility of coolant leakage. At the same time, the layered coolant tank structure improves the purification efficiency of the coolant, reduces the damage of impurities to the system components, further enhances the reliability of the entire coolant circulation system, and extends the service life of the system.

[0045] In the present invention, a plurality of grooves 11 are formed on the upper surface of the heat dissipation substrate 1, and the bottom of the heat dissipation fins 2 is snapped into the grooves 11. The inlaid connection structure can not only significantly enhance the mechanical connection strength between the heat dissipation fins and the heat dissipation substrate, prevent the fins from falling off during long-term use, but also minimize the contact thermal resistance between the two to ensure efficient heat transfer from the heat dissipation substrate to the heat dissipation fins.

[0046] In addition, the elastic buffer connection component 12 is made of a highly elastic and highly thermally conductive silicone rubber material, and a micro metal spring structure 13 is embedded inside. The good elasticity of the silicone rubber material can effectively compensate for the displacement caused by the difference in the coefficient of thermal expansion between the heat generating device and the heat dissipation substrate, and avoid connection looseness or damage caused by thermal stress. At the same time, the relatively high thermal conductivity of the silicone rubber itself and the enhancement of heat conduction by the internal metal spring structure can ensure efficient heat transfer between the two, further reducing the contact thermal resistance.

[0047] In the present invention, a detachable magnetic connection component is also provided between the heat dissipation substrate 1 and the heat generating device 3. The magnetic connection component includes a first magnetic connection patch 14 and a second magnetic connection patch 15. The first magnetic connection patch 14 is installed on the lower surface of the heat dissipation substrate 1, and the first magnetic connection patch 15 is installed on the upper surface of the heat generating device 3. The two are tightly attached by magnetic force. This connection method is not only convenient for installation and disassembly, facilitating the maintenance and repair of the equipment, but also can ensure that the heat dissipation substrate and the heat generating device always maintain a good contact state under normal working conditions, ensuring the stability of the heat dissipation effect.

[0048] Working principle: A method for using a liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter includes the following steps:

[0049] A. When the Sic silicon carbide power filter is working, the heating device generates a large amount of heat, and the heat is transferred to the heat dissipation substrate through direct contact.

[0050] B. The coolant pump is started to pump the coolant out of the coolant tank and send it into the coolant inlet of the heat dissipation substrate through the connecting pipe. The coolant flows in the coolant channel of the heat dissipation substrate, absorbs the heat transferred from the heat dissipation substrate, and the temperature rises.

[0051] C. The coolant with an increased temperature flows out from the coolant outlet of the heat dissipation substrate and returns to the coolant tank through the connecting pipe. In the coolant tank, the coolant exchanges heat with the outside through the cooling coil, and the temperature decreases. At the same time, the coolant passes through the filter partition to remove impurities and is then sent into the heat dissipation substrate by the coolant pump again to form a cycle.

[0052] D. During the heat dissipation process, the heat dissipation fins dissipate the heat transferred from the heat dissipation substrate to the surrounding air through natural convection and radiation.

[0053] Through the liquid-cooled direct-contact design of the present invention, the coolant directly contacts the heating device, greatly reducing the thermal resistance and improving the heat dissipation efficiency. Compared with the traditional heat dissipation method, it can more quickly and effectively dissipate the heat generated by the Sic silicon carbide power filter, ensuring that the device operates stably at a lower temperature.

[0054] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter, characterized in that It includes a heat dissipation substrate (1), a coolant circulation system, and heat dissipation fins (2); The heat dissipation substrate (1) is in contact with the heating device (3) of the Sic silicon carbide power filter, and the heat dissipation substrate (1) is connected to the heating device (3) through an elastic buffer connection component (12); The coolant circulation system includes a coolant pump (4), a coolant tank (5), and a connecting pipe (6); The heat dissipation fins (2) are connected to the heat dissipation substrate (1) in an inlaid manner.

2. The liquid-cooled direct-contact heat dissipation mechanism based on the Sic silicon carbide power filter according to claim 1, characterized in that, An S-shaped channel is provided inside the heat dissipation substrate (1), the connecting pipe (6) is installed in the S-shaped channel, and the liquid inlet end and the liquid outlet end of the connecting pipe (6) are respectively communicated with the coolant tank (5). The coolant pump (4) is installed outside the coolant tank (5), and the coolant pump (4) is respectively connected to the coolant tank (5) and the connecting pipe (6).

3. The liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter according to claim 2, characterized in that The coolant tank (5) is divided into upper and lower layers. The upper layer is a coolant storage area (7), and the lower layer is a sedimentation and filtration area (8). A filter partition (9) is installed between the upper and lower layers. Tiny filter holes are distributed on the filter partition (9). A liquid injection pipe (10) is also installed at the upper end of the coolant tank (5), and the liquid injection pipe (10) is communicated with the coolant storage area (7).

4. A liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter according to claim 1, characterized in that, A plurality of grooves (11) are formed on the upper surface of the heat dissipation substrate (1), and the bottom of the heat dissipation fins (2) is snapped into the grooves (11).

5. The liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter according to claim 1, characterized in that The elastic buffer connection component (12) is made of a silicone rubber material with high elasticity and high thermal conductivity, and a micro metal spring structure (13) is embedded inside.

6. The liquid-cooled direct-contact heat dissipation mechanism of a Sic silicon carbide power filter according to claim 1, wherein, A detachable magnetic connection component is also provided between the heat dissipation substrate (1) and the heating device (3). The magnetic connection component includes a first magnetic connection patch (14) and a second magnetic connection patch (15). The first magnetic connection patch (14) is installed on the lower surface of the heat dissipation substrate (1), and the first magnetic connection patch (15) is installed on the upper surface of the heating device (3).

7. The liquid-cooled direct-contact heat dissipation mechanism based on a Sic silicon carbide power filter according to claim 1, characterized in that, The heat dissipation substrate (1) is made of a high thermal conductivity metal material.

8. A method of using a liquid-cooled direct-contact heat dissipation mechanism for a SiC-based silicon carbide power filter as claimed in claim 1, characterized in that, Its usage method includes the following steps: A. When the Sic silicon carbide power filter is working, the heating device generates a large amount of heat, and the heat is transferred to the heat dissipation substrate through direct contact; B. The coolant pump is started to pump the coolant out of the coolant tank and send it into the coolant inlet of the heat dissipation substrate through the connecting pipe. The coolant flows in the coolant channel of the heat dissipation substrate, absorbs the heat transferred from the heat dissipation substrate, and the temperature rises; C. The coolant with an increased temperature flows out from the coolant outlet of the heat dissipation substrate and returns to the coolant tank through the connecting pipe. In the coolant tank, the coolant exchanges heat with the outside through a cooling coil, and the temperature decreases. At the same time, the coolant passes through the filter partition for filtration to remove impurities and is then sent into the heat dissipation substrate by the coolant pump again to form a cycle; D. During the heat dissipation process, the heat dissipation fins dissipate the heat transferred from the heat dissipation substrate to the surrounding air through natural convection and radiation.

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