Heat dissipation device of motor controller

Abstract

The embodiment of the invention discloses a motor controller heat dissipation device, and the device comprises a cooling fin which is disposed at the bottom of a housing of a controller; the fan is arranged at the bottom of the shell; and the temperature sensor is connected with the fan through a control chip and a driving circuit. The heat dissipation effect of the motor controller is improved, and the reliability of the motor controller is ensured.

Description

Technical Field

[0001] The present invention relates to the field of motor controllers, and particularly to a heat dissipation device for a motor controller. Background Art

[0002] Current motor controllers are widely used in the automotive and military fields. Among them, power devices such as IGBT modules or MOS transistors, as the main power-consuming devices of the motor controller, play a crucial role. However, due to their large working current, they will generate a large amount of heat. The housing of the motor controller is generally fully enclosed. After the controller works for a certain period of time, due to the enclosed environment, high temperature will be formed inside the housing, which is likely to damage electrical components and affect the working reliability and service life of the controller.

[0003] In view of the problem of poor heat dissipation performance of motor control in the prior art, there is currently no effective solution. Summary of the Invention

[0004] To solve the above problems, the present invention provides a heat dissipation device for a motor controller. By setting heat sinks, the heat dissipation performance of the motor control housing is improved; by the cooperation of a fan and a temperature sensor, the fan is started for heat dissipation when a predetermined temperature is reached; a thermal grease sheet is provided for further heat dissipation, thereby solving the problem of poor heat dissipation performance of motor control in the prior art.

[0005] To achieve the above object, the present invention provides a heat dissipation device for a motor controller, including: a heat sink, the heat sink is provided at the bottom of the housing of the controller; a fan, the fan is provided at the bottom of the housing; a temperature sensor, the temperature sensor is connected to the fan through a control chip and a drive circuit.

[0006] Further optionally, the device further includes: thermal grease, the thermal grease is provided between the power module and the housing.

[0007] Further optionally, the material of the heat sink is aluminum alloy or copper.

[0008] Further optionally, the temperature sensor is provided inside the controller near the power module.

[0009] Further optionally, the drive circuit includes: a drive chip, an input end of the drive chip is connected to an output end of the control chip; an optocoupler, an input end of the optocoupler is connected to an output end of the drive chip; a triode, a gate of the triode is connected to an output end of the optocoupler, a source is grounded, and a drain is connected to a negative electrode of the fan.

[0010] Further optionally, a power supply wire of the fan is connected to a connector through a wire and accesses the inside of the controller.

[0011] Further optionally, the device further includes: a plurality of ventilation holes uniformly distributed on the bottom and side walls of the housing, and a filter screen covering the ventilation holes.

[0012] Further optionally, the heat sink is connected to the bottom of the housing through a snap structure; the snap structure includes a groove provided at the bottom of the housing and a protrusion provided on the heat sink, and the protrusion of the heat sink is embedded in the groove at the bottom of the housing to form a snap connection.

[0013] Further optionally, the thermal grease is evenly coated on the contact surface between the power module and the housing through a coating process; the thickness of the thermal grease is 0.1 - 0.3 mm.

[0014] Further optionally, the device further includes a reinforcing rib provided at the bottom of the housing.

[0015] The above technical solution has the following beneficial effects: Through the combined application of the heat sink, the fan, the temperature sensor and the drive circuit, the heat dissipation problem of the motor controller is effectively solved; the use of the thermal grease enhances heat conduction, and the snap structure ensures the firm installation of the components and the convenience of maintenance; the design of the ventilation holes and the reinforcing ribs further optimizes air flow and structural stability; the above motor controller heat dissipation device has the advantages of simple structure, convenient installation, good heat dissipation effect and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 is a schematic structural diagram of the motor controller heat dissipation device provided by an embodiment of the present invention;

[0018] Figure 2 is a schematic structural diagram of the drive circuit provided by an embodiment of the present invention.

[0019] Reference numerals: 1 - housing; 2 - heat sink; 3 - fan; 4 - power supply wire; 5 - temperature controller; 6 - control chip; 7 - drive circuit. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] To solve the problem of poor heat dissipation effect of the motor controller in the prior art, an embodiment of the present invention provides a heat dissipation device for a motor controller, as Figure 1 - Figure 2 shown. The device includes: a heat sink 2, which is arranged at the bottom of the housing 1 of the controller; a fan 3, which is arranged at the bottom of the housing 1; a temperature sensor, and the temperature sensor 5 is connected to the fan 3 through a control chip 6 and a drive circuit 7.

[0022] The motor controller includes a housing 1, a power module inside the housing 1, and other components inside the housing 1. In this embodiment, a heat sink 2 is arranged at the bottom of the housing 1. The surface of the heat sink 2 is designed with a plurality of vertically arranged fins. These fins increase the surface area of the heat sink 2, enabling it to more efficiently conduct the heat inside the controller to the air. The arrangement density and shape of the fins are designed according to the actual situation to ensure that heat can be effectively carried away when air flows. The size and thickness of the heat sink 2 are designed according to the power and heat dissipation requirements of the motor controller. Generally speaking, a larger heat sink 2 can provide a larger heat dissipation area, and an appropriate thickness can ensure sufficient heat capacity and mechanical strength.

[0023] In addition to the heat sink 2, a fan 3 is also arranged at the bottom of the housing 1. The fan 3 is used in cooperation with the heat sink 2 to accelerate air flow, so that fresh air constantly passes through the surface of the heat sink 2, improving the heat dissipation efficiency. The fan 3 is installed near the power module.

[0024] A temperature sensor 5 is also installed inside the housing 1. The temperature sensor 5 is electrically connected to the fan 3. Specifically, the temperature sensor 5 is connected to a control chip 6, and the control chip 6 is connected to a drive circuit 7. The drive circuit 7 is used to drive the start and stop of the fan 3. A temperature threshold is preset in advance. When the temperature collected by the temperature sensor 5 reaches this temperature threshold, the control chip 6 controls the drive circuit 7 to work to start the fan 3 to dissipate heat from the housing 1.

[0025] As an optional implementation manner, the device further includes: thermal grease, which is arranged between the power module and the housing 1.

[0026] The power module is installed in a wall-mounted manner. To further improve the heat dissipation performance, a thermal grease sheet is also provided between the power module and the housing 1. This thermal grease sheet can reduce the thermal resistance and improve the heat conduction efficiency by filling the air gaps in the micro-irregularities. Even after fine machining, there are still tiny unevenness on the metal surface. Without using thermal grease, the contact area between the power module and the heat sink 2 is limited, and a large amount of air will be trapped between the contact surfaces. Since air is an insulator with extremely poor heat conduction performance, it greatly increases the thermal resistance and reduces the heat dissipation effect. Thermal grease can penetrate into these tiny voids and replace air as the heat conduction medium, thus significantly improving the heat dissipation efficiency.

[0027] As an alternative implementation, the material of the heat sink 2 is aluminum alloy or copper.

[0028] The material of the heat sink 2 is aluminum alloy or copper. Aluminum alloy has the characteristics of light weight, low cost, and good heat conduction performance. Copper has better heat conduction performance than aluminum alloy and a higher heat transfer rate.

[0029] As an alternative implementation, the temperature sensor is arranged inside the controller near the power module.

[0030] The temperature sensor is installed near the power module, and the control chip monitors the signal of the temperature sensor in real time.

[0031] As an alternative implementation, as Figure 2 shown, the drive circuit includes: a drive chip, the input end of the drive chip is connected to the output end of the control chip; an optocoupler, one input end of the optocoupler is connected to the output end of the drive chip; a triode, the gate of the triode is connected to one output end of the optocoupler, the source is grounded, and the drain is connected to the negative pole of the fan.

[0032] The output end of the temperature sensor (D1) is connected to the input end of the control chip (D2). The temperature sensor (D1) is used to detect the ambient temperature and convert it into an electrical signal and transmit it to the control chip (D2).

[0033] The control chip (D2) is connected to the input end (1B) of the logic drive chip (D3) through a 10K resistor (R1). The control chip (D2) is responsible for processing the signal provided by the temperature sensor. When the temperature reaches the set threshold, the control chip (D2) will output a signal to the drive chip (D3).

[0034] The 1A port of the driving chip (D3) is grounded (GND), receives the control signal from the control chip (D2) through R1. The 1Y output terminal of the driving chip (D3) is connected to the input terminal of the optocoupler (N1) through a 470-ohm resistor (R2). The VCC terminal of the driving chip (D3) is connected to the +5V power supply to provide the working voltage. The driving chip (D3) processes the input signal and outputs a control signal to drive the optocoupler (N1).

[0035] One of the input terminals of the optocoupler (N1) receives the signal from the driving chip (D3), and the other input terminal is grounded. The output terminal of the optocoupler (N1) is connected to the gate (G) of the MOSFET transistor (Q1). The optocoupler is used for electrical isolation, separating the logic circuit and the power circuit, and controlling the conduction of the transistor (Q1).

[0036] The gate (G) of the transistor (Q1) receives the control signal from the optocoupler (N1) through a 15K resistor (R3) and a 4.7K resistor (R4). The source (S) of the transistor (Q1) is grounded (GND). The drain (D) of the transistor (Q1) is connected to the negative pole of the fan (FAN), and is also connected to the +24V power supply through a diode (V1). The transistor (Q1) determines whether to conduct the power supply circuit of the fan by controlling the gate voltage.

[0037] When the temperature is higher than the set temperature threshold, a fan drive signal is output to the driving chip D3. After signal amplification, it controls the optocoupler N1 to conduct, making the G pin of the transistor Q1 high, the transistor conducts, the fan power supply circuit is turned on, and the fan starts to work.

[0038] As an alternative implementation, the power supply line of the fan is connected to the inside of the controller through a wire-connected connector.

[0039] The power supply line 4 of the fan is connected to the inside of the housing through a wire-connected connector, and the connector can be provided on the housing.

[0040] As an alternative implementation, the device further includes: a plurality of ventilation holes, which are evenly distributed on the bottom and side walls of the housing, and the ventilation holes are covered with a filter screen.

[0041] The bottom and side walls of the housing are provided with a plurality of ventilation holes, and the ventilation holes are covered with a filter screen to increase air flow and prevent dust from entering.

[0042] As an alternative implementation, the heat sink is connected to the bottom of the housing through a snap structure; the snap structure includes a groove provided on the bottom of the housing and a protrusion provided on the heat sink, and the protrusion of the heat sink is embedded in the groove at the bottom of the housing to form a snap connection.

[0043] The bottom of the housing is provided with a groove for snap connection, and a protruding portion is provided at the corresponding position of the heat sink. The cooperation between the protruding portion and the groove enables the heat sink to be quickly and stably installed on the bottom of the housing.

[0044] As an alternative embodiment, the thermal grease is evenly coated on the contact surface between the power module and the housing through a coating process; the thickness of the thermal grease is 0.1 - 0.3 mm.

[0045] The thermal grease is evenly coated on the contact surface between the power module and the housing, with a thickness of 0.1 - 0.3 mm, to ensure efficient heat conduction.

[0046] As an alternative embodiment, it further includes reinforcing ribs, which are arranged at the bottom of the housing.

[0047] Reinforcing ribs are provided at the bottom of the controller housing to increase the mechanical strength of the housing, support the installation of the fan and the heat sink, and prevent the influence of vibration during operation on the device.

[0048] The above technical solutions have the following beneficial effects: Through the combined application of the heat sink, the fan, the temperature sensor and the drive circuit, the heat dissipation problem of the motor controller is effectively solved; the use of the thermal grease enhances heat conduction, and the snap structure ensures the firmness of component installation and the convenience of maintenance; the design of the ventilation holes and the reinforcing ribs further optimizes air flow and structural stability; the above motor controller heat dissipation device has the advantages of simple structure, convenient installation, good heat dissipation effect and high reliability.

[0049] The specific embodiments of the above invention further elaborate on the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above content is only the specific embodiments of the present invention and is not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation device for a motor controller, characterized in that Comprising: A heat sink, which is provided at the bottom of the housing of the controller; A fan, which is provided at the bottom of the housing; A temperature sensor, which is connected to the fan through a control chip and a drive circuit.

2. The heat dissipation device for a motor controller according to claim 1, characterized in that, Further comprising: Thermal grease, which is provided between the power module and the housing.

3. The motor controller heat dissipation device according to claim 1, wherein: The material of the heat sink is aluminum alloy or copper.

4. The motor controller heat dissipation device according to claim 1, wherein: The temperature sensor is provided inside the controller near the power module.

5. The heat dissipation device for a motor controller according to claim 1, characterized in that, The drive circuit includes: A drive chip, the input end of which is connected to the output end of the control chip; An optocoupler, one input end of which is connected to the output end of the drive chip; A triode, the gate of which is connected to one output end of the optocoupler, the source is grounded, and the drain is connected to the negative pole of the fan.

6. The motor controller heat dissipation device according to claim 5, wherein: The power supply line of the fan is connected to the inside of the controller through a wire connecting a connector.

7. The heat dissipation device for a motor controller according to claim 1, characterized in that, Further comprising: A plurality of ventilation holes, which are evenly distributed on the bottom and side walls of the housing, and the ventilation holes are covered with a filter net.

8. The motor controller heat dissipation device according to claim 1, wherein: The heat sink is connected to the bottom of the housing through a snap structure; The snap structure includes a groove provided at the bottom of the housing and a protrusion provided on the heat sink, and the protrusion of the heat sink is embedded in the groove at the bottom of the housing to form a snap connection.

9. The motor controller heat dissipation device according to claim 1, wherein: The thermal grease is evenly coated on the contact surface between the power module and the housing through a coating process; The thickness of the thermal grease is 0.1 - 0.3 mm.

10. The motor controller heat dissipation device according to claim 1, wherein: Further comprising a reinforcing rib, which is provided at the bottom of the housing.

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