Micro-nano powder wafer non-traditional machining equipment

Abstract

The invention belongs to the technical field of semiconductor precision manufacturing, and discloses micro-nano powder wafer non-traditional machining equipment which comprises a sand blasting machining structure, a sand path and gas path structure, a sand returning and storing structure and a tail gas treatment structure. The sand path and gas path structure comprises a sand path group, a gas path group and an exhaust fan; the gas circuit group is arranged in the sand blasting processing structure and is communicated with the exhaust fan; one end of the gas circuit group is communicated with the exhaust fan, and the other end of the gas circuit group is communicated with the top of the sand returning and storing structure; and the tail gas treatment structure is communicated with the sand returning and storing structure. According to the micro-nano powder wafer non-traditional machining equipment, the problems of toxic pollutant treatment caused by wet etching, low laser machining efficiency and the like are solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor precision manufacturing technology, and particularly to a special processing equipment for micro-nano powder wafers. Background Art

[0002] In recent years, micro-nano processing technology has developed rapidly and has been widely applied in various different fields, such as the processing of micro-nano structured parts for micro-electromechanical systems, optoelectronics and optical components, and medical devices. Since the materials used in the preparation of micro-nano structured parts always have characteristics such as high hardness and high brittleness, traditional and many non-traditional processing technologies often cannot fully meet the requirements in terms of processing efficiency, precision, and processing process stability.

[0003] Micro-nano powder etching technology is a micro-nano processing technology developed on the basis of traditional abrasive jet machining. This technology uses a high-speed two-phase jet formed by high-pressure gas and micro-nano powder, which can perform precision machining on the surfaces of hard and brittle semiconductor materials such as quartz, glass, silicon carbide, and gallium nitride. Through the directional etching of a pre-set mask structure, the controllable peeling of complex and fine structures such as microarray gratings, microchannels, and special-shaped micropores can be achieved.

[0004] Compared with traditional and other non-traditional processing methods, this processing technology has unique advantages such as no heat-affected zone, good process stability, low cost, concentrated energy, and environmental protection and high efficiency, effectively solving problems such as product microcracks caused by processing, serious pollution in chemical etching processes, excessive heat-affected zones in laser processing, and low efficiency. It is particularly suitable for precision micro-nano processing in the high-end manufacturing fields of high-power chips in the new energy vehicle and photovoltaic industries, microfluidic chips in the biomedical and drug screening industries, and special sensor chips such as pressure sensors and inertial sensors. Summary of the Invention

[0005] The object of the present invention is to provide a special processing equipment for micro-nano powder wafers, including a sandblasting processing structure, a sand path and gas path structure, a sand return and storage structure, and a tail gas treatment structure; The sand path and gas path structure includes a sand path group, a gas path group, and an exhaust fan; The gas path group is arranged inside the sandblasting processing structure and is connected to the exhaust fan at one end; The other end of the gas path group is connected to the top of the sand return and storage structure; The tail gas treatment structure is connected to the sand return and storage structure.

[0006] Preferably, the sandblasting processing structure includes a sealed processing box, an X-direction moving workbench, a Y-direction moving spray gun group, a stable support for spray gun movement, a sand return funnel, a lifting partition door, a dust blowing device, and a processing chamber lighting lamp; The sealed processing box body is in an "L" shape and is internally divided into a sandblasting area, a platform area, and a sand return area; The Y-direction moving spray gun group is arranged in the sandblasting area and is fixedly connected to the upper platform inside the sealed processing box body, and the X-direction moving workbench is arranged in the platform area and is fixedly connected to the inner side plate of the sealed processing box body; The moving directions of the X-direction moving workbench and the Y-direction moving spray gun group are perpendicular to each other, and the Y-direction moving spray gun group is located above the X-direction moving workbench; The spray gun moving stable support is arranged inside the side plate of the sandblasting area of the sealed processing box body; The dust blowing device is arranged on the inner side plate of the sandblasting area of the sealed processing box body on the back side of the spray gun moving stable support; The processing chamber lighting lamp is arranged in the sandblasting area and is fixedly connected to the rear plate inside the sealed processing box body.

[0007] Preferably, a pair of sand return funnels are arranged in the sand return area and are fixedly arranged side by side at the bottom of the sealed processing box body; The lifting partition door is arranged on the side of the sandblasting area of the sealed processing box body; An air circuit inspection cabinet door is arranged on the surface of the sand return area of the sealed processing box body; An observation window door is machined on the surface of the sandblasting area of the sealed processing box body; An openable sealed door is arranged at the top of the platform area of the sealed processing box body.

[0008] Preferably, the Y-direction moving spray gun group includes an air sand spray gun group, a Y-direction motor driving device, a Y-direction moving support, a pair of Y-direction guide rails, and a spray gun group moving limit; The Y-direction motor driving device is fixedly connected to the rear plate inside the sandblasting area of the sealed processing box body through a first support frame; The Y-direction motor driving device is fixedly connected to the upper surface of the first support frame; One end of the Y-direction guide rail is fixed on the side surface of the first support frame, and a support bearing is fixedly connected to the upper surface of the other end of the Y-direction guide rail through an I-shaped bracket, the support bearing is connected through a rotating shaft, and the rotating shaft and the driving shaft of the Y-direction motor driving device are connected through a conveyor belt; The Y-direction moving support is fixed on the conveyor belt; The air sand spray gun group is connected to the Y-direction moving support through a vertical spray gun connecting rod; The spray gun group moving limit device is arranged at both ends of the Y-direction guide rail and inside the support bearing; A horizontal spray gun connecting rod is fixedly connected to the vertical spray gun connecting rod in the horizontal direction.

[0009] Preferably, the X-direction moving workbench includes a wafer placement table, an X-direction motor driving device, a moving transmission device, a pair of X-direction guide rails, a workbench movement limit, a bearing moving platform, guide wheels, and an X-direction hard limit; There are a pair of the X-direction guide rails, which are respectively fixed on the inner platform areas of the front and rear plate surfaces of the platform area of the sealed processing box body; A first fixing frame and a second fixing frame are arranged on both sides inside the platform area of the sealed processing box body; The moving transmission device includes two pairs of fixed bearings, a rotating rod, and a conveyor belt; A pair of fixed bearings are arranged on the surface of the first fixing frame. The fixed bearings are connected by a rotating rod. A conveyor belt is arranged on the rotating rod, and the other end of the conveyor belt is connected to another pair of fixed bearings; The fixed bearings are fixedly connected to the X-direction motor driving device and fixed on the second fixing frame.

[0010] Preferably, the bottom surface of the bearing moving platform is fixedly connected to the conveyor belt, and guide wheels are arranged at the four corners of the bottom surface. The guide wheels are arranged on the X-direction guide rails; The wafer placement table is fixedly connected to the bearing moving platform; X-direction hard limits are arranged at both ends of the X-direction guide rails, and a workbench movement limit is arranged inside the X-direction hard limits.

[0011] Preferably, the sand return and storage structure includes a cyclone separator, a partitioned material receiving box, a sand return and storage box body, a rotary quantitative sand discharging device, an outer cabinet; a stirring rod support frame, a front sand conveying pipeline, and a conveying pipeline support frame; The partitioned material receiving box, the sand return and storage box body, the rotary quantitative sand discharging device, the stirring rod support frame; the front sand conveying pipeline; the conveying pipeline support frame are arranged inside the outer cabinet; The cyclone separator passes through the upper plate of the outer cabinet for sand discharging and returning and is communicated with the partitioned material receiving box; A convex platform is arranged at the top of the sand return and storage box body. The top surface of the convex platform is connected to the partitioned material receiving box, and a stirring rod support frame is arranged on the side of the convex platform; The bottom of the sand return and storage box body is connected to the rotary quantitative sand discharging device; A conveying pipeline support frame is arranged inside the bottom surface of the outer cabinet, and the front sand conveying pipeline is fixedly connected to the conveying pipeline support frame and communicated with the rotary quantitative sand discharging device.

[0012] Preferably, the partitioned material receiving box includes a material receiving box body and a valve-type partition mechanism; The valve-type partition mechanism is arranged inside the material receiving box body.

[0013] Preferably, a heat preservation layer is obliquely arranged at the bottom of the sand return and storage box body; Inside the sand-returning and sand-storing box body is the sand-storing box body, and a sand stirring rod is arranged inside the sand-storing box body; At the top of the sand stirring rod is a stirring rod motor drive group, and the stirring rod motor drive group is fixedly connected to the stirring rod support frame; The sand-storing box body is equipped with a temperature probe; A heating plate is arranged on the inner side of the heat preservation layer; The sand-storing box body is equipped with a level gauge.

[0014] Preferably, the bottom of the outer cabinet body is fixedly connected with cabinet moving casters.

[0015] Therefore, by adopting the above-mentioned micro-nano powder wafer special processing equipment, the present invention has the following advantages compared with the existing methods: Through the cooperation of the front-end sandblasting equipment and the back-end sand-returning and sand-storing structure, the present invention utilizes the rotary sand discharging device and the high-pressure air flow to accurately control the sand discharging amount and sand discharging speed of the spray gun, and realizes the minimum micron-level material surface treatment and high-efficiency processing of microstructures for various wafers.

[0016] The technical solution of the present invention will be further described in detail below with reference to the drawings and embodiments. Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the overall structure of the equipment of the present invention; Figure 2 It is a schematic diagram of the sandblasting processing structure of the present invention; Figure 3 It is a schematic diagram of the sealed processing box body of the present invention; Figure 4 It is a schematic diagram of the X-direction moving workbench of the present invention; Figure 5 It is a schematic diagram of the Y-direction moving spray gun group of the present invention; Figure 6 It is a schematic diagram of the sand path and air path structure of the present invention; Figure 7 It is a schematic diagram of the sand-returning and sand-storing structure of the present invention; Figure 8 It is a schematic diagram of the partitioned material receiving box of the present invention; Figure 9 It is a schematic diagram of the sand-returning and sand-storing box body of the present invention.

[0018] Reference Signs 1. Sandblasting processing structure; 11. Sealed processing box; 111. Openable and closable sealed door; 112. Gas path inspection cabinet door; 113. Processing observation window door; 12. X-direction moving workbench; 121. Wafer placement table; 122. X-direction motor drive device; 123. Moving transmission device; 1231. Fixed bearing; 124. X-direction guide rail; 125. Workbench movement limit; 126. Load-bearing moving platform; 127. Guide wheel; 128. X-direction hard limit; 13. Y-direction moving spray gun group; 131. Air sand spray gun group; 132. Y-direction motor drive device; 133. Y-direction moving support; 134. Y-direction guide rail; 135. Spray gun group movement limit; 14. Spray gun movement stable support; 144. Vertical spray gun connecting rod; 142. Horizontal spray gun connecting rod; 15. Sand return funnel; 16. Lifting partition door; 17. Dust blowing device; 18. Working chamber lighting lamp; 2. Sand path and gas path structure; 21. Sand path group; 22. Gas path group; 23. Exhaust fan; 3. Sand return and storage structure; 31. Cyclone separator; 32. Partition feeding box; 321. Feeding box body; 322. Valve type partition mechanism; 33. Sand return and storage box body; 331. Storage box body; 332. Sand material stirring rod; 333. Stirring rod motor drive group; 334. Temperature probe; 335. Heating plate; 336. Heat preservation layer; 337. Level gauge; 34. Rotary quantitative sand discharging device; 35. Outer cabinet; 36. Stirring rod support frame; 37. Sand material front conveying pipeline; 38. Conveying pipeline support frame; 4. Tail gas treatment structure; 5. Sandblasting area; 6. Platform area; 61. First fixing frame; 62. Second fixing frame; 7. Sand return area; 8. First support frame; 81. I-shaped support; 82. Support bearing; 83. Drive shaft; 84. Conveyor belt. Detailed implementation manners

[0019] The technical solutions of the present invention will be further described below through the accompanying drawings and embodiments.

[0020] As Figure 1 shown, the object of the present invention is to provide a special processing equipment for micro-nano powder wafers, including a sandblasting processing structure 1, a sand path and gas path structure 2, a sand return and storage structure 3 and a tail gas treatment structure.

[0021] As Figure 3 shown, the sand path and gas path structure 2 includes a sand path group 21, a gas path group 22 and an exhaust fan 23. The exhaust fan 23 plays a role of secondary conveying for the recovery of sand materials, so that the sand materials can be smoothly sent to the sand return and storage structure 3.

[0022] The air path group 22 is arranged inside the sandblasting processing structure 1, one end is communicated with the exhaust fan 23, the other end of the air path group 22 is communicated with the top of the sand return and storage structure 3, and the tail gas treatment structure is communicated with the sand return and storage structure 3. When performing micro-nano powder wafer processing, after the wafer to be processed is placed in the sandblasting processing structure 1, the equipment group is started. The sand material for processing is transported from the sand return and storage structure 3 to the sandblasting processing structure 1 through the sand path and air path structure 2. At the same time, the debris generated during processing and the ejected sand material are transported from the sandblasting processing structure 1 to the sand return and storage structure 3 through the sand path and air path structure 2 for recycling and treatment, and the dust that cannot be recycled is sent to the tail gas treatment structure.

[0023] As Figure 2 shown, the sandblasting processing structure 1 includes a sealed processing box 11, an X-direction moving workbench 12, a Y-direction moving spray gun group 13, a spray gun moving stable support 14, a sand return funnel 15, a lifting partition door 16, a dust blowing device 17, and a processing chamber lighting lamp 18. The moving directions of the X-direction moving workbench 12 and the Y-direction moving spray gun group 13 are perpendicular to each other. The Y-direction moving spray gun group 13 is located above the X-direction moving workbench 12. During processing, the two move simultaneously to achieve full coverage sandblasting treatment of one side of the workpiece.

[0024] The sealed processing box 11 is in an "L" shape and is internally divided into a sandblasting area 5, a platform area 6, and a sand return area 7; The Y-direction moving spray gun group 13 is arranged in the sandblasting area 5 and is fixedly connected to the upper platform inside the sealed processing box 11. The X-direction moving workbench 12 is arranged in the platform area 6 and is fixedly connected to the inner side plate of the sealed processing box 11; The moving directions of the X-direction moving workbench 12 and the Y-direction moving spray gun group 13 are perpendicular to each other, and the Y-direction moving spray gun group 13 is located above the X-direction moving workbench 12; The spray gun moving stable support 14 is arranged inside the side plate of the sandblasting area 5 of the sealed processing box 11; The dust blowing device 17 is arranged on the inner side plate of the sandblasting area 5 of the sealed processing box 11 on the back side of the spray gun moving stable support 14; The processing chamber lighting lamp 18 is arranged in the sandblasting area 5 and is fixedly connected to the rear plate inside the sealed processing box 11.

[0025] Preferably, a pair of sand return funnels 15 are arranged in the sand return area 7 and are fixedly arranged side by side at the bottom of the sealed processing box 11; The lifting partition door 16 is arranged on the side of the sandblasting area 5 of the sealed processing box 11; As Figure 5 shown, an air path inspection cabinet door 112 is arranged on the surface of the sand return area 7 of the sealed processing box 11; The surface of the sandblasting area 5 of the sealed processing box body 11 is provided with a processing observation window door 113; The top of the platform area 6 of the sealed processing box body 11 is provided with an openable and closable sealing door 111.

[0026] Preferably, the Y-direction moving spray gun group 13 includes an air sand spray gun group 131, a Y-direction motor driving device 132, a Y-direction moving support 133, a pair of Y-direction guide rails 134, and a spray gun group moving limit 135; The Y-direction motor driving device 132 is fixedly connected to the inner rear plate of the sandblasting area 5 of the sealed processing box body 11 through the first support frame 8; The Y-direction motor driving device 132 is fixedly connected to the upper surface of the first support frame 8; One end of the Y-direction guide rail 134 is fixed to the side surface of the first support frame 8, and the upper surface of the other end of the Y-direction guide rail 134 is fixedly connected with a support bearing 82 through an I-shaped support 81. The support bearing 82 is connected through a rotating shaft, and the rotating shaft and the driving shaft 83 of the Y-direction motor driving device 132 are connected through a conveyor belt 84; The Y-direction moving support 133 is fixed on the conveyor belt 84; The air sand spray gun group 131 is connected to the Y-direction moving support 133 through a vertical spray gun connecting rod 144; The spray gun group moving limit 135 device is arranged at both ends of the Y-direction guide rail 134 and inside the support bearing 82; The vertical spray gun connecting rod 144 is horizontally fixedly connected with a horizontal spray gun connecting rod 142.

[0027] Preferably, the X-direction moving workbench 12 includes a wafer placement table 121, an X-direction motor driving device 122, a moving transmission device 123, a pair of X-direction guide rails 124, a workbench moving limit 125, a carrying moving platform 126, a guide wheel 127, and an X-direction hard limit 128; A pair of X-direction guide rails 124 are provided, and are respectively fixed on the inner platform areas 6 of the front and rear plate surfaces of the platform area 6 of the sealed processing box body 11; A first fixed frame 61 and a second fixed frame 62 are arranged on both sides inside the platform area 6 of the sealed processing box body 11; The moving transmission device 123 includes two pairs of fixed bearings 1231, a rotating rod, and a conveyor belt 84; A pair of fixed bearings 1231 are arranged on the surface of the first fixed frame 61. The fixed bearings 1231 are connected through a rotating rod, and a conveyor belt 84 is arranged on the rotating rod. The other end of the conveyor belt 84 is connected with another pair of fixed bearings 1231; The fixed bearing 1231 is fixedly connected to the X-direction motor driving device 122 and fixed on the second fixed frame 62.

[0028] Preferably, the bottom surface of the load moving platform 126 is fixedly connected to the conveyor belt 84, and guide wheels 127 are provided at the four corners of the bottom surface. The guide wheels 127 are arranged on the X-direction guide rails 124; The wafer placement table 121 is fixedly connected to the load moving platform 126; X-direction hard limits 128 are provided at both ends of the X-direction guide rails 124, and a workbench movement limit 125 is provided inside the X-direction hard limits 128.

[0029] As Figure 4 shown, the sand return and storage structure 3 includes a cyclone separator 31, a partitioned material receiving box 32, a sand return and storage box body 33, a rotary quantitative sand discharging device 34, an outer cabinet 35; a stirring rod support frame 36, a sand material front conveying pipeline 37, a conveying pipeline support frame 38. The sand return and storage structure 3 recovers and processes the micro-nano powder that can be reused during the operation of the sandblasting processing structure 1, that is, it is recovered from the sandblasting processing structure 1 through the sand path group 21, and the non-recyclable dust is separated and centrally collected in the tail gas treatment structure.

[0030] The partitioned material receiving box 32, the sand return and storage box body 33, the rotary quantitative sand discharging device 34, the stirring rod support frame 36; the sand material front conveying pipeline 37; the conveying pipeline support frame 38 are arranged inside the outer cabinet 35; As Figure 8 shown, the cyclone separator 31 passes through the upper plate of the sand discharging and returning outer cabinet 35 and communicates with the partitioned material receiving box 32. Among them, the non-recyclable dust separated by the cyclone separator 31 is transported to the tail gas treatment structure through a pipeline, and the reusable sand material falls into the partitioned material receiving box 32 to perform subsequent sand material treatment operations. The rotary quantitative sand discharging device 34 supplies continuous and stable processing sand material to the sandblasting processing structure 1 through the sand path in the sand material conveying pipeline; A convex platform is provided at the top of the sand return and storage box body 33. The top surface of the convex platform is connected to the partitioned material receiving box 32, and a stirring rod support frame 36 is provided on the side of the convex platform; The bottom of the sand return and storage box body 33 is connected to the rotary quantitative sand discharging device 34; A conveying pipeline support frame 38 is provided inside the bottom surface of the outer cabinet 35. The sand material front conveying pipeline 37 is fixedly connected to the conveying pipeline support frame 38 and communicates with the rotary quantitative sand discharging device 34.

[0031] Preferably, the partitioned material receiving box 32 includes a material receiving box body 321 and a valve type partition mechanism 322; The valve type partition mechanism 322 is arranged inside the material receiving box body 321.

[0032] Preferably, a thermal insulation layer 336 is inclinedly arranged at the bottom of the sand return and storage box body 33; The interior of the sand return and storage box body 33 is a sand storage box body 331, and a sand material stirring rod 332 is arranged inside the sand storage box body 331; A stirring rod motor driving group 333 is arranged at the top of the sand material stirring rod 332, and the stirring rod motor driving group 333 is fixedly connected to the stirring rod support frame 36; The sand storage box body 331 is equipped with a temperature probe 334; A heating plate 335 is arranged on the inner side of the thermal insulation layer 336; The sand storage box body 331 is equipped with a level gauge 337.

[0033] Preferably, the bottom of the outer cabinet body 35 is fixedly connected with cabinet moving casters.

[0034] The sand return and storage structure 3 recovers the reusable micro-nano powder during the operation and processing of the sandblasting processing structure 1, that is, it is recycled to the sandblasting processing structure 1 through the sand path group 21, and the non-recyclable dust is separated and centrally collected in the tail gas treatment structure.

[0035] When performing micro-nano powder wafer processing, the workpiece to be processed is placed on the wafer placement table 121 through the openable and sealable door 111. Subsequently, the equipment is started for processing. The wafer placement table 121 carries the wafer to be processed and runs back and forth along the X-direction guide rail 124 at a set speed under the drive of the X-direction motor drive device 122 and the moving transmission device 123. The gas sand spray gun group 131 of the Y-direction moving spray gun group 13 runs back and forth along the Y-direction guide rail 134 at a set speed under the traction of the Y-direction motor drive device 132 and the Y-direction moving support 133; at the same time, the micro-nano powder passes through the sand path group 21 and is directly impacted on the surface of the wafer to be processed through the gas sand spray gun group 131 under the drive of the high-pressure gas of the gas path group 22 to realize the sandblasting processing of the wafer. The waste generated by the processing is mixed with the ejected micro-nano powder sand material and falls into the sand return funnel 15 below the wafer placement table 121. Among them, the waste is filtered by the screen, and the micro-nano powder sand material is sent to the sand return and storage structure 3 through the pipeline of the sand path group 21.

[0036] Further, the abrasive material sent to the abrasive recycling and storage structure 3 enters the cyclone separator 31 to separate the reusable micro-nano powder abrasive material. Subsequently, the abrasive material falls into the receiving box body 321 of the partition receiving box 32 under the action of gravity. When the recycled abrasive material accumulates to a certain amount, the valve-type partition mechanism 322 opens to allow the abrasive material to further fall into the storage box body 331, and then closes to prevent the operation of the cyclone separator 31 from affecting the state of the abrasive material already stored in the storage box body 331. To maintain stable material discharge, the stirring rod motor drive group 333 drives the abrasive material stirring rod 332 to continuously stir the micro-nano powder abrasive material in the storage box body 331 to maintain the uniform distribution of the abrasive material and prevent the abrasive material from caking. At the same time, in order to further maintain the dryness of the abrasive material and prevent caking, the temperature probe 334 continuously detects the temperature of the abrasive material, and the heating plate 335 and the heat insulation layer 336 keep the temperature of the abrasive material in the storage box body 331 stable. In addition, a level gauge 337 is equipped for level measurement.

[0037] Further, the micro-nano powder abrasive material in the storage box body 331, under the action of the rotary metering abrasive discharging device 34, is transported through the abrasive material conveying pipeline to the abrasive blasting processing structure 1, and acts on the surface of the wafer to be processed again from the gas-abrasive gun group 131. Thus, a closed loop is formed for the use and recycling of the micro-nano powder abrasive material.

[0038] When the wafer to be processed is continuously processed to completion under the combined action of the X-direction moving workbench 12 and the Y-direction moving gun group 13, the wafer is moved out of the processing area from the wafer placement table 121 to directly below the openable and sealable door 111. At this time, the dust blowing device 17 is started to remove the residual impurities on the surface of the wafer, and at the same time, the lifting partition door 16 is started to lower the partition door to avoid the problem that a large amount of micro-nano dust is carried out into the environment when the sealed processing box body 11 is opened due to the dust sand explosion generated during processing, so as to achieve the purpose of quickly taking out the processed wafer.

[0039] In this embodiment, by using the micro-nano powder wafer processing equipment to process the wafer, problems such as the treatment of toxic pollutants brought about by dry / wet etching and the low efficiency of laser processing are avoided. Even for wafers of different materials and structures, only the grinding consumables need to be replaced to quickly correspond, providing a device solution with stable quality and high production efficiency for the batch micro-nano structure processing and surface treatment of wafers.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify or equivalently replace the technical solutions of the present invention, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A special processing equipment for micro-nano powder wafers, characterized in that, It includes a sandblasting processing structure, a sand path and air path structure, a sand return and storage structure, and a tail gas treatment structure; The sand path and air path structure includes a sand path group, an air path group, and a suction fan; The air path group is arranged inside the sandblasting processing structure and is connected to the suction fan at one end; The other end of the air path group is connected to the top of the sand return and storage structure; The tail gas treatment structure is connected to the sand return and storage structure.

2. The special processing equipment for micro-nano powder wafers according to claim 1, characterized in that, The sandblasting processing structure includes a sealed processing box, an X-direction moving workbench, a Y-direction moving spray gun group, a stable support for spray gun movement, a sand return funnel, a lifting partition door, a dust blowing device, and a processing chamber lighting lamp; The sealed processing box is "L"-shaped and is internally divided into a sandblasting area, a platform area, and a sand return area; The Y-direction moving spray gun group is arranged in the sandblasting area and is fixedly connected to the upper platform inside the sealed processing box; The X-direction moving workbench is arranged in the platform area and is fixedly connected to the inner side plate of the sealed processing box; The moving directions of the X-direction moving workbench and the Y-direction moving spray gun group are perpendicular to each other, and the Y-direction moving spray gun group is located above the X-direction moving workbench; The stable support for spray gun movement is arranged inside the side plate of the sandblasting area of the sealed processing box; The dust blowing device is arranged on the inner side plate of the sandblasting area of the sealed processing box on the back side of the stable support for spray gun movement; The processing chamber lighting lamp is arranged in the sandblasting area and is fixedly connected to the rear plate inside the sealed processing box.

3. A special processing device for micro-nano powder wafers according to claim 1, characterized in that, There are a pair of sand return funnels arranged in the sand return area and are fixedly arranged in parallel at the bottom of the sealed processing box; The lifting partition door is arranged on the side of the sandblasting area of the sealed processing box; An air path inspection cabinet door is arranged on the surface of the sand return area of the sealed processing box; An observation window door is processed on the surface of the sandblasting area of the sealed processing box; An openable and sealable door is arranged on the top of the platform area of the sealed processing box.

4. The special processing equipment for micro-nano powder wafers according to claim 2, characterized in that, The Y-direction moving spray gun group includes an air-sand spray gun group, a Y-direction motor driving device, a Y-direction moving support, a group of Y-direction guide rails, and a spray gun group movement limit; The Y-direction motor driving device is fixedly connected to the rear plate inside the sandblasting area of the sealed processing box through a first support frame; The Y-direction motor driving device is fixedly connected to the upper surface of the first support frame; One end of the Y-direction guide rail is fixed on the side surface of the first support frame, and a support bearing is fixedly connected to the upper surface of the other end of the Y-direction guide rail through an I-shaped bracket. The support bearing is connected through a rotating shaft, and the rotating shaft and the driving shaft of the Y-direction motor driving device are connected through a conveyor belt; The Y-direction moving support is fixed on the conveyor belt; The air-sand spray gun group is connected to the Y-direction moving support through a vertical spray gun connecting rod; The spray gun group movement limiting device is arranged at both ends of the Y-direction guide rail and inside the support bearing; A horizontal spray gun connecting rod is fixedly connected to the vertical spray gun connecting rod in the horizontal direction.

5. A special processing device for micro-nano powder wafers according to claim 2, characterized in that, The X-direction moving workbench includes a wafer placement table, an X-direction motor driving device, a moving transmission device, a pair of X-direction guide rails, a workbench movement limit, a carrying and moving platform, a guide wheel, and an X-direction hard limit; There are a pair of X-direction guide rails, which are respectively fixed on the inner platforms of the front and rear plate surfaces of the platform area of the sealed processing box; A first fixed frame and a second fixed frame are arranged on both sides inside the platform area of the sealed processing box; The mobile transmission device includes two pairs of fixed bearings, a rotating rod, and a conveyor belt; One pair of fixed bearings is arranged on the surface of the first fixed frame. The fixed bearings are connected by a rotating rod. A conveyor belt is arranged on the rotating rod, and the other end of the conveyor belt is connected to another pair of fixed bearings; The fixed bearings are fixedly connected to the X-direction motor driving device and fixed on the second fixed frame.

6. A special processing equipment for micro-nano powder wafers according to claim 5, characterized in that, The bottom surface of the load-bearing mobile platform is fixedly connected to the conveyor belt, and guide wheels are arranged at the four corners of the bottom surface. The guide wheels are arranged on the X-direction guide rail; The wafer placement table is fixedly connected to the load-bearing mobile platform; X-direction hard limits are arranged at both ends of the X-direction guide rail, and a workbench movement limit is arranged inside the X-direction hard limit.

7. A special processing device for micro-nano powder wafers according to claim 1, characterized in that, The sand return and storage structure includes a cyclone separator, a partitioned material receiving box, a sand return and storage box body, a rotary quantitative sand discharging device, and an outer cabinet; a stirring rod support frame, a front sand conveying pipeline, and a conveying pipeline support frame; The partitioned material receiving box, the sand return and storage box body, the rotary quantitative sand discharging device, the stirring rod support frame; the front sand conveying pipeline; the conveying pipeline support frame are arranged inside the outer cabinet; The cyclone separator passes through the upper plate of the sand discharging and sand returning outer cabinet and is communicated with the partitioned material receiving box; A boss is arranged at the top of the sand return and storage box body. The top surface of the boss is connected to the partitioned material receiving box, and a stirring rod support frame is arranged at the side of the boss; The bottom of the sand return and storage box body is connected to the rotary quantitative sand discharging device; A conveying pipeline support frame is arranged inside the bottom surface of the outer cabinet. The front sand conveying pipeline is fixedly connected to the conveying pipeline support frame and is communicated with the rotary quantitative sand discharging device.

8. A special processing device for micro-nano powder wafers according to claim 7, characterized in that The partitioned material receiving box includes a material receiving box body and a valve-type partition mechanism; The valve-type partition mechanism is arranged inside the material receiving box body.

9. A special processing device for micro-nano powder wafers according to claim 7, characterized in that, A heat preservation layer is inclinedly arranged at the bottom of the sand return and storage box body; The inside of the sand return and storage box body is a sand storage box body, and a sand stirring rod is arranged inside the sand storage box body; A stirring rod motor driving group is arranged at the top of the sand stirring rod, and the stirring rod motor driving group is fixedly connected to the stirring rod support frame; The sand storage box body is equipped with a temperature probe; A heating plate is arranged inside the heat preservation layer; The sand storage box body is equipped with a level gauge.

10. A special processing equipment for micro-nano powder wafers according to claim 7, characterized in that, Cabinet moving casters are fixedly connected to the bottom of the outer cabinet.

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