An apparatus for thinning and pickling a substrate of a metal mask
By setting metal rollers and sponge rollers between the etching unit and the pickling unit, combined with a shielding structure and liquid knife nozzle, the problems of etching solution film damage and uneven pickling are solved, achieving uniform etching and pickling of the substrate surface and avoiding the Mura phenomenon.
Patent Information
- Application Number
- CN202510757921.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2045-06-09
AI Technical Summary
In the prior art, metal mask substrates are prone to etching solution film damage, splashing, and uneven pickling during etching and pickling processes, leading to the Mura phenomenon.
Metal rollers and sponge rollers are set between the etching unit and the pickling unit. By rotating and squeezing the substrate, combined with the shielding structure and liquid knife nozzle, the splashing and uneven distribution of etching solution and pickling solution are avoided, ensuring the integrity and uniformity of the etching solution film.
It effectively prevents the etching solution film from being damaged and unevenly pickled on the substrate, avoids the Mura phenomenon, and ensures the uniformity and integrity of the etching solution film on the substrate surface.
Smart Images
Figure CN120291084B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of metal mask plates, and in particular to a device for thinning and pickling a substrate of a metal mask plate. Background Art
[0002] Stainless steel strips are currently used as the substrate for OLED metal mask production. Their exceptional corrosion resistance, strength, and processing properties make them crucial for a variety of key industries. The microelectronics and semiconductor industries require even thinner stainless steel foils for the manufacture of delicate chips and sensors, while flexible display technology is seeking ultra-thin stainless steel foils that can serve as the substrate for bendable display devices.
[0003] In the prior art, Figure 1 As shown, a plurality of spray heads 3 are provided in the etching unit, and etching liquid is sprayed through the spray heads 3 to etch and thin the metal mask substrate 1, and a sponge roller 6 is provided at the end of the etching unit. After passing through the sponge roller 6, the etching liquid remaining on the surface of the substrate 1 is formed into a layer of evenly distributed etching liquid film; and a pickling unit is provided after the etching unit. The pickling unit includes a plurality of spray heads 4 for spraying pickling liquid. The parameters such as the swing speed, spray pressure, and concentration of the sprayed pickling liquid of the spray heads and the moving speed of the metal mask substrate 1 are all set parameters. As the metal mask substrate 1 enters the pickling unit, the etching liquid film thereon is completely removed by the pickling liquid.
[0004] However, in the prior art, there are many factors that affect the uniform pickling of the etching solution film, which ultimately leads to the occurrence of mura, for example, above the substrate, including:
[0005] (1) During the process from the metal mask substrate 1 passing through the sponge roller 6 of the etching unit to entering the action range of the spray head 4 of the pickling unit, as shown in FIG. Figure 1 As shown, the movement range of the corresponding metal mask substrate 1 is L. In the prior art, only conveying rollers 5 are provided at the opposite ends of the etching unit and the pickling unit to tension and convey the substrate 1. However, the substrate 1 located between the etching unit and the pickling unit, including the position L, has uneven stress at various positions of the substrate 1 due to insufficient tension, which causes the uniform etching liquid film formed on the substrate at the position L to be damaged, thereby causing the substrate 1 to be unevenly pickled after entering the pickling unit, resulting in a mura phenomenon.
[0006] (2) During the process from the metal mask substrate 1 passing through the sponge roller 6 of the etching unit to entering the action range of the spray head 4 of the pickling unit, that is, Figure 1In the position L of the middle metal mask substrate, the etching unit spray head 3 sprays the etching liquid in the process of spraying the etching liquid, and the etching liquid is randomly splashed on the uniform etching liquid film of the position L, and / or the pickling unit spray head 4 sprays the pickling liquid in the process of spraying the pickling liquid, and the pickling liquid is randomly splashed on the uniform etching liquid film of the position L, so that the metal mask plate substrate is contaminated with a small amount of pickling liquid in advance after entering the pickling unit, or a small amount of etching liquid is splashed on the position after passing through the sponge roller, and the etching liquid film at each position on the substrate cannot be uniformly pickled due to the set parameters of the swing speed, the spraying pressure, the concentration of the pickling liquid sprayed by the spray head and the moving speed of the metal mask plate substrate, and the Mura phenomenon is generated.
[0007] (3) The pickling liquid unit spray head 4 sprays the pickling liquid to remove the etching liquid film formed on the metal mask plate substrate 1 after passing through the metal roller 6, and in the process of spraying the pickling liquid, the pickling liquid is randomly splashed after being sprayed on the substrate 1, so that the quality of the pickling liquid received at each position on the whole substrate 1 is uneven, and finally the etching liquid film on the substrate 1 is unevenly pickled, and the Mura phenomenon is generated.
[0008] Similarly, below the substrate, there is also a problem that the etching liquid film of the metal mask plate substrate 1 is damaged in the process of passing through the etching unit to the range of the pickling unit spray head 4, and is polluted by the etching liquid and the pickling liquid splashed from both sides, and the etching liquid film is unevenly pickled due to the random splashing of the pickling liquid, and the Mura phenomenon is generated. SUMMARY
[0009] The present application provides a device for etching and pickling a metal mask plate substrate, which comprises an etching unit and a pickling unit, and can avoid the damage of the etching liquid film formed on the substrate, avoid the pollution of the etching liquid film by the etching liquid and the pickling liquid from both sides, and eliminate the influence of the uneven pickling of the etching liquid film caused by the splashing of the pickling liquid in the pickling unit in the prior art.
[0010] The specific scheme is as follows.
[0011] A device for thinning and pickling a metal mask plate substrate, which comprises an etching unit and a pickling unit from front to back along the running direction of the substrate, and the etching unit and the pickling unit are arranged on the upper and lower sides of the substrate respectively, the etching unit sprays etching liquid to thin the substrate, and the etching unit further comprises a first sponge roller above the substrate, and the etching liquid remaining on the substrate after being thinned by the etching liquid forms a uniform etching liquid film through the first sponge roller.
[0012] The pickling unit sprays pickling liquid to remove the thin film of etching liquid on the substrate;
[0013] The pickling unit is provided with a metal roller for pressing the substrate, and a second sponge roller is arranged above the metal roller. The metal roller, the first sponge roller and the second sponge roller rotate during the movement of the substrate. The metal roller and the second sponge roller rotate at the same angular velocity, and the linear velocity of the rotation of the metal roller and the first sponge roller is the same as the moving speed of the substrate.
[0014] Further, a separation structure is arranged between the etching unit and the pickling unit above the substrate. The device further comprises a shielding structure, which comprises a recovery tank. The etching liquid sprayed by the etching unit towards the pickling unit is shielded by the separation structure and recovered by the recovery tank.
[0015] Further, in the vertical direction, the recovery tank is located below the separation structure, and in the horizontal direction, the recovery tank extends from the pickling unit to the etching unit and extends to the end of the recovery tank which is beyond the first sponge roller in the horizontal direction.
[0016] Further, the shielding structure comprises a baffle, which is located on the side of the metal roller away from the separation structure in the vertical direction.
[0017] Further, the lowest part of the baffle in the vertical direction is lower than the top end of the second sponge roller.
[0018] Further, the recovery tank, the baffle and the separation structure are connected.
[0019] Further, the pickling unit is provided with an upper liquid knife nozzle, which is located behind the metal roller and sprays pickling liquid to the back side surface of the metal roller.
[0020] Further, below the substrate, the etching unit comprises an overflow box, and the etching liquid overflowing from the overflow box forms a uniform thin film of etching liquid on the lower surface of the substrate. The pickling unit comprises a lower conveying roller which rotates and is located below the substrate at a position corresponding to the metal roller above the substrate. The linear velocity of the rotation of the lower conveying roller is the same as the moving speed of the substrate.
[0021] Further, the spraying height H2 of the etching liquid from the etching unit below the substrate to the lower surface of the substrate is less than the spraying height H1 of the etching liquid from the etching unit above the substrate to the upper surface of the substrate.
[0022] Further, the pickling unit is provided with a lower liquid knife nozzle, which sprays pickling liquid to the position behind the lower conveying roller on the substrate.
[0023] The present application has the following technical effects:
[0024] 1. Above the substrate
[0025] (1) The present application sets a metal roller in the middle of the etching unit and the pickling unit, the metal roller extrudes the substrate of the metal mask plate through self-rotation, maintains the stress uniformity of the substrate at each position during operation, so that the thin film of etching liquid formed on the surface of the substrate after passing through the first sponge roller of the etching unit remains in a flat state without damage; on the other hand, the metal roller also has the effect of preventing a part of the pickling liquid of the pickling unit from splashing onto the substrate between the metal roller and the first sponge roller. In addition, since the metal roller is close to the spray head of the pickling unit, it inevitably carries pickling liquid. In order to avoid the pickling liquid carried by the metal roller from being thrown out to the position between the metal roller and the first sponge roller on the substrate during self-rotation, a second sponge roller is arranged on the metal roller to cooperate with the metal roller during self-rotation. The second sponge roller can uniformly absorb the residual pickling liquid on the metal roller during self-rotation, avoiding the pickling liquid from being thrown out to the position between the metal roller and the first sponge roller on the substrate.
[0026] (2) The present application sets a shielding structure on both sides of the second sponge roller and the metal roller in the middle of the etching unit and the pickling unit, further preventing the etching liquid of the etching unit and the pickling liquid of the pickling unit from splashing onto the position between the metal roller and the first sponge roller on the substrate, avoiding random contamination of the etching liquid and the pickling liquid to the uniform thin film of etching liquid already formed on the substrate at this position.
[0027] (3) The present application cancels the spray head of the pickling unit in the prior art and uses a liquid knife nozzle instead, and sets the upper liquid knife nozzle behind the metal roller to spray pickling liquid to the rear side surface of the metal roller.
[0028] Above the substrate, the upper liquid knife nozzle is used to spray pickling liquid to the side surface of the metal roller, on the one hand, the pickling liquid is used to clean a small amount of etching liquid carried by the metal roller during self-rotation in contact with the thin film of etching liquid on the surface of the substrate, on the other hand, the pickling liquid flows along the side surface of the metal roller to the bottom of the metal roller, when the substrate moves to the instant of contact with the bottom of the metal roller, the pickling liquid on the metal roller can completely remove the thin film of pickling liquid on the substrate at the first time, avoiding the random splashing of the pickling liquid sprayed by the spray head to the surface of the substrate after the substrate moves to the pickling unit, resulting in uneven quality of the pickling liquid received by the substrate at each position.
[0029] 2. Below the substrate
[0030] (1) The present application sets an overflow box in the etching unit, and the etching liquid is poured upwards through the overflow box to form a uniform etching liquid film on the lower surface of the substrate. A lower conveying roller is arranged at the position corresponding to the upper metal roller, and the substrate is supported by the lower conveying roller, which has the similar effect as the upper metal roller, and can maintain the tension of the substrate between the etching unit and the pickling unit, preventing the etching liquid film at this position from being damaged. Due to the effect of gravity, the pickling liquid carried by the lower conveying roller can freely fall from the position between the lower conveying roller and the overflow box even during the self-rotation process, avoiding splashing onto the lower surface of the substrate.
[0031] (2) By adjusting the spraying height of the etching liquid on the substrate surface in the etching unit below the substrate, combined with the shielding effect of the lower conveying roller, the uniform etching liquid film between the overflow box and the lower conveying roller on the lower surface of the substrate can be prevented from being contaminated by the etching liquid and pickling liquid on both sides,
[0032] A) In the etching unit, the spraying height H2 of the lower etching liquid to the substrate surface is less than the spraying height H1 of the upper etching liquid to the substrate surface, so as to reduce the spraying pressure of the lower etching liquid on the lower surface of the substrate, and combined with the effect of gravity of the liquid droplets, finally a small amount of splashing etching liquid can directly fall to avoid splashing onto the etching liquid film between the overflow box and the lower conveying roller;
[0033] B) In the pickling unit, the lower liquid knife nozzle sprays pickling liquid to the position behind the lower conveying roller, and due to the effect of gravity, the sprayed pickling liquid is shielded by the lower conveying roller, so that the pickling liquid cannot splash onto the uniform etching liquid film on the upper surface of the substrate between the lower conveying roller and the overflow box.
[0034] (3) The present application cancels the spray head in the pickling unit of the prior art, and also uses a liquid knife nozzle below the substrate. The lower liquid knife nozzle sprays pickling liquid to the position behind the lower conveying roller, and the impact force of the pickling liquid sprayed on the lower surface of the substrate enables the pickling liquid to move along the lower surface of the substrate to the surface of the lower conveying roller. When the substrate passes through the etching unit and enters the pickling unit from front to back, the pickling liquid on the lower conveying roller can completely remove the etching liquid film on the lower surface of the substrate at the moment when the lower surface of the substrate contacts the lower conveying roller. On the other hand, the pickling liquid on the lower conveying roller can also be used to remove a small amount of etching liquid carried by the lower conveying roller and the lower surface of the substrate. BRIEF DESCRIPTION OF DRAWINGS
[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation to the scope, and other related drawings can also be obtained by those of ordinary skill in the art without any creative effort based on these drawings.
[0036] Figure 1 The device is used for thinning and pickling the metal mask plate substrate in the prior art.
[0037] Figure 2 The device is used for thinning and pickling the metal mask plate substrate in the prior art.
[0038] In the figure, 1. metal mask plate substrate, 2. separation structure, 3. etching unit shower head, 4. pickling unit shower head, 5. conveying roller, 6. first sponge roller, 7. metal roller, 8. second sponge roller, 9. recovery tank, 10. baffle, 11. connecting structure, 12. upper liquid knife nozzle, 13. lower conveying roller, 14. overflow box, 15. lower liquid knife nozzle. DETAILED DESCRIPTION
[0039] The technical solutions in the embodiments of the present application will be described below in combination with the drawings in the embodiments of the present application.
[0040] The embodiment discloses a device for thinning and pickling the substrate of a metal mask plate, and the etching unit and the pickling unit are respectively arranged on the upper and lower sides of the substrate, as shown in the figure. Figure 2 As shown in the figure, along the running direction of the substrate 1, the device sequentially includes the etching unit and the pickling unit from front to back, and a separation unit 2 can be further included between the etching unit and the pickling unit to separate the two different units.
[0041] The etching unit includes a shower head 3, which can spray etching liquid to etch and thin the substrate 1. Above the substrate 1, the etching unit further includes a first sponge roller 6, and after the substrate 1 is thinned by the etching liquid, the etching liquid remaining on the substrate 1 forms a uniform etching liquid film through the first sponge roller 6; the pickling unit sprays pickling liquid to remove the etching liquid film on the substrate 1.
[0042] In addition to the conveying rollers 5 arranged at the opposite ends of the etching unit and the pickling unit to tension and convey the substrate 1, the pickling unit above the substrate 1 is provided with a self-rotating metal roller 7 for pressing the substrate 1, so as to avoid the substrate 1 from relaxing due to insufficient tension at the middle position of the etching unit and the pickling unit, thereby avoiding the uniform etching liquid film on the substrate 1 from being damaged due to the relaxation of the substrate 1. In addition, the metal roller 7 also has the effect of blocking a part of the pickling liquid from splashing to the surface of the substrate between the metal roller 7 and the first sponge roller 6.
[0043] The metal roller 7 is arranged in the pickling unit and carries the pickling liquid sprayed by the pickling unit to rotate, and the pickling liquid carried in the process of rotation is splashed onto the substrate 1 between the metal roller 7 and the first sponge roller 6, so that the part of the substrate 1 is prematurely and randomly contaminated with a small amount of pickling liquid, and finally enters the pickling unit to be unevenly pickled, and Mura phenomenon occurs. Therefore, the second sponge roller 8 which can rotate is arranged on the metal roller 7, and by cooperating with the rotation of the metal roller 7, the second sponge roller 8 can absorb the pickling liquid carried by the metal roller 7, so as to avoid the pickling liquid splashing onto the substrate 1 between the metal roller 7 and the first sponge roller 6 in the process of rotation of the metal roller 7.
[0044] The rotation angular velocity of the metal roller 7 and the second sponge roller 8 is the same, and the rotation linear velocity of the metal roller 7 and the first sponge roller 6 is the same as the moving speed of the substrate 1.
[0045] Further, in order to avoid the etching liquid of the etching unit and the pickling liquid of the pickling unit from being sprayed or splashed onto the substrate 1 between the metal roller 7 and the first sponge roller 6, a shielding structure is arranged, which includes a recovery groove 9 and a baffle 10. In the vertical direction, the recovery groove 9 is located below the partition structure 2, and in the horizontal direction, the recovery groove 9 extends from the pickling unit to the etching unit, and the end of the recovery groove 9 extends beyond the first sponge roller 6 in the horizontal direction, so as to avoid the etching liquid from contaminating the substrate 1 between the first sponge roller 6 and the metal roller 7. The etching liquid sprayed or splashed from the etching unit to the pickling unit is shielded by the partition structure 2 and recovered by the recovery groove 9. The baffle 10 is located on the side of the metal roller 7 away from the partition structure 2 in the vertical direction. In order to shield the splashing of the pickling liquid as much as possible, the lowest part of the baffle 10 in the vertical direction is lower than the top end of the second sponge roller 8.
[0046] Further, the recovery groove 9 and the baffle 10 can be connected with the partition structure 2. Preferably, the recovery groove 9 and the baffle 10 can be connected with the partition structure 2 through the connecting structure 11 respectively.
[0047] In order to avoid the splashing of the pickling liquid on the substrate 1 caused by the use of the shower head to spray the pickling liquid, so that the pickling liquid received at each position on the substrate 1 is uneven, the upper liquid knife nozzle 12 is arranged on the upper surface and the lower surface of the substrate 1 behind the metal roller 7 in the embodiment, and the etching liquid film on the substrate 1 is removed by spraying the pickling liquid.
[0048] The upper liquid knife nozzle 12 sprays pickling liquid to the back side surface of the metal roller 7 above the substrate 1. On one hand, the pickling liquid is used to clean the small amount of etching liquid carried by the metal roller 7 during the self-rotation process. On the other hand, the pickling liquid flows along the side surface of the metal roller 7 to the bottom of the metal roller 7. When the substrate 1 moves to the position in contact with the metal roller 7, the pickling liquid can first remove the etching liquid film on the substrate 1 completely, thereby ensuring that the etching liquid film on the substrate 1 at each position is removed uniformly and completely at the first time when the substrate 1 moves to the position in contact with the metal roller 7.
[0049] The overflow box 14 is arranged below the substrate 1 in the etching unit. The etching liquid is sprayed upward through the overflow box 14 to form a uniform etching liquid film on the lower surface of the substrate 1. In addition, the lower conveying roller 13 is arranged at the position corresponding to the upper metal roller 5. The substrate 1 is supported by the lower conveying roller 13, thereby maintaining the tension of the substrate 1 between the etching unit and the pickling unit and preventing the etching liquid film at the position from being damaged. On the other hand, due to the gravity, the pickling liquid carried by the lower conveying roller 13 can freely fall from the position between the lower conveying roller 13 and the overflow box 14 even during the self-rotation process, thereby avoiding splashing onto the lower surface of the substrate 1.
[0050] Further, the etching liquid sprayed from the etching unit to the surface of the substrate 1 below is adjusted to have a height H2 smaller than the height H1 of the etching liquid sprayed from the etching unit to the surface of the substrate 1 above. The etching liquid sprayed from the etching unit to the lower surface of the substrate 1 is reduced in pressure, and finally, a small amount of splashing etching liquid can directly fall down and avoid splashing onto the etching liquid film between the overflow box 14 and the lower conveying roller 13.
[0051] Specifically, in the etching unit, the height H2 of the etching liquid sprayed from the etching unit to the surface of the substrate 1 below is adjusted to be smaller than the height H1 of the etching liquid sprayed from the etching unit to the surface of the substrate 1 above. The etching liquid sprayed from the etching unit to the lower surface of the substrate 1 is reduced in pressure, and finally, a small amount of splashing etching liquid can directly fall down and avoid splashing onto the etching liquid film between the overflow box 14 and the lower conveying roller 13.
[0052] In the pickling unit, the lower liquid knife nozzle 15 sprays pickling liquid to the position behind the lower conveying roller 13 on the substrate. Due to the gravity, the splashing pickling liquid is blocked by the lower conveying roller 13, thereby preventing the pickling liquid from splashing onto the uniform etching liquid film on the surface of the substrate 1 between the lower conveying roller 13 and the overflow box 14 from the pickling unit.
[0053] In addition, by using the liquid knife nozzle below the substrate 1, the lower liquid knife nozzle 15 sprays the pickling liquid to the position behind the lower conveying roller 13 on the substrate 1, and the pickling liquid is sprayed on the lower surface of the substrate 1 to carry the impact force, so that the pickling liquid can move along the lower surface of the substrate 1 to the surface of the lower conveying roller 13. When the substrate 1 passes through the etching unit from front to back into the pickling unit, the lower surface of the substrate 1 contacts the lower conveying roller 13 at the moment, and the pickling liquid on the lower conveying roller 13 can completely remove the etching liquid film on the lower surface of the substrate 1. On the other hand, the pickling liquid on the lower conveying roller 13 can also be used to remove a small amount of etching liquid carried by the lower conveying roller 13 and the lower surface of the substrate 1.
[0054] Therefore, the etching and pickling device of the present embodiment can uniformly pickling the residual pickling liquid on the upper and lower surfaces of the substrate, and avoid the occurrence of Mura phenomenon.
[0055] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. An apparatus for thinning and pickling a substrate of a metal mask, comprising, in the running direction of the substrate, an etching unit and a pickling unit arranged in sequence from front to back, the etching unit and the pickling unit being arranged on the upper and lower sides of the substrate respectively, the etching unit spraying etching liquid to etch and thin the substrate, the etching unit further comprising a first sponge roller above the substrate, the etching liquid remaining on the substrate after being thinned by the etching liquid forming a uniform etching liquid film on the substrate through the first sponge roller; the pickling unit spraying pickling liquid to remove the etching liquid film on the substrate; the pickling unit being provided with a metal roller for pressing the substrate, a second sponge roller being arranged above the metal roller, the metal roller, the first sponge roller and the second sponge roller rotating in the movement of the substrate, the metal roller and the second sponge roller rotating at the same angular velocity, the linear velocity of the metal roller and the first sponge roller rotating being the same as the moving speed of the substrate; a separation structure being arranged between the etching unit and the pickling unit above the substrate, the apparatus further comprising a shielding structure, the shielding structure comprising a recovery tank, the etching liquid sprayed by the etching unit towards the pickling unit being shielded by the separation structure and recovered by the recovery tank; the pickling unit being provided with an upper liquid knife nozzle, the upper liquid knife nozzle being located behind the metal roller and spraying pickling liquid to the back side surface of the metal roller. In the vertical direction, the recovery tank is located below the separation structure, in the horizontal direction, the recovery tank extends from the pickling unit to the etching unit and extends to one end of the recovery tank beyond the first sponge roller in the horizontal direction. characterized in that The shielding structure comprises a baffle, the baffle being located on the side of the metal roller away from the separation structure in the vertical direction. The lowest point of the baffle in the vertical direction is lower than the top end of the second sponge roller. The recovery tank, the baffle and the separation structure are connected.
2. The apparatus for thinning and pickling a substrate of a metal mask according to claim 1, wherein Below the substrate, the etching unit comprises an overflow box, the etching liquid overflowing from the overflow box forming a uniform etching liquid film on the lower surface of the substrate; the pickling unit comprising a lower conveying roller rotating, the lower conveying roller being located below the substrate at a position corresponding to the metal roller above the substrate, the linear velocity of the lower conveying roller rotating being the same as the moving speed of the substrate.
3. The apparatus for thinning and pickling a substrate of a metal mask according to claim 1, wherein The spraying height H2 of the etching liquid from the etching unit below the substrate to the lower surface of the substrate is less than the spraying height H1 of the etching liquid from the etching unit above the substrate to the upper surface of the substrate.
4. The apparatus for thinning and pickling a substrate of a metal mask according to claim 3, wherein The pickling unit is provided with a lower liquid knife nozzle, the lower liquid knife nozzle spraying pickling liquid to the position behind the lower conveying roller on the substrate.
5. The apparatus for thinning and pickling a substrate of a metal mask according to claim 3, wherein 6. The apparatus for thinning and pickling a substrate of a metal mask according to claim 1, wherein 7. The apparatus for thinning and pickling a substrate of a shadow mask according to claim 6, wherein 8. The apparatus for thinning and pickling a substrate of a metal mask according to claim 6, wherein
Citation Information
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