Flat plate heat conductivity coefficient measuring device

Through the improved plate thermal conductivity measurement device, the supporting bracket and rotary cover are used to solve the problems of uneven heating and air gap, and achieve higher accuracy and safe thermal conductivity measurement.

CN120294053APending Publication Date: 2025-07-11SHANDONG DAISHENG CONSTR CO LTD
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Patent Information

Application Number
CN202410047094.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-01-11
Publication Date
2025-07-11

AI Technical Summary

Technical Problem

In the existing thermal conductivity measurement device, the cantilever sample compression mechanism causes uneven heating, easy to generate air gaps, affect data accuracy, and cumbersome operation and safety hazards.

Method used

The design of supporting bracket, support column, lower experimental disk, upper experimental disk, heating ring and rotary cover is adopted. The close contact between the sample and the experimental disk is adjusted through the knob to avoid air gaps and simplify the operation process.

Benefits of technology

Improves the accuracy and safety of thermal conductivity measurement, simplifies operating steps, and reduces the risk of instrument damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a flat plate heat conductivity coefficient measuring device. The heat conductivity coefficient measuring device can be used for measuring the heat conductivity coefficient of a solid material and is simple and convenient to operate, a sample to be measured is uniformly heated, and the measured heat conductivity coefficient is high in accuracy. According to the invention, the upper experiment disc can be simply opened and closed through the knob, position slippage of the upper experiment disc in the experiment process does not need to be considered, the firmness is high, hands do not directly contact the heating experiment disc in the operation process, asbestos gloves do not need to be worn, and the operation is simple and convenient. The supporting column and the knob can adjust the pressing degree of the sample at the same time, the influence caused by an air gap is effectively reduced, and data measurement is accurate. The supporting bracket is fixedly installed on the box body, an anti-skid pad is arranged at the bottom of the box body, and the device is stable, small in size and convenient to carry.
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Description

Technical Field

[0001] The invention belongs to the field of material performance testing devices, and specifically relates to a flat plate thermal conductivity measuring device. Background Art

[0002] Thermal conductivity (also known as thermal conductivity) is an important physical quantity of the thermal performance of reactive materials. The thermal conductivity of materials will change with temperature and pressure, and the impurity content and structural changes of the materials will significantly affect the value of the thermal conductivity. Therefore, in scientific experiments and engineering design, the thermal conductivity of the materials used needs to be accurately measured by experimental methods. The experimental method for measuring thermal conductivity generally adopts the steady-state method. First, the sample is heated by a heat source so that there is a temperature difference inside the sample. Heat will be transferred from high temperature to low temperature. Appropriate control of experimental conditions and experimental parameters can make the heating and heat transfer process reach a state of equilibrium. Then a stable temperature distribution will be formed inside the sample to be tested. The thermal conductivity can be calculated based on this temperature distribution.

[0003] The measurement of thermal conductivity is one of the common performance measurements of materials. Usually, thermocouples are used for temperature measurement, and the steady-state plate method is used to measure the thermal conductivity of materials. In order to create a temperature gradient distribution inside the sample, the sample is processed into a flat plate and sandwiched between two copper plates. The copper plates need to be in close contact with the sample surface without any gaps, otherwise the air layer in the middle will generate thermal resistance, making the temperature gradient measurement inaccurate. However, the existing experimental equipment has the following defects:

[0004] During the experiment, a cantilever sample clamping mechanism was used. This method heated the sample unevenly and easily resulted in air gaps, which affected the data measurement results. The lifting process was also very cumbersome. To ensure experimental safety, asbestos gloves had to be worn. In addition, the two sides were unbalanced and it was very easy to tip over after a period of use, causing damage to the instrument.

[0005] To solve the above problems, we have made an improvement: a thermal conductivity measurement device. This device will help improve the accuracy, robustness and controllability of the experiment. Summary of the invention

[0006] In order to solve the above problems, the present invention provides the following technical solutions: a flat plate thermal conductivity measuring device, comprising a supporting bracket, a supporting column, a lower test plate, an upper test plate, a heating ring, a connecting hinge and a box body, the lower test plate and the upper test plate are circular and connected by the hinge, the lower test plate is installed on the supporting bracket, the supporting column can support the lower test plate and adjust the height; the heating ring is installed above the upper test plate, and the rotating cover is installed above the heating ring and can be opened and closed by the knob.

[0007] As a preferred technical solution of the present invention, the upper experimental plate and the lower experimental plate are made of copper plates, which are respectively installed on the support bracket and the rotary cover, and are opened or closed by the knob. There is no need to wear asbestos gloves. When opened, it can be vertically supported without lifting adjustment.

[0008] As a preferred technical solution of the present invention, the test sample can be placed between the upper experimental plate and the lower experimental plate. Both the knob and the support column can be used to adjust the clamping degree between the upper experimental plate and the lower experimental plate, so that there is no gap between the sample and the experimental plate and they are in close contact.

[0009] As a preferred technical solution of the present invention, the hinge can connect the upper experimental plate and the lower experimental plate, which is convenient for opening and closing, and the adjustable height can adapt to most test samples. Description of the Drawings

[0010] Figure 1 is a three-dimensional structure diagram of a flat thermal conductivity measuring device of the present invention;

[0011] Figure 2 is a three-dimensional exploded view of a flat thermal conductivity measuring device of the present invention;

[0012] Figure 3 is a right-side three-dimensional exploded view of a flat thermal conductivity measuring device of the present invention;

[0013] Figure 4 is a three-dimensional structure diagram of the experimental process of a flat thermal conductivity measuring device of the present invention;

[0014] Figure 5 is a structure diagram of the support bracket of a flat thermal conductivity measuring device of the present invention;

[0015] In the figure: 1. Support bracket; 2. Support column; 3. Lower experimental plate; 4. Upper experimental plate; 5. Heating coil; 6. Rotary cover; 7. Knob; 8. Connecting hinge; 9. Box body Detailed Embodiments

[0016] The following further details the preferred embodiments of the present invention in conjunction with the accompanying drawings. The accompanying drawings form a part of the detailed description and illustrate the illustrative specific embodiments through which the present invention can be practiced. In this regard, directional terms such as "upper", "lower", "left", "right", "top", "bottom", etc. are used with reference to the orientation of the described drawings for illustrative purposes only and do not limit the structure of this patent. The preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0017] Example: As Figure 1As shown in the figure, a thermal conductivity measuring device consists of a support bracket 1, a lower experimental plate 3, an upper experimental plate 4, a rotating cover 6 and a base 9. The bottom of the base 9 is provided with an anti-slip pad. The materials of the upper experimental plate and the lower experimental plate are copper plates with the same diameter and thickness, and they are connected by the connecting hinge 8. The lower experimental plate 4 can be placed vertically. The support bracket 1 is fixed on the base 9 by 4 screws. The lower experimental plate 3 is horizontally placed on the support column 2, and its level and height can be adjusted through the support column 2.

[0018] As Figures 2 - 3 shown in the figure, the heating coil 5 is fixed on the upper experimental plate 4, and the upper experimental plate 4 can be used to uniformly heat the sample to be measured. The rotating cover 6 is fixed on the tops of the upper experimental plate 4 and the heating coil 5, and is in a circular hollow shape with a diameter slightly larger than that of the upper experimental plate 4, which can effectively dissipate heat and prevent hand burns during the experiment. The knob 7 can be used to open and close the upper and lower experimental plates, effectively reducing the steps when placing and removing the sample during the experiment, and the operation is simple.

[0019] As Figure 4 shown in the figure, during the experiment, the sample to be measured is placed on the lower experimental plate 5, and the upper experimental plate 4 is covered on the sample to be measured, and the knob 7 is tightened to fix the position of the upper experimental plate.

[0020] As Figure 5 shown in the figure, 3 support columns 2 are fixed on the support bracket 1. During the experiment, the gap between the lower experimental plate 4 and the sample to be measured and the upper experimental plate 5 can be adjusted through the support column 2 to prevent heat dissipation and effectively improve the experimental accuracy.

[0021] The working steps are as follows:

[0022] (1) At the start of the measurement, place the sample to be measured on the lower experimental plate 4, cover the upper experimental plate 5 on the sample to be measured with the knob 7, and tighten it. Adjust the support column 2 so that the sample to be measured is in good contact with the upper and lower experimental plates without air gaps. Turn on the heating, and read the temperature indication every 5 minutes. After a period of time, when the temperature indications of the upper and lower experimental plates remain unchanged, it is considered to have reached a stable state.

[0023] (2) After reaching the stable state, hold the knob 7 to open the upper experimental plate 5, remove the sample to be measured, then cover the upper experimental plate 5 on the lower experimental plate 4, continue heating. When the lower experimental plate 4 is about 10 higher than the steady-state temperature, open the upper experimental plate 5 and stop heating, let the lower experimental plate 4 cool naturally, and read its temperature value every 30 seconds. Finally, calculate the thermal conductivity of the sample to be measured according to the measured data.

[0024] In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, the terms "fixed", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A device for measuring the thermal conductivity of a flat plate, comprising a support bracket, a support column, a lower experimental plate, an upper experimental plate, a heating coil, a connecting hinge and a box body.

2. The lower experimental plate and the upper experimental plate according to claim 1 are circular, connected by the hinge, the lower experimental plate is installed on the support bracket, and the support column can support the lower experimental plate and adjust the height; the heating coil is installed above the upper experimental plate, and the rotating cover is installed above the heating coil and can be opened and closed by the knob.

3. The upper experimental plate and the lower experimental plate according to claim 2 are made of copper plates, respectively installed on the support bracket and the rotating cover, opened or closed by the knob, without wearing asbestos gloves, can be vertically supported when opened, and no lifting adjustment is required.

4. The knob and the support column according to claim 2 can both be used to adjust the clamping degree between the upper experimental plate and the lower experimental plate, so that there is no gap between the sample and the experimental plate in close contact.

5. The hinge according to claim 2 can connect the upper experimental plate and the lower experimental plate, which is convenient for opening and closing, and the adjustable height adapts to most samples to be measured.